6Disconnect the CDMA LMF terminal Ethernet port from the BTS frame.
7Disconnect the CDMA LMF terminal serial port, the RS–232–to–GPIB interface box, and the
GPIB cables as required for equipment transport.
Connecting BTS T1/E1 Spans
Before leaving the site, connect any T1 or E1 span connectors removed
previously to allow the LMF to control the BTS. Refer to Table 5-7 and
Figure 3-7.
Table 5-7: Connect T1 or E1 Spans
StepAction
1Re–connect any disconnected span connectors to the Span I/O A and B boards.
2If equipped, ensure the CSU is powered on.
3Verify span status, ensuring the OMC–R/CBSC can communicate with the BTS.
Before Leaving the site
Be sure all requirements listed in Table 5-8 are completed before leaving
the site.
Table 5-8: Check Before Leaving the Site
StepAction
1All battery circuit breakers (for occupied shelves) are ON (pushed in).
2Both heat exchanger circuit breakers on the DC PDA are set to ON (pushed in), and the heat
exchanger blowers are running.
3The External Blower Assembly (EBA) power cable is connected, and the EBA is running.
4The MAP power switch is set to ON, and the POWER (green) LED is lighted.
5The BATT TEST switch on the MAP is set to OFF, and the BATT. TEST (amber) LED is not lighted.
6No alarm conditions are being reported to the CBSC with all frame doors closed.
The information in this chapter addresses some of the scenarios likely to
be encountered by Customer Field Engineering (CFE) team members.
This troubleshooting guide was created as an interim reference document
for use in the field. It provides “what to do if” basic troubleshooting
suggestions when the BTS equipment does not perform per the
procedure documented in the manual.
Comments are consolidated from inputs provided by CFEs in the field
and information gained from experience in Motorola labs and
classrooms.
1If MGLI2 LED is solid RED, it implies a hardware failure. Reset MGLI2 by
re-seating it. If this persists, install RGLI2 card in MGLI2 slot and retry. A Red
LED may also indicate no termination on an external LAN connector (power entry
compartment at rear of frame).
2Verify that the span line is disconnected at the Span I/O card. If the span is still
connected, verify the CBSC has disabled the BTS.
3Try ‘ping’ing the MGLI2.
4Verify the LMF is connected to the primary LAN (LAN A) at the LAN shelf
below the SCCP cage. If LAN A is not the active LAN, force a LAN switch to
LAN A by following the procedure in Table 6-2.
5Verify the LMF was configured properly.
6If a Xircom parallel BNC LAN interface is being used, verify the BTS-LMF cable
is RG-58 (flexible black cable of less than 2.5 feet length).
7Verify the external LAN connectors are properly terminated (power entry
compartment at rear of frame).
8Verify a T-adapter is not used on LMF computer side connector when connected
6
n StepAction
to the primary LAN at the LAN shelf.
9Try connecting to the Ethernet Out port in the power entry compartment (rear of
frame). Use a TRB–to–BNC (triax–to–coax) adapter at the LAN connector for this
connection.
10Re-boot the CDMA LMF and retry.
11Re-seat the MGLI2 and retry.
12Verify GLI2 IP addresses are configured properly by following the procedure in
Table 6-3.
Table 6-2: Force Ethernet LAN A to Active State as Primary LAN
1If LAN A is not the active LAN, make certain all external LAN connectors are
terminated with 50Ω loads or cabled to another frame.
6-2
2If it has not already been done, connect the LMF computer to the stand–alone or
starter frame, as applicable (Table 3-6).
3If it has not already been done, start a GUI LMF session and log into the BTS on
the active LAN (Table 3-7).
. . . continued on next page
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Troubleshooting: Installation– continued
Table 6-2: Force Ethernet LAN A to Active State as Primary LAN
nActionStep
4Remove the 50Ω termination from the LAN B IN connector in the power entry
compartment at the rear of the stand–alone or starter frame. The CDMA LMF
session will become inactive.
5Disconnect the LMF computer from the LAN shelf LAN B connector and connect
it to the LAN A connector.
6If the LAN was successfully forced to an active state (the cards in any cage can be
selected and statused), proceed to step 13.
7With the 50Ω termination still removed from the LAN B IN connector, remove
the 50
Ω termination from LAN B OUT connector. If more than one frame is
connected to the LAN, remove the termination from the last frame in the chain.
8If the LAN was successfully forced to an active state (the cards in any cage can be
selected and statused), proceed to step 13.
9With the 50Ω terminations still removed from LAN B, unseat each GLI card in
each frame connected to the LAN, until all are disconnected from the shelf
backplanes.
10Reseat each GLI card until all are reconnected.
11Allow the GLIs to power up, and attempt to select and status cards in the CCP
shelves. If LAN A is active, proceed to step 13.
12If LAN A is still not active, troubleshoot or continue troubleshooting following
the procedures in Table 6-1.
13Replace the 50Ω terminations removed from the LAN B IN and OUT connectors.
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Troubleshooting: Installation– continued
Table 6-3: GLI IP Address Setting
n StepAction
1If it has not previously been done, establish an MMI communication session with
the GLI card as described in Table 3-11.
2Enter the following command to display the IP address and subnet mask settings
for the card:
config lg0 current
A response similar to the following will be displayed:
GLI2>config lg0 current
lg0: IP address is set to
DEFAULT (configured based on card location)
lg0: netmask is set to
DEFAULT (255.255.255.128)
3If the IP address setting response shows an IP address rather than “Default
(configured based on card location),” enter the following:
config lg0 ip default
A response similar to the following will be displayed:
GLI2>config lg0 ip default
6
_param_config_lg0_ip(): param_delete(): 0x00050001
lg0: ip address set to DEFAULT
4If the GLI subnet mask setting does not display as “DEFAULT
(255.255.255.128),” set it to default by entering the following command:
config lg0 netmask default
A response similar to the following will be displayed:
GLI2>config lg0 netmask default
_param_config_lg0_netmask(): param_delete(): 0x00050001
lg0: netmask set to DEFAULT
. . . continued on next page
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Troubleshooting: Installation– continued
Table 6-3: GLI IP Address Setting
nActionStep
5Set the GLI route default to default by entering the following command:
config route default default
A response similar to the following will be displayed:
GLI2>config route default default
_esh_config_route_default(): param_delete(): 0x00050001
route: default gateway set to DEFAULT
6
NOTE
Changes to the settings will not take effect unless the GLI is reset.
When changes are completed, close the MMI session, and reset the GLI card.
7Once the GLI is reset, re–establish MMI communication with it and issue the
following command to confirm its IP address and subnet mask settings:
8Repeat steps 1 through 7 for all remaining GLI2s, including those in any
Cannot Communicate with
Power Meter
n StepAction
config lg0 current
A response similar to the following will be displayed:
GLI2>config lg0 current
6
lg0: IP address is set to
DEFAULT (configured based on card location)
lg0: netmask is set to
DEFAULT (255.255.255.128)
additional, inter–connected frames.
Table 6-4: Troubleshooting a Power Meter Communication Failure
08/01/2001
1Verify Power Meter is connected to LMF with GPIB adapter.
2Verify cable setup as specified in Chapter 3.
3Verify the GPIB address of the Power Meter is set to 13. Refer to Test Equipment
setup section of Chapter 3 for details.
. . . continued on next page
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Troubleshooting: Installation– continued
Table 6-4: Troubleshooting a Power Meter Communication Failure
nActionStep
4Verify that Com1 port is not used by another application.
5Verify that the communications analyzer is in Talk&Listen mode, not Control
mode.
Cannot Communicate with
Communications Analyzer
Table 6-5: Troubleshooting a Communications Analyzer Communication Failure
n StepAction
1Verify analyzer is connected to LMF with GPIB adapter.
2Verify cable setup.
3Verify the GPIB address is set to 18.
4Verify the GPIB adapter DIP switch settings are correct. Refer to Test Equipment
setup section for details.
5Verify the GPIB adapter is not locked up. Under normal conditions, only 2 green
LEDs must be ‘ON’ (Power and Ready). If any other LED is continuously ‘ON’,
then power-cycle the GPIB Box and retry.
6
6If a Hyperterm window is open for MMI, close it.
7Verify the LMF GPIB address is set to 18.
8Verify the analyzer is in Talk&Listen mode, not Control mode.
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Troubleshooting: Download
Table 6-6: Troubleshooting Code Download Failure
n StepAction
1Verify T1 or E1 span is disconnected from the BTS at CSU.
2Verify LMF can communicate with the BTS device using the Status function.
3Communication to MGLI2 must first be established before trying to talk to any
other BTS device. MGLI2 must be INS_ACT state (green).
4Verify the card is physically present in the cage and powered-up.
5If card LED is solid RED, it implies hardware failure. Reset card by re-seating it.
If this persists, replace card from another slot & retry.
NOTE
The card can only be replaced by a card of the same type.
6Re-seat card and try again.
7If BBX2 reports a failure message and is OOS_RAM, the code load was OK.
Status it to verify the load.
8If the download portion completes and the reset portion fails, reset the device by
clicking on the device and selecting DEVICE > RESET.
Cannot Download DA TA to Any
Device (Card)
n StepAction
1Re-seat card and repeat code and data load procedure.
2Verify the ROM and RAM code loads are of the same release by statusing the
card. Refer to Chapter 3, “Download the BTS” for more information.
6
Table 6-7: Troubleshooting Data Download Failure
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Troubleshooting: Download – continued
Cannot ENABLE Device
Before a device can be enabled (placed in-service), it must be in the
OOS_RAM state (yellow on the LMF) with data downloaded to the
device. The color of the device on the LMF changes to green, once it is
enabled.
The three states that devices can be displayed:
S Enabled (green, INS)
S Disabled (yellow, OOS_RAM)
S Reset (blue, OOS_ROM)
1Re-seat card and repeat code and data load procedure.
2If CSM cannot be enabled, verify the CDF file has correct latitude and longitude
data for cell site location and GPS sync.
3Ensure primary CSM is in INS_ACT state.
NOTE
MCCs will not go INS without the CSM being INS.
4Verify 19.6608 MHz CSM clock is present; MCCs will not go INS without it.
5BBXs should not be enabled for ATP tests.
6
6If MCCs give “invalid or no system time,” verify the CSM is enabled.
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Troubleshooting: Download – continued
LPA Errors
n StepAction
1If LPAs continue to give alarms, even after cycling power at the circuit breakers,
then connect an MMI cable to the LPA and set up a HyperTerminal connection.
Enter
ALARMS in the Hyperterminal window. The resulting hyperTerminal
display may provide an indication of the problem. (Call Field Support for further
1Verify the Power Meter is configured correctly (see the test equipment setup
section) and connection is made to the proper TX port.
2Verify the parameters in the bts–#.cdf file are set correctly for the following
bands:
For 1900 MHz:
Bandclass=1; Freq_Band=16
For 800 MHz:
Bandclass=0; Freq_Band=8
3Verify that no LPA in the sector is in alarm state (flashing red LED). Reset the
LPA by pulling the circuit breaker, and, after 5 seconds, pushing back in.
4Re-calibrate the Power Meter and verify it is calibrated correctly with cal factors
from the power sensor.
5Verify GPIB adapter is not locked up. Under normal conditions, only 2 green
LEDs must be ‘ON’ (Power and Ready). If any other LED is continuously ‘ON’,
power-cycle (turn power off and on) the GPIB Box and retry.
6Verify the power sensor is functioning properly by checking it with the 1–mW (0
6
dBm) Power Ref signal.
7If communication between the LMF and Power Meter is working, the Meter
display will show “RES :’’
8Verify the combiner frequency is the same as the test freq/chan.
1Verify Power Meter is configured correctly (refer to the test equipment setup
section).
2Re-calibrate the Power Meter and verify it is calibrated correctly with cal factors
from the power sensor.
3Verify that no LPA is in alarm state (rapidly flashing red LED). Reset the LPA by
pulling the circuit breaker, and, after 5 seconds, pushing back in.
4Verify the power sensor is functioning properly by checking it with the 1 mW (0
dBm) Power Ref signal.
5After calibration, the BLO data must be re-loaded to the BBXs before auditing.
Click on the BBX(s) and select Download Code > Download Data>Enable.
Re-try the audit.
6Verify GPIB adapter is not locked up. Under normal conditions, only 2 green
LEDs must be ‘ON’ (Power and Ready). If any other LED is continuously ‘ON’,
power-cycle (turn power off and on) the GPIB Box and retry.
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Basic Troubleshooting – RF Path Fault Isolation
Overview
The optimization (RF path characterization or calibration) and
post-calibration (audit) procedures measure and limit-check the BTS
reported transmit and receive levels of the path from each BBX2 to the
back of the frame. When a fault is detected, it is specific to a receive or
transmit path. The troubleshooting process in this section determines the
most probable cause of the fault.
As the calibration and audit tests are performed, results are displayed in
the LMF test status report window. When faults are encountered, the test
procedure in progress continues running and displaying any further
faults. If it appears that there are major faults, the test can be aborted.
The test results can be saved to a
wlmf\cdma\bts–<#> folder. To do this, close the test status report
window using the Save Results button.
IMPORTANT
*
If a test is re–run or a new calibration, audit, or test is run and the results
are saved, the previous test results in the
overwritten. To prevent losing previous test results in the
6
If Every Test Fails
file, refer to the procedure in Table 4-10 before performing further
testing with the LMF.
If there are major faults, recheck the test equipment attachments for
errors. If none are found, close the test status report window using the
Save Results button, and save the contents of the resulting
bts–<#>.rpt file as described in Table 4-10. Also, note other specifics
about the failure, and proceed with the fault isolation procedure.
Closing the test status report window with the Dismiss
button will delete the test results without saving them.
bts–<#>.rpt file in the
bts–<#>.rpt file are
bts–<#>.rpt
6-12
Check the calibration equipment for proper operation by manually
setting the signal generator output attenuator to the lowest output power
setting. Connect the output port to the spectrum analyzer RF input port.
Set the signal generator output attenuator to –90 dBm, and switch on the
RF output. Verify that the spectrum analyzer can receive the signal,
indicate the correct signal strength (accounting for the cable insertion
loss), and indicate the approximate frequency.
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Basic Troubleshooting – RF Path Fault Isolation – continued
Verify BLO Checkbox
When performing a calibration with the TX Calibration... or All
Cal/Audit... functions, the Verify BLO checkbox should normally be
checked. When a calibration fails, determine if any items such as
directional couplers or combiners have been added to the TX path. If
additional items have been installed in the path, try re–running the
calibration with Verify BLO unchecked. If calibration still does not
pass, refer to the following paragraphs and use the TX output fault
isolation flowchart to identify the most probable cause of the failure.
If Faults Are Isolated
If the fault reports are isolated between successful path checks, the root
cause of the faults most likely lies with one or more of the Field
Replaceable Unit (FRU) modules. If more than one failure was reported,
look for a common denominator in the data. For example, if any TX test
fails on one sector only, the BBX2 assigned to that sector (Table 1-5) is a
likely cause. Also, look at the severity of the failure. If the path loss is
just marginally out of the relaxed specification limit during the
post-calibration TX audit, suspect excessive cable loss. If limits are
missed by a wide margin, suspect mis–wired cables or total device
failure. Use the TX output fault isolation flowchart in Figure 6-1 to
identify the strongest possible cause for a failed TX test.
Fault Isolation Flowchart
Flowchart Prerequisites
The flowchart covers the transmit path. Transmit paths usually fail the
lower test limit, indicating excessive loss in some component in the BTS
site or mis–wiring. A failure of an upper limit usually indicates a
problem with the test setup or external equipment. Before replacing a
suspected FRU, always repeat and verify the test results to rule out a
transient condition. If a BBX2 fails an upper limit in the post–calibration
audit procedure, re–calibrate and verify the out–of–tolerance condition
for that BBX2 and/or sector before replacement.
Before entering the fault isolation sequence outlined in the flowchart, be
sure the following have been completed:
S GLIs, MCCs, and BBXs have been downloaded with the correct ROM
code, RAM code, and data (Table 3-13, Table 3-14, and Table 3-15).
S MGLI, CSMs, and MCCs are enabled (Table 3-14, Table 3-17, and
Table 3-18, respectively)
S Be sure the LED on the correct CCD card is solid green.
S Be sure no alarms are being reported by opening an LMF alarm
window as outlined in Table 3-47.
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Basic Troubleshooting – RF Path Fault Isolation – continued
TX Power Output Fault
Isolation Flowchart
Figure 6-1: TX Output Fault Isolation Flowchart
Start
TX Power
Out of Limits
High limit
Did TX Output
fail the High or
Low limit?
Low limit
failure.
6
If equipped, does a
BBX on the same
carrier but for a
different sector
pass?
No, next BBX on same carrier
fails on different sector .
failure.
Yes, it passes.
Does
redundant BBX
have the same
problem on the
same sector?
Yes
Does any other
sector have the
same problem?
No
No
Yes
Likely Cause:BBX card
Attempt re–calibration
before replacement.
Likely Cause:External Power Measurement
Equipment and/or Set–up.
Also check:Switch card
External Attenuators & Pads,
Check Site Documentation.
Likely Cause:CIO card
Carrier trunking module
Also check:CIO–trunking module cabling
TX filter/combiner cabling
TX DRDC/TRDC cabling
Likely Cause:BBX card
Loose connections on
CIO–trunking module cabling,
TX filter/combiner cabling, or
TX DRDC/TRDC cabling
1Verify that TX audit passes for the BBX2(s).
2If performing manual measurement, verify analyzer setup.
3Verify that no LPA in the sector is in alarm state (flashing red LED). Re-set the
LPA by pulling the circuit breaker, and, after 5 seconds, pushing it back in.
Cannot Perform Rho or Pilot
Time Offset Measurement
Table 6-13: Troubleshooting Rho and Pilot Time Offset Measurement Failure
n StepAction
1Verify presence of RF signal by switching to spectrum analyzer screen.
2Verify PN offsets displayed on the analyzer is the same as the PN offset in the
CDF file.
3Re–load MGLI2 data and repeat the test.
4If performing manual measurement, verify analyzer setup.
5Verify that no LPA in the sector is in alarm state (flashing red LED). Reset the
LPA by pulling the circuit breaker, and, after 5 seconds, pushing back in.
6If Rho value is unstable and varies considerably (e.g. .95,.92,.93), this may
indicate that the GPS is still phasing (i.e. trying to reach and maintain 0 freq.
error). Go to the freq. bar in the upper right corner of the Rho meter and select Hz.
Press <Shift–avg> and enter 10, to obtain an average Rho value. This is an
indication the GPS has not stabilized before going INS and may need to be
re-initialized.
6
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Troubleshooting: Transmit ATP – continued
Cannot Perform Code Domain
Power and Noise Floor
Measurement
Table 6-14: Troubleshooting Code Domain Power and Noise Floor Measurement Failure
n StepAction
1Verify presence of RF signal by switching to spectrum analyzer screen.
2Verify PN offset displayed on analyzer is same as PN offset being used in the
CDF file.
3Disable and re-enable MCC (one or more MCCs based on extent of failure).
1Perform the test manually, using the spread CDMA signal. Verify High Stability
10 MHz Rubidium Standard is warmed up (60 minutes) and properly connected to
test set-up.
6
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Troubleshooting: Receive ATP
Multi–FER Test Failure
Table 6-16: Troubleshooting Multi-FER Failure
n StepAction
1Verify test equipment set up is correct for a FER test.
2Verify test equipment is locked to 19.6608 and even second clocks. The yellow
LED (REF UNLOCK) must be OFF.
3Verify MCCs have been loaded with data and are INS–ACT.
4Disable and re-enable the MCC (1 or more based on extent of failure).
5Disable, re-load code and data, and re-enable MCC (one or more MCCs based on
extent of failure).
6Verify antenna connections to frame are correct based on the directions messages.
6
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Troubleshooting: CSM Checklist
Problem Description
Many Clock Synchronization Manager (CSM) board problems may be
resolved in the field before sending the boards to the factory for repair.
This section describes known CSM problems identified in field returns,
some of which are field-repairable. Check these problems before
returning suspect CSM boards.
If having any problems with CSM board kit numbers, SGLN1145 or
SGLN4132, check the suffix with the kit number. If the kit has version
“AB,” then replace with version ‘‘BC’’ or higher, and return model AB
to the repair center.
No GPS Reference Source
Check the CSM boards for proper hardware configuration.
RF–GPS (Local GPS) – CSM kit SGLN1145, which should be installed
in Slot l, has an on-board GPS receiver; while kit SGLN4132, in Slot 2,
does not have a GPS receiver.
Remote GPS (R–GPS) – Kit SGLN4132, which should be installed in
both Slot 1 and Slot 2, does not have a GPS receiver.
Any incorrectly configured board must be returned to the repair center.
6
Checksum Failure
GPS Bad RX Message T ype
Do not attempt to change hardware configuration in the field. Also,
verify the GPS antenna is not damaged and is installed per recommended
guidelines.
The CSM could have corrupted data in its firmware resulting in a
non-executable code. The problem is usually caused by either electrical
disturbance, or interruption of data during a download. Attempt another
download with no interruptions in the data transfer. Return CSM board
back to repair center if the attempt to reload fails.
This is believed to be caused by a later version of CSM software (3.5 or
higher) being downloaded, via LMF, followed by an earlier version of
CSM software (3.4 or lower), being downloaded from the CBSC.
Download again with CSM software code 3.5 or higher. Return CSM
board back to repair center if attempt to reload fails.
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Troubleshooting: CSM Checklist – continued
CSM Reference Source
Configuration Error
This is caused by incorrect reference source configuration performed in
the field by software download. CSM kit SGLN1145 and SGLN4132
must have proper reference sources configured (as shown below) to
function correctly.
This may be caused by a delay in GPS acquisition. Check the accuracy
flag status and/or current position. Refer to the CSM system time/GPS
and LFR/HSO verification section in Chapter 3. At least 1 satellite
should be visible and tracked for the “surveyed” mode and 4 satellites
should be visible and tracked for the “estimated” mode. Also, verify
correct base site position data used in “surveyed” mode.
6
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SCCP Backplane Troubleshooting
Introduction
The SCCP backplane is a multi–layer board that interconnects all the
SCCP modules. The complexity of this board lends itself to possible
improper diagnoses when problems occur.
Connector Functionality
The following connector overview describes the major types of
backplane connectors along with the functionality of each. This will
allow the Cellular Field Engineer (CFE) to:
S Determine which connector(s) is associated with a specific problem
type.
S Allow the isolation of problems to a specific cable or connector.
Span Line Connector
The span line input is an 8 pin RJ–45 connector that provides a primary
and secondary (if used) span line interface to each GLI2 in the SCCP
shelf. The span line is used for MM/EMX switch control of the Master
GLI2 and also all the BBX2 traffic.
Power Input (Return A and B connectors)
Provides a 27 volt input for use by the power supply modules.
Power Supply Module Interface
6
Each power supply module has a series of three different connectors to
provide the needed inputs/outputs to the SCCP backplane. These include
a VCC/Ground input connector, a Harting style multiple pin interface,
and a +15V/Analog Ground output connector. The Transceiver Power
Module converts 27/48 Volts to a regulated +15, +6.5, +5.0 volts to be
used by the SCCP shelf cards.
GLI2 Connector
This connector consists of a Harting 4SU digital connector and a
6–conductor coaxial connector for RDM distribution. The connectors
provide inputs/outputs for the GLI2s in the SCCP backplane.
GLI2 Ethernet “A” and “B” Connections
These SMB connectors are located on the SCCP backplane and connect
to the GLI2 board. This interface provides all the control and data
communications over the Ethernet LAN between the master GLI2, the
other GLI2, and the LMF.
6-20
BBX2 Connector
Each BBX2 connector consists of a Harting 2SU/1SU digital connector
and two 6–conductor coaxial connectors. These connectors provide DC,
digital, and RF inputs/outputs for the BBX2s in the SCCP backplane.
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SCCP Backplane Troubleshooting – continued
CIO Connectors
S RX RF antenna path signal inputs are routed through RX paths of the
DRDCs or TRDCs at the RF interface panel (rear of frame), and
through coaxial cables to the two MPC modules. The three “A” (main)
signals go to one MPC; the three “B” (diversity) to the other. The
MPC outputs the low–noise–amplified signals via the SCCP
backplane to the CIO where the signals are split and sent to the
appropriate BBX2.
S A digital bus then routes the baseband signal through the BBX2, to
the backplane, and then on to the MCC24/MCC8E slots.
S Digital TX antenna path signals originate at the MCC24/MCC8Es.
Each output is routed from the MCC24/MCC8E slot through the
backplane to the appropriate BBX2.
S TX RF path signal originates from the BBX2, travels through the
backplane to the CIO, through the CIO, and then through
multi-conductor coaxial cabling to the trunking module and LPAs in
the LPA shelf.
SCCP Backplane
Troubleshooting Procedure
Digital Control Problems
The following tables provide standard procedures for troubleshooting
problems that appear to be related to a defective SCCP backplane. The
tables are broken down into possible problems and steps which should
be taken in an attempt to find the root cause.
IMPORTANT
*
No GLI2 Control via LMF (all GLI2s)
StepAction
1Check the Ethernet LAN for proper connection, damage,
It is important to note that all steps be followed before
replacing ANY SCCP backplane.
Table 6-17: No GLI2 Control via LMF (all GLI2s)
shorts, or opens.
6
08/01/2001
2Be sure the LAN IN and OUT connectors in the power entry
compartment are properly terminated.
3Be sure the proper IP address is entered in the Network Login
tab of the LMF login screen.
4Verify SCCP backplane Shelf ID DIP switch is set correctly.
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SCCP Backplane Troubleshooting – continued
Table 6-17: No GLI2 Control via LMF (all GLI2s)
StepAction
5Visually check the master GLI2 connectors (both module and
backplane) for damage.
6Replace the master GLI2 with a known good GLI2.
No GLI2 Control through Span Line Connection (All GLI2s)
Table 6-18: No GLI2 Control through Span Line Connection (Both
StepAction
1Verify SCCP backplane Shelf ID DIP switch is set correctly.
2Verify that the BTS and GLI2s are correctly configured in the
OMCR/CBSC data base.
3Verify the span configurations set in the GLI2s match those in
the OMC–R/CBSC database (refer to Table 6-29).
GLI2s)
4Visually check the master GLI2 connectors (both module and
backplane) for damage.
5Replace the master GLI2 with a known good GLI2.
6Check the span line inputs from the top of the frame to the
master GLI2 for proper connection and damage.
6
Table 6-19: MGLI2 Control Good – No Control over Co–located
GLI2
StepAction
1Verify that the BTS and GLI2s are correctly configured in the
OMCR CBSC data base.
2Check the ethernet for proper connection, damage, shorts, or
opens.
3Visually check all GLI2 connectors (both module and
backplane) for damage.
4Replace the remaining GLI2 with a known good GLI2.
No AMR Control (MGLI2 good)
6-22
Table 6-20: MGLI2 Control Good – No Control over AMR
StepAction
1Visually check the master GLI2 connectors (both module and
backplane) for damage.
2Replace the master GLI2 with a known good GLI2.
3Replace the AMR with a known good AMR.
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SCCP Backplane Troubleshooting – continued
No BBX2 Control in the Shelf
Table 6-21: MGLI2 Control Good – No Control over Co–located
StepAction
1Visually check all GLI2 connectors (both module and
backplane) for damage.
2Replace the remaining GLI2 with a known good GLI2.
3Visually check BBX2 connectors (both module and
backplane) for damage.
4Replace the BBX2 with a known good BBX2.
No (or Missing) Span Line Traffic
Table 6-22: BBX2 Control Good – No (or Missing) Span Line Traffic
StepAction
BBX2s
1Visually check all GLI2 connectors (both module and
backplane) for damage.
2Replace the remaining GLI2 with a known good GLI2.
3Visually check all span line distribution (both connectors and
cables) for damage.
4If the problem seems to be limited to one BBX2, replace the
BBX2 with a known good BBX2.
No (or Missing) MCC24/MCC8E Channel Elements
Table 6-23: No MCC24/MCC8E Channel Elements
StepAction
1Verify CEs on a co–located MCC24/MCC8E (MccType=2)
2If the problem seems to be limited to 1 MCC24/MCC8E,
replace the MCC24/MCC8E with a known good
MCC24/MCC8E.
– Check connectors (both module and backplane) for
damage.
3If no CEs on any MCC24/MCC8E:
– Verify clock reference to CIO.
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SCCP Backplane Troubleshooting – continued
DC Power Problems
WARNING
Potentially lethal voltage and current levels are routed to
the BTS equipment. This test must be carried out with a
second person present, acting in a safety role. Remove all
rings, jewelry, and wrist watches prior to beginning this
test.
No DC Input Voltage to SCCP Shelf Power Supply Modules
Table 6-24: No DC Input Voltage to Power Supply Module
StepAction
1Verify DC power is applied to the frame. Determine if any
circuit breakers are tripped.
* IMPORTANT
If a breaker has tripped, remove all modules from the SCCP
shelf and attempt to reset it.
6
2Verify that the PS1 and PS2 circuit breakers on the DC PDA
3Remove the frame rear access panel (Figure 2-1), and use a
– If breaker trips again, there is probably a cable or breaker
problem within the frame or DC PDA.
– If breaker does not trip, there is probably a defective
module or sub–assembly within the shelf. Perform the
tests in Table 2-3 to attempt to isolate the module.
are functional.
voltmeter to determine if the input voltage is being routed to
the SCCP backplane. Measure the DC voltage level between:
S The PWR_IN_A and PWR_RTN_A contacts on the
extreme right side at the rear of the backplane
S The PWR_IN_B and PWR_RTN_B contacts on the
extreme right side at the rear of the backplane
– If the voltage is not present, there is probably a cable or
circuit breaker problem within the frame or DC PDA.
6-24
4If everything appears to be correct, visually inspect the PS1
and PS2 power supply module connectors.
5Replace the power supply modules with a known good
module.
6If steps 1 through 4 fail to indicate a problem, an SCCP
backplane failure has occurred (possibly an open trace).
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SCCP Backplane Troubleshooting – continued
No DC Voltage (+5, +6.5, or +15 Volts) to a Specific GLI2,
BBX2, or Switchmodule
Table 6-25: No DC Input Voltage to any SCCP Shelf Module
StepAction
1Verify steps outlined in Table 6-24 have been performed.
2Inspect the defective module connectors (both module and
backplane) for damage.
3Replace suspect module with known good module.
TX and RX Signal Routing
Problems
Table 6-26: TX and RX Signal Routing Problems
StepAction
1Inspect all Harting Cable connectors and backplane
connectors for damage in all the affected board slots.
2Perform steps outlined in the RF path troubleshooting
flowchart in Figure 6-1.
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RFDS – Fault Isolation
Introduction
The RFDS is used to perform Pre–Calibration Verification and
Post-Calibration Audits which limit-check the RFDS-generate and
reported receive levels of every path from the RFDS through the
directional coupler coupled paths. In the event of test failure, refer to the
following tables.
All tests fail
Table 6-27: RFDS Fault Isolation – All tests fail
StepAction
1Check the calibration equipment for proper operation by manually setting the signal generator output
attenuator to the lowest output power setting and connecting the output port to the spectrum analyzer
rf input port.
2Set the signal generator output attenuator to –90 dBm, and switch on the rf output. Verify that the
spectrum analyzer can receive the signal, indicate the correct signal strength, (accounting for the cable
insertion loss), and the approximate frequency.
3Visually inspect RF cabling. Make sure each directional coupler forward and reflected port connects to
the RFDS antenna select unit on the RFDS.
4Check the wiring against the site documentation wiring diagram or the BTS Site Installation manual.
5Verify RGLI and TSU have been downloaded.
6Check to see that all RFDS boards show green on the front panel indicators. Visually check for
external damage.
6
7If any boards that do not show green replace the RFDS with a known–good unit. Re–test after
replacement.
All RX and TX paths fail
If every receive or transmit path fails, the problem most likely lies with
the rf converter board or the transceiver board. Replace the RFDS with a
known–good unit and retest.
All tests fail on a single
antenna
If all path failures are on one antenna port, forward and/or reflected,
make the following checks.
Table 6-28: RFDS Fault Isolation – All tests fail on single antenna path
StepAction
1Visually inspect the site interface cabinet internal cabling to the suspect directional coupler antenna
port.
2Verify the forward and reflected ports connect to the correct RFDS antenna select unit positions on the
RFDS backplane. Refer to the installation manual for details.
. . . continued on next page
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RFDS – Fault Isolation – continued
Table 6-28: RFDS Fault Isolation – All tests fail on single antenna path
StepAction
3Replace the RFDS with a known–good unit.
4Replace the RF cables between the affected directional coupler and RFDS.
NOTE
Externally route the cable to bypass suspect segment.
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Module Front Panel LED Indicators and Connectors
Module Status Indicators
Each of the non-passive plug-in modules has a bi-color (green & red)
LED status indicator located on the module front panel. The indicator is
labeled PWR/ALM. If both colors are turned on, the indicator is yellow.
Each plug-in module, except for the fan module, has its own alarm
(fault) detection circuitry that controls the state of the PWR/ALM LED.
The fan TACH signal of each fan module is monitored by the AMR.
Based on the status of this signal the AMR controls the state of the
PWR/ALM LED on the fan module.
LED Status Combinations for
All Modules (except GLI2, CSM,
BBX2, MCC24, MCC8E)
PWR/ALM LED
The following list describes the states of the module status indicator.
S Solid GREEN – module operating in a normal (fault free) condition.
S Solid RED – module is operating in a fault (alarm) condition due to
electrical hardware failure.
Note that a fault (alarm) indication may or may not be due to a complete
module failure and normal service may or may not be reduced or
interrupted.
6
DC/DC Converter LED Status
Combinations
The PWR CNVTR has its own alarm (fault) detection circuitry that
controls the state of the PWR/ALM LED.
PWR/ALM LED
The following list describes the states of the bi-color LED.
S Solid GREEN – module operating in a normal (fault free) condition.
S Solid RED – module is operating in a fault (alarm) condition due to
electrical hardware problem.
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Module Front Panel LED Indicators and Connectors – continued
CSM LED Status Combinations
PWR/ALM LED
The CSMs include on-board alarm detection. Hardware and
software/firmware alarms are indicated via the front panel indicators.
After the memory tests, the CSM loads OOS–RAM code from the Flash
EPROM, if available. If not available, the OOS–ROM code is loaded
from the Flash EPROM.
S Solid GREEN – module is INS_ACT or INS_STBY no alarm.
S Solid RED – Initial power up or module is operating in a fault (alarm)
condition.
S Slowly Flashing GREEN – OOS_ROM no alarm.
S Long RED/Short GREEN – OOS_ROM alarm.
S Rapidly Flashing GREEN – OOS_RAM no alarm or
INS_ACT in DUMB mode.
S Short RED/Short GREEN – OOS_RAM alarm.
S Long GREEN/Short RED – INS_ACT or INS_STBY alarm.
S Off – no DC power or on-board fuse is open.
S Solid YELLOW – After a reset, the CSMs begin to boot. During
SRAM test and Flash EPROM code check, the LED is yellow. (If
SRAM or Flash EPROM fail, the LED changes to a solid RED and
the CSM attempts to reboot.)
Figure 6-2: CSM Front Panel Indicators & Monitor Ports
6
SYNC
MONITOR
PWR/ALM
Indicator
FREQ
MONITOR
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FW00303
. . . continued on next page
6-29
Module Front Panel LED Indicators and Connectors – continued
FREQ Monitor Connector
A test port provided at the CSM front panel via a BNC receptacle allows
monitoring of the 19.6608 MHz clock generated by the CSM. When
both CSM 1 and CSM 2 are in an in-service (INS) condition, the CSM 2
clock signal frequency is the same as that output by CSM 1.
The clock is a sine wave signal with a minimum amplitude of +2 dBm
(800 mVpp) into a 50 Ω load connected to this port.
SYNC Monitor Connector
A test port provided at the CSM front panel via a BNC receptacle allows
monitoring of the “Even Second Tick” reference signal generated by the
CSMs.
At this port, the reference signal is a TTL active high signal with a pulse
width of 153 nanoseconds.
MMI Connector – Only accessible behind front panel. The RS–232
MMI port connector is intended to be used primarily in the development
or factory environment, but may be used in the field for
debug/maintenance purposes.
6
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Module Front Panel LED Indicators and Connectors – continued
GLI2 LED Status Combinations
The GLI2 module has indicators, controls and connectors as described
below and shown in Figure 6-3.
The indicators and controls consist of:
S Four LEDs
S One pushbutton
ACTIVE LED
Solid GREEN – GLI2 is active. This means that the GLI2 has shelf
control and is providing control of the digital interfaces.
Off – GLI2 is not active (i.e., Standby). The mate GLI2 should be
active.
MASTER LED
S Solid GREEN – GLI2 is Master (sometimes referred to as MGLI2).
S Off – GLI2 is non-master (i.e., Slave).
ALARM LED
S Solid RED – GLI2 is in a fault condition or in reset.
S While in reset transition, STATUS LED is OFF while GLI2 is
performing ROM boot (about 12 seconds for normal boot).
S While in reset transition, STATUS LED is ON while GLI2 is
performing RAM boot (about 4 seconds for normal boot).
S Off – No Alarm.
STATUS LED
S FlashingGREEN– GLI2 is in service (INS), in a stable operating
condition.
S On – GLI2 is in OOS RAM state operating downloaded code.
S Off – GLI2 is in OOS ROM state operating boot code.
SPANS LED
S Solid GREEN – Span line is connected and operating.
S Solid RED – Span line is disconnected or a fault condition exists.
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Module Front Panel LED Indicators and Connectors – continued
GLI2 Pushbuttons and
Connectors
RESET Pushbutton – Depressing the RESET pushbutton causes a
partial reset of the CPU and a reset of all board devices. GLI2 will be
placed in the OOS_ROM state
MMI Connector – The RS–232MMI port connector is intended to be
used primarily in the development or factory environment but may be
used in the field for debug/maintenance purposes.
Figure 6-3: GLI2 Front Panel Operating Indicators
LEDOPERATING STATUS
STATUSOFF - operating normally
ON - briefly during powerĆup when the Alarm LED turns OFF.
SLOW GREEN - when the GLI2 is INS (inĆservice)
All functions on the GLI2 are reset when pressing and releasing
the switch.
ON - briefly during powerĆup when the Alarm LED turns OFF.
SLOW GREEN - when the GLI2 is INS (inĆservice)
STATUS LED
RESET
PUSHBUTTON
STATUSRESETALARMSPANSMASTERMMIACTIVE
RESET
ALARMOFF - operating normally
ALARM LED
6
SPANS LED
MASTER LED
MMI POR T
CONNECTOR
ACTIVE LED
SPANS
MASTER
MMI PORT
CONNECTOR
ACTIVE
OFF - card is powered down, in initialization, or in standby
GREEN - operating normally
YELLOW - one or more of the equipped initialized spans is receiving
a remote alarm indication signal from the far end
RED - one or more of the equipped initialized spans is in an alarm
state
The pair of GLI2 cards include a redundant status. The card in the
top shelf is designated by hardware as the active card; the card in
the bottom shelf is in the standby mode.
ON - operating normally in active card
OFF - operating normally in standby card
An RSĆ232, serial, asynchronous communications link for use as
an MMI port. This port supports 300 baud, up to a maximum of
115,200 baud communications.
Shows the operating status of the redundant cards. The redundant
card toggles automatically if the active card is removed or fails
ON - active card operating normally
OFF - standby card operating normally
FW00225
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Module Front Panel LED Indicators and Connectors – continued
BBX2 LED Status
Combinations
PWR/ALM LED
The BBX module has its own alarm (fault) detection circuitry that
controls the state of the PWR/ALM LED.
The following list describes the states of the bi-color LED:
S Solid GREEN – INS_ACT no alarm
S Solid RED Red – initializing or power-up alarm
S Slowly Flashing GREEN – OOS_ROM no alarm
S Long RED/Short GREEN – OOS_ROM alarm
S Rapidly Flashing GREEN – OOS_RAM no alarm
S Short RED/Short GREEN – OOS_RAM alarm
S Long GREEN/Short RED – INS_ACT alarm
MCC24 LED Status
Combinations
The MCC24 module has LED indicators and connectors as described
below. See Figure 6-4. Note that the figure does not show the connectors
as they are concealed by the removable lens.
The LED indicators and their states are as follows:
PWR/ALM LED
S RED – fault on module
ACTIVE LED
S Off – module is inactive, off-line, or not processing traffic.
S Slowly Flashing GREEN – OOS_ROM no alarm.
S Rapidly Flashing Green – OOS_RAM no alarm.
S Solid GREEN – module is INS_ACT, on-line, processing traffic.
PWR/ALM and ACTIVE LEDs
S Solid RED – module is powered but is in reset or the BCP is inactive.
MMI Connectors
S The RS–232 MMI port connector (four-pin) is intended to be used
primarily in the development or factory environment but may be used
in the field for debugging purposes.
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08/01/2001
S The RJ–11 ethernet port connector (eight-pin) is intended to be used
primarily in the development environment but may be used in the field
for high data rate debugging purposes.
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6-33
Module Front Panel LED Indicators and Connectors– continued
Figure 6-4: MCC24 Front Panel LEDs and LED Indicators
PWR/ALMACTIVE
PWR/ALM L E D
ACTIVE LED
LENS
(REMOVABLE)
LEDOPERATING STATUS
PWR/ALM
ACTIVE
COLOR
RED
An alarm is generated in the event of a failure
GREEN
RED
OFF - operating normally
ON - briefly during powerĆup and during failure
ąconditions
RAPIDLY BLINKING - Card is codeĆloaded but
ąnot enabled
SLOW BLINKING - Card is not codeĆloaded
ON - card is codeĆloaded and enabled
ą(INS_ACTIVE)
ON - fault condition
SLOW FLASHING (alternating with green) - CHI
ąbus inactive on powerĆup
FW00224
6
LPA Shelf LED Status
Combinations
LPA Module LED
6-34
Each LPA module is provided with a bi–color LED on the ETIB module
next to the MMI connector. Interpret this LED as follows:
S GREEN — LPA module is active and is reporting no alarms (Normal
condition).
S Flashing GREEN/RED — LPA module is active but is reporting an
low input power condition. If no BBX is keyed, this is normal and
does not constitute a failure.
S Flashing RED — LPA is in alarm.
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Basic Troubleshooting – Span Control Link
Span Problems (No Control
Link)
Table 6-29: Troubleshoot Control Link Failure
n StepAction
1Connect the CDMA LMF computer to the MMI port on the applicable MGLI2/GLI2 as shown in
Figure 6-5.
2Start an MMI communication session with the applicable MGLI2/GLI2 by using the Windows
desktop shortcut icon (refer to Table 3-11).
3Once the connection window opens, press the CDMA LMF computer Enter key until the GLI2>
prompt is obtained.
At the GLI2> prompt, enter:
4
config ni current <cr> (equivalent of span view command)
The system will respond with a display similar to the following:
The frame format in flash is set to use T1_2.
Equalization:
Span A – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span B – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span C – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span D – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span E – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span F – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Linkspeed: Default (56K for T1 D4 AMI, 64K otherwise)
Currently, the link is running at the default rate
The actual rate is 0
NOTE
Defaults for span equalization are 0–131 feet for T1/J1 spans and 120 Ohm for E1.
Default linkspeed is 56K for T1 D4 AMI spans and 64K for all other types.
There is no need to change from defaults unless the OMC–R/CBSC span configuration requires it.
5The span configurations loaded in the GLI must match those in the OMCR/CBSC database for the
BTS. If they do not, proceed to Table 6-30.
6Repeat steps 1 through 5 for all remaining GLIs.
7If the span settings are correct, verify the edlc parameters using the show command.
Any alarm conditions indicate that the span is not operating correctly.
S Try looping back the span line from the DSX panel back to the MM, and verify that the looped
signal is good.
S Listen for control tone on the appropriate timeslot from the Base Site and MM.
6
8Exit the GLI MMI session and HyperTerminal connection by selecting File from the connection
9If no TCHs in groomed MCCs (or in whole SCCP shelf) can process calls, verify that the ISB
08/01/2001
window menu bar, and then Exit from the dropdown menu.
cabling is correct and that ISB A and ISB B cables are not swapped.
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Basic Troubleshooti n g – Span Control Link– continued
Figure 6-5: MGLI/GLI Board MMI Connection Detail
To MMI port
8–PIN
STATUS RESET ALARM SPANS MASTER MMI ACTIVE
STATUS LED
RESET
Pushbutton
ALARM LED
SPANS LED
MASTER LED
MMI Port
Connector
ACTIVE LED
NULL MODEM
BOARD
(TRN9666A)
8–PIN TO 10–PIN
RS–232 CABLE (P/N
30–09786R01)
6
CDMA LMF
COMPUTER
RS–232 CABLE
DB9–TO–DB25
ADAPTER
IMPORTANT
Perform the following procedure ONLY if span
configurations loaded in the MGLI2/GLI2s do not match
those in the OMCR/CBSC data base, AND ONLY when the
exact configuration data is available. Loading incorrect
span configuration data will render the site inoperable.
Set BTS Site Span
Configuration
COM1
OR
COM2
*
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Basic Troubleshooti n g – Span Control Link– continued
Table 6-30: Set BTS Span Parameter Configuration
n StepAction
1If not previously done, connect the CDMA LMF computer to the MMI port on the applicable
MGLI2/GLI2 as shown in Figure 6-5.
2If there is no MMI communication session in progress with the applicable MGLI2/GLI2, initiate
one by using the Windows desktop shortcut icon (refer to Table 3-11).
3At the GLI2> prompt, enter:
config ni format <option> <cr>
The terminal will display a response similar to the following:
COMMAND SYNTAX: config ni format option
Next available options:
LIST – option : Span Option
E1_1 : E1_1 – E1 HDB3 CRC4 no TS16
E1_2 : E1_2 – E1 HDB3 no CRC4 no TS16
E1_3 : E1_3 – E1 HDB3 CRC4 TS16
E1_4 : E1_4 – E1 HDB3 no CRC4 TS16
T1_1 : T1_1 – D4, AMI, No ZCS
T1_2 : T1_2 – ESF, B8ZS
J1_1 : J1_1 – ESF, B8ZS (Japan) – Default
J1_2 : J1_2 – ESF, B8ZS
T1_3 : T1_3 – D4, AMI, ZCS
>
NOTE
With this command, all active (in–use) spans will be set to the same format.
To set or change the span type, enter the correct option from the list at the entry prompt (>), as
4
shown in the following example:
> T1_2 <cr>
NOTE
The entry is case–sensitive and must be typed exactly as it appears in the list. If the entry is typed
incorrectly, a response similar to the following will be displayed:
CP: Invalid command
GLI2>
5An acknowledgement similar to the following will be displayed:
The value has been programmed. It will take effect after the next reset.
GLI2>
. . . continued on next page
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Basic Troubleshooti n g – Span Control Link– continued
Table 6-30: Set BTS Span Parameter Configuration
nActionStep
6If the current MGLI/GLI span rate must be changed, enter the following MMI command:
config ni linkspeed <cr>
The terminal will display a response similar to the following:
Next available options:
LIST – linkspeed : Span Linkspeed
56K : 56K (default for T1_1 and T1_3 systems)
64K : 64K (default for all other span configurations)
>
NOTE
With this command, all active (in–use) spans will be set to the same linkspeed.
To set or change the span linkspeed, enter the required option from the list at the entry prompt (>),
7
as shown in the following example:
> 64K <cr>
NOTE
The entry is case–sensitive and must be typed exactly as it appears in the list. If the entry is typed
incorrectly, a response similar to the following will be displayed:
CP: Invalid command
6
GLI2>
8An acknowledgement similar to the following will be displayed:
The value has been programmed. It will take effect after the next reset.
GLI2>
9If the span equalization must be changed, enter the following MMI command:
config ni equal <cr>
The terminal will display a response similar to the following:
COMMAND SYNTAX: config ni equal span equal
Next available options:
LIST – span : Span
a : Span A
b : Span B
c : Span C
d : Span D
e : Span E
f : Span F
>
. . . continued on next page
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Basic Troubleshooti n g – Span Control Link– continued
Table 6-30: Set BTS Span Parameter Configuration
nActionStep
10At the entry prompt (>), enter the designator from the list for the span to be changed as shown in
the following example:
> a<cr>
The terminal will display a response similar to the following:
COMMAND SYNTAX: config ni equal a equal
Next available options:
LIST – equal : Span Equalization
0 : 0–131 feet (default for T1/J1)
1 : 132–262 feet
2 : 263–393 feet
3 : 394–524 feet
4 : 525–655 feet
5 : LONG HAUL
6 : 75 OHM
7 : 120 OHM (default for E1)
>
11At the entry prompt (>), enter the code for the required equalization from the list as shown in the
following example:
> 0<cr>
The terminal will display a response similar to the following:
> 0
The value has been programmed. It will take effect after the next reset.
GLI2>
12Repeat steps 9 through 11 for each in–use span.
13
* IMPORTANT
After executing the config ni format, config ni linkspeed, and/or config ni equal commands,
the affected MGLI/GLI board MUST be reset and reloaded for changes to take effect.
Although defaults are shown, always consult site specific documentation for span type and
linkspeed used at the site.
Press the RESET button on the MGLI2/GLI2 for changes to take effect.
. . . continued on next page
6
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6-39
Basic Troubleshooti n g – Span Control Link– continued
Table 6-30: Set BTS Span Parameter Configuration
nActionStep
14Once the MGLI/GLI has reset, execute the following command to verify span settings are as
required:
config ni current <cr> (equivalent of span view command)
The system will respond with a display similar to the following:
The frame format in flash is set to use T1_2.
Equalization:
Span A – 0–131 feet
Span B – 0–131 feet
Span C – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span D – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span E – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Span F – Default (0–131 feet for T1/J1, 120 Ohm for E1)
Linkspeed: 64K
Currently, the link is running at 64K
The actual rate is 0
15If the span configuration is not correct, perform the applicable step from this table to change it and
repeat steps 13 and 14 to verify required changes have been programmed.
LMF–to–BTS Connection
Verify GLI2 ethernet address settings
Ping LAN A
Ping LAN B
Verify ROM code loads for software
release
Download/Enable MGLI2s
Download/Enable GLI2s
Set Site Span Configuration
Set CSM clock source
Enable CSMs
Download/Enable MCC24s/MCC8Es
Download BBX2s
Download TSU (in RFDS)
Program TSU NAM
Periodic maintenance of a site may also mandate re–optimization of
specific portions of the site. An outline of some basic guidelines is
included in the following tables.
IMPORTANT
*
BTS Frame
SCCP ShelfAll sector TX and RX paths to the SCCP
Multicoupler/
Preselector Card
BBX2 boardRX and TX paths of the affected SCCP
CIO CardAll RX and TX paths of the affected
Re–optimization steps listed for any assembly detailed in
the tables below must be performed anytime a RF cable
associated with it is replaced.
Table B-1: When RF Optimization Is required on the BTS
Item ReplacedOptimize:
shelf
The three or six affected sector RX paths for
the SCCP shelf in the BTS frames
shelf / BBX2 board
CDMA carrier
B
Any LPA ModuleThe affected sector TX path.
DRDC or TRDCAll affected sector RX and TX paths
RFDSThe RFDS calibration RX & TX paths
(MONFWD/GENFWD)
Inter-frame Cabling
Optimization must be performed after the replacement of any RF cabling
between BTS frames.
Table B-2: When to Optimize Inter–frame Cabling
Item ReplacedOptimize:
Expansion frame–to–BTS
frame (RX) cables
Expansion frame–to–BTS
frame (TX) cables
The affected sector/antenna RX paths
The affected sector/antenna TX paths
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B-1
FRU Optimization/ATP Test Matrix – continued
Detailed Optimization/A TP Test
Matrix
B
Table B-3 outlines in more detail the tests that would need to be
performed if one of the BTS components were to fail and be replaced. It
is also assumed that all modules are placed OOS–ROM via the LMF
until full redundancy of all applicable modules is implemented.
The following guidelines should also be noted when using this table.
IMPORTANT
*
Various passive BTS components (such as the TX and RX directional
couplers, Preselector IO, CIO; etc.) only call for a TX or RX calibration
audit to be performed in lieu of a full path calibration. If the RX or TX
path calibration audit fails, the entire RF path calibration will need to be
repeated. If the RF path calibration fails, further troubleshooting is
warranted.
Not every procedure required to bring the site back on line
is indicated in Table B-3. It is meant to be used as a
guideline ONLY. The table assumes that the user is familiar
enough with the BTS Optimization/ATP procedure to
understand which test equipment set ups, calibrations, and
BTS site preparation will be required before performing the
Table # procedures referenced.
Whenever any SCCP BACKPLANE is replaced, it is assumed that only
power to the SCCP shelf being replaced is turned off via the breaker
supplying that shelf.
NOTE
If any significant change in signal level results from any
component being replaced in the RX or TX signal flow
paths, it would be identified by re–running the RX and TX
calibration audit command.
When the CIO is replaced, the SCCP shelf remains powered up. The
BBX2 boards may need to be removed, then re–installed into their
original slots, and re–downloaded (code and BLO data). RX and TX
calibration audits should then be performed.
B-2
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FRU Optimization/ATP Test Matrix– continued
Table B-3: SC 4812ET Lite BTS Optimization and ATP Test Matrix
Doc
Tbl
#
Table 2-1
Table 2-6
Table 3-6/
Table 3-7
Table 3-14/
Table 3-15
Table 3-17
Table 3-20
Table 3-21
Table 3-34/
Table 3-35
Table 3-36
Table 3-37
Table 3-45
Table 4-5
Table 4-6
Table 4-7
Table 4-8
Table 4-9
NOTE
Replace power supply modules one card at a time so that power to the SCCP shelf is not lost. If power
to the shelf is lost, all cards in the shelf must be downloaded again.
Description
Initial Boards/Modules
Install, Preliminary
Operations, CDF Site
Equipage; etc.
Initial Power-up
Start LMF
Download Code
Enable CSMs
GPS &HSO Initialization /
Verification
LFR Initialization /
Verification
TX Path Calibration
Download Offsets to BBX2
TX Path Calibration Audit
RFDS Path Calibration
Spectral Purity TX Mask
Waveform Quality (rho)
Pilot Time Offset
Code Domain Power /
Noise Floor
FER Test
Directional Coupler (TX)
RX Filter
Directional Coupler (RX)
D DDDDDDDDDDDDDDDDDD
D DD
RX Cables
DDDD
Multicoupler/Preselector
TX Cables
DDDDDDDD
DDDDD
SCCP Backplane
CIO
DDDDDDDD
DDDDDDDD
BBX2
DD
DD
DDDDD
DD
DDDD
DD
DDD
DD
DD
DDDDDD
DDD
CSM
MCC24/MCC8E
GPS
LFR/HSO
LPA
GLI2
LPA Filter Bandpass
Power Supply Modules (See Note)
DDD
LPA Combiner Filter 2:1
Switch Card
B
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B-3
B
FRU Optimization/ATP Test Matrix – continued
Notes
B-4
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Appendix C: BBX Gain Set Point vs. BTS Output Considerations
Appendix Content
BBX2 Gain Set Point vs. BTS Output ConsiderationsC-1. . . . . . . . . . . . . . . . . . .
Table C-1 outlines the relationship between the total of all code domain
channel element gain settings (digital root sum of the squares) and the
BBX2 Gain Set Point between 33.0 dBm and 44.0 dBm. The resultant
RF output (as measured at the top of the BTS in dBm) is shown in the
table. The table assumes that the BBX2 Bay Level Offset (BLO) values
have been calculated.
As an illustration, consider a BBX2 keyed up to produce a CDMA
carrier with only the Pilot channel (no MCCs forward link enabled).
Pilot gain is set to 262. In this case, the BBX2 Gain Set Point is shown
to correlate exactly to the actual RF output anywhere in the 33 to 44
dBm output range. (This is the level used to calibrate the BTS).
Table C-1: BBX2 Gain Set Point vs. Actual BTS Output (in dBm)
CDMA Operating Frequency Programming Information – North American
PCS Bands
Introduction
Programming of each of the BTS BBX2 synthesizers is performed by the
BTS GLI2s via the CHI bus. This programming data determines the
transmit and receive transceiver operating frequencies (channels) for
each BBX2.
1900 MHz PCS Channels
Figure D-1 shows the valid channels for the North American PCS
1900 MHz frequency spectrum. There are 10 CDMA wireline or
non–wireline band channels used in a CDMA system (unique per
customer operating system).
Figure D-1: North America PCS Frequency Spectrum (CDMA Allocation)
FREQ (MHz)
CHANNEL
A
275
D
B
6751883.75
E
RX TX
1851.2525
1863.75
1871.25425
D
1931.25
1943.75
1951.25
1963.75
08/01/2001
925
1896.25
1976.25
C
F
1175
1X SCt4812ET Lite BTS Optimization/ATP
1908.75
1988.75
PRELIMINARY
FW00463
D-1
D
CDMA Operating Frequency Programming Information – North American
Bands
Calculating 1900 MHz Center
Frequencies
– continued
Table D-1 shows selected 1900 MHz CDMA candidate operating
channels, listed in both decimal and hexadecimal, and the corresponding
transmit, and receive frequencies. Center frequencies (in MHz) for
channels not shown in the table may be calculated as follows:
Actual frequencies used depend on customer CDMA system frequency
plan.
Each CDMA channel requires a 1.77 MHz frequency segment. The
actual CDMA carrier is 1.23 MHz wide, with a 0.27 MHz guard band on
both sides of the carrier.
Minimum frequency separation required between any CDMA carrier and
the nearest NAMPS/AMPS carrier is 900 kHz (center-to-center).
Table D-1: 1900 MHz TX and RX Frequency vs. Channel
Table D-1: 1900 MHz TX and RX Frequency vs. Channel
Transmit Frequency (MHz)
Center Frequency
1988.751908.75
Receive Frequency (MHz)
Center Frequency
D
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D-3
ÉÉ
ÉÉ
D
CDMA Operating Frequency Programming Information – North American
Bands
800 MHz CDMA Channels
Figure D-2: North American Cellular Telephone System Frequency Spectrum (CDMA Allocation).
– continued
TX FREQ
(MHz)
RX FREQ
(MHz)
869.040
824.040
870.000
870.030
825.000
825.030
Figure D-2 shows the valid channels for the North American cellular
telephone frequency spectrum. There are 10 CDMA wireline or
non–wireline band channels used in a CDMA system (unique per
customer operating system).
879.990
880.020
834.990
835.020
889.980
890.010
844.980
845.010
891.480
891.510
846.480
846.510
893.970
848.970
CHANNEL
991
1013
1
1023
Calculating 800 MHz Center
Frequencies
333
334
311
OVERALL NON–WIRELINE (A) BANDS
OVERALL WIRELINE (B) BANDS
356
644
666
667
689
716
717
694
CDMA NON–WIRELINE (A) BAND
CDMA WIRELINE (B) BAND
739
777
799
FW00402
Table D-2 shows selected 800 MHz CDMA candidate operating
channels, listed in both decimal and hexadecimal, and the corresponding
transmit, and receive frequencies. Center frequencies (in MHz) for
channels not shown in the table may be calculated as follows:
All channel elements transmitted from a BTS in a particular 1.25 MHz
CDMA channel are orthonogonally spread by 1 of 64 possible Walsh
code functions; additionally, they are also spread by a quadrature pair of
PN sequences unique to each sector.
Overall, the mobile uses this to differentiate multiple signals transmitted
from the same BTS (and surrounding BTS) sectors, and to synchronize
to the next strongest sector.
The PN offset per sector is stored on the BBX2s, where the
corresponding I & Q registers reside.
The PN offset values are determined on a per BTS/per sector(antenna)
basis as determined by the appropriate cdf file content. A breakdown of
this information is found in Table E-1.
PN Offset Usage
There are three basic RF chip delays currently in use. It is important to
determine what RF chip delay is valid to be able to test the BTS
functionality. This can be done by ascertaining if the CDF file
FineTxAdj value was set to “on” when the MCC was downloaded with
“image data”. The
processing delay (approximately 20 mS) in the BTS using any type of
mobile meeting IS–97 specifications.
Observe the following guidelines:
FineTxAdj value is used to compensate for the
S If the FineTxAdj value in the cdf file is 101 (65 HEX), the
FineTxAdj has not been set. The I and Q values from the 0 table
MUST be used.
FineTxAdj value in the cdf file is 213 (D5 HEX), FineTxAdj has
If the
been set for the 14 chip table.
S If the FineTxAdj value in the cdf file is 197 (C5 HEX), FineTxAdj
has been set for the 13 chip table.
IMPORTANT
*
CDF file I and Q values can be represented in DECIMAL
or HEX. If using HEX, add 0x before the HEX value. If
necessary, convert HEX values in Table E-1 to decimal
before comparing them to cdf file I & Q value assignments.
E
08/01/2001
– If you are using a Qualcomm mobile, use the I and Q values from
the 13 chip delay table.
– If you are using a mobile that does not have the 1 chip offset
problem, (any mobile meeting the IS–97 specification), use the 14
chip delay table.
1X SCt4812ET Lite BTS Optimization/ATP
PRELIMINARY
E-1
PN Offset Programming Information – continued
IMPORTANT
E
*
If the wrong I and Q values are used with the wrong
FineTxAdj parameter, system timing problems will occur.
This will cause the energy transmitted to be “smeared”
over several Walsh codes (instead of the single Walsh code
that it was assigned to), causing erratic operation. Evidence
of smearing is usually identified by Walsh channels not at
correct levels or present when not selected in the Code
Domain Power Test.
Calibrating Test Cable Setup using Advantest R3465F-18. . . . . . . . . . . . .
F
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Table of Contents – continued
Notes
F
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Test Equipment Preparation
Purpose
HP8921A T est Equipment
Connections
This appendix provides information on setting up the HP8921 with PCS
interface, the HP8935, the Advantest R3465, and the HP437 and
Gigatronics 8542 power meters. The Cybertest test set doesn’t require
any setup.
The following diagram depicts the rear panels of the HP 8921A test
equipment as configured to perform automatic tests. All test equipment
is controlled by the LMF via an IEEE–488/GPIB bus. The LMF expects
each piece of test equipment to have a factory-set GPIB address (refer to
Table F-4). If there is a communications problem between the LMF and
any piece of test equipment, you should verify that the GPIB addresses
have been set correctly and that the GPIB cables are firmly connected to
the test equipment.
Figure F-1 shows the connections when not using an external 10 MHz
Rubidium reference.
Table F-1: HP8921A/600 Communications Test Set Rear Panel Connections Without Rubidium Reference
From Test Set:To Interface:
Connector Type
8921A83203B CDMA83236A PCS
CW RF OUTCW RF INSMC–female – SMC–female
114.3 MHZ IF OUT114.3 MHZ IF INSMC–female – SMC–female
IQ RF INIQ RF OUTSMC–female – SMC–female
DET OUTAUX DSP INSMC–female – SMC–female
CONTROL I/OCONTROL I/O45–pin custom BUS
10 MHZ OUTSYNTH REF INBNC–male – BNC–male
HPIB INTERFACEHPIB INTERFACEHPIB cable
10 MHZ OUTREF INBNC–male – BNC–male
F
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F-1
Test Equipment Preparation – continued
Figure F-1: HP8921A/600 Cables Connection for 10 MHz Signal and GPIB without Rubidium Reference
HP83203B CDMA
TO POWER
METER GPIB
CONNECTOR
TO GPIB
INTERFACE
BOX
CELLULAR ADAPTER
HP8921A CELL
SITE TEST SET
HP83236A PCS
INTERFACE
F
REF IN
COMMUNICATIONS TEST SET
HP–IB
FW00368
REAR PANEL
F-2
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08/01/2001
Test Equipment Preparation– continued
Figure F-2 shows the connections when using an external 10 MHz
Rubidium reference.
Table F-2: HP8921A/600 Communications Test Set Rear Panel Connections With Rubidium Reference
From Test Set:To Interface:
8921A83203B CDMA83236A PCS
CW RF OUTCW RF INSMC–female – SMC–female
114.3 MHZ IF OUT114.3 MHZ IF INSMC–female – SMC–female
IQ RF INIQ RF OUTSMC–female – SMC–female
DET OUTAUX DSP INSMC–female – SMC–female
CONTROL I/OCONTROL I/O45–pin custom BUS
10 MHZ OUTREF INBNC–male – BNC–male
HPIB INTERFACEHPIB INTERFACEHPIB cable
10 MHZ INPUT10 MHZ OUTBNC–male – BNC–male
Connector Type
F
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F-3
Test Equipment Preparation – continued
Figure F-2: HP8921A Cables Connection for 10 MHz Signal and GPIB with Rubidium Reference
10 MHZ WITH
RUBIDIUM STANDARD
HP83203B CDMA
TO POWER
METER GPIB
CONNECTOR
CELLULAR ADAPTER
TO GPIB
INTERFACE
BOX
F
REF IN
HP–IB
FW00369
HP8921A CELL
SITE TEST SET
HP83236A PCS
INTERFACE
REAR PANEL
COMMUNICATIONS TEST SET
F-4
1X SCt4812ET Lite BTS Optimization/ATP
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08/01/2001
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