This means that the phone does not use any current at all when the supply is connected and/or power key
is pressed. It is assumed that the voltage supplied is 3.6VDC. The UEMCLite will prevent any functionality at
battery/supply levels below 2.9VDC.
If this kind of failure is presenting itself immediately after FLALI, it is most likely caused by ASIC's missing
contact with PWB.
If the MCU doesn’t service the watchdog register within the UEMCLite, the operations watchdog will run out
after approximately 32 seconds. Unfortunately, the service routine can not be measured.
Troubleshooting flow
Figure 10 Troubleshooting when phone does not stay on or phone is jammed
The flash programming can be done via the pads on the PWB (J2060). If failed, then follow up the trouble
shooting flow chart.
In case of flash failure in the FLALI station, swap the phone and send it back to the care program for further
analysis. Possible failures could be short-circuit of balls under µBGAs (UEMCLite, UPP4M, FLASH), or missing
or misaligned components.
In flash programming error cases, the flash prommer can give some information about a fault. The fault
information messages could be:
Phone doesn't set FBUS_TX line low
Because of the use of uBGA components, it is not possible to verify if there is a short circuit in the control and
address lines of MCU (UPP8M) and the memory (flash).
The flash programming can be done via the easy flash connector. If failed, then follow up the trouble shooting
below.
It is not possible to verify if there is a short circuit in control and address lines of MCU (UPP8M) and memory
(flash) because BGA package is used in RM-340/341.
This error can only happen at power up where several self-tests are run. If any of these test cases fails the
display will show the message: "Contact Service".
They are individual test cases, so the below lineup of error hunting's has no chronological order. Use common
sense and experience to decide which test case to start error hunting at.
Figure 13 Troubleshooting when the "Contact Service" message is seen
The phone does not register to the networks, or the phone cannot make a call
Context
If the phone doesn't register to the network, the fault can be in either BB or RF. Only few signals can be tested
since several signals are 'buried' in one or more of the inner layers of the PWB.
First, check that SIM LOCK is not causing the error by using a Test-SIM card and connect the phone to a tester.
The hardware of the SIM interface from UEMCLite (D2200) to the SIM connector (X2700) can be tested without
a SIM card. When the power is switched on the phone first check for a 1.8V SIM card and then a 3V SIM card.
The phone will try this four times, where after it will display ”Insert SIM card”.
The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data
signal levels are wrong. The first data is always ATR and it is sent from card to phone.
For reference a picture with normal SIM power-up is shown below.
Figure 17 Signal diagram
User interface
Blank display
Context
The display does not show any information at all. If there is only main or sub display blank, the problem
mostly exists in individual display. Replace related display first. For main and sub display blank, refer to
troubleshooting flow below.
Most RF semiconductors are static discharge sensitive
Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or
"LF".
• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for
example HP54006A. (Note that when measuring with the 500ohm probe the signal will be around 20dB
attenuated. The values in the following will have these 20dB subtracted and represent the real value seen
on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration
when calibrating the test system.
• LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe
used in the following is 10Mohm/8pF passive probe. If using another probe then bear in mind that the
voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when
measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when
realigning the phone.
So ESD protection must be applied during repair (ground straps and ESD soldering irons). Mjoelner and Bifrost
are moisture sensitive so parts must be pre-baked prior to soldering. Apart from key-components described
in this document there are a lot of discrete components (resistors, inductors and capacitors) for which
troubleshooting is done by checking if soldering of the component is done properly and checking if the
component is missing from PWB. Capacitors can be checked for short-circuiting and resistors for value by
means of an ohmmeter, but be aware in-circuit measurements should be evaluated carefully. In the following
both the name EGSM and GSM850 will be used for the lower band and both PCN and GSM1900 will be used
for the upper band.
RF key components
Figure 29 RF key components on PWB
N7600PMB3258 RF IC
N7700FEM (PA and antenna switch)
Z7602EGSM 850/900 RX SAW filter
Z7600DCS 1800/PCS1900 RX SAW filter
Autotune is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and
measurements of RX and TX. The results are displayed and logged in a result file, if initiated.
By measuring with an oscilloscope at RXIP or RXQP on a working GSM900 receiver this picture should be seen.
Signal amplitude peak-peak 108mV. DC offset 1.0V.
By measuring with an oscilloscope at RXIP or RXQP on a working GSM1800 receiver this picture should be
seen. Signal amplitude peak-peak 114mV. DC offset 1.0V.
General instructions for GSM1800 TX troubleshooting
Steps
1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be
connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise
the PA may be damaged.
2. Start
3. Select File and Scan product.
4. Wait a while for the PC to read the information from the phone.
5. Select Testing and RF Controls.
6. Set the parameters as follows:
Phoenix
iBand: GSM 1800
iiActive Unit: TX
iii TX Power Level: 0
iv TX Data Type: Random
and establish a connection to the phone with the data cable e.g. FBUS.
By measuring with an oscilloscope at RXIP or RXQP on a working GSM1900 receiver this picture should be
seen. Signal amplitude 108 mVp-p. DC offset 1.0V.
General instructions for GSM1900 TX troubleshooting
Steps
1. Apply a RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable should be
connected to an attenuator at least 10dB before connected to the measurement equipment, otherwise
the PA may be damaged.
2. Start
3. Select File and Scan product.
4. Wait a while for the PC to read the information from the phone.
5. Select Testing and RF Controls.
6. Set the parameters as follows:
Phoenix
iBand: GSM 1900
iiActive Unit: TX
iii TX Power Level: 0
iv TX Data Type: Random
and establish a connection to the phone with the data cable e.g. FBUS.
There is only one PLL synthesizer generating Local Oscillator frequencies for both RX and TX in both bands
(PCN and EGSM). The VCO frequency is divided by 2 for PCN operation or by 4 for EGSM operation inside the
Mjoelner IC.
The 26MHz oscillator is located near the Mjoelner IC. (N7600). The coarse frequency for this oscillator is set
by an external crystal (B7600). The reference oscillator is used as a reference frequency for the PLL synthesizer
and as the system clock for the Baseband. The 26MHz signal is divided by 2 to achieve 13MHz inside the UPP
IC (D2800).
The 26MHz signal from the VCXO can be measured by probing R2900. The level at this point is approx.
770mVpp. Frequency of this oscillator is adjusted by changing the AFC-register inside the UEM IC. Example
Signal Measured at VCXO output (R2900).
The main board consists of a radio frequency part and a baseband part. The User Interface parts are situated
at the UI side, which is on the opposite side of the engine board. The 2CP is the engine module of the mobile
device, and the 2CQ is the UI module of module of the mobile device.
The master of EM control is UEMCLite and with SW it has the main control of the system voltages and operating
modes. The power distribution diagram is presented in the illustration below.
Figure 107 Power connection diagram
All connectors going to the “outside world” have filter components, ESD protection and EMC reduction.
The Digital/Data lines on SIM have special dedicated filter ASIP. The below figure show the SIM filtering.
The Audio circuit: Earpiece, IHF, internal microphone and external speaker are filtered with discrete
components (common mode reduction coils, Varistors, caps and resistors), where as the external microphone
uses differential mode mic. ASIP
The 16 UEMECLite BB & RF regulators are specified to have a decoupling cap of 1 µF ±20%.
Modes of operation
BB4.0 LiteV2 base band has five different functional modes, which are defined in UEMCLite specification:
• No supply: In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of
main battery or low battery voltage level in battery. Phone is exiting from NO_SUPPLY mode when sufficient
battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT >
VMSTR+ or by connecting charger and charging the battery above VMSTR+.
• Acting Dead: If the phone is off when the charger is connected, the phone is powered on but enters a state
called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery charging alert is given
and/or a battery charging indication on the display is shown to acknowledge the user that the battery is
being charged.
• Active: In the Active mode the phone is in normal operation, scanning for channels, listening to a base
station, transmitting and processing information. There are several sub-states in the active mode
depending on if the phone is in burst reception, burst transmission, if DSP is working etc.
In Active mode the RF regulators are controlled by SW writing into UEMCLite’s registers wanted settings:
VR regulators can be disabled, enabled or forced into low quiescent current mode. VR2 is always enabled
in Active mode for system clock chain supply
• Sleep: In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for
the base band.
• Charging: Charging can be performed in any operating mode. The battery type / size is indicated by a
resistor inside the battery pack. The resistor value corresponds to a specific battery capacity. This capacity
value is related to the battery technology as different capacity values are achieved by using different
battery technology. The battery voltage, temperature, size and current are measured by the UEMCLite and
controlled by the charging software running in the UPP. The charging control circuitry (CHACON) inside the
UEMCLite controls the charging current delivered from the charger to the battery. The battery voltage rise
is limited by turning the UEMCLite switch off when the battery voltage has reached 4.2 V. Charging current
is monitored by measuring the voltage drop across a 220 mW resistor. The PWM output doesn’t exist any
more from UEMCLite to the bottom connector
UEMcLite supports three microphone inputs and two outputs. The inputs can be used for internal, headset
or handsfree microphones. The microphone signals from different sources are connected to separate inputs
at the UEMcLite ASIC. The inputs and outputs are all differential.
Three inputs (MIC1, MIC2) and two outputs (EAR, HF) are used in the phone.
MIC1P/MIC1N inputs are used for the internal microphone, using single-ended biasing circuitry. EARP/EARN
outputs from UEMcLite are used for hand-portable mode.
Uplink external audio (headset as well as carkit) is connected to MIC2P/MIC2N, while downlink audio is
provided via the HF outputs from UEMcLite. A special situation exists since the carkit can be used with two
different microphones: either the phone's internal microphone (MIC1-inputs) or an external microphone that
connects to the carkit. In these cases UEMcLite is capable of switching between MIC1 and MIC2.
The audio control is taken care of by UEMcLite, which contains the MCU and audio codec. UPP contains DSP
blocks, and handling and processing of the audio signals.
Input and output selection, and gain control is performed inside UEMcLite. DTMF-tones and other audio tones
are generated and encoded by UPP and transmitted to UEMcLite for decoding.
External audio connector
The system connector, containing a 4-pole Jack plug, gains the access to the external audio interface. The
Jack plug, which is integrated in the system connector, contains a mechanical switch, which is used to detect
the connection of the accessories. The configuration for the 4-pole Jack-plug is shown in the following figure.
The HALL sensor is used to recognize the position of the flap.
The HALL sensor incorporates advanced chopper-stabilization techniques to provide accurate and stable
magnetic switch points. The circuit design provides an internally controlled clocking mechanism to cycle
power to the HALL element and analog signal processing circuits. This serves to place the high currentconsuming portions of the circuit into the sleep mode. Periodically the device is awakened by this internal
logic and the magnetic flux from the HALL element is evaluated against the predefined thresholds. If the flux
density is above or below the BOP/BRP thresholds, the output transistor is driven to change states accordingly.
While in the sleep cycle, the output transistor is latched in its previous state.
The output transistor of the SH248CSP is latched on at the presence of a sufficiently strong south or north
magnetic field facing the marked side of the package. The output is latched off in the absence of a magnetic
field.
The output of hall sensor is sent to GENIO24 of UPP. Baseband knows the status of the hall sensor that
represents the phone position (folded or not).
The UEMCLite contains the SIM interface logic level shifting. The SIM interface can be programmed to support
3V and 1.8V SIMs. SIM supply voltage is selected by with register in the UEMCLite. It is only allowed to change
the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEMCLite. This means that the UEMCLite generates the
RST signal to the SIM. In addition, the SIMCardDet signal is connected to UEMCLite. The detection is taken from
the BSI signal, which detects the removal of the battery. The monitoring of the BSI signal is done by a
comparator inside UEMCLite. The comparator offset is such that the comparator outputs do not alter state as
long as the battery is connected. The threshold voltage is calculated from the battery size specifications.
The SIM interface is powered up when the SIMCardDet signal indicates ”card in”. This signal is derived from
the BSI signal.