Nokia NSE–3 Service Manual

Technical Documentation

Programs After Market Services (PAMS)

Last Update 11/97

SERVICE

MANUAL

[NMP Part No.0275341]

NSE–3 SERIES

CELLULAR

PHONES

Technical Documentation

Programs After Market Services (PAMS)

Last Update 11/97

NSE–3 SERIES DIGITAL CELLULAR PHONES

SERVICE MANUAL

OVERALL CONTENTS

NSE–3 Series Core Transceiver booklet comprising

Chapter 1: Foreword

Chapter 2: General Information

Chapter 3: System Module

Chapter 4: UI Module

Appendices to Transceiver booklet covering a specific variant

Appendix 1: Transceiver NSE–3NX

Booklets comprising

Service Software Instructions

Tuning Instructions

Service Tools

Disassembly/Troubleshooting Instructions

Handsfree Unit HFU–2

Non–serviceable Accessories

Installation Instructions CARK–64

Installation Instructions CARK–91

NSE–3 SeriesTransceivers

PAMS Technical Documentation

Original 11/97

Chapter 1

Foreword

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NSE–3
Foreword

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IMPORTANT

This document is intended for use by qualified service personnel only .

Company Policy

Our policy is of continuous development; details of all technical modifications
will be included with service bulletins.

While every endeavour has been made to ensure the accuracy of this
document, some errors may exist. If any errors are found by the reader,
NOKIA MOBILE PHONES Ltd should be notified in writing.

Please state:

Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error

Please send to: Nokia Mobile Phones Ltd

PAMS Technical Documentation
PO Box 86
FIN–24101 SALO
Finland

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Foreword

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Warnings and Cautions

Please refer to the phone’s user guide for instructions relating to
operation, care and maintenance including important safety information.
Note also the following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES
FITTED WITH ELECTRONIC ENGINE MANAGEMENT
SYSTEMS AND ANTI–SKID BRAKING SYSTEMS. UNDER
CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT
THE VEHICLE DEALER/MANUFACTURER TO DETERMINE
THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO
RF ENERGY.

2. THE HANDPORTABLE TELEPHONE MUST NOT BE
OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY
EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.

3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT,
INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY
PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN
OR THE MANUFACTURER OF THE MEDICAL DEVICE IF
YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC
EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.

Cautions:

1. Servicing and alignment must be undertaken by qualified
personnel only.

2. Ensure all work is carried out at an anti–static workstation and
that an anti–static wrist strap is worn.

3. Ensure solder, wire, or foreign matter does not enter the
telephone as damage may result.

4. Use only approved components as specified in the parts list.

5. Ensure all components, modules screws and insulators are
correctly re–fitted after servicing and alignment. Ensure all
cables and wires are repositioned correctly.

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NSE–3 Series Transceivers

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Chapter 3

System Module

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CONTENTS

Transceiver NSE–3 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interconnection Diagram 3 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Module 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

External and Internal Connectors 3 – 7. . . . . . . . . . . . . . . . . . . . .

System Connector Contacts 3 – 8. . . . . . . . . . . . . . . . . . . . . . .

RF Connector Contacts 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply Voltages and Power Consumtion 3 – 9. . . . . . . . . . . .

Functional Description 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Baseband Module 3 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Block Diagram 3 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Summary 3 – 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Bottom Connector External Contacts 3 – 12. . . . . . . . . . . . . . .

Bottom Connector Signals 3 – 12. . . . . . . . . . . . . . . . . . . . . . . .

Battery Connector 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SIM Card Connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Microphone 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Infrared Module Connections 3 – 15. . . . . . . . . . . . . . . . . . . . . .

RTC Backup Battery 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Buzzer 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery charging 3 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Startup Charging 3 – 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Overvoltage Protection 3 – 19. . . . . . . . . . . . . . . . . . . .

Battery Removal During Charging 3 – 20. . . . . . . . . . . . . . . . . .

Different PWM Frequencies ( 1Hz and 32 Hz) 3 – 21. . . . . . .

Battery Identification 3 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Temperature 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply Voltage Regulators 3 – 23. . . . . . . . . . . . . . . . . . . . . . . .

Switched Mode Supply VSIM 3 – 25. . . . . . . . . . . . . . . . . . . . . .

Power Up 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power up with a charger 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . .

Power Up With The Power Switch (PWRONX) 3 – 26. . . . . . .

Power Up by RTC 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Up by IBI 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Acting Dead 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Active Mode 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Sleep Mode 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charging 3 – 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Off 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Watchdog 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Audio control 3 – 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

External Audio Connections 3 – 30. . . . . . . . . . . . . . . . . . . . . . .

Analog Audio Accessory Detection 3 – 31. . . . . . . . . . . . . . . . .

Headset Detection 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Internal Audio Connections 3 – 32. . . . . . . . . . . . . . . . . . . . . . . .

4–wire PCM Serial Interface 3 – 32. . . . . . . . . . . . . . . . . . . . . . .

Alert Signal Generation 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . .

Digital Control 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MAD2 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Memories 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Program Memory 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SRAM Memory 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EEPROM Memory 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MCU Memory Map 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Flash Programming 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

COBBA–GJ 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Infrared Transceiver Module 3 – 45. . . . . . . . . . . . . . . . . . . . . . .

Real Time Clock 3 – 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RTC backup battery charging 3 – 46. . . . . . . . . . . . . . . . . . . . . .

Vibra Alerting Device 3 – 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IBI Accessories 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Phone Power–on by IBI 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . .

IBI power–on by phone 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Module 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum Ratings 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF Frequency Plan 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution Diagram 3 – 49. . . . . . . . . . . . . . . . . . . . . . . . . .

DC Characteristics 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Regulators 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Control Signals 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Frequency synthesizers 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver 3 – 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter 3 – 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AGC strategy 3 – 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AFC function 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver blocks 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX interstage filter 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1st mixer in CRFU_1a 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1st IF–filter 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Transmitter Blocks 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX interstage filter 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power amplifier MMIC 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Synthesizer blocks 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VHF VCO and low pass filter 3 – 57. . . . . . . . . . . . . . . . . . . . . . . .

UHF PLL 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UHF PLL block in PLUSSA 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . .

UHF VCO module 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UHF local signal input in CRFU_1a 3 – 58. . . . . . . . . . . . . . . . . . .

Connections 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF connector and antenna switch 3 – 58. . . . . . . . . . . . . . . . . . . .

Timings 3 – 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Synthesizer control timing 3 – 61. . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter power switching timing diagram 3 – 63. . . . . . . . . . .

Synthesizer clocking 3 – 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Block Diagram of Baseband Blocks 3 – 64. . . . . . . . . . . . . . . . . . .

Parts list of UP8T (EDMS Issue 11.10) 3 – 65

Schematic Diagrams:

Block Diagram of System/RF Blocks 3/A3–1. . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of Baseband (Version 12 Edit 8) 3/A3–2. . . . . . . . . .

Circuit Diagram of Power Supply (Version 14 Edit 41) 3/A3–3. . . . . .

Circuit Diagram of SIM Connectors (Version 14 Edit 9) 3/A3–4. . . . . .

Circuit Diagram of CPU Block (Version 14 Edit 23) 3/A3–5. . . . . . . . .

Circuit Diagram of Audio (Version 14 Edit 27) 3/A3–6. . . . . . . . . . . . .

Circuit Diagram of IR Module (Version 14 Edit 21) 3/A3–7. . . . . . . . . .

Circuit Diagram of RF Block (Version 14 Edit 26) 3/A3–8. . . . . . . . . . .

Layout Diagram of UPT8T (Version 14) 3/A3–9. . . . . . . . . . . . . . . . . . .

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Transceiver NSE–3

Introduction

The NSE–3 is a radio transceiver unit designed for the GSM network. It is a
GSM phase 2 power class 4 transceiver providing 15 power levels with a
maximum output power of 2 W. The transceiver is a true 3 V transceiver.

The transceiver consists of System/RF module (UP8T), User interface
module (UE4) and assembly parts.

The transceiver has full graphic display and two soft key based user inter­face.

The antenna is a fixed helix. External antenna connection is provided by
rear RF connector

Functional Description

There are five different operation modes:
– power off mode
– idle mode
– active mode
– charge mode
– local mode

In the power off mode only the circuits needed for power up are supplied.
In the idle mode circuits are powered down and only sleep clock is run-

ning.
In the active mode all the circuits are supplied with power although some

parts might be in the idle state part of the time.
The charge mode is effective in parallel with all previous modes. The

charge mode itself consists of two different states, i.e. the charge and the
maintenance mode.

The local mode is used for alignment and testing.

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Interconnection Diagram

Module

User Interface

UE4

Module

System/RF

UP8

Keypad Display

SIM Battery

System

RF

Connector

Connector

Charger

Antenna

2

3 + 36

Earpiece

IR Link

2

1

6

10 9

2

4

28

2

Mic

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System Module

External and Internal Connectors

Rubber boot

Microphone

Solderable element,

2 pcs

Cable/Cradle connector,
guiding/fixing hole, 3 pcs

Contact 1

DC–jack

Contact 2

Contact 9

Contacts

3...8

Microphone port

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System Connector Contacts

Con-

tact

Line

Sym-

bol

Parameter Mini-

mum

Typical
/ Nomi-

nal

Maxi-

mum

Unit / Notes

1 VIN Charger input volt-

age
Charger input cur-

rent

7.1
720

7.24
320

8.4
800

7.6
370

9.3
850

16.0
420

V/ Unloaded ACP–9 Charger
mA/ Supply current
V/ Unloaded ACP–7 Charger
mA/ Supply current

DC–
JACK

L_GND Charger ground

input

0 0 0 V/ Supply ground

DC–
JACK

VIN Charger input volt-

age
Charger input cur-

rent

7.1
720

7.24
320

8.4
800

7.6
370

9.3
850

16.0
420

V/ Unloaded ACP–9 Charger
mA/ Supply current
V/ Unloaded ACP–7 Charger
mA/ Supply current

DC–
JACK

CHRG
CTRL

Output high volt­age

PWM frequency
output low voltage

2.0

0

32

2.8

0.5

V/ Charger control (PWM)
high

Hz /PWM frequency for
charger
V

2 CHRG

CTRL

Output high volt­age

PWM frequency

2.0
32

2.8 V/ Charger control (PWM)
high

Hz /PWM frequency for
charger

Mic
ports

Acoustic signal N/A N/A N/A Microphone sound ports

3 XMIC Input signal volt-

age

60 1 Vpp mVrms

4 SGND Signal ground 0 0 mVrms
5 XEAR Output signal volt-

age

80 1 Vpp mVrms

6 MBUS I/O low voltage

I/O high voltage

0

2.0

0.8

2.8

Serial bidirectional control
bus.
Baud rate 9600 Bit/s

7 FBUS_RXInput low voltage

Input high voltage02.0

0.8

2.8

V/ Fbus receive.
V/ Serial Data, Baud rate

9.6k–230.4kBit/s

8 FBUS_TXOutput low voltage

Output high volt­age

0

2.0

0.8

2.8

V/ Fbus transmit.
V/ Serial Data, Baud rate

9.6k–230.4kBit/s

9 L_GND Charger ground

input

0 0 0 V/ Supply ground

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RF Connector Contacts

Con-

tact

Line

Symbol

Parameter Mini-

mum

Typical
/ Nomi-

nal

Maxi-

mum

Unit / Notes

1 EXT_ANT

p

External antenna connec-

2 GND

Im edance 50ohm tor,

0 V DC

Supply Voltages and Power Consumtion

Connector Line Symbol Minimum Typical /

Nominal

Maximum/

Peak

Unit / Notes

Charging VIN 7.1 8.4 9.3 V/ Travel charger,

ACP–9

Charging VIN 7.25 7.6 16.0 V/ T ravel charger.

ACP–7

Charging I / VIN 720 800 850 mA/ Travel char-

ger, ACP–9

Charging I / VIN 320 370 420 mA/ Travel char-

ger, ACP–7

Functional Description

The transceiver electronics consist of the Radio Module ie. RF + System
blocks, the UI PCB, the display module and audio components. The key­pad and the display module are connected to the Radio Module with a
connectors. System blocks and RF blocks are interconnected with PCB
wiring. The Transceiver is connected to accessories via a bottom system
connector with charging and accessory control.

The System blocks provide the MCU, DSP and Logic control functions in
MAD ASIC, external memories, audio processing and RF control hard­ware in COBBA ASIC. Power supply circuitry CCONT ASIC delivers oper­ating voltages both for the System and the RF blocks.

The RF block is designed for a handportable phone which operates in the
GSM system. The purpose of the RF block is to receive and demodulate
the radio frequency signal from the base station and to transmit a modu­lated RF signal to the base station. The PLUSSA ASIC is used for VHF
and PLL functions. The CRFU ASIC is used at the front end.

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Baseband Module

Block Diagram

CCONT

UI

SIM

MAD

SYSCON

CHAPS

COBBA

BATTERY

PA SUPPLY

RF SUPPLIES

BB SUPPLY

TX/RX SIGNALS

BASEBAND

VBAT

+

MEMORIES

COBBA SUPPLY

AUDIOLINES

IR

32kHz
CLK

13MHz
CLK

SLEEP CLOCK

SYSTEM CLOCK

Technical Summary

The baseband module consists of four asics, CHAPS, CCONT, COBBA–
GJ and MAD2, which take care of the baseband functions of NSE–3.

The baseband is running from a 2.8V power rail, which is supplied by a
power controlling asic. In the CCONT asic there are 6 individually con­trolled regulator outputs for RF–section and two outputs for the base­band. In addition there is one +5V power supply output (V5V) for flash
programming voltage and other purposes where a higher voltage is need­ed. The CCONT contains also a SIM interface, which supports both 3V
and 5V SIM–cards. A real time clock function is integrated into the
CCONT, which utilizes the same 32kHz clock supply as the sleep clock. A
backup power supply is provided for the RTC, which keeps the real time
clock running when the main battery is removed. The backup power sup­ply is a rechargable polyacene battery. The backup time with this battery
is minimum of ten minutes.

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The interface between the baseband and the RF section is handled by a
specific asic. The COBBA asic provides A/D and D/A conversion of the
in–phase and quadrature receive and transmit signal paths and also A/D
and D/A conversions of received and transmitted audio signals to and
from the UI section. The COBBA supplies the analog TXC and AFC sig­nals to rf section according to the MAD DSP digital control and converts
analog AGC into digital signal for the DSP. Data transmission between the
COBBA and the MAD is implemented using a parallel connection for high
speed signalling and a serial connection for PCM coded audio signals.
Digital speech processing is handled by the MAD asic. The COBBA asic
is a dual voltage circuit, the digital parts are running from the baseband
supply VBB and the analog parts are running from the analog supply
VCOBBA.

The baseband supports three external microphone inputs and two exter­nal earphone outputs. The inputs can be taken from an internal micro­phone, a headset microphone or from an external microphone signal
source. The microphone signals from different sources are connected to
separate inputs at the COBBA asic.

The output for the internal earphone is a dual ended type output capable
of driving a dynamic type speaker. Input and output signal source selec­tion and gain control is performed inside the COBBA asic according to
control messages from the MAD. Keypad tones, DTMF, and other audio
tones are generated and encoded by the MAD and transmitted to the
COBBA for decoding. A buzzer and an external vibra alert control signals
are generated by the MAD with separate PWM outputs.

EMC shieding is implemented using a metallized plastic B–cover with a
conductive rubber seal on the ribs. On the other side the engine is
shielded with a frame having a conductive rubber on the inner walls,
which makes a contact to a ground ring of the engine board and a
ground plane of the UI–board. Heat generated by the circuitry will be con­ducted out via the PCB ground planes.

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 12

Bottom Connector External Contacts

Contact Line Symbol Function

1 VIN Charger input voltage
DC–jack

side contact
(DC–plug ring)

L_GND Charger ground

DC–jack
center pin

VIN Charger input voltage

DC–jack
side contact
(DC–plug jacket)

CHRG_CTRL Charger control output (from phone)

2 CHRG_CTRL Charger control output (from phone)
Microphone

acoustic ports

Acoustic signal (to phone)

3 XMIC Accessory microphone signal input (to phone)
4 SGND Accessory signal ground
5 XEAR Accessory earphone signal output (from phone)
6 MBUS MBUS, bidirectional serial data i/o
7 FBUS_RX FBUS, unidirectional serial data input (to phone)
8 FBUS_TX FBUS, unidirectional serial data output (from phone)
9 L_GND Charger ground

Bottom Connector Signals

Pin Name Min Typ Max Unit Notes

1,3 VIN

7.25

3.25
320

7.6

3.6

370

7.95

16.9

3.95
420

V
V
V

mA

Unloaded ACP–7 Charger (5kohms
load)

Peak output voltage (5kohms load)
Loaded output voltage (10ohms load)
Supply current

7.1

3.25
720

8.4

3.6

800

9.3

3.95
850

V
V

mA

Unloaded ACP–9 Charger
Loaded output voltage (10ohms load)
Supply current

2 L_GND 0 0 V Supply ground

4,5 CHRG_

0 0.5 V Charger control PWM low

CTRL

2.0 2.85 V Charger control PWM high
32 Hz PWM frequency for a fast charger

1 99 % PWM duty cycle
6 MICP N/A see section Internal microphone
7 MICN N/A see section Internal microphone

PAMS
Technical Documentation

NSE–3

System Module

Page 3 – 13

Original 11/97

NotesUnitMaxTypMinNamePin

8 XMIC

2.0 2.2 kΩ Input AC impedance
1 Vpp Maximum signal level

1.47 1.55 V Mute (output DC level)

2.5 2.85 V Unmute (output DC level)

100 600 µA Bias current

58 490 mV Maximum signal level

HMIC 0 3.2 29.3 mV Microphone signal

Connected to COBBA MIC3P input

9 SGND

47 Ω Output AC impedance (ref. GND)
10 µF Series output capacitance

380 Ω Resistance to phone ground

10 XEAR

47 Ω Output AC impedance (ref. GND)
10 µF Series output capacitance

16 300 Ω Load AC impedance to SGND (Head-

set)

4.7 10 kΩ Load AC impedance to SGND (Acces-

sory)

1.0 Vpp Maximum output level (no load)
22 626 mV Output signal level
10 kΩ Load DC resistance to SGND (Acces-

sory)

16 1500 Ω Load DC resistance to SGND (Head-

set)

2.8 V DC voltage (47k pull–up to VBB)

HEAR 28 626 mV Earphone signal (HF– HFCM)

Connected to COBBA HF output

11 MBUS 0 logic low 0.8 V Serial bidirectional control bus.

2.0 logic high 2.85

Baud rate 9600 Bit/s
Phone has a 4k7 pullup resistor

12 FBUS_RX 0 logic low 0.8 V Fbus receive. Serial Data

2.0 logic high 2.85

Baud rate 9.6k–230.4kBit/s
Phone has a 220k pulldown resistor

13 FBUS_TX 0 logic low 0.5 V Fbus transmit. Serial Data

2.0 logic high 2.85

Baud rate 9.6k–230.4kBit/s
Phone has a 47k pullup resistor

14 GND 0 0.3 V Supply ground

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 14

Battery Connector

Pin Name Min Typ Max Unit Notes

1 BVOLT 3.0 3.6 4.5 V Battery voltage

5.0

5.3

Maximum voltage in call state with charger
Maximum voltage in idle state with charger

2 BSI

0 2.85 V Battery size indication

Phone has 100kohm pull up resistor.

SIM Card removal detection

(Treshold is 2.4V@VBB=2.8V)

2.2 18 kohm Battery indication resistor (Ni battery)
20 22 24 kohm Battery indication resistor (service battery)
27 51 kohm Battery indication resistor (4.1V Lithium

battery)

68 91 kohm Battery indication resistor (4.2V Lithium bat-

tery)

3 BTEMP

0 1.4 V Battery temperature indication

Phone has a 100k (+–5%) pullup resistor,

Battery package has a NTC pulldown resis-

tor:

47k+–5%@+25C , B=4050+–3%

2.1

5

10

3

20

V

ms

Phone power up by battery (input)

Power up pulse width

1.9
90

100

2.85
200

V

ms

Battery power up by phone (output)

Power up pulse width

0 1 kohm Local mode initialization (in production)

20 22 25 kHz PWM control to VIBRA BATTERY

4 BGND 0 0 V Battery ground

PAMS
Technical Documentation

NSE–3

System Module

Page 3 – 15

Original 11/97

SIM Card Connector

Pin Name Parameter Min Typ Max Unit Notes

4 GND GND 0 0 V Ground

3, 5 VSIM 5V SIM Card

3V SIM Card

4.8

2.8

5.0

3.0

5.2

3.2

V Supply voltage

6 DATA 5V V in/Vout

3V Vin/Vout

4.0
0

2.8
0

”1”
”0”
”1”
”0”

VSIM

0.5

VSIM

0.5

V SIM data

Trise/Tfall max 1us

2 SIMRST 5V SIM Card

3V SIM Card

4.0

2.8

”1”
”1”

VSIM
VSIM

V SIM reset

1 SIMCLK Frequency

Trise/Tfall

3.25
25

MHz

ns

SIM clock

Internal Microphone

Pin Name Min Typ Max Unit Notes

6 MICP 0.55 4.1 mV Connected to COBBA MIC2N input. The

maximum value corresponds to1 kHz, 0
dBmO network level with input amplifier
gain set to 32 dB. typical value is maxi­mum value – 16 dB.

7 MICN 0.55 4.1 mV Connected to COBBA MIC2P input. The

maximum value corresponds to1 kHz, 0
dBmO network level with input amplifier
gain set to 32 dB. typical value is maxi­mum value – 16 dB.

Infrared Module Connections

An infrared transceiver module is designed to substitute an electrical
cable between the phone and a PC. The infrared transceiver module is a
stand alone component capable to perform infrared transmitting and re­ceiving functions by transforming signals transmitted in infrared light from
and to electrical data pulses running in two wire asyncronous databus. In
DCT3 the module is placed inside the phone at the top of the phone.

Signal Parameter Min Typ Max Unit Notes

IRON IR–module on/off 2.0 2.85 V Iout@2mA
FBUS_RX

IR receive pulse 0 0.8 V
IR receive no pulse 2.0 2.85 V

FBUS_TX

IR transmit pulse 2.0 2.85 V Iout@2mA
IR transmit no pulse 0 0.5 V

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 16

RTC Backup Battery

The RTC block in CCONT needs a power backup to keep the clock run­ning when the phone battery is disconnected. The backup power is sup­plied from a rechargable polyacene battery that can keep the clock run­ning minimum of 10 minutes. The backup battery is charged from the
main battery through CHAPS.

Signal Parameter Min Typ Max Unit Notes

VBACK

Backup battery charg­ing from CHAPS

3.02 3.15 3.28 V

Backup battery charg­ing from CHAPS

100 200 500 uA Vout@VBAT–0.2V

VBACK

Backup battery supply
to CCONT

2 3.28 V Battery capacity

65uAh

Backup battery supply
to CCONT

80 uA

Buzzer

Signal Maximum

output cur-

rent

Input

high level

Input

low level

Level (PWM)

range, %

Frequency

range, Hz

BuzzPWM /

BUZZER

2mA 2.5V 0.2V 0...50 (128 lin-

ear steps)

440...4700

PAMS
Technical Documentation

NSE–3

System Module

Page 3 – 17

Original 11/97

Functional Description

Power Distribution

In normal operation the baseband is powered from the phone‘s battery.
The battery consists of one Lithium–Ion cell. There is also a possibility to
use batteries consisting of three Nickel Metal Hydride cells. An external
charger can be used for recharging the battery and supplying power to
the phone. The charger can be either a standard charger that can deliver
around 400 mA or so called performance charger, which can deliver sup­ply current up to 850 mA.

The baseband contains components that control power distribution to
whole phone excluding those parts that use continuous battery supply.
The battery feeds power directly to three parts of the system: CCONT,
power amplifier, and UI (buzzer and display and keyboard lights). Figure 4
shows a block diagram of the power distribution.

The power management circuit CHAPS provides protection agains over­voltages, charger failures and pirate chargers etc. that would otherwise
cause damage to the phone.

CCONT

SIM

+

BOTTOM CONNECTOR

CHAPS

COBBA

BATTERY

PA SUPPLY

RF SUPPLIES

VBB

BASEBAND

VBAT

VCOBBA

VSIM

VBB

CNTVR

PWM

VBAT

PWRONX

PURX

VIN

UI

BACKUP

RTC

MEMORIES

MAD

LIM

VBB

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 18

Battery charging

The electrical specifications give the idle voltages produced by the ac­ceptable chargers at the DC connector input. The absolute maximum in­put voltage is 30V due to the transient suppressor that is protecting the
charger input. At phone end there is no difference between a plug–in
charger or a desktop charger. The DC–jack pins and bottom connector
charging pads are connected together inside the phone.

VIN

CHAPS

10k

1n

PWM

VBAT

GND

CCONT

CHRG_CTRL

L_GND

CHARGER

PWM_OUT

TRANSCEIVER

0R22

VCHAR

ICHAR

100k

22k

1u

2A

30V

VCH

VOUT

RSENSE

GND

NOT IN
ACP–7

CCONTINT

MAD

LIM

MAD

Startup Charging

When a charger is connected, the CHAPS is supplying a startup current
minimum of 130mA to the phone. The startup current provides initial
charging to a phone with an empty battery. Startup circuit charges the
battery until the battery voltage level is reaches 3.0V (+/– 0.1V) and the
CCONT releases the PURX reset signal and program execution starts.
Charging mode is changed from startup charging to PWM charging that is
controlled by the MCU software. If the battery voltage reaches 3.55V
(3.75V maximum) before the program has taken control over the charg­ing, the startup current is switched off. The startup current is switched on
again when the battery voltage is sunken 100mV (nominal).

Parameter Symbol Min Typ Max Unit

VOUT Start– up mode cutoff limit Vstart 3.45 3.55 3.75 V

VOUT Start– up mode hysteresis

NOTE: Cout = 4.7 uF

Vstarthys 80 100 200 mV

Start–up regulator output current

VOUT = 0V ... Vstart

Istart 130 165 200 mA

PAMS
Technical Documentation

NSE–3

System Module

Page 3 – 19

Original 11/97

Battery Overvoltage Protection

Output overvoltage protection is used to protect phone from damage.
This function is also used to define the protection cutoff voltage for differ­ent battery types (Li or Ni). The power switch is immediately turned OFF if
the voltage in VOUT rises above the selected limit VLIM1 or VLIM2.

Parameter Symbol LIM input Min Typ Max Unit

Output voltage cutoff limit

(during transmission or Li–

battery)

VLIM1 LOW 4.4 4.6 4.8 V

Output voltage cutoff limit

(no transmission or Ni–bat-

tery)

VLIM2 HIGH 4.8 5.0 5.2 V

The voltage limit (VLIM1 or VLIM2) is selected by logic LOW or logic
HIGH on the CHAPS (N101) LIM– input pin. Default value is lower limit
VLIM1.

When the switch in output overvoltage situation has once turned OFF, it
stays OFF until the the battery voltage falls below VLIM1 (or VLIM2) and
PWM = LOW is detected. The switch can be turned on again by setting
PWM = HIGH.

PWM (32Hz)

VOUT

VLIM1 or VLIM2

t

SWITCH

ON OFF

VCH

t

VCH<VOUT

ON

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 20

Battery Removal During Charging

Output overvoltage protection is also needed in case the main battery is
removed when charger connected or charger is connected before the bat­tery is connected to the phone.

With a charger connected, if VOUT exceeds VLIM1 (or VLIM2), CHAPS
turns switch OFF until the charger input has sunken below Vpor (nominal

3.0V, maximum 3.4V). MCU software will stop the charging (turn off
PWM) when it detects that battery has been removed. The CHAPS re­mains in protection state as long as PWM stays HIGH after the output
overvoltage situation has occured.

PWM

t

VOUT

t

4V

VLIM

”1”

”0”

SWITCH

t

ON

OFF

2

1.1Battery removed, (standard) charger connected, VOUT rises (follows charger voltage)

2. VOUT exceeds limit VLIM(X), switch is turned immediately OFF

3.3VOUT falls (because no battery) , also VCH<Vpor (standard chargers full–rectified
output). When VCH > Vpor and VOUT < VLIM(X) –> switch turned on again (also PWM
is still HIGH) and VOUT again exceeds VLIM(X).

4

4. Software sets PWM = LOW –> CHAPS does not enter PWM mode

Vstart

5

5. PWM low –> Startup mode, startup current flows until Vstart limit reached

VCH
(Standard
Charger)

Vpor

Vstarthys

Droop depends on load

Istart off due to VCH<Vpor

& C in phone

6

6. VOUT exceeds limit Vstart, Istart is turned off

7. VCH falls below Vpor

7

PAMS
Technical Documentation

NSE–3

System Module

Page 3 – 21

Original 11/97

Different PWM Frequencies ( 1Hz and 32 Hz)

When a travel charger (2– wire charger) is used, the power switch is
turned ON and OFF by the PWM input when the PWM rate is 1Hz. When
PWM is HIGH, the switch is ON and the output current Iout = charger cur­rent – CHAPS supply current. When PWM is LOW, the switch is OFF and
the output current Iout = 0. To prevent the switching transients inducing
noise in audio circuitry of the phone soft switching is used.

The performance travel charger (3– wire charger) is controlled with PWM
at a frequency of 32Hz. When the PWM rate is 32Hz CHAPS keeps the
power switch continuously in the ON state.

SWITCH

PWM (1Hz)

SWITCH

PWM (32Hz)

ON

ON ONON OFF OFF

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 22

Battery Identification

Different battery types are identified by a pulldown resistor inside the bat­tery pack. The BSI line inside transceiver has a 100k pullup to VBB. The
MCU can identify the battery by reading the BSI line DC–voltage level
with a CCONT (N100) A/D–converter.

SIMCardDetX

MAD

BSI

CCONT

2.8V

TRANSCEIVER

R

s

BATTERY

BSI

BGND

BTEMP

BVOLT

10k

10n

100k

The battery identification line is used also for battery removal detection.
The BSI line is connected to a SIMCardDetX line of MAD2 (D200). SIM­CardDetX is a threshold detector with a nominal input switching level

0.85xVcc for a rising edge and 0.55xVcc for a falling edge. The battery
removal detection is used as a trigger to power down the SIM card before
the power is lost. The BSI contact in the battery pack is made 0.7mm
shorter than the supply voltage contacts so that there is a delay between
battery removal detection and supply power off,

0.550.05 Vcc

0.850.05 Vcc

Vcc

GND

S

IGOUT

SIMCARDDETX

PAMS
Technical Documentation

NSE–3

System Module

Page 3 – 23

Original 11/97

Battery Temperature

The battery temperature is measured with a NTC inside the battery pack.
The BTEMP line inside transceiver has a 100k pullup to VREF. The MCU
can calculate the battery temperature by reading the BTEMP line DC–
voltage level with a CCONT (N100) A/D–converter.

100k

VREF

TRANSCEIVER

R

T

BATTERY

BTEMP

BGND

BSI

BVOLT

10n

NTC

1k

MAD

BTEMP

CCONT

VibraPWM

10k

1k

MCUGenIO4

Supply Voltage Regulators

The heart of the power distrubution is the CCONT. It includes all the volt­age regulators and feeds the power to the whole system. The baseband
digital parts are powered from the VBB regulator which provides 2.8V
baseband supply. The baseband regulator is active always when the
phone is powered on. The VBB baseband regulator feeds MAD and me­mories, COBBA digital parts and the LCD driver in the UI section. There is
a separate regulator for a SIM card. The regulator is selectable between
3V and 5V and controlled by the SIMPwr line from MAD to CCONT. The
COBBA analog parts are powered from a dedicated 2.8V supply VCOB­BA. The CCONT supplies also 5V for RF and for flash VPP. The CCONT
contains a real time clock function, which is powered from a RTC backup
when the main battery is disconnected.

PAMS

Technical Documentation

NSE–3
System Module

Original 11/97

Page 3 – 24

The RTC backup is rechargable polyacene battery, which has a capacity
of 50uAh (@3V/2V) The battery is charged from the main battery voltage
by the CHAPS when the main battery voltage is over 3.2V. The charging
current is 200uA (nominal).

Operating mode Vref RF REG VCOB-

BA

VBB VSIM SIMIF

Power off Off Off Off Off Off Pull

down
Power on On On/Off On On On On/Off
Reset On Off

VR1 On

On On Off Pull

down
Sleep On Off On On On On/Off

NOTE:

CCONT includes also five additional 2.8V regulators providing power to
the RF section. These regulators can be controlled either by the direct
control signals from MAD or by the RF regulator control register in
CCONT which MAD can update. Below are the listed the MAD control
lines and the regulators they are controlling.

– TxPwr controls VTX regulator (VR5)
– RxPwr controls VRX regulator (VR2)
– SynthPwr controls VSYN_1 and VSYN_2 regulators (VR4 and VR3)
– VCXOPwr controls VXO regulator (VR1)
CCONT generates also a 1.5 V reference voltage VREF to COBBA,

PLUSSA and CRFU. The VREF voltage is also used as a reference to
some of the CCONT A/D converters.

In additon to the above mentioned signals MAD includes also TXP control
signal which goes to PLUSSA power control block and to the power am­plifier. The transmitter power control TXC is led from COBBA to PLUSSA.