UIM connector pads viewed from the GND side on is on connector.
Page 8Nokia Mobile Phones Ltd.Issue 1 04/01
NSD-6
PAMS Technical DocumentationUI Module CU3
The LCD Module Interface
Typic
Pin
Line
Symbol
ParameterMinimum
al/
Nomi
nal
MaximumUnitNotes
1VLSupply voltage2.72.82.85
300
2SCLKSerial clock input0
0
3SDASerial data input0
0.7xVBB
4LCDCDXControl/display data flag
input
5LCDCSXChip select input0
6OSC**External clock for LCD30.432.033.6kHzConnected to
7UDGND*Ground0V
8VOUTDC/DC voltage converter
output
9LCDRSTXReset0
0
0.7xVBB
0.7xVBB
0.7xVBB
4.0
VBB
0.3xVBB
VBB
0.3xVBB
VBB
0.3xVBB
VBB
9
0.3xVBB
VBB
V
uA
MHz
V
VBB = 2.7V
Control
Data
Active
VBB on UI
Active
* Ground position is on connector NOT BATTERY.
** External oscillator is not used in UE4.
Display Driver
Viewing trought LCD cell
19
Issue 1 04/01Nokia Mobile Phones Ltd.Page 9
NSD-6
UI Module CU3PAMS Technical Documentation
Functional Description
Power Distribution Diagram
PWRXON
VBB
VBATT
Buzzer
UAGND
UDGND
Display Circuit
The display circuit includes LCD module GD40 and two capacitors. The LCD module is
COG (Chip on Glass) technology. The connection method for chip on the glass is ACF,
Adhesive Conductive Film. The LCD module is connected to UI board with gold wired
elastomer. Capacitors are placed on UI PCB.
The display driver includes hw–reset, voltage tripler or quadrupler which depends on
temperature, temperature compensating circui t and low po wer control. Driver includes
84x48 RAM memory which is used when some elements are create on display. Elements
can be create with software. Driver doesn’t include CG–ROM. One bit in RAM is same as
one pixel on display.
LEDs of
Display
LEDs of
Keybord
Display
PWR
key
Keyboard
AGND
Typical value for node is marked with black when circuit is not active.
Typical value for node is marked with gray when circuit is active.
Page 10Nokia Mobile Phones Ltd.Issue 1 04/01
NSD-6
PAMS Technical DocumentationUI Module CU3
[2.8V]
[4V]
Keyboard Matrix
ROW/COL01234
0FLIPSide KeySendEnd/ModeSide Key
1NCSoft leftU pDownSoft Right
2NC147*
3NC2580
4PWR
switch
NC = Not connected
Issue 1 04/01Nokia Mobile Phones Ltd.Page 11
369#
NSD-6
UI Module CU3PAMS Techni cal Documentation
Power Key
Micro switch is used as a power key on UI module. Circuitry includes micro switch and
two diodes which is needed for MAD interface. Power key is connected to CCONT. Power
switch is active in LOW state. The power key circuit can be seen from the Display Circuit
diagram. The power key is connected to ROW4.
Up
Down
12 3
4
7
*
S RightS Left
EndSend
56
8
0
9
#
Page 12Nokia Mobile Phones Ltd.Issue 1 04/01
NSD-6
PAMS Technical DocumentationUI Module CU3
Backlighting
[4V]
[4V]
[2.6V]
[2.0V]
[0V]
[1.9V]
[2.6V]
[0V]
[1.2V]
[1.4V]
[0V]
[0V]
[0.7V]
[0.5V]
Typical value for node is marked with black when circuit is not active
Typical value for node is marked with gray when circuit is active
Issue 1 04/01Nokia Mobile Phones Ltd.Page 13
NSD-6
UI Module CU3PAMS Techni cal Documentation
Display
Backlighting is provided by LEDs, three LED on right and three on left side of display.
LEDs are compatible with CL270–YG and those are side illuminating. Light is on when
LIGHT–signa l is in HIGH state.
Typic
Pin
Line
Symbol
ParameterMinimum
al/
Nomi
nal
MaximumUnitNotes
14VBATBattery voltage3.0
Keyboard
In keyboard backlighting is made by 6 LEDs. LEDs are compatible with CL190–YG. Backlighting is on when LIGHT–signal is on HIGH state.
Color of LED is for
= Keyboard :yellow-green, λ = 570nm
Pin
14VBATBattery voltage3.0
Line
Symbol
ParameterMinimum
43.451.4
Typic
al/
Nomi
nal
55.362.4
5.1
59.6
MaximumUnitNotes
5.1
69.9
V
mA
V
mA
Same sup-
ply for
buzzer &
keyboard
LEDs
Same sup-
ply for
buzzer &
keyboard
LEDs
Page 14Nokia Mobile Phones Ltd.Issue 1 04/01
NSD-6
PAMS Technical DocumentationUI Module CU3
Buzzer
Buzzer for DCT3 generation phone is SMD type.
[4V]
[4V]
[0V]
[0V]
Typical value for node is marked with black when circuit is not active
Typical value for node is marked with gray when circuit is active
[4V]
Speaker
The speaker is sealed to A–cover and UI PCB with silicon gasket. With that the frequency
response is more constant. Speaker needs 6pcs of 1.2mm holes under component for
leaking sound pressure into RF–section through UI module and 7pcs of 0.9mm holes left
corner of UIM to leak from RF–section back to up cavity of phone. RF–section between
UI module and engine acts like sound cage which is known. This gives better sound quality for the phone and it can be estimated in several environments.
Silicon gasket and speaker itself acts like water proofing elements in that area. Water
can come in speaker space between speaker and A–cover but not further from there into
the phone. On A–cover are three pieces of leaking holes which are not located top of the
speaker. The holes give better sound quality and are less sensitive for how well phone is
pressed against side of head.
[1.4V]
[1.4V]
Typical value for node is marked with black when circuit is not active
Typical value for node is marked with gray when circuit is active
Speaker circuit
Issue 1 04/01Nokia Mobile Phones Ltd.Page 15
NSD-6
UI Module CU3PAMS Techni cal Documentation
Page 16Nokia Mobile Phones Ltd.Issue 1 04/01
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