Nokia E62 Service Manual 08sys red

Nokia Customer Care

8 — System Module

Issue 1 COMPANY CONFIDENTIAL Page 8 –1

RM-88

Nokia Customer Care System Module

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Page 8 –2 COMPANY CONFIDENTIAL Issue 1

RM-88 System Module Nokia Customer Care

Table of Contents

Baseband description............................................................................................................................................8–5

System module block diagram........................................................................................................................8–5

Baseband functional description.....................................................................................................................8–6

Absolute maximum ratings..............................................................................................................................8–6

Phone modes of operation...............................................................................................................................8–7

Operation modes...............................................................................................................................................8–8

Power distribution............................................................................................................................................8–9

Clocking scheme..............................................................................................................................................8–10

Bluetooth.........................................................................................................................................................8–10

IrDA...................................................................................................................................................................8–11

USB....................................................................................................................................................................8–11

SIM card............................................................................................................................................................8–11

RF-BB interface................................................................................................................................................8–11

FBUS..................................................................................................................................................................8–12

ACI interface.....................................................................................................................................................8–12

SIM interface....................................................................................................................................................8–13

MiniSD interface...............................................................................................................................................8–13

Battery interface..............................................................................................................................................8–14

User interface..................................................................................................................................................8–15

Display interface.........................................................................................................................................8–15

Keyboard.....................................................................................................................................................8–15

Display and keyboard backlight...............................................................................................................8–15

ALS interface...............................................................................................................................................8–15

E-Mail LED....................................................................................................................................................8–16

Audio concept.......................................................................................................................................................8–17

Audio HW architecture....................................................................................................................................8–17

Internal microphone.......................................................................................................................................8–18

Internal earpiece.............................................................................................................................................8–19

Internal speaker..............................................................................................................................................8–19

Vibra circuitry..................................................................................................................................................8–19

Baseband technical specifications......................................................................................................................8–20

External interfaces..........................................................................................................................................8–20

USB IF electrical characteristics......................................................................................................................8–20

FBUS interface electrical characteristics (between RAP and N2300).........................................................8–21

SIM IF connections...........................................................................................................................................8–21

MiniSD interface connections.........................................................................................................................8–22

Charger connector and charging interface connections & electrical characteristics...............................8–23

Battery interface electrical characteristics...................................................................................................8–24

Internal interfaces...........................................................................................................................................8–24

l2C.....................................................................................................................................................................8–24

Keyboard interface electrical characteristics................................................................................................8–24

Display connector and interface connections..............................................................................................8–25

Back-up battery interface electrical characteristics.....................................................................................8–26

Frequency mappings............................................................................................................................................8–27

GSM850 frequencies........................................................................................................................................8–27

EGSM900 frequencies......................................................................................................................................8–28

GSM1800 frequencies......................................................................................................................................8–29

GSM1900 frequencies......................................................................................................................................8–30

Issue 1 COMPANY CONFIDENTIAL Page 8 –3

RM-88

Nokia Customer Care System Module

List of Tables

Table 14 Battery interface connections.............................................................................................................8–15

Table 15 ALS resistor values................................................................................................................................8–16

Table 16 Charging interface connections..........................................................................................................8–23

Table 17 Charging IF electrical characteristics..................................................................................................8–23

Table 18 Battery IF electrical characteristics.....................................................................................................8–24

Table 19 Back-up battery connections...............................................................................................................8–26

Table 20 Back-up battery electrical characteristics..........................................................................................8–26

List of Figures

Figure 52 System level block diagram..................................................................................................................8–6

Figure 53 Power distribution diagram.................................................................................................................8–9

Figure 54 BT-RAP connection..............................................................................................................................8–11

Figure 55 MiniSD contact area & pin order........................................................................................................8–14

Figure 56 Battery pin order.................................................................................................................................8–15

Figure 57 ALS HW implementation.....................................................................................................................8–16

Figure 58 E-mail LED implementation................................................................................................................8–17

Figure 59 Audio block diagram...........................................................................................................................8–18

Figure 60 Internal microphone passive circuitry..............................................................................................8–18

Figure 61 Internal earpiece circuitry..................................................................................................................8–19

Figure 62 Internal speaker circuitry...................................................................................................................8–19

Figure 63 Vibra circuitry......................................................................................................................................8–20

Figure 64 Charger connector...............................................................................................................................8–23

Page 8 –4 COMPANY CONFIDENTIAL Issue 1

RM-88 System Module Nokia Customer Care

Baseband description

System module block diagram

The device is a quad-band GSM mono-block product with full QWERTY keyboard. It is based on Series 60 UI Style on the Symbian Operating System (SOS) release (version 9.1).

The device has two antennas; Internal antenna for cellular quad band GSM and BT antenna. Bluetooth module has its own antenna. System calculations assume 15dB antenna isolation between

Bluetooth and cellular GSM antenna.

Architecture overview

The device is a monoblock quadband GSM/EDGE 850/900/1800/1900 handportable phone running on Symbian series 60 release 3.0.

Product segment is a Smart phone. The device baseband is single processor architecture based on CeMEnt G3.1S engine (CeBBo1GSM BB + Ritsa

4.5 RF). The baseband includes following HW-blocks:

• RAP, GSM EDGE BaseBand ASIC (ARM926EJ-S MCU, Lead3 PH3 DSP)

• N2200 , primary Energy Management ASIC

• N2300, secondary Energy Management ASIC

• T-combo memory, 256Mbit NOR FLASH + 256Mbit DDR-SDRAM + 1Gbit Mux-one Nand combo memory

• Audio (Microphone, Speaker, IHF and external audio)

• EL keyboard backlightning

• Ambient light sensor

• Bottom Connectors (Mini USB-B + 2.5mm Headset Jack + Dynamo DC jack)

• SIM Interface

• BB-RF Interface

• Bluetooth BTPerf 2.3 (BT 2.0 + EDR)

• UI (Oxford QVGA LCD, QWERTY keyboard)

• IR Interface (IrDA, 115.2kbit/s)

• Mini SD Interface (hot swappable) RF block includes:

• N7505 AHNE RF ASIC (Quad-band GSM functionality based on Ritsa 4.5 engine.)

• N7520 front end module (PA and antenna switch)

• G7500 VCO and G7501 VCXO (38.4MHz)

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Nokia Customer Care System Module

Figure 52 System level block diagram

Baseband functional description

Digital baseband is single processor architecture. It consists of RAP, EM ASIC (N2200), EM ASIC (N2300) and memories as the core. RAP is a GSM EDGE chip with lots of peripheral features. Supported cellular protocols in RAP are GSM (minimum EDGE class 10, GPRS phase2). In general RAP consists of three separate parts. The first part is processor subsystem (PSS) that includes both MCU and DSP processors and related functions. The second part is MCU peripherals that are peripherals mainly controlled by MCU. The third one is DSP peripherals that are peripherals mainly controlled by DSP. N2200 is an audio ASIC including also energy management (EM) functions. With second EM ASIC N2300, it covers the analog audio and energy management function. N2200 is also the device that handles the power-up and power-down routines of the system. During the times when the digital BB is alive N2200 handles a variety of tasks that can not be accomplished elsewhere due to voltage requirements, noise etc. N2300 power IC is intended for energy management control, supply voltage generation and charge control of mobile phone. N2300 has a step down type (buck) programmable switch mode regulator for digital core supply generation, up (boost) switch mode regulator with current control for led supply, charge control circuitry with integrated switch, level shifters and regulator for FBUS/ USB-OTG, and digital circuitry including registers. Stacked triple combo memory (RAM, Nor, Nand in one package) includes 256Mbit DDR SDRAM , 256Mbit NOR Flash and 1Gbit Mux-One Nand.

Absolute maximum ratings

Signal Min Nom Max

Uni

Notes

Battery voltage (idle) -0.3 5.2 V Battery voltage maximum value is

specified during charging is active

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RM-88 System Module Nokia Customer Care

Signal Min Nom Max

Battery voltage (Call) +3.2 +4.8 V Battery voltage maximum value is

Charger input voltage -0.3 +16 V

Uni

specified during charging is active

Notes

Phone modes of operation

Mode Description

NO_SUPPLY (dead) mode means that the main battery is not present or its voltage is too low (below

N2200 master reset threshold) and that the back-up battery voltage is too low.

BACK_UP The main battery is not present or its voltage is too low but back-up battery voltage is

adequate and the 32 kHz oscillator is running (RTC is on).

PWR_OFF In this mode (warm), the main battery is present and its voltage is over N2200 master

reset threshold. All regulators are disabled, PurX is on low state, the RTC is on and the oscillator is on. PWR_OFF (cold) mode is almost the same as PWR_OFF (warm), but the RTC and the oscillator are off.

RESET RESET mode is a synonym for start-up sequence. In this mode certain regulators are

enabled and after they and RFClk have stabilized, the system reset (PurX) is released and PWR_ON mode entered. RESET mode uses 32 kHz clock to count the REST mode delay (typically 16 ms).

DEEP SLEEP Deep sleep mode is entered only from Pwr_on mode with the aid of sw when the

system's activity is low. At deep sleep, VCTCXO is powering off. System is running with the sleep clock. Regulators are in sleep mode.

FLASHING FLASHING mode is for SW downloading.

Voltage limits

Parameter Description Value

Master reset threshold

VMSTR

VMSTR+

VMSTR-

VCOFF+

(N2200) 2.2V (typ.) Master reset

threshold level, rising (N2300) 2.1V (typ.)

Master reset threshold level, falling (N2300) 1.9V (typ.)

Hardware cutoff (rising) 2.9V (typ.)

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RM-88

Nokia Customer Care System Module

Parameter Description Value

Hardware cutoff

VCOFF-

SWCOFF

The master reset threshold controls the internal reset of N2200 / (N2300). If battery voltage is above VMSTR, N2300’s charging control logic is alive. Also, RTC is active and supplied from the main battery. Above VMSTR, N2300 allows the system to be powered on although this may not succeed due to voltage drops during start up. SW can also consider battery voltage too low for operation and power down the system.

(falling) 2.6V (typ.) SW cutoff

limit ~3.2V

Power key

The system boots up when power key is pressed (adequate battery voltage, VBAT, present). Power down can be initiated by pressing the power key again (the system is powered down with the aid of

SW).

Operation modes

There are four different power up possibilities to switch power on:

• Power key is pressed

• Charger is connected

• A pulse is supplied to MBUS line (Clk)

• Internal power up with Real Time Clock alarm. Power is not switched on by supplying battery voltage as in DCT4 generations

It should be noted that system behavior depends on the type of device the engine is in. The difference is mainly in the power key concept, basically:

• The power key controls the system power ON/OFF

• The system boots up always when not empty battery is connected. The power key controls only the CMT functionality. PDA functions are always available

• To the EM ASIC's functionality there is no difference how the power key is connected (the power up and down signaling and timings are the same)

Page 8 –8 COMPANY CONFIDENTIAL Issue 1

RM-88 System Module Nokia Customer Care

Power distribution

Figure 53 Power distribution diagram

System power-up

Power up procedure starts when the user presses power key (option 1) or when (not empty) battery is attached (option 2). In addition, some other triggers may start the system.

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