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FRD Type : EC8FS6
FEATURES
FEATURES
FEATURESFEATURES
* Miniature Size,Surface Mount Device
* Ultra-Fast Recovery
* Low Forward Voltage Drop
* Low Power Loss, High Efficiency
* High Surge Capability
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
EC8FS6
EC8FS6EC8FS6
OUTLINE DRAWING
Maximum Ratings Approx Net Weight:0.06g
Rating Symbol EC8FS6 Unit
Repetitive Peak Reverse Voltage
Average Rectified Output Current IO
RMS Forward Current
Surge Forward Current I
V
RRM
0.65
I
1.57
F(RMS)
20
FSM
Ta=25°C *1
0.8
Ta=35°C *2
50Hz Half Sine Wave,1cycle
Non-repetitive
600
Operating JunctionTemperature Range Tjw -40 to +150
Storage Temperature Range T
-40 to +150
stg
Electrical • Thermal Characteristics
Characteristics Symbol Conditions Min. Typ. Max. Unit
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time trr
Thermal Resistance Rth
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
I
V
RM
FM
Tj= 25°C, V
Tj= 25°C, I
= V
RM
= 0.8A
FM
RRM
IFM= 1A, -di/dt= 50A/µs, Ta= 25°C
I
=10mA, Ta= 25°C
F=IR
Junction to Ambient
(j-a)
*1 - - 157
*2 - - 108
V
50Hz Half Sine
Wave Resistive Load
A
A
A
°C
°C
- - 20
µA
- - 1.32 V
- -
80 ns
0.4
°C
µs
/W
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EC8FS6 OUTLINE DRAWING (Dimensions in mm)