Neoway W30 Hardware User's Manual

W30 Hardware User Guide

Version 1.0

W30 Hardware User Guide

Copyright

No part of this document may be reproduced or transmitted in any form or by any means without

prior written consent of Neoway Technology Co., Ltd.

is the trademark of Neoway Technology Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Remarks

This document provides guide for users to use the W30.

This document is intended for system engineers (SEs), development engineers, and test engineers.

The information in this document is subject to change without notice due to product version update

or other reasons.

Every effort has been made in preparation of this document to ensure accuracy of the contents, but all

statements, information, and recommendations in this document do not constitute a warranty of any

kind, express or implied.

Neoway provides customers complete technical support. If you have any question, please contact

your account manager or email to

Sales@neoway.com

Support@neoway.com

Website: http://www.neoway.com

W30 Hardware User Guide

Revision Record

Version

Changes

Date

Version 1.0

Initial draft

2017-09

W30 Hardware User Guide

Contents

1 About W30 .......................................................................................................................... 1

1.1 Overview ............................................................................................................................................ 1

1.2 Block Diagram ................................................................................................................................... 2

1.3 Features .............................................................................................................................................. 2

2 Application Interfaces ...................................................................................................... 4

2.1 Specifications and Pin Definition ....................................................................................................... 4

2.2 Pin Description ................................................................................................................................... 5

2.3 Power Supply Pins ............................................................................................................................ 11

2.3.1 Design of WLAN Power Supply ............................................................................................. 11

2.3.2 Design of AUDIO Power Supply ............................................................................................ 12

2.4 WLAN Application Interfaces .......................................................................................................... 13

2.4.1 SDIO Interface ........................................................................................................................ 13

2.4.2 WLAN Control Interface ......................................................................................................... 14

2.5 Bluetooth Application Interfaces ...................................................................................................... 15

2.5.1 Bluetooth UART Interface ...................................................................................................... 15

2.5.2 BLUETOOTH PCM Interface ................................................................................................ 15

2.6 AUDIO Application Interfaces ......................................................................................................... 17

2.6.1 Audio PCM Interface .............................................................................................................. 17

2.6.2 AUDIO I2C Interface .............................................................................................................. 18

2.6.3 Analog Audio interface ............................................................................................................ 20

3 RF Interface ....................................................................................................................... 24

4 Electric Feature and Reliability .................................................................................... 27

4.1 Electric Feature ................................................................................................................................. 27

4.2 Temperature Feature ......................................................................................................................... 27

4.3 ESD Protection ................................................................................................................................. 27

5 RF Feature ......................................................................................................................... 29

5.1 Work Band ........................................................................................................................................ 29

5.2 TX Power and RX Sensitivity .......................................................................................................... 29

6 Mechanical Features........................................................................................................ 31

6.1 Dimensions ....................................................................................................................................... 31

6.2 PCB Foot Print ................................................................................................................................. 31

7 Mounting and Packaging ............................................................................................... 33

7.1 Mounting the Module onto the Application Board ........................................................................... 33

W30 Hardware User Guide

7.2 Package ............................................................................................................................................. 33

8 SMT Furnace Temperature Curve ................................................................................ 34

9 Abbreviations ................................................................................................................... 35

W30 Hardware User Guide

Table of Figures

Figure 1-1 W30 block diagram ............................................................................................................... 2

Figure 2-1 W30 pin description (Top View) ........................................................................................... 4

Figure 2-2 Reference design of 3.3 V WLAN power supply ................................................................ 11

Figure 2-3 Power on/off sequence of the WLAN.................................................................................. 12

Figure 2-4 Reference design of AUDIO power supply ......................................................................... 12

Figure 2-5 SDIO connection ................................................................................................................. 13

Figure 2-6 Sequence of 32 KHz clock signal ........................................................................................ 14

Figure 2-7 UART connection ................................................................................................................ 15

Figure 2-8 PCM connection .................................................................................................................. 16

Figure 2-9 Power on/off sequence of the Bluetooth .............................................................................. 16

Figure 2-10 PCM sequence in host mode ............................................................................................. 17

Figure 2-11 PCM sequence in device mode .......................................................................................... 18

Figure 2-12 Reference design of the I2C interface ............................................................................... 19

Figure 2-13 I2C interface sequence ...................................................................................................... 19

Figure 2-14 Reference design of headphone ......................................................................................... 21

Figure 2-15 Headphone interface .......................................................................................................... 21

Figure 2-16 Reference design of the MIC circuit .................................................................................. 22

Figure 2-17 Reference design of the receiver circuit ............................................................................ 22

Figure 2-18 Reference design of the speaker circuit ............................................................................. 23

Figure 3-1 Reference design of antenna matching ................................................................................ 24

Figure 3-2 Recommended RF PCB design ........................................................................................... 25

Figure 3-3 Antenna layout ..................................................................................................................... 25

Figure 3-4 Clearance around the antenna .............................................................................................. 25

Figure 6-1 W30 dimensions(top view) .................................................................................................. 31

Figure 6-2 PCB foot print of W30 (top view) ....................................................................................... 32

Figure 8-1 SMT furnace temperature curve .......................................................................................... 34

W30 Hardware User Guide

Table of Tables

Table 1-1 W30 Features .......................................................................................................................... 2

Table 2-1 W30 dimensions ..................................................................................................................... 4

Table 2-2 W30 pin description ................................................................................................................ 5

Table 2-3 Parameters of 32 KHz clock signal sequence ....................................................................... 14

Table 2-4 Parameters of PCM sequence in host mode .......................................................................... 17

Table 2-5 Parameters of PCM sequence in device mode ...................................................................... 18

Table 2-6 I2C sequence parameters ...................................................................................................... 19

Table 4-1 W30 Electric Feature ............................................................................................................ 27

Table 4-2 W30 Temperature Feature ..................................................................................................... 27

Table 4-3 W30 ESD protection ............................................................................................................. 28

Table 5-1 Work band ............................................................................................................................. 29

Table 5-2 Wi-Fi/Bluetooth TX power and RX sensitivity .................................................................... 29

W30 Hardware User Guide

1 About W30

1.1 Overview

W30 is a compact low-power module that supports WLAN, Bluetooth, and Audio. Its dimensions are 20

mm x 18 mm x 2.2 mm. It is developed on Qualcomm QCA9377 chipset and in compliance with the

802.11 standards, so it supports 2.4 GHz and 5 GHz WLAN for high-speed data transmission. The

Bluetooth function complies with Bluetooth 4.1 protocol and compatible with earlier versions, and also

supports BLE mode. The Audio function is developed on the REALTEK chipset, supports different audio

codecs, and provides high-quality audio through various processing interfaces. The module is used with

N720 in notebooks, wireless routers/MIFI, Internet of vehicle (IoV), smart home, industrial automation

and other equipment.

 QCA9377: WLAN and Bluetooth support low power SDIO 3.0, and UART/PCM interfaces

 Compliant with IEEE 802.11a/b/g/n/ac WLAN protocol, Bluetooth 4.1+HS, compatible with

Bluetooth 1.x and Bluetooth 2.x

 Support 2.4GHz and 5GHz WLAN, 80 MHz at most

 Support earphone, SPK, and MIC analog audio interface

W30 Hardware User Guide

1.2 Block Diagram

Figure 1-1 W30 block diagram

WLAN_3.3V

ALC5616

48MHz

Crystal

RF switch

QCA9377

SPK

MIC

Wi-Fi/BT

Headphone

2.4G

5G

VDDIO_1.8V

AUDIO_3.3V

VDD_1.8V

PCM

SDIO3.0

I2C

PCM

WLAN/BT_EN

UART

1.3 Features

Table 1-1 W30 Features

Specifications

Description

Power supply

3.3V

Idle current

< 20 mA

Current in sleep mode

< 10mA

Temperature Operating temperature: -25

℃

to 85℃

Storage temperature: -45

℃

to +90℃

WLAN feature

SDIO3.0 interface

Compliant with 1x1 IEEE802.11a/b/g/n/ac standards

Supports 5 GHz 802.11ac and 2.4GHz/5GHz 802.11n

Supports 20 MHz, 40MHz@2.4GHz

Supports 20 MHz, 40MHz, 80MHz@5GHz

Maximum number of APs allowed to access: 15

W30 Hardware User Guide

Bluetooth feature

Supports Bluetooth 4.1, compatible with Bluetooth 4.0, Bluetooth 3.0, Bluetooth 2.x and Bluetooth 1.x

Supports GFSK, π/4-DQPSK, 8-DPSK and LE modulation

PCM/UART data communication interfaces

Audio feature

PCM data communication interfaces

I2C control interface

ADC: 94dBA SNR, DAC: 94dBA SNR

Two analog audio input: a single-end input, a differential input

Two analog audio output: an output without gain, an output with 20 mW gain

Adjustable Input/Output volume

MIC and SPK analog audio interface

Earphone detection

Wireless rate

WLAN 2.4GHz:

802.11b: 1, 2, 5.5, 11Mbps

802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n (20MHz): MCS0~MCS7

802.11n (40MHz): MCS0~MCS7

802.11ac: MCS0~MCS9

WLAN 5GHz:

802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n/ac (20MHz): MCS0~MCS7

802.11n/ac (40MHz): MCS0~MCS7

802.11ac (80MHz): MCS0~MCS9

Antenna feature

1x1 Wi-Fi/Bluetooth antenna interface, 50Ω impedance

W30 Hardware User Guide

2 Application Interfaces

2.1 Specifications and Pin Definition

Table 2-1 W30 dimensions

Specifications

W30

Dimensions (H x W x D)

(20±0.1 mm) x (18±0.1 mm) x (2.3±0.1 mm)

Weight

1.8g

Package

60-Pin LCC

Figure 2-1 W30 pin description (Top View)

W30 Hardware User Guide

2.2 Pin Description

IO: Input/Output

DI: Digital input

DO: Digital output

P: Power supply input

AI: Analog input

AO: Analog output

OD: Output drain

Table 2-2 W30 pin description

Signal

I/O

Function

Level Feature

Power Domain

Remarks

Power supply

VDD_3V3_WLAN

38 P Main power supply of WLAN

Vmin=3.14V

Vmax=3.46V

Vtyp=3.3V

The maximum current can be at least 800mA.

VDDIO_1V8_WLAN

39

P

WLAN I/O interface power supply

Vmin=1.71V

Vmax=1.9V

Vtyp=1.8V

The maximum current can be at least 300mA.

VDD_XO_1V8

40

P

Power supply for WLAN crystal oscillator to pull up

Vmin=1.71V

Vmax=1.9V

Vtyp=1.8V

Pullup power supply of clock

VDD_3V3_AUDIO

35 P 3.3 V power supply of AUDIO

Vmin=3V

Vmax=3.6V

Vtyp=3.3V

The maximum current can be at least 300mA.

VDD_1V8_AUDIO

34 P 1.8V power supply of AUDIO

Vmin=1.71V

Vmax=1.9V

Vtyp=1.8V

1.8 V power supply of audio

W30 Hardware User Guide

GND

7, 10, 37, 41, 43, 44, 46, 47, 60

WLAN/BLUETOOTH ground of the module

WLAN interface

SDIO_DATA3

1

IO

SDIO data 3

VOL max=0.45V

VOH min=1.35V

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

SDIO_DATA2

2

IO

SDIO data 2

SDIO_DATA1

3

IO

SDIO data 1

SDIO_DATA0

4

IO

SDIO data 0

SDIO_CLK

5

DI

Clock signal of SDIO interface

1.8V

Leave this pin unconnected if it is not used.

SDIO_CMD

6

DI

Control signal of SDIO interface

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

LTE_RX_UART

8

DI

Co-existing signal of LTE and WLAN, UART data input

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

LTE_TX_UART

9

DO

Co-existing signal of LTE and WLAN, UART data output

VOL max=0.45V

VOH min=1.35V

1.8V

Leave this pin unconnected if it is not used.

WLAN_EN

57

DI

WLAN enable signal

VIL min=-0.3V

VIL max=0.45V

1.8V

High level triggers the ON status. Leave this pin unconnected if it is not used.

W30 Hardware User Guide

VIH min=1.35V

VIH max=2.1V

WLAN_SLEEP_CLK

58

DI

Clock input signal of WLAN in sleep mode.

VIL min=-0.3V

VIL max=0.35V

VIH min=1.45V

VIH max=2V

1.8V

Leave this pin unconnected if it is not used.

WAKE_ON_WIRELESS

59

OD

Control signal of WLAN communication

VOL max=0.45V

VOH min=1.35V

1.8V

Leave this pin unconnected if it is not used.

Bluetooth interface

BT_EN

48

DI

Bluetooth enable

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

High level triggers the ON status. Leave this pin unconnected if it is not used.

UART_CTS

49

DI

Clear to send

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

UART_RTS

50

DO

Request to send

VOL max=0.45V

VOH min=1.35V

1.8V

Leave this pin unconnected if it is not used.

UART_TXD

51

DO

UART TX data of the Bluetooth

VOL max=0.45V

VOH min=1.35V

1.8V

Leave this pin unconnected if it is not used.

UART_RXD

52

DI

UART RX data of the Bluetooth

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

W30 Hardware User Guide

PCM_DOUT1

53

DO

PCM data output of the Bluetooth

VOL max=0.45V

VOH min=1.35V

1.8V

Leave this pin unconnected if it is not used.

PCM_DIN1

54

DI

PCM data input of the Bluetooth

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used. PCM_CLK1

55

DI

PCM clock signal of the Bluetooth

1.8V

Leave this pin unconnected if it is not used.

PCM_SYNC1

56

IO

PCM frame synchronization signal of the Bluetooth

VOL max=0.45V

VOH min=1.35V

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

AUDIO interface

I2S_MCLK

12

DI

Input signal of I2S main clock

1.8V

Leave this pin unconnected if it is not used.

PCM_SYNC2

13

IO

PCM frame synchronization signal of the AUDIO

VOL max=0.45V

VOH min=1.35V

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

PCM_DOUT2

14

DO

PCM data output of the AUDIO

VOL max=0.45V

VOH min=1.35V

1.8V

Leave this pin unconnected if it is not used.

PCM_DIN2

15

DI

PCM data output of the

VIL min=-0.3V

1.8V

Leave this pin unconnected if it is

W30 Hardware User Guide

AUDIO

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

not used.

PCM_CLK2

16

IO

PCM clock signal of the AUDIO

VOL max=0.45V

VOH min=1.35V

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Leave this pin unconnected if it is not used.

I2C_SCL

18

DI

Input signal of I2C clock

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V

Add a pull-up resistor externally. Leave this pin unconnected if it is not used.

I2C_SDA

19

IO

I2C data signal

VOL max=0.45V

VOH min=1.35V

VIL min=-0.3V

VIL max=0.45V

VIH min=1.35V

VIH max=2.1V

1.8V JD1

21

DI

Earphone detection

3 types of level detectable (threshold):

Vt1=1.485V

Vt2=1.925V

Vt3=2.7V

Leave this pin unconnected if it is not used.

MICBIAS

22

DO

Provides MIC bias voltage

Vtyp=3.3V

Leave this pin unconnected if it is not used.

W30 Hardware User Guide

IN1_P

23

AI

Single-end MIC input

Leave this pin unconnected if it is not used.

IN2_P

25

AI

Positive signal of the MIC

Differential input

Leave this pin unconnected if it is not used.

IN2_N

26

AI

Negative signal of the MIC

SPK_L

28

AO

Positive signal of the SPK

Differential input

Leave this pin unconnected if it is not used.

SPK_R

29

AO

Negative signal of the SPK

HPO_R

31

AO

Right sound channel of the earphone output

Leave this pin unconnected if it is not used.

HPO_L

32

AO

Left sound channel of the earphone output

GND

11, 17, 20, 24, 30, 33, 36

AUDIO ground

The trace layout should be separated from the ground for WLAN/BLUETOOTH.

AGND

27 Analog ground

Connected to the AUDIO ground and main ground. Ensure that the contact area of the connection between this pin and the main ground is big enough.

Other Interfaces

ANT

45 Wi-Fi/Bluetooth antenna pin

50 Ω impedance

NC

42

NC

W30 Hardware User Guide

2.3 Power Supply Pins

Signal

I/O

Function

Remarks

VDD_3V3_WLAN

38 P Main power supply of WLAN

The maximum current can be at least 800 mA.

VDDIO_1V8_WLAN

39

P

WLAN I/O interface power supply

The maximum current can be at least 300 mA.

VDD_XO_1V8

40

P

Power supply for WLAN crystal oscillator to pull up

Power supply for the crystal oscillator clock to pull up

VDD_3V3_AUDIO

35 P 3.3 V power supply of AUDIO

The maximum current can be at least 300 mA.

VDD_1V8_AUDIO

34

P

Power supply for AUDIO I/O interface

1.8 V power supply of audio

2.3.1 Design of WLAN Power Supply

VDD_3V3_WLAN is the main power supply input pin for the Wi-Fi function of the module. Its input

voltage ranges from 3.14 V to 3.46 V and the typical value is 3.3 V. It is recommended that the maximum

input current of the external power supply chipset should be at least 800 mA, which can fulfill the

requirements for current in all kinds of work modes. The power supply is a critical path to module's

performance and stability. The reference design of the WLAN power supply is shown as below:

Figure 2-2 Reference design of 3.3 V WLAN power supply

EN

IN

NC

OUT

FB

GND

WLAN_3V3_EN

VMAIN

VDD_3V3_WLAN

D1

C1

C2 C3 C4

C5

L1

R1

R2

2.2uH

47uF

47uF 10uF 1uF 0.1uF

135KΩ

30KΩ

C6

100pF

BL9309

In Figure 2-2, use TVS at D1 to enhance the performance of the module during a burst. SMF5.0AG is

recommended. A large bypass tantalum capacitor (47 μF) is expected at C2 to reduce voltage drops during

bursts together with C3 (10 μF ceramics capacitor). In addition, add 0.1 μF and 100 pF filter capacitors to

enhance the stability of the power supply.

VDDIO_1V8_WLAN and VDD_XO_1V8 are respectively the internal I/O power supply of the module

and the pullup power supply of the WLAN crystal oscillator. The level of VDDIO must be same as the I/O

level of the host, and the maximum work current should be at least 300 mA.

Figure 2-3 shows the power on/off sequence of the WLAN.

W30 Hardware User Guide

Figure 2-3 Power on/off sequence of the WLAN

VMAIN

VDD_XO_1V8

VDDIO_1V8

VDD_3V3

WLAN_EN

T>10us

2.3.2 Design of AUDIO Power Supply

VDD_3V3_AUDIO is the main power supply input pin for the AUDIO function of the module. Its input

voltage ranges from 3.0 V to 3.6 V and the typical value is 3.3 V. It is recommended that the maximum

input current of the power supply should be at least 300 mA, which can fulfill the current requirements of

the AUDIO function. The reference design of the AUDIO power supply is shown as below:

Figure 2-4 Reference design of AUDIO power supply

VIN

VEN

OUT

FB

GND

VMAIN

VDD_3V3_AUDIO

C2 C3 C4

C5

R1

10uF 1uF 0.1uF 100pF

10K

C6

33pF

R1131N331B

C7

1uF

C1

1uF

D1

VDD_1V8_AUDIO provides 1.8 V power supply input for the AUDIO and loads a very low current. The

external 1.8 V voltage is introduced into logic inputs to pull up the internal IO interface.

W30 Hardware User Guide

2.4 WLAN Application Interfaces

2.4.1 SDIO Interface

Signal

I/O

Function

Remarks

SDIO_DATA3

1

IO

SDIO data 3

Leave this pin unconnected if it is not used.

SDIO_DATA2

2

IO

SDIO data 2

Leave this pin unconnected if it is not used.

SDIO_DATA1

3

IO

SDIO data 1

Leave this pin unconnected if it is not used.

SDIO_DATA0

4

IO

SDIO data 0

Leave this pin unconnected if it is not used.

SDIO_CLK

5

DI

Clock signal of SDIO interface

Leave this pin unconnected if it is not used.

SDIO_CMD

6

DI

Control signal of SDIO interface

Leave this pin unconnected if it is not used.

The WLAN function of the W30 module complies with 8-bit SDIO 3.0 Interface Protocol, and supports

802.11ac 256-QAM modulation. The transmission rate of the WLAN TCP/IP can reach 215 Mbps at an 80

MHz bandwidth. Figure 2-5 shows the SDIO connection between W30 and N720.

Figure 2-5 SDIO connection

N720

W30

SDIO_CLK

SDIO_CMD

SDIO_DATA0

SDIO_CLK

SDIO_CMD

SDIO_DATA0

GNDGND

CLK, CMD, DATA0, DATA1, DATA2 and DATA3 are high-speed signal lines. Limit their characteristic

impedance to 50Ω and do not allow them to cross any other traces. Ensure length matching for CMD,

DATA0, DATA1, DATA2 and DATA3 traces. CLK trace should be grounded separately.

W30 Hardware User Guide

2.4.2 WLAN Control Interface

Signal

I/O

Function

Remarks

LTE_RX_UART

8

DI

Co-existing signal of LTE and WLAN, UART data input

It is pulled up internally. Leave this pin unconnected if it is not used.

LTE_TX_UART

9

DO

Co-existing signal of LTE and WLAN, UART data output

Leave this pin unconnected if it is not used.

WLAN_EN

57

DI

WLAN enable signal

High level triggers the ON status. Leave this pin unconnected if it is not used.

WLAN_SLEEP_CLK

58

DI

Clock signal of WLAN in sleep mode.

Leave this pin unconnected if it is not used.

WAKE_ON_WIRELESS

59

OD

Control signal of WLAN communication

Leave this pin unconnected if it is not used.

LTE_RX_UART and LTE_TX_UART are co-existing signals of LTE and Wi-Fi and can be used to send

and receive UART data.

WLAN_EN is the signal to enable or disable the Wi-Fi function. It is pulled down internally and a high

level trigger. For its power on/off sequence, see Figure 2-3.

WLAN_SLEEP_CLK is the clock input signal of the Wi-Fi function in sleep mode. The clock frequency

is 32.768 KHz. When the WLAN function enters sleep mode, an external 32.768 KHz clock signal is

required to wake up the module from different modes for data receiving. Figure 2-6 shows the sequence of

the 32 KHz clock signal. Table 2-3 lists the parameters.

Figure 2-6 Sequence of 32 KHz clock signal

1/CK1

CK2 CK3

CK6

CK7

Table 2-3 Parameters of 32 KHz clock signal sequence

Parameter

Symbol

Minimum

Typical

Maximum

Unit

Clock frequency

CK1

-

32.768

-

kHz

Fall time

CK2

1 - 100

ns

Rise time

CK3

1 - 100

ns

Duty ratio

CK4

15 - 85 % Frequency error

CK5

-200

-

200

ppm

Input high level

CK6

1.45 - 2

V

W30 Hardware User Guide

Input low level

CK7

-0.3 - 0.35

V

WAKE_ON_WIRELESS is the communication control signal in WLAN mode. Operating at 1.8 V, this

pin is an open-drain output.

2.5 Bluetooth Application Interfaces

The Bluetooth function is implemented mainly by the UART and PCM data communication interfaces and

the BT_EN control signal.

2.5.1 Bluetooth UART Interface

Signal

I/O

Function

Remarks

UART_CTS

49

DI

Clear to send

Leave this pin unconnected if it is not used.

UART_RTS

50

DO

Request to send

Leave this pin unconnected if it is not used.

UART_TXD

51

DO

UART TX data of the Bluetooth

Leave this pin unconnected if it is not used.

UART_RXD

52

DI

UART RX data of the Bluetooth

Leave this pin unconnected if it is not used.

The Bluetooth function of W30 requires one complete UART interface, which supports flow control and

operates at 1.8V. Figure 2-7 shows the UART connection.

Figure 2-7 UART connection

GND

N720

W30

UART_TXD

UART_RXD

UART_CTS

UART_RTS

UART_RXD

UART_TXD

UART_RTS

UART_CTS

2.5.2 BLUETOOTH PCM Interface

Signal

I/O

Function

Remarks

PCM_DOUT1

53

DO

PCM data output of the Bluetooth

Leave this pin unconnected if it is not used.

PCM_DIN1

54

DI

PCM data input of the Bluetooth

Leave this pin unconnected if it is not used.

PCM_CLK1

55

DI

PCM clock signal of the Bluetooth

Leave this pin unconnected if it is

W30 Hardware User Guide

not used.

PCM_SYNC1

56

IO

PCM frame synchronization signal of the Bluetooth

Leave this pin unconnected if it is not used.

In addition to UART interface, the Bluetooth requires a PCM interface, which operates at 1.8 V. Figure

2-8 shows the PCM connection.

Figure 2-8 PCM connection

N720

W30

PCM_SYNC

PCM_CLK

PCM_DOUT

PCM_DIN

PCM_SYNC

PCM_CLK

PCM_DOUT

PCM_DIN

The BT_EN signal controls the switch of the Bluetooth function. It is pulled down internally and triggered

by high level. Figure 2-9 shows the power on/off sequence of the Bluetooth.

Figure 2-9 Power on/off sequence of the Bluetooth

VMAIN

VDD_XO_1V8

VDDIO_1V8

VDD_3V3

BT_EN

T>10us

W30 Hardware User Guide

2.6 AUDIO Application Interfaces

AUDIO interfaces include PCM, I2C, and analog audio interface.

2.6.1 Audio PCM Interface

Signal

I/O

Function

Remarks

PCM_SYNC2

13

IO

AUDIO PCM sync signal

Leave this pin unconnected if it is not used.

PCM_DOUT2

14

DO

PCM data output of the Bluetooth

Leave this pin unconnected if it is not used.

PCM_DIN2

15

IO

PCM data input of the AUDIO

Leave this pin unconnected if it is not used.

PCM_CLK2

16

IO

PCM clock signal of the AUDIO

Leave this pin unconnected if it is not used.

I2S_MCLK

12

DI

Input signal of I2S main clock

Leave this pin unconnected if it is not used.

The AUDIO function of W30 communicates through one PCM interface. It supports both host and device

modes and operates at 1.8 V. Figure 2-10 and Figure 2-11 shows the PCM sequence respectively in host

and device modes.

Figure 2-10 PCM sequence in host mode

TLRD

TADD

TDAS

TDAH

PCM_CLK

PCM_SYNC

PCM_DOUT

PCM_DIN

Table 2-4 Parameters of PCM sequence in host mode

Parameter

Symbol

Minimum

Typical

Maximum

Unit

Delay between frame synchronization and

T

LRD

- - 30

ns

W30 Hardware User Guide

clock signal

Delay between data output and clock signal

T

ADD

- - 30

ns

Time period that data input signal is set up

T

DAS

10 - -

ns

Time period that data input signal lasts

T

DAH

10 - -

ns

Figure 2-11 PCM sequence in device mode

TBCH

PCM_CLK

PCM_SYNC

PCM_DOUT

PCM_DIN

TBCL

TLRS

TADD

TDAS

TDAH

Table 2-5 Parameters of PCM sequence in device mode

Parameter

Symbol

Minimum

Typical

Maximum

Unit

BCKO pulse width high

T

BCH

20 - -

ns

BCKO pulse width low

T

BCL

20 - -

ns

Time period that synchronization input signal is set up

T

LRS

30 - -

ns Delay between data output and clock signal

T

ADD

- - 30

ns

Time period that data input signal is set up

T

DAS

10 - -

ns

Time period that data input signal lasts

T

DAH

10 - -

ns

I2S_MCLK is the main clock signal referred by the system clock of the AUDIO. When PCM_CLK is

configured as clock signal output in host mode, I2S_MCLK is configured as the main clock signal of the

system. When PCM_CLK is configured as clock signal input in device mode, PCM_CLK signal should

be synchronous with I2S_MCLK signal.

2.6.2 AUDIO I2C Interface

Signal

I/O

Function

Remarks

I2C_SCL

18

DI

Input signal of I2C clock

Add a pull-up resistor externally. Leave this pin

W30 Hardware User Guide

I2C_SDA

19

IO

I2C data signal

unconnected if it is not used.

The AUDIO function of W30 allows one I2C interface to be control signal. The maximum rate at the I2C

interface can be 3.4 Mbps and the interface operates at high level 1.8 V. Add a pull-up resistor externally.

Figure 2-12 shows the reference design of the I2C interface.

Figure 2-12 Reference design of the I2C interface

10K10K

Figure 2-13 shows the sequence of the I2C control signal.

Figure 2-13 I2C interface sequence

Table 2-6 I2C sequence parameters

Parameter

Symbol

Minimum

Typical

Maximum

Unit

BCKO pulse width low

tw(9)

1.3 - -

us

BCKO pulse width high

tw(10)

600 - -

ns

Clock frequency

F 0 -

400K

Hz

Time period that the signal lasts

th(5)

600 - -

ns

Time period that data input signal is set up

tsu(7)

100 - -

ns

Time period that data input signal lasts

th(6)

- - 900

ns

Close signal setup time

tsu(8)

600 - -

ns

Width that filter suppresses peak pulse

tsp 0 -

50

ns

W30 Hardware User Guide

2.6.3 Analog Audio interface

Signal

I/O

Function

Remarks

JD1

21

DI

Earphone detection

3 types of level detectable (threshold): Vt1=1.485V; Vt2=1.925V; Vt3=2.7V

MICBIAS

22

DO

Provides MIC bias voltage

Leave this pin unconnected if it is not used.

IN1_P

23

AI

Single-end MIC input

Leave this pin unconnected if it is not used.

IN2_P

25

AI

Positive signal of the MIC

Leave this pin unconnected if it is not used.

IN2_N

26

AI

Negative signal of the MIC

Leave this pin unconnected if it is not used.

SPK_L

28

AO

Positive signal of the SPK

Leave this pin unconnected if it is not used.

SPK_R

29

AO

Negative signal of the SPK

Leave this pin unconnected if it is not used.

HPO_R

31

AO

Right sound channel of the earphone output

Leave this pin unconnected if it is not used.

HPO_L

32

AO

Left sound channel of the earphone output

Leave this pin unconnected if it is not used.

AGND

27 Analog ground

It is connected to the main GND. Leave this pin unconnected if it is not used.

The analog audio function is implemented mainly by the Headphone interface, the MIC interface, and the

SPK interface.

Headphone Interface

The headphone interface uses the JD1, MICBIAS, IN1_P, HPO_R, and HPO_L pins. This interface can

detect headphone automatically and the volume can be adjusted by AT commands. Figure 2-14 shows the

reference design of headphone circuit.

W30 Hardware User Guide

Figure 2-14 Reference design of headphone

Figure 2-15 Headphone interface

Please note if the headphone is CTIA or OMTP. The connections of ①and ② are reverse for the two type of headphones. The JD1 pin (⑤ in the above figure) is unconnected if the headphone is not plugged. After

the headphone is plugged, this pin is connected to GND through the left channel (8/16/32 Ω) loudspeaker

of the headphone.

Differential MIC/SPK Interface

MIC_P and MIC_N are the differential signals of MIC. Generally condenser microphone is

recommended.

SPK_P and SPK_N are the differential signals of speaker. The volume of MIC and SPK can be adjusted

through AT commands. For details, see the Neoway_N720_Wi-Fi_AUDIO_Application_Guide_V1.0.

Figure 2-16 shows the reference design of the MIC circuit.

W30 Hardware User Guide

Figure 2-16 Reference design of the MIC circuit

l

10pF

33pF

MIC_N

MIC_P

W30

MIC

1000Ω @100MHz

2.2uF

MICBIAS

2.2K

Figure 2-17 shows the reference design of the receiver circuit.

Figure 2-17 Reference design of the receiver circuit

32Ω

RECEIVER

10pF

33pF

W30

120Ω @100MHz

SPK_P

SPK_N

1uF

Figure 2-18 shows the reference design of the speaker circuit.

W30 Hardware User Guide

Figure 2-18 Reference design of the speaker circuit

4/8Ω

Audio

Amplifier

W30

SPK_P

SPK_N

10pF

33pF

SPEAKER

120Ω @100MHz

1uF

Audio Design Cautions

 On the PCB board, beed, filter capacitors, ESD components should be placed as close to the audio

components as possible.

 Traces should be as short as possible and be far away from antenna and power supply.

 Differential traces should follow the design rules.

 The audio signal traces should be wide enough on the PCB to bear large current when the module

output audios at the highest volume. 

 The traces should be isolated from digital signals and clock as well as other analog signal traces. No

signal trace crossing is allowed.Reserve enough grounding holes and ground protection.

 Do not connect the audio output pins to GND.

W30 Hardware User Guide

3 RF Interface

Signal

I/O

Function

Remarks

ANT

45

AI/O

Wi-Fi/Bluetooth antenna

50Ω impedance

The 45th pin of W30 is the Wi-Fi/Bluetooth antenna interface and the impedance is 50 Ω. It can connect

to 2.4G/5G ceramic chip antenna or magnetic antenna. The antenna should be well matched to achieve

best performance. It should be installed far away from high speed logic circuits, DC/DC power, or any

other strong disturbing sources if developers use RF cable to connect.

It is recommended to add an ESD protection diode to the antenna interface in an environment with great

electromagnetic interference and other applications with bad ESD. The ESD protection diode must have

ultra-low capacitance (lower than 0.5 pF). Otherwise, it will affect the impedance of the RF loop or result

in attenuation of RF signals. RCLAMP0521P from Semtech or ESD5V3U1U from Infineon is

recommended.

In PCB design, the RF trace between the antenna pad of module and the antenna connector, should have a

50 Ω characteristic impedance, and be as short as possible. The trace should be surrounded by ground

copper. The distance between the RF traces and ground copper should be twice of the RF trace width. Dig

as many ground holes as possible on the copper to ensure lowest grounding impedance.

If the trace between the module and connector has to be longer, or built-in antenna is used, a matching

circuit is needed, as shown in the following figure.

Figure 3-1 Reference design of antenna matching

T1 in the figure is an ESD diode (optional). Developers can choose one type of the matching circuits in

the figure. The π-type is recommended. Big RF solder pad can result in great parasitic capacitance, which

will affect the antenna performance. Remove the copper on the first and second layers under the RF solder

pad.

W30 Hardware User Guide

Figure 3-2 Recommended RF PCB design

Refer to the following antenna layouts if a ceramic chip antenna is used.

Figure 3-3 Antenna layout

1: Ceramic chip antenna

2: Feeder

3: Pad of the matching circuit

4: 50Ω transmission line

The first type of antenna layout is recommended if the PCB is big enough. Number 5 in Figure 3-3 shows

the area between the antenna and the ground Figure 3-4 shows the clearance if this area.

Figure 3-4 Clearance around the antenna

W30 Hardware User Guide

On the PCB, keep the RF signals and RF components away from high-speed circuits, power supplies,

transformers, inductors, the clock circuit of MCU, etc.

W30 Hardware User Guide

4 Electric Feature and Reliability

4.1 Electric Feature

Table 4-1 W30 Electric Feature

Module Status

Minimum Value

Typical Value

Maximum Value

WLAN_3.3V Vin

3.135 V

3.3 V

3.465 V

Iin - -

800 mA

AUDIO_3.3V Vin

3 V

3.3 V

3.6 V

Iin - -

300 mA

 If the voltage is too low, the WLAN/Bluetooth or AUDIO function might not work properly. If the

voltage is too high or there is a voltage burst during the startup, the module might be damaged

permanently.

 If using LDO or DC-DC to supply power for the module, ensure that it outputs a rated current.

4.2 Temperature Feature

Table 4-2 W30 Temperature Feature

Module Status

Minimum Value

Typical Value

Maximum Value

Operating temperature

-25℃

25℃

85℃

Storage temperature

-45℃

-

90℃

If the module works at a temperature exceeding the thresholds, its RF performance of Wi-Fi or Bluetooth

might be worse and the audio function does not work properly.

4.3 ESD Protection

Electronics need to pass several ESD tests. The following table shows the ESD capability of key pins of

this module. It is recommended to add ESD protection based on the application to ensure product quality

when designing a product.

W30 Hardware User Guide

Table 4-3 W30 ESD protection

Testing Point

Contact Discharge

Air Discharge

Power supply pins

±8 kV

±15 kV

GND

±8 kV

±15 kV

ANT

±8 kV

±15 kV

Cover

±8 kV

±15 kV

Others

±2 kV

±4 kV

Testing environment: Humidity 45%; Temperature 25

℃

W30 Hardware User Guide

5 RF Feature

5.1 Work Band

Table 5-1 Work band

Work band

Parameter

Frequency

WLAN 2.4 GHz

Center channel frequency

2412~2484 MHz

WLAN 5GHz

Center channel frequency

4900~5925 MHz

Bluetooth

Center channel frequency

2402~2480 MHz

5.2 TX Power and RX Sensitivity

Table 5-2 Wi-Fi/Bluetooth TX power and RX sensitivity

Work Band

Rate

Transmit Power

Receiving Sensitivity

802.11b (2.4G)

1/2/5.5/11Mbps

15 dBm

-75 dBm

802.11g (2.4G) 6/9/12/18/24/36Mbps

14 dBm

-75 dBm

48/54Mbps

13.5 dBm

-70 dBm

802.11n (2.4G, 20MHz) MCS0~MCS4

14 dBm

-70 dBm

MCS5~MCS7

13.5 dBm

-65 dBm

802.11n (2.4G, 40MHz) MCS0~MCS4

13.5 dBm

-67 dBm

MCS5~MCS7

12.5 dBm

-60 dBm

802.11ac (2.4G, 20MHz)

MCS8

12 dBm

-57 dBm

802.11ac (2.4G, 40MHz)

MCS9

11 dBm

-55 dBm

802.11a (5G)

6/9/12/18/24Mbps

12 dBm

-74 dBm

36/48Mbps

11 dBm

-67 dBm

54Mbps

10 dBm

-65 dBm

802.11n/ac (5G, 20MHz)

MCS0~MCS2

12 dBm

-76 dBm

MCS3~MCS5

11 dBm

-65 dBm

MCS6~MCS7

9.5 dBm

-62 dBm

802.11n/ac (5G, 40MHz)

MCS0~MCS2

11 dBm

-75 dBm

MCS3~MCS6

10 dBm

-62 dBm

MCS7

9 dBm

-60 dBm

802.11ac (5G, 80MHz)

MCS8~MCS9

6.5 dBm

-50 dBm

W30 Hardware User Guide

Bluetooth

GFSK

8 dBm

-92 dBm

π/4-DQPSK

7 dBm

-92 dBm

8-DPSK

7 dBm

-85 dBm

LE

3 dBm

-95 dBm

All the values above are obtained in the lab environment. The RX sensitivity is obtained within 10%

system error rate.

W30 Hardware User Guide

6 Mechanical Features

6.1 Dimensions

Figure 6-1 W30 dimensions(top view)

6.2 PCB Foot Print

LCC packaging is adopted to package the pins of the W30 module. Figure 6-2 shows the recommended

PCB foot print (Unit: mm). Extend the pad around 1 mm to avoid short circuit caused by irregular flow of

solder paste during the SMT process. Do not lay out any trace under the keepout area.

W30 Hardware User Guide

Figure 6-2 PCB foot print of W30 (top view)

W30 Hardware User Guide

7 Mounting and Packaging

7.1 Mounting the Module onto the Application Board

W30 is compatible with industrial standard reflow profile for lead-free SMT process. The reflow profile is

process dependent, so the following recommendation is just a start point guideline:

 Make stencils with a thickness ranging from 0.12 mm to 0.15 mm, which can be adjusted according

to the actual mounting conditions.

 The quality of the solder joint depends on the solder paste volume and the PCB flatness.

 Thin or long PCB might bend during SMT. So, use loading tools during the SMT and reflow

soldering process to avoid poor solder joint caused by PCB bending.

For information about cautions in W30 storage and mounting, refer to Neoway Module Reflow

Manufacturing Recommendations.

When manually desoldering the module, use heat guns with great opening, adjust the temperature to 250

degrees (depending on the type of the solder paste), and heat the module till the solder paste is melt. Then

remove the module using tweezers. Do not shake the module in high temperatures while removing it.

Otherwise, the components inside the module might get misplaced.

7.2 Package

W30 modules are packaged in sealed vacuum bags with dryer, humidity card, and tray on delivery to

guarantee a long shelf life. Follow the same package method again in case of opened for any reasons.

If the module is exposed to air for more than 48 hours at conditions not worse than 30°C/60% RH, bake it

at a temperature higher than 90 degree for more than 12 hours before SMT. Or, if the indication card

shows humidity greater than 20%, the baking procedure is also required. Do not bake modules with the

package tray directly.

W30 Hardware User Guide

8 SMT Furnace Temperature Curve

Figure 8-1 SMT furnace temperature curve

Technical parameters:

 Ramp up rate: 1 to 4 °C/sec

Ramp down rate: -3 to -1 °C/sec

 Soaking zone: 150-180 °C, Time: 60-100 s

 Reflow zone: >220 °C, Time: 40-90 s

 Peak temperature: 235-250 °C

Do not use the kind of solder paste different from our module technique.

 The melting temperature of solder paste with lead is 35 °C lower than that of solder paste without

lead. It is easy to cause faulty joints for BGA inside the module after second reflow soldering.

 When using only solder pastes with lead, please ensure that the reflow temperature is kept at 220 °C

for more than 45 seconds and the peak temperature reaches 240 °C.

Neoway will not provide warranty for heat-responsive element abnormalities caused by improper

temperature control.

W30 Hardware User Guide

9 Abbreviations

WLAN

Wireless Local Area Networks

SDIO

Secure Digital Input and Output Card

PCM

Pulse Code Modulation

I2C

Inter-Integrated Circuit bus

I2S

Inter-IC Sound

UART

Universal asynchronous receiver-transmitter

ESD

Electronic Static Discharge

PCB

Printed Circuit Board

RF

Radio Frequency

Neoway W30 Hardware User's Manual

Specifications and Main Features

Frequently Asked Questions

User Manual