Neoway Neo_M660A User Manual

Neo_M660A GPRS Module
Hardware User Guide
Version 1.1
Neo_M660A GPRS Module Hardware User Guide
Copyright © Neoway Technology Co., Ltd
i
Copyright © Neoway Technology Co., Ltd 2014. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Shenzhen Neoway Technology Co., Ltd.
is the trademark of Neoway Technology Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice
This document is intended for system engineers (SEs), development engineers, and test engineers. The information in this document is subject to change without notice due to product version update or
other reasons. Every effort has been made in preparation of this document to ensure accuracy of the contents, but all
statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.
Neoway provides customers complete technical support. If you have any question, please contact your account manager or email to the following email addresses:
Sales@neoway.com.cn Support@neoway.com.cn
Website: http://www.neoway.com.cn
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Revision Record
Issue
Changes
Revised By
Date
V1.0
Initial draft
Li Zhongqiu
2014-06
V1.1
Modified the definition of pin 53
Li Zhongqiu
2014-06
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Contents
About This Document ......................................................................................................... 1
1 Introduction to M660A ..................................................................................................... 1
1.1 Overview ..................................................................................................................................... 1
1.2 Block Diagram ............................................................................................................................ 1
1.3 Specifications .............................................................................................................................. 2
2 Pin Description and PCB Foot Print .............................................................................. 4
2.1 Specifications and Encapsulation ................................................................................................ 4
2.2 Pin Definition .............................................................................................................................. 5
2.3 PCB Foot Print ............................................................................................................................ 8
3 Interface Design................................................................................................................. 9
3.1 Power Supply and Switch Interfaces ........................................................................................... 9
3.1.1 VBAT ................................................................................................................................. 9
3.1.2 VDD_EXT ....................................................................................................................... 12
3.1.3 VRTC ............................................................................................................................... 12
3.1.4 Power On/Off Procedure .................................................................................................. 13
3.1.5 RESET .............................................................................................................................. 15
3.2 UART ........................................................................................................................................ 16
3.3 USB Interfaces .......................................................................................................................... 18
3.4 DTR and RING ......................................................................................................................... 19
3.4.1 DTR Pin ........................................................................................................................... 19
3.4.2 RING Signal Indicator...................................................................................................... 19
3.5 SIM Card Interface .................................................................................................................... 20
3.6 Running LED Indicator ............................................................................................................. 22
3.7 Audio Interface .......................................................................................................................... 23
3.8 RF Interface ............................................................................................................................... 25
3.8.1 RF Design and PCB Layout ............................................................................................. 25
3.8.2 Recommended RF Connection ......................................................................................... 26
4 Electric Features and Reliability................................................................................... 27
4.1 Electric Feature ......................................................................................................................... 27
4.2 Temperature ............................................................................................................................... 27
4.3 Current....................................................................................................................................... 28
4.4 ESD Protection .......................................................................................................................... 28
5 RF Features ....................................................................................................................... 30
5.1 Work Band ................................................................................................................................. 30
5.1.2 Transmitting Power .......................................................................................................... 30
5.1.3 Receiving Sensitivity ........................................................................................................ 31
6 Mounting the Module onto the Application Board.................................................. 32
7 Package .............................................................................................................................. 32
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8 Abbreviations ................................................................................................................... 33
Neo_M660A GPRS Module Hardware User Guide
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Table of Figures
Figure 2-1 Top view of the M660A module ............................................................................................ 4
Figure 2-2 PCB foot print recommended for M660A (unit: mm) ........................................................... 8
Figure 3-1 Current peaks and voltage drops ............................................................................................ 9
Figure 3-2 Reference design d for the power supply ............................................................................. 10
Figure 3-3 Reference design of power supply control ........................................................................... 10
Figure 3-4 Reference design of power supply controlled by p-MOSFET ..............................................11
Figure 3-5 Reference designs of separated power supply ...................................................................... 12
Figure 3-6 VRTC reference design ........................................................................................................ 13
Figure 3-7 Turning on procedure ........................................................................................................... 13
Figure 3-8 Turning off procedure .......................................................................................................... 14
Figure 3-9 Reference circuit for ON/OFF controlled by low level ........................................................ 14
Figure 3-10 Reference circuit for power-on controlled by high level .................................................... 15
Figure 3-11 Reset circuit with triode separating .................................................................................... 15
Figure 3-12 Signal connection between DCE and DTE ........................................................................ 16
Figure 3-13 Recommended communication circuit between 3.3V MCU and UART ........................... 17
Figure 3-14 Recommended communication circuit between 5V MCU and UART .............................. 17
Figure 3-15 USB circuit ........................................................................................................................ 18
Figure 3-16 RING indicator for incoming call ...................................................................................... 20
Figure 3-17 RING indicator for SMS .................................................................................................... 20
Figure 3-18 Reference design of SIM card interface ............................................................................. 21
Figure 3-19 Reference of SIM card socket ............................................................................................ 21
Figure 3-20 LED indicator directly driven by high level ....................................................................... 22
Figure 3-21 LED indicator driven by transistor ..................................................................................... 22
Figure 3-22 Reference design of MIC differential connections ............................................................. 23
Figure 3-23 Reference design for common audio input ........................................................................ 24
Figure 3-24 Reference design for receiver output ................................................................................. 24
Figure 3-25 Coupling capacitor interfacing ................................ ........................................................... 25
Figure 3-26 Reference design for antenna interface .............................................................................. 25
Figure 3-27 RF layout reference ............................................................................................................ 26
Figure 3-28 Encapsulation specifications of Murata RF connector ....................................................... 26
Figure 3-29 RF connections................................................................................................................... 26
Neo_M660A GPRS Module Hardware User Guide
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Table of Tables
Table 1-1 M660A specifications .............................................................................................................. 2
Table 2-1 M660A pin definition .............................................................................................................. 5
Table 3-1 Power supply and switch interface .......................................................................................... 9
Table 3-2 UART .................................................................................................................................... 16
Table 3-3 USB interface ........................................................................................................................ 18
Table 3-4 DTR and RING pins .............................................................................................................. 19
Table 3-5 SIM card interface ................................................................................................................. 20
Table 3-6 LED indicator ........................................................................................................................ 22
Table 3-7 Audio interface ...................................................................................................................... 23
Table 4-1 Electric feature of the module ............................................................................................... 27
Table 4-2 Temperature Feature ................................................................................................ .............. 27
Table 4-3 Current feature ....................................................................................................................... 28
Table 4-4 ESD feature of the module .................................................................................................... 29
Table 5-1 Work band ............................................................................................................................. 30
Table 5-2 Transmitting power (GSM850&EGSM900) ......................................................................... 30
Table 5-3 Transmitting power (DCS1800&PCS1900) .......................................................................... 30
Neo_M660A GPRS Module Hardware User Guide
Copyright © Neoway Technology Co., Ltd
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About This Document
This document defines the features, indicators, and test standards of the M660A module and provides reference for the hardware design of each interface. With Neo_M660A GPRS Module AT Command Set, this user guide can help you complete wireless communication application easily.
1 Introduction to M660A
M660A is a compact wireless GSM/GPRS module that supports downlink EDGE. It can provide functions of high-quality voice, SMS, and data services and is widely used in industrial and consumer fields.
1.1 Overview
Neoway M660A module adopts 68-pin LCC encapsulation and its dimensions are 24 mm x 24 mm x 2.6 mm, which can meet most customers' requirements. It provides customers the following hardware resources and features:
UART interfaces, used for data communication, firmware updating and commissioning, and
supporting hardware flow control
Audio interfaces, including one line of MIC input (differential) and one line of receiver output
(differential)
10-bit ADC input, voltage ranging from 0 V to 2.8 V One line of SIM card interface, compatible with 1.8 V and 3.0V SIM card RING/LIGHT/DTR (sleep mode) functions Time updating and timing power-on/off Firmware updating via USB interface
1.2 Block Diagram
The M660A module consists of baseband controller, Flash ROM, RF section, application interfaces, etc. All sections coordinate with each other to provide such communication functions as GPRS data and voice.
The following figure shows the block diagram of M660A.
Neo_M660A GPRS Module Hardware User Guide
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VBAT
VRTC
Digital
Interface
USB
SIM
UART
ON/OFF
Power
Manager
RF transceiver
FLASH
Digital
Baseband
Analog
Baseband
26 MHz CrystalRF Front-end-module
Audio
Interface
MIC
SIM
PC
ADC
REC
1.3 Specifications
Table 1-1 M660A specifications
Specifications
Description
Band
GSM850/EGSM900/DCS1800/PCS1900 MHz dual-band/quad-band Supporting band locking
Sensitivity
< -107 dBm
Max. transmit power
GSM850/EGSM900 Class4(2W)
DCS1800/PCS1900 Class1(1W)
Protocol
Supporting GSM/GPRS Phase 2/2+
AT  GSM07.07
Extended AT commands
Audio
Supporting the following audio coding:
HR
FR
EFR
AMR
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Supporting echo suppression Supporting recording and DTMF check function
SMS  TEXT/PDU
Supporting SMS message receiving and sending and ring for new SMS messages
Supporting SMS message management: reading/deleting/storage/list
GPRS feature
GPRS CLASS 12
Max. theoretic uplink rate: 85.6 Kbit/s
Max. theoretic downlink rate: 85.6 Kbit/s
Built-in TCP/IP protocol, supporting multiple links
Supporting server and client modes
Circuit Switch Data
CSD
USSD
Supplementary service
Call forwarding
Call waiting
Call holding and multi-way calling
UART
Supporting hardware flow control, RTS and CTS controlled via AT commands
Supporting multiplexing
Supporting AT sending, data transmission, and software download
Supporting baudrate from 1200 bit/s to 115200 bit/s
RTC
Supporting real-time clock and time updating
Supporting timing power-on/off
CPU
ARM7-EJ@360MHz
Antenna feature
50 Ω impedance
Operating temperature
-40℃ to +85℃ Operating voltage
3.5 V to 4.3 V (3.9 V is recommended)
Peak current
Max 2.0 A
Idle current
18 mA
Current in sleep mode
< 2 mA (live network)
< 1 mA (instrument, DRX=9)
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2 Pin Description and PCB Foot Print
2.1 Specifications and Encapsulation
Specifications
M660A
Dimensions
24 mm x 24 mm x 2.6 mm (H x W x D)
Weight
2.6 g
Encapsulation
68-pin LGA
Figure 2-1 Top view of the M660A module
M660A
TOP VIEW
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
ON/OFF
GND
DTR
RING
NC
NC CTS RTS
UTXD
URXD
NC
NC
NC
NC
VDD_EXT
RESET
GND
NC
SIM_RST
SIM_CLK
SIM_DATA
VSIM
GND
USB_DM
USB_DP
VRTC
ADC_IN
VBUS
NC
RECN
RECP
MICN
MICP
GND
NC NC NC NC NC GND GND NC NC NC NC NC GND NC NC NC NC
LIGHT
NC
GND
VBTA
VBAT
VBAT
GND
GND
GPRS_ANT
GND
GND
GND
GND
GND
NC
NC
NC
11
USB
NC
POWER GND
SIM
UART
AUDIO ADC ANT OTHERS
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2.2 Pin Definition
Table 2-1 M660A pin definition
Pin
Name
I/O
Function
Reset
Status
Level Feature
(V)
Remarks
Power Supply and Switch Interfaces
55, 56, 57
VBAT
P
Main power supply input
3.5 V to 4.3 V (3.9 V is recommended)
15
VDD_EXT
P
2.8 V power supply output
Supply power for IO level shifting circuit. Load capability: less than 50 mA
26
VRTC
P
RTC power supply
2.8 V, maximum output charging current 2 mA
2, 17, 18, 29, 39, 45, 46, 53, 54, 58, 59, 61-65
GND
P
Ground 1
ON/OFF
DI
ON/OFF control input
I/PU
0<VIL<0.6
2.1<VIH<VBAT
Low level pulse can change the ON/OFF state.
16
RESET
DI
Reset input
Internal 2.8V pull-up
Low level reset
Audio Interface
19
MICP
AI
Positive electrode of differential MIC output
Vpp≤200 mV 20
MICN
AI
Negative electrode of differential MIC output
21
RECP
AO
Positive electrode of differential receiver output
32 Ω receiver
driving output 22
RECN
AO
Negative electrode of differential receiver output
UART Interface
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7
CTS
DI
Clear to send
I/PU
0<VIL<0.6
2.1<VIH<3.1 0<VOL<0.42
2.38<VOH<2.8
With internal 47K resistors to respectively pull CTS and URXD up to 2.8 V
8
RTS
DO
Request to send
I/PU
9
UTXD
DO
UART data transmit
O/PU
10
URXD
DI
UART data receive
I/PU
SIM Card
30
VSIM
P
SIM card power supply output
0<VIL<0.25*VSI M
0.75*VSIM<V
IH
<VSIM 0<VOL<0.15*VS
IM
0.85*VSIM<V
OH
<VSIM
Compatible with
1.8/3.0 V SIM card
31
SIM_DATA
DI/O
SIM card data I/O
0<VIL<0.6
2.1<VIH<3.1 0<VOL<0.42
2.38<VOH<2.8
33
SIM_CLK
DO
SIM card clock output
32
SIM_RST
DO
SIM card reset output
LED Indicators
52
LIGHT
DO
Status LED
I/PD
2.8 V/4 mA output
Sleep Mode Controlling
3
DTR
DI
Sleep mode controlling input
I/PD
0<VIL<0.6
2.1<VIH<3.1 0<VOL<0.42
2.38<VOH<2.8
Low level by default
Used together with AT commands
SMS and Incoming Call Ring
4
RING
DO
Ring output
I/PD
0<VIL<0.6
2.1<VIH<3.1 0<VOL<0.42
2.38<VOH<2.8
Detect incoming SMS messages or calls
ADC Detecting
25
ADC_IN
AI
10-bit ADC input
Detectable voltage range: 0 V to 2.8 V
GPRS Antenna
60
GPRS_ANT
AI/O
GPRS antenna interface I/O
50 Ω impedance
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USB Interfaces
24
VBUS
AI
USB voltage test
27
USB_DP
DI/O
USB interface differential data cable
Complying with the USB1.1 standard
Used for firmware download
28
USB_DM
DI/O
Reserved Pins
5, 6, 11~14, 23, 34~38, 40~44, 47~51, 66~68
NC
Must be left disconnected.
Cannot connect to power supply or ground.
P: indicates power supply pins NC: indicates pins that are not supported and must not be connected DI: indicates digital signal input pins DO: indicates digital signal output pins I/PD: indicates digital signal input pins with pull-down I/PU: indicates digital signal input pins with pull-up AI: indicates analogy signal input pins AO: indicates analogy signal output pins
The maximum input voltage at all IO ports (including peak signal current) cannot exceed 3.1 V because the module uses a 2.8 V IO power system. In the application of the module, the IO output voltage from the
3.3 V power supply system of the external circuit might greatly overshoot 3.1 V due to the signal integrity design. In this situation, the IO pins of the module might be damaged if the IO signals are connected to the IO port on the 2.8-V system. To rectify this issue, take measures to match the level. For details, see the 3.2 UART.
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2.3 PCB Foot Print
LCC packaging is adopted to package the pins of the M660A module. Figure 2-2 shows the recommended PCB foot print.
Figure 2-2 PCB foot print recommended for M660A (unit: mm)
1.004.00
4.00
24.00
24.00
12.00
3.78
4.97
1.60
0.60
4.4
4.
4
2.4
1.30
3.03
Keepout Area A
Keepout Area B
No trace or copper is allowed in the keepout aera.
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3 Interface Design
3.1 Power Supply and Switch Interfaces
Table 3-1 Power supply and switch interface
Pin Name
I/O
Function
Remarks
VBAT
P
Main power supply input
3.5 V to 4.3 V (3.9 V is recommended)
VDD_EXT
P
2.8 V power supply output
Loading capability < 50 mA
VRTC
P
RTC power supply input
2.8 V, 2 mA at most
ON/OFF
DI
ON/OFF input
Triggered by low level
RESET
DI
Module reset input
Triggered by low level Keep more than 100 ms
3.1.1 VBAT
VBAT is the main power supply of the module. Its input voltage ranges from 3.5 V to 4.3 V and the preferable value is 3.9V. In addition to digital signals and analog signals, it supplies power for RF power
amplifier. The performance of VBAT is a critical path to module's performance and stability. The peak input current at
the VBAT pin can be up to 2 A when the signal is weak and the module works at the maximum transmitting power. The voltage will encounter a drop in such a situation. If the voltage drops lower than 3.5 V, the module might restart.
Figure 3-1 Current peaks and voltage drops
Keep above 3.5 V
3.5 V
0 ms
3.7 ms 7.4 ms 10.7 ms
T
2 A
Voltage
Input
current
3.9 V
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Figure 3-2 shows a recommended power supply design for the module.
Figure 3-2 Reference design d for the power supply
Power Supply GPRS Module
Close to the pin of the module
D1
C1 C2 C3 C4
VBAT
Current testing point
I_max
C5
In the circuit, you can use TVS at D1 to enhance the performance of the module during a burst. SMF5.0AG (Vrwm=5V&Pppm=200W) is recommended. A large bypass tantalum capacitor (220 μF or 100 μF) or aluminum capacitor (470 μF or 1000 μF) is expected at C1 to reduce voltage drops during bursts together with C2 (10 μF capacitor). In addition, you need to add 0.1 μF, 100 pF, and 33 pF filter capacitors to enhance the stability of the power supply.
A controllable power supply is preferable if used in harsh conditions. The module might fail to reset in remote or unattended applications, or in an environment with great electromagnetic interference (EMI). If you adapt 5 V power supply, you can use the EN pin on the LDO or DC/DC chipset to control the switch of the power supply as shown in Figure 3-3.
MIC29302WU in the following figure is an LDO, which can output 3 A current.
Figure 3-3 Reference design of power supply control
VCC_IN_5V
GPRS_EN
VBAT
100 uF
TAN
0.1 uF
TVS
5V
0.1 uF
470 uF
TAN
EN
VIN
VOUT
ADJ
MIC29302WU
10K
4.75K
2
1
6
4
5
3
The alternative way is to use a p-MOSFET to control the module's power supply, as shown in Figure 3-4. When the external MCU detects the exceptions such as no response from the module or the disconnection of GPRS, power off/on can rectify the module exceptions.
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Figure 3-4 Reference design of power supply controlled by p-MOSFET
VCC_IN_3.9V
VBAT
10K
100K
33 pF
10 uF
GPRS_EN
2K
10K
0.1 uF
Q1
R4
C1
C2
C4
C5
C7
R1
R2
10 uF 0.1 uF
R3
Q2
TVS
5V
470 uF
C3
C6
100pF
S
G
D
In Figure 3-4, the module is powered on when GPRS_EN is set to high level. Q2 is added to eliminate the need for a high enough voltage level of the host GPIO. In case that the GPIO
can output a high voltage greater than VCC_IN_3.9V - |V
GS(th)
|, where V
GS(th)
is the Gate Threshold Voltage,
Q2 is not needed. Reference components:
Q1 can be IRML6401 or Rds(on) p-MOSFET which has higher withstand voltage and drain current.
Q2: a common NPN transistor, e.g. MMBT3904; or a digital NPN transistor, e.g. DTC123. If digital transistor is used, delete R1 and R2.
C3: 470 μF tantalum capacitor rated at 6.3 V; or 1000 μF aluminum capacitor. If lithium battery is used to supply power, C3 can be 220 μF tantalum capacitor.
Protection
Place a TVS diode (V
RWM
=5 V) on the VBAT power supply to ground, especially in automobile applications. For some stable power supplies, zener diodes can decrease the power supply overshoot. MMSZ5231B1T1G from ONSEMI and PZ3D4V2 from Prisemi are options.
Trace
The trace width of primary loop lines for VBAT on PCB must be able to support the safe transmission of 2A current and ensure no obvious loop voltage decrease. Therefore, the trace width of VBAT loop line is required at least 2 mm and the ground should be as complete as possible.
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Separating
As shown in Figure 3-1, the GPRS module works in burst mode that generates voltage drops on power supply. And furthermore this results in a 217 Hz TDD noise through power (One of the way generating noise. Another way is through RF radiation). Analog parts, especially the audio circuits, are subjected to this noise, known as a "buzz noise" in GSM systems. To prevent other parts from being affected, it's better to use separated power supplies. The module shall be supplied by an independent power, like a DC/DC or LDO. See Figure 3-5.
DC/DC or LDO should output rated peak current larger than 2 A. The inductor used in Reference Design (b) should be a power inductor and have a very low resistance. 10
μH with average current ability greater than 1.2 A and low DC resistance is recommended.
Figure 3-5 Reference designs of separated power supply
Other circuit
DC-DC/LDO
GPRS
module
DC-DC/LDO
Power
Input
Other circuitDC-DC/LDO
GPRS
module
Power
Input
10 uH
Reference Design (a) Reference Design (b)
EMC Considerations
Place transient overvoltage protection components like TVS diode on power supply, to absorb the power surges. SMAJ5.0A/C could be a choice.
Never use a diode to make the drop voltage between a higher input and module power. Otherwise, Neoway will not provide warranty for product issues caused by this. In this situation, the diode will obviously decrease the module performances, or result in unexpected restarts, due to the forward voltage of diode will vary greatly in different temperature and current.
3.1.2 VDD_EXT
It is recommended that VDD_EXT is only used for interface level shifting. VDD_EXT can output 2.8 V and 50 mA. It stops output after the module is shut down.
3.1.3 VRTC
VRTC is the external power supply pin of RTC inside the module. It can be connected to external battery or supercapacitor. When VBAT works properly, VRTC outputs 2.8 V and maximum 2 mA and can be connected to battery or supercapacitor to charge. When VBAT is disconnected, the module can discharge the battery or capacitor to supply power for RTC circuit in short time. Leave this pin disconnected if not used.
0 shows the reference design of the VRTC power supply.
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Figure 3-6 VRTC reference design
Backup
battery
GPRS Module
RTC
Circuit
Capacitor
VRTC
3.1.4 Power On/Off Procedure
Prior to turning on the module, power on the host MCU and finish the UART initialization. Otherwise conflictions may occur during initialization, due to unstable conditions.
ON/OFF is a low level pulse active input, used to turn on or off the module.
Turning on the Module
While the module is off, power on the module, drive the ON/OFF pin to ground for at least 1.2 second and then release. The module starts. After the module is started up, keep the ON/OFF pin at high level. The UART port will send an unsolicited message (MODEM:STARTUP), indicating the powering on of the module and can respond to the AT commands.
When you design your program, you can use the unsolicited message (MODEM:STARTUP) to check whether the module is started or reset improperly.
Figure 3-7 shows the procedure of powering on the module.
Figure 3-7 Turning on procedure
VBAT
ON/OFF
VDD_EXT
UART
1.2s
3s
300 ms
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Turning off the Module
While the module is on, drive the ON/OFF pin to ground for at least 500 ms and then release. The module will detach to network and 2 seconds later it will shut down. Then shut down the main power supply. Figure 3-8 shows the procedure of turning off the module. Another approach to turn off the module is using AT commands. For details, see Neo_M660A GPRS Module AT Command Set.
Figure 3-8 Turning off procedure
VBAT
ON/OFF
VDD_EXT
UART
2 s
500 ms
Figure 3-9 shows a reference circuit for ON/OFF control with inverted control logic.
Figure 3-9 Reference circuit for ON/OFF controlled by low level
GPRS Module
ON/OFF
TVS
S 1
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Figure 3-10 Reference circuit for power-on controlled by high level
USER_ON
GPRS Module
ON/OFF
4.7K
47K
R1
R2
In Figure 3-10, high level takes effect for ON/OFF on the user side (USER_ON). R1 and R2 can be adjusted according to the driving capability of the USER_ON pin. Use a common NPN transistor, e.g. MMBT3904; or a digital NPN transistor, e.g. DTC123. If digital transistor is used, delete R1 and R2.
Level abnormalities at interfaces connected to the external MCU, especially the UART port, might affect the power on procedure of the module. For example, when a module is turned on, the IO ports of the MCU are still in output status because they have not been initialized completely. The module might fails to start if the UTXD signal (output pin) is forced to pull up or down.
The better way to rescue the module from abnormal condition, is to apply a power OFF-ON procedure, rather than using the ON/OFF control signal. In fact ON/OFF signal is software-dependent.
3.1.5 RESET
Pull the RESET signal to low level for more than 100 ms to reset the module. A pull-up resistor is internally included and the typical high level is 2.8 V. The RESET pin can be left disconnected if not used. A triode has been used in the internal RESET circuit. Please refer to Figure 3-11.
Figure 3-11 Reset circuit with triode separating
Reset
Circuit
R1
R2
2.8V
RESET
GPRS Module
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3.2 UART
Table 3-2 UART
Pin Name
I/O
Function Description
Remarks
RTS
DO
Request to send
CTS
DI
Clear to send
URXD
DI
UART data receive
UTXD
DO
UART data transmit
UART is used for AT commands, data sending/receiving, firmware updating, etc. Figure 3-12 shows the signal connection between the module (DCE) and the terminal (DTE).
Figure 3-12 Signal connection between DCE and DTE
DCE
URXD
UTXD
CTS
RTS
DTE
UTXD
URXD
RTS
CTS
The UART of M660A works at 2.8 V CMOS logic level. The voltages for input high level should not exceed 3.1 V. Supported baud rates range from 300 bit/s to 921600 bit/s and the default rate is 115200 bit/s. For more details about baudrate, see Neo_M660A GPRS Module Hardware User Guide.
If the UART is interfacing with an MCU that has 3.3 V logic levels, resistors should be connected in series with the signals.
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Figure 3-13 Recommended communication circuit between 3.3V MCU and UART
VDD_EXT
0.1 uF
47K
RB521S
200 Ω
33 pF
33 pF
MCU_UTXD
MCU_URXD
Module_URXD
Module_UTXD
In Figure 3-13, 100 pF filter capacitor should be placed near the receive pin of the module. Resistor (200 Ω to 470 Ω) and capacitor (100 pF to 470 pF) can be selected based on the tested signal wave. Great serial resistance and filter capacity will decrease the signal level significantly, resulting in undesired signal wave distortion and the low adaptable UART communication baudrate. RB521S-30TE-61, RB521SM-30GJT2R, and LRB521S-30T1G are recommended for separating diode.
When the external MCU adopts 5 V IO system, level shifting is required for both UART receive and transmit. Figure 3-14 shows a reference circuit design.
Figure 3-14 Recommended communication circuit between 5V MCU and UART
OUTPUT
VCC_IN VDD_EXT
4.7K 10K
INPUT
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INPUT is connected to TXD of the MCU and VCC_IN is connected to the 5 V power supply of the external MCU. OUTPUT is connected to RXD of the module. If the circuit is far away from the VDD_EXT pin, add a 0.1 μF decoupling capacitor to VDD_EXT.
Level shifting between RXD of the MCU and TXD of the module can be designed in the similar way. The pull-up resistor R3 ranges from 4.7 K to 10 K; R2 ranges from 2 K to 10 K. Resistors are selected based
on the voltage of the power supply and UART baudrate. You can select resistors with great resistance to reduce the power consumption when the power supply has great voltage or the baudrate is low. But, the resistance will affect the quality of the square wave. In addition, the circuit performance is affected by the signal traces during PCB layout.
It is recommended that you choose a high-speed NPN transistor because the Q1 switch rate will affect the wave quality after level shifting. MMBT3904 or MMBT2222 is recommended.
Avoid data produced at UART when the module is turned on. You are advised to send data to the UART 3 seconds after the module is turned on so that the module would not respond wrongly.
3.3 USB Interfaces
Table 3-3 USB interface
Pin Name
I/O
Function
Remarks
VBUS
AI
USB voltage check
4.3 V < VBUS < 7 V, typical value: 5 V
USB_DP
DIO
Positive signal of USB data
USB_DM
DIO
Negative signal of USB data
For M660A modules, you can download firmware through USB interfaces. Before download the firmware, connect the USB interface to a computer and power on the module. A dedicated download tool is required.
Figure 3-15 shows the recommended connection between the module and a computer.
Figure 3-15 USB circuit
GPRS Module
VBUS
USB_DM
USB_DP
GND
PC
UTXD
URXD
RTS
CTS
VBUS
USB_DM
USB_DP
GND
20 Ω
20 Ω
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Parallel a 1 μF filter capacitor on VBUS and place it as close to the pin as possible. You must also add TVS to the VBUS power cable. Use TVS diodes with a capacity of lower than 12 pF for protection on the data cables of USB_DP and USB_DM and adopt Differential Signal trace for USB_DP and USB_DM and ensure complete ground for separation.
USB interface is used only for software download.
3.4 DTR and RING
Table 3-4 DTR and RING pins
Pin Name
I/O
Function
Remarks
DTR
DI
Signal for controlling sleep mode
Low level by default Left disconnected if not used
RING
DO
Ring output
Left disconnected if not used
3.4.1 DTR Pin
Generally DTR is used to control sleep mode together with AT commands. For details, see Neo_M660A GPRS Module AT Command Set. Based on the setting of the selected mode, pulling DTR low will bring the
module into sleep mode if the module is idle. In this mode, the idle current is less than 2 mA, depending on the DRX setting of network.
In sleep mode, the module can respond to the incoming call, SMS, and GPRS data. The host MCU can also control the module to exit sleep mode by controlling DTR.
Process of entering the sleep mode:
1. Keep DTR high level in normal working mode. Activate the sleep mode by using the
AT+ENPWRSAVE=1 command.
2. Pull DTR low, and the module will enter sleep mode, but only after process and pending data
finished.
3. In the sleep mode, the external MCP can pull DTR high so that the module will exit from sleep mode
actively. Then the module can transmit data and initiate calls. After processing is finished, pull DTR low again to take the module back to sleep mode.
4. In sleep mode, the module can be woken up by the events of incoming voice call, received data, or
SMS. Meanwhile the module will send out the unsolicited messages through the UART. Upon receipt of the unsolicited messages, the host MCU should pull DTR high firstly, otherwise the
module will resume sleep mode in two minutes after the service processing. And then the host MCU can process the voice call, received data, or SMS. After processing is finished, pull DTR low again to put the module into sleep mode.
3.4.2 RING Signal Indicator
Calling: Once a voice call is coming, UART output "RING" character strings and meanwhile the RING pin outputs 250 ms low pulses at 4s period. After the call is answered, the high level restores.
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Figure 3-16 RING indicator for incoming call
4 s
250 ms
250 ms
SMS: Upon receipt of SMS, the module outputs one 600 ms low pulse.
Figure 3-17 RING indicator for SMS
600 ms
3.5 SIM Card Interface
Table 3-5 SIM card interface
Pin Name
I/O
Function Description
Remarks
VSIM
P
SIM card power supply output
1.8/3.0V
SIM_CLK
DO
SIM card clock output
SIM_RST
DO
SIM card reset output
SIM_DATA
DI/O
SIM card data IO
With internal pull-up resistor
M660A supports 3.0 V and 1.8 V SIM cards. VSIM supplies power for SIM card at Max. 30 mA. SIM_DATA is pulled up by an internal resistor. You do not have to add and external pull-up resistor in your
design. SIM_CLK can work at several frequencies at 3.25 MHz typically. SIM card is sensitive to GSM TDD noise
and RF interference. So, the PCB design should meet the following requirements:
The antenna especially build-in antenna should be installed a long distance away from the SIM card and SIM card traces.
The PCB traces of SIM should be as short as possible and shielded with GND copper.
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Figure 3-18 Reference design of SIM card interface
20 Ω
20 Ω
20 Ω
1 uF
SIM_DATA
SIM_CLK
SIM_RST
VSIM
GPRS Module
CLK RST
VCC
GND
SIM Card
DATA
VPP
ESD protectors, such as ESD diodes (lower than 33 pF) or ESD varistors, are recommended on the SIM signals, especially in automotive electronics or other applications with badly ESD. In other applications, replace ESD diodes with 27 pF to 33 pF grounding capacitors. The ESD diodes or small capacitors should be close to the SIM card pin on the socket.
If you use 6-pin SIM card sockets, MCP-C713(H2.8) is recommended. Figure 3-19 shows its encapsulation.
Figure 3-19 Reference of SIM card socket
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3.6 Running LED Indicator
Table 3-6 LED indicator
Pin Name
I/O
Function
Remarks
LIGHT
DO
Indicates running status
2.8 V output, max. 4 mA
When the module is running, the LED indicator is driven by the LIGHT pin to indicate different module status with its various blink behaviors. For how to set the LED indicator, see Neo_M660A GPRS Module AT Command Set.
LIGHT can output 4 mA current and 2.8 V high level, therefore the LED can be directly connected to this pin with a resistor in series. For better luminance, drive the LED with a transistor instead.
Figure 3-20 LED indicator directly driven by high level
LIGHT
GPRS
Module
1K
Figure 3-21 LED indicator driven by transistor
LIGHT
GPRS Module
10K
VCC
470 Ω
4.7K
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3.7 Audio Interface
Table 3-7 Audio interface
Pin Name
I/O
Function
Remarks
MICP
AI
Positive electrode of MIC output
Vpp≤200 mV MICN
AI
Negative electrode of MIC output
RECP
AO
Positive electrode of receiver output
32Ω receiver driving output RECN
AO
Negative electrode of receiver output
M660A supports two lines of audio interfaces. You can switch the audio channels and adjust the volume via AT commands. For details, see Neo_M660A GPRS AT Command Set.
Figure 3-22 shows a reference audio interface design. The peak voltage routed to MICP/MICN should not exceed 200 mV AC. AGC circuit is integrated inside the module. Electret microphone is suited.
The module can meet the requirements of common handsets with AGC and volume control.
Figure 3-22 Reference design of MIC differential connections
GPRS Module
33 pF
MIC
33 pF
100 pF
MICN
MICP
In Figure 3-23, a bias voltage for microphone is provided through MICP and MICN. But if an amplifier is used between the microphone and module, capacitors like C1 and C2, should be placed between the outputs of amplifier and module, to block the bias voltage.
For a peak voltage greater than 200 mV AC, an attenuation circuit comprised of R1-R4 should be used.
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Figure 3-23 Reference design for common audio input
GPRS Module
33 pF
33 pF
MICN
MICP
MIC_BIAS
Baseband
Circuit
2.2 uF
R6
2.2 KΩ
R5
2.2 kΩ
C1
C2
User's
Circuit
R1
R3
R2
R4
In Figure 3-22 and Figure 3-23, the audio input circuits are designed to meet the requirements for small audio signal, far away from interference source and masking PCB routing by ground.
Figure 3-24 shows a reference design for the receiver interface, which can drive a 32 Ω receiver directly.
Figure 3-24 Reference design for receiver output
GPRS Module
33 pF
Receiver@32Ω
33 pF
100 pF
RECN
RECP
If an external amplifier is used for driving the speakers, coupling capacitors of 2.2 μF to 4.7 μF should be used to block the DC voltage, as shown in Figure 3-25.
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Figure 3-25 Coupling capacitor interfacing
GPRS Module
RECN
RECP
C1
C2
User's
Circuit
3.8 RF Interface
3.8.1 RF Design and PCB Layout
GPRS_ANT is the antenna interface of the module. A 50 Ω antenna is required. VSWR ranges from 1.0 to
1.5. The antenna should be well matched to achieve best performance. It should be installed far away from high speed logic circuits, DC/DC power, or any other strong disturbing sources.
For multiple-layer PCB, the trace between the antenna pad of module and the antenna connector, should
have a 50 Ω characteristic impedance, and be as short as possible. The trace should be surrounded by ground
copper. Place plenty of via holes to connect this ground copper to main ground plane, at the copper edge. If the trace between the module and connector has to be longer than 10 mm, or built-in antenna is used, a
π-type matching circuit should be added, as shown in Figure 3-26. The types and values of C1, L1, and L2 should be verified by testing using network analyzer instrument. If the characteristic impedance is well matched, and VSWR requirement is met, just use a 0 Ω resistor for C1 and leave L1, L2 un-installed.
Avoid any other traces crossing the antenna trace on neighboring layer.
Figure 3-26 Reference design for antenna interface
GPRS Module
ANT
C1
GPRS_ANT
L2
L1
On two-layer boards which cannot control resistance properly, the RF route should be as short (less than 10 mm) and smooth as possible and at a width of 0.5 mm; the RF is 0.5 mm away from the ground.
Figure 3-27 shows a two-layer board application. The RF is connected to GSC RF connector through traces on PCB, which is connected to the antenna via cable.
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Figure 3-27 RF layout reference
The RF traces are wide 0.5 mm; leave space at least 0.5 mm between the coppers. Drill enough grounding holes.
Ensure that the ground pins on both sides of the antenna are grounded completely and they form a complete circle with grounding copper.
ESD protection is built in module. For special ESD protection, an ESD diode can be placed close to the antenna. But ensure using a low junction capacitance ESD diode. The junction capacitance should be less than 0.5 pF, otherwise the RF signal will be attenuated. RCLAMP0521P from Semtech, or ESD5V3U1U from Infineon, can be used here.
On the PCB, keep the RF signals and RF components away from high-speed circuits, power supplies, transformers, great inductors, the clock circuit of single-chip host, etc.
3.8.2 Recommended RF Connection
If you adopts RF cables for connections, the GSC RF connector MM9329-2700RA1 from Murata is recommended. Figure 3-28 shows the encapsulation specifications.
Figure 3-28 Encapsulation specifications of Murata RF connector
RF cable can also be connected to the module by soldering. In this manner, you must ensure proper soldering in case of damage that lowers RF performance. Figure 3-29 shows the pictures of these two connections.
Figure 3-29 RF connections
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4 Electric Features and Reliability
4.1 Electric Feature
Table 4-1 Electric feature of the module
Parameter
Minimum Value
Typical Value
Maximum Value
VBAT Vin
3.5 V
3.9 V
4.3 V
Iin / /
2 A
VBUS
4.3 V
5 V
7 V
VDD_EXT Vout
/
2.8 V
/
Iout / /
50 mA
DIO
Vout
2.3 V
2.8 V
3.1 V
Iout / /
4 mA
Vin
-0.3 V
0 V
0.6 V
Iin / /
22.5 μA
If the voltage is too low, the module might fail to start. If the voltage is too high or there is a voltage burst during the startup, the module might be damaged permanently.
If you use LDO or DC-DC to supply power for the module, ensure that it output at least 2 A current.
4.2 Temperature
Table 4-2 Temperature Feature
Module Status
Minimum Value
Typical Value
Maximum Value
Working
-40℃
25℃
85℃
Storage
-45℃
90℃
If the module works in temperature exceeding the thresholds, its RF performance (e.g. frequency deviation or phase deviation) might be worse but it can still work properly.
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4.3 Current
Table 4-3 Current feature
Parameter
Testing Conditions
Testing Result
(Average Current)
Testing voltage
3.9 V Agilent power supply
/
Idle mode
Set the instrument and power on the module.
18 mA
Off leakage current
Power on the module or use AT command to shut the module down.
60 μA
Average network searching current
Set the instrument. Start the module. Wait until the module registers the
instrument.
60 mA
Sleep mode
On a live network, the module registers the network and then enters the sleep mode.
1.8 mA Set the instrument properly (DRX=9)
992 μA
Voice service
Maximum power level in full rate mode
GSM850
210 mA
EGSM900
200 mA
DCS1800
135 mA
PCS1900
140 mA
GPRS class 12
4TX,1RX(4Up/1Down)
GSM850
425 mA
EGSM900
422 mA
DCS1800
260 mA
PCS1900
275 mA
1TX,4RX(1Up/4Down)
GSM850
200 mA
EGSM900
185 mA
DCS1800
155 mA
PCS1900
140 mA
The data in the above table is typical values obtained during tests in lab. It might be a little bit different caused by the difference of the module hardware. Also, the test results might be various due to different setting or testing methods.
4.4 ESD Protection
Electronics need to pass sever ESD tests. The following table shows the ESD capability of key pins of our module. It is recommended that you add ESD protection to those pins in accordance to the application to ensure your product quality when designing your products.
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Humility: 45% Temperature: 25
Table 4-4 ESD feature of the module
Testing Point
Contact Discharge
Air Discharge
VBAT
±8KV
±15KV
GND
±8KV
±15KV
ANT
±8KV
±15KV
Cover
±8KV
±15KV
RXD/TXD
±4KV
±8KV
USB
±4KV
±8KV
MIC/ REC
±4KV
±8KV
Others
±4KV
±8KV
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5 RF Features
5.1 Work Band
Table 5-1 Work band
Work Band
Uplink
Downlink
GSM850
824~849MHz
869~894MHz
EGSM900
880~915MHz
925~960MHz
DCS1800
1710~1785MHz
1805~1880MHz
PCS1900
1850~1910MHz
1930~1990MHz
5.1.2 Transmitting Power
Table 5-2 Transmitting power (GSM850&EGSM900)
PCL
Transmitting Power
Threshold Range
5
33 dBm
±2 dBm
6
31 dBm
±3 dBm
7
29 dBm
±3 dBm
8
27 dBm
±3 dBm
9
25 dBm
±3 dBm
10
23 dBm
±3 dBm
11
21 dBm
±3 dBm
12
19 dBm
±3 dBm
13
17 dBm
±3 dBm
14
15 dBm
±3 dBm
15
13 dBm
±5 dBm
16
11 dBm
±5 dBm
17
9 dBm
±5 dBm
18
7 dBm
±5 dBm
19
5 dBm
±5 dBm
Table 5-3 Transmitting power (DCS1800&PCS1900)
PCL
Transmitting Power
Threshold Range
0
30 dBm
±2 dBm
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1
28 dBm
±3 dBm
2
26 dBm
±3 dBm
3
24 dBm
±3 dBm
4
22 dBm
±3 dBm
5
20 dBm
±3 dBm
6
18 dBm
±3 dBm
7
16 dBm
±3 dBm
8
14 dBm
±3 dBm
9
12 dBm
±3 dBm
10
10 dBm
±4 Bm
11
8 dBm
±4 Bm
12
6 dBm
±4 Bm
13
4 dBm
±4 dBm
14
2 dBm
±5 dBm
15
0 dBm
±5 dBm
5.1.3 Receiving Sensitivity
Band
Typical
GSM800&EGSM900
<-107 dBm
DCS1800&PCS1900
<-107 dBm
The data in the above tables is obtained by connecting the module to RF test instrument (e..g. CMU200, CWM500, or Agilent8960) in lab tests. It is for reference only.
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6 Mounting the Module onto the Application Board
M660A is compatible with industrial standard reflow profile for lead-free SMT process. The reflow profile is process dependent, so the following recommendation is just a start point guideline:
Only one flow is supported.
Quality of the solder joint depends on the solder volume. Minimum of 0.15 mm stencil thickness is recommended.
Use bigger aperture size of the stencil than actual pad size.
Use a low-residue, no-clean type solder paste.
7 Package
M660Amodules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules again in case of opening for any reasons.
If exposed in air for more than 48 hours at conditions not worse than 30°C/60% RH, a baking procedure should be done before SMT. Or, if the indication card shows humidity greater than 20%, the baking procedure is also required.
The baking should last for at least 12 hours at 90.
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8 Abbreviations
ADC
Analog-Digital Converter
AFC
Automatic Frequency Control
AGC
Automatic Gain Control
AMR
Acknowledged multirate (speech coder)
CSD
Circuit Switched Data
CPU
Central Processing Unit
DAI
Digital Audio interface
DAC
Digital-to-Analog Converter
DCE
Data Communication Equipment
DSP
Digital Signal Processor
DTE
Data Terminal Equipment
DTMF
Dual Tone Multi-Frequency
DTR
Data Terminal Ready
EFR
Enhanced Full Rate
EGSM
Enhanced GSM
EMC
Electromagnetic Compatibility
EMI
Electro Magnetic Interference
ESD
Electronic Static Discharge
ETS
European Telecommunication Standard
FDMA
Frequency Division Multiple Access
FR
Full Rate
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
HR
Half Rate
IC
Integrated Circuit
IMEI
International Mobile Equipment Identity
LCD
Liquid Crystal Display
LED
Light Emitting Diode
MS
Mobile Station
PCB
Printed Circuit Board
PCS
Personal Communication System
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RAM
Random Access Memory
RF
Radio Frequency
ROM
Read-only Memory
RMS
Root Mean Square
RTC
Real Time Clock
SIM
Subscriber Identification Module
SMS
Short Message Service
SRAM
Static Random Access Memory
TA
Terminal adapter
TDMA
Time Division Multiple Access
UART
Universal asynchronous receiver-transmitter
VSWR
Voltage Standing Wave Ratio
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