NEC PS9851-1, PS9851-2 DATA SHEET

PRELIMINARY DATA SHEET

1. Anode1

2. Cathode1

3. Cathode2

4. Anode2

5. GND

6. V

O

2

7. V

O

1

8. V

DD

1. NC

2. Anode

3. Cathode

4. NC

5. GND

6. V

O

7. NC

8. V

DD

1234

8765

SHIELD

PIN CONNECTION

(Top View)

PS9851-2

PS9851-1

SHIELD

1234

8765

PHOTOCOUPLER

PS9851-1,-2

HIGH NOISE REDUCTION, 15 Mbps CMOS OUTPUT TYPE

8-PIN SSOP PHOTOCOUPLER

DESCRIPTION

The PS9851-1, -2 are optically coupled isolators containing GaAlAs LED on the input side and a CMOS output IC

on the output side.

They are high common mode transient immunity (CMR), high-speed CMOS output type photocouplers designed for

high-speed logic interface circuits.

FEATURES

• High-speed response (15 Mbps)

• Operable at high temperature (−40 to +100°C)

• High common mode transient immunity (CM

• High isolation voltage (BV = 2 500 Vr.m.s.)

• Pulse width distortion (t

PHL−tPLH = 5 ns TYP.)

• Ordering number of tape product : PS9851-1-F3, F4: 1 500 pcs/reel

: PS9851-2-F3, F4: 1 500 pcs/reel

• Safety standards

• UL awaiting approved

• DIN EN60747-5-2 (VDE0884 Part2) awaiting approved

APPLICATIONS

• FA Network

• Measurement equipment

• PDP

H, CML = ±15 kV/

µ

s TYP.)

−NEPOC Series−

Document No. PN10493EJ01V0DS (1st edition)
Date Published May 2004 CP(K)
Printed in Japan

The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.

Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.



NEC Compound Semiconductor Devices 2004

PACKAGE DIMENSIONS (UNIT: mm)

5.21±0.25 (include burr)

5.08±0.15

3.27±0.2

+0.10

–0.05

0.15

PS9851-1,-2

6.0±0.2

3.95±0.1

1.27

+0.10

0.1±0.1

0.4

–0.05

0.25 M

MARKING EXAMPLE

PS9851-1

9851-1
N451

N

N

4

51

No. 1 pin Mark

Initial of NEC

(Engraved mark)

*1 For the external plating Sn-Bi product,

L is indicated at the second digit of the rank.

Year Assembled
(Last 1 Digit)

Rank Code

Type Number

Assembly Lot

Week Assembled

*1

0.5±0.3

PS9851-2

9851-2
N451

Type Number

Assembly Lot

N

N

4

51

No. 1 pin Mark

Initial of NEC

(Engraved mark)

*1 For the external plating Sn-Bi product,

L is indicated at the second digit of the rank.

Week Assembled

Year Assembled
(Last 1 Digit)

Rank Code

0.10 S

*1

2

Preliminary Data Sheet PN10493EJ01V0DS

PS9851-1,-2

ORDERING INFORMATION

Part Number Package Packing Style Safety Standards

Approval

PS9851-1 8-pin SSOP 20 pcs (Tape 20 pcs cut) Standard products Sn-Pb PS9851-1

PS9851-1-F3 (SO-8) Embossed Tape 1 500 pcs/reel (UL awaiting

PS9851-1-F4 approved)

PS9851-2 20 pcs (Tape 20 pcs cut) PS9851-2

PS9851-2-F3 Embossed Tape 1 500 pcs/reel

PS9851-2-F4

PS9851-1-V 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS9851-1

PS9851-1-V-F3 Embossed Tape 1 500 pcs/reel (VDE0884 Part2)

PS9851-1-V-F4 awaiting approved

PS9851-2-V 20 pcs (Tape 20 pcs cut) (Option) PS9851-2

PS9851-2-V-F3 Embossed Tape 1 500 pcs/reel

PS9851-2-V-F4

PS9851-1-A 20 pcs (Tape 20 pcs cut) Standard products Sn-Bi PS9851-1

PS9851-1-F3-A Embossed Tape 1 500 pcs/reel (UL awaiting

PS9851-1-F4-A approved)

PS9851-2-A 20 pcs (Tape 20 pcs cut) PS9851-2

PS9851-2-F3-A Embossed Tape 1 500 pcs/reel

PS9851-2-F4-A

PS9851-1-V-A 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS9851-1

PS9851-1-V-F3-A Embossed Tape 1 500 pcs/reel (VDE0884 Part2)

PS9851-1-V-F4-A awaiting approved

PS9851-2-V-A 20 pcs (Tape 20 pcs cut) (Option) PS9851-2

PS9851-2-V-F3-A Embossed Tape 1 500 pcs/reel

PS9851-2-V-F4-A

*1 For the application of the Safety Standard, following part number should be used.

Solder plating

specification

Application

Part Number

*1

Preliminary Data Sheet PN10493EJ01V0DS

3

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)

Parameter Symbol Ratings Unit

Forward Current IF 20 mA Diode

Reverse Voltage V

Detector

Isolation Voltage

Operating Ambient Temperature TA −40 to +100 °C

Storage Temperature Tstg −55 to +125 °C

Supply Voltage VDD 0 to 5.5 V

Output Voltage VO −0.5 to VDD+0.5 V

Output Current IO 2 mA

*1

BV 2 500 Vr.m.s.

R 5 V

*1 AC voltage for 1 minute at T

A = 25°C, RH = 60% between input and output.

RECOMMENDED OPERATING CONDITIONS (TA = 25°C)

Parameter Symbol MIN. TYP. MAX. Unit

PS9851-1,-2

Forward Current IF 10 16 mA

Supply Voltage VDD 4.5 5.0 5.5 V

4

Preliminary Data Sheet PN10493EJ01V0DS

PS9851-1,-2

ELECTRICAL CHARACTERISTICS (TA = −40 to +100°C, VDD = 4.5 to 5.5 V, unless otherwise
specified)

Parameter Symbol Conditions MIN. TYP.

*1

MAX. Unit

Diode

Forward Voltage VF IF = 10 mA, TA = 25°C 1.6 1.9 V

Reverse Current IR VR = 3 V, TA = 25°C 10

Terminal Capacitance C

Detector

High Level Supply Current IDDH IF = 0 mA (1ch) 3 5

Low Level Supply Current IDDL IF = 10 mA (1ch) 3 5

High Level Output Voltage

Low Level Output Voltage

Coupled

Threshold Input Current

Isolation Resistance RI-O

Isolation Capacitance CI-O

Propagation Delay Time

*2

(H → L)

Propagation Delay Time

*2

(L → H)

Pulse Width PW 100

Pulse Width Distortion

(PWD)

Propagation Delay Skew tPSK 40

Rise Time tr 3

Fall Time tf

Common Mode

Transient Immunity at

High Level Output

Common Mode

Transient Immunity at

Low Level Output

*1 Typical values at T

*3

*3

A = 25°C

µ

A

t V = 0 V, f = 1 MHz, TA = 25°C 30 pF

mA

V

OH IO = −20

OL IO = 20

V

I

FHL VO < 1 V 6 mA

PHL 35 60

t

µ

A, IF = 0 mA 4.0 5.0

µ

A, IF = 10 mA 0.01 0.1

I-O = 1 kVDC, RH = 40 to 60%,

V

A = 25°C

T

V = 0 V, f = 1 MHz, T

I

F = 10 mA, VDD = 5 V,

A = 25°C

11

10

0.9 pF

V

Ω

ns

CL = 15 pF, CMOS Levels

PLH 30 60

t

tPHL−tPLH 5 30

3

CM

CM

H

CM = 1 kV, VO > 4 V, TA = 25°C

V

DD = 5 V, IF = 10 mA,

V

L

CM = 1 kV, VO < 1 V, TA = 25°C

V

10 15

10 15

kV/

µ

s

DD = 5 V, IF = 0 mA,

V

Preliminary Data Sheet PN10493EJ01V0DS

5

*2 Test circuit for propagation delay time

PS9851-1

Pulse input (IF)
(PW = 100 ns,
Duty cycle = 50%)

Input
(Monitor)

47 Ω

PS9851-2

Pulse input (I

F)

Input
(Monitor)

47 Ω

Remark C

L includes probe and stray wiring capacitance.

*3 Test circuit for common mode transient immunity

VDD = 5 V

µ

0.1 F

CL = 15 pF

VDD = 5 V

µ

0.1 F

CL = 15 pF

VO (Monitor)

O (Monitor)

V

Input

Output

tPHL tPLH

PS9851-1,-2

IF = 10 mA
50%

2.5 V
V

OL

PS9851-1

V

DD

= 5 V

I

F

0.1 F

µ

SW

SW

V

CM

I

F

PS9851-2

V

0.1 F

µ

DD

= 5 V

VO (Monitor)

CL = 15 pF

VO (Monitor)

90%

V

CM

10%

VO
(I

F

= 0 mA)

O

V
(I

F

= 10 mA)

1 kV

0 V

t

r

t

f

OH

V

4 V

1 V

V

OL

CL = 15 pF

V

CM

Remark CL includes probe and stray wiring capacitance.

USAGE CAUTIONS

1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static

electricity when handling.

2. By-pass capacitor of more than 0.1

distance between the leads of the photocoupler and capacitor is no more than 10 mm.

3. Avoid storage at a high temperature and high humidity.

µ

F is used between VDD and GND near device. Also, ensure that the

6

Preliminary Data Sheet PN10493EJ01V0DS

TAPING SPECIFICATIONS (UNIT: mm)

Outline and Dimensions (Tape)

PS9851-1,-2

2.0±0.05

4.0±0.1

1.7±0.1

Taping Direction

PS9851-1-F3
PS9851-2-F3

8.0±0.1

1.5

+0.1
–0

6.4±0.1

1.75±0.1

5.5±0.1

12.0±0.2

4.05 MAX.

5.56±0.1

3.6±0.1

0.3±0.05

PS9851-1-F4
PS9851-2-F4

Outline and Dimensions (Reel)

2.0±0.5

13.0±0.2

φ

R 1.0

Packing: 1 500 pcs/reel

21.0±0.8

φ

100±1.0

330±2.0

φ

φ

13.0±0.2

φ

±0.5

2.0

13.5±1.0

17.5±1.0

11.9 to 15.4
Outer edge of

flange

Preliminary Data Sheet PN10493EJ01V0DS

7

PS9851-1,-2

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)

• Time of peak reflow temperature 10 seconds or less

• Time of temperature higher than 220°C 60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux with a

Recommended Temperature Profile of Infrared Reflow

maximum chlorine content of 0.2 Wt% is recommended.)

(heating)

to 10 s

260˚C MAX.
220˚C

to 60 s

180˚C

120˚C

Package Surface Temperature T (˚C)

120±30 s

(preheating)

Time (s)

(2) Wave soldering

• Temperature 260°C or below (molten solder temperature)

• Time 10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between

collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute

maximum ratings.

8

Preliminary Data Sheet PN10493EJ01V0DS

PS9851-1,-2

•

The information in this document is current as of May, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.

•

NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.

•

While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.

•

NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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and industrial robots

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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
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(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.

and also includes its majority-owned subsidiaries.

(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for

NEC (as defined above).

M8E 00. 4 - 0110

Preliminary Data Sheet PN10493EJ01V0DS

9

PS9851-1,-2

Caution GaAs Products

This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.

For further information, please contact

NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/

E-mail: [e-mail] (sales and general)
[e-mail] (technical)
5th Sales Group, Sales Division TEL: [phone] FAX: [phone]

NEC Compound Semiconductor Devices Hong Kong Limited

E-mail: [e-mail] (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office

NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: [phone] FAX: [phone]

California Eastern Laboratories, Inc. http://www.cel.com/
TEL: [phone] FAX: [phone]

TEL: [phone]
TEL: [phone]
TEL: [phone]

FAX: [phone]
FAX: [phone]
FAX: [phone]

0401