2.5 A OUTPUT CURRENT, HIGH CMR
IGBT GATE DRIVE PHOTOCOUPLER
8-PIN DIP PHOTOCOUPLER
DESCRIPTION
The PS9552, PS9552L1, PS9552L2 and PS9552L3 are optically coupled isolators containing a GaAlAs LED on the
input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9552 Series is designed specifically for high common mode transient immunity (CMR), high output current
and high switching speed.
The PS9552 Series is suitable for driving IGBTs and MOS FETs.
The PS9552 Series is in a plastic DIP (Dual In-line Package).
The PS9552L1 is lead bending type for long creepage distance.
The PS9552L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS9552L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
• Long creepage distance (8 mm MIN.: PS9552L1, PS9552L2)
• Large peak output current (2.5 A MAX., 2.0 A MIN.)
• High speed switching (t
• UVLO (Under Voltage Lock Out) protection with hysteresis
• High common mode transient immunity (CM
• Ordering number of tape product: PS9552L2-E3: 1 000 pcs/reel
: PS9552L3-E3: 1 000 pcs/reel
• Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391
• BSI approved: No. 8937, 8938
• SEMKO approved: No. 615433
• NEMKO approved: No. P06207243
• DEMKO approved: No. 314091
• FIMKO approved: No. FI 22827
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40019182 (Option)
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
PLH, tPHL = 0.5
μ
s MAX.)
H, CML = ±25 kV/
μ
s MIN.)
−NEPOC Series−
Document No. PN10589EJ06V0DS (6th edition)
Date Published October 2008 NS
Printed in Japan
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
The mark <R> shows major revised points.
2006, 2008
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS9552,PS9552L1,PS9552L2,PS9552L3
PS9552
9.25
+0.5
–0.25
85
41
+0.4
1.01
–0.2
3.5±0.2
0.5±0.15
2.54
Lead Bending Type (Gull-wing) For Surface Mount
7.62
6.5
0 to 15˚
+0.5
–0.1
+0.5
9.25
–0.25
85
41
+0.4
1.01
–0.2
3.5±0.2
0.5±0.15
2.54
PS9552L3
0.635±0.15
0.74±0.25
9.65±0.4
+0.5
6.5
–0.1
2
Data Sheet PN10589EJ06V0DS
PS9552,PS9552L1,PS9552L2,PS9552L3
Lead Bending Type For Long Creepage Distance
PS9552L1
9.25
+0.5
–0.25
85
10.16
6.5
+0.5
–0.1
1.01
+0.4
–0.2
41
3.5±0.2
0.5±0.15
2.54
0 to 15˚
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
+0.5
9.25
–0.25
+0.4
–0.2
2.54
5
41
11.8±0.4
+0.5
6.5
–0.1
0.25±0.2
0.9±0.25
8
1.01
3.5±0.2
0.5±0.15
PS9552L2
Data Sheet PN10589EJ06V0DS
3
FUNCTIONAL DIAGRAM
PS9552,PS9552L1,PS9552L2,PS9552L3
2
3
Input
H
L
MARKING EXAMPLE
(Tr. 1)
(Tr. 2)
SHIELD
LED
ONH
OFF
Tr. 1
ON
OFF
Tr. 2
OFF
ON
Output
8
7
6
5
L
No. 1 pin
Mark
9552
NT831
NT
8
In-house Code
Rank Code
31
Week Assembled
Year Assembled
(Last 1 Digit)
Type Number
Assembly Lot
PHOTOCOUPLER CONSTRUCTION
Parameter PS9552, PS9552L3 PS9552L1, PS9552L2
Air Distance (MIN.) 7 mm 8 mm
Outer Creepage Distance (MIN.) 7 mm 8 mm
Isolation Distance (MIN.) 0.4 mm 0.4 mm
4
Data Sheet PN10589EJ06V0DS
PS9552,PS9552L1,PS9552L2,PS9552L3
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
PS9552 PS9552-AX Pb-Free Magazine case 50 pcs Standard products PS9552
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
4
VCC = 30 V,
V
EE
3
= GND,
I
F
= 0 mA
(V)
OL
2
1
Low Level Output Voltage V
00.511.52.52
Low Level Output Current I
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
500
(ns)
PLH
– t
(ns),
PHL
PLH
, t
PHL
400
300
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
t
PLH
OL
(A)
PHL
t
200
100
0
Pulse Width Distortion (PWD) t
Propagation Delay Time t
681012141618
PWD
Forward Current IF (mA)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
500
(ns)
PLH
– t
400
(ns),
PHL
PLH
, t
PHL
300
200
100
0
Pulse Width Distortion (PWD) t
Propagation Delay Time t
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
VCC = 30 V, VEE = GND,
IF = 10 mA,
R
g
= 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
t
PLH
PHL
t
PWD
0–40–2020
406080100
PHL
t
200
100
0
Pulse Width Distortion (PWD) t
Propagation Delay Time t
15202530
PWD
Supply Voltage VCC (V)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
500
(ns)
PLH
– t
(ns),
400
PHL
PLH
, t
PHL
300
200
100
Pulse Width Distortion (PWD) t
Propagation Delay Time t
020
Load Capacitance Cg (nF)
CC
= 30 V, VEE = GND,
V
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
t
PLH
t
PHL
PWD
406080120100
12
Data Sheet PN10589EJ06V0DS
PS9552,PS9552L1,PS9552L2,PS9552L3
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
3.5
(mA),
(mA)
3
CCH
CCL
2.5
2
Low Level Supply Current I
High Level Supply Current I
1.5
–20020401008060–40
I
CCH
(IF = 10 mA)
I
CCL
(IF = 0 mA)
Ambient Temperature TA (˚C)
VCC = 30 V,
V
EE
= GND,
V
O
= OPEN
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
0
–1
VCC = 30 V, VEE = GND,
I
F
= 10 mA, IO = –100 mA
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
3.5
(mA),
(mA)
3
CCH
CCL
2.5
2
Low Level Supply Current I
High Level Supply Current I
1.5
15203025
Supply Voltage V
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
0.25
(V)
OL
0.20
I
CCH
(IF = 10 mA)
I
CCL
(IF = 0 mA)
CC
VCC = 30 V, VEE = GND,
I
F
= 0 mA, IO = 100 mA
VEE = GND,
O
= OPEN
V
(V)
(V)
–2
CC
– V
OH
–3
High Level Output Voltage – Supply
Voltage V
–4
–20020401008060–40
Ambient Temperature T
A
(˚C)
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3
(A)
OH
2.5
2
1.5
High Level Output Current I
1
–20020401008060–40
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
VCC = 30 V, VEE = GND,
I
F
= 10 mA, VCC–VO = 4 V
0.15
0.10
0.05
Low Level Output Voltage V
0
–20020401008060–40
Ambient Temperature TA (˚C)
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
4
(A)
OL
3
2
1
Low Level Output Current I
0
–20020401008060–40
Ambient Temperature TA (˚C)
VCC = 30 V, VEE = GND,
F
= 0 mA, VO = 2.5 V
I
Data Sheet PN10589EJ06V0DS
13
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
500
400
PHL, tPLH (ns),
300
200
100
0
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time t
0102030405060
Remark The graphs indicate nominal characteristics.
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
tPLH
t
PHL
PWD
Load Resistance Rg (Ω)
PS9552,PS9552L1,PS9552L2,PS9552L3
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
12
10
8
6
4
Output Voltage VO (V)
2
05101520
VUVLO–
(10.7 V)
Supply Voltage VCC – VEE (V)
UVLOHYS
VUVLO+
(12.3 V)
14
Data Sheet PN10589EJ06V0DS
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
PS9552,PS9552L1,PS9552L2,PS9552L3
2.0±0.1
4.0±0.1
2.05±0.05
Tape Direction
12.0±0.1
+0.1
1.5
–0
10.7±0.1
PS9552L2-E3
1.75±0.1
11.5±0.1
24.0±0.3
4.5 MAX.
12.8±0.1
4.1±0.1
0.3±0.05
Outline and Dimensions (Reel)
2.0±0.5
13.0±0.2
R 1.0
Packing: 1 000 pcs/reel
Data Sheet PN10589EJ06V0DS
21.0±0.8
330±2.0
100±1.0
2.0±0.5
25.5±1.0
29.5±1.0
23.9 to 27.4
Outer edge of
flange
15
Outline and Dimensions (Tape)
PS9552,PS9552L1,PS9552L2,PS9552L3
Tape Direction
2.0±0.1
4.0±0.1
1.55±0.1
12.0±0.1
PS9552L3-E3
1.5
+0.1
–0
10.3±0.1
1.75±0.1
7.5±0.1
16.0±0.3
5.3 MAX.
10.4±0.1
4.75±0.1
0.35±0.05
Outline and Dimensions (Reel)
R 1.0
Packing: 1 000 pcs/reel
2.0±0.5
13.0±0.2
21.0±0.8
330±2.0
100±1.0
2.0±0.5
17.5±1.0
21.5±1.0
15.9 to 19.4
Outer edge of
flange
16
Data Sheet PN10589EJ06V0DS
PS9552,PS9552L1,PS9552L2,PS9552L3
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
D
CB
Part Number
PS9552L2
PS9552L3
A
Lead Bending
lead bending type (Gull-wing)
for long creepage distance (surface mount)
lead bending type (Gull-wing)
for surface mount
A
10.2
8.2
B
2.54
2.54
C
1.7
1.7
D
2.2
2.2
Data Sheet PN10589EJ06V0DS
17
PS9552,PS9552L1,PS9552L2,PS9552L3
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
Package Surface Temperature T (˚C)
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
18
Data Sheet PN10589EJ06V0DS
PS9552,PS9552L1,PS9552L2,PS9552L3
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the
output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) In older to avoid malfunctions and characteristics degradation, IGBT collector or emitter traces should not be
closed to the LED input.
3. Make sure the rise/fall time of the forward current is 0.5
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/
5. Avoid storage at a high temperature and high humidity.
μ
F is used between VCC and GND near device. Also, ensure that the
μ
s or less.
μ
s or less.
Data Sheet PN10589EJ06V0DS
19
PS9552,PS9552L1,PS9552L2,PS9552L3
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Symbol Spec. Unit
Application classification (DIN EN 60664-1 VDE0110 Part 1)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.
IV
III
Climatic test class (DIN EN 60664-1 VDE0110) 55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
pr = 1.5 × UIORM, Pd< 5 pC
U
Test voltage (partial discharge test, procedure b for all devices)
pr = 1.875 × UIORM, Pd< 5 pC
U
IORM
U
Upr
U
pr 2 119 Vpeak
1 130
1 695
peak
V
Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110Part 1) 2
Clearance distance PS9552, PS9552L3 >7.0 mm
PS9552L1, PS9552L2 >8.0
Creepage distance PS9552, PS9552L3 >7.0 mm
PS9552L1, PS9552L2 >8.0
Comparative tracking index (DIN IEC 112/VDE 0303 Part 1) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg–55 to +125 °C
Operating temperature range TA–40 to +100 °C
Isolation resistance, minimum value
IO = 500 V dc at TA = 25°C
V
IO = 500 V dc at TA MAX. at least 100°C
V
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current I
F, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
IO = 500 V dc at TA = Tsi
V
Ris MIN.
Ris MIN.
Tsi
Isi
Psi
Ris MIN.
10
10
175
400
700
10
12
11
Ω
Ω
°C
mA
mW
9
Ω
20
Data Sheet PN10589EJ06V0DS
PS9552,PS9552L1,PS9552L2,PS9552L3
•
The information in this document is current as of October, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
•
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
•
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
•
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
•
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard":
"Special":
"Specific":
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2)
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PN10589EJ06V0DS
21
PS9552,PS9552L1,PS9552L2,PS9552L3
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
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