NEC PS8502, PS8502L1, PS8502L2, PS8502L3 DATA SHEET

DATA SHEET

PHOTOCOUPLER

PS8502,PS8502L1,PS8502L2,PS8502L3

HIGH SPEED ANALOG OUTPUT TYPE

8 mm CREEPAGE 8-PIN PHOTOCOUPLER

DESCRIPTION

The PS8502, PS8502L1, PS8502L2 and PS8502L3 are 8-pin high speed photocouplers containing a GaAIAs LED

on input side and a PN photodiode and a high speed amplifier transistor on output side on one chip. The PS8502 is in

a plastic DIP (Dual In-line Package) with 8 mm creepage distance product.

The PS8502L1 is lead bending type for long creepage distance.

The PS8502L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.

The PS8502L3 is lead bending type (Gull-wing) for surface mounting.

FEATURES

• Long creepage distance (8 mm MIN.: PS8502L1, PS8502L2)

• High common mode transient immunity (CM

• High supply voltage (V

• High speed response (t

CC = 35 V MAX.)

PHL, tPLH = 0.8

H, CML = ±15 kV/

μ

s MAX.)

μ

• High isolation voltage (BV = 5 000 Vr.m.s.)

• TTL, CMOS compatible with a resistor

• Ordering number of tape product: PS8502L2-E3: 1 000 pcs/reel

: PS8502L3-E3: 1 000 pcs/reel

• Pb-Free product

• Safety standards

• UL approved: File No. E72422

• CSA approved: No. CA 101391

• BSI approved: No. 8937, 8938

• SEMKO approved: No. 615433

• NEMKO approved: No. P06207243

• DEMKO approved: No. 314091

• FIMKO approved: No. FI 22827

• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)

APPLICATIONS

• Interface for measurement or control equipment

• Substitutions for relays and pulse transformers

• Modem, communications device

• General purpose inverter

s MIN.)

PIN CONNECTION

12 43

−NEPOC Series−

(Top View)

6587

1. NC

2. Anode

3. Cathode

4. NC

SHIELD

5. Emitter

6. V

7. NC

8. V

O

CC

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.

Document No. PN10657EJ03V0DS (3rd edition)
Date Published August 2008 NS
Printed in Japan

The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.

The mark <R> shows major revised points.

2007, 2008

PACKAGE DIMENSIONS (UNIT: mm)

DIP Type

+0.5

9.25

–0.25

PS8502,PS8502L1,PS8502L2,PS8502L3

PS8502

+0.4

1.01

–0.2

3.5±0.2

0.5±0.15

2.54

Lead Bending Type (Gull-wing) For Surface Mount

PS8502L3

9.25

+0.5
–0.25

7.62

6.5

0 to 15˚

+0.5
–0.1

2

3.5±0.2

0.5±0.15

1.01

+0.4
–0.2

2.54

0.635±0.15

0.74±0.25

Data Sheet PN10657EJ03V0DS

9.65±0.4

+0.5

6.5

–0.1

PS8502,PS8502L1,PS8502L2,PS8502L3

Lead Bending Type For Long Creepage Distance

PS8502L1

+0.5

9.25

–0.25

+0.4

1.01

–0.2

3.5±0.2

10.16

6.5

+0.5
–0.1

0.5±0.15

2.54

0 to 15˚

Lead Bending Type For Long Creepage Distance (Gull-wing) For Surface Mount

PS8502L2

11.8±0.4

+0.5

6.5

–0.1

9.25

+0.5
–0.25

1.01

+0.4
–0.2

3.5±0.2

0.5±0.15

2.54

0.25±0.2

0.9±0.25

Data Sheet PN10657EJ03V0DS

3

PS8502,PS8502L1,PS8502L2,PS8502L3

<R>

MARKING EXAMPLE

No. 1 pin
Mark

8502

N 831

N

8

31

Week Assembled

Year Assembled
(Last 1 Digit)

In-house Code

(L or T)

Rank Code

PHOTOCOUPLER CONSTRUCTION

Parameter PS8502, PS8502L3 PS8502L1, PS8502L2

Type Number
Assembly Lot

Air Distance (MIN.) 7 mm 8 mm

Outer Creepage Distance (MIN.) 7 mm 8 mm

Isolation Distance (MIN.) 0.4 mm 0.4 mm

4

Data Sheet PN10657EJ03V0DS

PS8502,PS8502L1,PS8502L2,PS8502L3

ORDERING INFORMATION

Part Number Order Number Solder Plating

Specification

PS8502 PS8502-AX Pb-Free Magazine case 50 pcs Standard products PS8502

PS8502L1 PS8502L1-AX (Ni/Pd/Au) (UL, CSA, BSI, PS8502L1

PS8502L2 PS8502L2-AX SEMKO, NEMKO, PS8502L2

PS8502L3 PS8502L3-AX DEMKO, FIMKO PS8502L3

PS8502L2-E3 PS8502L2-E3-AX Embossed Tape 1 000 pcs/reel approved) PS8502L2

PS8502L3-E3 PS8502L3-E3-AX PS8502L3

PS8502-V PS8502-V-AX Magazine case 50 pcs DIN EN60747-5-2 PS8502

PS8502L1-V PS8502L1-V-AX (VDE0884 Part2) PS8502L1

PS8502L2-V PS8502L2-V-AX Approved (Option) PS8502L2

PS8502L3-V PS8502L3-V-AX PS8502L3

PS8502L2-V-E3 PS8502L2-V-E3-AX

PS8502L3-V-E3 PS8502L3-V-E3-AX PS8502L3

Embossed Tape 1 000 pcs/reel PS8502L2

*1 For the application of the Safety Standard, following part number should be used.

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)

Parameter Symbol Ratings Unit

Packing Style Safety Standard

Approval

Application Part

Number*

1

Diode Forward Current *1 IF 25 mA

Reverse Voltage VR 5 V

Detector

Output Voltage VO 35 V

Output Current IO 8 mA

Power Dissipation

Isolation Voltage *3 BV 5 000 Vr.m.s.

Operating Ambient Temperature TA −55 to +100 °C

Storage Temperature Tstg −55 to +125 °C

Supply Voltage VCC 35 V

*2

PC 100 mW

*1 Reduced to 0.33 mA/°C at T

*2 Reduced to 2.0 mW/°C at T

*3 AC voltage for 1 minute at T

A = 70°C or more.

A = 75°C or more.

A = 25°C, RH = 60% between input and output.

Pins 1-4 shorted together, 5-8 shorted together.

Data Sheet PN10657EJ03V0DS

5

PS8502,PS8502L1,PS8502L2,PS8502L3

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Parameter Symbol Conditions MIN. TYP.*1 MAX. Unit

Diode Forward Voltage VF IF = 16 mA 1.7 2.2 V

Reverse Current IR VR = 3 V 10

Forward Voltage

Δ

VF/ΔTA IF = 16 mA −2.1 mV/°C

Temperature Coefficent

Terminal Capacitance Ct V = 0 V, f = 1 MHz 60 pF

Detector High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V 3 500 nA

High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 35 V 100

Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 2.4 mA 0.15 0.4 V

Low Level Supply Current ICCL IF = 16 mA, VO = Open, VCC = 35 V 150

High Level Supply Current ICCH IF = 0 mA, VO = Open, VCC = 35 V 0.01 1

Coupled Current Transfer Ratio CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 15 %

Isolation Resistance RI-O VI-O = 1 kVDC 1011

Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.7 pF

Propagation Delay Time tPHL IF = 16 mA, VCC = 5 V, RL = 1.9 kΩ 0.22 0.8 μs

(H → L)*2

Propagation Delay Time tPLH IF = 16 mA, VCC = 5 V, RL = 1.9 kΩ 0.35 0.8 μs

(L → H)*2

Common Mode

Transient Immunity at High
Level Output

*3

Common Mode

Transient Immunity at Low
Level Output

*3

H IF = 0 mA, VCC = 5 V, VCM = 1.5 kV,

CM

L = 4.1 kΩ

R

L IF = 16 mA, VCC = 5 V, VCM = 1.5 kV,

CM

L = 4.1 kΩ

R

15 kV/

−15 kV/

μ

A

μ

A

μ

A

μ

A

Ω

μ

s

μ

s

6

Data Sheet PN10657EJ03V0DS

PS8502,PS8502L1,PS8502L2,PS8502L3

*1 Typical values at TA = 25°C

*2 Test circuit for propagation delay time

Remark C

*3 Test circuit for common mode transient immunity

Remark C

USAGE CAUTIONS

1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static

2. By-pass capacitor of more than 0.1

3. Avoid storage at a high temperature and high humidity.

Pulse Input

PW = 100 s

(

Duty Cycle = 1/10

μ

F Monitor

I

IF

18

)

27

36

45

51 Ω

SHIELD

0.1

μ

F

V

CC = 5 V

RL

(Monitor)

O

V

CL = 15 pF

Input

Output

tPHL tPLH

L includes probe and stray wiring capacitance.

10%90%

V

I

F

27

36

45

SHIELD

L includes probe and stray wiring capacitance.

18

0.1
F

μ

R

L

(Monitor)

O

V

CL = 15 pF

V

CM

VCC = 5 V

CM

10% 90%

r

t

V

O

(IF = 0 mA)

V

O

F

= 16 mA)

(I

electricity when handling.

μ

F is used between VCC and GND near device. Also, ensure that the

distance between the leads of the photocoupler and capacitor is no more than 10 mm.

t

f

V

CM

0 V

5 V

2 V

0.8 V
V

OL

= 1.5 kV

50%

5 V

1.5 V
V

OL

Data Sheet PN10657EJ03V0DS

7

PS8502,PS8502L1,PS8502L2,PS8502L3

TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)

MAXIMUM FORWARD CURRENT

vs. AMBIENT TEMPERATURE

30

DETECTOR POWER DISSIPATION

vs. AMBIENT TEMPERATURE

120

25

20

15

10

5

Maximum Forward Current IF (mA)

0 25 50 75 100 125

Ambient Temperature TA (˚C)

FORWARD CURRENT vs.

FORWARD VOLTAGE

100

10

TA = +100˚C

1.0

0.1

Forward Current IF (mA)

+85˚C
+50˚C
+25˚C

0˚C
–20˚C
–40˚C

100

80

60

40

20

Detector Power Dissipation PC (mW)

0 25 50 75 100 125

Ambient Temperature T

A (˚C)

OUTPUT CURRENT vs.

OUTPUT VOLTAGE

12

10

Output Current IO (mA)

8

6

4

2

IF = 25 mA

20 mA

15 mA

10 mA

5 mA

0.01

1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4

Forward Voltage V

F (V)

CURRENT TRANSFER RATIO

vs. FORWARD CURRENT

50

VCC = 4.5 V,

O = 0.4 V

40

30

20

10

Current Transfer Ratio CTR (%)

0

0.1 0.5 1 5 10 50 100

Forward Current I

Remark The graphs indicate nominal characteristics.

8

V

F (mA)

Data Sheet PN10657EJ03V0DS

048 1820162 6 10 12 14

Output Voltage V

O (V)

NORMALIZED CURRENT TRANSFER

RATIO vs. AMBIENT TEMPERATURE

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

Normalized Current Transfer Ratio CTR

0.0
–75 –50 –25 0 25 50 75 100 125

Ambient Temperature TA (˚C)

Normalized to 1.0
at T

A = 25˚C,

F = 16 mA, VCC = 4.5 V,

I

O = 0.4 V

V

PS8502,PS8502L1,PS8502L2,PS8502L3

(V)

O

Output Voltage V

( s)

PLH

, t

PHL

OUTPUT VOLTAGE vs.

FORWARD CURRENT

7

6

5

4

3

RL = 1.9 kΩ

2

12 kΩ

5.5 kΩ

4826

10

12

1

0

Forward Current I

PROPAGATION DELAY TIME,
vs. LORD RESISTANCE

10

VCC = 5 V,
I

F

= 16 mA

t

PLH

F

(mA)

14

VCC = 5 V

V

I

F

16

CC

18

HIGH LEVEL OUTPUT CURRENT
vs. AMBIENT TEMPERATURE

1 000

IF = 0 mA

L

R

(nA)

OH

100

VCC = VO = 35 V
V

CC

= VO = 5.5 V

10

1

High Level Output Current I

20

0.1

50 100–25 0 25 75

Ambient Temperature TA (˚C)

PROPAGATION DELAY TIME,
vs. AMBIENT TEMPERATURE

3.0

VCC = 5 V,

( s)

I

F

= 16 mA,

2.5

PLH

R

L

, t

PHL

= 1.9 kΩ

2.0

1

t

PHL

Propagation Delay Time t

0.1
1

10

100

Load Resistance RL (kΩ)

Remark The graphs indicate nominal characteristics.

1.5

1.0

t

0.5

Propagation Delay Time t

0.0

–50 –25 0 25 50 75 100 125

PLH

t

PHL

Ambient Temperature TA (˚C)

Data Sheet PN10657EJ03V0DS

9

TAPING SPECIFICATIONS (UNIT: mm)

Outline and Dimensions (Tape)

PS8502,PS8502L1,PS8502L2,PS8502L3

2.0±0.1

4.0±0.1

2.05±0.05

Tape Direction

12.0±0.1

+0.1

1.5

–0

10.7±0.1

PS8502L2-E3

1.75±0.1

11.5±0.1

24.0±0.3

4.5 MAX.

12.8±0.1

4.1±0.1

0.3±0.05

10

Outline and Dimensions (Reel)

2.0±0.5

13.0±0.2

R 1.0

Packing: 1 000 pcs/reel

Data Sheet PN10657EJ03V0DS

21.0±0.8

330±2.0

100±1.0

2.0±0.5

25.5±1.0

29.5±1.0

23.9 to 27.4
Outer edge of

flange

Outline and Dimensions (Tape)

PS8502,PS8502L1,PS8502L2,PS8502L3

Tape Direction

2.0±0.1

4.0±0.1

1.55±0.1

12.0±0.1

PS8502L3-E3

1.5

+0.1
–0

10.3±0.1

1.75±0.1

7.5±0.1

16.0±0.3

5.3 MAX.

10.4±0.1

4.75±0.1

0.35±0.05

Outline and Dimensions (Reel)

R 1.0

Packing: 1 000 pcs/reel

2.0±0.5

13.0±0.2

21.0±0.8

330±2.0

100±1.0

2.0±0.5

17.5±1.0

21.5±1.0

15.9 to 19.4
Outer edge of

flange

Data Sheet PN10657EJ03V0DS

11

PS8502,PS8502L1,PS8502L2,PS8502L3

RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)

D

CB

Part Number

PS8502L2

PS8502L3

A

Lead Bending

lead bending type (Gull-wing)
for long creepage distance (surface mount)

lead bending type (Gull-wing)
for surface mount

A

10.2

8.2

B

2.54

2.54

C

1.7

1.7

D

2.2

2.2

12

Data Sheet PN10657EJ03V0DS

PS8502,PS8502L1,PS8502L2,PS8502L3

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)

• Time of peak reflow temperature 10 seconds or less

• Time of temperature higher than 220°C 60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

260˚C MAX.
220˚C

to 60 s

180˚C

120˚C

Package Surface Temperature T (˚C)

120±30 s

(preheating)

Time (s)

(2) Wave soldering

• Temperature 260°C or below (molten solder temperature)

• Time 10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by soldering iron

• Peak temperature (lead part temperature) 350°C or below

• Time (each pins) 3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.

(b) Please be sure that the temperature of the package would not be heated over 100°C.

Data Sheet PN10657EJ03V0DS

13

<R>

PS8502,PS8502L1,PS8502L2,PS8502L3

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between

collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute

maximum ratings.

USAGE CAUTIONS

1. Protect against static electricity when handling.

2. Avoid storage at a high temperature and high humidity.

14

Data Sheet PN10657EJ03V0DS

PS8502,PS8502L1,PS8502L2,PS8502L3

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT

Parameter Symbol Speck Unit

Application classification (DIN EN 60664-1 VDE0110 Part 1)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.

IV
III

Climatic test class (DIN EN 60664-1 VDE0110) 55/100/21

Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)

pr = 1.5 × UIORM, Pd < 5 pC

U

Test voltage (partial discharge test, procedure b for all devices)

pr = 1.875 × UIORM, Pd < 5 pC

U

IORM

U

Upr

U

pr 2 119 Vpeak

1 130
1 695

peak

V
Vpeak

Highest permissible overvoltage UTR 8 000 Vpeak

Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2

Clearance distance >8.0 mm

Creepage distance >8.0 mm

Comparative tracking index (DIN IEC 112/VDE 0303 Part 1) CTI 175

Material group (DIN EN 60664-1 VDE0110 Part 1) III a

Storage temperature range Tstg –55 to +125 °C

Operating temperature range TA –55 to +100 °C

Isolation resistance, minimum value

IO = 500 V dc at TA = 25°C

V

IO = 500 V dc at TA MAX. at least 100°C

V

Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current I

F, Psi = 0)

Power (output or total power dissipation)
Isolation resistance
V

IO = 500 V dc at TA = Tsi

Ris MIN.
Ris MIN.

Tsi

Isi

Psi

Ris MIN.

10
10

175
400
700

10

12

11

Ω
Ω

°C

mA

mW

9

Ω

Data Sheet PN10657EJ03V0DS

15

PS8502,PS8502L1,PS8502L2,PS8502L3

•

The information in this document is current as of August, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without the prior

•

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative

•

purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer­designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.

"Standard":

"Special":

"Specific":

Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.

(Note)
(1)

"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.

(2)

"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).

M8E 02. 11-1

16

Data Sheet PN10657EJ03V0DS

PS8502,PS8502L1,PS8502L2,PS8502L3

Caution GaAs Products

This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.