Low-frequency oscillation mode: main system clock frequency = internal clock frequency
•
Low-power consumption mode: CPU can operate with a subsystem clock.
•
Supply voltage range: VDD = +2.7 to 5.5 V
•
Hardware watch function: watch operation at low voltage (VDD = 2.7 V (MIN.)) and low current consumption
•
PD784927 is described in detail in the following User’s Manual. Be sure to read this
Part Number
µ
PD784927, 784927YµPD784928, 784928Y
Unless otherwise specified, the
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. U12255EJ2V0DS00 (2nd edition)
Date Published December 1999 N CP(K)
Printed in Japan
µ
PD784927 is treated as the representative model throughout this document.
4 levels (programmable), vectored interrupt, macro service, context switching
9 (including NMI)
22 (including software interrupt)23 (including software interrupt)
HALT mode/STOP mode/low power consumption mode/low power consumption HALT mode
STOP mode can be released by input of valid edge of NMI pin, watch interrupt (INTW), or INTP1/
3.1.2 Other CPU registers................................................................................................................... 20
3.2Memory Space ...................................................................................................................................... 2 1
3.3Special Function Registers (SFRs) ................................................................................................... 2 4
3.6Super Timer Unit ..................................................................................................................................35
3.9VCR Analog Circuits............................................................................................................................45
3.10 Watch Function .................................................................................................................................... 50
3.11 Clock Output Function ........................................................................................................................51
3.12 Buzzer Output Function ...................................................................................................................... 5 2
4. INTERNAL/EXTERNAL CONTROL FUNCTION ........................................................................... 53
4.1Interrupt Function ................................................................................................................................53
4.4Reset Function ..................................................................................................................................... 65
5. INSTRUCTION SET ........................................................................................................................ 66
select register (IMS)
IC pinProvidedNot provided
VPP pinNot providedProvided
Electrical characteristicsRefer to the Data Sheet of each product.
µ
PD784927,
µ
PD784927Y
96K bytes128K bytes
µ
PD784928,
µ
PD784928Y
µ
PD78F4928,
µ
PD78F4928Y
12
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
2. PIN FUNCTION
2.1 Port Pins
Pin NameI/OShared with:Function
P00-P07I/OReal-time8-bit I/O port (port 0).
output port• Can be set in input or output mode in 1-bit units.
• Can be connected with software pull-up resistors.
P20InputNMI4-bit I/O port (port 2).
P21-P23INTP0-INTP2• Can be connected with software pull-up resistors (P22 and P23 only).
P30-P32I/OPTO00-PTO028-bit I/O port (port 3).
P33SI2/BUSY• Can be set in input or output mode in 1-bit units.
P34SO2• Can be connected with software pull-up resistors.
P35SCK2
P36, P37PWM1, PWM0
P40-P47I/O—8-bit I/O port (port 4).
• Can be set in input or output mode in 1-bit units.
• Can be connected with software pull-up resistors.
• Can directly drive LED.
P50-P57I/O—8-bit I/O port (port 5).
• Can be set in input or output mode in 1-bit units.
• Can be connected with software pull-up resistors.
P60I/OSTRB/CLO8-bit I/O port (port 6).
P61SCK1/BUZ• Can be set in input or output mode in 1-bit units.
P62SO1• Can be connected with software pull-up resistors.
P63SI1
P64DFGMON/BUZ
P65DPGMON/HWIN
P66CFGMON/PWM4
P67CTLMON/PWM5
P70-P77InputANI0-ANI78-bit input port (port 7)
P80I/OReal-timePseudo VSYNC output7-bit I/O port (port 8).
P82output portHASW output• Can be set in input or output mode
P83ROTC outputin 1-bit units.
P84PWM2/SDA
P85PWM3/SCL
P86PTO10
P87PTO11
P90I/OENV7-bit I/O port (port 9).
P91-P95KEY0-KEY4• Can be set in input or output mode in 1-bit units.
P96—• Can be connected with software pull-up resistors.
P100InputDPGIN4-bit input port (port 10).
P101REEL1IN
P102REEL0IN/INTP3
P103CSYNCIN
P110-P113InputANI8-ANI114-bit input port (port 11).
Note
Note
• Can be connected with software
pull-up resistors.
Note Pins SCL and SDA are provided for the µPD784928Y subseries only.
Data Sheet U12255EJ2V0DS00
13
µ
PD784927, 784928, 784927Y, 784928Y
2.2 Pins Other Than Port Pins (1/2)
Pin NameI/OShared with:Function
REEL0INInputP102/INTP3Reel FG input
REEL1INP101
DFGIN—Drum FG, PFG input (ternary)
DPGINP100Drum PG input
CFGIN—Capstan FG input
CSYNCINP103Composite SYNC input
CFGCPIN—CFG comparator input
CFGAMPOOutput—CFG amplifier output
PTO00OutputP30Programmable timer output of super timer unit
PTO01P31
PTO02P32
PTO10P86
PTO11P87
PWM0OutputP37PWM output of super timer unit
PWM1P36
PWM2P84/SDA
PWM3P85/SCL
PWM4P66/CFGMON
PWM5P67/CTLMON
HASWOutputP82Head amplifier switch signal output
ROTCOutputP83Chrominance rotation signal output
ENVInputP90Envelope signal input
SI1InputP63Serial data input (serial interface channel 1)
SO1OutputP62Serial data output (serial interface channel 1)
SCK1I/OP61/BUZSerial clock I/O (serial interface channel 1)
SI2InputP33/BUSYSerial data input (serial interface channel 2)
SO2OutputP34Serial data output (serial interface channel 2)
SCK2I/OP35Serial clock I/O (serial interface channel 2)
BUSYInputP33/SI2Serial busy signal input (serial interface channel 2)
STRBOutputP60/CLOSerial strobe signal output (serial interface channel 2)
SDAI/OP84/PWM2I2C bus data I/O
SCLI/OP85/PWM3I2C bus clock I/O
ANI0-ANI7Analog inputP70-P77Analog signal input of A/D converter
ANI8-ANI11P110-P113
CTLIN——CTL amplifier input capacitor connection
CTLOUT1Output—CTL amplifier output
CTLOUT2I/O—Logic signal input/CTL amplifier output
RECCTL+, RECCTL–I/O—RECCTL signal output/PBCTL signal input
CTLDLY——External time constant connection (for RECCTL rewriting)
Note
Note
Note Pins SCL and SDA are provided for the µPD784928Y subseries only.
14
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
2.2 Pins Other Than Port Pins (2/2)
Pin NameI/OShared with:Function
VREFC——VREF amplifier AC connection
DFGMONOutputP64/BUZDrum FG signal output
DPGMONP65/HWINDrum PG signal output
CFGMONP66/PWM4CFG signal output
CTLMONP67/PWM5CTL signal output
NMIInputP20Non-maskable interrupt request input
INTP0-INTP2InputP21-P23External interrupt request input
INTP3InputP102/REEL0IN
KEY0-KEY4InputP91-P95Key input signal input
CLOOutputP60/STRBClock output
BUZOutputP61/SCK1Buzzer output
P64/DFGMON
HWINInputP65/DPGMONExternal input of hardware watch counter
RESETInput—Reset input
X1Input—Crystal connection for main system clock oscillation
X2—
XT1Input—Crystal connection for subsystem clock oscillation.
XT2—Crystal connection for watch clock oscillation
AVDD1——Positive power supply to analog amplifier circuit
AVDD2——Positive power supply to A/D converter and analog circuits input buffer
AVSS1——GND of analog amplifier circuit
AVSS2——GND of A/D converter and analog circuits input buffer
AVREF——Reference voltage input to A/D converter
VDD——Positive power supply to digital circuits
VSS——GND of digital circuits
IC——Internally connected. Directly connect this pin to VSS.
Data Sheet U12255EJ2V0DS00
15
µ
PD784927, 784928, 784927Y, 784928Y
2.3 I/O Circuits of Pins and Processing of Unused Pins
Table 2-1 shows the types of the I/O circuits of the respective pins and processing of the unused pins. Figure
2-1 shows the circuits of the respective types.
Table 2-1. I/O Circuits of Respective Pins and Processing of Unused Pins (1/2)
PinI/O Circuit TypeI/ORecommended Connection of Unused Pins
P00-P075-AI/OInput: Connect to VDD.
Output: Leave unconnected.
P20/NMI2InputConnect to VDD.
P21/INTP0Connect to VDD or VSS.
P22/INTP1, P23/INTP22-AConnect to VDD.
P30/PTO00-P32/PTO025-AI/OInput: Connect to VDD.
P33/SI2/BUSY8-AOutput: Leave unconnected.
P34/SO25-A
P35/SCK28-A
P36/PWM1, P37/PWM05-A
P40-P47
P50-P57
P60/STRB/CLO
P61/SCK1/BUZ8-A
P62/SO15-A
P63/SI18-A
P64/DFGMON/BUZ5-A
P65/HWIN/DPGMON8-A
P66/PWM4/CFGMON5-A
P67/PWM5/CTLMON
P70/ANI0-P77/ANI79InputConnect to VSS.
P805-AI/OInput: Connect to VDD.
P82/HASWOutput: Leave unconnected.
P83/ROTC
P84/PWM2/SDA
P85/PWM3/SCL
P86/PTO105-A
P87/PTO11
P90/ENV
P91/KEY0-P95/KEY48-A
P965-A
Note
Note
10-A
Note Pins SCL and SDA are provided for the µPD784928Y subseries only.
16
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 2-1. I/O Circuits of Respective Pins and Processing of Unused Pins (2/2)
PinI/O Circuit TypeI/ORecommended Connection of Unused Pins
P100/DPGIN—InputWhen ENDRUM = 0 or ENDRUM = 1 and
SELPGSEPA = 0: Connect to VSS.
P101/REEL1INWhen ENREEL = 0: Connect to VSS.
P102/REEL0IN/INTP3
P103/CSYNCINWhen ENCSYN = 0: Connect to VSS.
P110/ANI8-P113/ANI119InputConnect to VSS.
RECCTL+, RECCTL–—I/OWhen ENCTL = 0 and ENREC = 0: Connect to VSS.
DFGIN—InputWhen ENDRUM = 0: Connect to VSS.
CFGIN, CFGCPINWhen ENCAP = 0: Connect to VSS.
CTLOUT1—OutputLeave unconnected.
CTLOUT2—I/OWhen ENCTL = 0 and ENCOMP = 0: Connect to VSS.
When ENCTL = 1: Leave unconnected.
CFGAMPO—OutputLeave unconnected.
CTLIN——When ENCTL = 0: Leave unconnected.
VREFC
CTLDLYLeave unconnected.
AVDD1, AVDD2——Connect to VDD.
AVREF, AVSS1, AVSS2Connect to VSS.
RESET2——
XT1——Connect to VSS.
XT2Leave unconnected.
When ENCTL = 0 and ENCAP = 0 and ENCOMP = 0: Leave unconnected.
ICDirectly connect to VSS.
Remark ENCTL: bit 1 of amplifier control register (AMPC)
ENREC: bit 7 of amplifier mode register 0 (AMPM0)
ENDRUM: bit 2 of amplifier control register (AMPC)
SELPGSEPA: bit 2 of amplifier mode register 0 (AMPM0)
ENCAP: bit 3 of amplifier control register (AMPC)
ENCSYN: bit 5 of amplifier control register (AMPC)
ENREEL: bit 6 of amplifier control register (AMPC)
ENCOMP: bit 4 of amplifier control register (AMPC)
Data Sheet U12255EJ2V0DS00
17
µ
PD784927, 784928, 784927Y, 784928Y
Figure 2-1. I/O Circuits of Respective Pins
Type 2
IN
Schmitt trigger input with hysteresis characteristics
Type 2-A
V
DD
P-ch
Pull-up
enable
IN
Schmitt trigger input with hysteresis characteristics
Type 5-A
V
DD
Pull-up
enable
Data
Output
disable
V
P-ch
N-ch
P-ch
DD
IN/
OUT
Type 8-A
Pull-up
enable
Data
Output
disable
Type 9
IN
Type 10-A
Pull-up
Enable
P-ch
N-ch
DD
V
P-ch
N-ch
Comparator
+
-
V
REF
(Threshold voltage)
Input enable
V
P-ch
DD
IN/
OUT
V
DD
P-ch
Input
enable
Data
Open drain
Output disable
V
DD
P-ch
IN/OUT
N-ch
18
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3. INTERNAL BLOCK FUNCTION
3.1 CPU Registers
3.1.1 General-purpose registers
µ
PD784927 has eight banks of general-purpose registers. One bank consists of sixteen 8-bit general-purpose
The
registers. Two of these 8-bit registers can be used in pairs as a 16-bit register. Four of the 16-bit general-purpose
registers can be used to specify a 24-bit address in combination with an 8-bit address expansion register.
These eight banks of general-purpose registers can be selected by software or context switching function.
The general-purpose registers, except for the address expansion registers V, U, T, and W, are mapped to the
internal RAM.
Figure 3-1. Configuration of General-Purpose Register
A (R1)X (R0)
AX (RP0)
B (R3)C (R2)
BC (RP1)
R5R4
RP2
R7R6
RP3
R9R8V
VP (RP4)
VVP (RG4)
R11R10U
UP (RP5)
UUP (RG5)
D (R13)E (R12)T
DE (RP6)
TDE (RG6)
H (R15)L (R14)W
HL (RP7)
WHL (RG7)
( ): absolute name
8 banks
Caution Although R4, R5, R6, R7, RP2, and RP3 can be used as X, A, C, B, AX, and BC registers,
respectively, by setting the RSS bit of PSW to 1, do not use this function. The function of the
RSS bit is planned to be deleted from the future models in the 78K/IV Series.
Data Sheet U12255EJ2V0DS00
19
3.1.2 Other CPU registers
(1) Program counter
The program counter of the
updated as the program is executed.
(2) Program status word
This is a register that holds the various statuses of the CPU. Its contents are automatically updated as the
program is executed.
µ
PD784927, 784928, 784927Y, 784928Y
µ
PD784927 is 20 bits wide. The value of the program counter is automatically
190
PC
12111098
PSWH UF15RBS214RBS113RBS0
PSW
PSWLS7Z
6
RSS
5AC4IE3
Note
0
P/V201CY
Note The RSS flag is provided to maintain compatibility with the microcomputers in the 78K/III Series.
Always clear this flag to 0 except when the software of the 78K/III Series is used.
(3) Stack pointer
This is a 24-bit pointer that holds the first address of the stack.
Be sure to write 0 to the high-order 4 bits.
230
000200SP
20
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.2 Memory Space
A memory space of 1M bytes can be accessed. The mapping of the internal data area (special function registers
and internal RAM) can be selected by using the LOCATION instruction. The LOCATION instruction must be always
executed after reset has been cleared, and cannot be used more than once.
(1) When LOCATION 0H instruction is executed
Part NumberInternal Data AreaInternal ROM Area
µ
PD784927, 784927Y0F700H-0FFFFH00000H-0F6FFH
10000H-17FFFH
µ
PD784928, 784928Y0F100H-0FFFFH00000H-0F0FFH
10000H-1FFFFH
Remark The area of the internal ROM overlapping the internal data area cannot be used when the
LOCATION 0 instruction is executed.
Part NumberUnusable Area
µ
PD784927, 784927Y0F700H-0FFFFH (2304 bytes)
µ
PD784928, 784928Y0F100H-0FFFFH (3840 bytes)
(2) When LOCATION 0FH instruction is executed
Part NumberInternal Data AreaInternal ROM Area
µ
PD784927, 784927YFF700H-FFFFFH00000H-17FFFH
µ
PD784928, 784928YFF100H-FFFFFH00000H-1FFFFH
Data Sheet U12255EJ2V0DS00
21
µ
(256 bytes)
Special function registers (SFRs)
Internal ROM
(63232
bytes)
Internal RAM
(2048 bytes)
Cannot be used
General-purpose registers
(128 bytes)
Macro service control
word area (54 bytes)
Data area (512 bytes)
Program/data area
(1536 bytes)
Note 2
CALLF entry area
(2K bytes)
Program/data area
Note 3
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
Internal RAM
(2048 bytes)
Cannot be used
Internal ROM
(96K bytes)
Note 4
When LOCATION 0H instruction is executed
Note 1
When LOCATION 0FH instruction is executed
Internal ROM
(32768 bytes)
FFFFFH
18000H
17FFFH
10000H
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0F700H
0F6FFH
00000H
0FEFFH
0FE80H
0FE7FH
0FE3BH
0FE06H
0FD00H
0FCFFH
0F700H
17FFFH
10000H
0F6FFH
01000H
00800H
007FFH
00080H
0007FH
00040H
0003FH
00000H00000H
17FFFH
18000H
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
FF6FFH
FF700H
FFEFFH
FFE80H
FFE7FH
FFE3BH
FFE06H
FFD00H
FFCFFH
FF700H
17FFFH
Special function registers (SFRs)
(256 bytes)
Note 4
Note 1
00FFFH
PD784927, 784928, 784927Y, 784928Y
PD784927, 784927Y
µ
Figure 3-2. Memory Map of
2. The 2304 bytes in this area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. When LOCATION 0H instruction is executed: 96000 bytes, when LOCATION 0FH instruction is executed: 98304 bytes
4. Base area or entry area for reset or interrupt. Excluding the internal RAM for reset.
Notes 1. Accessed in external memory expansion mode
22
Data Sheet U12255EJ2V0DS00
µ
(256 bytes)
Special function registers (SFRs)
Internal ROM
(61696
bytes)
Internal RAM
(3584 bytes)
Cannot be used
General-purpose registers
(128 bytes)
Macro service control
word area (54 bytes)
Data area (512 bytes)
Program/data area
(3072 bytes)
Note 2
CALLF entry area
(2K bytes)
Program/data area
Note 3
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
Internal RAM
(3584 bytes)
Cannot be used
Internal ROM
(128K bytes)
Note 4
When LOCATION 0H instruction is executed
Note 1
When LOCATION 0FH instruction is executed
Internal ROM
(65536 bytes)
FFFFFH
20000H
1FFFFH
10000H
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0F100H
0F0FFH
00000H
0FEFFH
0FE80H
0FE7FH
0FE3BH
0FE06H
0FD00H
0FCFFH
0F100H
1FFFFH
10000H
0F0FFH
01000H
00800H
007FFH
00080H
0007FH
00040H
0003FH
00000H00000H
1FFFFH
20000H
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
FF0FFH
FF100H
FFEFFH
FFE80H
FFE7FH
FFE3BH
FFE06H
FFD00H
FFCFFH
FF100H
1FFFFH
Special function registers (SFRs)
(256 bytes)
Note 4
Note 1
00FFFH
PD784927, 784928, 784927Y, 784928Y
PD784928, 784928Y
µ
Figure 3-3. Memory Map of
2. The 3840 bytes in this area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. When LOCATION 0H instruction is executed: 127232 bytes, when LOCATION 0FH instruction is executed: 131072 bytes
4. Base area or entry area for reset or interrupt. Excluding the internal RAM for reset.
Notes 1. Accessed in external memory expansion mode
Data Sheet U12255EJ2V0DS00
23
µ
PD784927, 784928, 784927Y, 784928Y
3.3 Special Function Registers (SFRs)
Special function registers are assigned special functions and mapped to a 256-byte space of addresses FF00H
through FFFFH. These registers include mode registers and control registers that control the internal peripheral
hardware units.
Caution Do not access an address to which no SFR is assigned. If such an address is accessed by
µ
mistake, the
Table 3-1 lists the special function registers (SFRs). The meanings of the symbols in this table are as follows:
• Symbol .................................... Abbreviation of an SFR. This abbreviation is reserved for NEC’s assembler
• R/ W ......................................... Indicates whether the SFR in question can be read or written.
PD784927 may be deadlocked. This deadlock can be cleared only by reset input.
(RA78K4). With a C compiler (CC78K4), the abbreviation can be used as sfr
variable by the #pragma sfr instruction.
R/W : Read/write
R: Read only
W: Write only
• Bit length................................. Indicates the bit length (word length) of the SFR.
• Bit units for manipulation ....... Indicates bit units in which the SFR in question can be manipulated. An SFR that
can be manipulated in 16-bit units can be used as the operand sfrp of an
instruction. Specify an even address to manipulate this SFR.
An SFR that can be manipulated in 1-bit units can be used for a bit manipulation
instruction.
• After clearing reset ................. Indicates the status of each register immediately after clearing reset.
Caution The addresses shown in Table 3-1 are used when the LOCATION 0H instruction is executed. Add
“F0000H” to the address values shown in the table when the LOCATION 0FH instruction is
executed.
24
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (1/5)
AddressSpecial Function Register (SFR) NameSymbolR/WBitBit Units for Manipulation After Clearing
Length1 bit8 bits 16 bitsReset
FF00H Port 0P0R/W8—Undefined
FF02H Port 2P2R8—
FF03H Port 3P3R/W8—
FF04H Port 4P48—
FF05H Port 5P58—
FF06H Port 6P68—
FF07H Port 7P7R8—
FF08H Port 8P8R/W8—
FF09H Port 9P98—
FF0AH Port 10P10R8—
FF0BH Port 11P118—
FF0EH Port 0 buffer register LP0LR/W8—
FF20H Port 0 mode registerPM08—FFH
FF23H Port 3 mode registerPM38—
FF24H Port 4 mode registerPM48—
FF25H Port 5 mode registerPM58—
FF26H Port 6 mode registerPM68—
FF28H Port 8 mode registerPM88—FDH
FF29H Port 9 mode registerPM98—7FH
FF2EH Real-time output port 0 control registerRTPC8—00H
Note These registers are provided for the µPD784928Y subseries only.
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
Data Sheet U12255EJ2V0DS00
27
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (4/5)
AddressSpecial Function Register (SFR) NameSymbolR/WBitBit Units for Manipulation After Clearing
Length1 bit8 bits 16 bitsReset
FFA4H VISS detection circuit up/down counter registerVUDCR/W8——00H
FFA5H VUDC value setting registerVUDST8——
FFA6H Key interrupt control registerKEYC8—70H
FFA7H VISS pulse pattern setting registerVPS8——00H
FFA8H In-service priority registerISPRR8—
FFAAH Interrupt mode control registerIMCR/W8—80H
FFACH Interrupt mask flag registerMK0L
FFADHMK0H8
FFAEHMK1L
FFAFHMK1H8
FFB0H FRC capture register 0LCPT0LR16——Cleared to 0
FFB1H FRC capture register 0HCPT0H8——
FFB2H FRC capture register 1LCPT1L16——
FFB3H FRC capture register 1HCPT1H8——
FFB4H FRC capture register 2LCPT2L16——
FFB5H FRC capture register 2HCPT2H8——
FFB6H FRC capture register 3LCPT3L16——
FFB7H FRC capture register 3HCPT3H8——
FFB8H FRC capture register 4LCPT4L16——
FFB9H FRC capture register 4HCPT4H8——
FFBAH FRC capture register 5LCPT5L16——
FFBBH FRC capture register 5HCPT5H8——
FFBDH VSYNC separation circuit control registerVSCR/W8—00H
FFBEH
FFBFH VSYNC separation circuit compare registerVSCMP8——FFH
FFC0H Standby control registerSTBC8——0011×000
FFC4H Execution speed select registerMMW8——20H
FFCEH CPU clock status registerPCSR8—00H
FFCFH
FFE0H Interrupt control register (INTP0)PIC0R/W8—43H
FFE1H Interrupt control register (INTCPT3)CPTIC38—
FFE2H Interrupt control register (INTCPT2)CPTIC28—
FFE3H Interrupt control register (INTCR12)CRIC128—
FFE4H Interrupt control register (INTCR00)CRIC008—
FFE5H Interrupt control register (INTCLR1)CLRIC18—
FFE6H Interrupt control register (INTCR10)CRIC108—
V
SYNC
separation circuit up/down counter register
Oscillation stabilization time specification register
MK0
MK1
VSUDC8——
OSTSW8——
8FFH
8
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
28
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (5/5)
AddressSpecial Function Register (SFR) NameSymbolR/WBitBit Units for Manipulation After Clearing
Length1 bit8 bits 16 bitsReset
FFE7H Interrupt control register (INTCR01)CRIC01R/W8—43H
FFE8H Interrupt control register (INTCR02)CRIC028—
FFE9H Interrupt control register (INTCR11)CRIC118—
FFEAH Interrupt control register (INTCPT1)CPTIC18—
FFEBH Interrupt control register (INTCR20)CRIC208—
FFECH Interrupt control register (INTIIC)
FFEDH Interrupt control register (INTTB)TBIC8—
FFEEH Interrupt control register (INTAD)ADIC8—
FFEFH Interrupt control register (INTP2)
Interrupt control register (INTCR40)
FFF0H Interrupt control register (INTUDC)UDCIC8—
FFF1H Interrupt control register (INTCR30)CRIC308—
FFF2H Interrupt control register (INTCR50)CRIC508—
FFF3H Interrupt control register (INTCR13)CRIC138—
FFF4H Interrupt control register (INTCSI1)CSIIC18—
FFF5H Interrupt control register (INTW)WIC8—×1000011
FFF6H Interrupt control register (INTVISS)VISIC8—43H
FFF7H Interrupt control register (INTP1)PIC18—
FFF8H Interrupt control register (INTP3)PIC38—
FFFAH Interrupt control register (INTCSI2)CSIIC28—
Note 1
Note 2
Note 2
IICIC8—
PIC28—
CRIC40
Notes 1.µPD784928Y subseries only.
2. PIC2 and CRIC40 are at the same address (register).
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
Data Sheet U12255EJ2V0DS00
29
µ
PD784927, 784928, 784927Y, 784928Y
3.4 Ports
The µPD784927 is provided with the ports shown in Figure 3-3. Table 3-2 shows the function of each port.
Figure 3-4. Port Configuration
Port 0
Port 2
Port 3
Port 4
Port 5
P00
P07
P20
P23
P30
P37
P40
P47
P50
P57
P60
P67
P70-P77
P80
P82
P87
P90
P96
P100
P103
P110
P113
Port 6
8
Port 7
Port 8
Port 9
Port 10
Port 11
Table 3-2. Port Function
NamePin NameFunctionSpecification of Pull-up Resistor
Port 0P00-P07Can be set in input or output mode inPull-up resistors are connected to all
1-bit units.pins in input mode.
Port 2P20-P23Input portPull-up resistors are connected to pins
P22 and P23.
Port 3P30-P37Can be set in input or output mode inPull-up resistors are connected to all pins
1-bit units.in input mode.
Port 4P40-P47Can be set in input or output mode in
1-bit units.
Can directly drive LED.
Port 5P50-P57Can be set in input or output mode in
Port 6P60-P671-bit units.
Port 7P70-P77Input portPull-up resistor is not provided.
Port 8P80, P82-P87Can be set in input or output mode inPull-up resistors are connected to all pins
Port 9P90-P961-bit units.in input mode.
Port 10P100-P103Input portPull-up resistor is not provided.
Port 11P110-P113
30
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.5 Real-Time Output Port
A real-time output port consists of a port output latch and a buffer register (refer to Figure 3-5).
The function to transfer the data prepared in advance in the buffer register to the output latch when a trigger such
as a timer interrupt occurs, and output the data to an external device is called a real-time output function. A port used
in this way is called a real-time output port (RTP).
µ
Table 3-3 shows the real-time output ports of the
PD784927.
Table 3-4 shows the trigger sources of RTPs.
Figure 3-5. Configuration of RTP
Buffer register
Output trigger
Port output latch
Port
Table 3-3. Bit Configuration of RTP
RTPShared with:Number of Bits ofNumber of Bits That CanRemark
2. When the real-time output port mode is set by the port mode control register 8 (PMC8), the HASW and
ROT-C signals that are set by the head amplifier switch output control register (HAPC) are directly
output. The HASW and ROT-C signals are synchronized with HSW output (TM0-CR00 coincidence
signal). However, the set signal is output immediately when the HAPC register is rewritten.
Data Sheet U12255EJ2V0DS00
31
µ
PD784927, 784928, 784927Y, 784928Y
Figures 3-6 and 3-7 show the block diagrams of RTP0 and RTP8. Figure 3-8 shows the types of RTP output trigger
sources.
Figure 3-6. Block Diagram of RTP0
Internal bus
844
Real-time output port 0
control register (RTPC)
INTP0
INTCR01
INTCR02
Output trigger
Control circuit
Remark INTCR01: TM0-CR01 coincidence signal
INTCR02: TM0-CR02 coincidence signal
Figure 3-7. Block Diagram of RTP8
8
Head amplifier output control register (HAPC)
SEL
SEL
SEL
00
ROTC
ENV
HASW
PB
MOD2PBMOD1PBMOD0
Buffer register
P0HP0L
44
Output latch (P0)
P07P00
Internal bus
8
Port 8 buffer register L (P8L)
0
P8L4
SEL
P8L20P8L0
MD80
00
8
8
32
TM0-CR00
coincidence signal
PMC80
0
PMC82
PMC83
PMC8
TRG
P80
HASW, ROT-C
control circuit
Output latch (P8)
HSYNC
superimposition
circuit
P83P82P80
Data Sheet U12255EJ2V0DS00
Pseudo V
SYNC
control circuit
output
INTP0
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-8. Types of RTP Output Trigger Sources
Real-time output port 0
control register (RTPC)
Capture
TM0
CR00
CR01
CR02
TM1
CR10
CR11
CR12
CR13
TM5
Interrupt and
timer output
Interrupt and
timer output
Interrupt
Selector
Selector
Trigger source select
register 0 (TRGS0)
Trigger of P0H
Trigger of P0L
Trigger of P82 and P83
Trigger of P80
CR50
Interrupt
Data Sheet U12255EJ2V0DS00
33
µ
PD784927, 784928, 784927Y, 784928Y
RTP80 can output low-level, high-level, and high-impedance values real-time.
Because RTP80 can superimpose a horizontal sync signal, it can be used to create pseudo vertical sync signal.
When RTP80 is set in the pseudo V
SYNC output mode, it repeatedly outputs a specific pattern when an output trigger
occurs.
Figure 3-9 shows the operation timing of RTP80.
Figure 3-9. Example of Operation Timing of RTP80
High impedance
P80
Trigger signal
High impedance
P80
Trigger signal
High level
Low level
High level
Low level
(a) When H
SYNC signal is superimposed
(b) Pseudo VSYNC output mode
34
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.6 Super Timer Unit
The µPD784927 is provided with a super timer unit that consists of the timers, and VCR special circuits such as
a VISS detection circuit and a V
SYNC separation circuit, etc., shown in Table 3-5.
Table 3-5. Configuration of Super Timer Unit
Unit Name Timer/CounterResolution
Timer 0TM01 µs65.5 msCR00Controls delay of video head switching signal
(16-bit timer)CR01Controls delay of audio head switching signal
EC——ECC0, ECC1,Creates internal head switching signal
(8-bit counter)ECC2, ECC3
FreeFRC125 ns524 msCPT0Detects reference phase (to control drum phase)
running(22-bit counter)CPT1Detects phase of drum motor (to control drum
counterphase)
Timer 1TM11 µs65.5 msCR10Playback: Creates internal reference signal
(16-bit timer)Recording: Buffer oscillator in case VSYNC is
TM31 µs or65.5 ms orCR30, CR31Controls duty detection timing of PBCTL signal
(16-bit timer)1.1 µs71.5 msCPT30Measures cycle of PBCTL signal
EDV——EDVCDivides CFG signal frequency
(8-bit counter)
Timer 2TM21 µs65.5 msCR20Can be used as interval timer (to control system)
(16-bit timer)
Timer 4TM42 µs131 msCR40Detects duty of remote controller signal (to decode
(16-bit timer)remote controller signal)
Timer 5TM52 µs131 msCR50Can be used as interval timer (to control system)
Timer 0 unit creates head switching signal and pseudo VSYNC output timing from the PG and FG signals of the
drum motor.
This unit consists of an event counter (EC: 8 bits), compare registers (ECC0 through ECC3), a timer (TM0:
16 bits), and compare registers (CR00 through CR02).
A signal indicating coincidence between the value of timer 0 and the value of a compare register can be used
as the output trigger of the real-time output port.
(2) Free running counter unit
The free running counter unit detects the speed and phase of the drum motor, and the speed and reel speed
of the capstan motor.
This unit consists of a free running counter (FRC), capture registers (CPT0 through CPT5), a V
circuit, and a HSYNC separation circuit.
(3) Timer 1 unit
Timer 1 unit is a reference timer unit synchronized with the frame cycle and creates the RECCTL signal, detects
the phase of the capstan motor, and detects the duty factor of the PBCTL signal. This unit consists of the
following three groups:
SYNC separation
• Timer 1 (TM1), compare registers (CR10, CR11, and CR13), and capture register (CR12)
• Timer 3 (TM3), compare registers (CR30 and CR31), and capture register (CPT30)
• Event divider counter (EDV) and compare register (EDVC)
The TM1-CR13 coincidence signal can be used for automatic unmasking of V
the real-time output port.
SYNC or as the output trigger of
36
Data Sheet U12255EJ2V0DS00
PTO00
PTO01
PTO02
µ
PD784927, 784928, 784927Y, 784928Y
PTO10
PTO11
To PBCTL signal
input block
INTCR00
INTCR01
INTCR02
RTP
RTP, A/D
RTP, A/D
Output control circuit
Selector
SelectorSelector
Clear
TM0
Mask
Figure 3-10. Block Diagram of Super Timer Unit (TM0, FRC, TM1)
Selector
Divider
Writes
00H to EC
Output control circuit
Output control circuit
(Superimposition)(Superimposition)
ECC2
ECC1
separation
SYNC
H
F/F
ECC0
CR00
CR01
Selector
Selector
Clear
EC
Selector
CR02
F/F
ECC3
To P80
circuit
separation
SYNC
V
INTCLR1
FRC
Selector
circuit
Selector
Analog circuit
INTCPT1
CPT0
CPT1
Capture
Capture
Selector
Mask
INTCPT2
INTCPT3
CPT2
CPT3
Capture
Selector
INTP3
CPT4
CPT5
Capture
Capture
Capture
SelectorSelector
INTCR10
Output control circuit
Selector
Clear
TM1
Selector
EDV
Clear
EDVC
INTCR11
INTCR12
INTCR13
INTCR30
Output control circuit
CR10
CR11
CR12
CR13
CR30
CR31
Selector
FFLVL
CTL
CPT30
Capture
Capture
Clear
TM3
Selector
F/F
DPGIN
DFGIN
CSYNCIN
Data Sheet U12255EJ2V0DS00
REEL0IN
REEL1IN
CFGIN
PTO10
PBCTL
PTO11
37
µ
PD784927, 784928, 784927Y, 784928Y
(4) Timer 2 unit
Timer 2 unit is a general-purpose 16-bit timer unit.
This unit consists of a timer (TM2) and a compare register (CR20).
The timer is cleared when the TM2-CR20 coincidence signal occurs, and at the same time, an interrupt request
is generated.
Figure 3-11. Block Diagram of Timer 2 Unit
Clear
TM2
CR20
INTCR20
(5) Timer 4 unit
Timer 4 unit is a general-purpose 16-bit timer unit.
This unit consists of a timer (TM4), a capture/compare register (CR40), and a capture register (CR41).
The value of the timer is captured to CR40/CR41 when the INTP2 signal is input. This timer can be used to
decode a remote controller signal.
Figure 3-12. Block Diagram of Timer 4 Unit
Mask
Clear
TM4
INTP2
Selector
CR40
CR41
INTCR40
(6) Timer 5 unit
Timer 5 unit is a general-purpose 16-bit timer unit.
This unit consists of a timer (TM5) and a compare register (CR50).
The timer is cleared by the TM5-CR50 coincidence signal, and at the same time, an interrupt request is
generated.
38
Figure 3-13. Block Diagram of Timer 5 Unit
Clear
TM5
CR50
Data Sheet U12255EJ2V0DS00
INTCR50
RTP, A/D
µ
PD784927, 784928, 784927Y, 784928Y
(7) Up/down counter unit
The up/down counter unit is a counter that realizes a linear time counter.
This unit consists of an up/down counter (UDC) and a compare register (UDCC).
The up/down counter counts up the rising edges of PBCTL and counts down the falling edges of PBCTL. When
the value of the up/down counter coincides with the value of the compare register, or when the counter
underflows, an interrupt request is generated.
Figure 3-14. Block Diagram of Up/Down Counter Unit
SELUD
PTO10
PTO11
PBCTL
Selector
P77
EDVC output
Selector
SelectorSelector
UP/DOWN
UDC
UDCC
INTUDC
(8) PWM output unit
The PWM output unit has three 16-bit accuracy output lines (PWM0, PWM1, and PWM5) and 8-bit accuracy
output lines (PWM2 through PWM4). The carrier frequency of all the output lines is 62.5 kHz (f
CLK = 8 MHz).
PWM0 and PWM1 can be used to control the drum motor and capstan motor.
Figure 3-15. Block Diagram of 16-Bit PWM Output Unit
(n = 0, 1, 5)
Internal bus
168
PWMn
158 70
PWMC0
16 MHz
Reload
8-bit down counter
1/256
88
Reload
Reload control
PWM pulse
generation circuit
8-bit counter
Data Sheet U12255EJ2V0DS00
To selector
Output control
circuit
PWMn
RESET
39
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-16. Block Diagram of 8-Bit PWM Output Unit
Internal bus
PWM2
8-bit comparator
16 MHz
(9) VISS detection circuit
Figure 3-17. Block Diagram of VISS Detection Circuit
PBCTL
PWM3
8-bit comparator
PWM counter
PWM4
8-bit comparator
PWMC1
Output control
circuit
Output control
circuit
Output control
circuit
PWM4
PWM3
PWM2
CFG signal
CLK
/16
f
f
CLK
/64
CLK
/256
f
Selector
VPS
(VISS pulse pattern
setting register)
UP/DOWN
VUDC
(8-bit up/down counter)
VISS malfunction
prevention circuit
VSFT0
(shift register 0)
(VUDC value
setting register)
VCMP
(compare register)
VUDST
VSFT1
(shift register 1)
Coincidence
INTVISS
40
Data Sheet U12255EJ2V0DS00
(10) VSYNC separation circuit
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-18. Block Diagram of V
C
SYNC
signal
f
CLK
/4
VSUDC
(8-bit up/down
CLK
/8
f
Selector
counter)
VSCMP
(8-bit compare
register)
"00"
SYNC Separation Circuit
Digital noise rejection circuit
V
SYNC
F/F
S
Q
R
Selector
V
3.7 Serial Interface
The µPD784927 is provided with the serial interfaces shown in Table 3-6.
Data can be automatically transmitted or received through these serial interfaces, when the macro service is used.
SYNC
Table 3-6. Types of Serial Interfaces
NameFunction
Serial interface channel 1• Clocked serial interface (3-wire)
Figure 3-19. Block Diagram of Serial Interface Channel n (n = 1 or 2)
SIn /BUSY
SOn
Selector
µ
PD784927, 784928, 784927Y, 784928Y
Internal bus
SIOn registerCSIMn register
Serial clock counter
INTCSIn
SCKn
f
CLK
/8
f
CLK
/16
CLK
/32
f
f
CLK
/64
f
CLK
/128
CLK
/256
f
STRB
Busy detection circuit
Strobe generation circuit
Selector
CSIC2 register
Internal bus
Remark The circuits enclosed in the broken line are provided to serial interface channel 2 only.
42
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(2) Serial interface channel 3 (µPD784928Y subseries only)
This channel transfers 8-bit data with multiple devices using two lines: serial clock (SCL) and serial data bus
(SDA).
2
It conforms to the I
C bus format, and can output a “start condition”, “data”, and “stop condition” onto the serial
data bus during transmission. This data is automatically detected by hardware during reception.
SCL and SDA are open-drain output pins and therefore, must be connected with a pull-up resistor.
Figure 3-20. Serial Interface Channel 3
DD
+V
DD
+V
Master CPU1
Slave CPU1
SDA
SCL
Serial data bus
Serial clock
SDA
SCL
SDA
SCL
SDA
SCL
SDA
SCL
Master CPU2
Slave CPU2
Address 1
Slave CPU3
Address 2
Slave IC
Address 3
Slave IC
Address N
Data Sheet U12255EJ2V0DS00
43
µ
PD784927, 784928, 784927Y, 784928Y
3.8 A/D Converter
The µPD784927Y has an analog-to-digital (A/D) converter with 12 multiplexed analog inputs (ANI0 through ANI11).
This A/D converter is of successive approximation type, and the conversion result is held by an 8-bit A/D conversion
µ
result register (ADCR) (conversion time: 10
A/D conversion can be started in the following two modes:
• Hardware start : Conversion is started by a hardware trigger
• Software start : Conversion is started by setting a bit of the A/D converter mode register (ADM).
After conversion has been started, the A/D converter operates in the following modes:
• Scan mode : Sequentially selects more than one analog input to obtain data to be converted from all the pins.
• Select mode: Use only one pin for analog input to obtain successive data to be converted.
When the conversion result is transferred to ADCR, interrupt request INTAD is generated. By processing this
interrupt with the macro service, the conversion result can be successively transferred to memory.
A mode in which starting A/D conversion of the next pin is kept pending until the value of ADCR is read is also
available. When this ode is used, reading the conversion result by mistake when timing is shifted because an interrupt
is disabled can be prevented.
s at fCLK = 8 MHz).
Note
.
Note A hardware trigger is the following coincidence signals, one of which is selected by the trigger source select
The CTL amplifier is used to amplify the playback control (PBCTL) signal that is reproduced from the CTL signal
recorded on a VCR tape.
The gain of the CTL amplifier is set by the gain control register (CTLM). Thirty-two types of gains can be set
in increments of about 1.78 dB.
µ
PD784927 is also provided with a gain control signal generation circuit that monitors the status of the
The
amplifier output to perform optimum gain control by software. The gain control signal generation circuit
generates a CTL detection flag that identifies the amplitude status of the CTL amplifier output. By using this
CTL detection flag, the gain of the CTL amplifier can be optimized.
The RECCTL driver writes a control signal onto a VCR tape.
This driver operates in two modes: REC mode that is used for recording, and rewrite mode used to rewrite
the VISS signal. The output status of the RECCTL± pin is changed by hardware, by using the timer output
from the super timer unit as a trigger.
Figure 3-22. Block Diagram of CTL Amplifier and RECCTL Driver
ANI11
CTLDLY
TOM1.4-TOM1.6
CTL head
CTLOUT1
CTLOUT2
RECCTL+
RECCTL
CTLIN
TM1-CR11 coincidence signal
RECCTL driver
V
REF
AMPC. 1
+
-
AMPC. 1
+
-
CTLM. 0-CTLM. 4
Gain control signal
generation circuit
Waveform
shaping circuit
TM1-CR13 coincidence signal
TM3-CR30 coincidence signal
Selector
CTL detection flag L (AMPM0. 1)
CTL detection flag S (AMPM0. 3)
CTL detection flag clear
(1 write to AMPM0. 6)
PBCTL signal (to timer unit)
CTLMON (to P67
46
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(2) DPG amplifier, DFG amplifier, and DFPG separation circuit
The DPG amplifier converts the drum PG (DPG) signal that indicates the phase information of the drum motor
into a logic signal.
The DFG amplifier amplifies the drum FG (DFG) signal that indicates the speed information of the drum motor.
The DPFG separation circuit (ternary separation circuit) separates a drum PFG (DPFG) signal having speed
and phase information into a DFG and DPG signals.
Figure 3-23. Block Diagram of DPG Amplifier, DFG Amplifier, and DPFG Separation Circuit
AMPC.7
REF
V
AMPM0.0
Drum PG signal
DPGIN
0 : ON
REF
V
+
–
DPG amplifier
AMPC.2
DPG
comparator
AMPM0.2
1
0
Selector
AMPC.2
1
0
Selector
DPG signal
(to timer unit)
DPGMON
(to P65)
Drum FG signal or
drum PFG signal
AMPM0.0
DFGIN
VREFVREF
AMPM0.2
10
AMPC.2
+
DFG amplifier
–
AMPC.2
DPFG separation
circuit (ternary
separation circuit)
AMPM0.2
AMPM0.2
1
0
Selector
AMPC.2
1
0
Selector
DFG signal
(to timer unit)
DFGMON
(to P64)
Data Sheet U12255EJ2V0DS00
47
µ
PD784927, 784928, 784927Y, 784928Y
(3) CFG amplifier
The CFG amplifier amplifies the capstan FG (CFG) signal that indicates the speed information of the capstan
motor. This amplifier consists of an operational amplifier and a comparator. The gain of the operational
amplifier is set by using an external resistor.
When the gain of the operational amplifier is set to 50 dB, the output duty accuracy of the CFG signal can be
improved to 50.0 ± 0.3%.
Figure 3-24. Block Diagram of CFG Amplifier
V
REF
AMPC.3
+
CFG amplifier
Capstan FG signal
CFGIN
CFGAMPO
CFGCPIN
AMPM0.0
-
V
REF
AMPC.3
+
CFG
comparator
AMPC.3
1
0
Selector
CFG signal
(to timer unit)
CFGMON
(to P66)
(4) Reel FG comparators
The reel FG comparator converts a reel FG signal that indicates the speed information of the reel motor into
a logic signal. Two comparators, one for take-up and the other for supply, are provided.
Figure 3-25. Block Diagram of Reel FG Comparators
V
REF
48
Supply reel signal
Take-up reel signal
AMPM0.0
REEL0IN
AMPM0.0
REEL1IN
AMPC.6
Reel FG comparator
V
REF
AMPC.6
Reel FG comparator
Data Sheet U12255EJ2V0DS00
1
SelectorSelector
0
AMPC.6
1
0
Reel FG0 signal
(to timer unit)
Reel FG1 signal
(to timer unit)
µ
PD784927, 784928, 784927Y, 784928Y
(5) CSYNC comparator
The CSYNC comparator converts the COMPSYNC signal into a logic signal.
Figure 3-26. Block Diagram of COMPSYNC Comparator
V
REF
AMPM1.7
AMPC.5
AMPM0.0
COMP
SYNC
signal
CSYNCIN
CSYNC comparator
(6) Reference amplifier
The reference amplifier generates a reference voltage (V
REF) to be supplied to the internal amplifiers and
comparators of the µPD784927.
AMPC.5
1
0
Selector
SYNC
signal
C
(to timer unit)
VREFC
Figure 3-27. Block Diagram of Reference Amplifier
AV
AV
DD1
SS1
+
+
+
+
ENCAP (AMPC.3)
V
REF
(CFG amplifier)
V
REF
(CFG amplifier)
ENCTL (AMPC.1)
V
REF
(CTL amplifier)
ENDRUM (AMPC.2)
ENREEL (AMPC.6)
ENCSYN (AMPC.5)
V
REF
DFG amplifier, DPG comparator,
reel FG comparator, and CSYNC
comparator)
Remark Multiple reference amplifiers are provided to assure the accuracy of the amplifiers and comparators.
Data Sheet U12255EJ2V0DS00
49
µ
PD784927, 784928, 784927Y, 784928Y
(7) Analog circuit monitor function
This function is to output the following signals to port pins, and is mainly used for debugging.
PD784927 has a watch function that counts the overflow signals of the watch timer by hardware. As the clock,
The
the subsystem clock (32.768 kHz) is used.
Because this watch function is independent of the CPU, it can be used even while the CPU is in the standby mode
(STOP mode) or is reset. In addition, this function can be used at a low voltage of V
DD = 2.7 V (MIN.).
Therefore, by using only the watch function with the CPU set in the standby mode or reset, a watch operation can
be performed at a low voltage and low current consumption.
In addition, the watch function can also be used while the CPU is in the normal operation mode, because a dedicated
counter is provided.
The watch function can be used to count up to about 17 years of data.
The hardware watch counters (HW0 and HW1) are shared with external input counters. These counters execute
counting at the falling edge of input to the P65 pin, and can be used to count the H
SYNC signals.
P65
(32.768 kHz)
f
Figure 3-28. Block Diagram of Watch Counter
P65
WM.2
(enables/disables operation)
XT
013
Watch timer
Normal
Fast
forward
0
1
WM.1
WM.5
WM.4
1
0
SelectorSelector
WM.7
WM.2
PM65
PMC65
CMS5
Edge detection
Pin level read
015013
HW0HW1
Selector
Subclock
BUZ signal
WM.2
Selector
WM.6
WM.2
(enables/disables operation)
To NMI generation block
INTW
50
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.11 Clock Output Function
The µPD784927 can output a square wave (with a duty factor of 50%) to the P60/STRB/CLO pin as the operating
clock for the peripheral devices or other microcomputers. To enable or disable the clock output, and to set the
frequency of the clock, the clock output mode register (CLOM) is used.
When setting the frequency, the division ratio can be set to f
CLK/n (where n = 1, 2, 4, 8, 16, 32, 64, or 128) (fCLK
= fOSC/2: fOSC is the oscillation frequency of the resonator).
Figure 3-29 shows the block diagram of the clock output circuit.
The clock output (CLO) pin is shared with P60 and STRB.
Figure 3-29. Block Diagram of Clock Output Circuit
CLK
f
CLK
/2
f
f
CLK
/4
f
CLK
/8
f
CLK
/16
f
CLK
/32
f
CLK
/64
f
CLK
/128
Remark f
CLOM
Selector
P60
(Output latch)
CLK: internal system clock
CLOM7 CLOM6 CLOM5 ENCLO0
1
0
Selector
RESET
SELFRQ2 SELFRQ1 SELFRQ0
P60/STRB/CLO
Caution Do not use the clock output function in the STOP mode. Clear ENCLO (CLOM.4) to 0 in the STOP
mode.
Figure 3-30. Application Example of Clock Output Function
PD784927
µ
System clock
CLO
SCK1
SI1
SO1
PD7503A
µ
CL1
SCK
SO
SI
LCD
24
Data Sheet U12255EJ2V0DS00
51
µ
PD784927, 784928, 784927Y, 784928Y
3.12 Buzzer Output Function
The BUZ signal can be superimposed on P61 or P64.
The buzzer output frequency can be generated from the subsystem clock frequency or main system clock
frequency.
Figure 3-31 shows the block diagram of the BUZ output circuit.
The BUZ signal can be also used for trimming the subsystem clock.
Figure 3-31. Block Diagram of BUZ Output Circuit
WM4
WM5
2.048 kHz
CMS4
WM7
4.096 kHz
32.768 kHz
CLK
/512
f
f
CLK
/1024
f
CLK
/2048
CLK
/4096
f
CLOM5
CLOM6
SelectorSelector
0
1
CLOM7
Selector
P61
(Output latch)
BUZ
output
P64
(Output latch)
BUZ
output
0
P61/BUZ
SelectorSelector
1
0
P64/BUZ
1
52
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
4. INTERNAL/EXTERNAL CONTROL FUNCTION
4.1 Interrupt Function
The µPD784927 has as many as 32 interrupt sources, including internal and external sources. For 28 sources,
a high-speed interrupt processing mode such as context switching or macro service can be specified by software.
11INTCR20 TM2-CR20 coincidence signalCRIC20FE1CH001CH
12INTIICEnd of I2C bus transferIICIC
13INTTBTime base from FRCTBICFE20H0020H
14INTADA/D converter conversion endADICFE22H0022H
15INTP2INTP2 pin input edgePIC2FE24H0024H
INTCR40 TM4-CR40 coincidence signalCRIC40
16INTUDC UDC-UDCC coincidence/UDC underflowUDCICFE26H0026H
17INTCR30 TM3-CR30 coincidence signalCRIC30FE28H0028H
18INTCR50 TM5-CR50 coincidence signalCRIC50FE2AH002AH
19INTCR13 TM1-CR13 coincidence signalCRIC13FE2CH002CH
20INTCSI1 End of serial transfer (channel 1)CSIIC1FE2EH002EH
21INTWOverflow of watch timerWICFE30H0030H
22INTVISS VISS detection signalVISICFE32H0032H
23INTP1INTP1 pin input edgePIC1FE34H0034H
24INTP3INTP3 pin input edgePIC3FE36H0036H
25INTCSI2 End of serial transfer (channel 2)CSIIC2FE3AH003AH
——Execution of BRKCS instruction—Yes——
Interrupt Request Source
(CR12 capture)
(CPT1 capture)
Interrupt
Control
Register
Name
Note
MacroContext
Switching Control Word
Macro Service
AddressAddress
FE1EH001EH
Vector
Table
NoteµPD784928Y subseries only.
Remark EVDC : Event divider compare register
EC: Event counter
FRC: Free running counter
MSCW : Macro service control register
54
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Figure 4-1. Differences in Operation Depending on Interrupt Processing Mode
Macro service
Context
switching
Vectored
interrupt
Note 1
Note 1
Vectored interrupt
Main
routine
Main
routine
Main
routine
Main
routine
Macro service
processing
Note 2
Note 4
Note 4
SEL
RBn
Saving
general-purpose
register
Main routine
Interrupt
processing
Interrupt
processing
Initializing
general-purpose
register
Note 3
Interrupt
processing
Main routine
Restoring
PC and
PSW
Main routine
Restoring
general-purpose
register
Restoring
PC and
PSW
Main
routine
Interrupt request generated
Notes 1. When the register bank switching function is used and when initial values are set in advance to the
registers
2. Selecting a register bank and saving PC and PSW by context switching
3. Restoring register bank, PC, and PSW by context switching
4. Saves PC and PSW to stack and loads vector address to PC
Data Sheet U12255EJ2V0DS00
55
µ
PD784927, 784928, 784927Y, 784928Y
4.1.1 Vectored interrupt
When an interrupt request is acknowledged, an interrupt processing program is executed according to the data
stored in the vector table area (the first address of the interrupt processing program created by the user).
In addition, four levels of priorities can be specified by software.
4.1.2 Context switching
When an interrupt request is generated or when the BRKCS instruction is executed, a specific register bank is
selected by hardware, and execution branches to a vector address set in advance in the register bank. At the same
time, the current contents of the program counter (PC) and program status word (PSW) are saved to the registers
in the register bank. Because the contents of PC and PSW are not saved to the stack area, execution can be branched
to an interrupt processing routine more quickly than the vectored interrupt.
Figure 4-2. Context Switching Operation When Interrupt Request Is Generated
<7> 0H
PC19-16PC15-0
<2> Save
Bits 8-11 of temporary
register
<1> Save
PSW
<6> Exchange
<5> Save
Temporary register
Register bank n (n = 0-7)
A
B
R5
R7
V
U
T
W
VP
UP
D
H
R4
R6
Register bank
(0-7)
X
C
<3>
Switching register bank
(RBS0-RBS2 ← n)
<4>
RSS
← 0
IE
E
L
← 0
56
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
4.1.3 Macro service
The macro service is a function to transfer data between the memory and a special function register (SFR) without
intervention by the CPU. A macro service controller accesses the memory and SFR and directly transfers the data.
Because the status of the CPU is not saved or restored, data can be transferred more quickly than context switching.
The processing that can be executed with the macro service is described below.
Figure 4-3. Macro Service
CPUMemorySFR
Internal bus
Read
Write
Macro service
controller
Write
Read
(1) Counter mode
In this mode, the value of the macro service counter (MSC) is decremented when an interrupt request occurs.
This mode can be used to execute the division operation of an interrupt request or count the number of times
an interrupt request has occurred.
When the value of the macro service counter has been decremented to 0, a vectored interrupt occurs.
MSC
-
1
(2) Compound data transfer mode
When an interrupt request occurs, data are simultaneously transferred from an 8-bit SFR to memory, a 16bit SFR to memory (word), memory (byte) to an 8-bit SFR, and memory (word) to a 16-bit SFR (3 points MAX.
for each transfer).
This mode can also be used to exchange data, instead of transferring data.
This mode can be used for automatic transfer/reception by the serial interface or automatic updating of data/
timing by the serial output port.
When the value of the macro service counter reaches to 0, a vectored interrupt request occurs.
SFR<4>-1
SFR<2>-1
SFR<4>-2 SFR<4>-3SFR<3>-1SFR<3>-2SFR<3>-3
Internal bus
SFR<2>-2 SFR<2>-3SFR<1>-1SFR<1>-2SFR<1>-3
Internal bus
Data Sheet U12255EJ2V0DS00
Memory
.
.
.
57
µ
(
)
PD784927, 784928, 784927Y, 784928Y
(3) Macro service type A
When an interrupt request occurs, data is transferred from an 8-/16-bit SFR to memory (byte/word) or from
memory (byte/word) to an 8-/16-bit SFR.
Data is transferred the number of times set in advance by the macro service counter.
This mode can be used to store the result of A/D conversion or for automatic transfer (or reception) by the
serial interface.
Because transfer data is stored at an address FE00H to FEFFH, if only a small quantity of data is to be
transferred, the data can be transferred at high speeds.
When the value of the macro service counter is decremented to 0, a vectored interrupt request occurs.
Data storage buffer (memory)
Data n
-
Data n
Internal bus
1
Data 2
Data 1
SFR
Data storage buffer (memory)
Data n
-
Data n
Internal bus
1
Data 2
Data 1
SFR
(4) Data pattern identification mode (VISS detection mode)
This mode of macro service is for detection of the VISS signal and is used in combination with a pulse width
detection circuit.
When an interrupt request occurs, the content of bit 7 of an SFR (usually, TMC3) specified by SFR pointer
1 is shifted into the buffer area. At the same time, the data in the buffer area is compared with the data in
the compare area. If the two data coincide, a vectored interrupt request is generated. When the value of the
macro service counter is decremented to 0, a vectored interrupt request occurs.
It can be specified by option that the value of an SFR (usually, CPT30) specified by SFR pointer 2 be multiplied
by a coefficient and the result of this multiplication be stored to an SFR (usually, CR30) specified by SFR pointer
3 (this operation is to automatically update an identification threshold value when the tape speed fluctuates).
58
Coefficient (memory)
Multiplier
Buffer area (memory)Compare area (memory)
CPT30
TM3
Coincidence
CR30
CTL F/F
bit 7 of TMC3
Data Sheet U12255EJ2V0DS00
Vectored interrupt
µ
(
)
PD784927, 784928, 784927Y, 784928Y
4.1.4 Application example of macro service
(1) Automatic transfer/reception of serial interface
Automatic transfer/reception of 3-byte data by serial interface channel 1
Setting of macro service register: compound data transfer mode (exchange mode)
Transfer of receive data by serial interface channel 1 (16 bytes)
Setting of macro service mode register: macro service type A (1-byte data transfer from SFR to memory)
Internal RAM
FE7FH
FE2EH
MSC 0FH
SFR pointer 85H
Channel pointer (= 7FH)
Mode register (= 00010001B)
Setting of number of transfers
Low-order 8 bits of address of SIO1 register
Starts macro service when INTCSI1 occurs
SI1
SIO1
(FF85H)
60
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(3) VISS detection operation
Setting of macro service mode register: data pattern identification mode (with multiplication, 8-byte comparison)
2. The peripheral hardware units that can operate with the subsystem clock have some restrictions. For details, refer to
µ
PD784927, 784928, 784927Y, 784928Y
4.4 Reset Function
When a low-level signal is input to the RESET pin, the system is reset, and each hardware unit is initialized (reset
status). During the reset period, oscillation of the system clock is unconditionally stopped, so that the current
consumption of the overall system can be reduced.
When the RESET pin goes high, the reset status is cleared. After the count time of the oscillation stabilization timer
(32.8 ms at 16 MHz or 65.6 ms at 8 MHz) has elapsed, the contents of the reset vector table are set to the program
counter (PC), and execution branches to the address set to the PC, and the program is executed starting from the
branch destination address. Therefore, execution can be reset and started from any address.
Figure 4-7. Oscillation of Main System Clock during Reset Period
Main system clock
oscillation circuit
During reset, oscillation
is unconditionally stopped.
CLT
f
RESET input
Oscillation stabilization
timer count time
The RESET pin is provided with an analog delay noise rejection circuit to prevent malfunctioning due to noise.
Figure 4-8. Accepting Reset Signal
delay
Oscillation
stabilization
time
Analog delayAnalog delay
Analog
RESET input
Internal reset signal
Internal clock
Data Sheet U12255EJ2V0DS00
65
µ
PD784927, 784928, 784927Y, 784928Y
5. INSTRUCTION SET
(1) 8-bit instructions (( ): combination realized by using A as r)
AVDD1| VDD – AVDD2 | ≤ 0.5 V–0.5 to +7.0V
AVDD2| AVDD1 – AVDD2 | ≤ 0.5 V–0.5 to +7.0V
AVSS1–0.5 to +0.5V
AVSS2–0.5 to +0.5V
Input voltageVI–0.5 to VDD + 0.5V
Analog input voltageVIANVDD≥ AVDD2–0.5 to AVDD2 + 0.5V
(ANI0-ANI11)VDD < AVDD2–0.5 to VDD + 0.5V
Output voltageVO–0.5 to VDD + 0.5V
Low-level output currentIOLPin 115mA
Total of all pins100mA
High-level output currentIOHPin 1–10mA
Total of all pins–50mA
Operating ambient temperature
Storage temperatureTstg–65 to +150°C
TA–10 to +70°C
Caution If the rated value of even one of the above parameters is exceeded even momentarily, the quality
of the product may be degraded. Absolute maximum ratings therefore specify the values
exceeding which the product may be physically damaged. Never exceed these values when
using the product.
Operating Conditions
Clock Frequency
4 MHz ≤ fXX≤ 16 MHz–10 to +70°CAll functions+4.5 to +5.5 V
32 kHz ≤ fXT≤ 35 kHzSubclock operation+2.7 to +5.5 V
Crystal resonatorOscillation frequency (fXT)3235kHz
XT1XT2 V
C1C2
SS
Caution When using the main system clock and subsystem clock oscillator, wire the portion enclosed
by the broken line in the above figures as follows to avoid the adverse influence of wiring
capacitance:
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines. Do not route the wiring in the
neighborhood of a signal line through which a high alternating current flows.
• Always keep the ground point of the capacitor of the oscillator to the same potential as V
SS.
Do not ground the capacitor to a ground pattern to which a high current flows.
• Do not extract signals from the oscillation circuit.
Exercise particular care in using the subsystem clock oscillator because the amplification factor
of this circuit is kept low to reduce the current consumption.
Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
Data Sheet U12255EJ2V0DS00
71
µ
PD784927, 784928, 784927Y, 784928Y
DC Characteristics (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
ParameterSymbolConditionsMIN.TYP.MAX.Unit
Low-level input voltageVIL1Pins other than those listed in Note 1 below00.3 VDDV
VIL2Pins listed in Note 1 below00.2 VDDV
VIL3X1, X200.4V
High-level input voltageVIH1Pins other than those listed in Note 1 below0.7 VDDVDDV
A = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
ParameterSymbolConditionsMIN.MAX.Unit
tCYSK + tWSKH
Remarks 1. The value in ( ) following SCK2 indicates the number of SCK2.
2. BUSY is detected after the time of (n + 2) x tCYSK (n = 0, 1, and so on) in respect to SCK2 (8) ↑ .
3. BUSY inactive →SCK2 (1) ↓ is the value when data has been completely written to SIO2.
Data Sheet U12255EJ2V0DS00
73
µ
PD784927, 784928, 784927Y, 784928Y
I2C bus mode (µPD784928Y subseries only)
ParameterSymbolStandard ModeHigh-speed ModeUnit
MIN.MAXMINMAX.
SCL clock frequencyfCLK01000400kHz
Bus free time (between stop and starttBUF4.7–1.3–
conditions)
Hold time
SCL clock low-level widthtLOW4.7–1.3–
SCL clock high-level widthtHIGH4.0–0.6–
Start/restart condition setup timetSU : STA4.7–0.6–
Data holdCBUS compatible mastertHD : DAT5.0–––
timeI2C bus0
Data setup timet SU : DAT250–100
SDA and SCL signal rise timetR–100020+0.1Cb
SDA and SCL signal fall timetF–30020+0.1Cb
Stop condition setup timetSU : STO4.0–0.6–
Pulse width of spike restrained by inputtSP––050ns
filter
Each bus line capacitative loadCb–400–400pF
Note 1
tHD : STA4.0–0.6–
Note 2
–0
Note 2
Note 4
Note 5
Note 5
0.9
300ns
300ns
Note 2
–ns
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Notes 1. The first clock pulse is generated at the start condition after this period.
2. The device needs to internally supply a hold time of at least 300 ns for the SDA signal to fill the undefined
area at the falling edge of the SCL (V
IHmin. of the SCL signal).
3. Unless the device extends the low hold time (tLOW) of the SCL signal, it is necessary to fill only the
maximum data hold time (t
HD : DAT).
4. The high-speed mode I2C bus can be used in the standard mode I2C bus system. In this case, satisfy
the following conditions:
• When the device does not extend the low hold time of the SCL signal
SU : DAT≥ 250 ns
t
• When the device extends the low hold time of the SCL signal
Send the next data bit to the SDA line before releasing the SCL line (t
= 1250 ns : in the standard mode I2C bus specification)
5. Cb: Total capacitance of one bus line (unit: pF)
Rmax. + tSU:DAT = 1000 + 250
74
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Other operations (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
ParameterSymbolConditionMIN.MAX.Unit
Timer input signal low-level widthtWCTLWhen DFGIN, CFGIN, DPGIN, REEL0IN,tCLK1ns
or REEL1IN logic level is input
Timer input signal high-level widthtWCTHWhen DFGIN, CFGIN, DPGIN, REEL0IN,tCLK1ns
or REEL1IN logic level is input
Timer input signal valid edge input cycletPERINWhen DFGIN, CFGIN, or DPGIN is input2
CSYNCIN low-level widthtWCR1L
CSYNCIN high-level widthtWCR1H
Digital noiseRejected pulse widthtWSEPBit 4 of INTM2 = 0104tCLK1ns
rejection circuitBit 4 of INTM2 = 1176tCLK1ns
Passed pulse widthBit 4 of INTM2 = 0108tCLK1ns
NMI low-level widthtWNILVDD = AVDD = 2.7 to 5.5 V10
NMI high-level widthtWNIHVDD = AVDD = 2.7 to 5.5 V10
INTP0, INTP3 low-level widthstWIPL02tCLK1ns
INTP0, INTP3 high-level widthstWIPH02tCLK1ns
INTP1, KEY0-KEY4 low-level widthstWIPL1Mode other than STOP mode2tCLK1ns
INTP1, KEY0-KEY4 high-level widthstWIPH1Mode other than STOP mode2tCLK1ns
INTP2 low-level widthtWIPL2In normal mode,Sampling = fCLK2tCLK1ns
INTP2 high-level widthtWIPH2In normal mode,Sampling = fCLK2tCLK1ns
RESET low-level widthtWRSL10
When digital noise rejection circuit is not used
When digital noise rejection circuit is used108tCLK1ns
(Bit 4 of INTM2 = 0)
When digital noise rejection circuit is used180tCLK1ns
(Bit 4 of INTM2 = 1)
When digital noise rejection circuit is not used
When digital noise rejection circuit is used108tCLK1ns
(Bit 4 of INTM2 = 0)
When digital noise rejection circuit is used180tCLK1ns
(Bit 4 of INTM2 = 1)
Bit 4 of INTM2 = 1180tCLK1ns
In STOP mode, for releasing STOP mode10
In STOP mode, for releasing STOP mode10
with main clockSampling = fCLK/12832
Normal mode,Sampling = fCLK61
with subclockSampling = fCLK/1287.9
In STOP mode, for releasing STOP mode10
with main clockSampling = fCLK/12832
Normal mode,Sampling = fCLK61
with subclockSampling = fCLK/1287.9
In STOP mode, for releasing STOP mode10
8tCLK1ns
8tCLK1ns
Note
Note
Note
Note
µ
µ
µ
µ
µ
µ
µ
ms
µ
µ
µ
ms
µ
µ
s
s
s
s
s
s
s
s
s
s
s
s
Note If a high or low level is successively input two times during the sampling period, a high or low level is
detected.
Remark t
CKL1: operating clock cycle time of peripheral circuit (125 ns)
ParameterSymbolConditionMIN.TYP.MAX.Unit
CTL+, – input resistanceRICTL2510kΩ
Feedback resistanceRFCTL2050100kΩ
Bias resistanceRBCTL2050100kΩ
Minimum voltage gainGCTLMIN172022dB
Maximum voltage gainGCTLMAX7175dB
Gain selecting stepSGAIN1.77dB
Same phase signal elimination ratioCMRDC, voltage gain: 20 dB50dB
High comparator set voltage of waveform shaping
High comparator reset voltage of waveform shaping
Low comparator set voltage of waveform shaping
Low comparator reset voltage of waveform shaping
Comparator Schmitt width of waveform shaping
High comparator voltage of CTL flag SVFSH
Low comparator voltage of CLT flag SV FSL
High comparator voltage of CTL flag LVFLH
Low comparator voltage of CTL flag LVFLL
ParameterSymbolConditionMIN.TYP.MAX.Unit
Voltage gain 1GCFG1 fi = 2 kHz, open loop50dB
Voltage gain 2GCFG2 fi = 30 kHz, open loop34dB
CFGAMPO High-level output currentIOHCFG DC– 1mA
CFGAMPO Low-level output currentIOLCFG DC0.1mA
High comparator voltageVCFGH
Low comparator voltageVCFGL
Duty accuracyPDUTY Note49.750.050.3%
Note The conditions include the following circuit and input signal.
V
V
Input signal : Sine wave input (5 mV
fi = 1 kHz
Voltage gain: 50 dB
DFG amplifier (AC coupling) (T
ParameterSymbolConditionMIN.TYP.MAX.Unit
Voltage gainGDFGf i = 900 Hz, open loop50dB
Feedback resistanceRFDFG160400640kΩ
Input protection resistanceRIDFG150Ω
High comparator voltageVDFGH
Low comparator voltageVDFGL
Caution When an external clock is selected as the serial clock, do not use the busy control or strobe
control.
Data Sheet U12255EJ2V0DS00
81
I2C bus mode (µPD784928Y subseries only)
t
SCL
SDA
LOW
t
HD : STA
t
BUF
t
HD : DAT
t
R
t
HIGH
t
SU : DAT
µ
PD784927, 784928, 784927Y, 784928Y
t
F
t
SU : STA
t
HD : STA
t
SP
t
SU : STO
Stop
condition
Start
condition
Restart
condition
Stop
condition
82
Data Sheet U12255EJ2V0DS00
Super timer unit input timing
When DFGIN, CFGIN, DPGIN,
REEL0IN, or REEL1IN logic
level is input
When CSYNCIN logic level
is input
Interrupt request input timing
0.8 V
0.8 V
µ
PD784927, 784928, 784927Y, 784928Y
t
WCTH
DD
t
WCTL
0.8 V
t
WCR1H
DD
t
WCR1L
0.8 V
NMI
INTP0, INTP3
INTP1, KEY0-KEY4
INTP2
0.8 V
0.8 V
0.8 V
0.8 V
t
WNIH
DD
t
WNIL
0.8 V
t
WIPH0
DD
t
WIPL0
0.8 V
t
WIPH1
DD
t
WIPL1
0.8 V
t
WIPH2
DD
t
WIPL2
0.8 V
Data Sheet U12255EJ2V0DS00
83
Reset input timing
µ
PD784927, 784928, 784927Y, 784928Y
t
WRSL
RESET
Clock output timing
CLO
0.8 V
0.8 V
0.8 V
t
CLH
DD
t
t
CYCL
CLF
t
CLL
t
CLR
84
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
7. PACKAGE DRAWING
100 PIN PLASTIC LQFP (FINE PITCH) (14×14)
A
B
7551
76
50
detail of lead end
100
1
25
26
F
G
H
M
I
J
P
N
NOTE
Each lead centerline is located within 0.08 mm (0.003 inch) of
its true position (T.P.) at maximum material condition.
CD
K
L
S
Q
R
M
ITEM MILLIMETERSINCHES
A16.00±0.200.630±0.008
+0.009
B14.00±0.200.551
C14.00±0.200.551
D16.00±0.200.630±0.008
F1.000.039
G1.000.039
+7°
–3°
+0.05
–0.04
+0.03
–0.07
H0.220.009±0.002
I0.080.003
J0.50 (T.P.)0.020 (T.P.)
K1.00±0.200.039
L0.50±0.200.020
M0.170.007
N0.080.003
P1.40±0.050.055±0.002
Q0.10±0.050.004±0.002
R3°3°
S1.60 MAX.0.063 MAX.
+0.009
–0.008
–0.008
+0.009
–0.008
+0.009
–0.008
+0.008
–0.009
+0.001
–0.003
+7°
–3°
S100GC-50-8EU
Remark The package dimensions and materials of ES versions are the same as those of mass-production
versions.
Data Sheet U12255EJ2V0DS00
85
100PIN PLASTIC QFP (14x20)
µ
PD784927, 784928, 784927Y, 784928Y
A
B
80
81
100
1
51
30
50
31
F
G
H
M
I
J
P
N
NOTE
Each lead centerline is located within 0.15 mm (0.006 inch) of
its true position (T.P.) at maximum material condition.
CD
K
M
L
detail of lead end
S
Q
ITEM MILLIMETERSINCHES
A23.6±0.40.929±0.016
B20.0±0.20.795
C14.0±0.20.551
D17.6±0.40.693±0.016
F0.80.031
G0.60.024
H0.30±0.100.012
I0.150.006
J0.65 (T.P.)0.026 (T.P.)
K1.8±0.20.071
L0.8±0.20.031
M0.150.006
N0.100.004
P2.7±0.10.106
Q0.1±0.10.004±0.004
R5°±5°5°±5°
S3.0 MAX.0.119 MAX.
R
+0.10
–0.05
P100GF-65-3BA1-3
+0.009
–0.008
+0.009
–0.008
+0.004
–0.005
+0.008
–0.009
+0.009
–0.008
+0.004
–0.003
+0.005
–0.004
Remark The package dimensions and materials of ES versions are the same as those of mass-production
versions.
86
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
8. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
PD784927GC-×××-8EU, 784927YGC-×××-8EU, 784928GC-×××-8EU, and 784928YGC-×××-8EU are
under development. Therefore their soldering conditions are not defined.
Table 8-1. Surface Mount Type Soldering Conditions
Conditions Symbol
Number of times: three times max.
Number of times: three times max.
Number of times: once,
Preheating temperature: 120°C max.(Package surface temperature)
Caution Do not use two or more soldering methods in combination (except partial heating).
Data Sheet U12255EJ2V0DS00
87
µ
PD784927, 784928, 784927Y, 784928Y
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for developing systems using the µPD784927.
Refer to (5) Cautions when the development tools are used.
(1) Language processing software
RA78K478K/IV series common assembler package
CC78K478K/IV series common C compiler package
DF784928Device file for the µPD784928, 784928Y subseries
CC78K4-L78K/IV series common C compiler library source file
(2) Flash memory writing tools
Flashpro II, IIIDedicated flash programmer
(Part number: FL-PR2,
FL-PR3, PG-FPIII)
FA-100GCAdapter for writing 100-pin plastic LQFP (GC-8EU type) flash memory. Be sure to
connect depending on the target product.
FA-100GFAdapter for writing 100-pin plastic QFP (GF-3BA type) flash memory. Be sure to
connect depending on the target product.
(3) Debugging tools
• When using the IE-78K4-NS in-circuit emulator
IE-78K4-NS78K/IV series common in-circuit emulator
IE-70000-MC-PS-BPower supply unit for IE-78K4-NS
IE-70000-98-IF-CInterface adapter necessary when a PC-9800 series computer (except notebook
personal computer) is used as host machine (C bus compatible)
IE-70000-CD-IF-APC card and interface cable necessary when a notebook personal computer is used as
host machine (PCMCIA socket compatible)
IE-70000-PC-IF-CInterface adapter necessary when an IBM PC/ATTM compatible machine is used as host
machine (ISA bus compatible)
IE-784928-NS-EM1Emulation board for emulating the µPD784928, 784928Y subseries
EP-784915-GF-REmulation probe for µPD784915 subseries common 100-pin plastic QFP (GC-3BA type)
and 100-pin plastic LQFP (GC-8EU type).
EV-9200GF-100Conversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in LCC system.
NQPACK100RBConversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in QFP system.
ID78K4-NSIntegrated debugger for IE-78K4-NS
SM78K478K/IV series common system simulator
DF784928Device file for the µPD784928, 784928Y subseries
88
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
• When using the IE-784000-R in-circuit emulator
IE-784000-R78K/IV series common in-circuit emulator
IE-70000-98-IF-CInterface adapter necessary when a PC-9800 series computer (except notebook
personal computer) is used as host machine (C bus compatible)
IE-70000-PC-IF-CInterface adapter necessary when an IBM PC/AT compatible machine is used
as host machine (ISA bus compatible)
IE-78000-R-SV3Interface adapter and cable necessary when an EWS is used as host machine
IE-784928-NS-EM1Emulation board for emulating the µPD784928, 784928Y subseries and µPD784915
IE-784915-R-EM1subseries
IE-784000-R-EM78K/IV series common emulation board
IE-78K4-R-EX3Conversion board for 100-pin products necessary when the IE-784928-NS-EM1 is used
in the IE-784000-R. Not necessary when the IE-784915-R-EM1 is used.
EP-784915-GF-REmulation probe for µPD784915 subseries common 100-pin plastic QFP (GC-3BA type)
and 100-pin plastic LQFP (GC-8EU type).
EV-9200GF-100Conversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in LCC system.
NQPACK100RBConversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in QFP system.
ID78K4Integrated debugger for IE-784000-R
SM78K478K/IV series common system simulator
DF784928Device file for the µPD784928, 784928Y subseries
(4) Real-time OS
RX78K/IVReal-time OS for 78K/IV series
MX78K4OS for 78K/IV series
Data Sheet U12255EJ2V0DS00
89
µ
PD784927, 784928, 784927Y, 784928Y
(5) Cautions when the development tools are used
• The ID78K4-NS, ID78K4, and SM78K4 are used in combination with the DF784928.
• The CC78K4 and RX78K/IV are used in combination with the RA78K4 and DF784928.
• FL-PR2, FL-PR3, FA-100GC, and FA-100GF are products of Naito Densei Machida Mfg. Co., Ltd. (TEL: 044822-3813). Contact an NEC distributor when purchasing these products.
• NQPACK100RB is a product of Tokyo Eletech Corp.
Reference: Daimaru Kogyo, Ltd.Electronics Dept. (TEL: Tokyo 03-3820-7112)
Electronics 2nd Dept. (TEL: Osaka 06-6244-6672)
• Host machines and OSs compatible with the software are as follows:
Host Machine [OS] PC EWS
PC-9800 Series [WindowsTM]HP9000 series 700TM [HP-UXTM]
IBM PC/AT compatible machinesSPARCstationTM [SunOSTM, SolarisTM]
PD784915, 784928, 784928Y Subseries Application Note - VCR Servo
78K/IV Series User’s Manual - InstructionU10905JU10905E
78K/IV Series Instruction TableU10594J–
78K/IV Series Instruction SetU10595J–
78K/IV Series Application Note - Software BasicsU10095JU10095E
U11361JU11361E
Development tool-related documents (User’s Manuals)
DocumentDocument No.
JapaneseEnglish
RA78K4 Assembler PackageOperationU11334JU11334E
LanguageU11162JU11162E
RA78K4 Structured Assembler PreprocessorU11743JU11743E
CC78K4 C CompilerOperationU11572JU11572E
LanguageU11571JU11571E
IE-78K4-NSU13356JU13356E
IE-784000-RU12903JEEU-1534
IE-784928-NS-EM1U13819JU13819E
IE-784915-R-EM1, EP-784915GF-RU10931JU10931E
SM78K4 System Simulator Windows Based
SM78K Series System SimulatorExternal Part User Open U10092JU10092E
ID78K4-NS Integrated DebuggerReferenceU12796JU12796E
ID78K4 Integrated Debugger Windows Based
ID78K4 Integrated DebuggerReferenceU11960JU11960E
HP-UX, SunOS, NEWS-OS Based
ReferenceU10093JU10093E
Interface Specifications
ReferenceU10440JU10440E
Caution The contents of the above related documents are subject to change without notice. Be sure to use
the latest edition of the document when designing your system.
78K/IV Series Real-Time OSFundamentalU10603JU10603E
InstallationU10604JU10604E
DebuggerU10364J–
78K/IV Series OS, MX78K4FundamentalU11779J–
Other documents
DocumentDocument No.
JapaneseEnglish
SEMICONDUCTORS SELECTION GUIDE Products & Packages (CD-ROM)X13769X
Semiconductor Device Mounting Technology ManualC10535JC10535E
Quality Grades on NEC Semiconductor DevicesC11531JC11531E
NEC Semiconductor Device Reliability/Quality Control SystemC10983JC10983E
Guide to Prevent Damage for Semiconductor Devices byC11892JC11892E
Electrostatic Discharge (ESD)
Guide to Microcomputer-Related Products by Third PartyU11416J–
Caution The contents of the above related documents are subject to change without notice. Be sure to use
the latest edition of the document when designing your system.
92
Data Sheet U12255EJ2V0DS00
[MEMO]
µ
PD784927, 784928, 784927Y, 784928Y
Data Sheet U12255EJ2V0DS00
93
µ
PD784927, 784928, 784927Y, 784928Y
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and
measurement tools including work bench and floor should be grounded. The operator should be
grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar
precautions need to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input
levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to V
possibility of being an output pin. All handling related to the unused pins must be judged device
by device and related specifications governing the devices.
DD or GND with a resistor, if it is considered to have a
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until
the reset signal is received. Reset operation must be executed immediately after power-on for
devices having reset function.
Purchase of NEC I2C components conveys a license under the Philips I2C Patent Rights to use these components in an
I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
EEPROM and FIP are trademarks of NEC Corporation.
Windows is either a registered trademark or a trademark of Microsoft Corporation in the
United States and/or other countries.
PC/AT and PC DOS are trademarks of IBM Corporation.
HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
NEWS and NEW-OS are trademarks of Sony Corporation.
94
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet U12255EJ2V0DS00
95
µ
PD784927, 784928, 784927Y, 784928Y
The documents referred to in this publication may include preliminary versions. However, preliminary versions are not
marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific:Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8
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