NEC PD784927, PD784928, PD784927Y, PD784928Y DATA SHEET

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µ
PD784927, 784928, 784927Y, 784928Y
DESCRIPTION
The µPD784927 and 784928 are members of the NEC 78K/IV Series of microcontrollers equipped with a high-
speed, high-performance 16-bit CPU for VCR software servo control.
µ
PD784927Y and 784928Y are based on the µPD784928 with the addition of an I2C bus interface compatible
The
with multi-master.
They contain many peripheral hardware units ideal for VCR control, such as a multi-function timer unit (super timer
unit) for software servo control and VCR analog circuits.
Flash memory models, the
DATA SHEET
MOS INTEGRATED CIRCUIT
16-BIT SINGLE-CHIP MICROCONTROLLER
µ
PD78F4928 and µPD78F4928Y, are under development.
µ
The functions of the
manual before designing your system.
µ
PD784928, 784928Y Subseries User’s Manual - Hardware : U12648E
78K/IV Series User’s Manual - Instruction : U10905E
FEATURES
High instruction execution speed realized by 16-bit CPU core
• Minimum instruction execution time: 250 ns (with 8 MHz internal clock) High internal memory capacity
Item Internal ROM capacity 96K bytes 128K bytes
Internal RAM capacity 2048 bytes 3584 bytes
VCR analog circuits conforming to VHS Standard
• CTL amplifier • DFG amplifier • Reel FG comparator (2 channels)
• RECCTL driver (rewritable) • DPG amplifier • CSYNC comparator
• CFG amplifier • DPFG separation circuit (ternary separation circuit) Timer unit (super timer unit) for servo control
Serial interface : 3 channels
3-wire serial I/O : 2 channels
I2C bus interface : 1 channel
A/D converter: 12 channels (conversion time: 10 µs)
Low-frequency oscillation mode: main system clock frequency = internal clock frequency
Low-power consumption mode: CPU can operate with a subsystem clock.
Supply voltage range: VDD = +2.7 to 5.5 V
Hardware watch function: watch operation at low voltage (VDD = 2.7 V (MIN.)) and low current consumption
PD784927 is described in detail in the following User’s Manual. Be sure to read this
Part Number
µ
PD784927, 784927YµPD784928, 784928Y
Unless otherwise specified, the
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. U12255EJ2V0DS00 (2nd edition) Date Published December 1999 N CP(K) Printed in Japan
µ
PD784927 is treated as the representative model throughout this document.
The mark shows major revised points.
©
1997,1999
APPLICATION FIELDS
Stationary VCR, video camera, In-TV VCR
ORDERING INFORMATION
(1)µPD784928 subseries
Part Number Package
µ
PD784927GC-×××-8EU
µ
PD784927GF-×××-3BA 100-pin plastic QFP (14 × 20 mm)
µ
PD784928GC-×××-8EU
µ
PD784928GF-×××-3BA 100-pin plastic QFP (14 × 20 mm)
µ
PD784928Y subseries
(2)
Part Number Package
µ
PD784927YGC-×××-8EU
µ
PD784927YGF-×××-3BA 100-pin plastic QFP (14 × 20 mm)
µ
PD784928YGC-×××-8EU
µ
PD784928YGF-×××-3BA 100-pin plastic QFP (14 × 20 mm)
Note
Note
Note
Note
µ
PD784927, 784928, 784927Y, 784928Y
100-pin plastic LQFP (fine pitch) (14 × 14 mm)
100-pin plastic LQFP (fine pitch) (14 × 14 mm)
100-pin plastic LQFP (fine pitch) (14 × 14 mm)
100-pin plastic LQFP (fine pitch) (14 × 14 mm)
Note Under development
Remark ××× indicates ROM code suffix.
PRODUCT DEVELOPMENT OF VCR-SERVO MICROCONTROLLERS
The product development of VCR-servo microcontrollers is shown below. Enclosed in a frame are subseries
names.
2
The Y subseries is a collection of products supporting the I
Products under mass production
Products under development
78K/IV series
78K/I series
µ
PD784928
µ
PD784915
µ
PD78148
µ
PD784928Y
C bus.
100-pin QFP. With flash memory. Expanded internal memory capacity. More powerful analog amplifier. Improved VCR functions. Increased I/O. High-current port added.
2
C function added (Y model only).
I 100-pin QFP.
Expanded internal memory capacity. Internal analog amplifier. Reinforced super timer. Low-power consumption mode added.
100-pin QFP Expanded internal RAM capacity. Operational amplifier, watch function, multiplier added.
µ
PD78138
2
Data Sheet U12255EJ2V0DS00
80-pin QFP
FUNCTION LIST (1/2)
Part Number
Item Internal ROM capacity Internal RAM capacity Operating clock
Minimum instruction execu­tion time
I/O port
Real-time output port
Timer/counter
Capture register
Super timer unit
VCR special circuit
General-purpose timer
PWM output
Serial interface
A/D converter
µ
PD784927, 784928, 784927Y, 784928Y
µ
PD784927, 784927Y
96K bytes 128K bytes 2048 bytes 3584 bytes 16 MHz (internal clock: 8 MHz)
Low frequency oscillation mode : 8 MHz (internal clock: 8 MHz) Low power consumption mode : 32.768 kHz (subsystem clock)
250 ns (with 8 MHz internal clock)
input : 20
74
I/O : 54 (including 8 ports for LED direct drive)
11 (including one each for pseudo VSYNC, head amplifier switch, and chrominance rotation)
Timer/counter Compare register Capture register Remark
TM0 (16 bits) 3 — TM1 (16 bits) 3 1 FRC (22 bits) 6 TM3 (16 bits) 2 1
UDC (5 bits) 1
EC (8 bits) 4 For HSW signal generation
EDV (8 bits) 1 For CFG signal division
Input signal Number of bits Measurable cycle Operating edge
CFG 22 125 ns to 524 ms ↑↓
DFG 22 125 ns to 524 ms HSW 16 1 µs to 65.5 ms ↑↓ VSYNC 22 125 ns to 524 ms
CTL 16 1 µs to 65.5 ms ↑↓ TREEL 22 125 ns to 524 ms ↑↓ SREEL 22 125 ns to 524 ms ↑↓
VSYNC separation circuit, HSYNC separation circuit
VISS detection, wide aspect detection circuits
Field identification circuit
Head amplifier switch/chrominance rotation output circuit
Timer Compare register Capture register TM2 (16 bits) 1 — TM4 (16 bits) 1 (capture/compare) 1 TM5 (16 bits) 1
16-bit resolution : 3 channels (carrier frequency: 62.5 kHz)
8-bit resolution : 3 channels (carrier frequency: 62.5 kHz)
3-wire serial I/O: 2 channels (BUSY/STRB control: 1 channel)
I2C bus interface: 1 channel (µPD784928Y subseries only) 8-bit resolution × 12 channels, conversion time: 10 µs
µ
PD784928, 784928Y
Data Sheet U12255EJ2V0DS00
3
FUNCTION LIST (2/2)
µ
PD784927, 784928, 784927Y, 784928Y
Part Number
Item Analog circuit
Interrupt sources
External Internal
Standby function
Watch function Buzzer output function
Supply voltage Package
Note Under development
µ
PD784927, 784927Y
CTL amplifier
RECCTL driver (rewritable)
DFG amplifier, DPG amplifier, CFG amplifier
DPFG separation circuit (ternary separation circuit)
Reel FG comparator (2 channels)
CSYNC comparator
4 levels (programmable), vectored interrupt, macro service, context switching 9 (including NMI) 22 (including software interrupt) 23 (including software interrupt) HALT mode/STOP mode/low power consumption mode/low power consumption HALT mode STOP mode can be released by input of valid edge of NMI pin, watch interrupt (INTW), or INTP1/
INTP2/KEY0-KEY4 pins
0.5-second measurement, low-voltage operation (VDD = 2.7 V)
1.95 kHz, 3.91 kHz, 7.81 kHz, 15.6 kHz (Internal clock: 8 MHz)
2.048 kHz, 4.096 kHz, 32.768 kHz (Subsystem clock: 32.768 kHz) VDD = +2.7 to 5.5 V
• 100-pin plastic LQFP (fine pitch)(14 × 14 mm)
• 100-pin plastic QFP (14 × 20 mm)
Note
µ
PD784928, 784928Y
4
Data Sheet U12255EJ2V0DS00
PIN CONFIGURATION (Top View)
100-pin plastic LQFP (fine pitch)(14 × 14 mm)
µ
PD784927GC-×××-8EU
µ
PD784928YGC-×××-8EU, 784928YGC-×××-8EU
P84/PWM2/SDA
P83/ROTC
P82/HASW
Note 2
P80 P57 P56 P55 P54 P53 P52 P51 P50
V
V P47 P46 P45 P44 P43 P42 P41 P40 P07 P06 P05
1 2 3 4 5 6 7 8 9 10 11 12
SS DD
13 14 15 16 17 18 19 20 21 22 23 24 25
Note 1
, 784928GC-×××-8EU
Note 2
P85/PWM3/SCL
P86/PTO10
P87/PTO11
P30/PTO00
P31/PTO01
100
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
µ
P32/PTO02ICRESETX1X2
PD784927, 784928, 784927Y, 784928Y
Note 1
Note 1
VSSXT2
XT1
VDDP33/SI2/BUSY
P34/SO2
P35/SCK2
P36/PWM1
P37/PWM0
P63/SI1
P62/SO1
P61/SCK1/BUZ
P60/STRB/CLO
P67/PWM5/CTLMON
P66/PWM4/CFGMON
80 79 78 77 76
46 47 48 49 50
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
P65/HWIN/DPGMON P64/BUZ/DFGMON P103/CSYNCIN P102/REEL0IN/INTP3 P101/REEL1IN DFGIN P100/DPGIN CFGCPIN CFGAMP0 CFGIN AV
DD1
AV
SS1
VREFC CTLOUT2 CTLOUT1 CTLIN RECCTL RECCTL+ CTLDLY AV
SS2
P113/ANI11 P112/ANI10 P111/ANI9 P110/ANI8 P77/ANI7
DD2AVREF
P04
P03
P02
P01
P00
P23/INTP2
P20/NMI
P22/INTP1
P21/INTP0
P90/ENV
P91/KEY0
P92/KEY1
P93/KEY2
P96
P94/KEY3
P95/KEY4
AV
Notes 1. Under development
2. Pins SCL and SDA are provided for the µPD784928Y subseries only.
Caution Directly connect the IC (Internally Connected) pins to V
Data Sheet U12255EJ2V0DS00
P70/ANI0
P71/ANI1
P72/ANI2
P73/ANI3
P74/ANI4
P75/ANI5
P76/ANI6
SS in the normal operation mode.
5
100-pin plastic QFP (14 × 20 mm)
µ
PD784927GF-×××-3BA, 784928GF-×××-3BA,
µ
PD784927YGF-×××-3BA, 784928YGF-×××-3BA
CSYNCIN/P103
REEL0IN/INTP3/P102
REEL1IN/P101
100
99
98
DFGMON/P64/BUZ
DPGMON/P65/HWIN
CFGMON/P66/PWM4
CTLMON/P67/PWM5
P60/STRB/CLO
P61/SCK1/BUZ
P62/SO1
P63/SI1 P37/PWM0 P36/PWM1
P35/SCK2
P34/SO2
P33/SI2/BUSY
XT1 XT2
RESET
P32/PTO02 P31/PTO01 P30/PTO00 P87/PTO11 P86/PTO10
Note
/P85/PWM3
SCL
Note
/P84/PWM2
SDA
P83/ROTC
P82/HASW
1 2 3 4 5 6 7 8 9 10 11 12 13
DD
14
V
15 16
SS
V
17
X2
18
X1
19 20
IC
21 22 23 24 25 26 27 28 29 30
3132333435363738 39 40 41 42 43 44 45 46 47 48 49 50
DFGIN96DPGIN/P100
CFGCPIN
CFGAMPO
97
95
94
µ
PD784927, 784928, 784927Y, 784928Y
-
DD1
93
CFGIN92AV
SS1
AV
VREFC89CTLOUT2
91
90
CTLOUT1
CTLIN86RECCTL
88
87
RECCTL+
CTLDLY83AV
85
84
SS2
ANI11/P113
ANI10/P112
82
81
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
ANI9/P111 ANI8/P110 P77/ANI7 P76/ANI6 P75/ANI5 P74/ANI4 P73/ANI3 P72/ANI2 P71/ANI1 P70/ANI0
REF
AV AV
DD2
P96 P95/KEY4 P94/KEY3 P93/KEY2 P92/KEY1 P91/KEY0 P90/ENV NMI/P20 INTP0/P21 INTP1/P22 INTP2/23 P00 P01 P02 P03 P04 P05 P06
SS
DD
V
P80
P57
P56
P55
Note Pins SCL and SDA are provided for the
P54
P53
P52
µ
PD784928Y subseries only.
P51
P50
V
P47
Caution Directly connect the IC (Internally Connected) pins to V
6
Data Sheet U12255EJ2V0DS00
P46
P45
P44
P43
SS.
P42
P41
P40
P07
µ
PD784927, 784928, 784927Y, 784928Y
ANI0-ANI11 : Analog Input AVDD1, AVDD2 : Analog Power Supply AV
SS1, AVSS2 : Analog Ground
AVREF : Analog Reference Voltage BUSY : Serial Busy BUZ : Buzzer Output CFGAMPO : Capstan FG Amplifier Output CFGCPIN : Capstan FG Capacitor Input CFGIN : Analog Unit Input CFGMON : Capstan FG Monitor CLO : Clock Output CSYNCIN : Analog Unit Input CTLDLY : Control Delay Input CTLIN : CTL Amplifier Input Capacitor CTLMON : CTL Amplifier Monitor CTLOUT1, CTLOUT2 : CTL Amplifier Output DFGIN : Analog Unit Input DFGMON : DFG Monitor DPGIN : Analog Unit Input DPGMON : DPG Monitor ENV : Envelope Input HASW : Head Amplifier Switch Output HWIN : Hardware Timer External Input IC : Internally Connected INTP0-INTP3 : Interrupt From Peripherals KEY0-KEY4 : Key Return NMI : Nonmaskable Interrupt P00-P07 : Port0
P20-P23 : Port2 P30-P37 : Port3 P40-P47 : Port4 P50-P57 : Port5 P60-P67 : Port6 P70-P77 : Port7 P80, P82-P87 : Port8 P90-P96 : Port9 P100-P103 : Port10 P110-P113 : Port11 PTO00-PTO02, PTO10, PTO11 : Programmable Timer Output PWM0-PWM5 : Pulse Width Modulation Output RECCTL+, RECCTL– : RECCTL Output/PBCLT Input REEL0IN, REEL1IN : Analog Unit Input RESET : Reset ROTC : Chrominance Rotate Output SCK1, SCK2 : Serial Clock
Note
SCL SDA
Note
: Serial Clock
: Serial Data SI1, SI2 : Serial Input SO1, SO2 : Serial Output STRB : Serial Strobe V
DD : Power Supply
VREFC : Reference Amplifier Capacitor V
SS : Ground
X1, X2 : Crystal (Main System Clock) XT1, XT2 : Crystal (Subsystem Clock)
Note Pins SCL and SDA are provided for the
Data Sheet U12255EJ2V0DS00
µ
PD784928Y subseries only.
7
INTERNAL BLOCK DIAGRAM
µ
PD784927, 784928, 784927Y, 784928Y
NMI
INTP0-INTP3
PWM0-PWM5
PTO00-PTO02
PTO10, PTO11
VREFC REEL0IN REEL1IN
CSYNCIN
DFGIN DPGIN CFGIN
CFGAMPO
CFGCPIN CTLOUT1 CTLOUT2
CTLIN
RECCTL+
RECCTL
CTLDLY
DFGMON
DPGMON
CFGMON
CTLMON
AV
DD1
, AV
DD2
AV
SS1
, AV
AV
REF
AN10-AN11
SI1
SO1
SCK1
SI2/BUSY
SO2
SCK2
STRB
SUPER TIMER
-
ANALOG UNIT
A/D CONVERTER
SS2
INTERFACE 1
INTERFACE 2
INTERRUPT
CONTROL
UNIT
&
SERIAL
SERIAL
78K/IV
16-BIT CPU CORE
(RAM: 512 bytes)
RAM
ROM
V
DD
V
SS
SYSTEM
CONTROL
CLOCK OUTPUT
BUZZER OUTPUT
KEY INPUT
REAL-TIME
OUTPUT PORT
PORT0 P00-P07
PORT2 P20-P23
PORT3 P30-P37
PORT4 P40-P47
PORT5 P50-P57
PORT6 P60-P67
PORT7 P70-P77
PORT8 P80, P82-P87
PORT9 P90-P96
X1 X2 XT1 XT2 RESET
CLO
BUZ
KEY0-KEY4
P00-P07
P80, P82, P83
SDA
SCL
SERIAL
INTERFACE 3
Note
Note Only the µPD784928 subseries supports I2C bus interface.
Remark Internal ROM and RAM capacities differ depending on the product.
8
Data Sheet U12255EJ2V0DS00
PORT10 P100-P103
PORT11 P110-P113
SYSTEM CONFIGURATION EXAMPLE
• Video camera
DFG
DPG
Drum motor M
Capstan motor M
CTL head
Loading motor M
Driver
CFG
Driver
Driver
µ
PD784927, 784928, 784927Y, 784928Y
µ
PD784927
DFGIN DPGIN
PWM0
CFGIN
PWM1
RECCTL+
RECCTL
PWM2
PORT
PORT
PORT
SCK1
SI1
SO1
INTP0
PORT
-
SCK2
SO2
BUSY
Key matrix
INTP0
Camera-
SCK
controlling
SO
microcontroller
SI
PD784038
µ
PORT
Camera block
CS CLK
µ
DATA BUSY
LCD C/D PD7225
Audio/video
signal
processing
circuit
Remote controller signal
Composite sync signal Video head switch Audio head switch Pseudo vertical sync signal
Remote controller reception signal
µ
PC2800A
PORT CSYNCIN
PTO00 PTO01 P80
INTP2
XT1 XT2X1 X2
16 MHz 32.768 kHz
PORT
STRB
PORT
SDA
SCL
Note
Note
+VDD
+V
CS CLK DATA BUSY STB
DD
SDA SCL
SDA SCL
LCD display panel
OSD
µ
PD6461
Mechanical block
EEPROM
TM
Other ICs
Note Pins SCL and SDA are provided for the
Data Sheet U12255EJ2V0DS00
µ
PD784928Y subseries only.
9
• Stationary VCR
Drum motor M
Capstan motor M
CTL head
Loading motor M
Reel motor
µ
PD784927, 784928, 784927Y, 784928Y
µ
PD784927
DFG
DFGIN DPGIN
DPG
Driver
Driver
Driver
Reel FG0
M
M
Driver
Driver
Reel FG1
CFG
PWM0
CFGIN
PWM1
RECCTL+
RECCTL
PWM2
REEL0IN
PWM3
PWM4
REEL1IN
-
PORT
SCK1
SI1
SO1
PORT
SCK2
SO2
PORT
CSYNCIN
PTO00 PTO01
P80
PWM5
PORT
PORT
INTP2
Note
SDA
Note
SCL
STB CLK DOUT DIN
FIP
CS CLK
µ
DATA
Composite sync signal Video head switch Audio head switch Pseudo vertical sync signal
Remote controller reception signal
+V
DD
+V
DD
EEPROM
SDA SCL
TM
C/D
FIP
µ
PD16311
Key matrix
OSD PD6464A
Audio/video signal
processing circuit
Tuner
Mechanical block
µ
PC2800A
Remote controller signal
Low frequency oscillation mode
Note Pins SCL and SDA are provided for the
10
XT1 XT2X1 X2
8 MHz 32.768 kHz
µ
PD784928Y subseries only.
Data Sheet U12255EJ2V0DS00
Other ICs
SDA SCL
µ
PD784927, 784928, 784927Y, 784928Y
CONTENTS
1. DIFFERENCE BETWEEN µPD784928 SUBSERIES AND 784928Y SUBSERIES .................... 12
2. PIN FUNCTION ............................................................................................................................... 13
2.1 Port Pins................................................................................................................................................ 13
2.2 Pins Other Than Port Pins .................................................................................................................. 14
2.3 I/O Circuits of Pins and Processing of Unused Pins...................................................................... 1 6
3. INTERNAL BLOCK FUNCTION ..................................................................................................... 19
3.1 CPU Registers ...................................................................................................................................... 19
3.1.1 General-purpose registers ......................................................................................................... 19
3.1.2 Other CPU registers................................................................................................................... 20
3.2 Memory Space ...................................................................................................................................... 2 1
3.3 Special Function Registers (SFRs) ................................................................................................... 2 4
3.4 Ports....................................................................................................................................................... 3 0
3.5 Real-Time Output Port......................................................................................................................... 31
3.6 Super Timer Unit .................................................................................................................................. 35
3.7 Serial Interface ..................................................................................................................................... 4 1
3.8 A/D Converter ....................................................................................................................................... 44
3.9 VCR Analog Circuits............................................................................................................................ 45
3.10 Watch Function .................................................................................................................................... 50
3.11 Clock Output Function ........................................................................................................................ 51
3.12 Buzzer Output Function ...................................................................................................................... 5 2
4. INTERNAL/EXTERNAL CONTROL FUNCTION ........................................................................... 53
4.1 Interrupt Function ................................................................................................................................53
4.1.1 Vectored interrupt....................................................................................................................... 56
4.1.2 Context switching ....................................................................................................................... 56
4.1.3 Macro service ............................................................................................................................. 57
4.1.4 Application example of macro service ...................................................................................... 59
4.2 Standby Function................................................................................................................................. 62
4.3 Clock Generation Circuit ..................................................................................................................... 64
4.4 Reset Function ..................................................................................................................................... 65
5. INSTRUCTION SET ........................................................................................................................ 66
6. ELECTRICAL SPECIFICATIONS .................................................................................................. 70
7. PACKAGE DRAWING .................................................................................................................... 85
8. RECOMMENDED SOLDERING CONDITIONS ............................................................................. 87
APPENDIX A. DEVELOPMENT TOOLS ............................................................................................ 88
APPENDIX B. RELATED DOCUMENTS ............................................................................................ 91
Data Sheet U12255EJ2V0DS00
11
µ
PD784927, 784928, 784927Y, 784928Y
1. DIFFERENCE BETWEEN µPD784928 SUBSERIES AND 784928Y SUBSERIES
The µPD78F4928 and 78F4928Y are based on the µPD784927 and 784927Y and are provided with a 128K-byte
flash memory instead of a mask ROM.
Table 1-1 shows the differences between the products in the µPD784928 subseries and 784928Y subseries.
µ
Table 1-1. Differences between
PD784928 Subseries and 784928Y Subseries
Part Number
Item Internal ROM Mask ROM Flash memory
Internal RAM 2048 bytes 3584 bytes Internal memory capacity Not provided Provided
select register (IMS) IC pin Provided Not provided VPP pin Not provided Provided Electrical characteristics Refer to the Data Sheet of each product.
µ
PD784927,
µ
PD784927Y
96K bytes 128K bytes
µ
PD784928,
µ
PD784928Y
µ
PD78F4928,
µ
PD78F4928Y
12
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
2. PIN FUNCTION
2.1 Port Pins
Pin Name I/O Shared with: Function
P00-P07 I/O Real-time 8-bit I/O port (port 0).
output port Can be set in input or output mode in 1-bit units.
Can be connected with software pull-up resistors. P20 Input NMI 4-bit I/O port (port 2). P21-P23 INTP0-INTP2 Can be connected with software pull-up resistors (P22 and P23 only). P30-P32 I/O PTO00-PTO02 8-bit I/O port (port 3). P33 SI2/BUSY Can be set in input or output mode in 1-bit units. P34 SO2 Can be connected with software pull-up resistors. P35 SCK2 P36, P37 PWM1, PWM0 P40-P47 I/O 8-bit I/O port (port 4).
Can be set in input or output mode in 1-bit units.
Can be connected with software pull-up resistors.
Can directly drive LED.
P50-P57 I/O 8-bit I/O port (port 5).
Can be set in input or output mode in 1-bit units.
Can be connected with software pull-up resistors.
P60 I/O STRB/CLO 8-bit I/O port (port 6). P61 SCK1/BUZ Can be set in input or output mode in 1-bit units. P62 SO1 Can be connected with software pull-up resistors. P63 SI1 P64 DFGMON/BUZ P65 DPGMON/HWIN P66 CFGMON/PWM4 P67 CTLMON/PWM5 P70-P77 Input ANI0-ANI7 8-bit input port (port 7) P80 I/O Real-time Pseudo VSYNC output 7-bit I/O port (port 8). P82 output port HASW output Can be set in input or output mode P83 ROTC output in 1-bit units. P84 PWM2/SDA P85 PWM3/SCL P86 PTO10 P87 PTO11 P90 I/O ENV 7-bit I/O port (port 9). P91-P95 KEY0-KEY4 Can be set in input or output mode in 1-bit units. P96 Can be connected with software pull-up resistors. P100 Input DPGIN 4-bit input port (port 10). P101 REEL1IN P102 REEL0IN/INTP3 P103 CSYNCIN P110-P113 Input ANI8-ANI11 4-bit input port (port 11).
Note
Note
Can be connected with software pull-up resistors.
Note Pins SCL and SDA are provided for the µPD784928Y subseries only.
Data Sheet U12255EJ2V0DS00
13
µ
PD784927, 784928, 784927Y, 784928Y
2.2 Pins Other Than Port Pins (1/2)
Pin Name I/O Shared with: Function REEL0IN Input P102/INTP3 Reel FG input REEL1IN P101 DFGIN Drum FG, PFG input (ternary) DPGIN P100 Drum PG input CFGIN Capstan FG input CSYNCIN P103 Composite SYNC input CFGCPIN CFG comparator input CFGAMPO Output CFG amplifier output PTO00 Output P30 Programmable timer output of super timer unit PTO01 P31 PTO02 P32 PTO10 P86 PTO11 P87 PWM0 Output P37 PWM output of super timer unit PWM1 P36 PWM2 P84/SDA PWM3 P85/SCL PWM4 P66/CFGMON PWM5 P67/CTLMON HASW Output P82 Head amplifier switch signal output ROTC Output P83 Chrominance rotation signal output ENV Input P90 Envelope signal input SI1 Input P63 Serial data input (serial interface channel 1) SO1 Output P62 Serial data output (serial interface channel 1) SCK1 I/O P61/BUZ Serial clock I/O (serial interface channel 1) SI2 Input P33/BUSY Serial data input (serial interface channel 2) SO2 Output P34 Serial data output (serial interface channel 2) SCK2 I/O P35 Serial clock I/O (serial interface channel 2) BUSY Input P33/SI2 Serial busy signal input (serial interface channel 2) STRB Output P60/CLO Serial strobe signal output (serial interface channel 2) SDA I/O P84/PWM2 I2C bus data I/O SCL I/O P85/PWM3 I2C bus clock I/O ANI0-ANI7 Analog input P70-P77 Analog signal input of A/D converter ANI8-ANI11 P110-P113 CTLIN CTL amplifier input capacitor connection CTLOUT1 Output CTL amplifier output CTLOUT2 I/O Logic signal input/CTL amplifier output RECCTL+, RECCTL– I/O RECCTL signal output/PBCTL signal input CTLDLY External time constant connection (for RECCTL rewriting)
Note
Note
Note Pins SCL and SDA are provided for the µPD784928Y subseries only.
14
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
2.2 Pins Other Than Port Pins (2/2)
Pin Name I/O Shared with: Function VREFC VREF amplifier AC connection DFGMON Output P64/BUZ Drum FG signal output DPGMON P65/HWIN Drum PG signal output CFGMON P66/PWM4 CFG signal output CTLMON P67/PWM5 CTL signal output NMI Input P20 Non-maskable interrupt request input INTP0-INTP2 Input P21-P23 External interrupt request input INTP3 Input P102/REEL0IN KEY0-KEY4 Input P91-P95 Key input signal input CLO Output P60/STRB Clock output BUZ Output P61/SCK1 Buzzer output
P64/DFGMON HWIN Input P65/DPGMON External input of hardware watch counter RESET Input Reset input X1 Input Crystal connection for main system clock oscillation X2 — XT1 Input Crystal connection for subsystem clock oscillation. XT2 Crystal connection for watch clock oscillation AVDD1 Positive power supply to analog amplifier circuit AVDD2 Positive power supply to A/D converter and analog circuits input buffer AVSS1 GND of analog amplifier circuit AVSS2 GND of A/D converter and analog circuits input buffer AVREF Reference voltage input to A/D converter VDD Positive power supply to digital circuits VSS GND of digital circuits IC Internally connected. Directly connect this pin to VSS.
Data Sheet U12255EJ2V0DS00
15
µ
PD784927, 784928, 784927Y, 784928Y
2.3 I/O Circuits of Pins and Processing of Unused Pins
Table 2-1 shows the types of the I/O circuits of the respective pins and processing of the unused pins. Figure
2-1 shows the circuits of the respective types.
Table 2-1. I/O Circuits of Respective Pins and Processing of Unused Pins (1/2)
Pin I/O Circuit Type I/O Recommended Connection of Unused Pins
P00-P07 5-A I/O Input: Connect to VDD.
Output: Leave unconnected. P20/NMI 2 Input Connect to VDD. P21/INTP0 Connect to VDD or VSS. P22/INTP1, P23/INTP2 2-A Connect to VDD. P30/PTO00-P32/PTO02 5-A I/O Input: Connect to VDD. P33/SI2/BUSY 8-A Output: Leave unconnected. P34/SO2 5-A P35/SCK2 8-A P36/PWM1, P37/PWM0 5-A P40-P47 P50-P57 P60/STRB/CLO P61/SCK1/BUZ 8-A P62/SO1 5-A P63/SI1 8-A P64/DFGMON/BUZ 5-A P65/HWIN/DPGMON 8-A P66/PWM4/CFGMON 5-A P67/PWM5/CTLMON P70/ANI0-P77/ANI7 9 Input Connect to VSS. P80 5-A I/O Input: Connect to VDD. P82/HASW Output: Leave unconnected. P83/ROTC P84/PWM2/SDA P85/PWM3/SCL P86/PTO10 5-A P87/PTO11 P90/ENV P91/KEY0-P95/KEY4 8-A P96 5-A
Note
Note
10-A
Note Pins SCL and SDA are provided for the µPD784928Y subseries only.
16
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 2-1. I/O Circuits of Respective Pins and Processing of Unused Pins (2/2)
Pin I/O Circuit Type I/O Recommended Connection of Unused Pins
P100/DPGIN Input When ENDRUM = 0 or ENDRUM = 1 and
SELPGSEPA = 0: Connect to VSS. P101/REEL1IN When ENREEL = 0: Connect to VSS. P102/REEL0IN/INTP3 P103/CSYNCIN When ENCSYN = 0: Connect to VSS. P110/ANI8-P113/ANI11 9 Input Connect to VSS. RECCTL+, RECCTL– I/O When ENCTL = 0 and ENREC = 0: Connect to VSS. DFGIN Input When ENDRUM = 0: Connect to VSS. CFGIN, CFGCPIN When ENCAP = 0: Connect to VSS. CTLOUT1 Output Leave unconnected. CTLOUT2 I/O When ENCTL = 0 and ENCOMP = 0: Connect to VSS.
When ENCTL = 1: Leave unconnected. CFGAMPO Output Leave unconnected. CTLIN When ENCTL = 0: Leave unconnected. VREFC CTLDLY Leave unconnected. AVDD1, AVDD2 Connect to VDD. AVREF, AVSS1, AVSS2 Connect to VSS. RESET 2 — XT1 Connect to VSS. XT2 Leave unconnected.
When ENCTL = 0 and ENCAP = 0 and ENCOMP = 0: Leave unconnected.
IC Directly connect to VSS.
Remark ENCTL : bit 1 of amplifier control register (AMPC)
ENREC : bit 7 of amplifier mode register 0 (AMPM0) ENDRUM : bit 2 of amplifier control register (AMPC) SELPGSEPA: bit 2 of amplifier mode register 0 (AMPM0) ENCAP : bit 3 of amplifier control register (AMPC) ENCSYN : bit 5 of amplifier control register (AMPC) ENREEL : bit 6 of amplifier control register (AMPC) ENCOMP : bit 4 of amplifier control register (AMPC)
Data Sheet U12255EJ2V0DS00
17
µ
PD784927, 784928, 784927Y, 784928Y
Figure 2-1. I/O Circuits of Respective Pins
Type 2
IN
Schmitt trigger input with hysteresis characteristics
Type 2-A
V
DD
P-ch
Pull-up enable
IN
Schmitt trigger input with hysteresis characteristics
Type 5-A
V
DD
Pull-up
enable
Data
Output
disable
V
P-ch
N-ch
P-ch
DD
IN/ OUT
Type 8-A
Pull-up
enable
Data
Output
disable
Type 9
IN
Type 10-A
Pull-up Enable
P-ch N-ch
DD
V
P-ch
N-ch
Comparator
+
-
V
REF
(Threshold voltage)
Input enable
V
P-ch
DD
IN/ OUT
V
DD
P-ch
Input
enable
Data
Open drain
Output disable
V
DD
P-ch
IN/OUT
N-ch
18
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3. INTERNAL BLOCK FUNCTION
3.1 CPU Registers
3.1.1 General-purpose registers
µ
PD784927 has eight banks of general-purpose registers. One bank consists of sixteen 8-bit general-purpose
The registers. Two of these 8-bit registers can be used in pairs as a 16-bit register. Four of the 16-bit general-purpose registers can be used to specify a 24-bit address in combination with an 8-bit address expansion register.
These eight banks of general-purpose registers can be selected by software or context switching function.
The general-purpose registers, except for the address expansion registers V, U, T, and W, are mapped to the internal RAM.
Figure 3-1. Configuration of General-Purpose Register
A (R1) X (R0)
AX (RP0)
B (R3) C (R2)
BC (RP1)
R5 R4
RP2
R7 R6
RP3
R9 R8V
VP (RP4)
VVP (RG4)
R11 R10U
UP (RP5)
UUP (RG5)
D (R13) E (R12)T
DE (RP6)
TDE (RG6)
H (R15) L (R14)W
HL (RP7)
WHL (RG7)
( ): absolute name
8 banks
Caution Although R4, R5, R6, R7, RP2, and RP3 can be used as X, A, C, B, AX, and BC registers,
respectively, by setting the RSS bit of PSW to 1, do not use this function. The function of the RSS bit is planned to be deleted from the future models in the 78K/IV Series.
Data Sheet U12255EJ2V0DS00
19
3.1.2 Other CPU registers
(1) Program counter
The program counter of the updated as the program is executed.
(2) Program status word
This is a register that holds the various statuses of the CPU. Its contents are automatically updated as the program is executed.
µ
PD784927, 784928, 784927Y, 784928Y
µ
PD784927 is 20 bits wide. The value of the program counter is automatically
19 0
PC
12 11 10 9 8
PSWH UF15RBS214RBS113RBS0
PSW
PSWL S7Z
6
RSS
5AC4IE3
Note
0
P/V201CY
Note The RSS flag is provided to maintain compatibility with the microcomputers in the 78K/III Series.
Always clear this flag to 0 except when the software of the 78K/III Series is used.
(3) Stack pointer
This is a 24-bit pointer that holds the first address of the stack. Be sure to write 0 to the high-order 4 bits.
23 0
000200SP
20
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.2 Memory Space
A memory space of 1M bytes can be accessed. The mapping of the internal data area (special function registers and internal RAM) can be selected by using the LOCATION instruction. The LOCATION instruction must be always executed after reset has been cleared, and cannot be used more than once.
(1) When LOCATION 0H instruction is executed
Part Number Internal Data Area Internal ROM Area
µ
PD784927, 784927Y 0F700H-0FFFFH 00000H-0F6FFH
10000H-17FFFH
µ
PD784928, 784928Y 0F100H-0FFFFH 00000H-0F0FFH
10000H-1FFFFH
Remark The area of the internal ROM overlapping the internal data area cannot be used when the
LOCATION 0 instruction is executed.
Part Number Unusable Area
µ
PD784927, 784927Y 0F700H-0FFFFH (2304 bytes)
µ
PD784928, 784928Y 0F100H-0FFFFH (3840 bytes)
(2) When LOCATION 0FH instruction is executed
Part Number Internal Data Area Internal ROM Area
µ
PD784927, 784927Y FF700H-FFFFFH 00000H-17FFFH
µ
PD784928, 784928Y FF100H-FFFFFH 00000H-1FFFFH
Data Sheet U12255EJ2V0DS00
21
µ
(256 bytes)
Special function registers (SFRs)
Internal ROM
(63232
bytes)
Internal RAM
(2048 bytes)
Cannot be used
General-purpose registers
(128 bytes)
Macro service control
word area (54 bytes)
Data area (512 bytes)
Program/data area
(1536 bytes)
Note 2
CALLF entry area
(2K bytes)
Program/data area
Note 3
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
Internal RAM
(2048 bytes)
Cannot be used
Internal ROM
(96K bytes)
Note 4
When LOCATION 0H instruction is executed
Note 1
When LOCATION 0FH instruction is executed
Internal ROM
(32768 bytes)
FFFFFH
18000H
17FFFH
10000H
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0F700H
0F6FFH
00000H
0FEFFH
0FE80H
0FE7FH
0FE3BH
0FE06H
0FD00H
0FCFFH
0F700H
17FFFH
10000H
0F6FFH
01000H
00800H
007FFH
00080H
0007FH
00040H
0003FH
00000H 00000H
17FFFH
18000H
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
FF6FFH
FF700H
FFEFFH
FFE80H
FFE7FH
FFE3BH
FFE06H
FFD00H
FFCFFH
FF700H
17FFFH
Special function registers (SFRs)
(256 bytes)
Note 4
Note 1
00FFFH
PD784927, 784928, 784927Y, 784928Y
PD784927, 784927Y
µ
Figure 3-2. Memory Map of
2. The 2304 bytes in this area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. When LOCATION 0H instruction is executed: 96000 bytes, when LOCATION 0FH instruction is executed: 98304 bytes
4. Base area or entry area for reset or interrupt. Excluding the internal RAM for reset.
Notes 1. Accessed in external memory expansion mode
22
Data Sheet U12255EJ2V0DS00
µ
(256 bytes)
Special function registers (SFRs)
Internal ROM
(61696
bytes)
Internal RAM
(3584 bytes)
Cannot be used
General-purpose registers
(128 bytes)
Macro service control
word area (54 bytes)
Data area (512 bytes)
Program/data area
(3072 bytes)
Note 2
CALLF entry area
(2K bytes)
Program/data area
Note 3
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
Internal RAM
(3584 bytes)
Cannot be used
Internal ROM
(128K bytes)
Note 4
When LOCATION 0H instruction is executed
Note 1
When LOCATION 0FH instruction is executed
Internal ROM
(65536 bytes)
FFFFFH
20000H
1FFFFH
10000H
0FFFFH
0FFDFH
0FFD0H
0FF00H
0FEFFH
0F100H
0F0FFH
00000H
0FEFFH
0FE80H
0FE7FH
0FE3BH
0FE06H
0FD00H
0FCFFH
0F100H
1FFFFH
10000H
0F0FFH
01000H
00800H
007FFH
00080H
0007FH
00040H
0003FH
00000H 00000H
1FFFFH
20000H
FFFFFH
FFFDFH
FFFD0H
FFF00H
FFEFFH
FF0FFH
FF100H
FFEFFH
FFE80H
FFE7FH
FFE3BH
FFE06H
FFD00H
FFCFFH
FF100H
1FFFFH
Special function registers (SFRs)
(256 bytes)
Note 4
Note 1
00FFFH
PD784927, 784928, 784927Y, 784928Y
PD784928, 784928Y
µ
Figure 3-3. Memory Map of
2. The 3840 bytes in this area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. When LOCATION 0H instruction is executed: 127232 bytes, when LOCATION 0FH instruction is executed: 131072 bytes
4. Base area or entry area for reset or interrupt. Excluding the internal RAM for reset.
Notes 1. Accessed in external memory expansion mode
Data Sheet U12255EJ2V0DS00
23
µ
PD784927, 784928, 784927Y, 784928Y
3.3 Special Function Registers (SFRs)
Special function registers are assigned special functions and mapped to a 256-byte space of addresses FF00H through FFFFH. These registers include mode registers and control registers that control the internal peripheral hardware units.
Caution Do not access an address to which no SFR is assigned. If such an address is accessed by
µ
mistake, the
Table 3-1 lists the special function registers (SFRs). The meanings of the symbols in this table are as follows:
Symbol .................................... Abbreviation of an SFR. This abbreviation is reserved for NEC’s assembler
R/ W ......................................... Indicates whether the SFR in question can be read or written.
PD784927 may be deadlocked. This deadlock can be cleared only by reset input.
(RA78K4). With a C compiler (CC78K4), the abbreviation can be used as sfr variable by the #pragma sfr instruction.
R/W : Read/write R : Read only W : Write only
Bit length................................. Indicates the bit length (word length) of the SFR.
Bit units for manipulation ....... Indicates bit units in which the SFR in question can be manipulated. An SFR that
can be manipulated in 16-bit units can be used as the operand sfrp of an instruction. Specify an even address to manipulate this SFR. An SFR that can be manipulated in 1-bit units can be used for a bit manipulation instruction.
After clearing reset ................. Indicates the status of each register immediately after clearing reset.
Caution The addresses shown in Table 3-1 are used when the LOCATION 0H instruction is executed. Add
“F0000H” to the address values shown in the table when the LOCATION 0FH instruction is executed.
24
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (1/5)
Address Special Function Register (SFR) Name Symbol R/W Bit Bit Units for Manipulation After Clearing
Length 1 bit 8 bits 16 bits Reset FF00H Port 0 P0 R/W 8 Undefined FF02H Port 2 P2 R 8 — FF03H Port 3 P3 R/W 8 — FF04H Port 4 P4 8 — FF05H Port 5 P5 8 — FF06H Port 6 P6 8 — FF07H Port 7 P7 R 8 — FF08H Port 8 P8 R/W 8 — FF09H Port 9 P9 8
FF0AH Port 10 P10 R 8 — FF0BH Port 11 P11 8 — FF0EH Port 0 buffer register L P0L R/W 8
FF0FH Port 0 buffer register H P0H 8 — FF10H Timer 0 compare register 0 CR00 16 Cleared to 0 FF11H Event counter compare register 0 ECC0 W 8 — FF12H Timer 0 compare register 1 CR01 R/W 16 — FF13H Event counter compare register 1 ECC1 W 8 — FF14H Timer 0 compare register 2 CR02 R/W 16 — FF15H Event counter compare register 2 ECC2 W 8 — FF16H Timer 1 compare register 0 CR10 R/W 16 — FF17H Event counter compare register 3 ECC3 W 8 — FF18H Timer 1 compare register 1 CR11 R/W 16
FF1AH Timer 1 compare register 2 CR12 R 16 — FF1CH Timer 1 compare register 3 CR13 R/W 16 — FF1EH Timer 2 compare register 0 CR20 16
FF20H Port 0 mode register PM0 8 FFH FF23H Port 3 mode register PM3 8 — FF24H Port 4 mode register PM4 8 — FF25H Port 5 mode register PM5 8 — FF26H Port 6 mode register PM6 8 — FF28H Port 8 mode register PM8 8 FDH FF29H Port 9 mode register PM9 8 7FH
FF2EH Real-time output port 0 control register RTPC 8 00H
FF30H Timer counter 0 TM0 R 16 Cleared to 0 FF31H Event counter EC R/W 8 — FF32H Timer counter 1 TM1 R 16 — FF34H Free running counter (bits 0-15) FRCL 16 0000H FF35H Free running counter (bits 16-21) FRCH 8 00H FF36H Timer counter 2 TM2 16 Cleared to 0
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
Data Sheet U12255EJ2V0DS00
25
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (2/5)
Address Special Function Register (SFR) Name Symbol R/W Bit Bit Units for Manipulation After Clearing
Length 1 bit 8 bits 16 bits Reset FF38H Timer control register 0 TMC0 R/W 8 00H FF39H Timer control register 1 TMC1 8 — FF3AH Timer control register 2 TMC2 8 — FF3BH Timer control register 3 TMC3 8 —00×00000 FF3CH Timer counter 3 TM3 R 16 Cleared to 0 FF3DH Timer control register 4 TMC4 R/W 8 ××000000 FF3EH Timer counter 4 TM4 R 16 Cleared to 0 FF43H Port 3 mode control register PMC3 R/W 8 00H FF48H Port 8 mode control register PMC8 8 — FF4BH Control mode select register CMS 8 — FF4DH Trigger source select register 0 TRGS0 8 — FF4EH Pull-up resistor option register L PUOL 8 — FF4FH Pull-up resistor option register H PUOH 8 — FF50H Input control register ICR 8 10H FF51H Up/down counter count register UDC 8 Undefined FF52H Event divider counter EDV R 8 Cleared to 0 FF53H Capture mode register CPTM R/W 8 00H FF54H Timer counter 5 TM5 R 16 Cleared to 0 FF56H Timer 3 capture register 0 CPT30 16 — FF58H Timer 0 output mode register TOM0 W 8 ××000000 FF59H Timer 0 output control register TOC0 8 00H
ADML
Note 1
R/W 8 80H
Note 2
8
FF5AH Timer 1 output mode register TOM1 FF5BH Timer 1 output control register TOC1 W 8 00H FF5CH Timer 3 compare register 0 CR30 R/W 16 Cleared to 0 FF5EH Timer 3 compare register 1 CR31 16 — FF60H Port 8 buffer register L P8L 8 000×0×0× FF63H Up/down counter compare register UDCC W 8 Undefined FF65H Trigger source select register 1 TRGS1 R/W 8 00H FF66H Port 6 mode control register PMC6 8 — FF68H A/D converter mode register ADM 16 0000H
FF6AH A/D conversion result register ADCR R 8 Undefined FF6CH Hardware watch counter 0 HW0 R/W 16 Not affected FF6EH Hardware watch counter 1 HW1 R 16 by reset FF6FH Watch mode register WM R/W 8 —00××0×00 FF70H PWM control register 0 PWMC0 8 05H
Notes 1. When the TOM1 is read, the write sequence of the REC driver is read (bits 0 and 1).
2. ADML is the low-order 8 bits of ADM and can be manipulated in 1- or 8-bit units.
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
26
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (3/5)
Address Special Function Register (SFR) Name Symbol R/W Bit Bit Units for Manipulation After Clearing
Length 1 bit 8 bits 16 bits Reset FF71H PWM control register 1 PWMC1 R/W 8 15H FF72H PWM0 modulo register PWM0 16 0000H FF73H PWM2 modulo register PWM2 8 00H FF74H PWM1 modulo register PWM1 16 0000H FF75H PWM3 modulo register PWM3 8 00H FF76H PWM5 modulo register PWM5 16 0000H FF77H PWM4 modulo register PWM4 8 00H FF78H Event divider control register EDVC W 8 Cleared to 0 FF79H Clock output mode register CLOM R/W 8 00H
FF7AH Timer 4 capture/compare register 0 CR40 16 Cleared to 0 FF7BH Clock control register CC 8 00H FF7CH Timer 4 capture register 1 CR41 R 16 Cleared to 0 FF7DH Capture/compare control register CRC W 8 00H FF7EH Timer 5 compare register CR50 R/W 16 Cleared to 0
FF80H I2C control register IICC 8 00H FF82H I2C clock select register IICCL 8 — FF84H Serial mode register 1 CSIM1 8 — FF85H Serial shift register 1 SIO1 8 Undefined FF86H Slave address register SVA 8 00H FF88H Serial mode register 2 CSIM2 8 — FF89H Serial shift register 2 SIO2 8 Undefined
FF8AH Serial control register 2 CSIC2 8 00H
Note
Note
IICS R 8
IIC R/W 8
FF8CH I2C bus status register FF8EH I2C bus shift register
FF90H Amplifier mode register 2 AMPM2 8
FF91H Head amplifier switch output control register HAPC 8 — FF94H Amplifier control register AMPC 8 — FF95H Amplifier mode register 0 AMPM0 8 — FF96H Amplifier mode register 1 AMPM1 8 — FF97H Gain control register CTLM 8 — FF98H VISS detection circuit shift register 0 VSFT0 16 0000H FF99H
FF9AH VISS detection circuit shift register 1 VSFT1 16 — FF9BH FFA0H External interrupt mode register INTM0 8 000000×0 FFA1H External capture mode register 1 INTM1 8 00H FFA2H External capture mode register 2 INTM2 8 — FFA3H VISS detection circuit control register VDC 8
Note These registers are provided for the µPD784928Y subseries only.
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
Data Sheet U12255EJ2V0DS00
27
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (4/5)
Address Special Function Register (SFR) Name Symbol R/W Bit Bit Units for Manipulation After Clearing
Length 1 bit 8 bits 16 bits Reset FFA4H VISS detection circuit up/down counter register VUDC R/W 8 00H FFA5H VUDC value setting register VUDST 8 — FFA6H Key interrupt control register KEYC 8 70H FFA7H VISS pulse pattern setting register VPS 8 00H FFA8H In-service priority register ISPR R 8 — FFAAH Interrupt mode control register IMC R/W 8 80H FFACH Interrupt mask flag register MK0L FFADH MK0H 8 FFAEH MK1L FFAFH MK1H 8 FFB0H FRC capture register 0L CPT0L R 16 Cleared to 0 FFB1H FRC capture register 0H CPT0H 8 — FFB2H FRC capture register 1L CPT1L 16 — FFB3H FRC capture register 1H CPT1H 8 — FFB4H FRC capture register 2L CPT2L 16 — FFB5H FRC capture register 2H CPT2H 8 — FFB6H FRC capture register 3L CPT3L 16 — FFB7H FRC capture register 3H CPT3H 8 — FFB8H FRC capture register 4L CPT4L 16 — FFB9H FRC capture register 4H CPT4H 8 — FFBAH FRC capture register 5L CPT5L 16 — FFBBH FRC capture register 5H CPT5H 8 — FFBDH VSYNC separation circuit control register VSC R/W 8 00H FFBEH FFBFH VSYNC separation circuit compare register VSCMP 8 FFH FFC0H Standby control register STBC 8 0011×000 FFC4H Execution speed select register MM W 8 20H FFCEH CPU clock status register PCS R 8 00H FFCFH FFE0H Interrupt control register (INTP0) PIC0 R/W 8 43H FFE1H Interrupt control register (INTCPT3) CPTIC3 8 — FFE2H Interrupt control register (INTCPT2) CPTIC2 8 — FFE3H Interrupt control register (INTCR12) CRIC12 8 — FFE4H Interrupt control register (INTCR00) CRIC00 8 — FFE5H Interrupt control register (INTCLR1) CLRIC1 8 — FFE6H Interrupt control register (INTCR10) CRIC10 8
V
SYNC
separation circuit up/down counter register
Oscillation stabilization time specification register
MK0
MK1
VSUDC 8
OSTS W 8
8 FFH
8
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
28
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Table 3-1. Special Function Registers (5/5)
Address Special Function Register (SFR) Name Symbol R/W Bit Bit Units for Manipulation After Clearing
Length 1 bit 8 bits 16 bits Reset FFE7H Interrupt control register (INTCR01) CRIC01 R/W 8 43H FFE8H Interrupt control register (INTCR02) CRIC02 8 — FFE9H Interrupt control register (INTCR11) CRIC11 8 — FFEAH Interrupt control register (INTCPT1) CPTIC1 8 — FFEBH Interrupt control register (INTCR20) CRIC20 8 — FFECH Interrupt control register (INTIIC) FFEDH Interrupt control register (INTTB) TBIC 8 — FFEEH Interrupt control register (INTAD) ADIC 8 — FFEFH Interrupt control register (INTP2)
Interrupt control register (INTCR40) FFF0H Interrupt control register (INTUDC) UDCIC 8 — FFF1H Interrupt control register (INTCR30) CRIC30 8 — FFF2H Interrupt control register (INTCR50) CRIC50 8 — FFF3H Interrupt control register (INTCR13) CRIC13 8 — FFF4H Interrupt control register (INTCSI1) CSIIC1 8 — FFF5H Interrupt control register (INTW) WIC 8 ×1000011 FFF6H Interrupt control register (INTVISS) VISIC 8 43H FFF7H Interrupt control register (INTP1) PIC1 8 — FFF8H Interrupt control register (INTP3) PIC3 8
FFFAH Interrupt control register (INTCSI2) CSIIC2 8
Note 1
Note 2
Note 2
IICIC 8
PIC2 8
CRIC40
Notes 1.µPD784928Y subseries only.
2. PIC2 and CRIC40 are at the same address (register).
Remark Cleared to 0: Counter is initialized to 0 within 16 clocks after the reset signal has been cleared (the
contents before initialization are undefined).
Data Sheet U12255EJ2V0DS00
29
µ
PD784927, 784928, 784927Y, 784928Y
3.4 Ports
The µPD784927 is provided with the ports shown in Figure 3-3. Table 3-2 shows the function of each port.
Figure 3-4. Port Configuration
Port 0
Port 2
Port 3
Port 4
Port 5
P00
P07
P20
P23 P30
P37
P40
P47 P50
P57
P60
P67
P70-P77
P80 P82
P87
P90
P96
P100 P103
P110 P113
Port 6
8
Port 7
Port 8
Port 9
Port 10
Port 11
Table 3-2. Port Function
Name Pin Name Function Specification of Pull-up Resistor Port 0 P00-P07 Can be set in input or output mode in Pull-up resistors are connected to all
1-bit units. pins in input mode.
Port 2 P20-P23 Input port Pull-up resistors are connected to pins
P22 and P23.
Port 3 P30-P37 Can be set in input or output mode in Pull-up resistors are connected to all pins
1-bit units. in input mode.
Port 4 P40-P47 Can be set in input or output mode in
1-bit units.
Can directly drive LED. Port 5 P50-P57 Can be set in input or output mode in Port 6 P60-P67 1-bit units. Port 7 P70-P77 Input port Pull-up resistor is not provided. Port 8 P80, P82-P87 Can be set in input or output mode in Pull-up resistors are connected to all pins Port 9 P90-P96 1-bit units. in input mode.
Port 10 P100-P103 Input port Pull-up resistor is not provided. Port 11 P110-P113
30
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.5 Real-Time Output Port
A real-time output port consists of a port output latch and a buffer register (refer to Figure 3-5).
The function to transfer the data prepared in advance in the buffer register to the output latch when a trigger such as a timer interrupt occurs, and output the data to an external device is called a real-time output function. A port used in this way is called a real-time output port (RTP).
µ
Table 3-3 shows the real-time output ports of the
PD784927.
Table 3-4 shows the trigger sources of RTPs.
Figure 3-5. Configuration of RTP
Buffer register
Output trigger
Port output latch
Port
Table 3-3. Bit Configuration of RTP
RTP Shared with: Number of Bits of Number of Bits That Can Remark
Real-Time Output Data Be Specified as RTP
RTP0 Port 0 4 bits × 2 channels or 4-bit units
8 bits × 1 channel
RTP8 Port 8 1 bit × 1 channel and 1-bit units Pseudo VSYNC output: 1 channel (RTP80)
2 bits × 1 channel Head amplifier switch: 1 channel (RTP82)
Chrominance rotation signal output: 1 channel (RTP83)
Table 3-4. Trigger Sources of RTP
Trigger Source INTCR00 INTCR01 INTCR02 INTCR13 INTCR50 INTP0 Remark
RTP RTP0 High-order 4 bits
Low-order 4 bits All 8 bits
RTP8 Bit 0 Note 1
Bits 2 and 3 Note 2
Notes 1. Select one of the four trigger sources.
2. When the real-time output port mode is set by the port mode control register 8 (PMC8), the HASW and
ROT-C signals that are set by the head amplifier switch output control register (HAPC) are directly output. The HASW and ROT-C signals are synchronized with HSW output (TM0-CR00 coincidence signal). However, the set signal is output immediately when the HAPC register is rewritten.
Data Sheet U12255EJ2V0DS00
31
µ
PD784927, 784928, 784927Y, 784928Y
Figures 3-6 and 3-7 show the block diagrams of RTP0 and RTP8. Figure 3-8 shows the types of RTP output trigger
sources.
Figure 3-6. Block Diagram of RTP0
Internal bus
8 4 4
Real-time output port 0 control register (RTPC)
INTP0 INTCR01 INTCR02
Output trigger
Control circuit
Remark INTCR01: TM0-CR01 coincidence signal
INTCR02: TM0-CR02 coincidence signal
Figure 3-7. Block Diagram of RTP8
8
Head amplifier output control register (HAPC)
SEL
SEL
SEL
00
ROTC
ENV
HASW
PB MOD2PBMOD1PBMOD0
Buffer register
P0H P0L
44
Output latch (P0)
P07 P00
Internal bus
8
Port 8 buffer register L (P8L)
0
P8L4
SEL
P8L20P8L0
MD80
00
8
8
32
TM0-CR00
coincidence signal
PMC80
0 PMC82 PMC83
PMC8
TRG
P80
HASW, ROT-C control circuit
Output latch (P8)
HSYNC
superimposition
circuit
P83P82 P80
Data Sheet U12255EJ2V0DS00
Pseudo V
SYNC
control circuit
output
INTP0
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-8. Types of RTP Output Trigger Sources
Real-time output port 0 control register (RTPC)
Capture
TM0
CR00
CR01
CR02
TM1
CR10
CR11
CR12
CR13
TM5
Interrupt and timer output
Interrupt and timer output
Interrupt
Selector
Selector
Trigger source select register 0 (TRGS0)
Trigger of P0H Trigger of P0L
Trigger of P82 and P83
Trigger of P80
CR50
Interrupt
Data Sheet U12255EJ2V0DS00
33
µ
PD784927, 784928, 784927Y, 784928Y
RTP80 can output low-level, high-level, and high-impedance values real-time. Because RTP80 can superimpose a horizontal sync signal, it can be used to create pseudo vertical sync signal.
When RTP80 is set in the pseudo V
SYNC output mode, it repeatedly outputs a specific pattern when an output trigger
occurs.
Figure 3-9 shows the operation timing of RTP80.
Figure 3-9. Example of Operation Timing of RTP80
High impedance
P80
Trigger signal
High impedance
P80
Trigger signal
High level
Low level
High level
Low level
(a) When H
SYNC signal is superimposed
(b) Pseudo VSYNC output mode
34
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.6 Super Timer Unit
The µPD784927 is provided with a super timer unit that consists of the timers, and VCR special circuits such as
a VISS detection circuit and a V
SYNC separation circuit, etc., shown in Table 3-5.
Table 3-5. Configuration of Super Timer Unit
Unit Name Timer/Counter Resolution
Timer 0 TM0 1 µs 65.5 ms CR00 Controls delay of video head switching signal
(16-bit timer) CR01 Controls delay of audio head switching signal
EC ECC0, ECC1, Creates internal head switching signal
(8-bit counter) ECC2, ECC3 Free FRC 125 ns 524 ms CPT0 Detects reference phase (to control drum phase) running (22-bit counter) CPT1 Detects phase of drum motor (to control drum counter phase)
Timer 1 TM1 1 µs 65.5 ms CR10 Playback: Creates internal reference signal
(16-bit timer) Recording: Buffer oscillator in case VSYNC is
TM3 1 µs or 65.5 ms or CR30, CR31 Controls duty detection timing of PBCTL signal
(16-bit timer) 1.1 µs 71.5 ms CPT30 Measures cycle of PBCTL signal
EDV EDVC Divides CFG signal frequency
(8-bit counter) Timer 2 TM2 1 µs 65.5 ms CR20 Can be used as interval timer (to control system)
(16-bit timer) Timer 4 TM4 2 µs 131 ms CR40 Detects duty of remote controller signal (to decode
(16-bit timer) remote controller signal)
Timer 5 TM5 2 µs 131 ms CR50 Can be used as interval timer (to control system)
(16-bit timer) Up/down UDC UDCC Creates linear tape counter counter (5-bit counter) PWM PWM0, PWM1, 16-bit resolution (carrier frequency: 62.5 kHz) output unit PWM5
Maximum
Count Time
Register Remark
CR02 Controls pseudo VSYNC output timing
CPT2 Detects speed of drum motor (to control drum
speed)
CPT3 Detects speed of capstan motor (to control speed
of capstan motor)
CPT4, CPT5 Detects remaining tape for reel FG
missing CR11 Controls RECCTL output timing CR12 Detects phase of capstan motor (to control capstan
phase)
CR13 Controls VSYNC mask as noise preventive measures
CR41 Measures cycle of remote controller signal (to de
code remote controller signal)
PWM2, PWM3, 8-bit resolution (carrier frequency: 62.5 kHz) PWM4
Data Sheet U12255EJ2V0DS00
35
µ
PD784927, 784928, 784927Y, 784928Y
(1) Timer 0 unit
Timer 0 unit creates head switching signal and pseudo VSYNC output timing from the PG and FG signals of the drum motor. This unit consists of an event counter (EC: 8 bits), compare registers (ECC0 through ECC3), a timer (TM0: 16 bits), and compare registers (CR00 through CR02). A signal indicating coincidence between the value of timer 0 and the value of a compare register can be used as the output trigger of the real-time output port.
(2) Free running counter unit
The free running counter unit detects the speed and phase of the drum motor, and the speed and reel speed of the capstan motor. This unit consists of a free running counter (FRC), capture registers (CPT0 through CPT5), a V circuit, and a HSYNC separation circuit.
(3) Timer 1 unit
Timer 1 unit is a reference timer unit synchronized with the frame cycle and creates the RECCTL signal, detects the phase of the capstan motor, and detects the duty factor of the PBCTL signal. This unit consists of the following three groups:
SYNC separation
Timer 1 (TM1), compare registers (CR10, CR11, and CR13), and capture register (CR12)
Timer 3 (TM3), compare registers (CR30 and CR31), and capture register (CPT30)
Event divider counter (EDV) and compare register (EDVC)
The TM1-CR13 coincidence signal can be used for automatic unmasking of V the real-time output port.
SYNC or as the output trigger of
36
Data Sheet U12255EJ2V0DS00
PTO00
PTO01
PTO02
µ
PD784927, 784928, 784927Y, 784928Y
PTO10
PTO11
To PBCTL signal
input block
INTCR00
INTCR01
INTCR02
RTP
RTP, A/D
RTP, A/D
Output control circuit
Selector
SelectorSelector
Clear
TM0
Mask
Figure 3-10. Block Diagram of Super Timer Unit (TM0, FRC, TM1)
Selector
Divider
Writes
00H to EC
Output control circuit
Output control circuit
(Superimposition) (Superimposition)
ECC2
ECC1
separation
SYNC
H
F/F
ECC0
CR00
CR01
Selector
Selector
Clear
EC
Selector
CR02
F/F
ECC3
To P80
circuit
separation
SYNC
V
INTCLR1
FRC
Selector
circuit
Selector
Analog circuit
INTCPT1
CPT0
CPT1
Capture
Capture
Selector
Mask
INTCPT2
INTCPT3
CPT2
CPT3
Capture
Selector
INTP3
CPT4
CPT5
Capture
Capture
Capture
SelectorSelector
INTCR10
Output control circuit
Selector
Clear
TM1
Selector
EDV
Clear
EDVC
INTCR11
INTCR12
INTCR13
INTCR30
Output control circuit
CR10
CR11
CR12
CR13
CR30
CR31
Selector
FFLVL
CTL
CPT30
Capture
Capture
Clear
TM3
Selector
F/F
DPGIN
DFGIN
CSYNCIN
Data Sheet U12255EJ2V0DS00
REEL0IN
REEL1IN
CFGIN
PTO10
PBCTL
PTO11
37
µ
PD784927, 784928, 784927Y, 784928Y
(4) Timer 2 unit
Timer 2 unit is a general-purpose 16-bit timer unit. This unit consists of a timer (TM2) and a compare register (CR20). The timer is cleared when the TM2-CR20 coincidence signal occurs, and at the same time, an interrupt request is generated.
Figure 3-11. Block Diagram of Timer 2 Unit
Clear
TM2
CR20
INTCR20
(5) Timer 4 unit
Timer 4 unit is a general-purpose 16-bit timer unit. This unit consists of a timer (TM4), a capture/compare register (CR40), and a capture register (CR41). The value of the timer is captured to CR40/CR41 when the INTP2 signal is input. This timer can be used to decode a remote controller signal.
Figure 3-12. Block Diagram of Timer 4 Unit
Mask
Clear
TM4
INTP2
Selector
CR40 CR41
INTCR40
(6) Timer 5 unit
Timer 5 unit is a general-purpose 16-bit timer unit. This unit consists of a timer (TM5) and a compare register (CR50). The timer is cleared by the TM5-CR50 coincidence signal, and at the same time, an interrupt request is generated.
38
Figure 3-13. Block Diagram of Timer 5 Unit
Clear
TM5
CR50
Data Sheet U12255EJ2V0DS00
INTCR50
RTP, A/D
µ
PD784927, 784928, 784927Y, 784928Y
(7) Up/down counter unit
The up/down counter unit is a counter that realizes a linear time counter. This unit consists of an up/down counter (UDC) and a compare register (UDCC). The up/down counter counts up the rising edges of PBCTL and counts down the falling edges of PBCTL. When the value of the up/down counter coincides with the value of the compare register, or when the counter underflows, an interrupt request is generated.
Figure 3-14. Block Diagram of Up/Down Counter Unit
SELUD
PTO10 PTO11
PBCTL
Selector
P77
EDVC output
Selector
Selector Selector
UP/DOWN
UDC
UDCC
INTUDC
(8) PWM output unit
The PWM output unit has three 16-bit accuracy output lines (PWM0, PWM1, and PWM5) and 8-bit accuracy output lines (PWM2 through PWM4). The carrier frequency of all the output lines is 62.5 kHz (f
CLK = 8 MHz).
PWM0 and PWM1 can be used to control the drum motor and capstan motor.
Figure 3-15. Block Diagram of 16-Bit PWM Output Unit
(n = 0, 1, 5)
Internal bus
16 8
PWMn
15 8 7 0
PWMC0
16 MHz
Reload
8-bit down counter
1/256
88
Reload
Reload control
PWM pulse
generation circuit
8-bit counter
Data Sheet U12255EJ2V0DS00
To selector
Output control
circuit
PWMn
RESET
39
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-16. Block Diagram of 8-Bit PWM Output Unit
Internal bus
PWM2
8-bit comparator
16 MHz
(9) VISS detection circuit
Figure 3-17. Block Diagram of VISS Detection Circuit
PBCTL
PWM3
8-bit comparator
PWM counter
PWM4
8-bit comparator
PWMC1
Output control
circuit
Output control
circuit
Output control
circuit
PWM4
PWM3
PWM2
CFG signal
CLK
/16
f f
CLK
/64
CLK
/256
f
Selector
VPS
(VISS pulse pattern
setting register)
UP/DOWN
VUDC
(8-bit up/down counter)
VISS malfunction prevention circuit
VSFT0
(shift register 0)
(VUDC value
setting register)
VCMP
(compare register)
VUDST
VSFT1
(shift register 1)
Coincidence
INTVISS
40
Data Sheet U12255EJ2V0DS00
(10) VSYNC separation circuit
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-18. Block Diagram of V
C
SYNC
signal
f
CLK
/4
VSUDC
(8-bit up/down
CLK
/8
f
Selector
counter)
VSCMP
(8-bit compare
register)
"00"
SYNC Separation Circuit
Digital noise rejection circuit
V
SYNC
F/F
S
Q
R
Selector
V
3.7 Serial Interface
The µPD784927 is provided with the serial interfaces shown in Table 3-6. Data can be automatically transmitted or received through these serial interfaces, when the macro service is used.
SYNC
Table 3-6. Types of Serial Interfaces
Name Function
Serial interface channel 1 Clocked serial interface (3-wire)
Bit length: 8 bits
Clock rate: External clock/31.25 kHz/62.5 kHz/125 kHz/250 kHz/500 kHz/1 MHz
(fCLK = 8 MHz)
MSB first/LSB first selectable
Serial interface channel 2 Clocked serial interface (3-wire)
Bit length: 8 bits
Clock rate: External clock/31.25 kHz/62.5 kHz/125 kHz/250 kHz/500 kHz/1 MHz
(fCLK = 8 MHz)
MSB first/LSB first selectable
BUSY/STRB control function
Serial interface channel 3 I2C bus interface
For multimaster
Data Sheet U12255EJ2V0DS00
41
(1) Serial interface channels 1, 2
Figure 3-19. Block Diagram of Serial Interface Channel n (n = 1 or 2)
SIn /BUSY
SOn
Selector
µ
PD784927, 784928, 784927Y, 784928Y
Internal bus
SIOn register CSIMn register
Serial clock counter
INTCSIn
SCKn
f
CLK
/8
f
CLK
/16
CLK
/32
f f
CLK
/64
f
CLK
/128
CLK
/256
f
STRB
Busy detection circuit
Strobe generation circuit
Selector
CSIC2 register
Internal bus
Remark The circuits enclosed in the broken line are provided to serial interface channel 2 only.
42
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(2) Serial interface channel 3 (µPD784928Y subseries only)
This channel transfers 8-bit data with multiple devices using two lines: serial clock (SCL) and serial data bus (SDA).
2
It conforms to the I
C bus format, and can output a “start condition”, “data”, and “stop condition” onto the serial data bus during transmission. This data is automatically detected by hardware during reception. SCL and SDA are open-drain output pins and therefore, must be connected with a pull-up resistor.
Figure 3-20. Serial Interface Channel 3
DD
+V
DD
+V
Master CPU1
Slave CPU1
SDA
SCL
Serial data bus Serial clock
SDA
SCL
SDA
SCL
SDA
SCL
SDA
SCL
Master CPU2 Slave CPU2
Address 1
Slave CPU3
Address 2
Slave IC
Address 3
Slave IC
Address N
Data Sheet U12255EJ2V0DS00
43
µ
PD784927, 784928, 784927Y, 784928Y
3.8 A/D Converter
The µPD784927Y has an analog-to-digital (A/D) converter with 12 multiplexed analog inputs (ANI0 through ANI11). This A/D converter is of successive approximation type, and the conversion result is held by an 8-bit A/D conversion
µ
result register (ADCR) (conversion time: 10
A/D conversion can be started in the following two modes:
Hardware start : Conversion is started by a hardware trigger
Software start : Conversion is started by setting a bit of the A/D converter mode register (ADM).
After conversion has been started, the A/D converter operates in the following modes:
Scan mode : Sequentially selects more than one analog input to obtain data to be converted from all the pins.
Select mode: Use only one pin for analog input to obtain successive data to be converted.
When the conversion result is transferred to ADCR, interrupt request INTAD is generated. By processing this
interrupt with the macro service, the conversion result can be successively transferred to memory.
A mode in which starting A/D conversion of the next pin is kept pending until the value of ADCR is read is also available. When this ode is used, reading the conversion result by mistake when timing is shifted because an interrupt is disabled can be prevented.
s at fCLK = 8 MHz).
Note
.
Note A hardware trigger is the following coincidence signals, one of which is selected by the trigger source select
register 1 (TRGS1):
TM0-CR01 coincidence signal
TM0-CR02 coincidence signal
TM1-CR13 coincidence signal
TM5-CR50 coincidence signal
44
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Figure 3-21. Block Diagram of A/D Converter
ADM.7 (CS)
ANI0 ANI1 ANI2 ANI3
.
.
.
.
.
.
ANI11
TM0-CR01 coincidence TM0-CR02 coincidence TM1-CR13 coincidence TM5-CR50 coincidence
Trigger source select register 1 (TRGS1)
A/D converter mode
Input selectorSelector
Conversion trigger
Trigger enable
register (ADM)
16
Sample & hold circuit
Successive approximation
register (SAR)
Control circuit
Delay detection
circuit
A/D conversion result
register (ADCR)
Internal bus
Voltage comparator
8
8
INTAD
A/D conversion
end interrupt
Series resistor string
R/2
R
Tap selector
R/2
1 : ON
AV
SS2
AV
REF
3.9 VCR Analog Circuits
µ
PD784927 is provided with the following VCR analog circuits:
The
CTL amplifier
RECCTL driver (rewritable)
DPG amplifier
DFG amplifier
DPFG separation circuit (ternary separation circuit)
CFG amplifier
Reel FG comparator (2 channels)
CSYNC comparator
Data Sheet U12255EJ2V0DS00
45
µ
)
PD784927, 784928, 784927Y, 784928Y
(1) CTL amplifier/RECCTL driver
The CTL amplifier is used to amplify the playback control (PBCTL) signal that is reproduced from the CTL signal recorded on a VCR tape. The gain of the CTL amplifier is set by the gain control register (CTLM). Thirty-two types of gains can be set in increments of about 1.78 dB.
µ
PD784927 is also provided with a gain control signal generation circuit that monitors the status of the
The amplifier output to perform optimum gain control by software. The gain control signal generation circuit generates a CTL detection flag that identifies the amplitude status of the CTL amplifier output. By using this CTL detection flag, the gain of the CTL amplifier can be optimized. The RECCTL driver writes a control signal onto a VCR tape. This driver operates in two modes: REC mode that is used for recording, and rewrite mode used to rewrite the VISS signal. The output status of the RECCTL± pin is changed by hardware, by using the timer output from the super timer unit as a trigger.
Figure 3-22. Block Diagram of CTL Amplifier and RECCTL Driver
ANI11
CTLDLY
TOM1.4-TOM1.6
CTL head
CTLOUT1
CTLOUT2
RECCTL+
RECCTL
CTLIN
TM1-CR11 coincidence signal
RECCTL driver
­V
REF
AMPC. 1
+
-
AMPC. 1
+
-
CTLM. 0-CTLM. 4
Gain control signal
generation circuit
Waveform
shaping circuit
TM1-CR13 coincidence signal TM3-CR30 coincidence signal
Selector
CTL detection flag L (AMPM0. 1) CTL detection flag S (AMPM0. 3) CTL detection flag clear
(1 write to AMPM0. 6)
PBCTL signal (to timer unit)
CTLMON (to P67
46
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(2) DPG amplifier, DFG amplifier, and DFPG separation circuit
The DPG amplifier converts the drum PG (DPG) signal that indicates the phase information of the drum motor into a logic signal. The DFG amplifier amplifies the drum FG (DFG) signal that indicates the speed information of the drum motor. The DPFG separation circuit (ternary separation circuit) separates a drum PFG (DPFG) signal having speed and phase information into a DFG and DPG signals.
Figure 3-23. Block Diagram of DPG Amplifier, DFG Amplifier, and DPFG Separation Circuit
AMPC.7
REF
V
AMPM0.0
Drum PG signal
DPGIN
0 : ON
REF
V
+ –
DPG amplifier
AMPC.2
DPG comparator
AMPM0.2
1
0
Selector
AMPC.2
1
0
Selector
DPG signal (to timer unit)
DPGMON (to P65)
Drum FG signal or
drum PFG signal
AMPM0.0
DFGIN
VREFVREF
AMPM0.2
10
AMPC.2
+
DFG amplifier
AMPC.2
DPFG separation
circuit (ternary
separation circuit)
AMPM0.2
AMPM0.2
1
0
Selector
AMPC.2
1
0
Selector
DFG signal (to timer unit)
DFGMON (to P64)
Data Sheet U12255EJ2V0DS00
47
µ
PD784927, 784928, 784927Y, 784928Y
(3) CFG amplifier
The CFG amplifier amplifies the capstan FG (CFG) signal that indicates the speed information of the capstan motor. This amplifier consists of an operational amplifier and a comparator. The gain of the operational amplifier is set by using an external resistor. When the gain of the operational amplifier is set to 50 dB, the output duty accuracy of the CFG signal can be improved to 50.0 ± 0.3%.
Figure 3-24. Block Diagram of CFG Amplifier
V
REF
AMPC.3
+
CFG amplifier
Capstan FG signal
CFGIN
CFGAMPO
CFGCPIN
AMPM0.0
-
V
REF
AMPC.3
­+
CFG comparator
AMPC.3
1
0
Selector
CFG signal (to timer unit)
CFGMON (to P66)
(4) Reel FG comparators
The reel FG comparator converts a reel FG signal that indicates the speed information of the reel motor into a logic signal. Two comparators, one for take-up and the other for supply, are provided.
Figure 3-25. Block Diagram of Reel FG Comparators
V
REF
48
Supply reel signal
Take-up reel signal
AMPM0.0
REEL0IN
AMPM0.0
REEL1IN
AMPC.6
Reel FG comparator
V
REF
AMPC.6
Reel FG comparator
Data Sheet U12255EJ2V0DS00
1
SelectorSelector
0
AMPC.6
1
0
Reel FG0 signal (to timer unit)
Reel FG1 signal (to timer unit)
µ
PD784927, 784928, 784927Y, 784928Y
(5) CSYNC comparator
The CSYNC comparator converts the COMPSYNC signal into a logic signal.
Figure 3-26. Block Diagram of COMPSYNC Comparator
V
REF
AMPM1.7
AMPC.5
AMPM0.0
COMP
SYNC
signal
CSYNCIN
CSYNC comparator
(6) Reference amplifier
The reference amplifier generates a reference voltage (V
REF) to be supplied to the internal amplifiers and
comparators of the µPD784927.
AMPC.5
1
0
Selector
SYNC
signal
C (to timer unit)
VREFC
Figure 3-27. Block Diagram of Reference Amplifier
AV
AV
DD1
SS1
­+
­+
­+
­+
ENCAP (AMPC.3)
V
REF
(CFG amplifier)
V
REF
(CFG amplifier)
ENCTL (AMPC.1)
V
REF
(CTL amplifier)
ENDRUM (AMPC.2) ENREEL (AMPC.6) ENCSYN (AMPC.5)
V
REF
DFG amplifier, DPG comparator, reel FG comparator, and CSYNC comparator)
Remark Multiple reference amplifiers are provided to assure the accuracy of the amplifiers and comparators.
Data Sheet U12255EJ2V0DS00
49
µ
PD784927, 784928, 784927Y, 784928Y
(7) Analog circuit monitor function
This function is to output the following signals to port pins, and is mainly used for debugging.
• Comparator output of CTL amplifier CTLMON (multiplexed port: P67)
• Comparator output of CFG amplifier CFGMON (multiplexed port: P66)
• Comparator output of DPG amplifier DPGMON (multiplexed port: P65)
• Comparator output of DFG amplifier DFGMON (multiplexed port: P64)
3.10 Watch Function
µ
PD784927 has a watch function that counts the overflow signals of the watch timer by hardware. As the clock,
The
the subsystem clock (32.768 kHz) is used.
Because this watch function is independent of the CPU, it can be used even while the CPU is in the standby mode
(STOP mode) or is reset. In addition, this function can be used at a low voltage of V
DD = 2.7 V (MIN.).
Therefore, by using only the watch function with the CPU set in the standby mode or reset, a watch operation can
be performed at a low voltage and low current consumption.
In addition, the watch function can also be used while the CPU is in the normal operation mode, because a dedicated
counter is provided.
The watch function can be used to count up to about 17 years of data. The hardware watch counters (HW0 and HW1) are shared with external input counters. These counters execute
counting at the falling edge of input to the P65 pin, and can be used to count the H
SYNC signals.
P65
(32.768 kHz)
f
Figure 3-28. Block Diagram of Watch Counter
P65
WM.2 (enables/disables operation)
XT
013
Watch timer
Normal
Fast forward
0
1
WM.1
WM.5 WM.4
1
0
SelectorSelector
WM.7
WM.2
PM65 PMC65
CMS5
Edge detection
Pin level read
015013
HW0 HW1
Selector
Subclock
BUZ signal
WM.2
Selector
WM.6
WM.2 (enables/disables operation)
To NMI generation block
INTW
50
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
3.11 Clock Output Function
The µPD784927 can output a square wave (with a duty factor of 50%) to the P60/STRB/CLO pin as the operating clock for the peripheral devices or other microcomputers. To enable or disable the clock output, and to set the frequency of the clock, the clock output mode register (CLOM) is used.
When setting the frequency, the division ratio can be set to f
CLK/n (where n = 1, 2, 4, 8, 16, 32, 64, or 128) (fCLK
= fOSC/2: fOSC is the oscillation frequency of the resonator).
Figure 3-29 shows the block diagram of the clock output circuit.
The clock output (CLO) pin is shared with P60 and STRB.
Figure 3-29. Block Diagram of Clock Output Circuit
CLK
f
CLK
/2
f f
CLK
/4
f
CLK
/8
f
CLK
/16
f
CLK
/32
f
CLK
/64
f
CLK
/128
Remark f
CLOM
Selector
P60
(Output latch)
CLK: internal system clock
CLOM7 CLOM6 CLOM5 ENCLO 0
1
0
Selector
RESET
SELFRQ2 SELFRQ1 SELFRQ0
P60/STRB/CLO
Caution Do not use the clock output function in the STOP mode. Clear ENCLO (CLOM.4) to 0 in the STOP
mode.
Figure 3-30. Application Example of Clock Output Function
PD784927
µ
System clock
CLO
SCK1
SI1
SO1
PD7503A
µ
CL1 SCK SO SI
LCD
24
Data Sheet U12255EJ2V0DS00
51
µ
PD784927, 784928, 784927Y, 784928Y
3.12 Buzzer Output Function
The BUZ signal can be superimposed on P61 or P64. The buzzer output frequency can be generated from the subsystem clock frequency or main system clock
frequency.
Figure 3-31 shows the block diagram of the BUZ output circuit. The BUZ signal can be also used for trimming the subsystem clock.
Figure 3-31. Block Diagram of BUZ Output Circuit
WM4 WM5
2.048 kHz
CMS4
WM7
4.096 kHz
32.768 kHz
CLK
/512
f
f
CLK
/1024
f
CLK
/2048
CLK
/4096
f
CLOM5 CLOM6
SelectorSelector
0
1
CLOM7
Selector
P61
(Output latch)
BUZ
output
P64
(Output latch)
BUZ
output
0
P61/BUZ
SelectorSelector
1
0
P64/BUZ
1
52
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
4. INTERNAL/EXTERNAL CONTROL FUNCTION
4.1 Interrupt Function
The µPD784927 has as many as 32 interrupt sources, including internal and external sources. For 28 sources, a high-speed interrupt processing mode such as context switching or macro service can be specified by software.
Table 4-1 lists the interrupt sources.
Data Sheet U12255EJ2V0DS00
53
µ
PD784927, 784928, 784927Y, 784928Y
Table 4-1. Interrupt Sources
Interrupt
Request Priority Service
Type Reset RESET RESET pin input No No 0000H Non- NMI NMI pin input edge 0002H maskable Maskable 0 INTP0 INTP0 pin input edge PIC0 Yes Yes FE06H 0006H
Operand Illegal operand of MOV STBC, #byte or No No 003CH error LOCATION instruction Software Execution of BRK instruction 003EH
Name Trigger
1 INTCPT3 EDVC output signal (CPT3 capture) CPTIC3 FE08H 0008H 2 INTCPT2 DFGIN pin input edge (CPT2 capture) CPTIC2 FE0AH 000AH 3 INTCR12 PBCTL input edge/EDVC output signal CRIC12 FE0CH 000CH
4 INTCR00 TM0-CR00 coincidence signal CRIC00 FE0EH 000EH 5 INTCLR1 CSYNCIN pin input edge CLRIC1 FE10H 0010H 6 INTCR10 TM1-CR10 coincidence signal CRIC10 FE12H 0012H 7 INTCR01 TM0-CR01 coincidence signal CRIC01 FE14H 0014H 8 INTCR02 TM0-CR02 coincidence signal CRIC02 FE16H 0016H 9 INTCR11 TM1-CR11 coincidence signal CRIC11 FE18H 0018H
10 INTCPT1 Pin input edge/EC output signal CPTIC1 FE1AH 001AH
11 INTCR20 TM2-CR20 coincidence signal CRIC20 FE1CH 001CH 12 INTIIC End of I2C bus transfer IICIC 13 INTTB Time base from FRC TBIC FE20H 0020H 14 INTAD A/D converter conversion end ADIC FE22H 0022H 15 INTP2 INTP2 pin input edge PIC2 FE24H 0024H
INTCR40 TM4-CR40 coincidence signal CRIC40 16 INTUDC UDC-UDCC coincidence/UDC underflow UDCIC FE26H 0026H 17 INTCR30 TM3-CR30 coincidence signal CRIC30 FE28H 0028H 18 INTCR50 TM5-CR50 coincidence signal CRIC50 FE2AH 002AH 19 INTCR13 TM1-CR13 coincidence signal CRIC13 FE2CH 002CH 20 INTCSI1 End of serial transfer (channel 1) CSIIC1 FE2EH 002EH 21 INTW Overflow of watch timer WIC FE30H 0030H 22 INTVISS VISS detection signal VISIC FE32H 0032H 23 INTP1 INTP1 pin input edge PIC1 FE34H 0034H 24 INTP3 INTP3 pin input edge PIC3 FE36H 0036H 25 INTCSI2 End of serial transfer (channel 2) CSIIC2 FE3AH 003AH
Execution of BRKCS instruction Yes
Interrupt Request Source
(CR12 capture)
(CPT1 capture)
Interrupt
Control
Register
Name
Note
Macro Context
Switching Control Word
Macro Service
Address Address
FE1EH 001EH
Vector
Table
NoteµPD784928Y subseries only.
Remark EVDC : Event divider compare register
EC : Event counter FRC : Free running counter MSCW : Macro service control register
54
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Figure 4-1. Differences in Operation Depending on Interrupt Processing Mode
Macro service
Context switching
Vectored interrupt
Note 1
Note 1
Vectored interrupt
Main routine
Main routine
Main routine
Main routine
Macro service processing
Note 2
Note 4
Note 4
SEL RBn
Saving general-purpose register
Main routine
Interrupt processing
Interrupt processing
Initializing general-purpose register
Note 3
Interrupt processing
Main routine
Restoring PC and PSW
Main routine
Restoring general-purpose register
Restoring PC and PSW
Main routine
Interrupt request generated
Notes 1. When the register bank switching function is used and when initial values are set in advance to the
registers
2. Selecting a register bank and saving PC and PSW by context switching
3. Restoring register bank, PC, and PSW by context switching
4. Saves PC and PSW to stack and loads vector address to PC
Data Sheet U12255EJ2V0DS00
55
µ
PD784927, 784928, 784927Y, 784928Y
4.1.1 Vectored interrupt
When an interrupt request is acknowledged, an interrupt processing program is executed according to the data
stored in the vector table area (the first address of the interrupt processing program created by the user).
In addition, four levels of priorities can be specified by software.
4.1.2 Context switching
When an interrupt request is generated or when the BRKCS instruction is executed, a specific register bank is selected by hardware, and execution branches to a vector address set in advance in the register bank. At the same time, the current contents of the program counter (PC) and program status word (PSW) are saved to the registers in the register bank. Because the contents of PC and PSW are not saved to the stack area, execution can be branched to an interrupt processing routine more quickly than the vectored interrupt.
Figure 4-2. Context Switching Operation When Interrupt Request Is Generated
<7> 0H
PC19-16 PC15-0
<2> Save
Bits 8-11 of temporary register
<1> Save
PSW
<6> Exchange
<5> Save
Temporary register
Register bank n (n = 0-7)
A
B R5 R7
V
U
T
W
VP
UP D H
R4 R6
Register bank
(0-7)
X C
<3>
Switching register bank (RBS0-RBS2 n)
<4>
RSS
0
IE
E L
0
56
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
4.1.3 Macro service
The macro service is a function to transfer data between the memory and a special function register (SFR) without
intervention by the CPU. A macro service controller accesses the memory and SFR and directly transfers the data.
Because the status of the CPU is not saved or restored, data can be transferred more quickly than context switching. The processing that can be executed with the macro service is described below.
Figure 4-3. Macro Service
CPU Memory SFR
Internal bus
Read Write
Macro service
controller
Write Read
(1) Counter mode
In this mode, the value of the macro service counter (MSC) is decremented when an interrupt request occurs. This mode can be used to execute the division operation of an interrupt request or count the number of times an interrupt request has occurred. When the value of the macro service counter has been decremented to 0, a vectored interrupt occurs.
MSC
-
1
(2) Compound data transfer mode
When an interrupt request occurs, data are simultaneously transferred from an 8-bit SFR to memory, a 16­bit SFR to memory (word), memory (byte) to an 8-bit SFR, and memory (word) to a 16-bit SFR (3 points MAX. for each transfer). This mode can also be used to exchange data, instead of transferring data. This mode can be used for automatic transfer/reception by the serial interface or automatic updating of data/ timing by the serial output port. When the value of the macro service counter reaches to 0, a vectored interrupt request occurs.
SFR<4>-1
SFR<2>-1
SFR<4>-2 SFR<4>-3 SFR<3>-1 SFR<3>-2 SFR<3>-3
Internal bus
SFR<2>-2 SFR<2>-3 SFR<1>-1 SFR<1>-2 SFR<1>-3
Internal bus
Data Sheet U12255EJ2V0DS00
Memory
.
.
.
57
µ
(
)
PD784927, 784928, 784927Y, 784928Y
(3) Macro service type A
When an interrupt request occurs, data is transferred from an 8-/16-bit SFR to memory (byte/word) or from memory (byte/word) to an 8-/16-bit SFR. Data is transferred the number of times set in advance by the macro service counter. This mode can be used to store the result of A/D conversion or for automatic transfer (or reception) by the serial interface. Because transfer data is stored at an address FE00H to FEFFH, if only a small quantity of data is to be transferred, the data can be transferred at high speeds. When the value of the macro service counter is decremented to 0, a vectored interrupt request occurs.
Data storage buffer (memory)
Data n
-
Data n
Internal bus
1
Data 2 Data 1
SFR
Data storage buffer (memory)
Data n
-
Data n
Internal bus
1
Data 2 Data 1
SFR
(4) Data pattern identification mode (VISS detection mode)
This mode of macro service is for detection of the VISS signal and is used in combination with a pulse width detection circuit. When an interrupt request occurs, the content of bit 7 of an SFR (usually, TMC3) specified by SFR pointer 1 is shifted into the buffer area. At the same time, the data in the buffer area is compared with the data in the compare area. If the two data coincide, a vectored interrupt request is generated. When the value of the macro service counter is decremented to 0, a vectored interrupt request occurs. It can be specified by option that the value of an SFR (usually, CPT30) specified by SFR pointer 2 be multiplied by a coefficient and the result of this multiplication be stored to an SFR (usually, CR30) specified by SFR pointer 3 (this operation is to automatically update an identification threshold value when the tape speed fluctuates).
58
Coefficient (memory)
Multiplier
Buffer area (memory) Compare area (memory)
CPT30
TM3
Coincidence
CR30
CTL F/F
bit 7 of TMC3
Data Sheet U12255EJ2V0DS00
Vectored interrupt
µ
(
)
PD784927, 784928, 784927Y, 784928Y
4.1.4 Application example of macro service
(1) Automatic transfer/reception of serial interface
Automatic transfer/reception of 3-byte data by serial interface channel 1 Setting of macro service register: compound data transfer mode (exchange mode)
Macro service channel
Macro service control word
SI1
SO1
70
Macro service counter (MSC = 2)
Memory pointer H (= FD)
Memory pointer L (= 50)
ddccbbaa (= 01000100B)
SFR pointer <2> (SFRP2 = 85H) SFR pointer <4> (SFRP4 = 85H)
Channel pointer (= 50H)
Mode register (= 10110011B)
(Exchange 2)
SIO1 (FF85H) <3>
<2>
FE50H
FE2EH
(Before transfer)
Transmit data 3
Transmit data 2
High-order address
Low-order address
FD52H
FD51H
(Exchange 1)
Transfer is started by writing
<1>
transmit data 1 to SIO1 by software.
(Transmit data 1)
(After transfer)
Receive data 2 FD51H
Receive data 1
Receive data 3 is the data of SIO1.
FD50H
FD50H
Data Sheet U12255EJ2V0DS00
59
µ
PD784927, 784928, 784927Y, 784928Y
(2) Reception operation of serial interface
Transfer of receive data by serial interface channel 1 (16 bytes) Setting of macro service mode register: macro service type A (1-byte data transfer from SFR to memory)
Internal RAM
FE7FH
FE2EH
MSC 0FH
SFR pointer 85H
Channel pointer (= 7FH)
Mode register (= 00010001B)
Setting of number of transfers Low-order 8 bits of address of SIO1 register
Starts macro service when INTCSI1 occurs
SI1
SIO1
(FF85H)
60
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(3) VISS detection operation
Setting of macro service mode register: data pattern identification mode (with multiplication, 8-byte compari­son)
CPT30
High-order address
FE50H
8 bytes
Macro service counter (MSC = FFH) SFR pointer 2 (SFRP2 = 56H)
Coefficient (6EH: 43%)
SFR pointer 3 (SFRP3 = 5CH)
SFR pointer 1 (SFRP1 = 3BH)
Buffer size specification
register (64 bits: 8H)
11111111
11111110
Compare area pointer (high): 10H
Compare area pointer (low): 50H
Coincidence (vectored interrupt)
Multiplier
Bit 7
0
TM3
CR30
TMC3
00000000
00000000
1050H 8 bytes
Channel pointer (= 50H)
FE0CH
Low-order address
Mode register (= 00010100B)
(CTL signal input edge detection interrupt)
Data Sheet U12255EJ2V0DS00
61
µ
PD784927, 784928, 784927Y, 784928Y
4.2 Standby Function
The standby function is to reduce the power consumption of the chip and is used in the following modes:
Mode Function
HALT mode Stops operating clock of CPU. Reduces average power consumption when used
in combination with normal mode for intermittent operation
STOP mode Stops oscillator. Stops all internal operations of chip to minimize power consump-
tion to leakage current only
Low power consumption mode Stops main system clock with subsystem clock used as system clock. CPU can
operate with subsystem clock to reduce current consumption
Low power consumption HALT mode Standby function in low power consumption mode. Stops operating clock of CPU.
Reduces power consumption of overall system
These modes are programmable. The macro service can be started in the HALT mode.
Figure 4-4. Status Transition of Standby Function
Macro service request
End of one processing
End of macro service
Sets HALT
Interrupt request
Note 2
Macro service request
End of one processing
HALT mode
(standby)
service
Note 1
NMI input
INTW, INTP2 interrupt request
Low power
consumption
HALT mode
(standby)
Low power
consumption mode
(subsystem
clock operation)
Sets low power consumption HALT mode
Sets low power consumption mode Restores normal operation
End of oscillation stabilization period
Waits for
stabilization
of oscillation
NMI input
RESET input
Note 1
STOP mode
(standby)
Normal
operation
RESET input
Sets STOP
Unmasked interrupt request
Notes 1. NMI input means starting NMI by NMI pin input, watch interrupt, or key interrupt input.
2. Unmasked interrupt request
Macro
62
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Figure 4-5. Relations among NMI, Watch Interrupt, and Key Interrupt When STOP Mode Is Released
INTM0.0
Standby control
block
NMI
INTP1 INTP2
KEY0 KEY1 KEY2 KEY3 KEY4
Mask Mask Mask
Selector
KEYC.6 KEYC.5 KEYC.4
Latch
Clear
SRQ KEYC.7
Cleared when "0" is written to KEYC.7
SRQ KEYC.0
Cleared when "0" is written to KEYC.0
Mask
WM.3
WM.6
Selector
Interrupt control
block
Watch timer
INTW (OVF)
Divides INTW by 128 (HW0L.7)
Data Sheet U12255EJ2V0DS00
63
µ
X1
X2
16 MHz or 8 MHz
XT1
XT2
32.768 kHz
PD784927
µ
Main
system
clock
oscillation
circuit
Oscillation stop
From standby control block
Subsystem
clock
oscillation
circuit
f
XT
STBC.7
Oscillation stop
1/2
Watch timer
Hardware watch function
Watch interrupt
Normal mode
Low-frequency
oscillation mode
CC.7
Selector
1/2
1/2
1/2
Oscillation stabilization timer
STBC.4, 5
STBC.6
f
XX
/16 (f
XX
/8)
Note 1
Selector
Selector
f
XX
/8 (f
XX
/4)
Note 1
f
XX
/4 (f
XX
/2)
Note 1
f
XX
/2 (f
XX
)
Note 1
CPU
Peripheral hardware
operation clock
Note 2
f
CLK
f
XX
PD784927, 784928, 784927Y, 784928Y
4.3 Clock Generation Circuit
The clock generation circuit generates and controls the internal system clock (CLK) to be supplied to the CPU and
peripheral circuits. Figure 4-6 shows the configuration of this circuit.
PD784928,
µ
Figure 4-6. Block Diagram of Clock Generation Circuit
64
XX: oscillation frequency, ( ): in low-frequency oscillation mode.
Notes 1. f
Data Sheet U12255EJ2V0DS00
784928Y Subseries User’s Manual-Hardware (U12648E).
2. The peripheral hardware units that can operate with the subsystem clock have some restrictions. For details, refer to
µ
PD784927, 784928, 784927Y, 784928Y
4.4 Reset Function
When a low-level signal is input to the RESET pin, the system is reset, and each hardware unit is initialized (reset status). During the reset period, oscillation of the system clock is unconditionally stopped, so that the current consumption of the overall system can be reduced.
When the RESET pin goes high, the reset status is cleared. After the count time of the oscillation stabilization timer (32.8 ms at 16 MHz or 65.6 ms at 8 MHz) has elapsed, the contents of the reset vector table are set to the program counter (PC), and execution branches to the address set to the PC, and the program is executed starting from the branch destination address. Therefore, execution can be reset and started from any address.
Figure 4-7. Oscillation of Main System Clock during Reset Period
Main system clock oscillation circuit
During reset, oscillation is unconditionally stopped.
CLT
f
RESET input
Oscillation stabilization timer count time
The RESET pin is provided with an analog delay noise rejection circuit to prevent malfunctioning due to noise.
Figure 4-8. Accepting Reset Signal
delay
Oscillation
stabilization
time
Analog delay Analog delay
Analog
RESET input
Internal reset signal
Internal clock
Data Sheet U12255EJ2V0DS00
65
µ
PD784927, 784928, 784927Y, 784928Y
5. INSTRUCTION SET
(1) 8-bit instructions (( ): combination realized by using A as r)
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, SHR, SHL, ROR4, ROL4, DBNZ, PUSH, POP, MOVM, XCHM, CMPME, CMPMNE, CMPMNC, CMPMC, MOVBK, XCHBK, CMPBKE, CMPBKNE, CMPBKNC, CMPBKC, CHKL, CHKLA
2nd Operand # byte A r saddr sfr !addr16 mem r3 [WHL+] [WHL–] n
None
r' saddr' !!addr24 [saddrp] PSWL 1st Operand [%saddrg] PSWH A (MOV) (MOV) MOV
Note 1
ADD
(XCH) XCH
Note 1
(ADD)
(ADD)
Note 1
r MOV (MOV) MOV MOV MOV MOV
Note 1
ADD
(XCH) XCH XCH XCH XCH DIVUW (ADD)
Note 1
ADD
Note 1
(MOV) (XCH) (ADD)
ADD
Note 6
MOV (MOV) MOV MOV (MOV) (MOV)
Note 6
(XCH) (XCH) XCH (XCH) (XCH)
Notes 1,6
Note 1
(ADD)
ADD
Note 1
Note 1
ADD
Note 1
ADD
Note 1
(ADD)
Note 1
(ADD)
Note 1
ROR
Note 3
MULU
INC DEC
saddr MOV
ADD
Note 1
(MOV) (ADD)
Note 6
MOV MOV INC
Note 1
ADD
Note 1
XCH DEC
Note 1
ADD
DBNZ
sfr MOV MOV MOV PUSH
ADD
Note 1
(ADD)
Note 1
ADD
Note 1
POP CHKL
CHKLA !addr16 MOV (MOV) MOV !!addr24
ADD
Note 1
mem MOV [saddrp]
ADD
Note 1
[%saddrg] mem3 ROR4
ROL4 r3 MOV MOV PSWL PSWH B, C DBNZ STBC, WDM MOV [TDE+] (MOV)
(ADD) MOVM
[TDE–] (MOV)
(ADD) MOVM
Note 1 Note 4
Note 1
Note 4
MOVBK
Note 5
MOVBK
Note 5
Note 2
Notes 1. ADDC, SUB, SUBC, AND, OR, XOR, and CMP are the same as ADD.
2. Either the second operand is not used, or the second operation is not an operand address.
3. ROL, RORC, ROLC, SHR, and SHL are the same as ROR.
4. XCHM, CMPME, CMPMNE, CMPMNC, and CMPMC are the same as MOVM.
5. XCHBK, CMPBKE, CMPBKNE, CMPBKNC, and CMPBKC are the same as MOVBK.
6. If saddr2 instead of saddr is used in this combination, the code length of some instructions is short.
66
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(2) 16-bit instructions (( ): combination realized by using AX as rp)
MOVW, XCHW, ADDW, SUBW, CMPW, MULUW, MULW, DIVUX, INCW, DECW, SHRW, SHLW, PUSH, POP, ADDWG, SUBWG, PUSHU, POPU, MOVTBLW, MACW, MACSW, SACW
2nd Operand # word AX rp saddrp sfrp !addr16 mem [WHL+] byte n None
rp' saddrp !!addr24 [saddrp] 1st Operand [%saddrg] AX (MOVM) (MOVW) (MOVW)
Note 1
ADDW
(XCHW) (XCHW) (
Note 1
(ADDW)
(ADDW)
Note 1
(MOVW)
XCHW
(ADDW)
Note 3
MOVW (MOVW) MOVW (MOVW)
Note 3
)
(XCHW) XCHW XCHW (XCHW)
Notes 1,3
(ADDW)
Note 1
rp MOVW (MOVW) MOVW MOVW MOVW MOVW SHRW MULW
Note 1
ADDW
saddrp MOVW
ADDW
(XCHW) XCHW XCHW XCHW SHLW INCW
Note 1
(ADDW) (MOVW) (ADDW)
Note 1
Note 3
Note 1
ADDW
Note 1
ADDW
Note 1
ADDW
Note 1
MOVW MOVW INCW
Note 1
ADDW
XCHW DECW
Note 1
ADDW
DECW
sfrp MOVW MOVW MOVW PUSH
Note 1
ADDW
!addr16 MOVW (MOVW) MOVW
(ADDW)
Note 1
ADDW
Note 1
POP
MOVTBLW !!addr24 mem MOVW [saddrp] [%saddrg] PSW PUSH
POP
SP ADDWG
SUBWG
post PUSH
POP PUSHU
POPU [TDE+] (MOVW) SACW byte MACW
MACSW
Note 2
Note 4
Notes 1. SUBW and CMPW are the same as ADDW.
2. Either the second operand is not used, or the second operation is not an operand address.
3. If saddr2 instead of saddr is used in this combination, the code length of some instructions is short.
4. MULUW and DIVUX are the same as MULW.
Data Sheet U12255EJ2V0DS00
67
µ
PD784927, 784928, 784927Y, 784928Y
(3) 24-bit instructions (( ): combination realized by using WHL as rg)
MOVG, ADDG, SUBG, INCG, DECG, PUSH, POP
2nd Operand # imm24 WHL rg saddrg !!addr24 mem1 [%saddrg] SP None
rg' 1st Operand WHL (MOVG) (MOVG) (MOVG) (MOVG) (MOVG) MOVG MOVG MOVG
(ADDG) (ADDG) (ADDG) ADDG (SUBG) (SUBG) (SUBG) SUBG
rg MOVG (MOVG) MOVG MOVG MOVG INCG
ADDG (ADDG) ADDG DECG SUBG (SUBG) SUBG PUSH
POP saddrg (MOVG) MOVG !!addr24 (MOVG) MOVG mem1 MOVG [%saddrg] MOVG SP MOVG MOVG INCG
DECG
Note Either the second operand is not used, or the second operation is not an operand address.
(4) Bit manipulation instructions
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR, BFSET
2nd Operand CY saddr.bit /saddr.bit None
sfr.bit /sfr.bit A.bit /A.bit X.bit /X.bit PSWL.bit /PSWL.bit PSWH.bit /PSWH.bit mem2.bit /mem2.bit iaddr16.bit /!addr16.bit
1st Operand !addr24.bit /!!addr24.bit CY MOV1 AND1 NOT1
AND1 OR1 SET1 OR1 CLR1 XOR1
Note
Note
68
saddr.bit MOV1 NOT1 sfr.bit SET1 A.bit CLR1 X.bit BF PSWL.bit BT PSWH.bit BTCLR mem2.bit BFSET !addr16.bit !!addr24.bit
Note Either the second operand is not used, or the second operation is not an operand address.
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
(5) Call/return and branch instructions
CALL, CALLF, CALLT, BRK, RET, RETI, RETB, RETCS, RETCSB, BRKCS, BR, BNZ, BNE, BZ, BE, BNC, BNL, BC, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, BH, BF, BT, BTCLR, BFSET, DBNZ
Operand of instruction address Basic BC instruction BR BR BR BR BR BR BR BR RET
Compound BF instruction BT
$addr20 $!addr20 !addr16 !!addr20
Note
CALL CALL CALL CALL CALL CALL CALL CALLF CALLT BRKCS BRK
RETCS RETI RETCSB
BTCLR BFSET DBNZ
rp rg [rp] [rg] !addr11 [addr5] RBn None
RETB
Note BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, and BH are
the same as BC.
(6) Other instructions
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT, EI, DI, SWRS
Data Sheet U12255EJ2V0DS00
69
µ
PD784927, 784928, 784927Y, 784928Y
6. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°C)
Parameter Symbol Conditions Ratings Unit
Supply voltage VDD | VDD – AVDD1 | 0.5 V –0.5 to +7.0 V
AVDD1 | VDD – AVDD2 | 0.5 V –0.5 to +7.0 V AVDD2 | AVDD1 – AVDD2 | 0.5 V –0.5 to +7.0 V
AVSS1 –0.5 to +0.5 V
AVSS2 –0.5 to +0.5 V Input voltage VI –0.5 to VDD + 0.5 V Analog input voltage VIAN VDD AVDD2 –0.5 to AVDD2 + 0.5 V (ANI0-ANI11) VDD < AVDD2 –0.5 to VDD + 0.5 V Output voltage VO –0.5 to VDD + 0.5 V Low-level output current IOL Pin 1 15 mA
Total of all pins 100 mA
High-level output current IOH Pin 1 –10 mA
Total of all pins –50 mA Operating ambient temperature Storage temperature Tstg –65 to +150 °C
TA –10 to +70 °C
Caution If the rated value of even one of the above parameters is exceeded even momentarily, the quality
of the product may be degraded. Absolute maximum ratings therefore specify the values exceeding which the product may be physically damaged. Never exceed these values when using the product.
Operating Conditions
Clock Frequency
4 MHz fXX 16 MHz –10 to +70°C All functions +4.5 to +5.5 V
32 kHz fXT 35 kHz Subclock operation +2.7 to +5.5 V
Operating Ambient Temperature (TA)
Operating Conditions Supply Voltage (VDD)
CPU function only +4.0 to +5.5 V
(CPU, watch, and port functions only)
70
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Oscillator Characteristics (main clock) (TA = –10 to +70°C, VDD = AVDD = 4.0 to 5.5 V, VSS = AVSS = 0 V)
Resonator Recommended Circuit Parameter MIN. MAX. Unit
Crystal resonator Oscillation frequency (fXX) 4 16 MHz
X1 X2 V
C1 C2
SS
Oscillator Characteristics (subclock) (TA = –10 to +70°C, VDD = AVDD = 2.7 to 5.5 V, VSS = AVSS = 0 V)
Resonator Recommended Circuit Parameter MIN. MAX. Unit
Crystal resonator Oscillation frequency (fXT) 32 35 kHz
XT1 XT2 V
C1 C2
SS
Caution When using the main system clock and subsystem clock oscillator, wire the portion enclosed
by the broken line in the above figures as follows to avoid the adverse influence of wiring capacitance:
Keep the wiring length as short as possible.
Do not cross the wiring with the other signal lines. Do not route the wiring in the
neighborhood of a signal line through which a high alternating current flows.
Always keep the ground point of the capacitor of the oscillator to the same potential as V
SS.
Do not ground the capacitor to a ground pattern to which a high current flows.
Do not extract signals from the oscillation circuit.
Exercise particular care in using the subsystem clock oscillator because the amplification factor of this circuit is kept low to reduce the current consumption.
Remark For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
Data Sheet U12255EJ2V0DS00
71
µ
PD784927, 784928, 784927Y, 784928Y
DC Characteristics (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Low-level input voltage VIL1 Pins other than those listed in Note 1 below 0 0.3 VDD V
VIL2 Pins listed in Note 1 below 0 0.2 VDD V VIL3 X1, X2 0 0.4 V
High-level input voltage VIH1 Pins other than those listed in Note 1 below 0.7 VDD VDD V
VIH2 Pins listed in Note 1 below 0.8 VDD VDD V VIH3 X1, X2 VDD – 0.5 VDD V
Low-level output voltage VOL1 IOL = 8.0 mA (pins in Note 2) 1.0 V
VOL2 IOL = 5.0 mA (pins in Note 4) 0.6 V VOL3 IOL = 2.0 mA 0.45 V VOL4 IOL = 100 µA 0.25 V
High-level output voltage VOH1 IOH = –1.0 mA VDD – 1.0 V
VOH2 IOH = –100 µAVDD – 0.4 V Input leakage current ILI 0 VI VDD ±10 Output leakage current ILO 0 VO VDD ±10 VDD supply current IDD1 Operation fXX = 16 MHz 30 50 mA
mode fXX = 8 MHz (low-frequency os-
cillation mode) Internally, 8 MHz main clock operation fXT = 32.768 kHz 50 80 Subclock operation (CPU, watch, port) VDD = 2.7 V
IDD2 HALT mode fXX = 16 MHz 10 25 mA
fXX = 8 MHz (low-frequency oscillation mode) Internally, 8 MHz main clock operation fXT = 32.768 MHz 25 50 Subclock operation (CPU, watch, port)
VDD = 2.7 V Data hold voltage VDDDR STOP mode 2.5 V Data hold current
Pull-up resistor RL VI = 0 V 25 55 110 k
Note 3
IDDDR
STOP mode VDDDR = 5.0 V STOP mode VDDDR = 2.7 V STOP mode VDDDR = 2.5 V
Subclock oscillates 18 50
Subclock oscillates 2.5 10
Subclock stops 0.2 7.0
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
Notes 1. RESET, IC, NMI, INTP0-INTP2, P61/SCK1/BUZ, P63/SI1, SCK2, SI2/BUSY, P65/HWIN, P91/KEY0 to
P95/KEY4
2. P40 to P47
3. In the STOP mode in which the subclock oscillation is stopped, disconnect the feedback resistor, and
connect the XT1 pin to V
DD.
4. P46, P47
72
Data Sheet U12255EJ2V0DS00
AC Characteristics
µ
PD784927, 784928, 784927Y, 784928Y
CPU and peripheral circuit operation clock (T
Parameter Symbol Conditions TYP. Unit
CPU operation clock cycle time tCLK fXX = 16 MHz VDD = AVDD = 4.0 to 5.5 V 125 ns
Peripheral operation clock cycle time tCLK1 fXX = 16 MHz 125 ns
A = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
CPU function only fXX = 16 MHz fXX = 8 MHz low-frequency oscillation mode
(Bit 7 of CC = 1)
fXX = 8MHz low-frequency oscillation mode
(Bit 7 of CC = 1)
Serial interface
(1) SIOn: n = 1 or 2 (T
Parameter Symbol Conditions MIN. MAX. Unit
Serial clock cycle time tCYSK Input External clock 1.0
Serial clock high- and low-level widths tWSKH Input External clock 420 ns
SIn setup time (vs. SCKn ↑)tSSSK 100 ns SIn hold time (vs. SCKn )tHSSK 400 ns SOn output delay time (vs. SCKn )tDSSK 0 300 ns
A = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Output fCLK1/8 1.0
fCLK1/16 2.0 fCLK1/32 4.0 fCLK1/64 8.0 fCLK1/128 16 fCLK1/256 32
tWSKL Output Internal clock tCYSK/2 – 50 ns
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Remarks 1. fCLK1: operating clock of peripheral circuit (8 MHz)
2. n = 1 or 2
(2) SIO2 only (T
SCK2(8) ↑→STRB tDSTRB tWSKH tCYSK Strobe high-level width tWSTRB tCYSK – 30 tCYSK + 30 ns BUSY setup time tSBUSY 100 ns (vs. BUSY detection timing) BUSY hold time t HBUSY 100 ns (vs. BUSY detection timing) BUSY inactive SCK2(1) tLBUSY
A = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Conditions MIN. MAX. Unit
tCYSK + tWSKH
Remarks 1. The value in ( ) following SCK2 indicates the number of SCK2.
2. BUSY is detected after the time of (n + 2) x tCYSK (n = 0, 1, and so on) in respect to SCK2 (8) ↑ .
3. BUSY inactive SCK2 (1) is the value when data has been completely written to SIO2.
Data Sheet U12255EJ2V0DS00
73
µ
PD784927, 784928, 784927Y, 784928Y
I2C bus mode (µPD784928Y subseries only)
Parameter Symbol Standard Mode High-speed Mode Unit
MIN. MAX MIN MAX. SCL clock frequency fCLK 0 100 0 400 kHz Bus free time (between stop and start tBUF 4.7 1.3 – conditions) Hold time SCL clock low-level width tLOW 4.7 1.3 – SCL clock high-level width tHIGH 4.0 0.6 – Start/restart condition setup time tSU : STA 4.7 0.6 – Data hold CBUS compatible master tHD : DAT 5.0 – time I2C bus 0 Data setup time t SU : DAT 250 100 SDA and SCL signal rise time tR 1000 20+0.1Cb SDA and SCL signal fall time tF 300 20+0.1Cb Stop condition setup time tSU : STO 4.0 0.6 – Pulse width of spike restrained by input tSP ––050ns filter Each bus line capacitative load Cb 400 400 pF
Note 1
tHD : STA 4.0 0.6
Note 2
–0
Note 2
Note 4
Note 5 Note 5
0.9
300 ns 300 ns
Note 2
–ns
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Notes 1. The first clock pulse is generated at the start condition after this period.
2. The device needs to internally supply a hold time of at least 300 ns for the SDA signal to fill the undefined
area at the falling edge of the SCL (V
IHmin. of the SCL signal).
3. Unless the device extends the low hold time (tLOW) of the SCL signal, it is necessary to fill only the maximum data hold time (t
HD : DAT).
4. The high-speed mode I2C bus can be used in the standard mode I2C bus system. In this case, satisfy the following conditions:
• When the device does not extend the low hold time of the SCL signal
SU : DAT 250 ns
t
• When the device extends the low hold time of the SCL signal
Send the next data bit to the SDA line before releasing the SCL line (t
= 1250 ns : in the standard mode I2C bus specification)
5. Cb: Total capacitance of one bus line (unit: pF)
Rmax. + tSU:DAT = 1000 + 250
74
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Other operations (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. MAX. Unit
Timer input signal low-level width tWCTL When DFGIN, CFGIN, DPGIN, REEL0IN, tCLK1 ns
or REEL1IN logic level is input
Timer input signal high-level width tWCTH When DFGIN, CFGIN, DPGIN, REEL0IN, tCLK1 ns
or REEL1IN logic level is input Timer input signal valid edge input cycle tPERIN When DFGIN, CFGIN, or DPGIN is input 2 CSYNCIN low-level width tWCR1L
CSYNCIN high-level width tWCR1H
Digital noise Rejected pulse width tWSEP Bit 4 of INTM2 = 0 104tCLK1 ns rejection circuit Bit 4 of INTM2 = 1 176tCLK1 ns
Passed pulse width Bit 4 of INTM2 = 0 108tCLK1 ns
NMI low-level width tWNIL VDD = AVDD = 2.7 to 5.5 V 10 NMI high-level width tWNIH VDD = AVDD = 2.7 to 5.5 V 10 INTP0, INTP3 low-level widths tWIPL0 2tCLK1 ns INTP0, INTP3 high-level widths tWIPH0 2tCLK1 ns INTP1, KEY0-KEY4 low-level widths tWIPL1 Mode other than STOP mode 2tCLK1 ns
INTP1, KEY0-KEY4 high-level widths tWIPH1 Mode other than STOP mode 2tCLK1 ns
INTP2 low-level width tWIPL2 In normal mode, Sampling = fCLK 2tCLK1 ns
INTP2 high-level width tWIPH2 In normal mode, Sampling = fCLK 2tCLK1 ns
RESET low-level width tWRSL 10
When digital noise rejection circuit is not used
When digital noise rejection circuit is used 108tCLK1 ns
(Bit 4 of INTM2 = 0)
When digital noise rejection circuit is used 180tCLK1 ns
(Bit 4 of INTM2 = 1)
When digital noise rejection circuit is not used
When digital noise rejection circuit is used 108tCLK1 ns
(Bit 4 of INTM2 = 0)
When digital noise rejection circuit is used 180tCLK1 ns
(Bit 4 of INTM2 = 1)
Bit 4 of INTM2 = 1 180tCLK1 ns
In STOP mode, for releasing STOP mode 10
In STOP mode, for releasing STOP mode 10
with main clock Sampling = fCLK/128 32
Normal mode, Sampling = fCLK 61
with subclock Sampling = fCLK/128 7.9
In STOP mode, for releasing STOP mode 10
with main clock Sampling = fCLK/128 32
Normal mode, Sampling = fCLK 61
with subclock Sampling = fCLK/128 7.9
In STOP mode, for releasing STOP mode 10
8tCLK1 ns
8tCLK1 ns
Note
Note
Note
Note
µ
µ µ
µ
µ
µ µ
ms
µ
µ µ
ms
µ µ
s
s s
s
s
s s
s
s s
s s
Note If a high or low level is successively input two times during the sampling period, a high or low level is
detected.
Remark t
CKL1: operating clock cycle time of peripheral circuit (125 ns)
Data Sheet U12255EJ2V0DS00
75
µ
PD784927, 784928, 784927Y, 784928Y
Clock output operation (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. MAX. Unit CLO cycle time tCYCL nT 125 16000 ns CLO low-level width tCLL tCYCL/2 ± 25 37.5 8025 ns CLO high-level width tCLH tCYCL/2 ± 25 37.5 8025 ns CLO rise time tCLR 25 ns CLO fall time tCLF 25 ns
Remarks 1. n: system clock division
2. T = 1/fCLK
Data hold characteristics (TA = –10 to +70°C, VDD = AVDD = 2.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Low-level input voltage VIL Special pins (pins in Note) 0 0.1 VDDDR V High-level input voltage V IH 0.9 VDDDR VDDDR V
Note RESET, IC, NMI, INTP0-INTP2, P61/SCK1/BUZ, P63/SI1, SCK2, SI2/BUSY, P65/HWIN, P91/KEY0-P95/
KEY4
Watch function (T
Subclock oscillation hold voltage VDDXT 2.7 V Hardware watch function operating voltage
A = –10 to +70°C, VDD = AVDD = 2.7 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. MAX. Unit
VDDW 2.7 V
Subclock oscillation stop detection flag (TA = –10 to +70°C, VDD = AVDD = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. MAX. Unit Oscillation stop detection width tOSCF 45
A/D converter characteristics (TA = –10 to +70°C, VDD = AVDD = AVREF = 4.5 to 5.5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Resolution 8 bit Total error AVREF = VDD 2.0 % Quantization error ±1/2 LSB Conversion time tCONV Bit 4 of ADM = 0 160tCLK1
Bit 4 of ADM = 1 80tCLK1
Sampling time tSAMP Bit 4 of ADM = 0 32tCLK1
Bit 4 of ADM = 1 16tCLK1 Analog input voltage VIAN 0AVREF V Analog input impedance ZAN 1000 M AVREF current AIREF 0.4 1.2 mA
µ
s
µ
s
µ
s
µ
s
µ
s
76
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
VREF amplifier (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Reference voltage VREF 2.35 2.50 2.65 V Charge current ICHG Sets AMPM0.0 to 1 300
(pins in Note)
µ
A
Note RECCTL+, RECCTL–, CFGIN, CFGCPIN, DFGIN, DPGIN, CSYNCIN, REEL0IN, REEL1IN
CTL amplifier (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit CTL+, – input resistance RICTL 2510k Feedback resistance RFCTL 20 50 100 k Bias resistance RBCTL 20 50 100 k Minimum voltage gain GCTLMIN 17 20 22 dB Maximum voltage gain GCTLMAX 71 75 dB Gain selecting step SGAIN 1.77 dB Same phase signal elimination ratio CMR DC, voltage gain: 20 dB 50 dB High comparator set voltage of waveform shaping High comparator reset voltage of waveform shaping Low comparator set voltage of waveform shaping Low comparator reset voltage of waveform shaping Comparator Schmitt width of waveform shaping High comparator voltage of CTL flag S VFSH Low comparator voltage of CLT flag S V FSL High comparator voltage of CTL flag L VFLH Low comparator voltage of CTL flag L VFLL
VPBCTLHS VPBCTLHR VPBCTLLS VPBCTLLR
VPBSH
VREF + 0.47 VREF + 0.50 VREF + 0.53 VREF + 0.27 VREF + 0.30 VREF + 0.33 VREF – 0.53 VREF – 0.50 VREF – 0.47 VREF – 0.33 VREF – 0.30 VREF – 0.27
150 200 250 mV VREF + 1.00 VREF + 1.05 VREF + 1.10 VREF – 1.10 VREF – 1.05 VREF – 1.00 VREF + 1.40 VREF + 1.45 VREF + 1.50 VREF – 1.50 VREF – 1.45 VREF – 1.40
V V V V
V V V V
Data Sheet U12255EJ2V0DS00
77
µ
PD784927, 784928, 784927Y, 784928Y
CFG amplifier (AC coupling) (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Voltage gain 1 GCFG1 fi = 2 kHz, open loop 50 dB Voltage gain 2 GCFG2 fi = 30 kHz, open loop 34 dB CFGAMPO High-level output current IOHCFG DC – 1 mA CFGAMPO Low-level output current IOLCFG DC 0.1 mA High comparator voltage VCFGH Low comparator voltage VCFGL Duty accuracy PDUTY Note 49.7 50.0 50.3 %
VREF + 0.09 VREF + 0.12 VREF + 0.15 VREF – 0.15 VREF – 0.12 VREF – 0.09
Note The conditions include the following circuit and input signal.
V V
Input signal : Sine wave input (5 mV
fi = 1 kHz
Voltage gain: 50 dB
DFG amplifier (AC coupling) (T
Parameter Symbol Condition MIN. TYP. MAX. Unit Voltage gain GDFG f i = 900 Hz, open loop 50 dB Feedback resistance RFDFG 160 400 640 k Input protection resistance RIDFG 150 High comparator voltage VDFGH Low comparator voltage VDFGL
A = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
p-p)
–+
22 F
µ
1 k
330 k
µ
PD784927
CFGIN
CFGAMPO
µ
0.01 F
CFGCPIN
VREF + 0.07 VREF + 0.10 VREF + 0.14 VREF – 0.14 VREF – 0.10 VREF – 0.07
V V
Caution Set the input resistance connected to the DFGIN pin to 16 k or below. Connecting a resistor
exceeding that value may cause the DFG amp to oscillate.
78
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
DPG amplifier (AC coupling) (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Voltage gain GDPG fI = 30 Hz 20 dB High comparator voltage VDPGH1
VDPGH2 VDPGH3
Low comparator voltage VDPGL1
VDPGL2 VDPGL3
SELDPGHL0 = 0, SELDPGHL1 = 0 SELDPGHL0 = 1, SELDPGHL1 = 0 SELDPGHL0 = 0, SELDPGHL1 = 1 SELDPGHL0 = 0, SELDPGHL1 = 0 SELDPGHL0 = 1, SELDPGHL1 = 0 SELDPGHL0 = 0, SELDPGHL1 = 1
VREF + 0.02 VREF + 0.05 VREF + 0.08 VREF + 0.56 VREF + 0.60 VREF + 0.64 VREF – 0.44 VREF – 0.40 VREF – 0.36 VREF – 0.08 VREF – 0.05 VREF – 0.02 VREF + 0.36 VREF + 0.40 VREF + 0.44 VREF – 0.64 VREF – 0.60 VREF – 0.56
Caution When both the SELDPGHL0 and SELDPGHL1 are set to 0, the DPG amplifier is not used.
Therefore, be sure to set AMPC.7 (ENDPG) to 0.
V V V V V V
Ternary separation circuit (T
Parameter Symbol Condition MIN. TYP. MAX. Unit Input impedance ZIPFG 20 50 100 k High comparator voltage VPFGH VREF + 0.5 VREF + 0.7 VREF + 0.9 V Low comparator voltage VPFGL VREF – 1.4 VREF – 1.2 VREF – 1.0 V
A = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
CSYNC comparator (AC coupling) (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Input impedance ZICSYN 20 50 100 k High comparator voltage VCSYNH Low comparator voltage VCSYNL
VREF + 0.07 VREF + 0.10 VREF + 0.13 VREF – 0.13 VREF – 0.10 VREF – 0.07
Reel FG comparator (AC coupling) (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit Input impedance ZIRLFG 20 50 100 k High comparator voltage VRLFGH Low comparator voltage VRLFGL
VREF + 0.02 VREF + 0.05 VREF + 0.08 VREF – 0.08 VREF – 0.05 VREF – 0.02
V V
V V
RECCTL driver (TA = 25°C, VDD = AVDD = 5 V, VSS = AVSS = 0 V)
Parameter Symbol Condition MIN. TYP. MAX. Unit RECCTL+, – high-level output voltage VCHREC IOH = –4 mA VDD – 0.8 V RECCTL+, – low-level output voltage VOLREC IOL = 4 mA 0.8 V CTLDLY internal resistance RCTL 40 70 140 k CTLDLY charge current IOHCTL Use of internal resistor –3 mA CTLDLY discharge current IOLCTL –3 mA
Data Sheet U12255EJ2V0DS00
79
Timing waveform
AC timing test point
µ
PD784927, 784928, 784927Y, 784928Y
0.8 VDD or 2.2 V
0.8 V
Serial transfer timing (SIOn: n = 1 or 2)
t
WSKL
SCKn
SIn
SOn
t
CYSK
t
WSKH
Test point
t
DSSK
Output data
0.8 VDD or 2.2 V
0.8 V
t
SSSK
t
HSSK
Input data
80
Data Sheet U12255EJ2V0DS00
Serial transfer timing (SIO2 only)
No busy processing
t
WSKL
t
WSKH
µ
PD784927, 784928, 784927Y, 784928Y
SCK2
BUSY
7
t
CYSK
Active high Busy invalid
STRB
Continuation of busy processing
t
WSKL
SCK2
BUSY
STRB
t
WSKH
78910
t
CYSK
Active high
89101 2
t
DSTRB
t
WSTRB
10+n
t
t
DSTRB
t
WSTRB
SBUSY
t
SBUSY
End of busy processing
tWSKL tWSKH
SCK2
BUSY
7 8 9 10+n 11+n
tCYSK
tHBUSY tLBUSY
Active high
1
Caution When an external clock is selected as the serial clock, do not use the busy control or strobe
control.
Data Sheet U12255EJ2V0DS00
81
I2C bus mode (µPD784928Y subseries only)
t
SCL
SDA
LOW
t
HD : STA
t
BUF
t
HD : DAT
t
R
t
HIGH
t
SU : DAT
µ
PD784927, 784928, 784927Y, 784928Y
t
F
t
SU : STA
t
HD : STA
t
SP
t
SU : STO
Stop condition
Start condition
Restart condition
Stop condition
82
Data Sheet U12255EJ2V0DS00
Super timer unit input timing
When DFGIN, CFGIN, DPGIN, REEL0IN, or REEL1IN logic level is input
When CSYNCIN logic level is input
Interrupt request input timing
0.8 V
0.8 V
µ
PD784927, 784928, 784927Y, 784928Y
t
WCTH
DD
t
WCTL
0.8 V
t
WCR1H
DD
t
WCR1L
0.8 V
NMI
INTP0, INTP3
INTP1, KEY0-KEY4
INTP2
0.8 V
0.8 V
0.8 V
0.8 V
t
WNIH
DD
t
WNIL
0.8 V
t
WIPH0
DD
t
WIPL0
0.8 V
t
WIPH1
DD
t
WIPL1
0.8 V
t
WIPH2
DD
t
WIPL2
0.8 V
Data Sheet U12255EJ2V0DS00
83
Reset input timing
µ
PD784927, 784928, 784927Y, 784928Y
t
WRSL
RESET
Clock output timing
CLO
0.8 V
0.8 V
0.8 V
t
CLH
DD
t
t
CYCL
CLF
t
CLL
t
CLR
84
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
7. PACKAGE DRAWING
100 PIN PLASTIC LQFP (FINE PITCH) (14×14)
A B
75 51
76
50
detail of lead end
100
1
25
26
F
G
H
M
I
J
P
N
NOTE
Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.
CD
K
L
S
Q
R
M
ITEM MILLIMETERS INCHES
A 16.00±0.20 0.630±0.008
+0.009
B 14.00±0.20 0.551
C 14.00±0.20 0.551 D 16.00±0.20 0.630±0.008
F 1.00 0.039
G 1.00 0.039
+7° –3°
+0.05 –0.04
+0.03 –0.07
H 0.22 0.009±0.002
I 0.08 0.003
J 0.50 (T.P.) 0.020 (T.P.) K 1.00±0.20 0.039
L 0.50±0.20 0.020
M 0.17 0.007
N 0.08 0.003 P 1.40±0.05 0.055±0.002
Q 0.10±0.05 0.004±0.002
R3° 3° S 1.60 MAX. 0.063 MAX.
+0.009 –0.008
–0.008 +0.009
–0.008
+0.009 –0.008
+0.008 –0.009
+0.001 –0.003
+7° –3°
S100GC-50-8EU
Remark The package dimensions and materials of ES versions are the same as those of mass-production
versions.
Data Sheet U12255EJ2V0DS00
85
100PIN PLASTIC QFP (14x20)
µ
PD784927, 784928, 784927Y, 784928Y
A B
80
81
100
1
51
30
50
31
F
G
H
M
I
J
P
N
NOTE
Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition.
CD
K
M
L
detail of lead end
S
Q
ITEM MILLIMETERS INCHES
A 23.6±0.4 0.929±0.016
B 20.0±0.2 0.795
C 14.0±0.2 0.551
D 17.6±0.4 0.693±0.016 F 0.8 0.031
G 0.6 0.024
H 0.30±0.10 0.012
I 0.15 0.006
J 0.65 (T.P.) 0.026 (T.P.)
K 1.8±0.2 0.071
L 0.8±0.2 0.031
M 0.15 0.006
N 0.10 0.004 P 2.7±0.1 0.106
Q 0.1±0.1 0.004±0.004
R5°±5° 5°±5° S 3.0 MAX. 0.119 MAX.
R
+0.10 –0.05
P100GF-65-3BA1-3
+0.009 –0.008
+0.009 –0.008
+0.004 –0.005
+0.008 –0.009
+0.009 –0.008
+0.004 –0.003
+0.005 –0.004
Remark The package dimensions and materials of ES versions are the same as those of mass-production
versions.
86
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
8. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions. For details of the recommended soldering conditions, refer to information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
µ
Caution
µ
PD784927GF-×××-3BA : 100-pin plastic QFP (14 × 20 mm)
µ
PD784928GF-×××-3BA : 100-pin plastic QFP (14 × 20 mm)
µ
PD784927YGF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)
µ
PD784928YGF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)
Soldering Method Soldering Conditions Recommended
Infrared reflow Package peak temperature: 235°C, Time: 30 secs. max. (210°C min.), IR35-00-3
VPS Package peak temperature: 215°C, Time: 40 secs. max. (200°C min.), VP15-00-3
Wave soldering Solder bath temperature: 260°C max., Time: 10 secs. max., WS60-00-1
Partial heating Pin temperature: 300°C max., Time: three secs. max. (per device side)
PD784927GC-×××-8EU, 784927YGC-×××-8EU, 784928GC-×××-8EU, and 784928YGC-×××-8EU are
under development. Therefore their soldering conditions are not defined.
Table 8-1. Surface Mount Type Soldering Conditions
Conditions Symbol
Number of times: three times max.
Number of times: three times max.
Number of times: once, Preheating temperature: 120°C max.(Package surface temperature)
Caution Do not use two or more soldering methods in combination (except partial heating).
Data Sheet U12255EJ2V0DS00
87
µ
PD784927, 784928, 784927Y, 784928Y
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for developing systems using the µPD784927. Refer to (5) Cautions when the development tools are used.
(1) Language processing software
RA78K4 78K/IV series common assembler package CC78K4 78K/IV series common C compiler package DF784928 Device file for the µPD784928, 784928Y subseries CC78K4-L 78K/IV series common C compiler library source file
(2) Flash memory writing tools
Flashpro II, III Dedicated flash programmer (Part number: FL-PR2, FL-PR3, PG-FPIII)
FA-100GC Adapter for writing 100-pin plastic LQFP (GC-8EU type) flash memory. Be sure to
connect depending on the target product.
FA-100GF Adapter for writing 100-pin plastic QFP (GF-3BA type) flash memory. Be sure to
connect depending on the target product.
(3) Debugging tools
• When using the IE-78K4-NS in-circuit emulator
IE-78K4-NS 78K/IV series common in-circuit emulator IE-70000-MC-PS-B Power supply unit for IE-78K4-NS IE-70000-98-IF-C Interface adapter necessary when a PC-9800 series computer (except notebook
personal computer) is used as host machine (C bus compatible)
IE-70000-CD-IF-A PC card and interface cable necessary when a notebook personal computer is used as
host machine (PCMCIA socket compatible)
IE-70000-PC-IF-C Interface adapter necessary when an IBM PC/ATTM compatible machine is used as host
machine (ISA bus compatible) IE-784928-NS-EM1 Emulation board for emulating the µPD784928, 784928Y subseries EP-784915-GF-R Emulation probe for µPD784915 subseries common 100-pin plastic QFP (GC-3BA type)
and 100-pin plastic LQFP (GC-8EU type). EV-9200GF-100 Conversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in LCC system. NQPACK100RB Conversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in QFP system. ID78K4-NS Integrated debugger for IE-78K4-NS SM78K4 78K/IV series common system simulator DF784928 Device file for the µPD784928, 784928Y subseries
88
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
When using the IE-784000-R in-circuit emulator
IE-784000-R 78K/IV series common in-circuit emulator IE-70000-98-IF-C Interface adapter necessary when a PC-9800 series computer (except notebook
personal computer) is used as host machine (C bus compatible)
IE-70000-PC-IF-C Interface adapter necessary when an IBM PC/AT compatible machine is used
as host machine (ISA bus compatible) IE-78000-R-SV3 Interface adapter and cable necessary when an EWS is used as host machine IE-784928-NS-EM1 Emulation board for emulating the µPD784928, 784928Y subseries and µPD784915
IE-784915-R-EM1 subseries IE-784000-R-EM 78K/IV series common emulation board IE-78K4-R-EX3 Conversion board for 100-pin products necessary when the IE-784928-NS-EM1 is used
in the IE-784000-R. Not necessary when the IE-784915-R-EM1 is used. EP-784915-GF-R Emulation probe for µPD784915 subseries common 100-pin plastic QFP (GC-3BA type)
and 100-pin plastic LQFP (GC-8EU type). EV-9200GF-100 Conversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in LCC system. NQPACK100RB Conversion socket to be mounted on the board of the target system for 100-pin plastic
QFP (GF-3BA type). It is used in QFP system. ID78K4 Integrated debugger for IE-784000-R SM78K4 78K/IV series common system simulator DF784928 Device file for the µPD784928, 784928Y subseries
(4) Real-time OS
RX78K/IV Real-time OS for 78K/IV series MX78K4 OS for 78K/IV series
Data Sheet U12255EJ2V0DS00
89
µ
PD784927, 784928, 784927Y, 784928Y
(5) Cautions when the development tools are used
• The ID78K4-NS, ID78K4, and SM78K4 are used in combination with the DF784928.
• The CC78K4 and RX78K/IV are used in combination with the RA78K4 and DF784928.
• FL-PR2, FL-PR3, FA-100GC, and FA-100GF are products of Naito Densei Machida Mfg. Co., Ltd. (TEL: 044­822-3813). Contact an NEC distributor when purchasing these products.
• NQPACK100RB is a product of Tokyo Eletech Corp. Reference: Daimaru Kogyo, Ltd. Electronics Dept. (TEL: Tokyo 03-3820-7112)
Electronics 2nd Dept. (TEL: Osaka 06-6244-6672)
• Host machines and OSs compatible with the software are as follows:
Host Machine [OS] PC EWS
PC-9800 Series [WindowsTM] HP9000 series 700TM [HP-UXTM] IBM PC/AT compatible machines SPARCstationTM [SunOSTM, SolarisTM]
Software [Japanese/English Windows] NEWSTM (RISC) [NEWS-OSTM] RA78K4 CC78K4 ID78K4-NS – ID78K4 SM78K4 – RX78K/IV MX78K4
Note
Note
Note
Note
Note DOS based software
90
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
APPENDIX B. RELATED DOCUMENTS
Device-related documents
Document Document No.
Japanese English
µ
PD784928, 784928Y Subseries User’s Manual - Hardware U12648J U12648E
µ
PD784927, 784928, 784927Y, 784928Y Data Sheet U12255J This document
µ
PD784928 Subseries Special Function Register Table U12798J
µ
PD78F4928 Preliminary Product Information U12188J U12188E
µ
PD784928Y Subseries Special Function Register Table U12719J
µ
PD78F4928Y Preliminary Product Information U12271J U12271E
µ
PD784915, 784928, 784928Y Subseries Application Note - VCR Servo 78K/IV Series User’s Manual - Instruction U10905J U10905E 78K/IV Series Instruction Table U10594J – 78K/IV Series Instruction Set U10595J – 78K/IV Series Application Note - Software Basics U10095J U10095E
U11361J U11361E
Development tool-related documents (User’s Manuals)
Document Document No.
Japanese English
RA78K4 Assembler Package Operation U11334J U11334E
Language U11162J U11162E RA78K4 Structured Assembler Preprocessor U11743J U11743E CC78K4 C Compiler Operation U11572J U11572E
Language U11571J U11571E IE-78K4-NS U13356J U13356E IE-784000-R U12903J EEU-1534 IE-784928-NS-EM1 U13819J U13819E IE-784915-R-EM1, EP-784915GF-R U10931J U10931E SM78K4 System Simulator Windows Based SM78K Series System Simulator External Part User Open U10092J U10092E
ID78K4-NS Integrated Debugger Reference U12796J U12796E ID78K4 Integrated Debugger Windows Based ID78K4 Integrated Debugger Reference U11960J U11960E
HP-UX, SunOS, NEWS-OS Based
Reference U10093J U10093E
Interface Specifications
Reference U10440J U10440E
Caution The contents of the above related documents are subject to change without notice. Be sure to use
the latest edition of the document when designing your system.
Data Sheet U12255EJ2V0DS00
91
µ
PD784927, 784928, 784927Y, 784928Y
Embedded software-related documents (User’s Manual)
Document Document No.
Japanese English
78K/IV Series Real-Time OS Fundamental U10603J U10603E
Installation U10604J U10604E Debugger U10364J
78K/IV Series OS, MX78K4 Fundamental U11779J
Other documents
Document Document No.
Japanese English SEMICONDUCTORS SELECTION GUIDE Products & Packages (CD-ROM) X13769X Semiconductor Device Mounting Technology Manual C10535J C10535E Quality Grades on NEC Semiconductor Devices C11531J C11531E NEC Semiconductor Device Reliability/Quality Control System C10983J C10983E Guide to Prevent Damage for Semiconductor Devices by C11892J C11892E
Electrostatic Discharge (ESD) Guide to Microcomputer-Related Products by Third Party U11416J
Caution The contents of the above related documents are subject to change without notice. Be sure to use
the latest edition of the document when designing your system.
92
Data Sheet U12255EJ2V0DS00
[MEMO]
µ
PD784927, 784928, 784927Y, 784928Y
Data Sheet U12255EJ2V0DS00
93
µ
PD784927, 784928, 784927Y, 784928Y
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and trans­ported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
DD or GND with a resistor, if it is considered to have a
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Purchase of NEC I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
EEPROM and FIP are trademarks of NEC Corporation. Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or other countries. PC/AT and PC DOS are trademarks of IBM Corporation. HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. NEWS and NEW-OS are trademarks of Sony Corporation.
94
Data Sheet U12255EJ2V0DS00
µ
PD784927, 784928, 784927Y, 784928Y
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, please contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel:040-2445845 Fax: 040-2444580
NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel:01-30-67 58 00 Fax: 01-30-67 58 99
NEC Electronics (France) S.A.
Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics Hong Kong Ltd.
Hong Kong Tel:2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel:65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd.
NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829
J99.1
Data Sheet U12255EJ2V0DS00
95
µ
PD784927, 784928, 784927Y, 784928Y
The documents referred to in this publication may include preliminary versions. However, preliminary versions are not marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited without governmental license, the need for which must be judged by the customer. The export or re-export of this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98.8
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