The µPD784224 and 784225 are products of the µPD784225 Subseries in the 78K/IV Series. Besides a highspeed and high performance CPU, these controllers have ROM, RAM, I/O ports, 8-bit resolution A/D and D/A
converters, timers, serial interfaces, a real-time output port, interrupt functions, and various other peripheral
hardware.
µ
PD784224Y and 784225Y are based on the µPD784225 Subseries with the addition of a multimaster-
The
supporting I2C bus interface.
Flash memory versions, the µPD78F4225 and 78F4225Y, which replace the internal ROM of the mask ROM
version with flash memory, and various development tools are also available.
The functions are explained in detail in the following user’s manuals. Be sure to read this manual when
designing your system.
6.1Memory Space ...................................................................................................................................... 2 0
8.4Macro Service ....................................................................................................................................... 49
8.5Application Example of Macro Service............................................................................................. 50
Data Sheet U12376EJ1V0DS00
5
µ
PD784224, 784225, 784224Y, 784225Y
9.LOCAL BUS INTERFACE ............................................................................................................. 51
APPENDIX A. DEVELOPMENT TOOLS ............................................................................................ 85
APPENDIX B. RELATED DOCUMENTS ............................................................................................ 88
6
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
1. DIFFERENCES AMONG MODELS IN µPD784225, 784225Y SUBSERIES
The only difference among the µPD784224 and 784225 lies in the internal memory capacity.
The µPD784224Y and 784225Y are based on the µPD784224 and 784225 respectively, with the addition of an
I2C bus control function.
µ
PD78F4225 and 78F4225Y are provided with a 128-Kbyte flash memory instead of the mask ROM of the
The
above models. These differences are summarized in Table 1-1.
Supply voltageVDD = 1.8 to 5.5 VVDD = 1.9 to 5.5 V
ElectricalRefer to the data sheet for each device.
specifications
Recommended
soldering
conditions
TEST pinProvidedNone
VPP pinNoneProvided
Note
µ
PD784224,
µ
PD784224Y
µ
PD784225,
µ
PD784225Y
µ
PD78F4225,
µ
PD78F4225Y
Note The internal flash memory capacity and internal RAM capacity can be changed using the internal memory
size switching register (IMS).
CautionThere are differences in noise immunity and noise radiation between the flash memory and mask
ROM versions. When pre-producing an application set with the flash memory version and then
mass-producing it with the mask ROM version, be sure to conduct sufficient evaluations on the
commercial samples (not engineering samples) of the mask ROM version.
Data Sheet U12376EJ1V0DS00
7
µ
PD784224, 784225, 784224Y, 784225Y
2. MAJOR DIFFERENCES BETWEEN µPD784216Y SUBSERIES AND µPD780058Y SUBSERIES
Series Name
ItemSubseries
CPU16-bit CPU8-bit CPU
MinimumWith main system160 ns (at 12.5 MHz)400 ns (at 5.0 MHz)
Notes 1. The SCL0 and SDA0 pins are available in µPD784225Y Subseries only.
2. Connect the TEST pin to V
SS0 directly or via a pull-down resistor. For the pull-down connection, use
of a resistor with a resistance ranging from 470 Ω to 10 kΩ is recommended.
Caution Connect the AV
SS pin to VSS0.
Remark When using in applications where noise from inside the microcomputer has to be reduced, it is
recommended to take countermeasures against noise such as supplying power to V
DD0 and VDD1
independently, and connecting VSS0 and VSS1 to different ground lines.
Data Sheet U12376EJ1V0DS00
9
µ
PD784224, 784225, 784224Y, 784225Y
A8 to A19: Address Bus
AD0 to AD7: Address/Data Bus
ANI0 to ANI7: Analog Input
ANO0, ANO1: Analog Output
ASCK1, ASCK2: Asynchronous Serial Clock
ASTB: Address Strobe
DD: Analog Power Supply
AV
AVREF1: Analog Reference Voltage
SS: Analog Ground
AV
BUZ: Buzzer Clock
EXA: External Access Status Output
INTP0 to INTP5: Interrupt from Peripherals
NMI: Non-maskable Interrupt
P00 to P05: Port0
P10 to P17: Port1
P20 to P27: Port2
P30 to P37: Port3
P40 to P47: Port4
P50 to P57: Port5
P60 to P67: Port6
P70 to P72: Port7
P120 to P127: Port12
P130, P131: Port13
PCL: Programmable Clock
RD: Read Strobe
RESET: Reset
RTP0 to RTP7: Real-time Output Port
RxD1, RxD2: Receive Data
SCK0 to SCK2: Serial Clock
SCL0
SDA0
Note
Note
: Serial Clock
: Serial Data
SI0 to SI2: Serial Input
SO0 to SO2: Serial Output
TEST: Test
TI00, TI01, TI1, TI2 : Timer Input
TO0 to TO2: Timer Output
TxD1, TxD2: Transmit Data
DD0, VDD1: Power Supply
V
VSS0, VSS1: Ground
WAIT: Wait
WR: Write Strobe
X1, X2: Crystal (Main System Clock)
XT1, XT2: Crystal (Subsystem Clock)
Note The SCL0 and SDA0 pins are available in
µ
PD784225Y Subseries only.
10
Data Sheet U12376EJ1V0DS00
4. BLOCK DIAGRAM
µ
PD784224, 784225, 784224Y, 784225Y
INTP2/NMI
INTP0, INTP1,
INTP3 to INTP5
TI00
TI01
TO0
TI1
TO1
TI2
TO2
RTP0 to RTP7
NMI/INTP2
ANO0
ANO1
AV
REF1
AV
ANI0 to ANI7
AV
AV
P03/INTP3
PCL
BUZ
PROGRAMMABLE
INTERRUPT
CONTROLLER
TIMER/EVENT
COUNTER
(16 BITS)
TIMER/EVENT
COUNTER1
(8 BITS)
TIMER/EVENT
COUNTER2
(8 BITS)
TIMER/COUNTER5
(8 BITS)
TIMER/COUNTER6
(8 BITS)
78K/IV
CPU CORE
UART/IOE1
BAUD-RATE
GENERATOR
UART/IOE2
BAUD-RATE
GENERATOR
CLOCKED
SERIAL
INTERFACE
BUS I/F
ROM
PORT0
RxD1/SI1
TxD1/SO1
ASCK1/SCK1
RxD2/SI2
TxD2/SO2
ASCK2/SCK2
SI0/SDA0
Note
SO0
SCK0/SCL0
AD0 to AD7
A8 to A15
A16 to A19
RD
WR
WAIT
ASTB
EXA
P00 to P05
Note
WATCH TIMER
PORT1
PORT2
WATCHDOG TIMER
RAM
REAL-TIME
OUTPUT PORT
PORT3
PORT4
PORT5
PORT6
D/A
CONVERTER
SS
DD
SS
A/D
CONVERTER
PORT7
PORT12
PORT13
CLOCK OUTPUT
CONTROL
SYSTEM CONTROL
P10 to P17
P20 to P27
P30 to P37
P40 to P47
P50 to P57
P60 to P67
P70 to P72
P120 to P127
P130, P131
RESET
X1
X2
XT1
BUZZER OUTPUT
XT2
V
DD0
V
SS0
, V
, V
DD1
SS1
TEST
Note This function supports the I2C bus interface and is available in µPD784225Y Subseries only.
Remark The internal ROM and RAM capacities differ depending on the model.
Data Sheet U12376EJ1V0DS00
11
µ
PD784224, 784225, 784224Y, 784225Y
5. PIN FUNCTION
5.1 Port Pins (1/2)
Pin NameI/OAlternate FunctionFunction
P00I/OINTP0
P01INTP1
P02INTP2/NM1
P03INTP3
P04INTP4
P05INTP5
P10 to P17InputANI0 to ANI7
Port 0 (P0):
• 6-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up
resistors by software bit-wise.
• All pins set in input mode can be connected to internal pull-up
resistors by software.
Port 7 (P7):
• 3-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up
resistor by software bit-wise.
P120 to P127I/ORTP0 to RTP7Port 12 (P12):
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up
resistor by software bit-wise.
P130, P131I/OANO0, ANO1Port 13 (P13):
• 2-bit I/O port
• Can be set in input or output mode bit-wise.
Data Sheet U12376EJ1V0DS00
13
µ
PD784224, 784225, 784224Y, 784225Y
5.2 Pins Other Than Port Pins (1/2)
Pin NameI/OAlternate FunctionFunction
TI00InputP35External count clock input to 16-bit timer register
TI01P36Capture trigger signal input to capture/compare register 00
TI1P33External count clock input to 8-bit timer register 1
TI2P34External count clock input to 8-bit timer register 2
TO0OutputP3016-bit timer output (shared by 14-bit PWM output)
TO1P318-bit timer output (shared by 8-bit PWM output)
TO2P32
RxD1InputP20/SI1Serial data input (UART1)
RxD2P70/SI2Serial data input (UART2)
TxD1OutputP21/SO1Serial data output (UART1)
TxD2P71/SO2Serial data output (UART2)
ASCK1IntputP22/SCK1Baud rate clock input (UART1)
ASCK2P72/SCK2Baud rate clock input (UART2)
SI0InputP25/SDA0
SI1P20/RxD1Serial data input (3-wire serial clock I/O1)
SI2P70/RxD2Serial data input (3-wire serial clock I/O2)
SO0OutputP26Serial data output (3-wire serial I/O0)
SO1P21/TxD1Serial data output (3-wire serial I/O1)
SO2P71/TxD2Serial data output (3-wire serial I/O2)
Note
SDA0
SCK0I/OP27/SCL0
SCK1P22/ASCK1Serial clock input/output (3-wire serial I/O1)
SCK2P72/ASCK2Serial clock input/output (3-wire serial I/O2)
Note
SCL0
NMIInputP02/INTP2Non-maskable interrupt request input
INTP0P00External interrupt request input
INTP1P01
INTP2P02/NMI
INTP3P03
INTP4P04
INTP5P05
PCLOutputP23Clock output (for trimming main system clock and subsystem clock)
BUZOutputP24Buzzer output
RTP0 to RTP7
AD0 to AD7I/OP40 to P47Low-order address/data bus when external memory is connected
A8 to A15OutputP50 to P57Middle-order address bus when external memory is connected
A16 to A19P60 to P63High-order address bus when external memory is connected
I/OP25/SI0Serial data input/output (I2C bus)
P27/SCK0Serial clock input/output (I2C bus)
OutputP120 to P127Real-time output port that outputs data in synchronization with
Note
Note
Serial data input (3-wire serial clock I/O0)
Serial clock input/output (3-wire serial I/O0)
trigger
Note This function is available in µPD784255Y Subseries only.
14
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
5.2 Pins Other Than Port Pins (2/2)
Pin NameI/OAlternate FunctionFunction
RDOutputP64Strobe signal output for read operation of external memory
WRP65Strobe signal output for write operation of external memory
WAITInputP66To insert wait state(s) when external memory is accessed
ASTBOutputP67Strobe output to externally latch address information output to ports
4 to 6 to access external memory
EXAOutputP37External access status output
RESETInput−System reset input
X1Input−To connect main system clock oscillation crystal
X2−
XT1Input−To connect subsystem clock oscillation crystal
XT2−
ANI0 to ANI7InputP10 to P17Analog voltage input for A/D converter
ANO0, ANO1OutputP130, P131Analog voltage output for D/A converter
AVREF1−−To apply reference voltage for D/A converter
AVDDPositive power supply for A/D converter. Connected to VDD0.
AVSSGND for A/D converter and D/A converter. Connected to VSS0.
VDD0Positive power supply for port block
VSS0GND potential for port block
VDD1Positive power supply (except port block)
VSS1GND potential (except port block)
TESTConnect this pin to VSS0 directly or via pull-down resistor. For the
pull-down connection, use of a resistor with a resistance ranging
from 470 Ω to 10 kΩ is recommended.
Data Sheet U12376EJ1V0DS00
15
µ
PD784224, 784225, 784224Y, 784225Y
5.3 I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins
Table 5-1 shows symbols indicating the I/O circuit types of the respective pins and the recommended connection
of unused pins.
For the circuit diagram of each type of I/O circuit, refer to Figure 5-1.
Table 5-1. I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins (1/2)
Pin NameI/O Circuit TypeI/ORecommended Connections of Unused Pins
P00/INTP08-KI/OInput : Individually connected to VSS0 via resistor
P01/INTP1
P02/INTP2/NMI
P03/INTP3 to P05/INTP5
P10/ANI0 to P17/ANI79InputConnected to VSS0 or VDD0
P20/RxD1/SI110-II/OInput : Individually connected to VSS0 via resistor
P21/TxD1/SO110-J
P22/ASCK1/SCK110-I
P23/PCL10-J
P24/BUZ
P25/SDA0
P26/SO010-J
P27/SCL0
P30/TO0 to P32/TO28-M
P33/TI1, P34/TI28-K
P35/TI00, P36/TI018-L
P37/EXA8-M
P40/AD0 to P47/AD75-H
P50/A8 to P57/A15
P60/A16 to P63/A19
P64/RD
P65/WR
P66/WAIT
P67/ASTB
P70/RxD2/SI28-K
P71/TxD2/SO28-L
P72/ASCK2/SCK28-K
Note
/SI010-I
Note
/SCK010-I
Output: Open
Output: Open
Note This function is available in µPD784255Y Subseries only.
Remark Because the circuit type numbers are standardized among the 78K Series products, they are not
sequential in some models (i.e., some circuits are not provided).
16
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 5-1. I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins (2/2)
Pin NameI/O Circuit TypeI/ORecommended Connections of Unused Pins
P120/RTP0 to P127/RTP78-KI/OInput : Individually connected to VSS0 via resistor
P130/ANO0, P131/ANO112-D
RESET2-GInput−
XT116Connected to VSS0
XT2−Open
AVREF1−Connected to VDD0
AVDD
AVSSConnected to VSS0
TEST/VPP
Note
Output: Open
Directly connected to VSS0
Note VPP pin is available in µPD78F4225, 78F4255Y only.
Remark Because the circuit type numbers are standardized among the 78K Series products, they are not
sequential in some models (i.e., some circuits are not provided).
Data Sheet U12376EJ1V0DS00
17
µ
PD784224, 784225, 784224Y, 784225Y
Figure 5-1. Types of Pin I/O Circuits (1/2)
Type 2-G
IN
Schmitt trigger input with hysteresis characteristics
V
Type 5-H
pullup
enable
data
output
disable
V
SS0
DD0
P-ch
DD0
V
P-ch
N-ch
input
enable
IN/OUT
Type 8-M
pullup
enable
data
output
disable
input
enable
Type 9
IN
P-ch
N-ch
V
V
DD0
P-ch
N-ch
V
SS0
Comparator
+
−
V
REF
(threshold voltage)
DD0
P-ch
IN/OUT
input
enable
Type 8-K
pullup
enable
data
output
disable
Type 8-L
pullup
enable
data
open drain
output disable
V
DD0
Type 10-I
pullup
P-ch
DD0
V
P-ch
IN/OUT
N-ch
V
SS0
V
DD0
P-ch
DD0
V
P-ch
enable
data
open drain
output disable
Type 10-J
pullup
enable
data
V
IN/OUT
N-ch
V
SS0
open drain
output disable
V
SS0
SS0
V
DD0
P-ch
DD0
V
P-ch
IN/OUT
N-ch
V
DD0
P-ch
DD0
V
P-ch
IN/OUT
N-ch
18
Data Sheet U12376EJ1V0DS00
Type 12-D
data
output
disable
input
enable
Type 16
Analog output
voltage
feedback
cut-off
P-ch
VSS0
P-ch
N-ch
µ
PD784224, 784225, 784224Y, 784225Y
Figure 5-1. Types of Pin I/O Circuits (2/2)
V
DD0
P-ch
IN/OUT
N-ch
VSS0
XT1XT2
Data Sheet U12376EJ1V0DS00
19
µ
PD784224, 784225, 784224Y, 784225Y
6. CPU ARCHITECTURE
6.1 Memory Space
A memory space of 1 Mbyte can be accessed. Mapping of the internal data area (special function registers and
internal RAM) can be specified the LOCATION instruction. The LOCATION instruction must be always executed
after RESET cancellation, and must not be used more than once.
(1) When LOCATION 0H instruction is executed
• Internal memory
The internal data area and internal ROM area are mapped as follows:
Part NumberInternal Data AreaInternal ROM Area
µ
PD784224,0F100H to 0FFFFH00000H to 0F0FFH
µ
PD784224Y10000H to 17FFFH
µ
PD784225,0EE00H to 0FFFFH00000H to 0EDFFH
µ
PD784225Y10000H to 1FFFFH
CautionThe following areas that overlap the internal data area of the internal ROM cannot be used when
the LOCATION 0H instruction is executed.
Part NumberUnusable Area
µ
PD784224,0F100H to 0FFFFH (3,840 bytes)
µ
PD784224Y
µ
PD784225,0EE00H to 0FFFFH (4,608 bytes)
µ
PD784225Y
• External memory
The external memory is accessed in external memory expansion mode.
(2) When LOCATION 0FH instruction is executed
• Internal memory
The internal data area and internal ROM area are mapped as follows:
Part NumberInternal Data AreaInternal ROM Area
µ
PD784224,FF100H to FFFFFH00000H to 17FFFH
µ
PD784224Y
µ
PD784225,FEE00H to FFFFFH00000H to 1FFFFH
µ
PD784225Y
20
• External memory
The external memory is accessed in external memory expansion mode.
Data Sheet U12376EJ1V0DS00
(256 bytes)
Internal RAM
On execution of
Note 1
Special function registers (SFR)
LOCATION 0FH instruction
HFFFFF
HFDFFF
H0DFFF
H00FFF
(3,584 bytes)
HFFEFF
µ
PD784224, 784225, 784224Y, 784225Y
Note 4
Note 1
Internal ROM
External memory
(980,736 bytes)
HFFF71
HFF0FF
H001FF
H00081
(96 Kbytes)
H00000
HFFEFF
PD784224, 784224Y
µ
HFFEF0
H08EFF
HF7EFF
General-purpose
registers (128 bytes)
H08EF0
Figure 6-1. Memory Map of
Note 1
On execution of
LOCATION 0H instruction
HFFFFF
External memory
(928 Kbytes)
HF7EF0
Internal ROM
H00081
HFFF71
H93EFF
H60EFF
H00DFF
HFFCFF
H007FF
Program/data area
H00DF0
HFFCF0
(3,072 bytes)
H001F0
Data area (512 bytes)
Macro service control word
area (52 bytes)
H93EF0
H60EF0
(256 bytes)
(32,768 bytes)
Internal RAM
(3,584 bytes)
Note 1
Special function registers (SFR)
H00001
HFFFF0
HFDFF0
H0DFF0
H00FF0
HFFEF0
H001F0
HFFF71
Note 3
Note 2
CALLF entry
H00010
HFFF00
area (2 Kbytes)
H00800
HFF700
Internal ROM
(61,696 bytes)
CALLT table
area (64 bytes)
H08000
HF7000
H04000
Vector table area
(64 bytes)
HF3000
H00000
H00000
Program/data area
HFF0F0
H00001
HFFF71
Note 4
HFF0F0
Data Sheet U12376EJ1V0DS00
2. This 3,840-byte area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. On execution of LOCATION 0H instruction: 94,464 bytes, on execution of LOCATION 0FH instruction: 98,304 bytes
4. Base area and entry area for reset or interrupt. However, the internal RAM area is not used as a reset entry area.
Notes 1. Accessed in external memory expansion mode.
21
(256 bytes)
Internal RAM
On execution of
Note 1
Special function registers (SFR)
LOCATION 0FH instruction
HFFFFF
HFDFFF
H0DFFF
H00FFF
(4,352 bytes)
HFFEFF
µ
PD784224, 784225, 784224Y, 784225Y
Note 4
Note 1
Internal ROM
External memory
(912,896 bytes)
HFFFF1
HFFDEF
H00EEF
H00002
(128 Kbytes)
H00000
HFFEFF
PD784225, 784225Y
µ
HFFEF0
H08EFF
HF7EFF
General-purpose
registers (128 bytes)
H08EF0
HF7EF0
Figure 6-2. Memory Map of
Note 1
On execution of
LOCATION 0H instruction
HFFFFF
External memory
(896 Kbytes)
H00002
H93EFF
H60EFF
H00DFF
HFFCFF
Macro service control word
H93EF0
Internal ROM
(65,536 bytes)
Data area (512 bytes)
area (52 bytes)
H00DF0
H60EF0
HFFCF0
(256 bytes)
Internal RAM
Note 1
Special function registers (SFR)
H00001
HFFFF1
HFFFF0
HFDFF0
H0DFF0
H00FF0
HFFEF0
HFFFF1
H00EEF
Note 2
Program/data area
(3,840 bytes)
H00001
HFFFF1
H00EE0
(4,352 bytes)
H00EE0
HFFDE0
Note 3
CALLF entry
H00010
HFFF00
Internal ROM
area (2 Kbytes)
(60,928 bytes)
Program/data area
HFFDE0
Note 4
CALLT table
area (64 bytes)
Vector table area
H00800
HFF700
H08000
HF7000
H04000
HF3000
(64 bytes)
H00000
H00000
22
Data Sheet U12376EJ1V0DS00
2. This 4,608-byte area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. On execution of LOCATION 0H instruction: 126,464 bytes, on execution of LOCATION 0FH instruction: 131,072 bytes
4. Base area and entry area for reset or interrupt. However, the internal RAM area is not used as a reset entry area.
Notes 1. Accessed in external memory expansion mode.
µ
(
PD784224, 784225, 784224Y, 784225Y
6.2 CPU Registers
6.2.1 General-purpose registers
Sixteen 8-bit general-purpose registers are available. Two 8-bit registers can be also used in pairs as a 16-bit
register. Of the 16-bit registers, four can be used in combination with an 8-bit register for address expansion as
24-bit address specification registers.
Eight banks of these registers are available which can be selected by using software or the context switching
function.
The general-purpose registers except V, U, T, and W registers for address expansion are mapped to the internal
RAM.
Figure 6-3. General-Purpose Register Format
V
VVP (RG4)
U
UUP (RG5)
T
TDE (RG6)
W
WHL (RG7)
Parentheses
A (R1)
AX (RP0)
B (R3)
BC (RP1)
R5
R7
R9
VP (RP4)
R11
UP (RP5)
D (R13)
DE (RP6)
H (R15)
HL (RP7)
) indicate an absolute name.
X (R0)
C (R2)
R4
RP2
R6
RP3
R8
R10
E (R12)
L (R14)
8 banks
CautionRegisters R4, R5, R6, R7, RP2, and RP3 can be used as X, A, C, B, AX, and BC registers,
respectively, by setting the RSS bit of the PSW to 1. However, use this function only for recycling
the program of the 78K/III Series.
Data Sheet U12376EJ1V0DS00
23
µ
PD784224, 784225, 784224Y, 784225Y
6.2.2 Control registers
(1) Program counter (PC)
The program counter is a 20-bit register whose contents are automatically updated when the program is
executed.
Figure 6-4. Program Counter (PC) Format
190
PC
(2) Program status word (PSW)
This register holds the statuses of the CPU. Its contents are automatically updated when the program is
executed.
Figure 6-5. Program Status Word (PSW) Format
15141312111098
UFRBS2RBS1RBS0––––PSWH
PSW
76543210
SZRSS
Note
ACIEP/V0CYPSWL
Note This flag is provided to maintain compatibility with the 78K/III Series. Be sure to clear this flag to 0, except
when the software for the 78K/III Series is used.
(3) Stack pointer (SP)
This is a 24-bit pointer that holds the first address of the stack. Be sure to write 0 to the higher 4 bits of this
pointer.
Figure 6-6. Stack Pointer (SP) Format
230
PC
20
0000
24
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
6.2.3 Special function registers (SFRs)
The special function registers, such as the mode registers and control registers of the internal peripheral
hardware, are registers to which special functions are allocated. These registers are mapped to a 256-byte space
Note
of addresses 0FF00H to 0FFFFH
Note On execution of the LOCATION 0H instruction. FFF00H to FFFFFH on execution of the LOCATION 0FH
instruction.
CautionDo not access an address in this area to which no SFR is allocated. If such an address is accessed
µ
by mistake, the
only by inputting the RESET signal.
Table 6-1 lists the special function registers (SFRs). The meanings of the symbols in this table are as follows:
• Symbol ............................... Symbol indicating an SFR. This symbol is reserved for NEC’s assembler
PD784225 may be in the deadlock status. This deadlock status can be cleared
.
(RA78K4). It can be used an sfr variable by the #pragma sfr directive with the
C compiler (CC78K4).
• R/ W .................................... Indicates whether the SFR is read-only, write-only, or read/write.
R/W : Read/write
R: Read-only
W: Write-only
• Bit units for manipulation.. Bit units in which the value of the SFR can be manipulated.
SFRs that can be manipulated in 16-bit units can be described as the operand
sfrp of an instruction. To specify the address of this SFR, describe an even
address.
SFRs that can be manipulated in 1-bit units can be described as the operand of
a bit manipulation instruction.
• At reset .............................. Indicates the status of the register when the RESET signal has been input.
Data Sheet U12376EJ1V0DS00
25
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (1/4)
Special Function Register (SFR) NameSymbolR/WBit Units for ManipulationAt Reset
1 Bit8 Bits 16 Bits
TM1TM1W
TM2
CR10 CR1W
CR20
TMC1
TMC2
PRM1
PRM2
CR50 CR5W
CR60
TMC5
TMC6
PRM5
PRM6
Asynchronous serial interface mode register 1
Asynchronous serial interface mode register 2
Asynchronous serial interface status register 1
Asynchronous serial interface status register 2
Receive buffer register 1RXB1R——
Receive buffer register 2RXB2R——
ASIM1—00H
ASIM2—
ASIS1R—
ASIS2—
R—0000H
—
R/W—
—
TMC1W
PRM1W
TM5W
R—
R/W—
—
TMC5W
PRM5W
Note When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
Data Sheet U12376EJ1V0DS00
27
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (3/4)
Address
Note 1
0FF88HROM correction control registerCORCR/W—00H
0FF89HROM correction address pointer HCORAH——
0FF8AHROM correction address pointer LCORAL——0000H
0FF8BH
0FF8DHExternal access status enable registerEXAE—00H
0FF90HSerial operation mode register 0CSIM0—
0FF91HSerial operation mode register 1CSIM1—
0FF92HSerial operation mode register 2CSIM2—
0FF94HSerial I/O shift register 0SIO0——
0FF95HSerial I/O shift register 1SIO1——
0FF96HSerial I/O shift register 2SIO2——
0FF98HReal-time output buffer register LRTBL——
0FF99HReal-time output buffer register HRTBH——
0FF9AHReal-time output port mode registerRTPM—
0FF9BHReal-time output port control registerRTPC—
0FF9CHWatch timer mode control registerWTM—
0FFA0H
0FFA2H
0FFA8HIn-service priority registerISPRR—
0FFA9HInterrupt select control registerSNMIR/W—
0FFAAHInterrupt mode control registerIMC—80H
0FFACHInterrupt mask flag register 0L
0FFADHInterrupt mask flag register 0H
0FFAEHInterrupt mask flag register 1L
0FFAFHInterrupt mask flag register 1H
0FFB0HI2C bus control register
0FFB2HPrescaler mode register for serial clockSPRM0—
0FFB4HSlave address registerSVA0—
0FFB6HI2C bus status register
0FFB8HSerial shift registerIIC0R/W—
0FFC0HStandby control registerSTBC——30H
0FFC2HWatchdog timer mode registerWDM——00H
0FFC4HMemory expansion mode registerMM—20H
0FFC7HProgrammable wait control register 1PWC1—AAH
0FFC8HProgrammable wait control register 2PWC2W——AAAAH
00FFCEHClock status registerPCSR—32H
0FFCFH
0FFD0H toExternal SFR area—— —
0FFDFH
Special Function Register (SFR) NameSymbolR/WBit Units for ManipulationAt Reset
Oscillation stabilization time specification register
EGP0—
EGN0—
MK0L MK0
MK0H
MK1L MK1
MK1H
IICCL0—00H
IICS0R—
OSTSR/W—00H
FFFFH
Notes 1. When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
µ
PD784225Y Subseries only
28
2.
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (4/4)
Note
Address
0FFE0HInterrupt control register (INTWDTM)WDTICR/W—43H
0FFE1HInterrupt control register (INTP0)PIC0—
0FFE2HInterrupt control register (INTP1)PIC1—
0FFE3HInterrupt control register (INTP2)PIC2—
0FFE4HInterrupt control register (INTP3)PIC3—
0FFE5HInterrupt control register (INTP4)PIC4—
0FFE6HInterrupt control register (INTP5)PIC5—
0FFE8HInterrupt control register (INTIIC0/INTCSI0)CSIIC0—
0FFE9HInterrupt control register (INTSER1)SERIC1—
0FFEAHInterrupt control register (INTSR1/INTCSI1)SRIC1—
0FFEBHInterrupt control register (INTST1)STIC1—
0FFECHInterrupt control register (INTSER2)SERIC2—
0FFEDHInterrupt control register (INTSR2/INTCSI2)SRIC2—
0FFEEHInterrupt control register (INTST2)STIC2—
0FFEFHInterrupt control register (INTTM3)TMIC3—
0FFF0HInterrupt control register (INTTM00)TMIC00—
0FFF1HInterrupt control register (INTTM01)TMIC01—
0FFF2HInterrupt control register (INTTM1)TMIC1—
0FFF3HInterrupt control register (INTTM2)TMIC2—
0FFF4HInterrupt control register (INTAD)ADIC—
0FFF5HInterrupt control register (INTTM5)TMIC5—
0FFF6HInterrupt control register (INTTM6)TMIC6—
0FFF9HInterrupt control register (INTWT)WTIC—
Special Function Register (SFR) NameSymbolR/WBit Units for ManipulationAt Reset
1 Bit8 Bits 16 Bits
Note When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
Data Sheet U12376EJ1V0DS00
29
µ
PD784224, 784225, 784224Y, 784225Y
7. PERIPHERAL HARDWARE FUNCTIONS
7.1 Ports
The ports shown in Figure 7-1 are provided to make various control operations possible. Table 7-1 shows the
function of each port. Ports 0, 2 to 7, and 12 can be connected to internal pull-up resistors by software when inputting.
Figure 7-1. Port Configuration
Port 5
Port 6
Port 7
Port 12
Port 13
P50
P57
P60
P67
P70
P72
P120
P127
P130
P131
P00
P05
P10 to P17
P20
P27
P30
P37
P40
P47
Port 0
Port 1
8
Port 2
Port 3
Port 4
30
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 7-1. Port Functions
Port NamePin NameFunctionSpecification of Pull-up Resistor
Connection by Software
Port 0P00 to P05• Can be set in input or output mode bit-wiseCan be specified bit-wise
Port 1P10 to P17• Input port—
Port 2P20 to P27• Can be set in input or output mode bit-wiseCan be specified bit-wise
Port 3P30 to P37• Can be set in input or output mode bit-wiseCan be specified bit-wise
Port 4P40 to P47• Can be set in input or output mode bit-wiseCan be specified in 1-port units
• Can directly drive LEDs
Port 5P50 to P57• Can be set in input or output mode bit-wiseCan be specified in 1-port units
• Can directly drive LEDs
Port 6P60 to P67• Can be set in input or output mode bit-wiseCan be specified in 1-port units
Port 7P70 to P72• Can be set in input or output mode bit-wiseCan be specified bit-wise
Port 12P120 to P127• Can be set in input or output mode bit-wiseCan be specified bit-wise
Port 13P130, P131• Can be set in input or output mode bit-wise—
7.2 Clock Generator
An on-chip clock generator necessary for operation is provided. This clock generator has a frequency divider.
If high-speed operation is not necessary, the internal operating frequency can be lowered by the frequency divider
to reduce the current consumption.
Figure 7-2. Block Diagram of Clock Generator
XT1
XT2
X1
X2
Subsystem
clock
f
XT
oscillator
Main system
clock
oscillator
IDLE
controller
STOP and bit 2 (MCK) of the
standby control register (STBC)
= 1 when the subsystem clock
is selected as CPU clock
f
X
Frequency
divider
f
2
X
f
Selector
XX
f
XX
2
Prescaler
f
XX
f
XX
2
2
2
Watch timer,
clock output
function
Prescaler
Clock to
peripheral
hardware
3
Selector
STOP,
IDLE
controller
HALT
controller
CPU
clock
(f
CPU
)
Data Sheet U12376EJ1V0DS00
Internal
system
clock
CLK
(f
31
)
µ
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-3. Example of Using Main System Clock Oscillator
(1) Crystal/ceramic oscillation(2) External clock
X2
X1
VSS1
Crystal resorator
or
ceramic resonator
X2
X1
VSS
External
clock
PD74HCU04
µ
Figure 7-4. Example of Using Subsystem Clock Oscillator
(1) Crystal oscillation(2) External clock
V
SS
XT2
32.768
kHz
V
SS1
XT1
External
clock
PD74HCU04
XT2
XT1
CautionWhen using the main system clock and subsystem clock oscillator, wire the dotted portions in
Figures 7-3 and 7-4 as follows to avoid adverse influence from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with other signal lines.
• Do not route the wiring in the vicinity of lines through which a high alternating current flows.
• Always keep the potential at the ground point of the capacitor in the oscillator the same as
SS1. Do not ground to a ground pattern through which a high current flows.
V
• Do not extract signals from the oscillator.
Note that the subsystem clock oscillator has a low amplification factor to reduce the current
consumption.
32
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
7.3 Real-Time Output Port
The real-time output function is to transfer data set in advance to the real-time output buffer register to the output
latch as soon as the timer interrupt or external interrupt has occurred in order to output the data to an external device.
The pins that output the data to the external device constitute a port called a real-time output port.
Because the real-time output port can output signals without jitter, it is ideal for controlling a stepping motor.
Figure 7-5. Block Diagram of Real-Time Output Port
Internal bus
Real-time output port
control register (RTPC)
RTPOEBYTEEXTR
INTP2TRG
INTTM1
INTTM2
Output trigger
controller
Port 12 output latch
P127······································ P120
Higher 4 bits of
real-time output
buffer register
(RTBH)
Real-time output port output latch
RTP7······································ RTP0
Lower 4 bits of
real-time output
buffer register
(RTBL)
Real-time output
port mode register
(RTPM)
RTPOE bit
P12n/RTPn pin output (n = 0 to 7)
P127/ P120/
······································
RTP7 RTP0
Data Sheet U12376EJ1V0DS00
33
µ
PD784224, 784225, 784224Y, 784225Y
7.4 Timer
One unit of 16-bit timers/event counters, two units of timers/event counters, and two 8-bit timers are provided.
Because a total of six interrupt requests are supported, these timers/counters and timer can be used as six units
of timers/counters.
Table 7-2. Operations of Timers
Name16-Bit8-Bit8-Bit8-Bit8-Bit
Timer/Event Timer/Event Timer/Event
ItemCounterCounter 1Counter 2
Count width8 bits—
16 bits
Operation modeInterval timer1ch1ch1ch1ch1ch
External event counter ——
FunctionTimer output1ch1ch1ch——
PPG output————
PWM output——
Square wave output——
One-shot pulse output————
Pulse width measurement2 inputs————
Number of interrupt requests21111
Timer 5Timer 6
34
Data Sheet U12376EJ1V0DS00
16-bit timer/event counter
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-6. Block Diagram of Timers (1/2)
fXX/4
f
XX
/16
INTTM3
TI01
TI00
Edge detector
Edge detector
8-bit timer/event counter 1
2
fXX/2
3
fXX/2
4
fXX/2
5
fXX/2
7
fXX/2
9
fXX/2
TI1
Edge detector
SelectorSelector
Selector
Clear
16-bit timer counter (TM0)
16
16-bit capture/compare register 00
(CR00)
16
16-bit capture/compare register 01
(CR01)
Clear
8-bit timer counter 1
(TM1)
8
8-bit compare register 10
(CR10)
INTTM2
OVF
INTTM00
INTTM01
Selector
Output controller
Output
controller
INTTM1
TO0
TO1
8-bit timer/event counter 2
TM1
2
fXX/2
3
fXX/2
4
fXX/2
5
fXX/2
7
fXX/2
9
fXX/2
TI2
Edge detector
Remark OVF: Overflow flag
Selector
Clear
8-bit timer counter 2
(TM2)
8
8-bit compare register 20
(CR20)
Data Sheet U12376EJ1V0DS00
OVF
Output
controller
INTTM2
TO2
35
8-bit timer 5
8-bit timer 6
fXX/2
fXX/2
fXX/2
fXX/2
fXX/2
fXX/2
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-6. Block Diagram of Timers (2/2)
2
(TM5)
8
(CR50)
Clear
INTTM5
Selector
INTTM6
3
4
5
7
9
Selector
8-bit timer counter 5
8-bit compare register 50
TM5
fXX/2
fXX/2
fXX/2
fXX/2
fXX/2
fXX/2
2
3
4
5
7
9
Selector
8-bit timer counter 6
8-bit compare register 60
(TM6)
8
(CR60)
Clear
INTTM6
36
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
7.5 A/D Converter
An A/D converter converts an analog input variable into a digital signal. This microcontroller is provided with
an A/D converter with a resolution of 8 bits and 8 channels (ANI0 to ANI7).
This A/D converter is of successive approximation type and the result of conversion is stored to an 8-bit A/D
conversion result register (ADCR).
The A/D converter can be started in the following two ways:
• Hardware start
Conversion is started by trigger input (P03).
• Software start
Conversion is started by setting the A/D converter mode register.
One analog input channel is selected from ANI0 to ANI7 for A/D conversion. When A/D conversion is started
by means of hardware start, conversion is stopped after it has been completed. When conversion is started by
means of software start, A/D conversion is repeatedly executed, and each time conversion has been completed,
an interrupt request (INTAD) is generated.
Figure 7-7. Block Diagram of A/D Converter
Series resistor string
ANI0
ANI1
ANI2
ANI3
ANI4
ANI5
ANI6
ANI7
INTP3/P03INTAD
Selector
Edge
detector
Edge
detector
Sample & hold circuit
Voltage comparator
Tap selector
Successive approximation
register (SAR)
Controller
A/D conversion result register
(ADCR)
Internal bus
AVDD
AV
SS
INTP3
Data Sheet U12376EJ1V0DS00
37
µ
PD784224, 784225, 784224Y, 784225Y
7.6 D/A Converter
A D/A converter converts an input digital signal into an analog voltage. This microcontroller is provided with a
voltage output type D/A converter with a resolution of 8 bits and two channels.
The conversion method is of R-2R resistor ladder type.
D/A conversion is started by setting DACE0 of the D/A converter mode register 0 (DAM0) and DACE1 of the D/
A converter mode register 1 (DAM1).
The D/A converter operates in the following two modes:
• Normal mode
The converter outputs an analog voltage immediately after it has completed D/A conversion.
• Real-time output mode
The converter outputs an analog voltage in synchronization with an output trigger after it has completed D/A
conversion.
Figure 7-8. Block Diagram of D/A Converter
DACS0
AV
REF1
8
Selector
2R
2R
2R
2R
ANO0
R
R
DACS1
8
Selector
2R
2R
2R
R
R
ANO1
38
AV
SS
Data Sheet U12376EJ1V0DS00
2R
µ
PD784224, 784225, 784224Y, 784225Y
7.7 Serial Interface
Three independent serial interface channels are provided.
• Asynchronous serial interface (UART)/3-wire serial I/O (IOE) × 2
• Clocked serial interface (CSI) × 1
• 3-wire serial I/O (IOE)
2
C bus interface (I2C) (µPD784225Y Subseries only)
•I
Therefore, communication with an external system and local communication within the system can be simultaneously
executed (see Figure 7-9).
Figure 7-9. Example of Serial Interface
2
C
V
DD0
V
DD0
PD780078Y (slave)
µ
SDA
SCL
PD780308Y (slave)
µ
µ
PD4711A
RS-232C
driver/receiver
PD784225Y (master)
µ
[UART]
RxD1
TxD1
Port
SDA0
SCL0
(a) UART + I
2
[I
C]
µ
PD4711A
RS-232C
driver/receiver
µ
driver/receiver
Note Handshake line
[UART]
PD4711A
RS-232C
RxD2
TxD2
Port
[UART]
(b) UART + 3-wire serial I/O
PD784225Y (master)
µ
SO1
RxD2
TxD2
Port
SI1
SCK1
INTPm
Port
SDA
SCL
[3-wise serial I/O]
Note
µ
PD753106 (slave)
SI
SO
SCK
Port
INT
LCD
Data Sheet U12376EJ1V0DS00
39
µ
PD784224, 784225, 784224Y, 784225Y
7.7.1 Asynchronous serial interface/3-wire serial I/O (UART/IOE)
Two channels of serial interfaces that can select an asynchronous serial interface mode and 3-wire serial I/O
mode are provided.
(1) Asynchronous serial interface mode
In this mode, data of 1 byte following the start bit is transferred or received.
Because an on-chip baud rate generator is provided, a wide range of baud rates can be set.
Moreover, the clock input to the ASCK pin can be divided to define a baud rate.
When the baud rate generator is used, a baud rate conforming to the MIDI standard (31.25 kbps) can be
also obtained.
Figure 7-10. Block Diagram in Asynchronous Serial Interface Mode
Internal bus
8
Receive buffer register
1, 2 (RXB1, RXB2)
8
RxD1, RxD2
TxD1, TxD2
ASCK1, ASCK2
Baud rate generator
8
Receive shift register
1, 2 (RX1, RX2)
Receive control
parity check
Transmit/receive clock generation
Transmit shift register
1, 2 (TXS1, TXS2)
INTSR1,
INTSR2
5-bit counter × 2
Transmit control
parity addition
Selector
INTST1,
INTST2
fXX to fXX/2
5
40
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(2) 3-wire serial I/O mode
In this mode, the master device starts transfer by making the serial clock active and transfers 1-byte data
in synchronization with this clock.
This mode is used to communicate with a device having the conventional clocked serial interface. Basically,
communication is established by using three lines: serial clocks (SCK1 and SCK2), serial data inputs (SI1
and SI2), and serial data outputs (SO1 and SO2). To connect two or more devices, a handshake line is
necessary.
Figure 7-11. Block Diagram in 3-wire Serial I/O Mode
Internal bus
8
Direction controller
8
SI1, SI2
SO1, SO2
Serial I/O shift register
1, 2 (SIO1, SIO2)
SCK1, SCK2
Serial clock
counter
Serial clock
controller
Interrupt
generator
Selector
INTCSI1,
INTCSI2
TO2
XX
/8
f
fXX/16
Data Sheet U12376EJ1V0DS00
41
µ
PD784224, 784225, 784224Y, 784225Y
7.7.2 Clocked serial interface (CSI)
In this mode, the master device starts transfer by making the serial clock active and communicates 1-byte data
in synchronization with this clock.
(1) 3-wire serial I/O mode
This mode is to communicate with devices having the conventional clocked serial interface.
Basically, communication is established in this mode with three lines: one serial clock (SCK0) and two serial
data (SI0 and SO0) lines.
Generally, a handshake line is necessary to check the reception status.
Figure 7-12. Block Diagram in 3-Wise Serial I/O Mode
This mode is to communicate with devices conforming to the I2C bus format.
This mode is to transfer 8-bit data with two or more devices by using two lines: serial clock (SCL0) and serial
data bus (SDA0).
During transfer, a “start condition”, “data”, and “stop condition” can be output onto the serial data bus. During
reception, these data can be automatically detected by hardware.
42
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-13. Block Diagram in I2C Bus Mode
Internal bus
8
Direction controller
Slave address register
8
(SVA0)
8
SDA0
Serial I/O shift
register 0 (SIO0)
Start condition/
acknowledge
detector
Output latch
Stop condition
detector
SCL0
Serial clock
counter
Serial clock
controller
7.8 Clock Output Function
Clocks of the following frequencies can be output.
Figure 7-15. Block Diagram of Buzzer Output Function
10
fXX/2
11
fXX/2
fXX/2
fXX/2
12
13
Selector
Output controller
BUZ
7.10 Edge Detection Function
The interrupt input pins (INTP0, INTP1, NMI/INTP2, INTP3 to INTP5) are used not only to input interrupt requests
but also to input trigger signals to the internal hardware units. Because these pins operate at an edge of the input
signal, they have a function to detect an edge. Moreover, a noise reduction circuit is also provided to prevent
erroneous detection due to noise.
Pin NameDetectable EdgeNoise Reduction
NMIEither or both of rising and falling edgesBy analog delay
INTP0 to INTP5—
7.11 Watch Timer
The watch timer has the following functions:
• Watch timer
• Interval timer
The watch timer and interval timer functions can be used at the same time.
(1) Watch timer
The watch timer sets the WTIF flag of the interrupt control register (WTIC) at time intervals of 0.5 seconds
by using the 32.768-kHz subsystem clock.
(2) Interval timer
The interval timer generates an interrupt request (INTTM3) at predetermined time intervals.
44
Data Sheet U12376EJ1V0DS00
µ
fXX/2
7
Prescaler
f
XT
f
W
2
4
f
W
2
5
f
W
2
6
f
W
2
7
f
W
2
8
f
W
f
W
2
9
5-bit counter
f
W
2
5
f
W
2
14
INTWT
INTTM3
To 16-bit timer/counter
Selector
Selector
Selector
Selector
PD784224, 784225, 784224Y, 784225Y
Figure 7-16. Block Diagram of Watch Timer
7.12 Watchdog Timer
A watchdog timer is provided to detect a hang up of the CPU. This watchdog timer generates a non-maskable
or maskable interrupt unless it is cleared by software within a specified interval time. Once enabled to operate, the
watchdog timer cannot be stopped by software. Whether the interrupt by the watchdog timer or the interrupt input
from the NMI pin takes precedence can be specified.
Figure 7-17. Block Diagram of Watchdog Timer
Timer
RUN
HALT
IDLE
STOP
f
CLK
Note
Note Write 1 to bit 7 (RUN) of the watchdog timer (WDM).
Remark f
CLK: Internal system clock (fXX to fXX/8)
21
f
CLK
/2
20
f
CLK
/2
19
f
CLK
/2
INTWDT
Selector
17
f
CLK
/2
Data Sheet U12376EJ1V0DS00
45
µ
PD784224, 784225, 784224Y, 784225Y
8. INTERRUPT FUNCTION
As the servicing in response to an interrupt request, the three types shown in Table 8-1 can be selected by
program.
Table 8-1. Servicing of Interrupt Request
Servicing ModeEntity of ServicingServicingContents of PC and PSW
Vectored interruptSoftwareBranches and executes servicing routineSaves to and restores
(servicing is arbitrary).from stack.
Context switchingAutomatically switches register bank,Saves to or restores from
branches and executes servicing routinefixed area in register bank
(servicing is arbitrary).
Macro serviceFirmwareExecutes data transfer between memoryRetained
and I/O (servicing is fixed)
8.1 Interrupt Sources
Table 8-2 shows the interrupt sources available. As shown, interrupts are generated by 25 types of sources,
execution of the BRK instruction, BRKCS instruction, or an operand error.
The priority of interrupt servicing can be set to four levels, so that nesting can be controlled during interrupt
servicing and that which of the two or more interrupts that simultaneously occur should be serviced first. When the
macro service function is used, however, nesting always proceeds.
The default priority is the priority (fixed) of the service that is performed if two or more interrupt requests, having
the same request, simultaneously generate (see Table 8-2).
8INTSER1Occurrence of UART reception error in ASI1
9INTSR1End of UART reception by ASI1
10INTST1End of UART transfer by ASI1
11INTSER2Occurrence of UART reception error in ASI2
12INTSR2End of UART reception by ASI2
13INTST2End of UART transfer by ASI2
14INTTM3
15INTTM00Signal indicating coincidence between 16-bit
16INTTM01Signal indicating coincidence between 16-bit
17INTTM1Occurrence of coincidence signal of 8-bit
18INTTM2Occurrence of coincidence signal of 8-bit
19INTADEnd of conversion by A/D converter
20INTTM5Occurrence of coincidence signal of 8-bit
21INTTM6Occurrence of coincidence signal of 8-bit
22
(lowest)
NameTrigger
BRKCS instructionInstruction execution
Operand errorIf result of exclusive OR between operands
INTWDTOverflow of watchdog timerInternal
Note
INTCSI0End of 3-wire transfer by CSI0
INTCSI1End of 3-wire transfer by CSI1
INTCSI2End of 3-wire transfer by CSI2
INTWTOverflow of watch timer
Source
byte and byte is not FFH when MOV STBC,
#byte instruction or MOV WDM, #byte
instruction, LOCATION instruction is executed
End of I2C bus transfer by CSI0Internal
Reference time interval signal from watch timer
timer counter and capture/compare register
(CR00)
timer counter and capture/compare register
(CR01)
timer/counter 1
timer/counter 2
timer/counter 5
timer/counter 6
Internal/Macro
ExternalService
NoteµPD784255Y Subseries only
Remarks 1. ASI : Asynchronous Serial Interface
CSI: Clocked Serial Interface
2. There are two interrupt sources for the watchdog timer: non-maskable interrupts (INTWDT) and
maskable interrupts (INTWDTM). Either one (but not both) should be selected for actual use.
Data Sheet U12376EJ1V0DS00
47
µ
PD784224, 784225, 784224Y, 784225Y
8.2 Vectored Interrupt
Execution branches to a servicing routing by using the memory contents of a vector table address corresponding
to the interrupt source as the address of the branch destination.
So that the CPU performs interrupt servicing, the following operations are performed:
• On branching: Saves the status of the CPU (contents of PC and PSW) to stack
• On returning : Restores the status of the CPU (contents of PC and PSW) from stack
To return to the main routine from an interrupt service routine, the RETI instruction is used.
The branch destination address is in a range of 0 to FFFFH.
When an interrupt request is generated or when the BRKCS instruction is executed, a predetermined register
bank is selected by hardware. Context switching is a function that branches execution to a vector address stored
in advance in the register bank, and to stack the current contents of the program counter (PC) and program status
word (PSW) to the register bank.
The branch address is in a range of 0 to FFFFH.
Figure 8-1. Context Switching Operation When Interrupt Request Is Generated
0000B
<7> Transfer
PC19 to PC16
<2> Save
(bits 8 through 11
of temporary register)
<1> Save
PC15 to PC0
Temporary register
PSW
<6> Exchange
<5> Save
Register bank n (n = 0 to 7)
A
B
R5
R7
V
U
T
W
VP
UP
D
H
X
C
R4
R6
E
L
<3> Switching of register bank
(RBS0 to RBS2 ← n)
<4> RSS ← 0
IE ← 0
Register bank n
(0 to 7)
8.4 Macro Service
This function is to transfer data between memory and a special function register (SFR) without intervention by
the CPU. A macro service controller accesses the memory and SFR in the same transfer cycle and directly transfers
data without loading it.
Because this function does not save or restore the status of the CPU, or load data, data can be transferred at
high speeds.
CPU
Internal bus
Figure 8-2. Macro Service
Read
MemorySFR
Write
Data Sheet U12376EJ1V0DS00
Macro service
controller
Write
Read
49
8.5 Application Example of Macro Service
(1) Transmission of serial interface
Transfer data storage buffer (memory)
µ
PD784224, 784225, 784224Y, 784225Y
Data n
Data n − 1
Data 2
Data 1
Internal bus
TxD1, TxD2
Transmit shift register
Transfer control
TXS1, TXS2 (SFR)
INTST1, INTST2
Each time macro service request INTST1 and INTST2 are generated, the next transmit data is transferred
from memory to TXS1 and TXS2. When data n (last byte) has been transferred to TXS1 and TXS2 (when
the transmit data storage buffer has become empty), vectored interrupt request INTST1 and INTST2 are
generated.
(2) Reception of serial interface
Receive data storage buffer (memory)
Data n
Data n − 1
Data 2
Data 1
Internal bus
RXB1, RXB2 (SFR)
INTSR1, INTSR2
RxD1, RxD2
Receive buffer register
Receive shift register
Reception control
Each time macro service request INTSR1 and INTSR2 are generated, the receive data is transferred from
RXB1 and RXB2 to memory. When data n (last byte) has been transferred to memory (when the receive
data storage buffer has become full), vectored interrupt request INTSR1 and INTSR2 are generated.
50
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
9. LOCAL BUS INTERFACE
The local bus interface can connect an external memory or I/O (memory mapped I/O) and support a memory
space of 1 Mbyte (refer to Figure 9-1).
Figure 9-1. Example of Local Bus Interface (Multiplexed bus)
V
µ
PD784225
A8 to A19
RD
WR
DD1
Address latch
Address bus
SRAM
CS
OE
WE
I/O1 to I/O8
A0 to A19
Data bus
ASTB
AD0 to AD7
LE
Q0 to Q7
D0 to D7
OE
9.1 Memory Expansion
External program and data memory can be connected in two stages: 256 Kbytes and 1 Mbytes.
To connect the external memory, ports 4 to 6 are used.
The external memory is connected by using a time-division address/data bus. The number of ports used when
the external memory is connected can be reduced in this mode.
9.2 Programmable Wait
Wait state(s) can be inserted to the memory space (00000H to FFFFFH) while the RD and WR signals are active.
In addition, there is an address wait function that extends the active period of the ASTB signal to gain the address
decode time.
9.3 External Access Status Function
An active low external access status signal is output from the P37/EXA pin. This signal notifies other devices
connected to the external bus of the external access status, to disable data output to the external bus from other
devices, or enables reception.
The external access status signal is output during external access.
Data Sheet U12376EJ1V0DS00
51
µ
PD784224, 784225, 784224Y, 784225Y
10. STANDBY FUNCTION
This function is to reduce the power consumption of the chip, and can be used in the following modes:
• HALT mode: Stops supply of the operating clock to the CPU. This mode is used in combination
with the normal operation mode for intermittent operation to reduce the average
power consumption.
• IDLE mode: Stops the entire system with the oscillator continuing operation. The power
consumption in this mode is close to that in the STOP mode. However, the time
required to restore the normal program operation from this mode is almost the
same as that from the HALT mode.
• STOP mode: Stops the main system clock and thereby to stop all the internal operations of the
chip. Consequently, the power consumption is minimized with only leakage
current flowing.
• Power-saving mode: The main system clock is stopped with the subsystem clock used as the system
clock. The CPU can operate on the subsystem clock to reduce the current
consumption.
• Power-saving HALT mode: This is a standby function in the power-saving mode and stops the operation clock
of the CPU, to reduce the power consumption of the entire system.
• Power-saving IDLE mode : This is a standby function in the power-saving mode and stops the entire system
except the oscillator, to reduce the power consumption of the entire system.
These modes are programmable.
The macro service can be started from the HALT mode and power-saving HALT mode.
After executing macro service processing, it returns to the HALT mode.
52
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Figure 10-1. Transition of Standby Status
Macro
End of one processing
Macro service request
Power-
saving HALT
mode
(standby)
Power-saving HALT mode is set.
service
Interrupt request
Macro service request
End of one processing
End of macro service
saving mode
(operation on
Note 1
Power-
subsystem
clock)
Power-saving IDLE mode is set.
NMI, INTP0 to INTP6 input,
Note 2
INTWT
saving IDLE
(standby)
Power-
mode
STOP
(standby)
Interrupt
request of
masked interrupt
Sets STOP mode
Interrupt
request of
masked
interrupt
NMI, INTP0 to INTP6 input,
INTWT, key return interrupt
IDLE
(standby)
RESET input
RESET input
Power-saving HALT mode is set.
Normal operation is restored.
Normal
operation
(operation on
main system
clock)
Sets HALT mode
RESET input
Sets IDLE mode
NMI, INTP0 to INTP6 input, INTWT,
key return interrupt
Interrupt
request of
masked
interrupt
RESET input
Note 2
Interrupt
request of
masked
interrupt
End of oscillation stabilization time
RESET input
RESET input
Macro service request
End of one processing
End of macro service
Interrupt request
HALT
(standby)
Macro
service
Macro service request
End of one processing
Interrupt
request of
masked interrupt
Note 2
Waits for
oscillation
stabilization
Notes 1. Only unmasked interrupt requests
2. Only unmasked INTP0 to INTP6, INTWT, key return interrupt (P80 to P87)
Remark NMI is valid only for an external input. The watchdog timer cannot be used for the release of standby
(HALT mode/STOP mode/IDLE mode).
Data Sheet U12376EJ1V0DS00
53
µ
PD784224, 784225, 784224Y, 784225Y
11. RESET FUNCTION
When a low-level signal is input to the RESET pin, the system is reset, and each hardware unit is initialized (reset).
During the reset period, oscillation of the main system clock is unconditionally stopped. Consequently, the current
consumption of the entire system can be reduced.
When the RESET signal goes high, the reset status is cleared, oscillation stabilization time (41.9 ms at 12.5 MHz)
elapses, the contents of the reset vector table are set to the program counter (PC), execution branches to an address
set to the PC, and program execution is started from that branch address. Therefore, the program can be reset
and started from any address.
Figure 11-1. Oscillation of Main System Clock during Reset Period
Main system clock
oscillator
Oscillation is unconditionally
stopped during rest period
f
CLK
RESET input
Oscillation stabilization time
The RESET input pin has an analog delay noise eliminator to prevent malfunctioning due to noise.
Figure 11-2. Accepting Reset Signal
Time until the clock starts oscillation
Oscillation
stabilization
time
RESET input
Internal reset signal
Analog delayAnalog delay
Analog
delay
54
Internal clock
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
12. ROM CORRECTION
ROM correction is a function to replace part of the program in the internal ROM with a program in the internal
RAM.
By using the ROM correction function, instruction bugs found in the internal ROM can be avoided or the flow of
the program can be changed.
ROM correction can be used at up to four places in the internal ROM (program).
Figure 12-1. Block Diagram of ROM Correction
Program counter (PC)
Comparator
Correction address pointer n
Correction address registers
(CORAH, CORAL)
Remark n = 0 to 3, m = 0 or 1
Coincidence
Internal bus
Correction branch processing
request signal
(CALLT instruction)
CORENn CORCHm
ROM correction control register (CORC)
Data Sheet U12376EJ1V0DS00
55
µ
PD784224, 784225, 784224Y, 784225Y
13. INSTRUCTION SET
(1) 8-bit instructions (The instructions in parentheses are combinations realized by describing A as r)
Note The operands of BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT,
BNH, and BH are the same as BC.
(6) Other instructions
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT, EI, DI, SWRS
60
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
14. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°C)
ParameterSymbolConditionsRatingsUnit
Supply voltageVDD0−0.3 to +6.5V
AVDD−0.3 to VDD0 + 0.3V
AVSS−0.3 to VSS0 + 0.3V
AVREF1D/A converter reference voltage input−0.3 to VDD0 + 0.3V
Input voltageVI−0.3 to VDD0 + 0.3V
Analog input voltageVANAnalog input pinAVSS− 0.3 to AVREF1 + 0.3V
Output voltageVO−0.3 to VDD + 0.3V
Output current, lowIOLPer pin15mA
Total of all pins100mA
Output current, highIOHPer pin−10mA
Total of all pins−40mA
Operating ambientTA−40 to +85°C
temperature
Storage temperatureTstg−65 to +150°C
CautionAbsolute maximum ratings are rated values beyond which physical damage will be caused to the
product; if the rated value of any of the parameters in the above table is exceeded, even
momentarily, the quality of the product may deteriorate. Always use the product within its rated
values.
Data Sheet U12376EJ1V0DS00
61
Operating Conditions
µ
PD784224, 784225, 784224Y, 784225Y
• Operating ambient temperature (T
A): −40°C to +85°C
• Power supply voltage and clock cycle time: see Figure 14-1
• Operating voltage when the subsystem clock is operating: VDD = 1.8 to 5.5 V
Figure 14-1. Power Supply Voltage and Clock Cycle Time (CPU Clock Frequency: f
X1 input rising/falling4.5 V ≤ VDD≤ 5.5 V05ns
time (tXR, tXF)
2.7 V ≤ VDD < 4.5 V26.25
2.0 V ≤ VDD < 2.7 V23.125
1.8 V ≤ VDD < 2.0 V22
2.7 V ≤ VDD < 4.5 V26.25
2.0 V ≤ VDD < 2.7 V23.125
1.8 V ≤ VDD < 2.0 V22
2.7 V ≤ VDD < 4.5 V010
2.0 V ≤ VDD < 2.7 V020
1.8 V ≤ VDD < 2.0 V030
Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the
broken lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
SS.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
2. When the main system clock is stopped and the device is operating on the subsystem clock,
wait until the oscillation stabilization time has been secured by the program before switching
back to the main system clock.
Remark For the resonator selection and oscillator constant, customers are required to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
Note Time required to stabilize oscillation after applying supply voltage (VDD).
Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
SS.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
2. When the main system clock is stopped and the device is operating on the subsystem clock,
wait until the oscillation stabilization time has been secured by the program before switching
back to the main system clock.
Remark For the resonator selection and oscillator constant, customers are required to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
ParameterSymbolConditionsMIN.TYP. MAX. Unit
Resolution888bit
Overall error
Conversion timetCONV14144
Sampling timetSAMP24/fXX
Analog input voltageVIANAVSSAVDDV
Reference voltageAVDDVDDVDDVDDV
Resistance betweenRAVREF0A/D conversion is not performed40kΩ
2.0 V ≤ VDD≤ 5.5 V±0.6 %FSR
R = 10 MΩ, 2.0 V ≤ AVREF1≤ 5.5 V
1.8 V ≤ VDD≤ 2.0 V±1.2 %FSR
R = 10 MΩ, 1.8 V ≤ AVREF1≤ 5.5 V
µ
s
C = 30 pF
2.7 V ≤ AVREF1 < 4.5 V15
1.8 V ≤ AVREF1 < 2.7 V20
µ
s
µ
s
Note Excludes quantization error (±0.2%FSR).
Remark FSR: Full-scale range
Data Sheet U12376EJ1V0DS00
75
µ
PD784224, 784225, 784224Y, 784225Y
Data Retention Characteristics
(TA = −40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
ParameterSymbolConditionsMIN.TYP. MAX. Unit
Data retention voltageVDDDRSTOP mode1.85.5V
Data retention currentIDDDRVDDDR = 5.0 V ±10%1050
VDDDR = 2.0 V ±10%210
VDD rise timetRVD200
VDD fall timetFVD200
VDD hold time (fromtHVD0ms
STOP mode setting)
STOP release signaltDREL0ms
input time
Oscillation stabilizationtWAITCrystal resonator30ms
wait time
Low-level input voltageVILRESET, P00/INTP0 to P06/INTP60
High-level input voltageVIH
Ceramic resonator5ms
0.1VDDDR
0.9VDDDR
VDDDRV
µ
A
µ
A
µ
s
µ
s
V
AC Timing Measurement Points
DD
− 1 V
V
0.45 V
0.8VDD or 1.8 V
0.8 V
Points of
measurement
0.8VDD or 1.8 V
0.8 V
76
Data Sheet U12376EJ1V0DS00
Timing Waveform
(1) Read operation
(CLK)
t
CYK
µ
PD784224, 784225, 784224Y, 784225Y
A0 to A7
(Output)
A8 to A19
(Output)
AD0 to AD7
(Input/output)
ASTB
(Output)
RD
(Output)
WAIT
(Input)
Lower addressLower address
Higher address
t
DAID
t
DSTID
Hi-ZHi-ZHi-Z
Lower address
(Output)
t
SAST
t
WSTH
t
DAWT
t
DAR
t
HSTLA
t
DSTR
t
DRWTL
t
t
t
DSTWT
DSTWTH
HSTWT
Data (Input)
t
HRID
t
FAR
t
DRID
t
WRL
t
DRWTH
t
HRWT
t
DWTID
t
DWTR
t
t
HRA
t
DRA
DRST
Higher address
Lower address
(Output)
Data Sheet U12376EJ1V0DS00
77
(2) Write operation
(CLK)
µ
PD784224, 784225, 784224Y, 784225Y
t
CYK
A0 to A7
(Output)
A8 to A19
(Output)
AD0 to AD7
(Output)
ASTB
(Output)
WR
(Output)
WAIT
(Input)
Lower addressLower address
Higher addressHigher address
t
DAID
t
DSTOD
Hi-ZHi-ZHi-Z
Lower address
(Output)
t
SAST
t
WSTH
t
DAWT
t
DAW
t
HSTLA
t
DSTW
t
DWWTL
t
t
t
DSTWT
DSTWTH
HSTWT
t
FAR
t
DWOD
t
DWWTH
t
HWWT
t
WWL
Data (Output)
t
HWOD
t
SODWR
t
DWTW
t
DWTID
t
t
HWA
t
DAW
DWST
Lower address
(Output)
78
Data Sheet U12376EJ1V0DS00
Serial Operation
(1) 3-wire serial I/O mode
SI/SO
(2) UART mode
ASCK
SCK
µ
PD784224, 784225, 784224Y, 784225Y
t
t
KSO1, 2
t
KSI1, 2
KCY1, 2
t
KL1, 2
t
SIK1, 2
t
KH1, 2
t
KCY3
t
KH3
t
KL3
(3) I2C bus mode (µPD784255Y Subseries only)
LOW
SCL0
SDA0
Stop
condition
t
BUF
t
HD : STA
Start
condition
t
t
HD : DAT
t
R
t
HIGH
t
SU : DAT
t
F
t
SU : STA
Restart
condition
t
HD : STA
t
SP
Stop
condition
t
SU : STO
Data Sheet U12376EJ1V0DS00
79
Clock Output Timing
CLKOUT
Interrupt Input Timing
NMI
µ
PD784224, 784225, 784224Y, 784225Y
t
CLH
t
CLR
t
CYCL
t
WNIH
t
CLL
t
CLF
t
WNIL
INTP0 to INTP6
Reset Input Timing
RESET
t
WRSH
t
WITH
t
WRSL
t
WITL
80
Data Sheet U12376EJ1V0DS00
Clock Timing
X1
XT1
µ
PD784224, 784225, 784224Y, 784225Y
t
WXH
t
XR
1/f
X
t
XTH
1/f
XT
t
WXL
t
XF
t
XTL
Data Retention Characteristics
STOP mode setting
V
DD
t
HVD
RESET
NMI
(Cleared by falling edge)
NMI
(Cleared by rising edge)
t
FVD
V
DDDR
t
RVD
t
DREL
t
WAIT
Data Sheet U12376EJ1V0DS00
81
15. PACKAGE DRAWINGS
80-PIN PLASTIC QFP (14x14)
µ
PD784224, 784225, 784224Y, 784225Y
A
B
4160
4061
detail of lead end
S
CD
R
Q
2180
201
F
G
H
M
I
P
SN
NOTE
Each lead centerline is located within 0.13 mm of
its true position (T.P.) at maximum material condition.
J
K
S
L
M
ITEM MILLIMETERS
A
17.20±0.20
B
14.00±0.20
C14.00±0.20
D
17.20±0.20
F0.825
G
0.825
H0.32±0.06
0.13
I
J
0.65 (T.P.)
K
1.60±0.20
L
0.80±0.20
M0.17
N0.10
P
Q
R3
S1.70 MAX.
+0.03
−0.07
1.40±0.10
0.125±0.075
+7
−3
P80GC-65-8BT-1
82
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
80-PIN PLASTIC TQFP (FINE PITCH) (12x12)
A
B
6041
61
40
detail of lead end
80
21
120
F
G
H
M
I
K
N
S
NOTE
Each lead centerline is located within 0.08 mm of
its true position (T.P.) at maximum material condition.
CD
P
T
S
R
L
U
Q
J
S
M
ITEM MILLIMETERS
A14.0±0.2
B12.0±0.2
C12.0±0.2
D
14.0±0.2
F1.25
G
1.25
H0.22±0.05
I0.08
J0.5 (T.P.)
K
1.0±0.2
L0.5
M
0.145±0.05
N0.08
P
1.0
Q0.1±0.05
R
S1.1±0.1
T0.25
U0.6±0.15
+4
3
−3
P80GK-50-9EU-1
Data Sheet U12376EJ1V0DS00
83
µ
PD784224, 784225, 784224Y, 784225Y
16. RECOMMENDED SOLDERING CONDITIONS
The µPD784225 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
µ
CautionSoldering conditions for the
×××-9EU are undetermined because these products are under development.
Table 16-1. Soldering Conditions for Surface Mount Type
CautionDo not use different soldering methods together (except for partial heating).
84
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for system development using the µPD784225. Also see (5).
(1) Language Processing Software
RA78K4Assembler package common to 78K/IV Series
CC78K4C compiler package common to 78K/IV Series
DF784225Device file common to µPD784225, 784225Y Subseries
CC78K4-LC compiler library source file common to 78K/IV Series
(2) Flash Memory Writing Tools
Flashpro IIDedicated flash programmer for microcontroller incorporating flash memory
(Part No.: FL-PR2),
Flashpro III
(Part No.: FL-PR3, PG-FP3)
FA-80GCAdapter for writing 80-pin plastic QFP (GC-8BT type) flash memory.
FA-80GKAdapter for writing 80-pin plastic LQFP (GK-BE9 type) flash memory.
(3) Debugging Tools
• When IE-78K4-NS in-circuit emulator is used
IE-78K4-NSIn-circuit emulator common to 78K/IV Series
IE-70000-MC-PS-BPower supply unit for IE-78K4-NS
IE-70000-98-IF-CInterface adapter used when PC-9800 series PC (except notebook type) is used as host
machine (C bus supported)
IE-70000-CD-IF-APC card and cable when notebook PC is used as host machine (PCMCIA socket supported)
IE-70000-PC-IF-CInterface adapter when using IBM PC/ATTM or compatible as host machine (ISA bus
supported)
IE-70000-PCI-IFInterface adapter when using PC that incorporates PCI bus as host machine
IE-784225-NS-EM1Emulation board to emulate µPD784225, 784225Y Subseries
NP-100GFEmulation probe for 100-pin plastic QFP (GF-3BA type)
NP-100GCEmulation probe for 100-pin plastic LQFP (GC-8EU type)
EV-9200GF-100Socket to be mounted on a target system board made for 100-pin plastic QFP (GF-3BA type)
TGC-100SDWConversion adapter to connect the NP-100GC and a target system board on which a 100-
pin plastic LQFP (GC-8EU type) can be mounted
ID78K4-NSIntegrated debugger for IE-78K4-NS
SM78K4System simulator common to 78K/IV Series
DF784225Device file common to µPD784225, 784225Y Subseries
Data Sheet U12376EJ1V0DS00
85
µ
PD784224, 784225, 784224Y, 784225Y
• When IE-784000-R in-circuit emulator is used
IE-784000-RIn-circuit emulator common to 78K/IV Series
IE-70000-98-IF-CInterface adapter used when PC-9800 series PC (except notebook type) is used as host
machine (C bus supported)
IE-70000-PC-IF-CInterface adapter when using IBM PC/AT or compatible as host machine (ISA bus
supported)
IE-70000-PCI-IFInterface adapter when using PC that incorporates PCI bus as host machine
IE-78000-R-SV3Interface adapter and cable used when EWS is used as host machine
IE-784225-NS-EM1Emulation board to emulate µPD784225, 784225Y Subseries
IE-784218-R-EM1
IE-784000-R-EMEmulation board common to 78K/IV Series
IE-78K4-R-EX3Emulation probe conversion board necessary when using IE-784225-NS-EM1 on IE-
784000-R. Not necessary when IE-784216-R-EM1 is used.
EP-78064GF-REmulation probe for 100-pin plastic QFP (GF-3BA type)
EP-78064GC-REmulation probe for 100-pin plastic LQFP (GC-8EU type)
EV-9200GF-100Socket to be mounted on a target system board made for 100-pin plastic QFP (GF-3BA type)
TGC-100SDWConversion adapter to connect the NP-100GC and a target system board on which a 100-
pin plastic LQFP (GC-8EU type) can be mounted
ID78K4Integrated debugger for IE-784000-R
SM78K4System simulator common to 78K/IV Series
DF784225Device file common to µPD784225, 784225Y Subseries
(4) Real-time OS
RX78K/IVReal-time OS for 78K/IV Series
MX78K4OS for 78K/IV Series
86
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(5) Cautions on Using Development Tools
• The ID78K4-NS, ID78K4, and SM78K4 are used in combination with the DF784225.
• The CC78K4 and RX78K/IV are used in combination with the RA78K4 and DF784218.
• The FL-PR2, FL-PR3, FA-100GF, FA-100GC, NP-100GF, and NP-100GC are products made by Naito
Densei Machida Mfg. Co., Ltd. (TEL: +81-44-822-3813).
• The TGC-100SDW is a product made by TOKYO ELETECH CORPORATION.
For further information, contact Daimaru Kogyo, Ltd.
Tokyo Electronic Division (TEL: +81-3-3820-7112)
Osaka Electronic Division (TEL: +81-6-6244-6672)
• For third-party development tools, see the 78K/IV Series Selection Guide (U13355E).
• The host machine and OS suitable for each software are as follows:
PD784225Y Subseries Special Function Register TablePlanned–
78K/IV Series User’s Manual - InstructionU10905JU10905E
78K/IV Series Instruction TableU10594J–
78K/IV Series Instruction SetU10595J–
78K/IV Series Application Note - Software BasicsU10095JU10095E
Documents related to development tools (User’s Manuals)
Document NameDocument No.
JapaneseEnglish
RA78K4 Assembler PackageOperationU11334JU11334E
LanguageU11162JU11162E
RA78K Series Structured Assembler PreprocessorU11743JU11743E
CC78K4 C CompilerOperationU11572JU11572E
LanguageU11571JU11571E
IE-78K4-NSU13356JU13356E
IE-784000-RU12903JU12903E
IE-784218-R-EM1U12155JU12155E
IE-784225-NS-EM1U13742JU13742E
EP-78064EEU-934EEU-1469
SM78K4 System Simulator - Windows BaseReferenceU10093JU10093E
SM78K Series System Simulator
ID78K4-NS Integrated Debugger - PC BaseReferenceU12796JU12796E
ID78K4 Integrated Debugger - Windows BaseReferenceU10440JU10440E
ID78K4 Integrated Debugger - HP-UX, SunOS,ReferenceU11960JU11960E
NEWS-OS Base
External component
user open interface
specification
U10092JU10092E
CautionThe contents of the above related documents are subject to change without notice. Be sure to
use the latest edition of a document for designing.
88
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Documents related to embedded software (User’s Manual)
Document NameDocument No.
JapaneseEnglish
78K/IV Series Real-Time OSBasicsU10603JU10603E
InstallationU10604JU10604E
DebuggerU10364J–
78K/IV Series OS MX78K4BasicsU11779J–
Other documents
Document NameDocument No.
JapaneseEnglish
SEMICONDUCTOR SELECTION GUIDE Products & Packages (CD-ROM)
Semiconductor Device Mounting Technology ManualC10535JC10535E
Quality Grades on NEC Semiconductor DeviceC11531JC11531E
NEC Semiconductor Device Reliability/Quality Control SystemC10983JC10983E
Guide to Prevent Damage for Semiconductor Devices by ElectrostaticC11892JC11892E
Discharge (ESD)
Semiconductor Device Quality Control/Reliability HandbookC12769JMEI-1202
Guide for Products Related to Micro-Computer: Other CompaniesU11416J–
X13769X
CautionThe contents of the above related documents are subject to change without notice. Be sure to
use the latest edition of a document for designing.
Data Sheet U12376EJ1V0DS00
89
µ
PD784224, 784225, 784224Y, 784225Y
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
DD
pin should be connected to V
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
or GND with a resistor, if it is considered to have a possibility of
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Caution This product contains an I2C bus interface circuit.
When using the I
guarantee the following only when the customer informs NEC of the use of the interface:
Purchase of NEC I
these components in an I
Specification as defined by Philips.
IEBus is a trademark of NEC Corporation.
Windows is a registered trademark or a trademark of Microsoft Corporation in the United States and/or other
countries.
PC/AT is a trademark of International Business Machines Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
NEWS and NEWS-OS are trademarks of Sony Corporation.
2
C bus interface, notify its use to NEC when ordering custom code. NEC can
2
C components conveys a license under the Philips I2C Patent Rights to use
2
C system, provided that the system conforms to the I2C Standard
90
Data Sheet U12376EJ1V0DS00
µ
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
PD784224, 784225, 784224Y, 784225Y
Data Sheet U12376EJ1V0DS00
91
µ
PD784224, 784225, 784224Y, 784225Y
The related documents indicated in this publication may include preliminary versions. However, preliminary
versions are not marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
92
M7D 98. 12
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