NEC PD784224, PD784225, PD784224Y, PD784225Y Technical data

DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD784224, 784225, 784224Y, 784225Y
16/8-BIT SINGLE-CHIP MICROCONTROLLERS
The µPD784224 and 784225 are products of the µPD784225 Subseries in the 78K/IV Series. Besides a high­speed and high performance CPU, these controllers have ROM, RAM, I/O ports, 8-bit resolution A/D and D/A converters, timers, serial interfaces, a real-time output port, interrupt functions, and various other peripheral hardware.
PD784224Y and 784225Y are based on the µPD784225 Subseries with the addition of a multimaster-
The supporting I2C bus interface.
Flash memory versions, the µPD78F4225 and 78F4225Y, which replace the internal ROM of the mask ROM version with flash memory, and various development tools are also available.
The functions are explained in detail in the following user’s manuals. Be sure to read this manual when designing your system.
PD784225, 784225Y Subseries User’s Manual - Hardware : U12697E
78K/IV Series User’s Manual - Instruction : U10905E

FEATURES

•I2C bus
• ROM correction
µ
• Inherits peripheral functions of Subseries
• Minimum instruction execution time 160 ns (main system clock f 61 µs (subsystem clock fXT = 32.768 kHz)
• I/O port: 67 pins
• Timer/counter: 16-bit timer/counter × 1 unit
8-bit timer/counter × 4 units
• Serial interface: 3 channels UART/IOE (3-wire serial I/O): 2 channels CSI (3-wire serial I/O, multi-master supporting I
Note
bus Note
): 1 channel
µ
PD784225Y Subseries only
XX = 12.5 MHz)
PD780058Y
• Standby function HALT/STOP/IDLE mode In power-saving mode: HALT/IDLE mode (with subsystem clock)
• Clock division function
• Watch timer: 1 channel
• Watchdog timer: 1 channel
• Clock output function
XX, fXX/2, fXX/2
f selectable
• Buzzer output function
10
XX/2
, fXX/211, fXX/212, fXX/213 selectable
f
2
• A/D converter: 8-bit resolution × 8 channels
C
• D/A converter: 8-bit resolution × 2 channels
• Supply voltage: V
2
, fXX/23, fXX/24, fXX/25, fXX/26, fXX/27, fXT
DD = 1.8 to 5.5 V

APPLICATION FIELD

Car audio, portable audio, telephones, etc.
Unless contextually excluded, references in this document to µPD784225 mean µPD784224, 784225, 784224Y,
and 784225Y.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Document No. U12376EJ1V0DS00 (1st edition) Date Published May 2000 J CP(K) Printed in Japan
The mark shows major revised points.
©
1997, 2000
µ
PD784224, 784225, 784224Y, 784225Y

ORDERING INFORMATION

Part Number Package Internal ROM (Bytes) Internal RAM (Bytes)
µ
PD784224GC-×××-8BT 80-pin plastic QFP (14 × 14 mm) 96 K 3,584
µ
PD784224GK-×××-9EU
µ
PD784225GC-×××-8BT 80-pin plastic QFP (14 × 14 mm) 128 K 4,352
µ
PD784225GK-×××-9EU 80-pin plastic TQFP (fine pitch) (14 × 20 mm) 128 K 4,352
µ
PD784224YGC-×××-8BT 80-pin plastic QFP (14 × 14 mm) 96 K 3,584
µ
PD784224YGK-×××-9EU 80-pin plastic TQFP (fine pitch) (14 × 20 mm) 96 K 3,584
µ
PD784225YGC-×××-8BT
µ
PD784225YGK-×××-9EU
Note Under development
Remark ××× indicates a ROM code suffix.
Note
80-pin plastic TQFP (fine pitch) (14 × 20 mm) 96 K 3,584
Note
80-pin plastic QFP (14 × 14 mm) 128 K 4,352
Note
80-pin plastic TQFP (fine pitch) (14 × 20 mm) 128 K 4,352
2
Data Sheet U12376EJ1V0DS00

78K/IV SERIES LINEUP

PD784026
PD784956A
PD784908
PD784915
PD784928
PD784928Y
PD784046
PD784054
PD784216A
PD784216AY
PD784038
PD784038Y
PD784225Y
PD784225
PD784218AY
PD784218A
Enhanced A/D converter, 16-bit timer, and power management
Enhanced internal memory capacity Pin-compatible with the PD784026
Supports I
2
C bus
Supports multi-master I
2
C bus
80-pin, ROM correction added
Supports multi-master I
2
C bus
Enhanced internal memory capacity, ROM correction added
100-pin, enhanced I/O and internal memory capacity
On-chip 10-bit A/D converter
For DC inverter control
On-chip IEBus
TM
controller
Software servo control On-chip analog circuit for VCRs Enhanced timer
Supports multi-master I
2
C bus
Enhanced functions of the PD784915
Standard models
ASSP models
Supports multi-master I2C bus
: In mass production
: Under development
µ
µ
PD784967
On-chip FIP controller/driver
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ µ
µ
µ
PD784938A
Enhanced functions of the PD784908, enhanced internal memory capacity, ROM correction added.
µ
µ
µ
PD784224, 784225, 784224Y, 784225Y
Data Sheet U12376EJ1V0DS00
3

FUNCTIONS

µ
PD784224, 784225, 784224Y, 784225Y
Part Number
Item
Number of basic instructions 113 (mnemonics)
General-purpose register 8 bits × 16 registers × 8 banks, or 16 bits × 8 registers × 8 banks (memory mapping) Minimum instruction execution • 160 ns/320 ns/640 ns/1,280 ns/2,560 ns (main system clock: fXX = 12.5 MHz)
time • 61 µs (subsystem clock: fXT = 32.768 kHz) Internal ROM 96 Kbytes 128 Kbytes
memory Memory space 1 MB with program and data spaces combined
I/O port Total 67
Pins with ancillary functions
Real-time output port 4 bits × 2, or 8 bits × 1 Timer Timer/event counter : Timer counter × 1 Pulse output
Serial interface • UART/IOE (3-wire serial I/O): 2 channels (
A/D converter 8-bit resolution × 8 channels D/A converter 8-bit resolution × 2 channels Clock output Selectable from fXX, fXX/2, fXX/22, fXX/23, fXX/24, fXX/25, fXX/26, fXX/27, fXT Buzzer output Selectable from fXX/210, fXX/211, fXX/212, fXX/2 Watch timer 1 channel Watchdog timer 1 channel Standby • HALT/STOP/IDLE mode
Interrupt Hardware 25 (internal: 18, external: 7)
Supply voltage VDD = 1.8 to 5.5 V Package • 80-pin plastic QFP(14 × 14 mm)
RAM 3,584 bytes 4,352 bytes
CMOS Input 8 CMOS I/O 59 Pins with pull-up 57
resistor LEDs direct 16
Note 1
drive output
(16-bit) Capture/compare register × 2 • PWM/PPG output
Timer/event counter 1 : Timer counter × 1 Pulse output (8-bit) Compare register × 1 • PWM output
Timer/event counter 2 : Timer counter × 1 Pulse output (8-bit) Compare register × 1 • PWM output
Timer 5 : Timer counter × 1 (8-bit) Compare register × 1
Timer 6 : Timer counter × 1 (8-bit) Compare register × 1
• CSI (3-wire serial I/O, I2C bus
• In power-saving mode (with subsystem clock): HALT/IDLE mode
Software BRK instruction, BRKCS instruction, operand error Non-maskable Internal: 1, external: 1 Maskable Internal: 17, external: 6
• 4 programmable priority levels
• 3 service modes: vectored interrupt/macro service/context switching
• 80-pin plastic TQFP (fine pitch) (12 × 12 mm)
µ
PD784224,
µ
PD784224Y
µ
PD784225,
µ
PD784225Y
• Square wave output
• One-shot pulse output
• Square wave output
• Square wave output
Note 2
on-chip baud rate generator
supporting multi master): 1 channel
13
)
Notes 1. The pins with ancillary functions are included in the I/O pins.
2.µPD784225Y Subseries only
4
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
CONTENTS
1. DIFFERENCES AMONG MODELS IN µPD784225, 784225Y SUBSERIES .............................. 7
2. MAJOR DIFFERENCES BETWEEN µPD784216Y SUBSERIES AND
µ
PD780058Y SUBSERIES............................................................................................................. 8
3. PIN CONFIGURATION (Top View)............................................................................................... 9
4. BLOCK DIAGRAM ........................................................................................................................ 11
5. PIN FUNCTION............................................................................................................................... 12
5.1 Port Pins ................................................................................................................................................ 12
5.2 Pins Other Than Port Pins .................................................................................................................. 14
5.3 I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins ........... 16
6. CPU ARCHITECTURE ................................................................................................................... 20
6.1 Memory Space ...................................................................................................................................... 2 0
6.2 CPU Registers ...................................................................................................................................... 23
6.2.1 General-purpose registers .......................................................................................................... 23
6.2.2 Control registers .......................................................................................................................... 24
6.2.3 Special function registers (SFRs) ............................................................................................... 25
7. PERIPHERAL HARDWARE FUNCTIONS .................................................................................... 30
7.1 Ports....................................................................................................................................................... 30
7.2 Clock Generator ................................................................................................................................... 31
7.3 Real-Time Output Port......................................................................................................................... 33
7.4 Timer ...................................................................................................................................................... 34
7.5 A/D Converter ....................................................................................................................................... 37
7.6 D/A Converter ....................................................................................................................................... 38
7.7 Serial Interface ..................................................................................................................................... 39
7.7.1 Asynchronous serial interface/3-wire serial I/O (UART/IOE) ...................................................... 40
7.7.2 Clocked serial interface (CSI) ..................................................................................................... 42
7.8 Clock Output Function ........................................................................................................................ 43
7.9 Buzzer Output Function ...................................................................................................................... 4 4
7.10 Edge Detection Function .................................................................................................................... 44
7.11 Watch Timer.......................................................................................................................................... 4 4
7.12 Watchdog Timer ................................................................................................................................... 45
8. INTERRUPT FUNCTION ................................................................................................................ 4 6
8.1 Interrupt Sources ................................................................................................................................. 46
8.2 Vectored Interrupt ................................................................................................................................48
8.3 Context Switching ................................................................................................................................49
8.4 Macro Service ....................................................................................................................................... 49
8.5 Application Example of Macro Service............................................................................................. 50
Data Sheet U12376EJ1V0DS00
5
µ
PD784224, 784225, 784224Y, 784225Y
9. LOCAL BUS INTERFACE ............................................................................................................. 51
9.1 Memory Expansion .............................................................................................................................. 51
9.2 Programmable Wait ............................................................................................................................. 51
9.3 External Access Status Function ...................................................................................................... 51
10. STANDBY FUNCTION ................................................................................................................... 52
11. RESET FUNCTION......................................................................................................................... 54
12. ROM CORRECTION...................................................................................................................... 55
13. INSTRUCTION SET........................................................................................................................ 56
14. ELECTRICAL SPECIFICATIONS................................................................................................. 61
15. PACKAGE DRAWINGS ................................................................................................................. 82
16. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 84
APPENDIX A. DEVELOPMENT TOOLS ............................................................................................ 85
APPENDIX B. RELATED DOCUMENTS ............................................................................................ 88
6
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
1. DIFFERENCES AMONG MODELS IN µPD784225, 784225Y SUBSERIES
The only difference among the µPD784224 and 784225 lies in the internal memory capacity. The µPD784224Y and 784225Y are based on the µPD784224 and 784225 respectively, with the addition of an
I2C bus control function.
PD78F4225 and 78F4225Y are provided with a 128-Kbyte flash memory instead of the mask ROM of the
The
above models. These differences are summarized in Table 1-1.
Table 1-1. Differences among Models in
PD784225, 784225Y Subseries
Part Number
Item Internal ROM 96 Kbytes 128 Kbytes 128 Kbytes
(mask ROM) (mask ROM) (Flash memory) Internal RAM 3,584 bytes 4,352 bytes Internal memory None Provided
size switching register (IMS)
Supply voltage VDD = 1.8 to 5.5 V VDD = 1.9 to 5.5 V Electrical Refer to the data sheet for each device.
specifications Recommended
soldering conditions
TEST pin Provided None VPP pin None Provided
Note
µ
PD784224,
µ
PD784224Y
µ
PD784225,
µ
PD784225Y
µ
PD78F4225,
µ
PD78F4225Y
Note The internal flash memory capacity and internal RAM capacity can be changed using the internal memory
size switching register (IMS).
Caution There are differences in noise immunity and noise radiation between the flash memory and mask
ROM versions. When pre-producing an application set with the flash memory version and then mass-producing it with the mask ROM version, be sure to conduct sufficient evaluations on the commercial samples (not engineering samples) of the mask ROM version.
Data Sheet U12376EJ1V0DS00
7
µ
PD784224, 784225, 784224Y, 784225Y
2. MAJOR DIFFERENCES BETWEEN µPD784216Y SUBSERIES AND µPD780058Y SUBSERIES
Series Name
Item Subseries CPU 16-bit CPU 8-bit CPU Minimum With main system 160 ns (at 12.5 MHz) 400 ns (at 5.0 MHz)
instruction clock selected execution time
Memory space 1 Mbytes 64 Kbytes I/O port Total 67 pins 86 pins 68 pins
Pins with Pins with pull-up 57 pins 70 pins 66 pins (flash memory ancillary resistor model: 62 pins)
function
Timer/counter • 16-bit timer/event counter • 16-bit timer/event counter • 16-bit timer/event counter
Serial interface • UART/IOE (3-wire serial I/O) × 2 channels
Interrupt NMI pin Provided None
Standby function • HALT/STOP/IDLE mode HALT/STOP mode
ROM correction Provided None Provided Package • 80-pin plastic QFP • 100-pin plastic QFP • 80-pin plastic QFP
With subsystem 61 µs (at 32.768 kHz) 122 µs (at 32.768 kHz) clock
CMOS input 8 pins 8 pins 2 pins CMOS I/O 59 pins 72 pins 62 pins N-ch open-drain I/O
Note 1
LED direct drive 16 pins 22 pins 12 pins output
Medium-voltage pin
Macro service Provided None Context switching Provided None Programmable priority
µ
PD784225, 784225Y
6 pins 4 pins
6 pins 4 pins
× 1 unit × 1 unit × 1 unit
• 8-bit timer/event counter • 8-bit timer/event counter • 8-bit timer/event counter × 4 units × 6 units × 2 units
• CSI (3-wire serial I/O, multi-master supporting I2C
Note 2
bus
4 levels 2 levels
• Power-saving mode: HALT/IDLE Mode
(14 × 14 mm) (fine pitch) (14 × 14 mm) (14 × 14 mm)
• 80-pin plastic TQFP • 100-pin plastic QFP • 80-pin plastic TQFP (fine pitch) (12 × 12 mm) (14 × 20 mm) (fine pitch) (12 × 12 mm)
) × 1 channel
µ
PD784216Y Subseries
µ
PD780058Y Subseries
• UART (time-division transfer function)/IOE (3-wire
serial I/O) × 2 channels
• CSI (3-wire serial I/O, 2-wire serial I/O, I2C bus) × 1 channel
• CSI (3-wire serial I/O with automatic transmission/reception function) × 1 channel
Notes 1. Pins with ancillary function are included in the I/O pins.
2.µPD784225Y and 784216Y Subseries only
8
Data Sheet U12376EJ1V0DS00

3. PIN CONFIGURATION (Top View)

• 80-pin plastic QFP (14 × 14 mm)
PD784224GC-×××-8BT, µPD784224YGC-×××-8BT,
PD784225GC-×××-8BT, µPD784225YGC-×××-8BT
• 80-pin plastic TQFP (fine pitch) (12 × 12 mm)
PD784224GK-×××-BE9, µPD784224YGK-×××-BE9,
PD784225GK-×××-BE9, µPD784225YGK-×××-BE9
A14/ANI4
P13/ANI3
P12/ANI2
P11/ANI1
P10/ANI0
µ
PD784224, 784225, 784224Y, 784225Y
Note 2
AVDDV
DD0
XT1
XT2
TEST
X1X2V
DD1
SS0
V
P05/INTP5
P04/INTP4
P03/INTP3
P02/INTP2/NMI
P01/INTP1
P00/INTP0
P15/ANI5 P16/ANI6 P17/ANI7
P130/ANO0 P131/ANO1
AV
P70/SI2/RxD2
P71/SO2/TxD2
P72/SCK2/ASCK2
P20/SI1/RxD1
P21/SO1/TxD1
P22/SCK1/ASCK1
P23/PCL P24/BUZ
P25/SI0/SDA0
P26/SO0
P27/SCK0/SCL0
P40/AD0 P41/AD1
AV
REF1
Note 1
Note 1
80
1 2 3
SS
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
21 40393837363534333231302928272625242322
61626364656667686970717273747576777879
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
RESET P127/RTP7 P126/RTP6 P125/RTP5 P124/RTP4 P123/RTP3 P122/RPT2 P121/RTP1 P120/RTP0 P37/EXA P36/TI01 P35/TI00 P34/TI2 P33/TI1 P32/TO2 P31/TO1 P30/TO0 P67/ASTB P66/WAIT P65/WR
SS1
V
P50/A8
P42/AD2
P43/AD3
P44/AD4
P45/AD5
P46/AD6
P47/AD7
P51/A9
P52/A10
P53/A11
P54/A12
P55/A13
P56/A14
P57/A15
P60/A16
P61/A17
P62/A18
P63/A19
P64/RD
Notes 1. The SCL0 and SDA0 pins are available in µPD784225Y Subseries only.
2. Connect the TEST pin to V
SS0 directly or via a pull-down resistor. For the pull-down connection, use
of a resistor with a resistance ranging from 470 to 10 k is recommended.
Caution Connect the AV
SS pin to VSS0.
Remark When using in applications where noise from inside the microcomputer has to be reduced, it is
recommended to take countermeasures against noise such as supplying power to V
DD0 and VDD1
independently, and connecting VSS0 and VSS1 to different ground lines.
Data Sheet U12376EJ1V0DS00
9
µ
PD784224, 784225, 784224Y, 784225Y
A8 to A19 : Address Bus AD0 to AD7 : Address/Data Bus ANI0 to ANI7 : Analog Input ANO0, ANO1 : Analog Output ASCK1, ASCK2 : Asynchronous Serial Clock ASTB : Address Strobe
DD : Analog Power Supply
AV AVREF1 : Analog Reference Voltage
SS : Analog Ground
AV BUZ : Buzzer Clock EXA : External Access Status Output INTP0 to INTP5 : Interrupt from Peripherals NMI : Non-maskable Interrupt P00 to P05 : Port0 P10 to P17 : Port1 P20 to P27 : Port2 P30 to P37 : Port3 P40 to P47 : Port4 P50 to P57 : Port5 P60 to P67 : Port6 P70 to P72 : Port7 P120 to P127 : Port12
P130, P131 : Port13 PCL : Programmable Clock RD : Read Strobe RESET : Reset RTP0 to RTP7 : Real-time Output Port RxD1, RxD2 : Receive Data SCK0 to SCK2 : Serial Clock SCL0 SDA0
Note
Note
: Serial Clock
: Serial Data SI0 to SI2 : Serial Input SO0 to SO2 : Serial Output TEST : Test TI00, TI01, TI1, TI2 : Timer Input TO0 to TO2 : Timer Output TxD1, TxD2 : Transmit Data
DD0, VDD1 : Power Supply
V VSS0, VSS1 : Ground WAIT : Wait WR : Write Strobe X1, X2 : Crystal (Main System Clock) XT1, XT2 : Crystal (Subsystem Clock)
Note The SCL0 and SDA0 pins are available in
PD784225Y Subseries only.
10
Data Sheet U12376EJ1V0DS00

4. BLOCK DIAGRAM

µ
PD784224, 784225, 784224Y, 784225Y
INTP2/NMI
INTP0, INTP1,
INTP3 to INTP5
TI00 TI01
TO0
TI1
TO1
TI2
TO2
RTP0 to RTP7
NMI/INTP2
ANO0 ANO1
AV
REF1
AV
ANI0 to ANI7
AV AV
P03/INTP3
PCL
BUZ
PROGRAMMABLE INTERRUPT CONTROLLER
TIMER/EVENT
COUNTER
(16 BITS)
TIMER/EVENT
COUNTER1
(8 BITS)
TIMER/EVENT
COUNTER2
(8 BITS)
TIMER/COUNTER5
(8 BITS)
TIMER/COUNTER6
(8 BITS)
78K/IV
CPU CORE
UART/IOE1 BAUD-RATE GENERATOR
UART/IOE2 BAUD-RATE GENERATOR
CLOCKED SERIAL INTERFACE
BUS I/F
ROM
PORT0
RxD1/SI1 TxD1/SO1
ASCK1/SCK1 RxD2/SI2
TxD2/SO2 ASCK2/SCK2
SI0/SDA0
Note
SO0 SCK0/SCL0
AD0 to AD7 A8 to A15
A16 to A19 RD
WR WAIT ASTB
EXA
P00 to P05
Note
WATCH TIMER
PORT1 PORT2
WATCHDOG TIMER
RAM
REAL-TIME OUTPUT PORT
PORT3 PORT4 PORT5 PORT6
D/A CONVERTER
SS
DD SS
A/D CONVERTER
PORT7 PORT12 PORT13
CLOCK OUTPUT CONTROL
SYSTEM CONTROL
P10 to P17 P20 to P27 P30 to P37 P40 to P47 P50 to P57 P60 to P67
P70 to P72 P120 to P127 P130, P131
RESET X1 X2 XT1
BUZZER OUTPUT
XT2 V
DD0
V
SS0
, V , V
DD1 SS1
TEST
Note This function supports the I2C bus interface and is available in µPD784225Y Subseries only.
Remark The internal ROM and RAM capacities differ depending on the model.
Data Sheet U12376EJ1V0DS00
11
µ
PD784224, 784225, 784224Y, 784225Y

5. PIN FUNCTION

5.1 Port Pins (1/2)
Pin Name I/O Alternate Function Function P00 I/O INTP0 P01 INTP1 P02 INTP2/NM1 P03 INTP3 P04 INTP4 P05 INTP5 P10 to P17 Input ANI0 to ANI7
Port 0 (P0):
• 6-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up resistors by software bit-wise.
Port 1 (P1):
• 8-bit input port
P20 I/O RxD1/SI1 P21 TxD1/SO1 P22 ASCK1/SCK1 P23 PCL P24 BUZ P25 SI0/SDA0 P26 SO0 P27 SCK0/SCL0 P30 I/O TO0 P31 TO1 P32 TO2 P33 TI1 P34 TI2 P35 TI00 P36 TI01 P37 EXA P40 to P47 I/O AD0 to AD7 Port 4 (P4):
P50 to P57 I/O A8 to A15 Port 5 (P5):
Note
Note
Port 2 (P2):
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up resistors by software bit-wise.
Port 3 (P3):
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up resistors by software bit-wise.
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• All pins set in input mode can be connected to internal pull-up resistors by software.
• Can drive LEDs.
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• All pins set in input mode can be connected to internal pull-up resistors by software.
• Can drive LEDs.
Note This function is available in µPD784255Y Subseries only.
12
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
5.1 Port Pins (2/2)
Pin Name I/O Alternate Function Function P60 I/O A16 P61 A17 P62 A18 P63 A19 P64 RD P65 WR P66 WAIT P67 ASTB P70 I/O RxD2/SI2
P71 TxD2/SO2
P72 ASCK2/SCK2
Port 6 (P6):
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• All pins set in input mode can be connected to internal pull-up resistors by software.
Port 7 (P7):
• 3-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up resistor by software bit-wise.
P120 to P127 I/O RTP0 to RTP7 Port 12 (P12):
• 8-bit I/O port
• Can be set in input or output mode bit-wise.
• Pins set in input mode can be connected to internal pull-up resistor by software bit-wise.
P130, P131 I/O ANO0, ANO1 Port 13 (P13):
• 2-bit I/O port
• Can be set in input or output mode bit-wise.
Data Sheet U12376EJ1V0DS00
13
µ
PD784224, 784225, 784224Y, 784225Y
5.2 Pins Other Than Port Pins (1/2)
Pin Name I/O Alternate Function Function TI00 Input P35 External count clock input to 16-bit timer register TI01 P36 Capture trigger signal input to capture/compare register 00 TI1 P33 External count clock input to 8-bit timer register 1 TI2 P34 External count clock input to 8-bit timer register 2 TO0 Output P30 16-bit timer output (shared by 14-bit PWM output) TO1 P31 8-bit timer output (shared by 8-bit PWM output) TO2 P32 RxD1 Input P20/SI1 Serial data input (UART1) RxD2 P70/SI2 Serial data input (UART2) TxD1 Output P21/SO1 Serial data output (UART1) TxD2 P71/SO2 Serial data output (UART2) ASCK1 Intput P22/SCK1 Baud rate clock input (UART1) ASCK2 P72/SCK2 Baud rate clock input (UART2) SI0 Input P25/SDA0 SI1 P20/RxD1 Serial data input (3-wire serial clock I/O1) SI2 P70/RxD2 Serial data input (3-wire serial clock I/O2) SO0 Output P26 Serial data output (3-wire serial I/O0) SO1 P21/TxD1 Serial data output (3-wire serial I/O1) SO2 P71/TxD2 Serial data output (3-wire serial I/O2)
Note
SDA0 SCK0 I/O P27/SCL0 SCK1 P22/ASCK1 Serial clock input/output (3-wire serial I/O1) SCK2 P72/ASCK2 Serial clock input/output (3-wire serial I/O2)
Note
SCL0 NMI Input P02/INTP2 Non-maskable interrupt request input INTP0 P00 External interrupt request input INTP1 P01 INTP2 P02/NMI INTP3 P03 INTP4 P04 INTP5 P05 PCL Output P23 Clock output (for trimming main system clock and subsystem clock) BUZ Output P24 Buzzer output RTP0 to RTP7
AD0 to AD7 I/O P40 to P47 Low-order address/data bus when external memory is connected A8 to A15 Output P50 to P57 Middle-order address bus when external memory is connected A16 to A19 P60 to P63 High-order address bus when external memory is connected
I/O P25/SI0 Serial data input/output (I2C bus)
P27/SCK0 Serial clock input/output (I2C bus)
Output P120 to P127 Real-time output port that outputs data in synchronization with
Note
Note
Serial data input (3-wire serial clock I/O0)
Serial clock input/output (3-wire serial I/O0)
trigger
Note This function is available in µPD784255Y Subseries only.
14
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
5.2 Pins Other Than Port Pins (2/2)
Pin Name I/O Alternate Function Function RD Output P64 Strobe signal output for read operation of external memory WR P65 Strobe signal output for write operation of external memory WAIT Input P66 To insert wait state(s) when external memory is accessed ASTB Output P67 Strobe output to externally latch address information output to ports
4 to 6 to access external memory EXA Output P37 External access status output RESET Input System reset input X1 Input To connect main system clock oscillation crystal X2 XT1 Input To connect subsystem clock oscillation crystal XT2 ANI0 to ANI7 Input P10 to P17 Analog voltage input for A/D converter ANO0, ANO1 Output P130, P131 Analog voltage output for D/A converter AVREF1 −−To apply reference voltage for D/A converter AVDD Positive power supply for A/D converter. Connected to VDD0. AVSS GND for A/D converter and D/A converter. Connected to VSS0. VDD0 Positive power supply for port block VSS0 GND potential for port block VDD1 Positive power supply (except port block) VSS1 GND potential (except port block) TEST Connect this pin to VSS0 directly or via pull-down resistor. For the
pull-down connection, use of a resistor with a resistance ranging
from 470 to 10 k is recommended.
Data Sheet U12376EJ1V0DS00
15
µ
PD784224, 784225, 784224Y, 784225Y

5.3 I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins

Table 5-1 shows symbols indicating the I/O circuit types of the respective pins and the recommended connection
of unused pins.
For the circuit diagram of each type of I/O circuit, refer to Figure 5-1.
Table 5-1. I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins (1/2)
Pin Name I/O Circuit Type I/O Recommended Connections of Unused Pins P00/INTP0 8-K I/O Input : Individually connected to VSS0 via resistor P01/INTP1 P02/INTP2/NMI P03/INTP3 to P05/INTP5 P10/ANI0 to P17/ANI7 9 Input Connected to VSS0 or VDD0 P20/RxD1/SI1 10-I I/O Input : Individually connected to VSS0 via resistor P21/TxD1/SO1 10-J P22/ASCK1/SCK1 10-I P23/PCL 10-J P24/BUZ P25/SDA0 P26/SO0 10-J P27/SCL0 P30/TO0 to P32/TO2 8-M P33/TI1, P34/TI2 8-K P35/TI00, P36/TI01 8-L P37/EXA 8-M P40/AD0 to P47/AD7 5-H P50/A8 to P57/A15 P60/A16 to P63/A19 P64/RD P65/WR P66/WAIT P67/ASTB P70/RxD2/SI2 8-K P71/TxD2/SO2 8-L P72/ASCK2/SCK2 8-K
Note
/SI0 10-I
Note
/SCK0 10-I
Output: Open
Output: Open
Note This function is available in µPD784255Y Subseries only.
Remark Because the circuit type numbers are standardized among the 78K Series products, they are not
sequential in some models (i.e., some circuits are not provided).
16
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 5-1. I/O Circuit Type of Respective Pins and Recommended Connections of Unused Pins (2/2)
Pin Name I/O Circuit Type I/O Recommended Connections of Unused Pins P120/RTP0 to P127/RTP7 8-K I/O Input : Individually connected to VSS0 via resistor P130/ANO0, P131/ANO1 12-D RESET 2-G Input XT1 16 Connected to VSS0 XT2 Open AVREF1 Connected to VDD0 AVDD AVSS Connected to VSS0 TEST/VPP
Note
Output: Open
Directly connected to VSS0
Note VPP pin is available in µPD78F4225, 78F4255Y only.
Remark Because the circuit type numbers are standardized among the 78K Series products, they are not
sequential in some models (i.e., some circuits are not provided).
Data Sheet U12376EJ1V0DS00
17
µ
PD784224, 784225, 784224Y, 784225Y
Figure 5-1. Types of Pin I/O Circuits (1/2)
Type 2-G
IN
Schmitt trigger input with hysteresis characteristics
V
Type 5-H
pullup enable
data
output disable
V
SS0
DD0
P-ch
DD0
V
P-ch
N-ch
input enable
IN/OUT
Type 8-M
pullup enable
data
output disable
input enable
Type 9
IN
P-ch
N-ch
V
V
DD0
P-ch
N-ch
V
SS0
Comparator
+
V
REF
(threshold voltage)
DD0
P-ch
IN/OUT
input enable
Type 8-K
pullup enable
data
output disable
Type 8-L
pullup
enable
data
open drain
output disable
V
DD0
Type 10-I
pullup
P-ch
DD0
V
P-ch
IN/OUT
N-ch
V
SS0
V
DD0
P-ch
DD0
V
P-ch
enable
data
open drain
output disable
Type 10-J
pullup
enable
data
V
IN/OUT
N-ch
V
SS0
open drain
output disable
V
SS0
SS0
V
DD0
P-ch
DD0
V
P-ch
IN/OUT
N-ch
V
DD0
P-ch
DD0
V
P-ch
IN/OUT
N-ch
18
Data Sheet U12376EJ1V0DS00
Type 12-D
data
output disable
input enable
Type 16
Analog output voltage
feedback cut-off
P-ch
VSS0 P-ch
N-ch
µ
PD784224, 784225, 784224Y, 784225Y
Figure 5-1. Types of Pin I/O Circuits (2/2)
V
DD0
P-ch
IN/OUT
N-ch
VSS0
XT1 XT2
Data Sheet U12376EJ1V0DS00
19
µ
PD784224, 784225, 784224Y, 784225Y

6. CPU ARCHITECTURE

6.1 Memory Space

A memory space of 1 Mbyte can be accessed. Mapping of the internal data area (special function registers and internal RAM) can be specified the LOCATION instruction. The LOCATION instruction must be always executed after RESET cancellation, and must not be used more than once.
(1) When LOCATION 0H instruction is executed
• Internal memory
The internal data area and internal ROM area are mapped as follows:
Part Number Internal Data Area Internal ROM Area
µ
PD784224, 0F100H to 0FFFFH 00000H to 0F0FFH
µ
PD784224Y 10000H to 17FFFH
µ
PD784225, 0EE00H to 0FFFFH 00000H to 0EDFFH
µ
PD784225Y 10000H to 1FFFFH
Caution The following areas that overlap the internal data area of the internal ROM cannot be used when
the LOCATION 0H instruction is executed.
Part Number Unusable Area
µ
PD784224, 0F100H to 0FFFFH (3,840 bytes)
µ
PD784224Y
µ
PD784225, 0EE00H to 0FFFFH (4,608 bytes)
µ
PD784225Y
• External memory
The external memory is accessed in external memory expansion mode.
(2) When LOCATION 0FH instruction is executed
• Internal memory
The internal data area and internal ROM area are mapped as follows:
Part Number Internal Data Area Internal ROM Area
µ
PD784224, FF100H to FFFFFH 00000H to 17FFFH
µ
PD784224Y
µ
PD784225, FEE00H to FFFFFH 00000H to 1FFFFH
µ
PD784225Y
20
• External memory
The external memory is accessed in external memory expansion mode.
Data Sheet U12376EJ1V0DS00
(256 bytes)
Internal RAM
On execution of
Note 1
Special function registers (SFR)
LOCATION 0FH instruction
HFFFFF
HFDFFF
H0DFFF
H00FFF
(3,584 bytes)
HFFEFF
µ
PD784224, 784225, 784224Y, 784225Y
Note 4
Note 1
Internal ROM
External memory
(980,736 bytes)
HFFF71
HFF0FF
H001FF
H00081
(96 Kbytes)
H00000
HFFEFF
PD784224, 784224Y
HFFEF0
H08EFF
HF7EFF
General-purpose
registers (128 bytes)
H08EF0
Figure 6-1. Memory Map of
Note 1
On execution of
LOCATION 0H instruction
HFFFFF
External memory
(928 Kbytes)
HF7EF0
Internal ROM
H00081
HFFF71
H93EFF
H60EFF
H00DFF
HFFCFF
H007FF
Program/data area
H00DF0
HFFCF0
(3,072 bytes)
H001F0
Data area (512 bytes)
Macro service control word
area (52 bytes)
H93EF0
H60EF0
(256 bytes)
(32,768 bytes)
Internal RAM
(3,584 bytes)
Note 1
Special function registers (SFR)
H00001
HFFFF0
HFDFF0
H0DFF0
H00FF0
HFFEF0
H001F0
HFFF71
Note 3
Note 2
CALLF entry
H00010
HFFF00
area (2 Kbytes)
H00800
HFF700
Internal ROM
(61,696 bytes)
CALLT table
area (64 bytes)
H08000
HF7000
H04000
Vector table area
(64 bytes)
HF3000
H00000
H00000
Program/data area
HFF0F0
H00001
HFFF71
Note 4
HFF0F0
Data Sheet U12376EJ1V0DS00
2. This 3,840-byte area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. On execution of LOCATION 0H instruction: 94,464 bytes, on execution of LOCATION 0FH instruction: 98,304 bytes
4. Base area and entry area for reset or interrupt. However, the internal RAM area is not used as a reset entry area.
Notes 1. Accessed in external memory expansion mode.
21
(256 bytes)
Internal RAM
On execution of
Note 1
Special function registers (SFR)
LOCATION 0FH instruction
HFFFFF
HFDFFF
H0DFFF
H00FFF
(4,352 bytes)
HFFEFF
µ
PD784224, 784225, 784224Y, 784225Y
Note 4
Note 1
Internal ROM
External memory
(912,896 bytes)
HFFFF1
HFFDEF
H00EEF
H00002
(128 Kbytes)
H00000
HFFEFF
PD784225, 784225Y
HFFEF0
H08EFF
HF7EFF
General-purpose
registers (128 bytes)
H08EF0
HF7EF0
Figure 6-2. Memory Map of
Note 1
On execution of
LOCATION 0H instruction
HFFFFF
External memory
(896 Kbytes)
H00002
H93EFF
H60EFF
H00DFF
HFFCFF
Macro service control word
H93EF0
Internal ROM
(65,536 bytes)
Data area (512 bytes)
area (52 bytes)
H00DF0
H60EF0
HFFCF0
(256 bytes)
Internal RAM
Note 1
Special function registers (SFR)
H00001
HFFFF1
HFFFF0
HFDFF0
H0DFF0
H00FF0
HFFEF0
HFFFF1
H00EEF
Note 2
Program/data area
(3,840 bytes)
H00001
HFFFF1
H00EE0
(4,352 bytes)
H00EE0
HFFDE0
Note 3
CALLF entry
H00010
HFFF00
Internal ROM
area (2 Kbytes)
(60,928 bytes)
Program/data area
HFFDE0
Note 4
CALLT table
area (64 bytes)
Vector table area
H00800
HFF700
H08000
HF7000
H04000
HF3000
(64 bytes)
H00000
H00000
22
Data Sheet U12376EJ1V0DS00
2. This 4,608-byte area can be used as an internal ROM only when the LOCATION 0FH instruction is executed.
3. On execution of LOCATION 0H instruction: 126,464 bytes, on execution of LOCATION 0FH instruction: 131,072 bytes
4. Base area and entry area for reset or interrupt. However, the internal RAM area is not used as a reset entry area.
Notes 1. Accessed in external memory expansion mode.
µ
(
PD784224, 784225, 784224Y, 784225Y

6.2 CPU Registers

6.2.1 General-purpose registers

Sixteen 8-bit general-purpose registers are available. Two 8-bit registers can be also used in pairs as a 16-bit register. Of the 16-bit registers, four can be used in combination with an 8-bit register for address expansion as 24-bit address specification registers.
Eight banks of these registers are available which can be selected by using software or the context switching function.
The general-purpose registers except V, U, T, and W registers for address expansion are mapped to the internal RAM.
Figure 6-3. General-Purpose Register Format
V
VVP (RG4)
U
UUP (RG5)
T
TDE (RG6)
W
WHL (RG7)
Parentheses
A (R1)
AX (RP0)
B (R3)
BC (RP1)
R5
R7
R9
VP (RP4)
R11
UP (RP5)
D (R13)
DE (RP6)
H (R15)
HL (RP7)
) indicate an absolute name.
X (R0)
C (R2)
R4
RP2
R6
RP3
R8
R10
E (R12)
L (R14)
8 banks
Caution Registers R4, R5, R6, R7, RP2, and RP3 can be used as X, A, C, B, AX, and BC registers,
respectively, by setting the RSS bit of the PSW to 1. However, use this function only for recycling the program of the 78K/III Series.
Data Sheet U12376EJ1V0DS00
23
µ
PD784224, 784225, 784224Y, 784225Y

6.2.2 Control registers

(1) Program counter (PC)
The program counter is a 20-bit register whose contents are automatically updated when the program is executed.
Figure 6-4. Program Counter (PC) Format
19 0
PC
(2) Program status word (PSW)
This register holds the statuses of the CPU. Its contents are automatically updated when the program is executed.
Figure 6-5. Program Status Word (PSW) Format
15 14 13 12 11 10 9 8
UF RBS2 RBS1 RBS0 PSWH
PSW
76543210 S Z RSS
Note
AC IE P/V 0 CYPSWL
Note This flag is provided to maintain compatibility with the 78K/III Series. Be sure to clear this flag to 0, except
when the software for the 78K/III Series is used.
(3) Stack pointer (SP)
This is a 24-bit pointer that holds the first address of the stack. Be sure to write 0 to the higher 4 bits of this pointer.
Figure 6-6. Stack Pointer (SP) Format
23 0
PC
20
0000
24
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

6.2.3 Special function registers (SFRs)

The special function registers, such as the mode registers and control registers of the internal peripheral
hardware, are registers to which special functions are allocated. These registers are mapped to a 256-byte space
Note
of addresses 0FF00H to 0FFFFH
Note On execution of the LOCATION 0H instruction. FFF00H to FFFFFH on execution of the LOCATION 0FH
instruction.
Caution Do not access an address in this area to which no SFR is allocated. If such an address is accessed
by mistake, the only by inputting the RESET signal.
Table 6-1 lists the special function registers (SFRs). The meanings of the symbols in this table are as follows:
• Symbol ............................... Symbol indicating an SFR. This symbol is reserved for NEC’s assembler
PD784225 may be in the deadlock status. This deadlock status can be cleared
.
(RA78K4). It can be used an sfr variable by the #pragma sfr directive with the C compiler (CC78K4).
• R/ W .................................... Indicates whether the SFR is read-only, write-only, or read/write.
R/W : Read/write R : Read-only W : Write-only
• Bit units for manipulation.. Bit units in which the value of the SFR can be manipulated.
SFRs that can be manipulated in 16-bit units can be described as the operand sfrp of an instruction. To specify the address of this SFR, describe an even address. SFRs that can be manipulated in 1-bit units can be described as the operand of a bit manipulation instruction.
• At reset .............................. Indicates the status of the register when the RESET signal has been input.
Data Sheet U12376EJ1V0DS00
25
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (1/4)
Address
Note 1
0FF00H Port 0 P0 R/W 00H 0FF01H Port 1 P1 R — 0FF02H Port 2 P2 R/W — 0FF03H Port 3 P3 — 0FF04H Port 4 P4 — 0FF05H Port 5 P5 — 0FF06H Port 6 P6 — 0FF07H Port 7 P7 — 0FF0CH Port 12 P12 — 0FF0DH Port 13 P13 — 0FF10H 16-bit timer counter TM0 R 0000H 0FF11H 0FF12H Capture/compare register 00 CR00 R/W — 0FF13H 0FF14H Capture/compare register 01 CR01 — 0FF15H 0FF16H Capture/compare control register 0 CRC0 00H 0FF18H 16-bit timer mode control register TMC0 — 0FF1AH 16-bit timer output control register TOC0 — 0FF1CH Prescaler mode register 0 PRM0 — 0FF20H Port 0 mode register PM0 FFH 0FF22H Port 2 mode register PM2 — 0FF23H Port 3 mode register PM3 — 0FF24H Port 4 mode register PM4 — 0FF25H Port 5 mode register PM5 — 0FF26H Port 6 mode register PM6 — 0FF27H Port 7 mode register PM7 — 0FF2CH Port 12 mode register PM12 — 0FF2DH Port 13 mode register PM13 — 0FF30H Pull-up resistor option register 0 PU0 00H 0FF32H Pull-up resistor option register 2 PU2 — 0FF33H Pull-up resistor option register 3 PU3 — 0FF37H Pull-up resistor option register 7 PU7 — 0FF3CH Pull-up resistor option register 12 PU12 — 0FF40H Clock output control register CKS
Special Function Register (SFR) Name Symbol R/W Bit Units for Manipulation At Reset
1 Bit 8 Bits 16 Bits
(16-bit timer/counter)
(16-bit timer/counter)
Note 2
Notes 1. When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
2. Because each port is initialized to input mode at reset, “00H” is not actually read. The output latch is initialized to “0”.
26
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (2/4)
Note
Address
0FF42H Port function control register PF2 R/W 00H 0FF4EH Pull-up resistor option register PUO — 0FF50H 8-bit timer counter 1 0FF51H 8-bit timer counter 2 0FF52H Compare register 10 (8-bit timer/counter 1) 0FF53H Compare register 20 (8-bit timer/counter 2) 0FF54H 8-bit timer mode control register 1 0FF55H 8-bit timer mode control register 2 0FF56H Prescaler mode register 1 0FF57H Prescaler mode register 2 0FF60H 8-bit timer counter 5 TM5 0FF61H 8-bit timer counter 6 TM6 — 0FF64H Compare register 50 (8-bit timer/counter 5) 0FF65H Compare register 60 (8-bit timer/counter 6) 0FF68H 8-bit timer mode control register 5 0FF69H 8-bit timer mode control register 6 0FF6CH Prescaler mode register 5 0FF6DH Prescaler mode register 6 0FF70H 0FF71H 0FF72H 0FF73H 0FF74H Transmit shift register 1 TXS1 W FFH
0FF75H Transmit shift register 2 TXS2 W
0FF76H Baud rate generator control register 1 BRGC1 R/W 00H 0FF77H Baud rate generator control register 2 BRGC2 — 0FF7AH Oscillation mode select register CC — 0FF80H A/D converter mode register ADM — 0FF81H A/D converter input select register ADIS — 0FF83H A/D conversion result register ADCR R Undefined 0FF84H D/A conversion value setting register 0 DACS0 R/W 00H 0FF85H D/A conversion value setting register 1 DACS1 — 0FF86H D/A converter mode register 0 DAM0 — 0FF87H D/A converter mode register 1 DAM1
Special Function Register (SFR) Name Symbol R/W Bit Units for Manipulation At Reset
1 Bit 8 Bits 16 Bits
TM1 TM1W TM2 CR10 CR1W CR20 TMC1 TMC2 PRM1 PRM2
CR50 CR5W CR60 TMC5 TMC6 PRM5
PRM6 Asynchronous serial interface mode register 1 Asynchronous serial interface mode register 2 Asynchronous serial interface status register 1 Asynchronous serial interface status register 2
Receive buffer register 1 RXB1 R
Receive buffer register 2 RXB2 R
ASIM1 00H ASIM2 — ASIS1 R — ASIS2
R— 0000H
R/W
TMC1W
PRM1W
TM5W
R—
R/W
TMC5W
PRM5W
Note When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
Data Sheet U12376EJ1V0DS00
27
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (3/4)
Address
Note 1
0FF88H ROM correction control register CORC R/W 00H 0FF89H ROM correction address pointer H CORAH — 0FF8AH ROM correction address pointer L CORAL 0000H 0FF8BH 0FF8DH External access status enable register EXAE 00H 0FF90H Serial operation mode register 0 CSIM0 — 0FF91H Serial operation mode register 1 CSIM1 — 0FF92H Serial operation mode register 2 CSIM2 — 0FF94H Serial I/O shift register 0 SIO0 — 0FF95H Serial I/O shift register 1 SIO1 — 0FF96H Serial I/O shift register 2 SIO2 — 0FF98H Real-time output buffer register L RTBL — 0FF99H Real-time output buffer register H RTBH — 0FF9AH Real-time output port mode register RTPM — 0FF9BH Real-time output port control register RTPC — 0FF9CH Watch timer mode control register WTM — 0FFA0H 0FFA2H 0FFA8H In-service priority register ISPR R — 0FFA9H Interrupt select control register SNMI R/W — 0FFAAH Interrupt mode control register IMC 80H 0FFACH Interrupt mask flag register 0L 0FFADH Interrupt mask flag register 0H 0FFAEH Interrupt mask flag register 1L 0FFAFH Interrupt mask flag register 1H 0FFB0H I2C bus control register 0FFB2H Prescaler mode register for serial clock SPRM0 — 0FFB4H Slave address register SVA0 — 0FFB6H I2C bus status register 0FFB8H Serial shift register IIC0 R/W — 0FFC0H Standby control register STBC 30H 0FFC2H Watchdog timer mode register WDM 00H 0FFC4H Memory expansion mode register MM 20H 0FFC7H Programmable wait control register 1 PWC1 AAH 0FFC8H Programmable wait control register 2 PWC2 W AAAAH 00FFCEH Clock status register PCS R 32H 0FFCFH 0FFD0H to External SFR area
0FFDFH
Special Function Register (SFR) Name Symbol R/W Bit Units for Manipulation At Reset
1 Bit 8 Bits 16 Bits
External interrupt rising edge enable register External interrupt falling edge enable register
Note 2
Note 2
Oscillation stabilization time specification register
EGP0 — EGN0
MK0L MK0 MK0H MK1L MK1 MK1H
IICCL0 00H
IICS0 R
OSTS R/W 00H
FFFFH
Notes 1. When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
PD784225Y Subseries only
28
2.
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 6-1. Special Function Register (SFR) List (4/4)
Note
Address
0FFE0H Interrupt control register (INTWDTM) WDTIC R/W 43H 0FFE1H Interrupt control register (INTP0) PIC0 — 0FFE2H Interrupt control register (INTP1) PIC1 — 0FFE3H Interrupt control register (INTP2) PIC2 — 0FFE4H Interrupt control register (INTP3) PIC3 — 0FFE5H Interrupt control register (INTP4) PIC4 — 0FFE6H Interrupt control register (INTP5) PIC5 — 0FFE8H Interrupt control register (INTIIC0/INTCSI0) CSIIC0 — 0FFE9H Interrupt control register (INTSER1) SERIC1 — 0FFEAH Interrupt control register (INTSR1/INTCSI1) SRIC1 — 0FFEBH Interrupt control register (INTST1) STIC1 — 0FFECH Interrupt control register (INTSER2) SERIC2 — 0FFEDH Interrupt control register (INTSR2/INTCSI2) SRIC2 — 0FFEEH Interrupt control register (INTST2) STIC2 — 0FFEFH Interrupt control register (INTTM3) TMIC3 — 0FFF0H Interrupt control register (INTTM00) TMIC00 — 0FFF1H Interrupt control register (INTTM01) TMIC01 — 0FFF2H Interrupt control register (INTTM1) TMIC1 — 0FFF3H Interrupt control register (INTTM2) TMIC2 — 0FFF4H Interrupt control register (INTAD) ADIC — 0FFF5H Interrupt control register (INTTM5) TMIC5 — 0FFF6H Interrupt control register (INTTM6) TMIC6 — 0FFF9H Interrupt control register (INTWT) WTIC
Special Function Register (SFR) Name Symbol R/W Bit Units for Manipulation At Reset
1 Bit 8 Bits 16 Bits
Note When the LOCATION 0H instruction is executed. Add “F0000H” to this value when the LOCATION 0FH
instruction is executed.
Data Sheet U12376EJ1V0DS00
29
µ
PD784224, 784225, 784224Y, 784225Y

7. PERIPHERAL HARDWARE FUNCTIONS

7.1 Ports

The ports shown in Figure 7-1 are provided to make various control operations possible. Table 7-1 shows the
function of each port. Ports 0, 2 to 7, and 12 can be connected to internal pull-up resistors by software when inputting.
Figure 7-1. Port Configuration
Port 5
Port 6
Port 7
Port 12
Port 13
      
      
  
      
  
P50
P57 P60
P67 P70
P72 P120
P127 P130
P131
P00
P05
P10 to P17
P20
P27 P30
P37 P40
P47
   
Port 0
  
Port 1
8
  
Port 2
   
  
Port 3
   
  
Port 4
   
30
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 7-1. Port Functions
Port Name Pin Name Function Specification of Pull-up Resistor
Connection by Software Port 0 P00 to P05 • Can be set in input or output mode bit-wise Can be specified bit-wise Port 1 P10 to P17 • Input port — Port 2 P20 to P27 • Can be set in input or output mode bit-wise Can be specified bit-wise Port 3 P30 to P37 • Can be set in input or output mode bit-wise Can be specified bit-wise Port 4 P40 to P47 • Can be set in input or output mode bit-wise Can be specified in 1-port units
• Can directly drive LEDs
Port 5 P50 to P57 • Can be set in input or output mode bit-wise Can be specified in 1-port units
• Can directly drive LEDs Port 6 P60 to P67 • Can be set in input or output mode bit-wise Can be specified in 1-port units Port 7 P70 to P72 • Can be set in input or output mode bit-wise Can be specified bit-wise Port 12 P120 to P127 • Can be set in input or output mode bit-wise Can be specified bit-wise Port 13 P130, P131 • Can be set in input or output mode bit-wise

7.2 Clock Generator

An on-chip clock generator necessary for operation is provided. This clock generator has a frequency divider. If high-speed operation is not necessary, the internal operating frequency can be lowered by the frequency divider to reduce the current consumption.
Figure 7-2. Block Diagram of Clock Generator
XT1
XT2
X1
X2
Subsystem
clock
f
XT
oscillator
Main system
clock
oscillator
IDLE
controller
STOP and bit 2 (MCK) of the standby control register (STBC) = 1 when the subsystem clock is selected as CPU clock
f
X
Frequency
divider
f 2
X
f
Selector
XX
f
XX
2
Prescaler
f
XX
f
XX
2
2
2
Watch timer, clock output function
Prescaler
Clock to peripheral hardware
3
Selector
STOP,
IDLE
controller
HALT
controller
CPU clock (f
CPU
)
Data Sheet U12376EJ1V0DS00
Internal system clock
CLK
(f
31
)
µ
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-3. Example of Using Main System Clock Oscillator
(1) Crystal/ceramic oscillation (2) External clock
X2
X1
VSS1
Crystal resorator or ceramic resonator
X2
X1 VSS
External clock
PD74HCU04
µ
Figure 7-4. Example of Using Subsystem Clock Oscillator
(1) Crystal oscillation (2) External clock
V
SS
XT2
32.768 kHz
V
SS1
XT1
External clock
PD74HCU04
XT2
XT1
Caution When using the main system clock and subsystem clock oscillator, wire the dotted portions in
Figures 7-3 and 7-4 as follows to avoid adverse influence from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with other signal lines.
• Do not route the wiring in the vicinity of lines through which a high alternating current flows.
• Always keep the potential at the ground point of the capacitor in the oscillator the same as
SS1. Do not ground to a ground pattern through which a high current flows.
V
• Do not extract signals from the oscillator.
Note that the subsystem clock oscillator has a low amplification factor to reduce the current consumption.
32
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

7.3 Real-Time Output Port

The real-time output function is to transfer data set in advance to the real-time output buffer register to the output latch as soon as the timer interrupt or external interrupt has occurred in order to output the data to an external device. The pins that output the data to the external device constitute a port called a real-time output port.
Because the real-time output port can output signals without jitter, it is ideal for controlling a stepping motor.
Figure 7-5. Block Diagram of Real-Time Output Port
Internal bus
Real-time output port control register (RTPC)
RTPOE BYTE EXTR
INTP2TRG
INTTM1 INTTM2
Output trigger
controller
Port 12 output latch
P127······································ P120
Higher 4 bits of
real-time output
buffer register
(RTBH)
Real-time output port output latch
RTP7······································ RTP0
Lower 4 bits of
real-time output
buffer register
(RTBL)
Real-time output
port mode register
(RTPM)
RTPOE bit
P12n/RTPn pin output (n = 0 to 7)
P127/ P120/
······································
RTP7 RTP0
Data Sheet U12376EJ1V0DS00
33
µ
PD784224, 784225, 784224Y, 784225Y

7.4 Timer

One unit of 16-bit timers/event counters, two units of timers/event counters, and two 8-bit timers are provided. Because a total of six interrupt requests are supported, these timers/counters and timer can be used as six units
of timers/counters.
Table 7-2. Operations of Timers
Name 16-Bit 8-Bit 8-Bit 8-Bit 8-Bit
Timer/Event Timer/Event Timer/Event
Item Counter Counter 1 Counter 2 Count width 8 bits
16 bits
Operation mode Interval timer 1ch 1ch 1ch 1ch 1ch
External event counter ——
Function Timer output 1ch 1ch 1ch
PPG output ———— PWM output —— Square wave output ——
One-shot pulse output ———— Pulse width measurement 2 inputs ———— Number of interrupt requests 21111
Timer 5 Timer 6
34
Data Sheet U12376EJ1V0DS00
16-bit timer/event counter
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-6. Block Diagram of Timers (1/2)
fXX/4
f
XX
/16
INTTM3
TI01
TI00
Edge detector
Edge detector
8-bit timer/event counter 1
2
fXX/2
3
fXX/2
4
fXX/2
5
fXX/2
7
fXX/2
9
fXX/2
TI1
Edge detector
SelectorSelector
Selector
Clear
16-bit timer counter (TM0)
16
16-bit capture/compare register 00
(CR00)
16
16-bit capture/compare register 01
(CR01)
Clear
8-bit timer counter 1
(TM1)
8
8-bit compare register 10
(CR10)
INTTM2
OVF
INTTM00
INTTM01
Selector
Output controller
Output
controller
INTTM1
TO0
TO1
8-bit timer/event counter 2
TM1
2
fXX/2
3
fXX/2
4
fXX/2
5
fXX/2
7
fXX/2
9
fXX/2
TI2
Edge detector
Remark OVF: Overflow flag
Selector
Clear
8-bit timer counter 2
(TM2)
8
8-bit compare register 20
(CR20)
Data Sheet U12376EJ1V0DS00
OVF
Output
controller
INTTM2
TO2
35
8-bit timer 5
8-bit timer 6
fXX/2 fXX/2 fXX/2
fXX/2 fXX/2
fXX/2
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-6. Block Diagram of Timers (2/2)
2
(TM5)
8
(CR50)
Clear
INTTM5
Selector
INTTM6
3
4
5
7
9
Selector
8-bit timer counter 5
8-bit compare register 50
TM5
fXX/2 fXX/2 fXX/2 fXX/2
fXX/2 fXX/2
2
3
4
5
7
9
Selector
8-bit timer counter 6
8-bit compare register 60
(TM6)
8
(CR60)
Clear
INTTM6
36
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

7.5 A/D Converter

An A/D converter converts an analog input variable into a digital signal. This microcontroller is provided with
an A/D converter with a resolution of 8 bits and 8 channels (ANI0 to ANI7).
This A/D converter is of successive approximation type and the result of conversion is stored to an 8-bit A/D
conversion result register (ADCR).
The A/D converter can be started in the following two ways:
• Hardware start Conversion is started by trigger input (P03).
• Software start Conversion is started by setting the A/D converter mode register.
One analog input channel is selected from ANI0 to ANI7 for A/D conversion. When A/D conversion is started by means of hardware start, conversion is stopped after it has been completed. When conversion is started by means of software start, A/D conversion is repeatedly executed, and each time conversion has been completed, an interrupt request (INTAD) is generated.
Figure 7-7. Block Diagram of A/D Converter
Series resistor string
ANI0 ANI1 ANI2 ANI3 ANI4 ANI5 ANI6 ANI7
INTP3/P03 INTAD
Selector
Edge
detector
Edge
detector
Sample & hold circuit
Voltage comparator
Tap selector
Successive approximation register (SAR)
Controller
A/D conversion result register
(ADCR)
Internal bus
AVDD
AV
SS
INTP3
Data Sheet U12376EJ1V0DS00
37
µ
PD784224, 784225, 784224Y, 784225Y

7.6 D/A Converter

A D/A converter converts an input digital signal into an analog voltage. This microcontroller is provided with a
voltage output type D/A converter with a resolution of 8 bits and two channels.
The conversion method is of R-2R resistor ladder type. D/A conversion is started by setting DACE0 of the D/A converter mode register 0 (DAM0) and DACE1 of the D/
A converter mode register 1 (DAM1).
The D/A converter operates in the following two modes:
• Normal mode The converter outputs an analog voltage immediately after it has completed D/A conversion.
• Real-time output mode The converter outputs an analog voltage in synchronization with an output trigger after it has completed D/A conversion.
Figure 7-8. Block Diagram of D/A Converter
DACS0
AV
REF1
8
Selector
2R
2R
2R
2R
ANO0
R
R
DACS1
8
Selector
2R
2R
2R
R
R
ANO1
38
AV
SS
Data Sheet U12376EJ1V0DS00
2R
µ
PD784224, 784225, 784224Y, 784225Y

7.7 Serial Interface

Three independent serial interface channels are provided.
• Asynchronous serial interface (UART)/3-wire serial I/O (IOE) × 2
• Clocked serial interface (CSI) × 1
• 3-wire serial I/O (IOE)
2
C bus interface (I2C) (µPD784225Y Subseries only)
•I
Therefore, communication with an external system and local communication within the system can be simultaneously
executed (see Figure 7-9).
Figure 7-9. Example of Serial Interface
2
C
V
DD0
V
DD0
PD780078Y (slave)
µ
SDA SCL
PD780308Y (slave)
µ
µ
PD4711A
RS-232C
driver/receiver
PD784225Y (master)
µ
[UART]
RxD1 TxD1
Port
 
SDA0
SCL0
(a) UART + I
2
[I
C]
µ
PD4711A
RS-232C
driver/receiver
µ
driver/receiver
Note Handshake line
[UART]
PD4711A
RS-232C
RxD2 TxD2
Port
 
[UART]
(b) UART + 3-wire serial I/O
PD784225Y (master)
µ
SO1
RxD2 TxD2
Port
 
SI1
SCK1
INTPm
Port
SDA SCL
[3-wise serial I/O]
Note
µ
PD753106 (slave)
SI SO SCK Port INT
LCD
Data Sheet U12376EJ1V0DS00
39
µ
PD784224, 784225, 784224Y, 784225Y

7.7.1 Asynchronous serial interface/3-wire serial I/O (UART/IOE)

Two channels of serial interfaces that can select an asynchronous serial interface mode and 3-wire serial I/O
mode are provided.
(1) Asynchronous serial interface mode
In this mode, data of 1 byte following the start bit is transferred or received. Because an on-chip baud rate generator is provided, a wide range of baud rates can be set. Moreover, the clock input to the ASCK pin can be divided to define a baud rate. When the baud rate generator is used, a baud rate conforming to the MIDI standard (31.25 kbps) can be also obtained.
Figure 7-10. Block Diagram in Asynchronous Serial Interface Mode
Internal bus
8
Receive buffer register
1, 2 (RXB1, RXB2)
8
RxD1, RxD2
TxD1, TxD2
ASCK1, ASCK2
Baud rate generator
8
Receive shift register
1, 2 (RX1, RX2)
Receive control
parity check
Transmit/receive clock generation
Transmit shift register
1, 2 (TXS1, TXS2)
INTSR1, INTSR2
5-bit counter × 2
Transmit control
parity addition
Selector
INTST1, INTST2
fXX to fXX/2
5
40
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(2) 3-wire serial I/O mode
In this mode, the master device starts transfer by making the serial clock active and transfers 1-byte data in synchronization with this clock. This mode is used to communicate with a device having the conventional clocked serial interface. Basically, communication is established by using three lines: serial clocks (SCK1 and SCK2), serial data inputs (SI1 and SI2), and serial data outputs (SO1 and SO2). To connect two or more devices, a handshake line is necessary.
Figure 7-11. Block Diagram in 3-wire Serial I/O Mode
Internal bus
8
Direction controller
8
SI1, SI2
SO1, SO2
Serial I/O shift register 1, 2 (SIO1, SIO2)
SCK1, SCK2
Serial clock counter
Serial clock controller
Interrupt generator
Selector
INTCSI1, INTCSI2
TO2
XX
/8
f fXX/16
Data Sheet U12376EJ1V0DS00
41
µ
PD784224, 784225, 784224Y, 784225Y

7.7.2 Clocked serial interface (CSI)

In this mode, the master device starts transfer by making the serial clock active and communicates 1-byte data
in synchronization with this clock.
(1) 3-wire serial I/O mode
This mode is to communicate with devices having the conventional clocked serial interface. Basically, communication is established in this mode with three lines: one serial clock (SCK0) and two serial data (SI0 and SO0) lines. Generally, a handshake line is necessary to check the reception status.
Figure 7-12. Block Diagram in 3-Wise Serial I/O Mode
Internal bus
8
Direction controller
8
SI0
Serial I/O shift register 0
(SIO0)
SO0
SCK0
Serial clock counter
Serial clock controller
Interrupt generator
Selector
INTCSI0
TO2
XX
/8
f fXX/16
(2) I2C (Inter IC) bus mode (supporting multi-master) (µPD784225Y Subseries only)
This mode is to communicate with devices conforming to the I2C bus format. This mode is to transfer 8-bit data with two or more devices by using two lines: serial clock (SCL0) and serial data bus (SDA0). During transfer, a “start condition”, “data”, and “stop condition” can be output onto the serial data bus. During reception, these data can be automatically detected by hardware.
42
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Figure 7-13. Block Diagram in I2C Bus Mode
Internal bus
8
Direction controller
Slave address register
8
(SVA0)
8
SDA0
Serial I/O shift register 0 (SIO0)
Start condition/ acknowledge detector
Output latch
Stop condition detector
SCL0
Serial clock counter
Serial clock controller

7.8 Clock Output Function

Clocks of the following frequencies can be output.
• 97.7 kHz/195 kHz/391 kHz/781 kHz/1.56 MHz/3.13 MHz/6.25 MHz/12.5 MHz (main system clock: 12.5 MHz)
• 32.768 kHz (subsystem clock: 32.768 kHz)
Interrupt generator
Selector
Wakeup controller
Acknowledge generator
INTIIC0
TO2/18 to TO2/68 f
XX
/24 to fXX/178
fXX/2
f
XX
fXX/2 fXX/2 fXX/2 fXX/2 fXX/2
Figure 7-14. Block Diagram of Clock Output Function
f
XX
2
/2
3
4
5
6
7
f
XT
Selector
Synchronizer
Output controller PCL
Data Sheet U12376EJ1V0DS00
43
µ
PD784224, 784225, 784224Y, 784225Y

7.9 Buzzer Output Function

Clocks of the following frequencies can be output as buzzer output.
• 1.5 kHz/3.1 kHz/6.1 kHz/12.2 kHz (main system clock: 12.5 MHz)
Figure 7-15. Block Diagram of Buzzer Output Function
10
fXX/2
11
fXX/2 fXX/2 fXX/2
12
13
Selector
Output controller
BUZ

7.10 Edge Detection Function

The interrupt input pins (INTP0, INTP1, NMI/INTP2, INTP3 to INTP5) are used not only to input interrupt requests but also to input trigger signals to the internal hardware units. Because these pins operate at an edge of the input signal, they have a function to detect an edge. Moreover, a noise reduction circuit is also provided to prevent erroneous detection due to noise.
Pin Name Detectable Edge Noise Reduction NMI Either or both of rising and falling edges By analog delay INTP0 to INTP5

7.11 Watch Timer

The watch timer has the following functions:
• Watch timer
• Interval timer
The watch timer and interval timer functions can be used at the same time.
(1) Watch timer
The watch timer sets the WTIF flag of the interrupt control register (WTIC) at time intervals of 0.5 seconds by using the 32.768-kHz subsystem clock.
(2) Interval timer
The interval timer generates an interrupt request (INTTM3) at predetermined time intervals.
44
Data Sheet U12376EJ1V0DS00
µ
fXX/2
7
Prescaler
f
XT
f
W
2
4
f
W
2
5
f
W
2
6
f
W
2
7
f
W
2
8
f
W
f
W
2
9
5-bit counter
f
W
2
5
f
W
2
14
INTWT
INTTM3
To 16-bit timer/counter
Selector
Selector
Selector
Selector
PD784224, 784225, 784224Y, 784225Y
Figure 7-16. Block Diagram of Watch Timer

7.12 Watchdog Timer

A watchdog timer is provided to detect a hang up of the CPU. This watchdog timer generates a non-maskable
or maskable interrupt unless it is cleared by software within a specified interval time. Once enabled to operate, the watchdog timer cannot be stopped by software. Whether the interrupt by the watchdog timer or the interrupt input from the NMI pin takes precedence can be specified.
Figure 7-17. Block Diagram of Watchdog Timer
Timer
RUN HALT IDLE STOP
f
CLK
Note
Note Write 1 to bit 7 (RUN) of the watchdog timer (WDM).
Remark f
CLK: Internal system clock (fXX to fXX/8)
21
f
CLK
/2
20
f
CLK
/2
19
f
CLK
/2
INTWDT
Selector
17
f
CLK
/2
Data Sheet U12376EJ1V0DS00
45
µ
PD784224, 784225, 784224Y, 784225Y

8. INTERRUPT FUNCTION

As the servicing in response to an interrupt request, the three types shown in Table 8-1 can be selected by
program.
Table 8-1. Servicing of Interrupt Request
Servicing Mode Entity of Servicing Servicing Contents of PC and PSW
Vectored interrupt Software Branches and executes servicing routine Saves to and restores
(servicing is arbitrary). from stack.
Context switching Automatically switches register bank, Saves to or restores from
branches and executes servicing routine fixed area in register bank (servicing is arbitrary).
Macro service Firmware Executes data transfer between memory Retained
and I/O (servicing is fixed)

8.1 Interrupt Sources

Table 8-2 shows the interrupt sources available. As shown, interrupts are generated by 25 types of sources,
execution of the BRK instruction, BRKCS instruction, or an operand error.
The priority of interrupt servicing can be set to four levels, so that nesting can be controlled during interrupt servicing and that which of the two or more interrupts that simultaneously occur should be serviced first. When the macro service function is used, however, nesting always proceeds.
The default priority is the priority (fixed) of the service that is performed if two or more interrupt requests, having the same request, simultaneously generate (see Table 8-2).
46
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Table 8-2. Interrupt Sources
Type
Software BRK instruction Instruction execution
Non-maskable NMI Pin input edge detection External
Maskable 0 (
Default Priority
highest
) INTWDTM Overflow of watchdog timer Internal 1 INTP0 Pin input edge detection External 2 INTP1 3 INTP2 4 INTP3 5 INTP4 6 INTP5 7 INTIIC0
8 INTSER1 Occurrence of UART reception error in ASI1 9 INTSR1 End of UART reception by ASI1
10 INTST1 End of UART transfer by ASI1 11 INTSER2 Occurrence of UART reception error in ASI2 12 INTSR2 End of UART reception by ASI2
13 INTST2 End of UART transfer by ASI2 14 INTTM3 15 INTTM00 Signal indicating coincidence between 16-bit
16 INTTM01 Signal indicating coincidence between 16-bit
17 INTTM1 Occurrence of coincidence signal of 8-bit
18 INTTM2 Occurrence of coincidence signal of 8-bit
19 INTAD End of conversion by A/D converter 20 INTTM5 Occurrence of coincidence signal of 8-bit
21 INTTM6 Occurrence of coincidence signal of 8-bit
22
(lowest)
Name Trigger
BRKCS instruction Instruction execution Operand error If result of exclusive OR between operands
INTWDT Overflow of watchdog timer Internal
Note
INTCSI0 End of 3-wire transfer by CSI0
INTCSI1 End of 3-wire transfer by CSI1
INTCSI2 End of 3-wire transfer by CSI2
INTWT Overflow of watch timer
Source
byte and byte is not FFH when MOV STBC, #byte instruction or MOV WDM, #byte instruction, LOCATION instruction is executed
End of I2C bus transfer by CSI0 Internal
Reference time interval signal from watch timer
timer counter and capture/compare register (CR00)
timer counter and capture/compare register (CR01)
timer/counter 1
timer/counter 2
timer/counter 5
timer/counter 6
Internal/ Macro External Service
NoteµPD784255Y Subseries only
Remarks 1. ASI : Asynchronous Serial Interface
CSI: Clocked Serial Interface
2. There are two interrupt sources for the watchdog timer: non-maskable interrupts (INTWDT) and maskable interrupts (INTWDTM). Either one (but not both) should be selected for actual use.
Data Sheet U12376EJ1V0DS00
47
µ
PD784224, 784225, 784224Y, 784225Y

8.2 Vectored Interrupt

Execution branches to a servicing routing by using the memory contents of a vector table address corresponding
to the interrupt source as the address of the branch destination.
So that the CPU performs interrupt servicing, the following operations are performed:
• On branching: Saves the status of the CPU (contents of PC and PSW) to stack
• On returning : Restores the status of the CPU (contents of PC and PSW) from stack
To return to the main routine from an interrupt service routine, the RETI instruction is used. The branch destination address is in a range of 0 to FFFFH.
Table 8-3. Vector Table Address
Interrupt Source Vector Table Address Interrupt Source Vector Table Address BRK instruction 003EH INTST1 001CH Operand error 003CH INTSER2 001EH NMI 0002H INSR2 0020H INTWDT ( INTWDTM (maskable) INTP0 0008H INTTM3 0024H INTP1 000AH INTTM00 0026H INTP2 000CH INTTM01 0028H INTP3 000EH INTTM1 002AH INTP4 0010H INTTM2 002CH INTP5 0012H INTAD 002EH INTIIC0 0016H INTTM5 00030H INTCSI0 INTTM6 0032H INTSER1 0018H INTWT 0038H INTSR1 001AH INTCSI1
non-maskable
) 0004H INTCSI2
0006H INTST2 0022H
48
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

8.3 Context Switching

When an interrupt request is generated or when the BRKCS instruction is executed, a predetermined register bank is selected by hardware. Context switching is a function that branches execution to a vector address stored in advance in the register bank, and to stack the current contents of the program counter (PC) and program status word (PSW) to the register bank.
The branch address is in a range of 0 to FFFFH.
Figure 8-1. Context Switching Operation When Interrupt Request Is Generated
0000B <7> Transfer
PC19 to PC16
<2> Save (bits 8 through 11 of temporary register)
<1> Save
PC15 to PC0
Temporary register
PSW
<6> Exchange
<5> Save
Register bank n (n = 0 to 7)
A
B R5 R7
V U T
W
VP
UP D H
X
C R4 R6
E L
<3> Switching of register bank (RBS0 to RBS2 n)
<4> RSS 0 IE 0
Register bank n
(0 to 7)

8.4 Macro Service

This function is to transfer data between memory and a special function register (SFR) without intervention by the CPU. A macro service controller accesses the memory and SFR in the same transfer cycle and directly transfers data without loading it.
Because this function does not save or restore the status of the CPU, or load data, data can be transferred at high speeds.
CPU
Internal bus
Figure 8-2. Macro Service
Read
Memory SFR
Write
Data Sheet U12376EJ1V0DS00
Macro service
controller
Write
Read
49

8.5 Application Example of Macro Service

(1) Transmission of serial interface
Transfer data storage buffer (memory)
µ
PD784224, 784225, 784224Y, 784225Y
Data n
Data n 1
Data 2 Data 1
Internal bus
TxD1, TxD2
Transmit shift register
Transfer control
TXS1, TXS2 (SFR)
INTST1, INTST2
Each time macro service request INTST1 and INTST2 are generated, the next transmit data is transferred from memory to TXS1 and TXS2. When data n (last byte) has been transferred to TXS1 and TXS2 (when the transmit data storage buffer has become empty), vectored interrupt request INTST1 and INTST2 are generated.
(2) Reception of serial interface
Receive data storage buffer (memory)
Data n
Data n 1
Data 2 Data 1
Internal bus
RXB1, RXB2 (SFR)
INTSR1, INTSR2
RxD1, RxD2
Receive buffer register
Receive shift register
Reception control
Each time macro service request INTSR1 and INTSR2 are generated, the receive data is transferred from RXB1 and RXB2 to memory. When data n (last byte) has been transferred to memory (when the receive data storage buffer has become full), vectored interrupt request INTSR1 and INTSR2 are generated.
50
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

9. LOCAL BUS INTERFACE

The local bus interface can connect an external memory or I/O (memory mapped I/O) and support a memory space of 1 Mbyte (refer to Figure 9-1).
Figure 9-1. Example of Local Bus Interface (Multiplexed bus)
V
µ
PD784225
A8 to A19
RD
WR
DD1
Address latch
Address bus
SRAM
CS OE
WE I/O1 to I/O8
A0 to A19
Data bus
ASTB
AD0 to AD7
LE Q0 to Q7
D0 to D7
OE

9.1 Memory Expansion

External program and data memory can be connected in two stages: 256 Kbytes and 1 Mbytes.
To connect the external memory, ports 4 to 6 are used.
The external memory is connected by using a time-division address/data bus. The number of ports used when the external memory is connected can be reduced in this mode.

9.2 Programmable Wait

Wait state(s) can be inserted to the memory space (00000H to FFFFFH) while the RD and WR signals are active.
In addition, there is an address wait function that extends the active period of the ASTB signal to gain the address decode time.

9.3 External Access Status Function

An active low external access status signal is output from the P37/EXA pin. This signal notifies other devices connected to the external bus of the external access status, to disable data output to the external bus from other devices, or enables reception.
The external access status signal is output during external access.
Data Sheet U12376EJ1V0DS00
51
µ
PD784224, 784225, 784224Y, 784225Y

10. STANDBY FUNCTION

This function is to reduce the power consumption of the chip, and can be used in the following modes:
• HALT mode : Stops supply of the operating clock to the CPU. This mode is used in combination with the normal operation mode for intermittent operation to reduce the average power consumption.
• IDLE mode : Stops the entire system with the oscillator continuing operation. The power consumption in this mode is close to that in the STOP mode. However, the time required to restore the normal program operation from this mode is almost the same as that from the HALT mode.
• STOP mode : Stops the main system clock and thereby to stop all the internal operations of the chip. Consequently, the power consumption is minimized with only leakage current flowing.
• Power-saving mode : The main system clock is stopped with the subsystem clock used as the system clock. The CPU can operate on the subsystem clock to reduce the current consumption.
• Power-saving HALT mode: This is a standby function in the power-saving mode and stops the operation clock of the CPU, to reduce the power consumption of the entire system.
• Power-saving IDLE mode : This is a standby function in the power-saving mode and stops the entire system except the oscillator, to reduce the power consumption of the entire system.
These modes are programmable. The macro service can be started from the HALT mode and power-saving HALT mode. After executing macro service processing, it returns to the HALT mode.
52
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Figure 10-1. Transition of Standby Status
Macro
End of one processing
Macro service request
Power-
saving HALT
mode
(standby)
Power-saving HALT mode is set.
service
Interrupt request
Macro service request
End of one processing
End of macro service
saving mode
(operation on
Note 1
Power-
subsystem
clock)
Power-saving IDLE mode is set. NMI, INTP0 to INTP6 input,
Note 2
INTWT
saving IDLE
(standby)
Power-
mode
STOP
(standby)
Interrupt request of masked interrupt
Sets STOP mode
Interrupt request of masked interrupt
NMI, INTP0 to INTP6 input,
INTWT, key return interrupt
IDLE
(standby)
RESET input
RESET input
Power-saving HALT mode is set.
Normal operation is restored.
Normal
operation
(operation on
main system
clock)
Sets HALT mode
RESET input
Sets IDLE mode
NMI, INTP0 to INTP6 input, INTWT,
key return interrupt
Interrupt request of masked interrupt
RESET input
Note 2
Interrupt request of masked interrupt
End of oscillation stabilization time
RESET input
RESET input
Macro service request End of one processing
End of macro service
Interrupt request
HALT
(standby)
Macro
service
Macro service request
End of one processing
Interrupt request of masked interrupt
Note 2
Waits for
oscillation
stabilization
Notes 1. Only unmasked interrupt requests
2. Only unmasked INTP0 to INTP6, INTWT, key return interrupt (P80 to P87)
Remark NMI is valid only for an external input. The watchdog timer cannot be used for the release of standby
(HALT mode/STOP mode/IDLE mode).
Data Sheet U12376EJ1V0DS00
53
µ
PD784224, 784225, 784224Y, 784225Y

11. RESET FUNCTION

When a low-level signal is input to the RESET pin, the system is reset, and each hardware unit is initialized (reset). During the reset period, oscillation of the main system clock is unconditionally stopped. Consequently, the current consumption of the entire system can be reduced.
When the RESET signal goes high, the reset status is cleared, oscillation stabilization time (41.9 ms at 12.5 MHz) elapses, the contents of the reset vector table are set to the program counter (PC), execution branches to an address set to the PC, and program execution is started from that branch address. Therefore, the program can be reset and started from any address.
Figure 11-1. Oscillation of Main System Clock during Reset Period
Main system clock oscillator
Oscillation is unconditionally stopped during rest period
f
CLK
RESET input
Oscillation stabilization time
The RESET input pin has an analog delay noise eliminator to prevent malfunctioning due to noise.
Figure 11-2. Accepting Reset Signal
Time until the clock starts oscillation
Oscillation stabilization time
RESET input
Internal reset signal
Analog delay Analog delay
Analog delay
54
Internal clock
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

12. ROM CORRECTION

ROM correction is a function to replace part of the program in the internal ROM with a program in the internal
RAM.
By using the ROM correction function, instruction bugs found in the internal ROM can be avoided or the flow of
the program can be changed.
ROM correction can be used at up to four places in the internal ROM (program).
Figure 12-1. Block Diagram of ROM Correction
Program counter (PC)
Comparator
Correction address pointer n
Correction address registers
(CORAH, CORAL)
Remark n = 0 to 3, m = 0 or 1
Coincidence
Internal bus
Correction branch processing request signal (CALLT instruction)
CORENn CORCHm
ROM correction control register (CORC)
Data Sheet U12376EJ1V0DS00
55
µ
PD784224, 784225, 784224Y, 784225Y

13. INSTRUCTION SET

(1) 8-bit instructions (The instructions in parentheses are combinations realized by describing A as r)
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, SHR, SHL, ROR4, ROL4, DBNZ, PUSH, POP, MOVM, XCHM, CMPME, CMPMNE, CMPMNC, CMPMC, MOVBK, XCHBK, CMPBKE, CMPBKNE, CMPBKNC, CMPBKC, CHKL, CHKLA
Table 13-1. Instruction List by 8-Bit Addressing
Second Operand #byte A r saddr sfr !addr16 mem r3 [WHL+] n None
Note 2
r' saddr' !!addr24 [saddrp] PSWL [WHL–]
First Operand
(ADD)
Note 6
MOV (MOV) MOV MOV (MOV)
Note 6
(XCH) (XCH) XCH (XCH)
Note 1,6
(ADD)
Note 1
ADD
A (MOV) (MOV) MOV (MOV)
Note 1
ADD
(XCH) XCH (XCH)
(ADD)
Note 1
(ADD)
Note 1
r MOV (MOV) MOV MOV MOV MOV ROR
Note 1
ADD
(XCH) XCH XCH XCH XCH DIVUW
(ADD)
Note 1
ADD
Note 1
ADD
Note 1
ADD
Note 1
Note 1
[%saddrg]
Note 1
ADD
PSWH
(ADD)
Note 1
Note 3
MULU
INC
DEC
(ADD)
Note 6
MOV MOV INC
Note 1
ADD
Note 1
XCH DEC
Note 1
ADD
DBNZ
saddr MOV (MOV)
Note 1
ADD
sfr MOV MOV MOV PUSH
ADD
Note 1
(ADD)
Note 1
ADD
Note 1
POP
CHKL
CHKLA
!addr16 MOV (MOV) MOV !!addr24 ADD
Note 1
mem MOV [saddrp] ADD
Note 1
[%saddrg] mem3 ROR4
ROL4
r3 MOV MOV PSWL PSWH
B, C DBNZ STBC, WDM MOV [TDE+] (MOV)
[TDE–] (ADD)
MOVM
Note 1
Note 4
MOVBK
Note 5
Notes 1. The operands of ADDC, SUB, SUBC, AND, OR, XOR, and CMP are the same as that of ADD.
2. Either the second operand is not used, or the second operand is not an operand address.
3. The operands of ROL, RORC, ROLC, SHR, and SHL are the same as that of ROR.
4. The operands of XCHM, CMPME, CMPMNE, CMPMNC, and CMPMC are the same as that of MOVM.
5. The operands of XCHBK, CMPBKE, CMPBKNE, CMPBKNC, and CMPBKC are the same as that of
MOVBK.
6. The code length of some instructions having saddr2 as saddr in this combination is short.
56
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(2) 16-bit instructions (The instructions in parentheses are combinations realized by describing AX as
rp)
MOVW, XCHW, ADDW, SUBW, CMPW, MULUW, MULW, DIVUX, INCW, DECW, SHRW, SHLW, PUSH, POP, ADDWG, SUBWG, PUSHU, POPU, MOVTBLW, MACW, MACSW, SACW
Table 13-2. Instruction List by 16-Bit Addressing
Second Operand #word AX rp saddrp sfrp !addr16 mem [WHL+] byte n None
rp' saddrp' !!addr24 [saddrp]
First Operand
AX (MOVW) (MOVW) (MOVW)
Note 1
ADDW
(XCHW) (XCHW)
Note 1
(ADD)
(ADDW)
Note 1
(MOVW) (XCHW)
(ADDW)
Note 3
MOVW (MOVW) MOVW (MOVW)
Note 3
(XCHW) XCHW XCHW (XCHW)
Note 1,3
(ADDW)
Note 1
[%saddrg]
rp MOVW (MOVW) MOVW MOVW MOVW MOVW SHRW MULW
Note 1
ADDW
saddrp MOVW
ADDW
(XCHW) XCHW XCHW XCHW SHLW INCW
Note 1
(ADDW)
(MOVW)
(ADDW)
Note 1
Note 3
Note 1
ADDW
Note 1
ADDW
Note 1
ADDW
Note 1
MOVW MOVW INCW
Note 1
ADDW
XCHW DECW
Note 1
ADDW
DECW
sfrp MOVW MOVW MOVW PUSH
Note 1
ADDW
!addr16 MOVW (MOVW) MOVW
(ADDW)
Note 1
ADDW
Note 1
POP
MOVTBLW
!!addr24
mem MOVW [saddrp] [%saddrg]
Note 2
Note 4
PSW PUSH
SP ADDWG
SUBWG
post PUSH
PUSHU
POPU
[TDE+] (MOVW) SACW
byte MACW
MACSW
Notes 1. The operands of SUBW and CMPW are the same as that of ADDW.
2. Either the second operand is not used, or the second operand is not an operand address.
3. The code length of some instructions having saddrp2 as saddrp in this combination is short.
4. The operands of MULUW and DIVUX are the same as that of MULW.
POP
POP
Data Sheet U12376EJ1V0DS00
57
µ
PD784224, 784225, 784224Y, 784225Y
(3) 24-bit instructions (The instructions in parentheses are combinations realized by describing WHL
as rg)
MOVG, ADDG, SUBG, INCG, DECG, PUSH, POP
Table 13-3. Instruction List by 24-Bit Addressing
Second Operand #imm24 WHL rg saddrg !!addr24 mem1
rg'
First Operand
WHL (MOVG) (MOVG) (MOVG) (MOVG) (MOVG) MOVG MOVG MOVG
(ADDG) (ADDG) (ADDG) ADDG (SUBG) (SUBG) (SUBG) SUBG
rg MOVG (MOVG) MOVG MOVG MOVG INCG
ADDG (ADDG) ADDG DECG
SUBG (SUBG) SUBG PUSH
saddrg (MOVG) MOVG
!!addr24 (MOVG) MOVG
mem1 MOVG
[%saddrg] MOVG
SP MOVG MOVG INCG
[%saddrg]
SP None
Note
POP
DECG
Note Either the second operand is not used, or the second operand is not an operand address.
58
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(4) Bit manipulation instructions
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR, BFSET
Table 13-4. Bit Manipulation Instructions
Second Operand CY saddr.bit sfr.bit /saddr.bit /sfr. bit None
A.bit X.bit /A.bit /X.bit PSWL.bit PSWH.bit /PSWL.bit /PSWH.bit mem2.bit /mem2.bit
First Operand !addr16.bit !!addr24.bit /!addr16.bit /!!addr24.bit
CY MOV1 AND1 NOT1
AND1 OR1 SET1 OR1 CLR1 XOR1
saddr.bit MOV1 NOT1 sfr.bit SET1 A.bit CLR1 X.bit BF PSWL.bit BT PSWH.bit BTCLR mem2.bit BFSET !addr16.bit !!addr24.bit
Note
Note Either the second operand is not used, or the second operand is not an
operand address.
Data Sheet U12376EJ1V0DS00
59
µ
PD784224, 784225, 784224Y, 784225Y
(5) Call and return/branch instructions
CALL, CALLF, CALLT, BRK, RET, RETI, RETB, RETCS, RETCSB, BRKCS, BR, BNZ, BNE, BZ, BE, BNC, BNL, BC, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, BH, BF, BT, BTCLR, BFSET, DBNZ
Table 13-5. Call and Return/Branch Instructions
Operand of Instruction $addr20 Address
Basic instruction BC
Compound instruction BF
$!addr20
!addr16 !!addr20 rp rg [rp] [rg] !addr11 [addr5] RBn None
Note
CALL CALL CALL CALL CALL CALL CALL CALLF CALLF BRKCS BRK
BR BR BR BR BR BR BR BR RET
RETCS RETI RETCSB
BT BTCLR BFSET DBNZ
RETB
Note The operands of BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT,
BNH, and BH are the same as BC.
(6) Other instructions
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT, EI, DI, SWRS
60
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

14. ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings (TA = 25°C)
Parameter Symbol Conditions Ratings Unit
Supply voltage VDD0 0.3 to +6.5 V
AVDD 0.3 to VDD0 + 0.3 V AVSS 0.3 to VSS0 + 0.3 V
AVREF1 D/A converter reference voltage input 0.3 to VDD0 + 0.3 V Input voltage VI 0.3 to VDD0 + 0.3 V Analog input voltage VAN Analog input pin AVSS 0.3 to AVREF1 + 0.3 V Output voltage VO 0.3 to VDD + 0.3 V Output current, low IOL Per pin 15 mA
Total of all pins 100 mA
Output current, high IOH Per pin 10 mA
Total of all pins 40 mA
Operating ambient TA 40 to +85 °C temperature
Storage temperature Tstg 65 to +150 °C
Caution Absolute maximum ratings are rated values beyond which physical damage will be caused to the
product; if the rated value of any of the parameters in the above table is exceeded, even momentarily, the quality of the product may deteriorate. Always use the product within its rated values.
Data Sheet U12376EJ1V0DS00
61
Operating Conditions
µ
PD784224, 784225, 784224Y, 784225Y
Operating ambient temperature (T
A): 40°C to +85°C
Power supply voltage and clock cycle time: see Figure 14-1
Operating voltage when the subsystem clock is operating: VDD = 1.8 to 5.5 V
Figure 14-1. Power Supply Voltage and Clock Cycle Time (CPU Clock Frequency: f
10,000
8,000
500
400
[ns]
CYK
320 300
Guaranteed
operation range
CPU)
Clock cycle time t
200 160
100
80
0
01231.8 2.7 4.5 5.5
Supply voltage [V]
456
Capacitance (TA = 25°C, VDD = VDD0 = VDD1 = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit Input capacitance CI f = 1 MHz 15 pF Output capacitance CO I/O capacitance CIO 15 pF
Unmeasured pins returned to 0 V.
15 pF
62
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Main System Clock Oscillator Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1)
Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit
Ceramic Oscillation frequency (fX) 4.5 V VDD 5.5 V 2 12.5 MHz resonator or crystal resonator
External X1 input frequency (fX) 4.5 V VDD 5.5 V 2 12.5 MHz clock
X2 X1 V
X2 X1
µ
PD74HCU04
SS
X1 input high-/low- 15 250 ns level width (tWXH, tWXL)
X1 input rising/falling 4.5 V VDD 5.5 V 0 5 ns time (tXR, tXF)
2.7 V VDD < 4.5 V 2 6.25
2.0 V VDD < 2.7 V 2 3.125
1.8 V VDD < 2.0 V 2 2
2.7 V VDD < 4.5 V 2 6.25
2.0 V VDD < 2.7 V 2 3.125
1.8 V VDD < 2.0 V 2 2
2.7 V VDD < 4.5 V 0 10
2.0 V VDD < 2.7 V 0 20
1.8 V VDD < 2.0 V 0 30
Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the
broken lines in the above figures to avoid an adverse effect from wiring capacitance.
Keep the wiring length as short as possible.
Do not cross the wiring with the other signal lines.
Do not route the wiring near a signal line through which a high fluctuating current flows.
Always make the ground point of the oscillator capacitor the same potential as V
SS.
Do not ground the capacitor to a ground pattern through which a high current flows.
Do not fetch signals from the oscillator.
2. When the main system clock is stopped and the device is operating on the subsystem clock, wait until the oscillation stabilization time has been secured by the program before switching back to the main system clock.
Remark For the resonator selection and oscillator constant, customers are required to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
Data Sheet U12376EJ1V0DS00
63
µ
PD784224, 784225, 784224Y, 784225Y
Subsystem Clock Oscillator Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1)
Resonator Recommended Circuit Parameter Conditions MIN. TYP. MAX. Unit Crystal Oscillation frequency (fXT)32
resonator
VSSXT2 XT1
Oscillation stabilization 4.5 V VDD 5.5 V 1.2 2 s
Note
time
1.8 V VDD < 4.5 V 10
32.768
35 kHz
External XT1 input frequency (fXT) 32 35 kHz clock
XT2 XT1
µ
PD74HCU04
XT1 input high-/low-level 14.3 15.6 width (tXTH, tXTL)
µ
s
Note Time required to stabilize oscillation after applying supply voltage (VDD).
Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
Keep the wiring length as short as possible.
Do not cross the wiring with the other signal lines.
Do not route the wiring near a signal line through which a high fluctuating current flows.
Always make the ground point of the oscillator capacitor the same potential as V
SS.
Do not ground the capacitor to a ground pattern through which a high current flows.
Do not fetch signals from the oscillator.
2. When the main system clock is stopped and the device is operating on the subsystem clock, wait until the oscillation stabilization time has been secured by the program before switching back to the main system clock.
Remark For the resonator selection and oscillator constant, customers are required to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
64
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
DC Characteristics
(TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V) (1/2)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input voltage, low VIL1 Note 1 2.2 V VDD 5.5 V 0 0.3VDD V
1.8 V VDD < 2.2 V 0 0.2VDD
VIL2 P00 to P05, P20, P22, P33, 2.2 V VDD 5.5 V 0 0.2VDD V
P34, P70, P72, RESET
VIL4 P10 to P17, P130, P131 2.2 V VDD 5.5 V 0 0.3VDD V
VIL5 X1, X2, XT1, XT2 2.2 V VDD 5.5 V 0 0.2VDD V
VIL6 P25, P27 2.2 V VDD 5.5 V 0 0.3VDD V
Input voltage, high VIH1 Note 1 2.2 V VDD 5.5 V 0.7VDD VDD V
VIH2 P00 to P05, P20, P22, P33, 2.2 V VDD 5.5 V 0.8VDD VDD V
P34, P70, P72, RESET
VIH4 P10 to P17, P130, P131 2.2 V VDD 5.5 V 0.7VDD VDD V
VIH5 X1, X2, XT1, XT2 2.2 V VDD 5.5 V 0.8VDD VDD V
VIH6 P25, P27 2.2 V VDD 5.5 V 0.7VDD VDD V
Output voltage, low VOL1 For pins other than 4.5 V VDD 5.5 V 0.4 V
P40 to P47, P50 to P57, IOL = 1.6 mA
P40 to P47, P50 to P57 4.5 V VDD 5.5 V 1.0 V IOL = 8 mA
VOL2 IOL = 400 µA
Output voltage, high VOH1 IOH = 1 mA
IOH = 100 µA
Input leakage current, ILIL1 VIN = 0 V Except X1, X2, 3 low XT1, XT2
ILIL2 X1, X2, XT1, XT2 20µA
Input leakage current, ILIH1 VIN = VDD0 Except X1, X2, 3 high XT1, XT2
ILIH2 X1, X2, XT1, XT2 20
Output leakage current, ILOL1 VOUT = 0 V 3 low
Output leakage current, ILOH1 VOUT = VDD 3 high
Note 2
Note 2
Note 2
Note 2
Note 2
1.8 V VDD < 2.2 V 0
1.8 V VDD < 2.2 V 0 0.2VDD
1.8 V VDD < 2.2 V 0 0.1VDD
1.8 V VDD < 2.2 V 0 0.2VDD
1.8 V VDD < 2.2 V 0.8VDD VDD
1.8 V VDD < 2.2 V
1.8 V VDD < 2.2 V 0.8VDD VDD
1.8 V VDD < 2.2 V
1.8 V VDD < 2.2 V 0.8VDD VDD
4.5 V VDD 5.5 V
0.85VDD
0.85VDD
VDD 1.0 VDD 0.5
0.15VDD
VDD
VDD
0.5 V V V
µ
A
µ
A
µ
A
µ
A
µ
A
Notes 1. P21, P23, P24, P26, P30 to P32, P35 to P37, P40 to P47, P50 to P57, P60 to P67, P71, P80 to P87,
P120 to P127
2. Per pin
Data Sheet U12376EJ1V0DS00
65
µ
PD784224, 784225, 784224Y, 784225Y
DC Characteristics
(TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V) (2/2)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Supply voltage IDD1 Operation fXX = 12.5 MHz, VDD = 5.0 V ±10% 17 40 mA
mode
IDD2 HALT mode fXX = 12.5 MHz, VDD = 5.0 V ±10% 7 20 mA
IDD3 IDLE mode fXX = 12.5 MHz, VDD = 5.0 V ±10% 1 2.5 mA
IDD4 Operation fXX = 32 kHz, VDD = 5.0 V ±10% 80 200µA
Note
mode
IDD5 HALT fXX = 32 kHz, VDD = 5.0 V ±10% 60 160µA
Note
mode
IDD6 IDLE fXX = 32 kHz, VDD = 5.0 V ±10% 50 150µA
Note
mode
Data retention voltage VDDDR HALT, IDLE modes 1.8 5.5 V Data retention current IDDDR STOP mode VDD = 2.0 V ±10% 2 10
Pull-up resistor RL VIN = 0 V 10 30 100 k
fXX = 6 MHz, VDD = 3.0 V ±10% 5 17 mA fXX = 2 MHz, VDD = 2.0 V ±10% 2 8 mA
fXX = 6 MHz, VDD = 3.0 V ±10% 2 8 mA fXX = 2 MHz, VDD = 2.0 V ±10% 0.5 3.5 mA
fXX = 6 MHz, VDD = 3.0 V ±10% 0.4 1.3 mA fXX = 2 MHz, VDD = 2.0 V ±10% 0.2 0.9 mA
fXX = 32 kHz, VDD = 3.0 V ±10% 60 110 fXX = 32 kHz, VDD = 2.0 V ±10% 30 100
fXX = 32 kHz, VDD = 3.0 V ±10% 20 80 fXX = 32 kHz, VDD = 2.0 V ±10% 10 70
fXX = 32 kHz, VDD = 3.0 V ±10% 15 70 fXX = 32 kHz, VDD = 2.0 V ±10% 5 60
VDD = 5.0 V ±10% 10 50
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
Note When main system clock is stopped.
Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port
pins.
66
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
AC Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
(1) Read/write operation (1/3)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Cycle time tCYK 4.5 V VDD 5.5 V 80 ns
2.7 V VDD < 4.5 V 160 ns
2.0 V VDD < 2.7 V 320 ns
1.8 V VDD < 2.0 V 500 ns
Address setup time tSAST VDD = 5.0 V ±10% (0.5 + a) T 20 ns (to ASTB)
Address hold time tHSTLA VDD = 5.0 V ±10% 0.5T 19 ns (from ASTB)
ASTB high-level width tWSTH VDD = 5.0 V ±10% (0.5 + a) T 17 ns
Address hold time tHRA VDD = 5.0 V ±10% 0.5T 14 ns (from RD)
Delay time from address to tDAR VDD = 5.0 V ±10% (1 + a) T 24 ns RD
Address float time tFAR VDD = 5.0 V ±10% 0 ns (from RD)
Data input time from tDAID VDD = 5.0 V ±10% (2.5 + a + n) T 37 ns address
Data input time from ASTB tDSTID VDD = 5.0 V ±10% (2 + n) T 35 ns
Data input time from RD tDRID VDD = 5.0 V ±10% (1.5 + n) T 40 ns
VDD = 3.0 V ±10% (0.5 + a) T 40 ns VDD = 2.0 V ±10% (0.5 + a) T 80 ns
VDD = 3.0 V ±10% 0.5T 24 ns VDD = 2.0 V ±10% 0.5T 34 ns
VDD = 3.0 V ±10% (0.5 + a) T 40 ns VDD = 2.0 V ±10% (0.5 + a) T 110 ns
VDD = 3.0 V ±10% 0.5T 14 ns VDD = 2.0 V ±10% 0.5T 14 ns
VDD = 3.0 V ±10% (1 + a) T 35 ns VDD = 2.0 V ±10% (1 + a) T 80 ns
VDD = 3.0 V ±10% 0 ns VDD = 2.0 V ±10% 0 ns
VDD = 3.0 V ±10% (2.5 + a + n) T 52 ns VDD = 2.0 V ±10% (2.5 + a + n) T 120 ns
VDD = 3.0 V ±10% (2 + n) T 50 ns VDD = 2.0 V ±10% (2 + n) T 80 ns
VDD = 3.0 V ±10% (1.5 + n) T 50 ns VDD = 2.0 V ±10% (1.5 + n) T 90 ns
Remark T: tCYK = 1/fXX (fXX: Main system clock frequency)
a: 1 (during address wait), otherwise, 0 n: Number of wait states (n 0)
Data Sheet U12376EJ1V0DS00
67
µ
PD784224, 784225, 784224Y, 784225Y
AC Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
(1) Read/write operation (2/3)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Delay time from ASTB tDSTR VDD = 5.0 V ±10% 0.5T 9ns to RD
Data hold time (from RD)tHRID VDD = 5.0 V ±10% 0 ns
Address active time from tDRA VDD = 5.0 V ±10% 0.5T 2ns RD
Delay time from RD to tDRST VDD = 5.0 V ±10% 0.5T 9ns ASTB
RD low-level width tWRL VDD = 5.0 V ±10% (1.5 + n) T 25 ns
Delay time from address to tDAW VDD = 5.0 V ±10% (1 + a) T 24 ns WR
Address hold time tHRD VDD = 5.0 V ±10% 0.5T 14 ns (from WR)
Delay time from ASTB to tDSTOD VDD = 5.0 V ±10% 0.5T + 15 ns data output
Delay time from WR to tDWOD VDD = 5.0 V ±10% 0.5T 30 ns data output
Delay time from ASTB to tDSTW VDD = 5.0 V ±10% 0.5T 9ns WR
Data setup time (to WR)tSODWR VDD = 5.0 V ±10% (1.5 + n) T 20 ns
VDD = 3.0 V ±10% 0.5T 9ns VDD = 2.0 V ±10% 0.5T 20 ns
VDD = 3.0 V ±10% 0 ns VDD = 2.0 V ±10% 0 ns
VDD = 3.0 V ±10% 0.5T 12 ns VDD = 2.0 V ±10% 0.5T 35 ns
VDD = 3.0 V ±10% 0.5T 9ns VDD = 2.0 V ±10% 0.5T 40 ns
VDD = 3.0 V ±10% (1.5 + n) T 30 ns VDD = 2.0 V ±10% (1.5 + n) T 25 ns
VDD = 3.0 V ±10% (1 + a) T 34 ns VDD = 2.0 V ±10% (1 + a) T 70 ns
VDD = 3.0 V ±10% 0.5T 14 ns VDD = 2.0 V ±10% 0.5T 14 ns
VDD = 3.0 V ±10% 0.5T + 30 ns VDD = 2.0 V ±10% 0.5T + 240 ns
VDD = 3.0 V ±10% 0.5T 30 ns VDD = 2.0 V ±10% 0.5T 30 ns
VDD = 3.0 V ±10% 0.5T 9ns VDD = 2.0 V ±10% 0.5T 20 ns
VDD = 3.0 V ±10% (1.5 + n) T 25 ns VDD = 2.0 V ±10% (1.5 + n) T 70 ns
Remark T: tCYK = 1/fXX (fXX: Main system clock frequency)
a: 1 (during address wait), otherwise, 0 n: Number of wait states (n 0)
68
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
AC Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
(1) Read/write operation (3/3)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Data hold time (from WR)tHWOD VDD = 5.0 V ±10% 0.5T 14 ns
VDD = 3.0 V ±10% 0.5T 14 ns VDD = 2.0 V ±10% 0.5T 50 ns
Delay time from WR to tDWST VDD = 5.0 V ±10% 0.5T 9ns ASTB
WR low-level width tWWL VDD = 5.0 V ±10% (1.5 + n) T 25 ns
VDD = 3.0 V ±10% 0.5T 9ns VDD = 2.0 V ±10% 0.5T 30 ns
VDD = 3.0 V ±10% (1.5 + n) T 30 ns VDD = 2.0 V ±10% (1.5 + n) T 30 ns
Remark T: tCYK = 1/fXX (fXX: Main system clock frequency)
a: 1 (during address wait), otherwise, 0 n: Number of wait states (n 0)
Data Sheet U12376EJ1V0DS00
69
µ
PD784224, 784225, 784224Y, 784225Y
AC Characteristics (TA = 40°C to +85°C, VDD = V
DD0
= V
DD1
= AVDD = 1.8 to 5.5 V, VSS = V
SS0
= V
SS1
= AVSS = 0 V)
(2) External wait timing (1/2)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input time from address to tDAWT VDD = 5.0 V ±10% (2 + a) T 40 ns WAIT
Input time from ASTB to tDSTWT VDD = 5.0 V ±10% 1.5T 40 ns WAIT
Hold time from ASTB to tHSTWT VDD = 5.0 V ±10% (0.5 + n) T + 5 ns WAIT
Delay time from ASTB to tDSTWTH VDD = 5.0 V ±10% (1.5 + n) T 40 ns WAIT
Input time from RD to tDRWTL VDD = 5.0 V ±10% T 40 ns WAIT
Hold time from RD to tHRWT VDD = 5.0 V ±10% nT + 5 ns WAIT
Delay time from RD to tDRWTH VDD = 5.0 V ±10% (1 + n) T 40 ns WAIT
Input time from WAIT to tDWTID VDD = 5.0 V ±10% 0.5T 5ns data
Delay time from WAIT to tDWTR VDD = 5.0 V ±10% 0.5T ns RD
Delay time from WAIT to tDWTW VDD = 5.0 V ±10% 0.5T ns WR
Delay time from WR to tDWWTL VDD = 5.0 V ±10% T 40 ns WAIT
VDD = 3.0 V ±10% (2 + a) T 60 ns VDD = 2.0 V ±10% (2 + a) T 300 ns
VDD = 3.0 V ±10% 1.5T 60 ns VDD = 2.0 V ±10% 1.5T 260 ns
VDD = 3.0 V ±10% (0.5 + n) T + 10 ns VDD = 2.0 V ±10% (0.5 + n) T + 30 ns
VDD = 3.0 V ±10% (1.5 + n) T 60 ns VDD = 2.0 V ±10% (1.5 + n) T 90 ns
VDD = 3.0 V ±10% T 60 ns VDD = 2.0 V ±10% T 70 ns
VDD = 3.0 V ±10% nT + 10 ns VDD = 2.0 V ±10% nT + 30 ns
VDD = 3.0 V ±10% (1 + n) T 60 ns VDD = 2.0 V ±10% (1 + n) T 90 ns
VDD = 3.0 V ±10% 0.5T 10 ns VDD = 2.0 V ±10% 0.5T 30 ns
VDD = 3.0 V ±10% 0.5T ns VDD = 2.0 V ±10% 0.5T + 5 ns
VDD = 3.0 V ±10% 0.5T ns VDD = 2.0 V ±10% 0.5T + 5 ns
VDD = 3.0 V ±10% T 60 ns VDD = 2.0 V ±10% T 90 ns
Remark T: tCYK = 1/fXX (fXX: Main system clock frequency)
a: 1 (during address wait), otherwise, 0 n: Number of wait states (n 0)
70
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(2) External wait timing (2/2)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Hold time from WR to tHWWT VDD = 5.0 V ±10% nT + 5 ns WAIT
Delay time from WR to tDWWTH VDD = 5.0 V ±10% (1 + n) T 40 ns WAIT
Remark T: tCYK = 1/fXX (fXX: Main system clock frequency)
a: 1 (during address wait), otherwise, 0 n: Number of wait states (n 0)
VDD = 3.0 V ±10% nT + 10 ns VDD = 2.0 V ±10% nT + 30 ns
VDD = 3.0 V ±10% (1 + n) T 60 ns VDD = 2.0 V ±10% (1 + n) T 90 ns
Data Sheet U12376EJ1V0DS00
71
µ
PD784224, 784225, 784224Y, 784225Y
Serial Operation (TA = 40°C to +85°C, VDD = V
DD0
= V
DD1
= AVDD = 1.8 to 5.5 V, VSS = V
SS0
= V
SS1
= AVSS = 0 V)
(a) 3-wire serial I/O mode (SCK: Internal clock output)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
SCK cycle time tKCY1 2.7 V VDD 5.5 V 800 ns
3,200 ns
SCK high-/low-level tKH1, 2.7 V VDD 5.5 V 350 ns width tKL1
SI setup time (to SCK)tSIK1 2.7 V VDD 5.5 V 10 ns
SI hold time (from SCK) SO output delay time tKSO1 30 ns
(from SCK)
tKSI1 40 ns
1,500 ns
30 ns
(b) 3-wire serial I/O mode (SCK: External clock input)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
SCK cycle time tKCY2 2.7 V VDD 5.5 V 800 ns
3,200 ns
SCK high-/low-level tKH2 2.7 V VDD 5.5 V 400 ns width tKL2
SI setup time (to SCK)tSIK2 2.7 V VDD 5.5 V 10 ns
SI hold time (from SCK) SO output delay time tKSO2 30 ns
(from SCK)
tKSI2 40 ns
1,600 ns
30 ns
(c) UART mode
Parameter Symbol Conditions MIN. TYP. MAX. Unit
ASCK cycle time tKCY3 4.5 V VDD 5.5 V 417 ns
2.7 V VDD < 4.5 V 833 ns 1,667 ns
ASCK high-/low-level tKH3 4.5 V VDD 5.5 V 208 ns width tKL3
72
2.7 V VDD < 4.5 V 416 ns
833 ns
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(d) I2C bus mode (µPD784225Y only)
Parameter Symbol Standard Mode High-Speed Mode Unit
MIN. MAX. MIN. MAX. SCL0 clock frequency fCLK 0 100 0 400 kHz Bus free time (between stop tBUF 4.7 1.3
and start conditions) Hold time Low-level width of SCL0 tLOW 4.7 1.3
clock High-level width of SCL0 tHIGH 4.0 0.6
clock Setup time of start/restart tSU : STA 4.7 0.6
conditions Data hold When using tHD : DAT 5.0 −−−
time
Data setup time tSU : DAT 250 100 Rising time of SDA0 and tR 1,000 20 + 0.1Cb
SCL0 signals Falling time of SDA0 and tF 300 20 + 0.1Cb
SCL0 signals Setup time of stop condition t SU : STO 4.0 0.6 Pulse width of spike tSP −−050ns
restricted by input filter Load capacitance of each Cb 400 400 pF
bus line
Note1
CBUS-compatible master
When using I2C0 bus
tHD : STA 4.0 0.6
Note 2
0
Note 2
Note 4
Note 5
Note 5
Note 3
0.9
ns
300 ns
300 ns
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Notes 1. For the start condition, the first clock pulse is generated after the hold time.
2. To fill the undefined area of the SCL0 falling edge, it is necessary for the device to provide an internal
SDA0 signal (on V
IHmin.) with at least 300 ns of hold time.
3. If the device does not extend the SCL0 signal low-level hold time (t LOW), only the maximum data hold time tHD : DAT needs to be satisfied.
2
4. The high-speed mode I
C bus can be used in a standard mode I2C bus system. In this case, the
conditions described below must be satisfied.
If the device does not extend the SCL0 signal low-level hold time
SU : DAT 250 ns
t
If the device extends the SCL0 signal low-level hold time
Be sure to transmit the data bit to the SDA0 line before the SCL0 line is released (tRmax. + tSU : DAT =
2
1,000 + 250 = 1,250 ns by standard mode I
C bus specification)
5. Cb: Total capacitance per bus line (unit: pF)
Data Sheet U12376EJ1V0DS00
73
µ
PD784224, 784225, 784224Y, 784225Y
Other Operations (TA = 40°C to +85°C, VDD = V
Parameter Symbol Conditions MIN. TYP. MAX. Unit
NMI high-/low-level tWNIL 10 width tWNIH
INTP input high-/low- tWITL INTP0 to INTP6 100 ns level width t WITH
RESET high-/low-level tWRSL 10 width t WRSH
DD0
= V
DD1
= AVDD = 1.8 to 5.5 V, VSS = V
SS0
= V
SS1
= AVSS = 0 V)
Clock Output Operation
A = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
(T
Parameter Symbol Conditions MIN. TYP. MAX. Unit PCL cycle time tCYCL 4.5 V VDD 5.5 V, nT 80 31,250 ns PCL high-/low-level tCLL 4.5 V VDD 5.5 V, 0.5T − 10 30 15,615 ns
width tCLH PCL rising/falling time tCLR 4.5 V VDD 5.5 V 5 ns
tCLF
2.7 V VDD < 4.5 V 10 ns
1.8 V VDD < 2.7 V 20 ns
µ
s
µ
s
Remark T: tCYK = 1/fXX (fXX: Main system clock frequency)
n: Divided frequency ratio set by software in the CPU
When using the main system clock: n = 1, 2, 4, 8, 16, 32, 64, 128
When using the subsystem clock: n = 1
74
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
A/D Converter Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit Resolution 888bit Overall error
Conversion time tCONV 14 144 Sampling time tSAMP 24/fXX Analog input voltage VIAN AVSS AVDD V Reference voltage AVDD VDD VDD VDD V Resistance between RAVREF0 A/D conversion is not performed 40 k
AVDD and AVSS
Note
6.25 MHz < fXX 12.5 MHz, ±1.2 %FSR
4.5 V VDD 5.5 V, AVDD = VDD0
3.125 MHz < fXX 6.25 MHz, ±1.2 %FSR
2.7 V VDD 5.5 V, AVDD = VDD0 2 MHz < fXX 3.125 MHz, ±1.6 %FSR
2.0 V VDD 5.5 V, AVDD = VDD0 fXX = 2 MHz, 1.8 V VDD 5.5 V ±1.6 %FSR
AVDD = VDD0
µ
s
µ
s
Note Excludes quantization error (±0.2%FSR).
Remark FSR: Full-scale range
D/A Converter Characteristics
A = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
(T
Parameter Symbol Conditions MIN. TYP. MAX. Unit Resolution 888bit Overall error
Settling time Load conditions: 4.5 V AVREF1 5.5 V 10
Output resistance RO DACS0, 1 = 55H 8 k Reference voltage AVREF1 1.8 VDD0 V AVREF1 current AIREF1 For only 1 channel 2.5 mA
Note
2.0 V VDD 5.5 V ±0.6 %FSR R = 10 M, 2.0 V AVREF1 5.5 V
1.8 V VDD 2.0 V ±1.2 %FSR R = 10 M, 1.8 V AVREF1 5.5 V
µ
s
C = 30 pF
2.7 V AVREF1 < 4.5 V 15
1.8 V AVREF1 < 2.7 V 20
µ
s
µ
s
Note Excludes quantization error (±0.2%FSR).
Remark FSR: Full-scale range
Data Sheet U12376EJ1V0DS00
75
µ
PD784224, 784225, 784224Y, 784225Y
Data Retention Characteristics (TA = 40°C to +85°C, VDD = VDD0 = VDD1 = AVDD = 1.8 to 5.5 V, VSS = VSS0 = VSS1 = AVSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit Data retention voltage VDDDR STOP mode 1.8 5.5 V Data retention current IDDDR VDDDR = 5.0 V ±10% 10 50
VDDDR = 2.0 V ±10% 2 10 VDD rise time tRVD 200 VDD fall time tFVD 200 VDD hold time (from tHVD 0ms
STOP mode setting) STOP release signal tDREL 0ms
input time Oscillation stabilization tWAIT Crystal resonator 30 ms
wait time Low-level input voltage VIL RESET, P00/INTP0 to P06/INTP6 0
High-level input voltage VIH
Ceramic resonator 5 ms
0.1VDDDR
0.9VDDDR
VDDDR V
µ
A
µ
A
µ
s
µ
s
V
AC Timing Measurement Points
DD
1 V
V
0.45 V
0.8VDD or 1.8 V
0.8 V
Points of
measurement
0.8VDD or 1.8 V
0.8 V
76
Data Sheet U12376EJ1V0DS00
Timing Waveform
(1) Read operation
(CLK)
t
CYK
µ
PD784224, 784225, 784224Y, 784225Y
A0 to A7
(Output)
A8 to A19
(Output)
AD0 to AD7
(Input/output)
ASTB
(Output)
RD (Output)
WAIT
(Input)
Lower address Lower address
Higher address
t
DAID
t
DSTID
Hi-Z Hi-Z Hi-Z
Lower address (Output)
t
SAST
t
WSTH
t
DAWT
t
DAR
t
HSTLA
t
DSTR
t
DRWTL
t t t
DSTWT DSTWTH HSTWT
Data (Input)
t
HRID
t
FAR
t
DRID
t
WRL
t
DRWTH
t
HRWT
t
DWTID
t
DWTR
t
t
HRA
t
DRA
DRST
Higher address
Lower address (Output)
Data Sheet U12376EJ1V0DS00
77
(2) Write operation
(CLK)
µ
PD784224, 784225, 784224Y, 784225Y
t
CYK
A0 to A7
(Output)
A8 to A19
(Output)
AD0 to AD7
(Output)
ASTB
(Output)
WR
(Output)
WAIT
(Input)
Lower address Lower address
Higher address Higher address
t
DAID
t
DSTOD
Hi-Z Hi-Z Hi-Z
Lower address (Output)
t
SAST
t
WSTH
t
DAWT
t
DAW
t
HSTLA
t
DSTW
t
DWWTL
t t t
DSTWT DSTWTH HSTWT
t
FAR
t
DWOD
t
DWWTH
t
HWWT
t
WWL
Data (Output)
t
HWOD
t
SODWR
t
DWTW
t
DWTID
t
t
HWA
t
DAW
DWST
Lower address (Output)
78
Data Sheet U12376EJ1V0DS00
Serial Operation
(1) 3-wire serial I/O mode
SI/SO
(2) UART mode
ASCK
SCK
µ
PD784224, 784225, 784224Y, 784225Y
t
t
KSO1, 2
t
KSI1, 2
KCY1, 2
t
KL1, 2
t
SIK1, 2
t
KH1, 2
t
KCY3
t
KH3
t
KL3
(3) I2C bus mode (µPD784255Y Subseries only)
LOW
SCL0
SDA0
Stop condition
t
BUF
t
HD : STA
Start condition
t
t
HD : DAT
t
R
t
HIGH
t
SU : DAT
t
F
t
SU : STA
Restart condition
t
HD : STA
t
SP
Stop condition
t
SU : STO
Data Sheet U12376EJ1V0DS00
79
Clock Output Timing
CLKOUT
Interrupt Input Timing
NMI
µ
PD784224, 784225, 784224Y, 784225Y
t
CLH
t
CLR
t
CYCL
t
WNIH
t
CLL
t
CLF
t
WNIL
INTP0 to INTP6
Reset Input Timing
RESET
t
WRSH
t
WITH
t
WRSL
t
WITL
80
Data Sheet U12376EJ1V0DS00
Clock Timing
X1
XT1
µ
PD784224, 784225, 784224Y, 784225Y
t
WXH
t
XR
1/f
X
t
XTH
1/f
XT
t
WXL
t
XF
t
XTL
Data Retention Characteristics
STOP mode setting
V
DD
t
HVD
RESET
NMI (Cleared by falling edge)
NMI (Cleared by rising edge)
t
FVD
V
DDDR
t
RVD
t
DREL
t
WAIT
Data Sheet U12376EJ1V0DS00
81

15. PACKAGE DRAWINGS

80-PIN PLASTIC QFP (14x14)
µ
PD784224, 784225, 784224Y, 784225Y
A
B
4160
4061
detail of lead end
S
C D
R
Q
2180
201
F
G
H
M
I
P
SN
NOTE
Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition.
J
K
S
L
M
ITEM MILLIMETERS
A
17.20±0.20
B
14.00±0.20 C 14.00±0.20 D
17.20±0.20 F 0.825 G
0.825 H 0.32±0.06
0.13
I
J
0.65 (T.P.) K
1.60±0.20 L
0.80±0.20
M 0.17
N 0.10
P
Q R3 S 1.70 MAX.
+0.03
0.07
1.40±0.10
0.125±0.075
+7
3
P80GC-65-8BT-1
82
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
80-PIN PLASTIC TQFP (FINE PITCH) (12x12)
A B
60 41
61
40
detail of lead end
80
21
120
F
G
H
M
I
K
N
S
NOTE
Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition.
CD
P
T
S
R
L
U
Q
J
S
M
ITEM MILLIMETERS
A 14.0±0.2 B 12.0±0.2 C 12.0±0.2 D
14.0±0.2 F 1.25 G
1.25 H 0.22±0.05
I 0.08
J 0.5 (T.P.)
K
1.0±0.2
L 0.5
M
0.145±0.05 N 0.08 P
1.0 Q 0.1±0.05
R S 1.1±0.1
T 0.25 U 0.6±0.15
+4
3
3
P80GK-50-9EU-1
Data Sheet U12376EJ1V0DS00
83
µ
PD784224, 784225, 784224Y, 784225Y

16. RECOMMENDED SOLDERING CONDITIONS

The µPD784225 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
µ
Caution Soldering conditions for the
×××-9EU are undetermined because these products are under development.
Table 16-1. Soldering Conditions for Surface Mount Type
PD784225GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
(1)
Soldering Method Soldering Conditions Recommended
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or IR35-00-2
higher), Count: Two times or less, Exposure limit: 7 days prebake at 125°C for 20 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or VP15-00-2
higher), Count: Two times or less, Exposure limit: 7 days prebake at 125°C for 20 hours)
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature) Exposure limit: 7 days
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
PD784224GC-×××-8BT, µPD784225YGC-×××-8BT, and µPD784225YGK-
Condition Symbol
Note
(after that,
Note
(after that,
Note
(after that, prebake at 125°C for 20 hours)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2)µPD784224GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (14 × 20 mm)
PD784225GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (14 × 20 mm)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or IR35-103-2
higher), Count: Two times or less, Exposure limit: 7 days prebake at 125°C for 20 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or VP15-103-2
higher), Count: Two times or less, Exposure limit: 7 days prebake at 125°C for 20 hours)
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note
Note
(after that,
(after that,
Caution Do not use different soldering methods together (except for partial heating).
84
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y

APPENDIX A. DEVELOPMENT TOOLS

The following development tools are available for system development using the µPD784225. Also see (5).
(1) Language Processing Software
RA78K4 Assembler package common to 78K/IV Series CC78K4 C compiler package common to 78K/IV Series DF784225 Device file common to µPD784225, 784225Y Subseries CC78K4-L C compiler library source file common to 78K/IV Series
(2) Flash Memory Writing Tools
Flashpro II Dedicated flash programmer for microcontroller incorporating flash memory (Part No.: FL-PR2), Flashpro III (Part No.: FL-PR3, PG-FP3)
FA-80GC Adapter for writing 80-pin plastic QFP (GC-8BT type) flash memory. FA-80GK Adapter for writing 80-pin plastic LQFP (GK-BE9 type) flash memory.
(3) Debugging Tools
• When IE-78K4-NS in-circuit emulator is used
IE-78K4-NS In-circuit emulator common to 78K/IV Series IE-70000-MC-PS-B Power supply unit for IE-78K4-NS IE-70000-98-IF-C Interface adapter used when PC-9800 series PC (except notebook type) is used as host
machine (C bus supported) IE-70000-CD-IF-A PC card and cable when notebook PC is used as host machine (PCMCIA socket supported) IE-70000-PC-IF-C Interface adapter when using IBM PC/ATTM or compatible as host machine (ISA bus
supported) IE-70000-PCI-IF Interface adapter when using PC that incorporates PCI bus as host machine IE-784225-NS-EM1 Emulation board to emulate µPD784225, 784225Y Subseries NP-100GF Emulation probe for 100-pin plastic QFP (GF-3BA type) NP-100GC Emulation probe for 100-pin plastic LQFP (GC-8EU type) EV-9200GF-100 Socket to be mounted on a target system board made for 100-pin plastic QFP (GF-3BA type) TGC-100SDW Conversion adapter to connect the NP-100GC and a target system board on which a 100-
pin plastic LQFP (GC-8EU type) can be mounted ID78K4-NS Integrated debugger for IE-78K4-NS SM78K4 System simulator common to 78K/IV Series DF784225 Device file common to µPD784225, 784225Y Subseries
Data Sheet U12376EJ1V0DS00
85
µ
PD784224, 784225, 784224Y, 784225Y
• When IE-784000-R in-circuit emulator is used
IE-784000-R In-circuit emulator common to 78K/IV Series IE-70000-98-IF-C Interface adapter used when PC-9800 series PC (except notebook type) is used as host
machine (C bus supported)
IE-70000-PC-IF-C Interface adapter when using IBM PC/AT or compatible as host machine (ISA bus
supported) IE-70000-PCI-IF Interface adapter when using PC that incorporates PCI bus as host machine IE-78000-R-SV3 Interface adapter and cable used when EWS is used as host machine IE-784225-NS-EM1 Emulation board to emulate µPD784225, 784225Y Subseries
IE-784218-R-EM1 IE-784000-R-EM Emulation board common to 78K/IV Series IE-78K4-R-EX3 Emulation probe conversion board necessary when using IE-784225-NS-EM1 on IE-
784000-R. Not necessary when IE-784216-R-EM1 is used. EP-78064GF-R Emulation probe for 100-pin plastic QFP (GF-3BA type) EP-78064GC-R Emulation probe for 100-pin plastic LQFP (GC-8EU type) EV-9200GF-100 Socket to be mounted on a target system board made for 100-pin plastic QFP (GF-3BA type) TGC-100SDW Conversion adapter to connect the NP-100GC and a target system board on which a 100-
pin plastic LQFP (GC-8EU type) can be mounted ID78K4 Integrated debugger for IE-784000-R SM78K4 System simulator common to 78K/IV Series DF784225 Device file common to µPD784225, 784225Y Subseries
(4) Real-time OS
RX78K/IV Real-time OS for 78K/IV Series MX78K4 OS for 78K/IV Series
86
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
(5) Cautions on Using Development Tools
• The ID78K4-NS, ID78K4, and SM78K4 are used in combination with the DF784225.
• The CC78K4 and RX78K/IV are used in combination with the RA78K4 and DF784218.
• The FL-PR2, FL-PR3, FA-100GF, FA-100GC, NP-100GF, and NP-100GC are products made by Naito Densei Machida Mfg. Co., Ltd. (TEL: +81-44-822-3813).
• The TGC-100SDW is a product made by TOKYO ELETECH CORPORATION. For further information, contact Daimaru Kogyo, Ltd. Tokyo Electronic Division (TEL: +81-3-3820-7112) Osaka Electronic Division (TEL: +81-6-6244-6672)
• For third-party development tools, see the 78K/IV Series Selection Guide (U13355E).
• The host machine and OS suitable for each software are as follows:
Host Machine PC EWS
[OS]
Software [Japanese/English Windows] NEWSTM (RISC) [NEWS-OSTM] RA78K4 CC78K4 ID78K4-NS – ID78K4 SM78K4 – RX78K/IV MX78K4
PC-9800 series [Windows] HP9000 series 700TM [HP-UXTM]
IBM PC/AT and compatibles SPARCstationTM [SunOSTM, SolarisTM]
Note
Note
Note
Note
Note DOS-based software
Data Sheet U12376EJ1V0DS00
87
µ
PD784224, 784225, 784224Y, 784225Y

APPENDIX B. RELATED DOCUMENTS

Documents related to device
Document Name Document No.
Japanese English
µ
PD784224, 784225, 784224Y, 784225Y Data Sheet U12376J This document
µ
PD78F4225, 78F4225Y Data Sheet U12377J Planned
µ
PD784225, 784225Y Subseries User’s Manual - Hardware Planned Planned
µ
PD784225Y Subseries Special Function Register Table Planned – 78K/IV Series User’s Manual - Instruction U10905J U10905E 78K/IV Series Instruction Table U10594J – 78K/IV Series Instruction Set U10595J – 78K/IV Series Application Note - Software Basics U10095J U10095E
Documents related to development tools (User’s Manuals)
Document Name Document No.
Japanese English
RA78K4 Assembler Package Operation U11334J U11334E
Language U11162J U11162E RA78K Series Structured Assembler Preprocessor U11743J U11743E CC78K4 C Compiler Operation U11572J U11572E
Language U11571J U11571E IE-78K4-NS U13356J U13356E IE-784000-R U12903J U12903E IE-784218-R-EM1 U12155J U12155E IE-784225-NS-EM1 U13742J U13742E EP-78064 EEU-934 EEU-1469 SM78K4 System Simulator - Windows Base Reference U10093J U10093E SM78K Series System Simulator
ID78K4-NS Integrated Debugger - PC Base Reference U12796J U12796E ID78K4 Integrated Debugger - Windows Base Reference U10440J U10440E ID78K4 Integrated Debugger - HP-UX, SunOS, Reference U11960J U11960E
NEWS-OS Base
External component
user open interface
specification
U10092J U10092E
Caution The contents of the above related documents are subject to change without notice. Be sure to
use the latest edition of a document for designing.
88
Data Sheet U12376EJ1V0DS00
µ
PD784224, 784225, 784224Y, 784225Y
Documents related to embedded software (User’s Manual)
Document Name Document No.
Japanese English
78K/IV Series Real-Time OS Basics U10603J U10603E
Installation U10604J U10604E Debugger U10364J
78K/IV Series OS MX78K4 Basics U11779J
Other documents
Document Name Document No.
Japanese English SEMICONDUCTOR SELECTION GUIDE Products & Packages (CD-ROM) Semiconductor Device Mounting Technology Manual C10535J C10535E Quality Grades on NEC Semiconductor Device C11531J C11531E NEC Semiconductor Device Reliability/Quality Control System C10983J C10983E Guide to Prevent Damage for Semiconductor Devices by Electrostatic C11892J C11892E
Discharge (ESD) Semiconductor Device Quality Control/Reliability Handbook C12769J MEI-1202 Guide for Products Related to Micro-Computer: Other Companies U11416J
X13769X
Caution The contents of the above related documents are subject to change without notice. Be sure to
use the latest edition of a document for designing.
Data Sheet U12376EJ1V0DS00
89
µ
PD784224, 784225, 784224Y, 784225Y
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
DD
pin should be connected to V being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
or GND with a resistor, if it is considered to have a possibility of
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Caution This product contains an I2C bus interface circuit.
When using the I guarantee the following only when the customer informs NEC of the use of the interface: Purchase of NEC I these components in an I Specification as defined by Philips.
IEBus is a trademark of NEC Corporation. Windows is a registered trademark or a trademark of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. NEWS and NEWS-OS are trademarks of Sony Corporation.
2
C bus interface, notify its use to NEC when ordering custom code. NEC can
2
C components conveys a license under the Philips I2C Patent Rights to use
2
C system, provided that the system conforms to the I2C Standard
90
Data Sheet U12376EJ1V0DS00
µ
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290
NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99
NEC Electronics (France) S.A.
Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829
J99.1
PD784224, 784225, 784224Y, 784225Y
Data Sheet U12376EJ1V0DS00
91
µ
PD784224, 784225, 784224Y, 784225Y
The related documents indicated in this publication may include preliminary versions. However, preliminary versions are not marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited without governmental license, the need for which must be judged by the customer. The export or re-export of this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
92
M7D 98. 12
Loading...