The µPD780031AY, 780032AY, 780033AY, and 780034AY are members of the µPD780034AY Subseries of the
78K/0 Series. This is a µPD780034A Subseries product with an added multimaster-supporting I2C bus interface, and
is suitable for AV equipment applications.
A flash memory version, the
ROM version, and various development tools, are available.
Detailed function descriptions are provided in the following user’s manuals. Be sure to read them before
designing.
P71/TI01
P70/TI00/TO0
P03/INTP3/ADTRG
P02/INTP2
P01/INTP1
P00/INTP0
V
SS1
X1
X2
IC
XT1
XT2
RESET
DD
AV
AV
REF
P10/ANI0
SS
P36
P20/SI30
P21/SO30
P24/TxD0
P23/RxD0
P22/SCK30
DD1
V
AV
P25/ASCK0
P17/ANI7
P16/ANI6
Cautions 1. Connect the IC (Internally Connected) pin directly to V
2. Connect the AVSS pin to VSS0.
Remark When the
µ
PD780031AY, 780032AY, 780033AY, and 780034AY are used in applications where the
noise generated inside the microcontroller needs to be reduced, the implementation of noise reduction
measures, such as supplying voltage to V
DD0 and VDD1 individually and connecting VSS0 and VSS1 to
different ground lines, is recommended.
8
Data Sheet U14045EJ1V0DS00
P15/ANI5
P14/ANI4
P13/ANI3
P12/ANI2
P11/ANI1
SS0 or VSS1.
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A8 to A15:Address Bus
AD0 to AD7:Address/Data Bus
ADTRG:AD Trigger Input
ANI0 to ANI7:Analog Input
ASCK0:Asynchronous Serial Clock
ASTB:Address Strobe
DD:Analog Power Supply
AV
AVREF:Analog Reference Voltage
SS:Analog Ground
AV
BUZ:Buzzer Clock
IC:Internally Connected
INTP0 to INTP3:External Interrupt Input
P00 to P03:Port 0
P10 to P17:Port 1
P20 to P25:Port 2
P30 to P36:Port 3
P40 to P47:Port 4
P50 to P57:Port 5
P64 to P67:Port 6
P70 to P75:Port 7
PCL:Programmable Clock
RD:Read Strobe
RESET:Reset
RxD0:Receive Data
SCK30, SCL0:Serial Clock
SDA0:Serial Data
SI30:Serial Input
SO30:Serial Output
TI00, TI01, TI50, TI51: Timer Input
TO0, TO50, TO51:Timer Output
TxD0:Transmit Data
DD0, VDD1:Power Supply
V
VSS0, VSS1:Ground
WAIT:Wait
WR:Write Strobe
X1, X2:Crystal (Main System Clock)
XT1, XT2:Crystal (Subsystem Clock)
Data Sheet U14045EJ1V0DS00
9
2. BLOCK DIAGRAM
µ
PD780031AY, 780032AY, 780033AY, 780034AY
TI00/TO0/P70
TI01/P71
TI50/TO50/P72
TI51/TO51/P73
SI30/P20
SO30/P21
SCK30/P22
RxD0/P23
TxD0/P24
ASCK0/P25
SDA0/P32
SCL0/P33
ANI0/P10 to
ANI7/P17
AV
AV
AV
REF
INTP0/P00 to
INTP3/P03
BUZ/P75
PCL/P74
16-BIT TIMER/
EVENT COUNTER
8-BIT TIMER/
EVENT COUNTER 50
8-BIT TIMER/
EVENT COUNTER 51
WATCHDOG TIMER
WATCH TIMER
SERIAL
INTERFACE 30
UART0
I2C BUS
DD
SS
A/D CONVERTER
INTERRUPT
CONTROL
BUZZER OUTPUT
CLOCK OUTPUT
CONTROL
78K/0
CPU CORE
RAM
V
DD0VDD1VSS0VSS1
ROM
IC
PORT 0
PORT 1
PORT 2
PORT 3
PORT 4
PORT 5
PORT 6
PORT 7P70 to P75
EXTERNAL
ACCESS
SYSTEM
CONTROL
P00 to P03
P10 to P17
P20 to P25
P30 to P36
P40 to P47
P50 to P57
P64 to P67
AD0/P40 to
AD7/P47
A8/P50 to
A15/P57
RD/P64
WR/P65
WAIT/P66
ASTB/P67
RESET
X1
X2
XT1
XT2
Remark The internal ROM and RAM capacities differ depending on the product.
10
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3. PIN FUNCTIONS
3.1 Port Pins (1/2)
Pin NameI/OFunctionAfterAlternate
ResetFunction
P00I/OPort 0InputINTP0
P01
P02
P03
P10 to P17InputPort 1InputANI0 to ANI7
P20I/OPort 2InputSI30
P21
P22
P23
P24TxD0
P25ASCK0
P30I/OPort 3N-ch open-drain input/output portInput—
P31
P32
P33
P34An on-chip pull-up resistor can be—
P35
P36
P40 to P47I/OPort 4InputAD0 to AD7
P50 to P57I/OPort 5InputA8 to A15
P64I/OPort 6InputRD
P65
P66
P67
4-bit input/output port
Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
8-bit input-only port
6-bit input/output port
Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
7-bit input/output portThe mask option can be used to specify the
Input/output can be
specified in 1-bit units. LEDs can be driven directly.
8-bit input/output port
Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
The interrupt request flag (KRIF) is set to 1 by falling edge detection.
8-bit input/output port
LEDs can be driven directly.
Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
4-bit input/output port
Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
connection of an on-chip pull-up resistor to P30, P31.
6-bit input/output port
Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
TI01
TI50/TO50
TI51/TO51
3.2 Non-Port Pins (1/2)
Pin NameI/OFunctionAfterAlternate
ResetFunction
INTP0InputExternal interrupt request input for which the valid edge (rising edge,InputP00
INTP1
INTP2P02
INTP3P03/ADTRG
SI30InputSerial interface serial data inputInputP20
SO30Output Serial interface serial data outputInputP21
SDA0I/OSerial interface serial data input/outputInputP32
SCK30I/OSerial interface serial clock input/outputInputP22
SCL0P33
RxD0InputSerial data input for asynchronous serial interfaceInputP23
TxD0Output Serial data output for asynchronous serial interfaceInputP24
ASCK0InputSerial clock input for asynchronous serial interfaceInputP25
TI00InputExternal count clock input to 16-bit timer (TM0)InputP70/TO0
TI01Capture trigger input to capture register (CR00) of 16-bit timer (TM0)P71
TI50External count clock input to 8-bit timer (TM50)P72/TO50
TI51External count clock input to 8-bit timer (TM51)P73/TO51
TO0Output 16-bit timer (TM0) outputInputP70/TI00
TO508-bit timer (TM50) output (also used for 8-bit PWM output)InputP72/TI50
TO518-bit timer (TM51) output (also used for 8-bit PWM output)P73/TI51
PCLOutput Clock output (for trimming of main system clock and subsystem clock)InputP74
BUZOutput Buzzer outputInputP75
AD0 to AD7I/OLower address/data bus for expanding memory externallyInputP40 to P47
A8 to A15Output Higher address bus for expanding memory externallyInputP50 to P57
RDOutput Strobe signal output for reading from external memoryInputP64
WRStrobe signal output for writing to external memoryP65
WAITInputWait insertion at external memory accessInputP66
ASTBOutput Strobe output that externally latches address information output toInputP67
falling edge, or both rising and falling edges) can be specified
Capture trigger input to capture register (CR01) of 16-bit timer (TM0)
ports 4 and 5 to access external memory
P01
12
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3.2 Non-Port Pins (2/2)
Pin NameI/OFunctionAfterAlternate
ResetFunction
ANI0 to ANI7 InputA/D converter analog inputInputP10 to P17
ADTRGInputA/D converter trigger signal inputInputP03/INTP3
AVREFInputA/D converter reference voltage input——
AVDD—A/D converter analog power supply. Set potential to that of VDD0 or VDD1.——
AVSS—A/D converter ground potential. Set potential to that of VSS0 or VSS1.——
RESETInputSystem reset input——
X1InputConnecting crystal resonator for main system clock oscillation——
X2———
XT1InputConnecting crystal resonator for subsystem clock oscillation——
XT2———
VDD0—Positive power supply for ports——
VSS0—Ground potential of ports——
VDD1—Positive power supply (except ports)——
VSS1—Ground potential (except ports)——
IC—Internally connected. Connect directly to VSS0 or VSS1.——
Data Sheet U14045EJ1V0DS00
13
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3.3 Pin I/O Circuits and Recommended Connection of Unused Pins
The input/output circuit type of each pin and recommended connection of unused pins are shown in Table 3-1.
For the input/output circuit configuration of each type, see Figure 3-1.
Table 3-1. Types of Pin Input/Output Circuits
Pin NameInput/OutputI/ORecommended Connection of Unused Pins
Circuit Type
P00/INTP0 to P02/INTP28-CInputIndependently connect to VSS0 via a resistor.
P03/INTP3/ADTRG
P10/ANI0 to P17/ANI725InputIndependently connect to VDD0 or VSS0 via a resistor.
P20/SI308-CI/O
P21/SO305-H
P22/SCK308-C
P23/RxD0
P24/TxD05-H
P25/ASCK08-C
P30, P3113-QI/OIndependently connect to VDD0 via a resistor.
P32/SDA013-R
P33/SCL0
P348-CIndependently connect to VDD0 or VSS0 via a resistor.
P355-H
P368-C
P40/AD0 to P47/AD75-HI/OIndependently connect to VDD0 via a resistor.
P50/A8 to P57/A15I/OIndependently connect to VDD0 or VSS0 via a resistor.
P64/RDI/O
P65/WR
P66/WAIT
P67/ASTB
P70/TI00/TO08-C
P71/TI01
P72/TI50/TO50
P73/TI51/TO51
P74/PCL5-H
P75/BUZ
RESET2Input—
XT116Connect to VDD0.
XT2—Leave open.
AVDD—Connect to VDD0.
AVREFConnect to VSS0.
AVSS
ICConnect directly to VSS0 or VSS1.
14
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 3-1. Pin Input/Output Circuits
TYPE 2
IN
Schmitt-triggered input with hysteresis characteristics
TYPE 5-H
Pullup
enable
Data
Output
disable
V
DD0
P-ch
N-ch
V
SS0
V
DD0
P-ch
IN/OUT
TYPE 13-R
Data
Output disable
TYPE 16
Feedback
cut-off
P-ch
V
IN/OUT
N-ch
SS0
Input
enable
TYPE 8-C
Pullup
enable
Data
Output
disable
TYPE 13-Q
Data
Output disable
V
DD0
P-ch
N-ch
V
Mask
option
SS0
N-ch
V
SS0
XT1XT2
TYPE 25
V
DD0
P-ch
P-ch
IN/OUT
Comparator
+
–
N-ch
V
SS0
REF
(threshold voltage)
V
IN
Input
enable
V
DD0
IN/OUT
Input
enable
Data Sheet U14045EJ1V0DS00
15
µ
PD780031AY, 780032AY, 780033AY, 780034AY
4. MEMORY SPACE
Figure 4-1 shows the memory map of the µPD780031AY, 780032AY, 780033AY, and 780034AY.
Figure 4-1. Memory Map
FFFFH
Special function registers
(SFRs) 256 × 8 bits
FF00H
FEFFH
FEE0H
FEDFH
General-purpose
registers
32 × 8 bits
Data memory
space
Program memory
space
mmmmH
mmmmH – 1
F800H
F7FFH
nnnnH + 1
nnnnH
0000H
Internal high-speed
External memory
Internal ROM
Note
RAM
Reserved
Note
nnnnH
Program area
1000H
0FFFH
CALLF entry area
0800H
07FFH
Program area
0080H
007FH
CALLT table area
0040H
003FH
Vector table area
0000H
NoteThe internal ROM and internal high-speed RAM capacities differ depending on the product (see the
following table).
16
Part NumberLast Address of Internal ROM
nnnnHmmmmH
µ
PD780031AY1FFFHFD00H
µ
PD780032AY3FFFH
µ
PD780033AY5FFFHFB00H
µ
PD780034AY7FFFH
Data Sheet U14045EJ1V0DS00
Start Address of Internal High-Speed RAM
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5. PERIPHERAL HARDWARE FUNCTION FEATURES
5.1 Ports
The following 3 types of I/O ports are available.
• CMOS input (Port 1):8
• CMOS input/output (Ports 0, 2 to 7, P34 to P36):39
• N-ch open-drain input/output (P30 to P33):4
Total:51
Table 5-1. Port Functions
NamePin NameFunction
Port 0P00 to P03I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
Port 1P10 to P17Dedicated input port pins.
Port 2P20 to P25I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
Port 3P30 to P33N-ch open-drain I/O port pins. Input/output can be specified in 1-bit units.
The mask option can be used to specify the connection of an on-chip pull-up resistor to P30, P31.
LEDs can be driven directly.
P34 to P36I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
Port 4P40 to P47I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
The interrupt request flag (KRIF) is set to 1 by falling edge detection.
Port 5P50 to P57I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
LEDs can be driven directly.
Port 6P64 to P67I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
Port 7P70 to P75I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
Data Sheet U14045EJ1V0DS00
17
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.2 Clock Generator
A system clock generator is incorporated.
The minimum instruction execution time can be changed.
µ
• 0.24
s/0.48 µs/0.95 µs/1.91 µs/3.81 µs (@ 8.38-MHz operation with main system clock)
• 122 µs (@ 32.768-kHz operation with subsystem clock)
Notes 1. The watch timer can perform both watch timer and interval timer functions at the same time.
2. The watchdog timer has watchdog timer and interval timer functions. However, use the watchdog timer
by selecting either the watchdog timer function or the interval timer function.
Data Sheet U14045EJ1V0DS00
19
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 5-2. Block Diagram of 16-Bit Timer/Event Counter TM0
Internal bus
TI01/P71
3
fX/2
TI00/TO0/P70
fX/2
fX/2
X
f
2
6
Noise
elimination
circuit
Noise
elimination
circuit
Selector
Noise
elimination
circuit
16-bit capture/compare
register 00 (CR00)
Selector
16-bit timer counter 0
(TM0)
16-bit capture/compare
register 01 (CR01)
Internal bus
Match
Match
Clear
Selector
Selector
Output
control
circuit
INTTM00
TO0/TI00/P70
INTTM01
20
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 5-3. Block Diagram of 8-Bit Timer/Event Counter TM50
Internal bus
TI50/TO50/P72
fX/2
fX/2
fX/2
fX/2
fX/2
TCL502 TCL501 TCL500
Timer clock select
register 50 (TCL50)
8-bit compare
register 50 (CR50)
f
X
2
4
6
8
10
8-bit timer counter
Selector
50 (TM50)
Match
OVF
Mask circuit
SelectorINTTM50
S
Q
INV
R
TO50/TI50/P72
Selector
Clear
3
Selector
TCE50
TMC506 TMC504
S
R
LVS50 LVR50
Invert
level
TMC501
TOE50
8-bit timer mode control
register 50 (TMC50)
Internal bus
Figure 5-4. Block Diagram of 8-Bit Timer/Event Counter TM51
Internal bus
TI51/TO51/P73
fX/2
fX/2
fX/2
fX/2
fX/2
fX/2
TCL512 TCL511 TCL510
Timer clock select
register 51 (TCL51)
8-bit compare
register 51
(CR51)
Selector
INTTM51
Match
3
5
7
9
11
Selector
8-bit timer
counter 51
(TM51)
Mask circuit
OVF
INV
S
Q
TO51/TI51/P73
R
Selector
Clear
3
Selector
TCE51
TMC516 TMC514
S
R
LVS51 LVR51
Invert
level
TMC511
TOE51
8-bit timer mode control
register 51 (TMC51)
Internal bus
Data Sheet U14045EJ1V0DS00
21
fX/2
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 5-5. Watch Timer Block Diagram
Clear
7
f
XT
f
W
Selector
f
W
f
4
2
2
9-bit prescaler
W
f
W
f
5
W
6
7
2
2
f
W
f
W
8
2
9
2
Selector
WTM7 WTM6 WTM5 WTM4 WTM1 WTM0
Watch timer operation
mode register (WTM)
Internal bus
5-bit counterINTWT
Clear
INTWTI
8
fX/2
OSTS2 OSTS1 OSTS0WDCS2 WDCS1 WDCS0
Oscillation
stabilization time
select register
(OSTS)
Figure 5-6. Watchdog Timer Block Diagram
Clock
input
control
circuit
RUN
Division
circuit
Division mode
selection circuit
Watchdog timer
clock select
register (WDCS)
Divided
clock
selection
circuit
3
Internal bus
RUN WDTM4 WDTM3
Watchdog timer
mode register
(WDTM)
Output
control
circuit
INTWDT
RESET
WDT mode signal
22
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.4 Clock Output/Buzzer Output Control Circuit
A clock output/buzzer output control circuit (CKU) is incorporated.
Clocks with the following frequencies can be output as clock output.
• 65.5 kHz/131 kHz/262 kHz/524 kHz/1.05 MHz/2.10 MHz/4.19 MHz/8.38 MHz (@ 8.38-MHz operation with main
system clock)
• 32.768 kHz (@ 32.768-kHz operation with subsystem clock)
Clocks with the following frequencies can be output as buzzer output.
• 1.02 kHz/2.05 kHz/4.10 kHz/8.19 kHz (@ 8.38-MHz operation with main system clock)
Figure 5-7. Block Diagram of Clock Output/Buzzer Output Control Circuit CKU
fX
fXT
BZOEBCS1BCS0CLOECCS3CCS2CCS1CCS0
Prescaler
8
Clock output select register (CKS)
Internal bus
fX to fX/2
4
fX/210 to fX/2
7
13
Selector
Selector
BZOE
Clock
control
circuit
CLOE
BUZ/P75
BCS0, BCS1
PCL/P74
Data Sheet U14045EJ1V0DS00
23
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.5 A/D Converter
An A/D converter consisting of eight 10-bit resolution channels is incorporated.
The following two A/D conversion operation start-up methods are available.
The serial interface UART0 has two modes: asynchronous serial interface (UART) mode and infrared data
transfer mode.
• Asynchronous serial interface (UART) mode
This mode enables full-duplex operation wherein one byte of data starting from the start bit is transmitted
and received.
The on-chip UART-dedicated baud-rate generator enables communication using a wide range of selectable
baud rates. In addition, a baud rate can be also defined by dividing the clock input to the ASCK0 pin.
The UART-dedicated baud-rate generator can also be used to generate a MIDI-standard baud rate (31.25
kbps).
RxD0/P23
TxD0/P24
• Infrared data transfer mode
This mode enables pulse output and pulse reception in data format.
This mode can be used for office equipment applications such as personal computers.
Figure 5-9. Block Diagram of Serial Interface UART0
Internal bus
Receive
buffer
RXB0
RX0
register 0
Receive
shift
register 0
Receive
control
circuit
(parity
check)
PE0 FE0
INTSR0
Asynchronous serial
interface status
register 0 (ASIS0)
OVE0
TXS0
INTSER0
Transmit
shift
register 0
Transmit
control
circuit
(parity
addition)
TXE0 RXE0
INTST0
PS01 PS00
CL0 SL0
Asynchronous serial
interface mode register 0
(ASIM0)
ISRM0
IRDAM0
Data Sheet U14045EJ1V0DS00
Baud rate
generator
ASCK0/P25
X
/2 to fX/2
f
7
25
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Serial interface SIO30
The serial interface SIO30 has one mode: 3-wire serial I/O mode.
• 3-wire serial I/O mode (fixed as MSB first)
This is an 8-bit data transfer mode using three lines: a serial clock line (SCK30), serial output line (SO30),
and serial input line (SI30).
Since simultaneous transmit and receive operations are enabled in the 3-wire serial I/O mode, the
processing time for data transfer is reduced.
The first bit in 8-bit data in the serial transfer is fixed as MSB.
The 3-wire serial I/O mode is useful for connection to peripheral I/O devices, display controllers, etc. that
include a clocked serial interface.
Figure 5-10. Block Diagram of Serial Interface SIO30
Internal bus
SI30/P20
8
Serial I/O shift register
30 (SIO30)
SO30/P21
SCK30/P22
Serial clock
counter
Serial clock
control circuit
Interrupt request
signal generator
Selector
INTCSI30
3
X
/2
f
4
fX/2
5
fX/2
26
Data Sheet U14045EJ1V0DS00
(3) Serial interface IIC0
The serial interface IIC0 has the I2C (Inter IC) bus mode (multimaster supported).
2
C bus mode (multimaster supported)
•I
This is an 8-bit data transfer mode using two lines: a serial clock line (SCL0) and serial data bus line (SDA0).
This mode complies with the I
during transmission via the serial data bus. This data is automatically detected by hardware during
reception.
Since the SCL0 and SDA0 are open-drain outputs in IIC0, pull-up resistors for the serial clock line and the
serial data bus line are required.
SDA0/P32
Noise elimination
circuit
µ
PD780031AY, 780032AY, 780033AY, 780034AY
2
C bus format, and can output "start condition", "data", and "stop condition"
Figure 5-11. Block Diagram of Serial Interface IIC0
Internal bus
IIC control register 0
Slave address
register 0 (SVA0)
Matched
signal
IIC shift register 0
(IIC0)
IICE0
CLEAR
D
(IICC0)
LREL0
SET
SO0 latch
CL00
WREL0
SPIE0
WTIM0
ACKE0
IIC status register 0
(IICS0)
MSTS0
ALD0 EXC0 COI0 TRC0
STT0 SPT0
ACKD0
STD0 SPD0
SCL0/P33
N-ch opendrain output
Noise elimination
circuit
N-ch open-drain
output
Acknowledge
detection circuit
Start condition
detection circuit
Stop condition
detection circuit
Serial clock counter
Serial clock control circuit
f
X
DAD0 SMC0 DFC0
CLD0
Data hold
time correction
circuit
Prescaler
Serial clock wait
control circuit
IIC transfer clock select
CL00
register 0 (IICCL0)
Acknowledge
detection
circuit
Wake-up control
circuit
Interrupt request
signal generator
INTIIC0
Internal bus
Data Sheet U14045EJ1V0DS00
27
µ
PD780031AY, 780032AY, 780033AY, 780034AY
6. INTERRUPT FUNCTION
A total of 20 interrupt sources are provided, divided into the following three types.
1INTP0Pin input edge detectionExternal0006H(C)
2INTP10008H
3INTP2000AH
4INTP3000CH
5INTSER0Generation of serial interface UART0Internal000EH(B)
6INTSR0End of serial interface UART0 reception0010H
7INTST0End of serial interface UART0 transmission0012H
8INTCSI30End of serial interface SIO30 transfer0014H
9INTIIC0End of serial interface IIC0 transfer0016H
10INTWTIReference time interval signal from watch timer001AH
11INTTM00Matching of TM0 and CR00 (when CR00 is001CH
12INTTM01Matching of TM0 and CR01 (when CR01 is001EH
13INTTM50Matching of TM50 and CR500020H
14INTTM51Matching of TM51 and CR510022H
15INTAD0End of conversion by A/D converter0024H
16INTWTWatch timer overflow0026H
17INTKRDetection of port 4 falling edgeExternal0028H(D)
NameTriggerExternalAddress
mode selected)
reception error
specified as a compare register)
Detection of TI01 pin valid edge (when CR00
is specified as a capture register)
specified as a compare register)
Detection of TI00 pin valid edge (when CR00
is specified as a capture register)
Basic
Configuration
Type
Note 2
Notes 1. Default priority is the priority order when several maskable interrupt requests are generated at the same
time. 0 is the highest and 17 is the lowest.
2. Basic configuration types (A) to (E) correspond to (A) to (E) in Figure 6-1.
28
Data Sheet U14045EJ1V0DS00
Figure 6-1. Basic Configuration of Interrupt Function (1/2)
Figure 6-1. Basic Configuration of Interrupt Function (2/2)
(D) External maskable interrupt (INTKR)
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Internal bus
Interrupt
request
1 when MEM = 01H
(E) Software interrupt
IF:Interrupt request flag
IE:Interrupt enable flag
ISP:In-service priority flag
MK:Interrupt mask flag
PR:Priority specification flag
MEM: Memory expansion mode register
Falling edge
detection circuit
Interrupt
request
MKIE
IF
Priority control
circuit
Internal bus
PRISP
Priority control
circuit
Vector table
address
generator
Vector table
address
generator
Standby release
signal
30
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
7. EXTERNAL DEVICE EXPANSION FUNCTION
The external device expansion function is for connecting external devices to areas other than the internal ROM,
RAM, and SFR. Ports 4 to 6 are used for external device connection.
8. STANDBY FUNCTION
The following two standby modes are available for further reduction of system current consumption.
• HALT mode: In this mode, the CPU operation clock is stopped. The average current consumption can be
reduced by intermittent operation by combining this mode with the normal operation mode.
• STOP mode: In this mode, oscillation of the main system clock is stopped. All the operations performed on
the main system clock are suspended, and only the subsystem clock is used, resulting in
extremely small power consumption. This can be used only when the main system clock is
operating (the subsystem clock oscillation cannot be stopped).
Figure 8-1. Standby Function
Main system clock
operation
STOP
Interrupt
request
STOP mode
Main system clock
operation is stopped
instruction
Interrupt
request
CSS = 1
CSS = 0
HALT
instruction
HALT modeHALT mode
Clock supply for CPU is stopped,
oscillation is maintained
9. RESET FUNCTION
The following two reset methods are available.
• External reset by RESET signal input
• Internal reset by watchdog timer runaway time detection
10. MASK OPTION
Table 10.1 Pin Mask Option Selection
Subsystem clock
operation
HALT
instruction
Interrupt
request
Clock supply for CPU is stopped,
oscillation is maintained
PinsMask Option
P30, P31An on-chip pull-up resistor can be specified in 1-bit units.
The mask option can be used to specify the connection of an on-chip pull-up resistor to P30, P31, in 1-bit units.
AVDD–0.3 to VDD + 0.3
AVREF–0.3 to VDD + 0.3
AVSS–0.3 to +0.3V
Input voltageVI1
VI2P30 to P33N-ch open-drain Without pull-up resistor–0.3 to +6.5V
Output voltageVO–0.3 to VDD + 0.3
Analog input voltage
Output current,IOHPer pin–10mA
high
Output current,IOLPer pin for P00 to P03, P20 to P25, P34 to20mA
lowP36, P40 to P47, P64 to P67, P70 to P75
Operating ambientTA –40 to +85°C
temperature
Storage Tstg–65 to +150°C
temperature
VANP10 to P17Analog input pin
P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47,
P50 to P57, P64 to P67, P70 to P75, X1, X2, XT1, XT2,
RESET
With pull-up resistor–0.3 to VDD + 0.3
Total for P00 to P03, P40 to P47, P50 to P57, P64 to P67, P70 to P75
Total for P20 to P25, P30 to P36–15mA
Per pin for P30 to P33, P50 to P5730mA
Total for P00 to P03, P40 to P47,50mA
P64 to P67, P70 to P75
Total for P20 to P2520mA
Total for P30 to P36100mA
Total for P50 to P57100mA
–0.3 to VDD + 0.3
AVSS– 0.3 to AVREF+ 0.3
and –0.3 to VDD + 0.3
–15mA
Note
Note
Note
Note
Note
Note
Note
V
V
V
V
V
V
Note 6.5 V or below
CautionProduct quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
34
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Capacitance(TA = 25°C, VDD= VSS = 0 V)
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
InputCINf = 1 MHz15pF
capacitanceUnmeasured pins returned to 0 V.
I/OCIOf = 1 MHzP00 to P03, P20 to P25,15pF
capacitanceUnmeasured pinsP34 to P36, P40 to P47,
returned to 0 V.P50 to P57, P64 to P67,
P70 to P75
P30 to P3320pF
RemarkUnless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins.
Main System Clock Oscillator Characteristics (TA = –40 to 85°C, VDD = 1.8 to 5.5 V)
Resonator
CeramicOscillationVDD = 4.0 to 5.5 V1.08.38MHz
resonatorfrequency (fX)
Recommended
Circuit
C1
IC
C2
X1X2
ParameterTest ConditionsMIN.TYP.MAX.Unit
Note 1
1.05.0
OscillationAfter VDD reaches4ms
stabilization time
Note 2
oscillation voltage range
MIN.
CrystalOscillationVDD = 4.0 to 5.5 V1.08.38MHz
resonatorfrequency (fX)
X1 X2
C1
IC
C2
OscillationVDD = 4.0 to 5.5 V10ms
stabilization time
Note 1
Note 2
1.05.0
30
ExternalX1 inputVDD = 4.0 to 5.5 V1.08.38MHz
clockfrequency (fX)
X2X1
Note 1
1.05.0
X1 inputVDD = 4.0 to 5.5 V50500ns
µ
PD74HCU04
high-/low-level width
85500
(tXH, tXL)
Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after reset or STOP mode release.
Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
SS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
2. When the main system clock is stopped and the system is operating on the subsystem clock,
wait until the oscillation stabilization time has been secured by the program before switching
back to the main system clock.
Data Sheet U14045EJ1V0DS00
35
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Subsystem Clock Oscillator Characteristics(TA = –40 to +85°C, VDD= 1.8 to 5.5 V)
Resonator
Crystal
resonator
External
clock
Recommended Circuit
XT2 XT1
µ
PD74HCU04
IC
R
C3
C4
XT1XT2
Parameter
Oscillation
frequency (fXT)
Oscillation
stabilization time
XT1 input
frequency (fXT)
XT1 input
high-/low-level width
(tXTH , tXTL)
Note 1
Note 2
Note 1
Test Conditions
VDD = 4.0 to 5.5 V
MIN.
TYP.
32
32.768
1.2
32
515
MAX.
35
2
10
38.5
Unit
kHz
s
kHz
µ
s
Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after VDD reaches oscillation voltage range MIN.
Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
SS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing current
consumption, and is more prone to malfunction due to noise than the main system clock
oscillator. Particular care is therefore required with the wiring method when the subsystem
clock is used.
36
Data Sheet U14045EJ1V0DS00
Recommended Oscillator Constant
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Main system clock: Ceramic resonator (T
ManufacturerPart NumberFrequencyRecommended Circuit ConstantOscillation Voltage Range
Caution The oscillator constant and oscillation voltage range indicate conditions of stable oscillation.
Oscillation frequency precision is not guaranteed. For applications requiring oscillation
frequency precision, the oscillation frequency must be adjusted on the implementation circuit.
For details, please contact directly the manufacturer of the resonator you will use.
Data Sheet U14045EJ1V0DS00
37
µ
PD780031AY, 780032AY, 780033AY, 780034AY
DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
Output current,IOHPer pin–1mA
high
Output current,IOLPer pin for P00 to P03, P20 to P25, P34 to P36,10mA
lowP40 to P47, P64 to P67, P70 to P75
Input voltage,VIH1
highP40 to P47, P50 to P57,
VIH2
VIH3P30 to P33VDD = 2.7 to 5.5 V0.7VDD5.5V
VIH4X1, X2VDD = 2.7 to 5.5 V
VIH5XT1, XT2VDD = 4.0 to 5.5 V0.8VDDVDDV
Input voltage,VIL1P10 to P17, P21, P24, P35,VDD = 2.7 to 5.5 V00.3VDDV
low
VIL2
VIL3P30 to P334.0 V ≤ VDD≤ 5.5 V00.3VDDV
VIL4X1, X2VDD = 2.7 to 5.5 V00.4V
VIL5XT1, XT2VDD = 4.0 to 5.5 V00.2V DDV
Output voltage,VOH1VDD = 4.0 to 5.5 V, IOH = –1 mA
high
Output voltage,VOL1P30 to P33VDD = 4.0 to 5.5 V,2.0V
low
VOL2IOL = 400 µA0.5V
All pins–15mA
Per pin for P30 to P33, P50 to P5715mA
Total for P00 to P03, P40 to P47, P64 to P67, P70 to P75
Total for P20 to P2510mA
Total for P30 to P3670mA
Total for P50 to P5770mA
P10 to P17, P21, P24, P35,
P64 to P67, P74, P75
P00 to P03, P20, P22, P23, P25,
P34, P36, P70 to P73, RESET
(N-ch open-drain)
P40 to P47, P50 to P57,
P64 to P67,
P00 to P03, P20, P22, P23, P25,
P34, P36, P70 to P73, RESET
IOH = –100 µA
P50 to P57
P00 to P03, P20 to P25, P34 to P36,
P40 to P47, P64 to P67, P70 to P75
P74, P75
VDD = 2.7 to 5.5 V0.7VDDVDDV
0.8VDDVDDV
VDD = 2.7 to 5.5 V0.8VDDVDDV
0.85VDDVDDV
0.8VDD5.5V
VDD–0.5
VDD–0.2
0.9VDDVDDV
0
VDD = 2.7 to 5.5 V00.2VDDV
00.15VDDV
2.7 V ≤ VDD < 4.0 V00.2VDDV
1.8 V ≤ VDD < 2.7 V00.1VDDV
00.2V
00.1VDDV
VDD–1.0
VDD–0.5
IOL = 15 mA
VDD = 4.0 to 5.5 V,0.4V
IOL = 1.6 mA
0.42.0V
20mA
VDDV
VDDV
0.2VDDV
VDDV
VDDV
RemarkUnless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins.
38
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
DC Characteristics (TA = –40 to +85°C, VDD= 1.8 to 5.5 V)
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
Input leakageILIH1VIN = VDD
current, high
ILIH2X1, X2, XT1, XT220
ILIH3VIN = 5.5 VP30 to P33
Input leakageILIL1VIN = 0 V
current, low
ILIL2X1, X2, XT1, XT2–20
ILIL3P30 to P33
Output leakageILOHVOUT = VDD3
current, high
Output leakageILOLVOUT = 0 V–3
current, low
Mask option
pull-up resistance
Software pull-R2VIN = 0 V,153090kΩ
up resistanceP00 to P03, P20 to P25, P34 to P36, P40 to P47,
R1VIN = 0 V,153090kΩ
P30, P31
P50 to P57, P64 to P67, P70 to P75
P00 to P03, P10 to P17, P20 to P25,
P34 to P36, P40 to P47, P50 to P57,
P64 to P67, P70 to P75,
RESET
Note
P00 to P03, P10 to P17, P20 to P25,
P34 to P36, P40 to P47, P50 to P57,
P64 to P67, P70 to P75,
RESET
Note
3
3
–3
–3
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
NoteWhen pull-up resistors are not connected to P30, P31 (specified by the mask option).
RemarkUnless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins.
Data Sheet U14045EJ1V0DS00
39
µ
PD780031AY, 780032AY, 780033AY, 780034AY
DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
Power supplyIDD18.38-MHz
Note 1
current
crystal oscillation
operating mode
5.00-MHz
crystal oscillation
operating mode
IDD28.38-MHz
crystal oscillation
HALT mode
5.00-MHz
crystal oscillation
HALT mode
IDD332.768-kHz crystal oscillationVDD = 5.0 V ±10%4080
operating mode
IDD432.768-kHz crystal oscillationVDD = 5.0 V ±10%3060
HALT mode
IDD5XT1 = 0V STOP modeVDD = 5.0 V ±10%0.130
When feedback resistor is not used
VDD = 5.0V±10%
VDD = 3.0V±10%
VDD = 2.0V±10%
VDD = 5.0V±10%
VDD = 3.0V±10%
VDD = 2.0V±10%
Note 4
Note 4
Note 2
When A/D converter is5.511mA
stopped
When A/D converter is6.513mA
operating
Note 2
When A/D converter is24mA
stopped
When A/D converter is36mA
operating
Note 3
When A/D converter is0.41.5mA
stopped
When A/D converter is1.44.2mA
operating
Note 2
When peripheral functions
1.12.2mA
are stopped
When peripheral functions
are operating
Note 2
When peripheral functions
0.350.7mA
are stopped
When peripheral functions
are operating
Note 3
When peripheral functions0.150.4mA
are stopped
When peripheral functions
are operating
VDD = 3.0 V ±10%2040
VDD = 2.0 V ±10%1020
VDD = 3.0 V ±10%618
VDD = 2.0 V ±10%210
VDD = 3.0 V ±10%0.0510
VDD = 2.0 V ±10%0.0510
4.7mA
1.7mA
1.1mA
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
Notes 1. Total current through the internal power supply (VDD0, VDD1), including the peripheral operation current
(except the current through pull-up resistors of ports and the AVREF pin).
2. When the processor clock control register (PCC) is set to 00H.
3. When PCC is set to 02H.
4. When main system clock operation is stopped.
40
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
AC Characteristics
(1) Basic Operation
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
Cycle timeTCYOperating with4.0 V ≤ VDD≤ 5.5 V0.2416
(Min. instructionmain system clock
execution time)
TI00, TI01 inputtTIH0, tTIL04.0 V ≤ VDD≤ 5.5 V
high-/low-level
width
TI50, TI51 inputfTI5VDD = 2.7 to 5.5 V04MHz
frequency
Interrupt requesttINTH, tINTLINTP0 to INTP3,VDD = 2.7 to 5.5 V1
input high-/lowP40 to P47
-level width
RESETtRSLVDD = 2.7 to 5.5 V10
low-level width
(TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
2.7 V ≤ VDD < 4.0 V0.416
Operating with subsystem clock
2.7 V ≤ VDD < 4.0 V
1.616
Note 1
103.9
2/fsam + 0.1
2/fsam + 0.2
2/fsam + 0.5
0275kHz
1.8ns
2
20
122125
Note2
Note2
Note2
Notes 1. Value when an external clock is used. When a crystal resonator is used, it is 114 µs (MIN.).
2. Selection of fsam = fX, fX/4, fX/64 is possible using bits 0 and 1 (PRM00, PRM01) of prescaler mode register
0 (PRM0). However, if the TI00 valid edge is selected as the count clock, the value becomes f
sam = fX/8.
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Data Sheet U14045EJ1V0DS00
41
µ
PD780031AY, 780032AY, 780033AY, 780034AY
TCY vs. VDD (main system clock operation)
16.0
10.0
µ
[ s]
5.0
CY
2.0
1.6
Cycle time T
1.0
0.4
0.24
0.1
0
Operation
guaranteed
range
1.02.03.04.05.06.0
1.8
2.7
Supply voltage V
DD
[V]
5.5
42
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Read/Write Operation (TA = –40 to + 85°C, VDD = 4.0 to 5.5 V)
(1/3)
Parameter SymbolTest ConditionsMIN.MAX.Unit
ASTB high-level widthtASTH0.3tCYns
Address setup timetADS20ns
Address hold timetADH6ns
Data input time from addresstADD1(2 + 2n)tCY – 54ns
tADD2(3 + 2n)tCY – 60ns
Address output time from RD↓t RDAD0100ns
Data input time from RD↓tRDD1(2 + 2n)tCY – 87ns
tRDD2(3 + 2n)tCY – 93ns
Read data hold timetRDH0ns
RD low-level widthtRDL1(1.5 + 2n)tCY – 33ns
tRDL2(2.5 + 2n)tCY – 33ns
WAIT↓ input time from RD↓tRDWT1tCY – 43ns
tRDWT2tCY – 43ns
WAIT↓ input time from WR↓tWRWTtCY – 25ns
WAIT low-level widthtWTL(0.5 + n)tCY + 10(2 + 2n)tCYns
Write data setup timetWDS60ns
Write data hold timetWDH6ns
WR low-level widthtWRL1(1.5 + 2n)tCY – 15ns
RD↓ delay time from ASTB↓tASTRD6ns
WR↓ delay time from ASTB↓tASTWR2tCY – 15ns
ASTB↑ delay time fromtRDAST0.8tCY – 151.2tCYns
RD↑ at external fetch
Address hold time fromtRDADH0.8tCY – 151.2tCY + 30ns
RD↑ at external fetch
Write data output time from RD↑tRDWD40ns
Write data output time from WR↓tWRWD1060ns
Address hold time from WR↑tWRADH 0.8tCY – 151.2tCY + 30ns
RD↑ delay time from WAIT↑tWTRD0.8tCY2.5tCY + 25ns
WR↑ delay time from WAIT↑tWTWR0.8tCY2.5tCY + 25ns
Remarks 1.tCY = TCY/4
2. n indicates the number of waits.
L = 100 pF (CL indicates the load capacitance of the AD0 to AD7, A8 to A15, RD, WR, WAIT, and
3.C
ASTB pins.)
Data Sheet U14045EJ1V0DS00
43
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Read/Write Operation (TA = –40 to + 85°C, VDD = 2.7 to 4.0 V)
(2/3)
Parameter SymbolTest ConditionsMIN.MAX.Unit
ASTB high-level widthtASTH0.3tCYns
Address setup timetADS30ns
Address hold timetADH10ns
Data input time from addresstADD1(2 + 2n)tCY – 108ns
tADD2(3 + 2n)tCY – 120ns
Address output time from RD↓t RDAD0200ns
Data input time from RD↓tRDD1(2 + 2n)tCY – 148ns
tRDD2(3 + 2n)tCY – 162ns
Read data hold timetRDH0ns
RD low-level widthtRDL1(1.5 + 2n)tCY – 40ns
tRDL2(2.5 + 2n)tCY – 40ns
WAIT↓ input time from RD↓tRDWT1tCY – 75ns
tRDWT2tCY – 60ns
WAIT↓ input time from WR↓tWRWTtCY – 50ns
WAIT low-level widthtWTL(0.5 + 2n)tCY + 10(2 + 2n)tCYns
Write data setup timetWDS60ns
Write data hold timetWDH10ns
WR low-level widthtWRL1(1.5 + 2n)tCY – 30ns
RD↓ delay time from ASTB↓tASTRD10ns
WR↓ delay time from ASTB↓tASTWR2tCY – 30ns
ASTB↑ delay time fromtRDAST 0.8tCY – 301.2tCYns
RD↑ at external fetch
Address hold time fromtRDADH0.8tCY – 301.2tCY + 60ns
RD↑ at external fetch
Write data output time from RD↑tRDWD40ns
Write data output time from WR↓tWRWD20120ns
Address hold time from WR↑tWRADH 0.8tCY – 301.2tCY + 60ns
RD↑ delay time from WAIT↑tWTRD0.5tCY2.5tCY + 50ns
WR↑ delay time from WAIT↑tWTWR0.5tCY2.5tCY + 50ns
Remarks 1.tCY = TCY/4
2. n indicates the number of waits.
3. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT,
and ASTB pins.)
44
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Read/Write Operation (TA = –40 to + 85°C, VDD = 1.8 to 2.7 V)
(3/3)
Parameter SymbolTest ConditionsMIN.MAX.Unit
ASTB high-level widthtASTH0.3tCYns
Address setup timetADS120ns
Address hold timetADH20ns
Data input time from addresstADD1(2 + 2n)tCY – 233ns
tADD2(3 + 2n)tCY – 240ns
Address output time from RD↓t RDAD0400ns
Data input time from RD↓tRDD1(2 + 2n)tCY – 325ns
tRDD2(3 + 2n)tCY – 332ns
Read data hold timetRDH0ns
RD low-level widthtRDL1(1.5 + 2n)tCY – 92ns
tRDL2(2.5 + 2n)tCY – 92ns
WAIT↓ input time from RD↓tRDWT1tCY – 350ns
tRDWT2tCY – 132ns
WAIT↓ input time from WR↓tWRWTtCY – 100ns
WAIT low-level widthtWTL(0.5 + 2n)tCY + 10(2 + 2n)tCYns
Write data setup timetWDS60ns
Write data hold timetWDH20ns
WR low-level widthtWRL1(1.5 + 2n)tCY – 60ns
RD↓ delay time from ASTB↓tASTRD20ns
WR↓ delay time from ASTB↓tASTWR2tCY – 60ns
ASTB↑ delay time fromtRDAST 0.8tCY – 601.2tCYns
RD↑ at external fetch
Address hold time fromtRDADH0.8tCY – 601.2tCY + 120ns
RD↑ at external fetch
Write data output time from RD↑tRDWD40ns
Write data output time from WR↓tWRWD40240ns
Address hold time from WR↑tWRADH 0.8tCY – 601.2tCY + 120ns
RD↑ delay time from WAIT↑tWTRD0.5tCY2.5tCY + 100ns
WR↑ delay time from WAIT↑tWTWR0.5tCY2.5tCY + 100ns
Remarks 1.tCY = TCY/4
2. n indicates the number of waits.
L = 100pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT, and
3. C
ASTB pins.)
Data Sheet U14045EJ1V0DS00
45
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(3) Serial Interface (TA = –40 to + 85°C, VDD = 1.8 to 5.5 V)
(a) 3-wire serial I/O mode (SCK30 ... Internal clock output)
(between stop and start condition)
Hold time
SCL0 clock low-level widthtLOW4.7—1.3—
SCL0 clock high-level widthtHIGH4.0—0.6—
Start/restart condition setup timetSU:STA4.7—0.6—
Data hold time CBUS compatible mastertHD:DAT5.0———
Data setup timetSU:DAT250—100
SDA0 and SCL0 signal rise timetR—100020 + 0.1Cb
SDA0 and SCL0 signal fall timetF—30020 + 0.1Cb
Stop condition setup timetSU:STO4.0—0.6—
Spike pulse width controlled by input filtertSP—— 050ns
Capacitive load per bus lineCb—400—400pF
Note 1
I2C bus0
tHD:STA4.0—0.6—
Standard ModeHigh-Speed Mode
MIN.MAX.MIN.MAX.
Note 2
—0
Note 2
Note 4
Note 5
Note 5
Note 3
0.9
—ns
300ns
300ns
Unit
µ
µ
µ
µ
µ
µ
µ
µ
s
s
s
s
s
s
s
s
Notes 1. In the start condition, the first clock pulse is generated after this hold time.
2. To fill in the undefined area of the SCL0 falling edge, it is necessary for the device to internally provide
at least 300 ns of hold time for the SDA0 signal (which is VIHmin. of the SCL0 signal).
3. If the device does not extend the SCL0 signal low hold time (t
LOW), only maximum data hold time tHD:DAT
needs to be fulfilled.
2
4. The high-speed mode I
C bus is available in a standard mode I2C bus system. At this time, the conditions
described below must be satisfied.
• If the device does not extend the SCL0 signal low state hold time
SU:DAT≥ 250 ns
t
• If the device extends the SCL0 signal low state hold time
Be sure to transmit the next data bit to the SDA0 line before the SCL0 line is released (tRmax. + tSU:DAT
= 1000 + 250 = 1250 ns by standard mode I2C bus specification).
Analog input voltageVIAN0AVREFV
Reference voltageAVREF1.8AVDDV
Resistance between AVREF and AVSS RREF
Notes 1, 2
Notes 1, 2
Notes 1, 2
Note 1
Note 1
4.0 V ≤ AVREF≤ 5.5 V±0.2±0.4%FSR
2.7 V ≤ AVREF< 4.0 V±0.3±0.6%FSR
1.8 V ≤ AVREF< 2.7 V±0.6±1.2%FSR
2.7 V ≤ AVREF< 4.0 V1996
1.8 V ≤ AVREF< 2.7 V2896
4.0 V ≤ AVREF≤ 5.5 V±0.4%FSR
2.7 V ≤ AVREF< 4.0 V±0.6%FSR
1.8 V ≤ AVREF< 2.7 V±1.2%FSR
4.0 V ≤ AVREF≤ 5.5 V±0.4%FSR
2.7 V ≤ AVREF< 4.0 V±0.6%FSR
1.8 V ≤ AVREF< 2.7 V±1.2%FSR
4.0 V ≤ AVREF≤ 5.5 V±2.5LSB
2.7 V ≤ AVREF< 4.0 V±4.5LSB
1.8 V ≤ AVREF< 2.7 V±8.5LSB
4.0 V ≤ AVREF≤ 5.5 V±1.5LSB
2.7 V ≤ AVREF< 4.0 V±2.0LSB
1.8 V ≤ AVREF< 2.7 V±3.5LSB
When A/D conversion is not performed
2040kΩ
µ
s
µ
s
µ
s
Notes 1. Excludes quantization error (±1/2 LSB).
2. Shown as a percentage of the full scale value.
54
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C)
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
Data retention powerVDDDR1.65.5V
supply voltage
Data retentionIDDDRVDDDR = 1.6 V0.130
power supplySubsystem clock stop (XT1 = VDD) and
currentfeed-back resistor disconnected
Release signal set time
Oscillation stabilizationtWAITRelease by RESET217/fxms
time
tSREL0
Release by interrupt requestNotems
µ
A
µ
s
Note Selection of 212/fX and 214/fX to 217/fX is possible using bits 0 to 2 (OSTS0 to OSTS2) of the oscillation
stabilization time select register (OSTS).
Data Retention Timing (STOP mode release by RESET)
Internal reset operation
HALT mode
STOP mode
Operating mode
V
RESET
DD
STOP instruction execution
Data retention mode
V
DDDR
t
SREL
t
WAIT
Data Sheet U14045EJ1V0DS00
55
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Retention Timing (Standby release signal: STOP mode release by interrupt request signal)
HALT mode
STOP mode
Data retention mode
Operating mode
VDD
STOP Instruction execution
Standby release signal
(interrupt request)
Interrupt Request Input Timing
INTP0 to INTP2
INTP3
VDDDR
t
t
INTL
INTL
t
tSREL
tWAIT
INTH
RESET Input Timing
56
RESET
t
RSL
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
13. PACKAGE DRAWINGS
64 PIN PLASTIC SHRINK DIP (750 mil)
6433
A
321
K
J
I
F
M
H
D
N
G
NOTES
1. Controlling dimension millimeter.
2. Each lead centerline is located within 0.17 mm (0.007 inch) of
its true position (T.P.) at maximum material condition.
3. Item "K" to center of leads when formed parallel.
CB
ITEM MILLIMETERSINCHES
A58.02.283
B
C
D
F
G
H
I4.050.159
J
K
L
M
N
R
M
+0.68
–0.20
1.78 MAX.
1.778 (T.P.)
0.50±0.10
0.9 MIN.
3.2±0.3
0.51 MIN.
+0.26
–0.20
5.08 MAX.
19.05 (T.P.)
17.0±0.2
+0.10
0.25
–0.05
0.17
0 to 15°
L
R
+0.028
–0.008
0.070 MAX.
0.070 (T.P.)
+0.004
0.020
–0.005
0.035 MIN.
0.126±0.012
0.020 MIN.
+0.011
–0.008
0.200 MAX.
0.750 (T.P.)
+0.009
0.669
–0.008
+0.004
0.010
–0.003
0.007
0 to 15°
P64C-70-750A,C-3
Remark The external dimensions and materials of the ES version are the same as those of the mass-produced
version.
Data Sheet U14045EJ1V0DS00
57
64 PIN PLASTIC QFP ( 14)
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A
B
49
48
33
32
CD
64
1
16
17
F
G
HI
M
P
NS
J
K
L
M
NOTE
1. Controlling dimension millimeter.
2. Each lead centerline is located within 0.15 mm (0.006 inch) of
its true position (T.P.) at maximum material condition.
detail of lead end
S
Q
R
S
ITEM MILLIMETERSINCHES
A17.6±0.40.693±0.016
B14.0±0.20.551
C14.0±0.20.551
D17.6±0.40.693±0.016
F
1.0
G1.0
0.15
5°±5°
+0.08
–0.07
+0.08
–0.07
H0.370.015
I
J0.8 (T.P.)
K1.8±0.20.071±0.008
L0.8±0.20.031
M0.170.007
N0.100.004
P2.55±0.10.100±0.004
Q0.1±0.10.004±0.004
R
S2.85 MAX.
+0.009
–0.008
+0.009
–0.008
0.039
0.039
+0.003
–0.004
0.006
0.031 (T.P.)
+0.009
–0.008
+0.003
–0.004
5°±5°
0.113 MAX.
P64GC-80-AB8-4
Remark The external dimensions and materials of the ES version are the same as those of the mass-produced
version.
58
Data Sheet U14045EJ1V0DS00
64 PIN PLASTIC LQFP (12x12)
A
B
µ
PD780031AY, 780032AY, 780033AY, 780034AY
48
49
64
1
33
32
17
16
F
G
HI
P
NOTES
1. Controlling dimension millimeter.
2. Each lead centerline is located within 0.13 mm of
its true position (T.P.) at maximum material condition.
M
SN
K
L
J
CD
S
M
detail of lead end
S
R
Q
ITEM MILLIMETERSINCHES
A14.8±0.40.583±0.016
B12.0±0.20.472
C12.0±0.20.472
14.8±0.4D0.583±0.016
F
1.125
1.125
G
H0.32±0.080.013
0.13I0.005
0.65 (T.P.)J0.026
K1.4±0.20.055±0.008
L0.6±0.20.024
M0.170.007
P1.4±0.10.055
S1.7 MAX.0.067 MAX.
+0.08
−0.07
0.10N0.004
0.125±0.075Q0.005±0.003
5°±5°R5°±5°
+0.009
−0.008
+0.009
−0.008
0.044
0.044
+0.003
−0.004
+0.008
−0.009
+0.003
−0.004
+0.004
−0.005
P64GK-65-8A8-2
Remark The external dimensions and materials of the ES version are the same as those of the mass-produced
version.
Data Sheet U14045EJ1V0DS00
59
µ
PD780031AY, 780032AY, 780033AY, 780034AY
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 14-1. Surface Mounting Type Soldering Conditions
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
Data Sheet U14045EJ1V0DS00
61
µ
PD780031AY, 780032AY, 780033AY, 780034AY
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for system development using the µPD780034AY Subseries.
Also refer to (5) Cautions on Using Development Tools.
(1) Language Processing Software
RA78K/0Assembler package common to 78K/0 Series
CC78K/0C compiler package common to 78K/0 Series
DF780034Device file common to µPD780034A Subseries
CC78K/0-LC compiler library source file common to 78K/0 Series
(2) Flash Memory Writing Tools
Flashpro II (FL-PR2)Flash programmer dedicated to microcontrollers with on-chip flash memory
Flashpro III (FL-PR3, PG-FP3)
FA-64CWAdapter for flash memory writing
FA-64GC
FA-64GK
(3) Debugging Tools
• When using in-circuit emulator IE-78K0-NS
IE-78K0-NSIn-circuit emulator common to 78K/0 Series
IE-70000-MC-PS-BPower supply unit for IE-78K0-NS
IE-78K0-NS-PA
IE-70000-98-IF-C
IE-70000-CD-IF-A
IE-70000-PC-IF-CInterface adapter when using IBM PC/ATTM or compatible as host machine (ISA bus supported)
IE-70000-PCI-IFAdapter required when using PC in which PCI bus is embedded as host machine
IE-780034-NS-EM1Emulation board to emulate µPD780034AY Subseries
NP-64CWEmulation probe for 64-pin plastic shrink DIP (CW type)
NP-64GCEmulation probe for 64-pin plastic QFP (GC-AB8 type)
NP-64GC-TQ
NP-64GKEmulation probe for 64-pin plastic LQFP (GK-8A8 type)
TGK-064SBWConversion adapter to connect NP-64GK and target system board on which a 64-pin plastic LQFP
EV-9200GC-64Socket to be mounted on target system board made for 64-pin plastic QFP (GC-AB8 type)
ID78K0-NSIntegrated debugger for IE-78K0-NS
SM78K0System simulator common to 78K/0 Series
DF780034Device file common to µPD780034A Subseries
Note
Performance board to enhance and expand the functions of IE-78K0-NS
Interface adapter when using PC-9800 series as host machine (excluding notebook PCs) (C bus supported)
PC card and interface cable when using notebook PC as host machine (PCMCIA socket supported)
(GK-8A8 type) can be mounted.
Note Under development
62
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
• When using in-circuit emulator IE-78001-R-A
IE-78001-R-AIn-circuit emulator common to 78K/0 Series
IE-70000-98-IF-C
IE-70000-PC-IF-CInterface adapter when using IBM PC/AT or compatible as host machine (ISA bus supported)
IE-70000-PCI-IFAdapter required when using PC in which PCI bus is embedded as host machine
IE-78000-R-SV3Interface adapter and cable when using EWS as host machine
IE-780034-NS-EM1Emulation board to emulate µPD780034AY Subseries
IE-78K0-R-EX1Emulation probe conversion board necessary when using IE-780034-NS-EM1 on IE-78001-R-A
EP-78240CW-REmulation probe for 64-pin plastic shrink DIP (CW type)
EP-78240GC-REmulation probe for 64-pin plastic QFP (GC-AB8 type)
EP-78012GK-REmulation probe for 64-pin plastic LQFP (GK-8A8 type)
TGK-064SBW
EV-9200GC-64
ID78K0Integrated debugger for IE-78001-R-A
SM78K0System simulator common to 78K/0 Series
DF780034Device file common to µPD780034A Subseries
Interface adapter when using PC-9800 series as host machine (excluding notebook PCs) (C bus supported)
Conversion adapter to connect
LQFP (GK-8A8 type) can be mounted.
Socket to be mounted on target system board made for 64-pin plastic QFP (GC-AB8 type)
EP-78012GK-R a
nd target system board on which a 64-pin plastic
(4) Real-time OS
RX78K/0Real-time OS for 78K/0 Series
MX78K0OS for 78K/0 Series
Data Sheet U14045EJ1V0DS00
63
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(5) Cautions on Using Development Tools
• The ID78K0-NS, ID78K0, and SM78K0 are used in combination with the DF780034.
• The CC78K/0 and RX78K/0 are used in combination with the RA78K/0 and the DF780034.
• FL-PR2, FL-PR3, FA-64CW, FA-64GC, FA-64GK, NP-64CW, NP-64GC, NP-64GC-TQ, and NP-64GK are
products made by Naito Densei Machida Mfg. Co., Ltd. (+81-44-822-3813).
Contact an NEC distributor regarding the purchase of these products.
• The TGK-064SBW is a product made by TOKYO ELETECH CORPORATION.
Refer to: Daimaru Kogyo, Ltd.
Tokyo Electronic Division (+81-3-3820-7112)
Osaka Electronic Division (+81-6-6244-6672)
• For third-party development tools, see the 78K/0 Series Selection Guide (U11126E).
• The host machines and OSs supporting each software are as follows.
Host MachinePCEWS
[OS]PC-9800 series [WindowsTM]HP9000 series 700TM [HP-UXTM]
IBM PC/AT and compatiblesSPARCstationTM [SunOSTM, SolarisTM]
PD780031AY, 780032AY, 780033AY, 780034AY Data SheetThis documentU14045J
µ
PD78F0034AY Data SheetU14041EU14041J
78K/0 Series User’s Manual InstructionsU12326EU12326J
78K/0 Series Instruction Table—U10903J
78K/0 Series Instruction Set—U10904J
Documents Related to Development Tools (User’s Manuals)
Document NameDocument No.Document No.
(English)(Japanese)
RA78K0 Assembler PackageOperationU11802EU11802J
Assembly LanguageU11801EU11801J
Structured Assembly LanguageU11789EU11789J
RA78K Series Structured Assembler PreprocessorEEU-1402U12323J
CC78K0 C CompilerOperationU11517EU11517J
LanguageU11518EU11518J
CC78K0 C Compiler Application NoteProgramming Know-howU13034EU13034J
IE-78K0-NSTo be preparedTo be prepared
IE-78001-R-ATo be preparedTo be prepared
IE-780034-NS-EM1To be preparedTo be prepared
EP-78240U10332EEEU-986
EP-78012GK-REEU-1538EEU-5012
SM78K0 System Simulator Windows basedReferenceU10181EU10181J
SM78K Series System SimulatorExternal Part User OpenU10092EU10092J
Interface Specifications
ID78K0-NS Integrated Debugger Windows based
ID78K0 Integrated Debugger EWS basedReference—U11151J
ID78K0 Integrated Debugger PC basedReferenceU11539EU11539J
ID78K0 Integrated Debugger Windows basedGuideU11649EU11649J
ReferenceU12900EU12900J
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document for designing.
Data Sheet U14045EJ1V0DS00
65
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Documents Related to Embedded Software (User’s Manuals)
Document NameDocument No.Document No.
(English)(Japanese)
78K/0 Series Real-time OSBasicsU11537EU11537J
InstallationU11536EU11536J
78K/0 Series OS MX78K0BasicsU12257EU12257J
Other Related Documents
Document NameDocument No.Document No.
(English)(Japanese)
SEMICONDUCTORS SELECTION GUIDE Products & Packages (CD-ROM)X13769X
Semiconductor Device Mounting Technology ManualC10535EC10535J
Quality Grades on NEC Semiconductor DevicesC11531EC11531J
NEC Semiconductor Device Reliability/Quality Control SystemC10983EC10983J
Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD)
Guide to Microcomputer-Related Products by Third Party—U11416J
C11892EC11892J
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document for designing.
66
Data Sheet U14045EJ1V0DS00
[MEMO]
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Sheet U14045EJ1V0DS00
67
µ
PD780031AY, 780032AY, 780033AY, 780034AY
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
DD or GND with a resistor, if it is considered to have a possibility of
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Caution Purchase of NEC I2C components conveys a license under the Philips I2C Patent Rights to use
2
these components in an I
Specification as defined by Philips.
C system, provided that the system conforms to the I2C Standard
68
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet U14045EJ1V0DS00
69
µ
PD780031AY, 780032AY, 780033AY, 780034AY
FIP and IEBus are trademarks of NEC Corporation.
Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/
or other countries.
PC/AT is a trademark of International Business Machines Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
NEWS and NEWS-OS are trademarks of Sony Corporation.
The related documents indicated in this publication may include preliminary versions. However, preliminary
versions are not marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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