NEC PD780031AY, PD780032AY, PD780033AY, PD780034AY Technical data

查询UPD780031AYCW供应商查询UPD780031AYCW供应商
µ
PD780031AY, 780032AY, 780033AY, 780034AY
8-BIT SINGLE-CHIP MICROCONTROLLERS
DESCRIPTION
The µPD780031AY, 780032AY, 780033AY, and 780034AY are members of the µPD780034AY Subseries of the 78K/0 Series. This is a µPD780034A Subseries product with an added multimaster-supporting I2C bus interface, and is suitable for AV equipment applications.
A flash memory version, the ROM version, and various development tools, are available.
Detailed function descriptions are provided in the following user’s manuals. Be sure to read them before designing.
µ
PD780024A, 780034A, 780024AY, 780034AY Subseries User's Manual: U14046E 78K/0 Series User’s Manual Instructions: U12326E
DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD78F0034AY, that can operate in the same power supply voltage range as the mask
FEATURES
• Internal ROM and RAM
Item Program Memory Data Memory Package
Part Number (Internal ROM) (Internal High-Speed RAM)
µ
PD780031AY 8 Kbytes 512 bytes • 64-pin plastic shrink DIP (750 mils)
µ
PD780032AY 16 Kbytes
µ
PD780033AY 24 Kbytes 1024 bytes
µ
PD780034AY 32 Kbytes
• External memory expansion space: 64 Kbytes
• Minimum instruction execution time: 0.24 µs (@ fX = 8.38-MHz operation)
• I/O ports: 51 (5-V-tolerant N-ch open-drain: 4)
• 10-bit resolution A/D converter: 8 channels (AV
• Serial interface: 3 channels (multimaster-supporting I2C bus mode, UART mode, 3-wire serial I/O mode)
• Timer: 5 channels
• Power supply voltage: V
DD = 1.8 to 5.5 V
DD = 1.8 to 5.5 V)
• 64-pin plastic QFP (14 × 14 mm)
• 64-pin plastic LQFP (12 × 12 mm)
APPLICATIONS
Telephones, home electric appliances, pagers, AV equipment, car audios, office automation equipment, etc.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. U14045EJ1V0DS00 (1st edition) Date Published August 1999 N CP(K) Printed in Japan
©
1999
µ
PD780031AY, 780032AY, 780033AY, 780034AY
ORDERING INFORMATION
Part Number Package
µ
PD780031AYCW-××× 64-pin plastic shrink DIP (750 mils)
µ
PD780031AYGC-×××-AB8 64-pin plastic QFP (14 × 14 mm)
µ
PD780031AYGK-×××-8A8 64-pin plastic LQFP (12 × 12 mm)
µ
PD780032AYCW-××× 64-pin plastic shrink DIP (750 mils)
µ
PD780032AYGC-×××-AB8 64-pin plastic QFP (14 × 14 mm)
µ
PD780032AYGK-×××-8A8 64-pin plastic LQFP (12 × 12 mm)
µ
PD780033AYCW-××× 64-pin plastic shrink DIP (750 mils)
µ
PD780033AYGC-×××-AB8 64-pin plastic QFP (14 × 14 mm)
µ
PD780033AYGK-×××-8A8 64-pin plastic LQFP (12 × 12 mm)
µ
PD780034AYCW-××× 64-pin plastic shrink DIP (750 mils)
µ
PD780034AYGC-×××-AB8 64-pin plastic QFP (14 × 14 mm)
µ
PD780034AYGK-×××-8A8 64-pin plastic LQFP (12 × 12 mm)
Remark ××× indicates ROM code suffix.
2
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
78K/0 SERIES LINEUP
The products in the 78K/0 Series are listed below. The names enclosed in boxes are subseries names.
Products in mass production Products under development
2
C bus.
100-pin 100-pin 100-pin 100-pin 80-pin 80-pin 80-pin 80-pin
64-pin 64-pin
64-pin 64-pin
64-pin 42/44-pin
Control
PD78075B
µ
PD78078
µ
PD78070A
µ
PD780058
µ
PD78058F
µ
PD78054
µ
PD780065
µ
PD780078
µ
PD780034A
µ
PD780024A
µ
PD78014H
µ
PD78018F
µ
PD78083
µ
µ
PD78078Y PD78070AY
µ
PD780018AY
µ
PD780058Y
µ
PD78058FY
µ
PD78054Y
µ
PD780078Y
µ
PD780034AY
µ
PD780024AY
µ
PD78018FY
µ
Y subseries products are compatible with I
EMI-noise reduced version of the PD78078 PD78054 with added timer and enhanced external interface
µ
ROM-less version of the PD78078
µ
PD78078Y with enhanced serial I/O and limited functions
µ
PD78054 with enhanced serial I/O
EMI-noise reduced version of the PD78054
µ
PD78018F with added UART and D/A converter and enhanced I/O
PD780024A with increased RAM capacity
µ
µ
A PD780034A with added timer and enhanced serial I/O
µ
PD780024A with enhanced A/D converter
PD78018F with enhanced serial I/O
µ
EMI-noise reduced version of the PD78018F Basic subseries for control
On-chip UART, capable of operating at low voltage (1.8 V)
µ
µ
µ
µ
78K/0 Series
64-pin
80-pin 80-pin 80-pin
100-pin 100-pin 100-pin
80-pin
100-pin 80-pin 80-pin
80-pin
Inverter control
PD780988
µ
TM
FIP
drive
PD780208100-pin
PD780208
µ
µ
PD780228100-pin
µµ
PD780232
µ
PD78044H
µ
PD78044F
µ
LCD drive
PD780308
µ
PD78064B
µ
PD78064
Call ID supported
PD780841
µ
Bus interface supported
µ
PD780948
µ
PD78098B
PD780308Y
µ
PD78064Y
µµ
PD780701Y
µ
PD780833Y
µ
On-chip inverter control circuit and UART. EMI-noise reduced.
µ
PD78044F with enhanced I/O and FIP C/D. Display output total: 53
µ
PD78044H with enhanced I/O and FIP C/D. Display output total: 48
For panel control. On-chip FIP C/D. Display output total: 53
PD78044F with added N-ch open drain I/O. Display output total: 34
µ
Basic subseries for driving FIP. Display output total: 34
µ
PD78064 with enhanced SIO, and increased ROM, RAM capacity.
EMI-noise reduced version of the PD78064 Basic subseries for driving LCDs, on-chip UART
On-chip Call ID and simple DTMF. EMI-noise reduced.
On-chip D-CAN controller
PD78054 with IEBusTM controller added. EMI-noise reduced.
µ
On-chip D-CAN/IEBus controller
On-chip controller compliant with J1850 (Class 2)
µ
100-pin 80-pin
80-pin 80-pin
Meter control
PD780958
µ
PD780955
µ
PD780973
µ
PD780824
µ
For industrial meter control
Ultra low-power consumption. On-chip UART. On-chip automobile meter controller/driver For automobile meter. On-chip D-CAN controller.
Data Sheet U14045EJ1V0DS00
3
µ
PD780031AY, 780032AY, 780033AY, 780034AY
The major functional differences among the Y subseries are shown below.
Function ROM Capacity Configuration of Serial Interface I/O VDD MIN.
Subseries Name Value ControlµPD78078Y 48 K to 60 K 3-wire/2-wire/I2C: 1 ch 88 1.8 V
µ
PD78070AY
µ
PD780018AY 48 K to 60 K 3-wire with automatic transmit/receive function: 1 ch 88
µ
PD780058Y 24 K to 60 K 3-wire/2-wire/I2C: 1 ch 68 1.8 V
µ
PD78058FY 48 K to 60 K 3-wire/2-wire/I2C: 1 ch 69 2.7 V
µ
PD78054Y 16 K to 60 K
µ
PD780078Y 48 K to 60 K 3-wire: 1 ch 52 1.8 V
µ
PD780034AY 8 K to 32 K UART: 1 ch 51 1.8 V
µ
PD780024AY
µ
PD78018FY 8 K to 60 K 3-wire/2-wire/I2C: 1 ch 53
LCD drive 3-wire/time-division UART: 1 ch
µ
PD780308Y 48 K to 60 K 3-wire/2-wire/I2C: 1 ch 57 2.0 V
µ
PD78064Y 16 K to 32 K 3-wire/2-wire/I2C: 1 ch
3-wire with automatic transmit/receive function: 1 ch 3-wire/UART: 1 ch
Time-division 3-wire: 1 ch I2C bus (multimaster supported): 1 ch
3-wire with automatic transmit/receive function: 1 ch 3-wire/time-division UART: 1 ch
3-wire with automatic transmit/receive function: 1 ch 3-wire/UART: 1 ch
UART: 1 ch 3-wire/UART: 1 ch I2C bus (multimaster supported): 1 ch
3-wire: 1 ch I2C bus (multimaster supported): 1 ch
3-wire with automatic transmit/receive function: 1 ch
3-wire: 1 ch
3-wire/UART: 1 ch
61 2.7 V
2.0 V
Remark Functions other than the serial interface are common to the non-Y subseries.
4
Data Sheet U14045EJ1V0DS00
OVERVIEW OF FUNCTIONS
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Part Number
Item Internal ROM 8 Kbytes 16 Kbytes 24 Kbytes 32 Kbytes memory High-speed RAM 512 bytes 1024 bytes Memory space 64 Kbytes General-purpose registers 8 bits × 32 registers (8 bits × 8 registers × 4 banks) Minimum instruction execution On-chip minimum instruction execution time cycle variable function
time
Instruction set • 16-bit operation
I/O ports Total: 51
A/D converter • 10-bit resolution x 8 channels
Serial interface • 3-wire serial I/O mode: 1 channel
Timer • 16-bit timer/event counter: 1 channel
Timer output 3 (8-bit PWM output capable: 2) Clock output • 65.5 kHz, 131 kHz, 262 kHz, 524 kHz, 1.05 MHz, 2.10 MHz, 4.19 MHz, 8.38 MHz
Buzzer output 1.02 kHz, 2.05 kHz, 4.10 kHz, 8.19 kHz (@ 8.38-MHz operation with main system clock) Vectored Maskable Internal: 13, external: 5 interrupt Non-maskable Internal: 1 sources Software 1 Power supply voltage VDD = 1.8 to 5.5 V Operating ambient temperature TA = –40 to +85°C Package • 64-pin plastic shrink DIP (750 mils)
When main system 0.24 µs/0.48 µs/0.95 µs/1.91 µs/3.81 µs (@ 8.38-MHz operation) clock selected
When subsystem 122 µs (@ 32.768-kHz operation) clock selected
µ
PD780031AY
• Multiply/divide (8 bits × 8 bits,16 bits ÷ 8 bits)
• Bit manipulation (set, reset, test, Boolean operation)
• BCD adjust, etc.
• CMOS input: 8
• CMOS I/O: 39
• 5-V-tolerant N-ch open-drain I/O: 4
• Low-voltage operation available: AVDD = 1.8 to 5.5 V
• UART mode: 1 channel
• I2C bus mode (multimaster supported): 1 channel
• 8-bit timer/event counter: 2 channels
• Watch timer: 1 channel
• Watchdog timer: 1 channel
(@ 8.38-MHz operation with main system clock )
• 32.768 kHz (@ 32.768-kHz operation with subsystem clock)
• 64-pin plastic QFP (14 × 14 mm)
• 64-pin plastic LQFP (12 × 12 mm)
µ
PD780032AY
µ
PD780033AY
µ
PD780034AY
Data Sheet U14045EJ1V0DS00
5
µ
PD780031AY, 780032AY, 780033AY, 780034AY
CONTENTS
1. PIN CONFIGURATION (Top View) .....................................................................................................7
2. BLOCK DIAGRAM .............................................................................................................................10
3. PIN FUNCTIONS ................................................................................................................................11
3.1 Port Pins .................................................................................................................................................... 11
3.2 Non-Port Pins............................................................................................................................................ 12
3.3 Pin I/O Circuits and Recommended Connection of Unused Pins..................................................... 14
4. MEMORY SPACE ............................................................................................................................... 16
5. PERIPHERAL HARDWARE FUNCTION FEATURES .......................................................................17
5.1 Ports ........................................................................................................................................................... 17
5.2 Clock Generator ........................................................................................................................................ 18
5.3 Timer/Counter ........................................................................................................................................... 19
5.4 Clock Output/Buzzer Output Control Circuit ....................................................................................... 2 3
5.5 A/D Converter ........................................................................................................................................... 24
5.6 Serial Interface.......................................................................................................................................... 25
6. INTERRUPT FUNCTION....................................................................................................................28
7. EXTERNAL DEVICE EXPANSION FUNCTION ...............................................................................31
8. STANDBY FUNCTION .......................................................................................................................31
9. RESET FUNCTION ............................................................................................................................31
10. MASK OPTION...................................................................................................................................31
11. INSTRUCTION SET ...........................................................................................................................32
12. ELECTRICAL SPECIFICATIONS......................................................................................................34
13. PACKAGE DRAWINGS .....................................................................................................................57
14. RECOMMENDED SOLDERING CONDITIONS ................................................................................60
APPENDIX A. DEVELOPMENT TOOLS ................................................................................................62
APPENDIX B. RELATED DOCUMENTS ...............................................................................................65
6
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
1. PIN CONFIGURATION (Top View)
• 64-pin plastic shrink DIP (750 mils)
µ
PD780031AYCW-×××, 780032AYCW-×××, 780033AYCW-×××, 780034AYCW-×××
P40/AD0 P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6 P47/AD7
P50/A8
P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P56/A14 P57/A15
V
SS0
VDD0
P30 P31
P32/SDA0
P33/SCL0
P34 P35 P36
P20/SI30
P21/SO30
P22/SCK30
P23/RxD0
P24/TxD0
P25/ASCK0
DD1
V
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P67/ASTB P66/WAIT P65/WR P64/RD P75/BUZ P74/PCL P73/TI51/TO51 P72/TI50/TO50 P71/TI01 P70/TI00/TO0 P03/INTP3/ADTRG P02/INTP2 P01/INTP1 P00/INTP0
SS1
V X1 X2 IC XT1 XT2 RESET
DD
AV AVREF P10/ANI0 P11/ANI1 P12/ANI2 P13/ANI3 P14/ANI4 P15/ANI5 P16/ANI6 P17/ANI7 AV
SS
Cautions 1. Connect the IC (Internally Connected) pin directly to VSS0 or VSS1.
2. Connect the AV
SS pin to VSS0.
Remark When the µPD780031AY, 780032AY, 780033AY, and 780034AY are used in applications where the
noise generated inside the microcontroller needs to be reduced, the implementation of noise reduction measures, such as supplying voltage to V
DD0 and VDD1 individually and connecting VSS0 and VSS1 to
different ground lines, is recommended.
Data Sheet U14045EJ1V0DS00
7
µ
PD780031AY, 780032AY, 780033AY, 780034AY
• 64-pin plastic QFP (14 × 14 mm)
µ
PD780031AYGC-×××-AB8, 780032AYGC-×××-AB8, 780033AYGC-×××-AB8, 780034AYGC-×××-AB8
• 64-pin plastic LQFP (12 × 12 mm)
µ
PD780031AYGK-×××-8A8, 780032AYGK-×××-8A8, 780033AYGK-×××-8A8, 780034AYGK-×××-8A8
P47/AD7
P46/AD6
P45/AD5
P44/AD4
P43/AD3
P42/AD2
P41/AD1
P40/AD0
P67/ASTB
P66/WAIT
P65/WR
P64/RD
P75/BUZ
P74/PCL
P73/TI51/TO51
P72/TI50/TO50
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P50/A8
P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P56/A14 P57/A15
SS0
V V
DD0
P30 P31
P32/SDA0
P33/SCL0
P34 P35
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P71/TI01 P70/TI00/TO0 P03/INTP3/ADTRG P02/INTP2 P01/INTP1 P00/INTP0 V
SS1
X1 X2 IC XT1 XT2 RESET
DD
AV AV
REF
P10/ANI0
SS
P36
P20/SI30
P21/SO30
P24/TxD0
P23/RxD0
P22/SCK30
DD1
V
AV
P25/ASCK0
P17/ANI7
P16/ANI6
Cautions 1. Connect the IC (Internally Connected) pin directly to V
2. Connect the AVSS pin to VSS0.
Remark When the
µ
PD780031AY, 780032AY, 780033AY, and 780034AY are used in applications where the noise generated inside the microcontroller needs to be reduced, the implementation of noise reduction measures, such as supplying voltage to V
DD0 and VDD1 individually and connecting VSS0 and VSS1 to
different ground lines, is recommended.
8
Data Sheet U14045EJ1V0DS00
P15/ANI5
P14/ANI4
P13/ANI3
P12/ANI2
P11/ANI1
SS0 or VSS1.
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A8 to A15: Address Bus AD0 to AD7: Address/Data Bus ADTRG: AD Trigger Input ANI0 to ANI7: Analog Input ASCK0: Asynchronous Serial Clock ASTB: Address Strobe
DD: Analog Power Supply
AV AVREF: Analog Reference Voltage
SS: Analog Ground
AV BUZ: Buzzer Clock IC: Internally Connected INTP0 to INTP3: External Interrupt Input P00 to P03: Port 0 P10 to P17: Port 1 P20 to P25: Port 2 P30 to P36: Port 3 P40 to P47: Port 4 P50 to P57: Port 5 P64 to P67: Port 6
P70 to P75: Port 7 PCL: Programmable Clock RD: Read Strobe RESET: Reset RxD0: Receive Data SCK30, SCL0: Serial Clock SDA0: Serial Data SI30: Serial Input SO30: Serial Output TI00, TI01, TI50, TI51: Timer Input TO0, TO50, TO51: Timer Output TxD0: Transmit Data
DD0, VDD1: Power Supply
V VSS0, VSS1: Ground WAIT: Wait WR: Write Strobe X1, X2: Crystal (Main System Clock) XT1, XT2: Crystal (Subsystem Clock)
Data Sheet U14045EJ1V0DS00
9
2. BLOCK DIAGRAM
µ
PD780031AY, 780032AY, 780033AY, 780034AY
TI00/TO0/P70
TI01/P71
TI50/TO50/P72
TI51/TO51/P73
SI30/P20
SO30/P21
SCK30/P22
RxD0/P23
TxD0/P24
ASCK0/P25
SDA0/P32 SCL0/P33
ANI0/P10 to
ANI7/P17
AV AV
AV
REF
INTP0/P00 to
INTP3/P03
BUZ/P75
PCL/P74
16-BIT TIMER/ EVENT COUNTER
8-BIT TIMER/ EVENT COUNTER 50
8-BIT TIMER/ EVENT COUNTER 51
WATCHDOG TIMER
WATCH TIMER
SERIAL INTERFACE 30
UART0
I2C BUS
DD SS
A/D CONVERTER
INTERRUPT CONTROL
BUZZER OUTPUT
CLOCK OUTPUT CONTROL
78K/0
CPU CORE
RAM
V
DD0VDD1VSS0VSS1
ROM
IC
PORT 0
PORT 1
PORT 2
PORT 3
PORT 4
PORT 5
PORT 6
PORT 7 P70 to P75
EXTERNAL ACCESS
SYSTEM CONTROL
P00 to P03
P10 to P17
P20 to P25
P30 to P36
P40 to P47
P50 to P57
P64 to P67
AD0/P40 to AD7/P47
A8/P50 to A15/P57
RD/P64 WR/P65 WAIT/P66 ASTB/P67
RESET X1 X2 XT1 XT2
Remark The internal ROM and RAM capacities differ depending on the product.
10
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3. PIN FUNCTIONS
3.1 Port Pins (1/2)
Pin Name I/O Function After Alternate
Reset Function P00 I/O Port 0 Input INTP0 P01 P02 P03 P10 to P17 Input Port 1 Input ANI0 to ANI7
P20 I/O Port 2 Input SI30 P21 P22 P23 P24 TxD0 P25 ASCK0 P30 I/O Port 3 N-ch open-drain input/output port Input — P31 P32 P33 P34 An on-chip pull-up resistor can be — P35 P36 P40 to P47 I/O Port 4 Input AD0 to AD7
P50 to P57 I/O Port 5 Input A8 to A15
P64 I/O Port 6 Input RD P65 P66 P67
4-bit input/output port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be connected by means of software.
8-bit input-only port
6-bit input/output port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be connected by means of software.
7-bit input/output port The mask option can be used to specify the Input/output can be specified in 1-bit units. LEDs can be driven directly.
8-bit input/output port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be connected by means of software. The interrupt request flag (KRIF) is set to 1 by falling edge detection.
8-bit input/output port LEDs can be driven directly. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be connected by means of software.
4-bit input/output port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be connected by means of software.
connection of an on-chip pull-up resistor to P30, P31.
connected by means of software.
INTP1 INTP2 INTP3/ADTRG
SO30 SCK30 RxD0
SDA0 SCL0
WR WAIT ASTB
Data Sheet U14045EJ1V0DS00
11
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3.1 Port Pins (2/2)
Pin Name I/O Function After Alternate
Reset Function P70 I/O Port 7 Input TI00/TO0 P71 P72 P73 P74 PCL P75 BUZ
6-bit input/output port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be connected by means of software.
TI01 TI50/TO50 TI51/TO51
3.2 Non-Port Pins (1/2)
Pin Name I/O Function After Alternate
Reset Function INTP0 Input External interrupt request input for which the valid edge (rising edge, Input P00
INTP1 INTP2 P02 INTP3 P03/ADTRG SI30 Input Serial interface serial data input Input P20 SO30 Output Serial interface serial data output Input P21 SDA0 I/O Serial interface serial data input/output Input P32 SCK30 I/O Serial interface serial clock input/output Input P22 SCL0 P33 RxD0 Input Serial data input for asynchronous serial interface Input P23 TxD0 Output Serial data output for asynchronous serial interface Input P24 ASCK0 Input Serial clock input for asynchronous serial interface Input P25 TI00 Input External count clock input to 16-bit timer (TM0) Input P70/TO0
TI01 Capture trigger input to capture register (CR00) of 16-bit timer (TM0) P71 TI50 External count clock input to 8-bit timer (TM50) P72/TO50 TI51 External count clock input to 8-bit timer (TM51) P73/TO51 TO0 Output 16-bit timer (TM0) output Input P70/TI00 TO50 8-bit timer (TM50) output (also used for 8-bit PWM output) Input P72/TI50 TO51 8-bit timer (TM51) output (also used for 8-bit PWM output) P73/TI51 PCL Output Clock output (for trimming of main system clock and subsystem clock) Input P74 BUZ Output Buzzer output Input P75 AD0 to AD7 I/O Lower address/data bus for expanding memory externally Input P40 to P47 A8 to A15 Output Higher address bus for expanding memory externally Input P50 to P57 RD Output Strobe signal output for reading from external memory Input P64 WR Strobe signal output for writing to external memory P65 WAIT Input Wait insertion at external memory access Input P66 ASTB Output Strobe output that externally latches address information output to Input P67
falling edge, or both rising and falling edges) can be specified
Capture trigger input to capture register (CR01) of 16-bit timer (TM0)
ports 4 and 5 to access external memory
P01
12
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3.2 Non-Port Pins (2/2)
Pin Name I/O Function After Alternate
Reset Function ANI0 to ANI7 Input A/D converter analog input Input P10 to P17 ADTRG Input A/D converter trigger signal input Input P03/INTP3 AVREF Input A/D converter reference voltage input — AVDD A/D converter analog power supply. Set potential to that of VDD0 or VDD1.— — AVSS A/D converter ground potential. Set potential to that of VSS0 or VSS1.—— RESET Input System reset input — X1 Input Connecting crystal resonator for main system clock oscillation — X2 —— XT1 Input Connecting crystal resonator for subsystem clock oscillation — XT2 —— VDD0 Positive power supply for ports VSS0 Ground potential of ports — VDD1 Positive power supply (except ports) — VSS1 Ground potential (except ports) — IC Internally connected. Connect directly to VSS0 or VSS1.—
Data Sheet U14045EJ1V0DS00
13
µ
PD780031AY, 780032AY, 780033AY, 780034AY
3.3 Pin I/O Circuits and Recommended Connection of Unused Pins
The input/output circuit type of each pin and recommended connection of unused pins are shown in Table 3-1. For the input/output circuit configuration of each type, see Figure 3-1.
Table 3-1. Types of Pin Input/Output Circuits
Pin Name Input/Output I/O Recommended Connection of Unused Pins
Circuit Type P00/INTP0 to P02/INTP2 8-C Input Independently connect to VSS0 via a resistor. P03/INTP3/ADTRG P10/ANI0 to P17/ANI7 25 Input Independently connect to VDD0 or VSS0 via a resistor. P20/SI30 8-C I/O P21/SO30 5-H P22/SCK30 8-C P23/RxD0 P24/TxD0 5-H P25/ASCK0 8-C P30, P31 13-Q I/O Independently connect to VDD0 via a resistor. P32/SDA0 13-R P33/SCL0 P34 8-C Independently connect to VDD0 or VSS0 via a resistor. P35 5-H P36 8-C P40/AD0 to P47/AD7 5-H I/O Independently connect to VDD0 via a resistor. P50/A8 to P57/A15 I/O Independently connect to VDD0 or VSS0 via a resistor. P64/RD I/O P65/WR P66/WAIT P67/ASTB P70/TI00/TO0 8-C P71/TI01 P72/TI50/TO50 P73/TI51/TO51 P74/PCL 5-H P75/BUZ RESET 2 Input — XT1 16 Connect to VDD0. XT2 Leave open. AVDD Connect to VDD0. AVREF Connect to VSS0. AVSS IC Connect directly to VSS0 or VSS1.
14
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 3-1. Pin Input/Output Circuits
TYPE 2
IN
Schmitt-triggered input with hysteresis characteristics
TYPE 5-H
Pullup
enable
Data
Output
disable
V
DD0
P-ch
N-ch
V
SS0
V
DD0
P-ch
IN/OUT
TYPE 13-R
Data
Output disable
TYPE 16
Feedback cut-off
P-ch
V
IN/OUT
N-ch
SS0
Input
enable
TYPE 8-C
Pullup
enable
Data
Output
disable
TYPE 13-Q
Data
Output disable
V
  
DD0
P-ch
N-ch
V
Mask option
SS0
N-ch
V
SS0
XT1 XT2
TYPE 25
V
DD0
P-ch
P-ch
IN/OUT
Comparator
+
N-ch
V
SS0
REF
(threshold voltage)
V
IN
Input
enable
V
DD0
  
IN/OUT
Input
enable
Data Sheet U14045EJ1V0DS00
15
µ
PD780031AY, 780032AY, 780033AY, 780034AY
4. MEMORY SPACE
Figure 4-1 shows the memory map of the µPD780031AY, 780032AY, 780033AY, and 780034AY.
Figure 4-1. Memory Map
FFFFH
Special function registers
(SFRs) 256 × 8 bits
FF00H
FEFFH
FEE0H FEDFH
General-purpose
registers
32 × 8 bits
Data memory space
Program memory space
mmmmH
mmmmH – 1
F800H F7FFH
nnnnH + 1
nnnnH
0000H
Internal high-speed
External memory
Internal ROM
Note
RAM
Reserved
Note
nnnnH
Program area
1000H
0FFFH
CALLF entry area
0800H
07FFH
Program area
0080H 007FH
CALLT table area
0040H 003FH
Vector table area
0000H
Note The internal ROM and internal high-speed RAM capacities differ depending on the product (see the
following table).
16
Part Number Last Address of Internal ROM
nnnnH mmmmH
µ
PD780031AY 1FFFH FD00H
µ
PD780032AY 3FFFH
µ
PD780033AY 5FFFH FB00H
µ
PD780034AY 7FFFH
Data Sheet U14045EJ1V0DS00
Start Address of Internal High-Speed RAM
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5. PERIPHERAL HARDWARE FUNCTION FEATURES
5.1 Ports
The following 3 types of I/O ports are available.
• CMOS input (Port 1): 8
• CMOS input/output (Ports 0, 2 to 7, P34 to P36): 39
• N-ch open-drain input/output (P30 to P33): 4 Total: 51
Table 5-1. Port Functions
Name Pin Name Function
Port 0 P00 to P03 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software. Port 1 P10 to P17 Dedicated input port pins. Port 2 P20 to P25 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software. Port 3 P30 to P33 N-ch open-drain I/O port pins. Input/output can be specified in 1-bit units.
The mask option can be used to specify the connection of an on-chip pull-up resistor to P30, P31.
LEDs can be driven directly.
P34 to P36 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software. Port 4 P40 to P47 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
The interrupt request flag (KRIF) is set to 1 by falling edge detection. Port 5 P50 to P57 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
LEDs can be driven directly. Port 6 P64 to P67 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software. Port 7 P70 to P75 I/O port pins. Input/output can be specified in 1-bit units.
An on-chip pull-up resistor can be connected by means of software.
Data Sheet U14045EJ1V0DS00
17
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.2 Clock Generator
A system clock generator is incorporated. The minimum instruction execution time can be changed.
µ
• 0.24
s/0.48 µs/0.95 µs/1.91 µs/3.81 µs (@ 8.38-MHz operation with main system clock)
• 122 µs (@ 32.768-kHz operation with subsystem clock)
Figure 5-1. Clock Generator Block Diagram
XT1
XT2
X1
X2
Subsystem clock oscillator
Main system clock oscillator
STOP
f
XT
Watch timer, clock output function
Prescaler
1
2
f
XT
2
Selector
Standby control circuit
Wait control circuit
f
X
f
X
2
Prescaler
f
X
f
X
2
3
2
2
f
X
4
2
Clock to peripheral hardware
CPU clock (f
CPU
)
18
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.3 Timer/Counter
Five timer/counter channels are incorporated.
• 16-bit timer/event counter: 1 channel
• 8-bit timer/event counter: 2 channels
• Watch timer: 1 channel
• Watchdog timer: 1 channel
Table 5-2. Operations of Timer/Event Counters
16-Bit Timer/ 8-Bit Timer/ Watch Timer Watchdog Timer
Event Counter TM0 Event Counters TM50, TM51
Operation mode
Interval timer 1 channel 2 channels 1 channel External event counter 1 channel 2 channels
Function
Timer output 1 output 2 outputs — PPG output 1 output — PWM output 2 outputs — Pulse width measurement 2 inputs — Square wave output 1 output 2 outputs — One-shot pulse output 1 output — Interrupt source 2 2 2 1
Note 1
1 channel
Note 2
Notes 1. The watch timer can perform both watch timer and interval timer functions at the same time.
2. The watchdog timer has watchdog timer and interval timer functions. However, use the watchdog timer
by selecting either the watchdog timer function or the interval timer function.
Data Sheet U14045EJ1V0DS00
19
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 5-2. Block Diagram of 16-Bit Timer/Event Counter TM0
Internal bus
TI01/P71
3
fX/2
TI00/TO0/P70
fX/2 fX/2
X
f
2 6
Noise elimi­nation circuit
Noise elimi­nation circuit
Selector
Noise elimi­nation circuit
16-bit capture/compare register 00 (CR00)
Selector
16-bit timer counter 0 (TM0)
16-bit capture/compare register 01 (CR01)
Internal bus
Match
Match
Clear
Selector
Selector
Output control circuit
INTTM00
TO0/TI00/P70
INTTM01
20
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 5-3. Block Diagram of 8-Bit Timer/Event Counter TM50
Internal bus
TI50/TO50/P72
fX/2
fX/2 fX/2 fX/2
fX/2
TCL502 TCL501 TCL500
Timer clock select register 50 (TCL50)
8-bit compare register 50 (CR50)
f
X 2
4 6 8
10
8-bit timer counter
Selector
50 (TM50)
Match
OVF
Mask circuit
Selector INTTM50
S
Q
INV
R
TO50/TI50/P72
Selector
Clear
3
Selector
TCE50
TMC506 TMC504
S R
LVS50 LVR50
Invert level
TMC501
TOE50
8-bit timer mode control register 50 (TMC50)
Internal bus
Figure 5-4. Block Diagram of 8-Bit Timer/Event Counter TM51
Internal bus
TI51/TO51/P73
fX/2 fX/2 fX/2 fX/2 fX/2
fX/2
TCL512 TCL511 TCL510
Timer clock select register 51 (TCL51)
8-bit compare register 51 (CR51)
Selector
INTTM51
Match
3 5 7 9
11
Selector
8-bit timer counter 51 (TM51)
Mask circuit
OVF
INV
S
Q
TO51/TI51/P73
R
Selector
Clear
3
Selector
TCE51
TMC516 TMC514
S R
LVS51 LVR51
Invert level
TMC511
TOE51
8-bit timer mode control register 51 (TMC51)
Internal bus
Data Sheet U14045EJ1V0DS00
21
fX/2
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Figure 5-5. Watch Timer Block Diagram
Clear
7
f
XT
f
W
Selector
f
W
f
4
2
2
9-bit prescaler
W
f
W
f
5
W
6
7
2
2
f
W
f
W
8
2
9
2
Selector
WTM7 WTM6 WTM5 WTM4 WTM1 WTM0
Watch timer operation mode register (WTM)
Internal bus
5-bit counter INTWT
Clear
INTWTI
8
fX/2
OSTS2 OSTS1 OSTS0 WDCS2 WDCS1 WDCS0
Oscillation stabilization time select register (OSTS)
Figure 5-6. Watchdog Timer Block Diagram
Clock input control circuit
RUN
Division circuit
Division mode selection circuit
Watchdog timer clock select register (WDCS)
Divided clock selection circuit
3
Internal bus
RUN WDTM4 WDTM3
Watchdog timer mode register (WDTM)
Output control circuit
INTWDT
RESET
WDT mode signal
22
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.4 Clock Output/Buzzer Output Control Circuit
A clock output/buzzer output control circuit (CKU) is incorporated. Clocks with the following frequencies can be output as clock output.
• 65.5 kHz/131 kHz/262 kHz/524 kHz/1.05 MHz/2.10 MHz/4.19 MHz/8.38 MHz (@ 8.38-MHz operation with main system clock)
• 32.768 kHz (@ 32.768-kHz operation with subsystem clock)
Clocks with the following frequencies can be output as buzzer output.
• 1.02 kHz/2.05 kHz/4.10 kHz/8.19 kHz (@ 8.38-MHz operation with main system clock)
Figure 5-7. Block Diagram of Clock Output/Buzzer Output Control Circuit CKU
fX
fXT
BZOE BCS1 BCS0 CLOE CCS3 CCS2 CCS1 CCS0
Prescaler
8
Clock output select register (CKS)
Internal bus
fX to fX/2
4
fX/210 to fX/2
7
13
Selector
Selector
BZOE
Clock
control
circuit
CLOE
BUZ/P75
BCS0, BCS1
PCL/P74
Data Sheet U14045EJ1V0DS00
23
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.5 A/D Converter
An A/D converter consisting of eight 10-bit resolution channels is incorporated. The following two A/D conversion operation start-up methods are available.
• Hardware start
• Software start
Figure 5-8. A/D Converter Block Diagram
ANI0/P10 ANI1/P11 ANI2/P12 ANI3/P13 ANI4/P14 ANI5/P15 ANI6/P16 ANI7/P17
Selector
Sample & hold circuit
Voltage comparator
Succesive approximation register (SAR)
Series resistor string
Tap selector
AV AV
AV
DD
REF
SS
ADTRG/INTP3/P03
Edge detection circuit
Edge detection circuit
Control circuit
A/D conversion result register 0 (ADCR0)
Internal bus
INTAD
INTP3
24
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
5.6 Serial Interface
Three serial interface channels are incorporated.
• Serial interface UART0: 1 channel
• Serial interface SIO30: 1 channel
• Serial interface IIC0: 1 channel
(1) Serial interface UART0
The serial interface UART0 has two modes: asynchronous serial interface (UART) mode and infrared data transfer mode.
• Asynchronous serial interface (UART) mode
This mode enables full-duplex operation wherein one byte of data starting from the start bit is transmitted and received. The on-chip UART-dedicated baud-rate generator enables communication using a wide range of selectable baud rates. In addition, a baud rate can be also defined by dividing the clock input to the ASCK0 pin. The UART-dedicated baud-rate generator can also be used to generate a MIDI-standard baud rate (31.25 kbps).
RxD0/P23
TxD0/P24
• Infrared data transfer mode
This mode enables pulse output and pulse reception in data format. This mode can be used for office equipment applications such as personal computers.
Figure 5-9. Block Diagram of Serial Interface UART0
Internal bus
Receive buffer
RXB0
RX0
register 0
Receive shift register 0
Receive control circuit (parity check)
PE0 FE0
INTSR0
Asynchronous serial interface status register 0 (ASIS0)
OVE0
TXS0
INTSER0
Transmit shift register 0
Transmit control circuit (parity addition)
TXE0 RXE0
INTST0
PS01 PS00
CL0 SL0
Asynchronous serial interface mode register 0 (ASIM0)
ISRM0
IRDAM0
Data Sheet U14045EJ1V0DS00
Baud rate generator
ASCK0/P25
X
/2 to fX/2
f
7
25
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Serial interface SIO30
The serial interface SIO30 has one mode: 3-wire serial I/O mode.
• 3-wire serial I/O mode (fixed as MSB first)
This is an 8-bit data transfer mode using three lines: a serial clock line (SCK30), serial output line (SO30), and serial input line (SI30). Since simultaneous transmit and receive operations are enabled in the 3-wire serial I/O mode, the processing time for data transfer is reduced. The first bit in 8-bit data in the serial transfer is fixed as MSB. The 3-wire serial I/O mode is useful for connection to peripheral I/O devices, display controllers, etc. that include a clocked serial interface.
Figure 5-10. Block Diagram of Serial Interface SIO30
Internal bus
SI30/P20
8
Serial I/O shift register 30 (SIO30)
SO30/P21
SCK30/P22
Serial clock counter
Serial clock control circuit
Interrupt request signal generator
Selector
INTCSI30
3
X
/2
f
4
fX/2
5
fX/2
26
Data Sheet U14045EJ1V0DS00
(3) Serial interface IIC0
The serial interface IIC0 has the I2C (Inter IC) bus mode (multimaster supported).
2
C bus mode (multimaster supported)
•I
This is an 8-bit data transfer mode using two lines: a serial clock line (SCL0) and serial data bus line (SDA0). This mode complies with the I during transmission via the serial data bus. This data is automatically detected by hardware during reception. Since the SCL0 and SDA0 are open-drain outputs in IIC0, pull-up resistors for the serial clock line and the serial data bus line are required.
SDA0/P32
Noise elimination circuit
µ
PD780031AY, 780032AY, 780033AY, 780034AY
2
C bus format, and can output "start condition", "data", and "stop condition"
Figure 5-11. Block Diagram of Serial Interface IIC0
Internal bus
IIC control register 0
Slave address register 0 (SVA0)
Matched signal
IIC shift register 0 (IIC0)
IICE0
CLEAR
D
(IICC0)
LREL0
SET
SO0 latch
CL00
WREL0
SPIE0
WTIM0
ACKE0
IIC status register 0
(IICS0)
MSTS0
ALD0 EXC0 COI0 TRC0
STT0 SPT0
ACKD0
STD0 SPD0
SCL0/P33
N-ch open­drain output
Noise elimination circuit
N-ch open-drain output
Acknowledge
detection circuit
Start condition detection circuit
Stop condition detection circuit
Serial clock counter
Serial clock control circuit
f
X
DAD0 SMC0 DFC0
CLD0
Data hold time correction circuit
Prescaler
Serial clock wait control circuit
IIC transfer clock select
CL00
register 0 (IICCL0)
Acknowledge detection circuit
Wake-up control circuit
Interrupt request signal generator
INTIIC0
Internal bus
Data Sheet U14045EJ1V0DS00
27
µ
PD780031AY, 780032AY, 780033AY, 780034AY
6. INTERRUPT FUNCTION
A total of 20 interrupt sources are provided, divided into the following three types.
• Non-maskable: 1
• Maskable: 18
• Software: 1
Table 6-1. Interrupt Source List
Interrupt Default Interrupt Source Internal/ Vector Table
Type Priority
Non- INTWDT Watchdog timer overflow (with watchdog timer Internal 0004H (A) maskable mode 1 selected)
Maskable 0 INTWDT Watchdog timer overflow (with interval timer (B)
Software BRK Execution of BRK instruction 003EH (E)
Note 1
1 INTP0 Pin input edge detection External 0006H (C) 2 INTP1 0008H 3 INTP2 000AH 4 INTP3 000CH 5 INTSER0 Generation of serial interface UART0 Internal 000EH (B)
6 INTSR0 End of serial interface UART0 reception 0010H 7 INTST0 End of serial interface UART0 transmission 0012H 8 INTCSI30 End of serial interface SIO30 transfer 0014H
9 INTIIC0 End of serial interface IIC0 transfer 0016H 10 INTWTI Reference time interval signal from watch timer 001AH 11 INTTM00 Matching of TM0 and CR00 (when CR00 is 001CH
12 INTTM01 Matching of TM0 and CR01 (when CR01 is 001EH
13 INTTM50 Matching of TM50 and CR50 0020H 14 INTTM51 Matching of TM51 and CR51 0022H 15 INTAD0 End of conversion by A/D converter 0024H 16 INTWT Watch timer overflow 0026H 17 INTKR Detection of port 4 falling edge External 0028H (D)
Name Trigger External Address
mode selected)
reception error
specified as a compare register) Detection of TI01 pin valid edge (when CR00 is specified as a capture register)
specified as a compare register) Detection of TI00 pin valid edge (when CR00 is specified as a capture register)
Basic
Configuration
Type
Note 2
Notes 1. Default priority is the priority order when several maskable interrupt requests are generated at the same
time. 0 is the highest and 17 is the lowest.
2. Basic configuration types (A) to (E) correspond to (A) to (E) in Figure 6-1.
28
Data Sheet U14045EJ1V0DS00
Figure 6-1. Basic Configuration of Interrupt Function (1/2)
(A) Internal non-maskable interrupt
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Internal bus
Interrupt request
(B) Internal maskable interrupt
Interrupt request
Priority control circuit
Internal bus
MK
IF
IE
Priority control circuit
Vector table address generator
PR ISP
Standby release signal
Vector table address generator
Standby release signal
(C) External maskable interrupt (INTP0 to INTP3)
Internal bus
External interrupt edge enable register (EGP, EGN)
Interrupt request
Edge detection circuit
IF
Data Sheet U14045EJ1V0DS00
MK IE
PR ISP
Priority control circuit
Vector table address generator
Standby release signal
29
Figure 6-1. Basic Configuration of Interrupt Function (2/2)
(D) External maskable interrupt (INTKR)
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Internal bus
Interrupt request
1 when MEM = 01H
(E) Software interrupt
IF: Interrupt request flag IE: Interrupt enable flag ISP: In-service priority flag MK: Interrupt mask flag PR: Priority specification flag MEM: Memory expansion mode register
Falling edge detection circuit
Interrupt request
MK IE
IF
Priority control circuit
Internal bus
PR ISP
Priority control circuit
Vector table address generator
Vector table address generator
Standby release signal
30
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
7. EXTERNAL DEVICE EXPANSION FUNCTION
The external device expansion function is for connecting external devices to areas other than the internal ROM,
RAM, and SFR. Ports 4 to 6 are used for external device connection.
8. STANDBY FUNCTION
The following two standby modes are available for further reduction of system current consumption.
• HALT mode: In this mode, the CPU operation clock is stopped. The average current consumption can be reduced by intermittent operation by combining this mode with the normal operation mode.
• STOP mode: In this mode, oscillation of the main system clock is stopped. All the operations performed on the main system clock are suspended, and only the subsystem clock is used, resulting in extremely small power consumption. This can be used only when the main system clock is operating (the subsystem clock oscillation cannot be stopped).
Figure 8-1. Standby Function
Main system clock operation
STOP
Interrupt
request
STOP mode
Main system clock
operation is stopped
instruction
Interrupt request
CSS = 1
CSS = 0
HALT instruction
HALT mode HALT mode
Clock supply for CPU is stopped,
oscillation is maintained
9. RESET FUNCTION
The following two reset methods are available.
• External reset by RESET signal input
• Internal reset by watchdog timer runaway time detection
10. MASK OPTION
Table 10.1 Pin Mask Option Selection
Subsystem clock operation
HALT instruction
Interrupt request
Clock supply for CPU is stopped,
oscillation is maintained
Pins Mask Option
P30, P31 An on-chip pull-up resistor can be specified in 1-bit units.
The mask option can be used to specify the connection of an on-chip pull-up resistor to P30, P31, in 1-bit units.
Data Sheet U14045EJ1V0DS00
31
µ
PD780031AY, 780032AY, 780033AY, 780034AY
11. INSTRUCTION SET
(1) 8-bit instructions
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, ROR4, ROL4, PUSH, POP, DBNZ
2nd Operand
1st Operand
A
r
B, C sfr
saddr
!addr16 PSW
[DE] [HL]
[HL + byte] [HL + B]
[HL + C]
X C
#byte A r
ADD ADDC SUB SUBC
AND OR XOR
CMP
MOV MOV
ADD ADDC SUB SUBC
AND OR XOR
CMP
MOV MOV MOV
ADD ADDC SUB SUBC
AND
OR
XOR CMP
MOV DBNZ INC
MOV MOVMOV PUSH
MOV MOV
MOV
[HL + byte]
Note
MOV MOV MOV MOV MOV MOV MOV MOV ROR
XCH XCH XCH XCH XCH XCH XCH ROL ADD ADDC ADDC ADDC ADDC ADDC SUB SUB SUB SUB SUB SUBC SUBC SUBC SUBC SUBC AND AND AND AND AND OR OR OR OR OR XOR XOR XOR XOR XOR CMP CMPCMP CMP CMP
sfr saddr !addr16 PSW [DE] [HL]
ADD ADD ADD ADD
[HL + B] [HL + C]
$addr16 1
RORC ROLC
DBNZ
None
INC
DEC
DEC
POP
ROR4 ROL4
MULU
DIVUW
Note Except r = A
32
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) 16-bit instructions
MOVW, XCHW, ADDW, SUBW, CMPW, PUSH, POP, INCW, DECW
2nd Operand
1st Operand
AX
rp
sfrp saddrp
!addr16 SP
#word
ADDW SUBW
CMPW MOVW
MOVW MOVW
MOVW
MOVW
MOVW MOVW MOVW
MOVW
Note Only when rp = BC, DE or HL
(3) Bit manipulation instructions
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR
2nd Operand
1st Operand
A.bit
sfr.bit
saddr.bit
PSW.bit
[HL].bit
CY
A.bit sfr.bit
MOV1 AND1 OR1 XOR1
MOV1 AND1 OR1 XOR1
AX
Note
rp
MOVW XCHW
Note
saddr.bit PSW.bit [HL].bit CY $addr16 None
MOV1 AND1 OR1 XOR1
MOVW
MOV1 AND1 OR1 XOR1
sfrp
saddrp
MOVW
MOV1 AND1 OR1 XOR1
!addr16 MOVW
MOV1
MOV1
MOV1
MOV1
MOV1
MOVW
BT BF BTCLR
BT BF BTCLR
BT BF BTCLR
BT BF BTCLR
BT BF BTCLR
SP
None
INCW, DECW PUSH, POP
SET1 CLR1
SET1 CLR1
SET1 CLR1
SET1 CLR1
SET1 CLR1
SET1 CLR1 NOT1
(4) Call instructions/branch instructions
CALL, CALLF, CALLT, BR, BC, BNC, BZ, BNZ, BT, BF, BTCLR, DBNZ
2nd Operand
1st Operand Basic instruction
Compound instruction
AX !addr16 !addr11 [addr5] $addr16
BR CALL
BR
CALLF CALLT BR, BC, BNC
(5) Other instructions
ADJBA, ADJBS, BRK, RET, RETI, RETB, SEL, NOP, EI, DI, HALT, STOP
Data Sheet U14045EJ1V0DS00
BZ, BNZ BT, BF
BTCLR DBNZ
33
µ
PD780031AY, 780032AY, 780033AY, 780034AY
12. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°C)
Parameter Symbol Test Conditions Ratings Unit
Supply voltage VDD –0.3 to +6.5 V
AVDD –0.3 to VDD + 0.3 AVREF –0.3 to VDD + 0.3 AVSS –0.3 to +0.3 V
Input voltage VI1
VI2 P30 to P33 N-ch open-drain Without pull-up resistor –0.3 to +6.5 V
Output voltage VO –0.3 to VDD + 0.3 Analog input voltage
Output current, IOH Per pin –10 mA high
Output current, IOL Per pin for P00 to P03, P20 to P25, P34 to 20 mA low P36, P40 to P47, P64 to P67, P70 to P75
Operating ambient TA –40 to +85 °C temperature
Storage Tstg –65 to +150 °C temperature
VAN P10 to P17 Analog input pin
P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, X1, X2, XT1, XT2, RESET
With pull-up resistor –0.3 to VDD + 0.3
Total for P00 to P03, P40 to P47, P50 to P57, P64 to P67, P70 to P75 Total for P20 to P25, P30 to P36 –15 mA
Per pin for P30 to P33, P50 to P57 30 mA Total for P00 to P03, P40 to P47, 50 mA
P64 to P67, P70 to P75 Total for P20 to P25 20 mA Total for P30 to P36 100 mA Total for P50 to P57 100 mA
–0.3 to VDD + 0.3
AVSS – 0.3 to AVREF + 0.3
and –0.3 to VDD + 0.3
–15 mA
Note
Note
Note
Note
Note
Note
Note
V V
V
V V V
Note 6.5 V or below
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded.
34
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Capacitance (TA = 25°C, VDD = VSS = 0 V)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Input CIN f = 1 MHz 15 pF capacitance Unmeasured pins returned to 0 V.
I/O CIO f = 1 MHz P00 to P03, P20 to P25, 15 pF capacitance Unmeasured pins P34 to P36, P40 to P47,
returned to 0 V. P50 to P57, P64 to P67,
P70 to P75 P30 to P33 20 pF
Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins.
Main System Clock Oscillator Characteristics (TA = –40 to 85°C, VDD = 1.8 to 5.5 V)
Resonator
Ceramic Oscillation VDD = 4.0 to 5.5 V 1.0 8.38 MHz resonator frequency (fX)
Recommended
Circuit
C1
IC
C2
X1 X2
Parameter Test Conditions MIN. TYP. MAX. Unit
Note 1
1.0 5.0
Oscillation After VDD reaches 4 ms stabilization time
Note 2
oscillation voltage range MIN.
Crystal Oscillation VDD = 4.0 to 5.5 V 1.0 8.38 MHz resonator frequency (fX)
X1 X2
C1
IC
C2
Oscillation VDD = 4.0 to 5.5 V 10 ms stabilization time
Note 1
Note 2
1.0 5.0
30
External X1 input VDD = 4.0 to 5.5 V 1.0 8.38 MHz clock frequency (fX)
X2X1
Note 1
1.0 5.0
X1 input VDD = 4.0 to 5.5 V 50 500 ns
µ
PD74HCU04
high-/low-level width
85 500
(tXH, tXL)
Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after reset or STOP mode release.
Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
SS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
2. When the main system clock is stopped and the system is operating on the subsystem clock, wait until the oscillation stabilization time has been secured by the program before switching back to the main system clock.
Data Sheet U14045EJ1V0DS00
35
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Subsystem Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
Resonator
Crystal resonator
External clock
Recommended Circuit
XT2 XT1
µ
PD74HCU04
IC
R
C3
C4
XT1XT2
Parameter
Oscillation frequency (fXT)
Oscillation stabilization time
XT1 input frequency (fXT)
XT1 input high-/low-level width (tXTH , tXTL)
Note 1
Note 2
Note 1
Test Conditions
VDD = 4.0 to 5.5 V
MIN.
TYP.
32
32.768
1.2
32
515
MAX.
35
2
10
38.5
Unit
kHz
s
kHz
µ
s
Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after VDD reaches oscillation voltage range MIN.
Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
SS1.
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing current consumption, and is more prone to malfunction due to noise than the main system clock oscillator. Particular care is therefore required with the wiring method when the subsystem clock is used.
36
Data Sheet U14045EJ1V0DS00
Recommended Oscillator Constant
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Main system clock: Ceramic resonator (T
Manufacturer Part Number Frequency Recommended Circuit Constant Oscillation Voltage Range
Murata Mfg. CSB1000J 1.00 100 100 1.8 5.5 Co., Ltd.
TDK CCR3.58MC3 3.58 On-chip On-chip 1.8 5.5
CSA2.00MG040 2.00 100 100 1.8 5.5 CST2.00MG040 2.00 On-chip On-chip 1.8 5.5 CSA3.58MG 3.58 30 30 1.8 5.5 CST3.58MGW 3.58 On-chip On-chip 1.8 5.5 CSA4.19MG 4.19 30 30 1.8 5.5 CST4.19MGW 4.19 On-chip On-chip 1.8 5.5 CSA5.00MG 5.00 30 30 1.8 5.5 CST5.00MGW 5.00 On-chip On-chip 1.8 5.5 CSA8.00MTZ 8.00 30 30 4.0 5.5 CST8.00MTW 8.00 On-chip On-chip 4.0 5.5 CSA8.00MTZ093 8.00 30 30 4.0 5.5 CST8.00MTW093 8.00 On-chip On-chip 4.0 5.5 CSA8.38MTZ 8.38 30 30 4.0 5.5 CST8.38MTW 8.38 On-chip On-chip 4.0 5.5 CSA8.38MTZ093 8.38 30 30 4.0 5.5 CST8.38MTW093 8.38 On-chip On-chip 4.0 5.5
CCR4.19MC3 4.19 On-chip On-chip 1.8 5.5 CCR5.0MC3 5.00 On-chip On-chip 1.8 5.5 CCR8.0MC5 8.00 On-chip On-chip 4.0 5.5 CCR8.38MC5 8.38 On-chip On-chip 4.0 5.5
A = –40 to +85°C)
(MHz) C1 (pF) C2 (pF) MIN. (V) MAX. (V)
Caution The oscillator constant and oscillation voltage range indicate conditions of stable oscillation.
Oscillation frequency precision is not guaranteed. For applications requiring oscillation frequency precision, the oscillation frequency must be adjusted on the implementation circuit. For details, please contact directly the manufacturer of the resonator you will use.
Data Sheet U14045EJ1V0DS00
37
µ
PD780031AY, 780032AY, 780033AY, 780034AY
DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Output current, IOH Per pin –1 mA high
Output current, IOL Per pin for P00 to P03, P20 to P25, P34 to P36, 10 mA low P40 to P47, P64 to P67, P70 to P75
Input voltage, VIH1 high P40 to P47, P50 to P57,
VIH2
VIH3 P30 to P33 VDD = 2.7 to 5.5 V 0.7VDD 5.5 V
VIH4 X1, X2 VDD = 2.7 to 5.5 V
VIH5 XT1, XT2 VDD = 4.0 to 5.5 V 0.8VDD VDD V
Input voltage, VIL1 P10 to P17, P21, P24, P35, VDD = 2.7 to 5.5 V 0 0.3VDD V low
VIL2
VIL3 P30 to P33 4.0 V VDD 5.5 V 0 0.3VDD V
VIL4 X1, X2 VDD = 2.7 to 5.5 V 0 0.4 V
VIL5 XT1, XT2 VDD = 4.0 to 5.5 V 0 0.2V DD V
Output voltage, VOH1 VDD = 4.0 to 5.5 V, IOH = –1 mA high
Output voltage, VOL1 P30 to P33 VDD = 4.0 to 5.5 V, 2.0 V low
VOL2 IOL = 400 µA 0.5 V
All pins –15 mA
Per pin for P30 to P33, P50 to P57 15 mA Total for P00 to P03, P40 to P47, P64 to P67, P70 to P75 Total for P20 to P25 10 mA Total for P30 to P36 70 mA Total for P50 to P57 70 mA P10 to P17, P21, P24, P35,
P64 to P67, P74, P75 P00 to P03, P20, P22, P23, P25,
P34, P36, P70 to P73, RESET
(N-ch open-drain)
P40 to P47, P50 to P57, P64 to P67,
P00 to P03, P20, P22, P23, P25, P34, P36, P70 to P73, RESET
IOH = –100 µA
P50 to P57 P00 to P03, P20 to P25, P34 to P36,
P40 to P47, P64 to P67, P70 to P75
P74, P75
VDD = 2.7 to 5.5 V 0.7VDD VDD V
0.8VDD VDD V
VDD = 2.7 to 5.5 V 0.8VDD VDD V
0.85VDD VDD V
0.8VDD 5.5 V VDD 0.5 VDD 0.2
0.9VDD VDD V
0
VDD = 2.7 to 5.5 V 0 0.2VDD V
0 0.15VDD V
2.7 V VDD < 4.0 V 0 0.2VDD V
1.8 V VDD < 2.7 V 0 0.1VDD V
0 0.2 V
0 0.1VDD V VDD 1.0 VDD 0.5
IOL = 15 mA VDD = 4.0 to 5.5 V, 0.4 V
IOL = 1.6 mA
0.4 2.0 V
20 mA
VDD V VDD V
0.2VDD V
VDD V VDD V
Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins.
38
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Input leakage ILIH1 VIN = VDD current, high
ILIH2 X1, X2, XT1, XT2 20 ILIH3 VIN = 5.5 V P30 to P33
Input leakage ILIL1 VIN = 0 V current, low
ILIL2 X1, X2, XT1, XT2 –20 ILIL3 P30 to P33
Output leakage ILOH VOUT = VDD 3 current, high
Output leakage ILOL VOUT = 0 V –3 current, low
Mask option pull-up resistance
Software pull- R2 VIN = 0 V, 15 30 90 k up resistance P00 to P03, P20 to P25, P34 to P36, P40 to P47,
R1 VIN = 0 V, 15 30 90 k
P30, P31
P50 to P57, P64 to P67, P70 to P75
P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, RESET
Note
P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, RESET
Note
3
3
–3
–3
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
Note When pull-up resistors are not connected to P30, P31 (specified by the mask option).
Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins.
Data Sheet U14045EJ1V0DS00
39
µ
PD780031AY, 780032AY, 780033AY, 780034AY
DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Power supply IDD1 8.38-MHz
Note 1
current
crystal oscillation operating mode
5.00-MHz crystal oscillation operating mode
IDD2 8.38-MHz
crystal oscillation HALT mode
5.00-MHz crystal oscillation HALT mode
IDD3 32.768-kHz crystal oscillation VDD = 5.0 V ±10% 40 80
operating mode
IDD4 32.768-kHz crystal oscillation VDD = 5.0 V ±10% 30 60
HALT mode
IDD5 XT1 = 0V STOP mode VDD = 5.0 V ±10% 0.1 30
When feedback resistor is not used
VDD = 5.0V±10%
VDD = 3.0V±10%
VDD = 2.0V±10%
VDD = 5.0V±10%
VDD = 3.0V±10%
VDD = 2.0V±10%
Note 4
Note 4
Note 2
When A/D converter is 5.5 11 mA stopped
When A/D converter is 6.5 13 mA operating
Note 2
When A/D converter is 2 4 mA stopped
When A/D converter is 3 6 mA operating
Note 3
When A/D converter is 0.4 1.5 mA stopped
When A/D converter is 1.4 4.2 mA operating
Note 2
When peripheral functions
1.1 2.2 mA
are stopped When peripheral functions
are operating
Note 2
When peripheral functions
0.35 0.7 mA
are stopped When peripheral functions
are operating
Note 3
When peripheral functions 0.15 0.4 mA are stopped
When peripheral functions are operating
VDD = 3.0 V ±10% 20 40 VDD = 2.0 V ±10% 10 20
VDD = 3.0 V ±10% 6 18 VDD = 2.0 V ±10% 2 10
VDD = 3.0 V ±10% 0.05 10 VDD = 2.0 V ±10% 0.05 10
4.7 mA
1.7 mA
1.1 mA
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
µ
A
Notes 1. Total current through the internal power supply (VDD0, VDD1), including the peripheral operation current
(except the current through pull-up resistors of ports and the AVREF pin).
2. When the processor clock control register (PCC) is set to 00H.
3. When PCC is set to 02H.
4. When main system clock operation is stopped.
40
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
AC Characteristics
(1) Basic Operation
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Cycle time TCY Operating with 4.0 V VDD 5.5 V 0.24 16 (Min. instruction main system clock execution time)
TI00, TI01 input tTIH0, tTIL0 4.0 V VDD 5.5 V high-/low-level width
TI50, TI51 input fTI5 VDD = 2.7 to 5.5 V 0 4 MHz frequency
TI50, TI51 input tTIH5, tTIL5 VDD = 2.7 to 5.5 V 100 ns high-/low-level width
Interrupt request tINTH, tINTL INTP0 to INTP3, VDD = 2.7 to 5.5 V 1 input high-/low P40 to P47
-level width RESET tRSL VDD = 2.7 to 5.5 V 10
low-level width
(TA = –40 to +85°C, VDD = 1.8 to 5.5 V)
2.7 V VDD < 4.0 V 0.4 16
Operating with subsystem clock
2.7 V VDD < 4.0 V
1.6 16
Note 1
103.9 2/fsam + 0.1 2/fsam + 0.2 2/fsam + 0.5
0 275 kHz
1.8 ns
2
20
122 125
Note2
Note2
Note2
Notes 1. Value when an external clock is used. When a crystal resonator is used, it is 114 µs (MIN.).
2. Selection of fsam = fX, fX/4, fX/64 is possible using bits 0 and 1 (PRM00, PRM01) of prescaler mode register
0 (PRM0). However, if the TI00 valid edge is selected as the count clock, the value becomes f
sam = fX/8.
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
µ
s
Data Sheet U14045EJ1V0DS00
41
µ
PD780031AY, 780032AY, 780033AY, 780034AY
TCY vs. VDD (main system clock operation)
16.0
10.0
µ
[ s]
5.0
CY
2.0
1.6
Cycle time T
1.0
0.4
0.24
0.1 0
Operation guaranteed range
1.0 2.0 3.0 4.0 5.0 6.0
1.8
2.7
Supply voltage V
DD
[V]
5.5
42
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Read/Write Operation (TA = –40 to + 85°C, VDD = 4.0 to 5.5 V)
(1/3)
Parameter Symbol Test Conditions MIN. MAX. Unit ASTB high-level width tASTH 0.3tCY ns Address setup time tADS 20 ns Address hold time tADH 6ns Data input time from address tADD1 (2 + 2n)tCY – 54 ns
tADD2 (3 + 2n)tCY – 60 ns Address output time from RD t RDAD 0 100 ns Data input time from RD tRDD1 (2 + 2n)tCY – 87 ns
tRDD2 (3 + 2n)tCY – 93 ns Read data hold time tRDH 0ns RD low-level width tRDL1 (1.5 + 2n)tCY – 33 ns
tRDL2 (2.5 + 2n)tCY – 33 ns
WAIT input time from RD tRDWT1 tCY – 43 ns
tRDWT2 tCY – 43 ns WAIT input time from WR tWRWT tCY – 25 ns WAIT low-level width tWTL (0.5 + n)tCY + 10 (2 + 2n)tCY ns Write data setup time tWDS 60 ns Write data hold time tWDH 6ns WR low-level width tWRL1 (1.5 + 2n)tCY – 15 ns RD delay time from ASTB tASTRD 6ns WR delay time from ASTB tASTWR 2tCY – 15 ns ASTB delay time from tRDAST 0.8tCY – 15 1.2tCY ns
RD at external fetch Address hold time from tRDADH 0.8tCY – 15 1.2tCY + 30 ns
RD at external fetch Write data output time from RD tRDWD 40 ns Write data output time from WR tWRWD 10 60 ns Address hold time from WR tWRADH 0.8tCY – 15 1.2tCY + 30 ns RD delay time from WAIT tWTRD 0.8tCY 2.5tCY + 25 ns WR delay time from WAIT tWTWR 0.8tCY 2.5tCY + 25 ns
Remarks 1. tCY = TCY/4
2. n indicates the number of waits.
L = 100 pF (CL indicates the load capacitance of the AD0 to AD7, A8 to A15, RD, WR, WAIT, and
3.C ASTB pins.)
Data Sheet U14045EJ1V0DS00
43
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Read/Write Operation (TA = –40 to + 85°C, VDD = 2.7 to 4.0 V)
(2/3)
Parameter Symbol Test Conditions MIN. MAX. Unit ASTB high-level width tASTH 0.3tCY ns Address setup time tADS 30 ns Address hold time tADH 10 ns Data input time from address tADD1 (2 + 2n)tCY – 108 ns
tADD2 (3 + 2n)tCY – 120 ns Address output time from RD t RDAD 0 200 ns Data input time from RD tRDD1 (2 + 2n)tCY – 148 ns
tRDD2 (3 + 2n)tCY – 162 ns Read data hold time tRDH 0ns RD low-level width tRDL1 (1.5 + 2n)tCY – 40 ns
tRDL2 (2.5 + 2n)tCY – 40 ns WAIT input time from RD tRDWT1 tCY – 75 ns
tRDWT2 tCY – 60 ns WAIT input time from WR tWRWT tCY – 50 ns WAIT low-level width tWTL (0.5 + 2n)tCY + 10 (2 + 2n)tCY ns Write data setup time tWDS 60 ns Write data hold time tWDH 10 ns WR low-level width tWRL1 (1.5 + 2n)tCY – 30 ns RD delay time from ASTB tASTRD 10 ns WR delay time from ASTB tASTWR 2tCY – 30 ns ASTB delay time from tRDAST 0.8tCY – 30 1.2tCY ns
RD at external fetch Address hold time from tRDADH 0.8tCY – 30 1.2tCY + 60 ns
RD at external fetch Write data output time from RD tRDWD 40 ns Write data output time from WR tWRWD 20 120 ns Address hold time from WR tWRADH 0.8tCY – 30 1.2tCY + 60 ns RD delay time from WAIT tWTRD 0.5tCY 2.5tCY + 50 ns WR delay time from WAIT tWTWR 0.5tCY 2.5tCY + 50 ns
Remarks 1. tCY = TCY/4
2. n indicates the number of waits.
3. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT,
and ASTB pins.)
44
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2) Read/Write Operation (TA = –40 to + 85°C, VDD = 1.8 to 2.7 V)
(3/3)
Parameter Symbol Test Conditions MIN. MAX. Unit ASTB high-level width tASTH 0.3tCY ns Address setup time tADS 120 ns Address hold time tADH 20 ns Data input time from address tADD1 (2 + 2n)tCY – 233 ns
tADD2 (3 + 2n)tCY – 240 ns Address output time from RD t RDAD 0 400 ns Data input time from RD tRDD1 (2 + 2n)tCY – 325 ns
tRDD2 (3 + 2n)tCY – 332 ns Read data hold time tRDH 0ns RD low-level width tRDL1 (1.5 + 2n)tCY – 92 ns
tRDL2 (2.5 + 2n)tCY – 92 ns WAIT input time from RD tRDWT1 tCY – 350 ns
tRDWT2 tCY – 132 ns WAIT input time from WR tWRWT tCY – 100 ns WAIT low-level width tWTL (0.5 + 2n)tCY + 10 (2 + 2n)tCY ns Write data setup time tWDS 60 ns Write data hold time tWDH 20 ns WR low-level width tWRL1 (1.5 + 2n)tCY – 60 ns RD delay time from ASTB tASTRD 20 ns WR delay time from ASTB tASTWR 2tCY – 60 ns ASTB delay time from tRDAST 0.8tCY – 60 1.2tCY ns
RD at external fetch Address hold time from tRDADH 0.8tCY – 60 1.2tCY + 120 ns
RD at external fetch Write data output time from RD tRDWD 40 ns Write data output time from WR tWRWD 40 240 ns Address hold time from WR tWRADH 0.8tCY – 60 1.2tCY + 120 ns RD delay time from WAIT tWTRD 0.5tCY 2.5tCY + 100 ns WR delay time from WAIT tWTWR 0.5tCY 2.5tCY + 100 ns
Remarks 1. tCY = TCY/4
2. n indicates the number of waits.
L = 100pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT, and
3. C ASTB pins.)
Data Sheet U14045EJ1V0DS00
45
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(3) Serial Interface (TA = –40 to + 85°C, VDD = 1.8 to 5.5 V)
(a) 3-wire serial I/O mode (SCK30 ... Internal clock output)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
SCK30 cycle time tKCY1 4.0 V VDD 5.5 V 954 ns
2.7 V VDD < 4.0 V 1600 ns 3200 ns
SCK30 high-/low-level tKH1, tKL1 VDD = 4.0 to 5.5 V tKCY1/2 – 50 ns width
SI30 setup time tSIK1 4.0 V VDD 5.5V 100 ns (to SCK30)
SI30 hold time tKSI1 400 ns (from SCK30)
SO30 output tKSO1 C = 100 pF delay time from SCK30
2.7 V VDD < 4.0V 150 ns
Note
tKCY1/2 – 100 ns
300 ns
300 ns
Note C is the load capacitance of the SCK30 and SO30 output lines.
(b) 3-wire serial I/O mode (SCK30 ... External clock input)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
SCK30 cycle time tKCY2 4.0 V VDD 5.5 V 800 ns
2.7 V VDD < 4.0 V 1600 ns
3200 ns
SCK30 high-/low-level tKH2, tKL2 4.0 V VDD 5.5 V 400 ns width
SI30 setup time tSIK2 100 ns (to SCK30)
SI30 hold time tKSI2 400 ns (from SCK30)
SO30 output tKSO2 C = 100 pF delay time from SCK30
2.7 V VDD < 4.0 V 800 ns
1600 ns
Note
300 ns
Note C is the load capacitance of the SO30 output line.
46
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(c) UART mode (Dedicated baud-rate generator output)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Transfer rate 4.0 V VDD 5.5 V 131031 bps
2.7 V VDD < 4.0 V 78125 bps 39063 bps
(d) UART mode (External clock input)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
ASCK0 cycle time tKCY3 4.0 V VDD 5.5 V 800 ns
2.7 V VDD < 4.0 V 1600 ns
3200 ns
ASCK0 high-/low-level width tKH3, 4.0 V VDD 5.5 V 400 ns
tKL3
Transfer rate 4.0 V VDD 5.5 V 39063 bps
2.7 V VDD < 4.0 V 800 ns
1600 ns
2.7 V VDD < 4.0 V 19531 bps
9766 bps
(e) UART mode (Infrared ray data transfer mode)
Parameter Symbol Test Conditions MIN. MAX. Unit Transfer rate VDD = 4.0 to 5.5 V 131031 bps Bit rate allowable error VDD = 4.0 to 5.5 V ±0.87 % Output pulse width VDD = 4.0 to 5.5 V 1.2 Input pulse width VDD = 4.0 to 5.5 V 4/fX
0.24/fbr
Note
µ
µ
Note fbr: Specified baud rate
s
s
Data Sheet U14045EJ1V0DS00
47
(f) I2C bus Mode
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Parameter Symbol
SCL0 clock frequency fCLK 0 100 0 400 kHz Bus-free time tBUF 4.7 1.3
(between stop and start condition) Hold time SCL0 clock low-level width tLOW 4.7 1.3 — SCL0 clock high-level width tHIGH 4.0 0.6 — Start/restart condition setup time tSU:STA 4.7 0.6 — Data hold time CBUS compatible master tHD:DAT 5.0
Data setup time tSU:DAT 250 100 SDA0 and SCL0 signal rise time tR 1000 20 + 0.1Cb SDA0 and SCL0 signal fall time tF 300 20 + 0.1Cb Stop condition setup time tSU:STO 4.0 0.6 — Spike pulse width controlled by input filter tSP —— 050ns Capacitive load per bus line Cb 400 400 pF
Note 1
I2C bus 0
tHD:STA 4.0 0.6
Standard Mode High-Speed Mode
MIN. MAX. MIN. MAX.
Note 2
—0
Note 2
Note 4
Note 5
Note 5
Note 3
0.9 —ns
300 ns 300 ns
Unit
µ
µ µ µ µ µ µ
µ
s
s s s s s s
s
Notes 1. In the start condition, the first clock pulse is generated after this hold time.
2. To fill in the undefined area of the SCL0 falling edge, it is necessary for the device to internally provide
at least 300 ns of hold time for the SDA0 signal (which is VIHmin. of the SCL0 signal).
3. If the device does not extend the SCL0 signal low hold time (t
LOW), only maximum data hold time tHD:DAT
needs to be fulfilled.
2
4. The high-speed mode I
C bus is available in a standard mode I2C bus system. At this time, the conditions
described below must be satisfied.
• If the device does not extend the SCL0 signal low state hold time
SU:DAT 250 ns
t
• If the device extends the SCL0 signal low state hold time Be sure to transmit the next data bit to the SDA0 line before the SCL0 line is released (tRmax. + tSU:DAT = 1000 + 250 = 1250 ns by standard mode I2C bus specification).
5. Cb: Total capacitance per bus line (unit: pF)
48
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
AC Timing Test Points (Excluding X1, XT1 Inputs)
0.8V
0.2V
DD DD
Test points
Clock Timing
t
XL
X1 Input
1/f
DD
0.8V
0.2V
DD
X
t
XH
V
IH4
(MIN.)
IL4
(MAX.)
V
TI Timing
XT1 Input
TI00, TI01
1/f
XT
t
t
XTL
t
TIL0
TIL5
1/f
t
XTH
V
IH5
(MIN.)
IL5
(MAX.)
V
t
TIH0
TI5
t
TIH5
TI50, TI51
Data Sheet U14045EJ1V0DS00
49
Read/Write Operation
External fetch (no wait):
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A8 to A15
AD0 to AD7
ASTB
RD
External fetch (wait insertion):
A8 to A15
t
Lower-8-bit address
ADS
t
t
ADH
t
ASTH
t
ASTRD
Higher 8-bit address
ADD1
Hi-Z
t
RDAD
t
RDD1
Higher 8-bit address
Instruction code
t
RDL1
t
RDH
t
RDADH
t
RDAST
AD0 to AD7
ASTB
RD
WAIT
Lower 8-bit address
t
ADS
t
ADH
t
ASTH
t
ASTRD
t
RDWT1
t
RDAD
t
ADD1
Hi-Z
t
RDD1
t
WTL
t
RDL1
Instruction code
t
WTRD
t
RDH
t
RDADH
t
RDAST
50
Data Sheet U14045EJ1V0DS00
External data access (no wait):
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A8 to A15
t
ADD2
AD0 to AD7
Lower 8-bit address
ADS
t
t
ADH
t
ASTH
ASTB
RD
ASTRD
t
WR
External data access (wait insertion):
Hi-Z
t
RDAD
t
RDD2
Higher 8-bit address
Read data
t
RDL2
t
ASTWR
t
RDH
t
RDWD
t
WRWD
Write data
t
WDS
t
WRL1
t
WDH
t
Hi-Z
WRADH
A8 to A15
AD0 to AD7
ASTB
RD
WR
WAIT
Lower 8-bit
address
t
ADH
t
ADS
t
ASTH
t
RDWT2
t
t
RDAD
t
ASTRD
ADD2
Hi-Z
t
RDD2
Higher 8-bit address
WDH
t
WRADH
Hi-Z
Read data
t
RDH
t
t
RDL2
t
ASTWR
t
WTL
t
WTRD
RDWD
t
WRWD
t
WRWT
Write data
t
WDS
t
WRL1
t
WTL
t
WTWR
t
Data Sheet U14045EJ1V0DS00
51
Serial Transfer Timing
3-wire serial I/O mode:
SCK30
µ
PD780031AY, 780032AY, 780033AY, 780034AY
t
KCYm
t
KLm
t
SIKm
t
KSIm
t
KHm
SI30
SO30
m = 1, 2
UART mode (external clock input):
ASCK0
t
KSOm
Input data
Output data
KCY3
t
KL3
t
t
KH3
52
Data Sheet U14045EJ1V0DS00
I2C Bus Mode:
SCL0
SDA0
Stop condition
t
BUF
t
HD:STA
Start condition
t
LOW
t
HD:DAT
µ
PD780031AY, 780032AY, 780033AY, 780034AY
t
R
t
t
HIGH
t
SU:DAT
F
t
SU:STA
Restart condition
t
HD:STA
t
SP
Stop condition
t
SU:STO
Data Sheet U14045EJ1V0DS00
53
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A/D Converter Characteristics (TA = –40 to +85°C, VDD = AVDD = AVREF = 1.8 to 5.5 V, AVSS = VSS = 0 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit Resolution 10 10 10 bit Overall error
Conversion time tCONV 4.0 V AVREF 5.5 V 14 96
Zero-scale offset
Full-scale offset
Integral linearity error
Differential linearity error
Analog input voltage VIAN 0AVREF V Reference voltage AVREF 1.8 AVDD V Resistance between AVREF and AVSS RREF
Notes 1, 2
Notes 1, 2
Notes 1, 2
Note 1
Note 1
4.0 V AVREF 5.5 V ±0.2 ±0.4 %FSR
2.7 V AVREF < 4.0 V ±0.3 ±0.6 %FSR
1.8 V AVREF < 2.7 V ±0.6 ±1.2 %FSR
2.7 V AVREF < 4.0 V 19 96
1.8 V AVREF < 2.7 V 28 96
4.0 V AVREF 5.5 V ±0.4 %FSR
2.7 V AVREF < 4.0 V ±0.6 %FSR
1.8 V AVREF < 2.7 V ±1.2 %FSR
4.0 V AVREF 5.5 V ±0.4 %FSR
2.7 V AVREF < 4.0 V ±0.6 %FSR
1.8 V AVREF < 2.7 V ±1.2 %FSR
4.0 V AVREF 5.5 V ±2.5 LSB
2.7 V AVREF < 4.0 V ±4.5 LSB
1.8 V AVREF < 2.7 V ±8.5 LSB
4.0 V AVREF 5.5 V ±1.5 LSB
2.7 V AVREF < 4.0 V ±2.0 LSB
1.8 V AVREF < 2.7 V ±3.5 LSB
When A/D conversion is not performed
20 40 k
µ
s
µ
s
µ
s
Notes 1. Excludes quantization error (±1/2 LSB).
2. Shown as a percentage of the full scale value.
54
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Data retention power VDDDR 1.6 5.5 V supply voltage
Data retention IDDDR VDDDR = 1.6 V 0.1 30 power supply Subsystem clock stop (XT1 = VDD) and current feed-back resistor disconnected
Release signal set time Oscillation stabilization tWAIT Release by RESET 217/fx ms
time
tSREL 0
Release by interrupt request Note ms
µ
A
µ
s
Note Selection of 212/fX and 214/fX to 217/fX is possible using bits 0 to 2 (OSTS0 to OSTS2) of the oscillation
stabilization time select register (OSTS).
Data Retention Timing (STOP mode release by RESET)
Internal reset operation
HALT mode
STOP mode
Operating mode
V
RESET
DD
STOP instruction execution
Data retention mode
V
DDDR
t
SREL
t
WAIT
Data Sheet U14045EJ1V0DS00
55
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Data Retention Timing (Standby release signal: STOP mode release by interrupt request signal)
HALT mode
STOP mode
Data retention mode
Operating mode
VDD
STOP Instruction execution
Standby release signal (interrupt request)
Interrupt Request Input Timing
INTP0 to INTP2
INTP3
VDDDR
t
t
INTL
INTL
t
tSREL
tWAIT
INTH
RESET Input Timing
56
RESET
t
RSL
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
13. PACKAGE DRAWINGS
64 PIN PLASTIC SHRINK DIP (750 mil)
64 33
A
321
K
J
I
F
M
H
D
N
G
NOTES
1. Controlling dimension millimeter.
2. Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition.
3. Item "K" to center of leads when formed parallel.
CB
ITEM MILLIMETERS INCHES
A 58.0 2.283 B
C D
F G H
I 4.05 0.159
J K
L
M N
R
M
+0.68 –0.20
1.78 MAX.
1.778 (T.P.)
0.50±0.10
0.9 MIN.
3.2±0.3
0.51 MIN. +0.26
–0.20
5.08 MAX.
19.05 (T.P.)
17.0±0.2 +0.10
0.25
–0.05
0.17
0 to 15°
L
R
+0.028 –0.008
0.070 MAX.
0.070 (T.P.) +0.004
0.020
–0.005
0.035 MIN.
0.126±0.012
0.020 MIN. +0.011
–0.008
0.200 MAX.
0.750 (T.P.) +0.009
0.669
–0.008 +0.004
0.010
–0.003
0.007
0 to 15°
P64C-70-750A,C-3
Remark The external dimensions and materials of the ES version are the same as those of the mass-produced
version.
Data Sheet U14045EJ1V0DS00
57
64 PIN PLASTIC QFP ( 14)
µ
PD780031AY, 780032AY, 780033AY, 780034AY
A
B
49
48
33
32
CD
64
1
16
17
F
G
HI
M
P
NS
J
K
L
M
NOTE
1. Controlling dimension millimeter.
2. Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition.
detail of lead end S
Q
R
S
ITEM MILLIMETERS INCHES
A 17.6±0.4 0.693±0.016 B 14.0±0.2 0.551
C 14.0±0.2 0.551 D 17.6±0.4 0.693±0.016
F
1.0
G 1.0
0.15
5°±5°
+0.08 –0.07
+0.08 –0.07
H 0.37 0.015
I J 0.8 (T.P.)
K 1.8±0.2 0.071±0.008 L 0.8±0.2 0.031
M 0.17 0.007
N 0.10 0.004 P 2.55±0.1 0.100±0.004 Q 0.1±0.1 0.004±0.004 R S 2.85 MAX.
+0.009 –0.008
+0.009 –0.008
0.039
0.039 +0.003
–0.004
0.006
0.031 (T.P.)
+0.009 –0.008
+0.003 –0.004
5°±5°
0.113 MAX.
P64GC-80-AB8-4
Remark The external dimensions and materials of the ES version are the same as those of the mass-produced
version.
58
Data Sheet U14045EJ1V0DS00
64 PIN PLASTIC LQFP (12x12)
A
B
µ
PD780031AY, 780032AY, 780033AY, 780034AY
48
49
64
1
33
32
17
16
F
G
HI
P
NOTES
1. Controlling dimension millimeter.
2. Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition.
M
SN
K
L
J
CD
S
M
detail of lead end
S
R
Q
ITEM MILLIMETERS INCHES
A 14.8±0.4 0.583±0.016 B 12.0±0.2 0.472
C 12.0±0.2 0.472
14.8±0.4D 0.583±0.016
F
1.125
1.125
G
H 0.32±0.08 0.013
0.13I 0.005
0.65 (T.P.)J 0.026
K 1.4±0.2 0.055±0.008 L 0.6±0.2 0.024
M 0.17 0.007
P 1.4±0.1 0.055
S 1.7 MAX. 0.067 MAX.
+0.08
0.07
0.10N 0.004
0.125±0.075Q 0.005±0.003 5°±5°R5°±5°
+0.009
0.008 +0.009
0.008
0.044
0.044
+0.003
0.004
+0.008
0.009 +0.003
0.004
+0.004
0.005
P64GK-65-8A8-2
Remark The external dimensions and materials of the ES version are the same as those of the mass-produced
version.
Data Sheet U14045EJ1V0DS00
59
µ
PD780031AY, 780032AY, 780033AY, 780034AY
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 14-1. Surface Mounting Type Soldering Conditions
µ
PD780031AYGC-×××-AB8: 64-pin plastic QFP (14 × 14 mm)
(1)
µ
PD780032AYGC-×××-AB8: 64-pin plastic QFP (14 × 14 mm)
µ
PD780033AYGC-×××-AB8: 64-pin plastic QFP (14 × 14 mm)
µ
PD780034AYGC-×××-AB8: 64-pin plastic QFP (14 × 14 mm)
Soldering Method Soldering Conditions
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. IR35-00-3
(at 210°C or higher), Count: three times or less
VPS Package peak temperature: 215°C, Time: 40 seconds max. VP15-00-3
(at 200°C or higher), Count: three times or less
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., WS60-00-1
Count: once, Preheating temperature: 120°C max. (package surface temperature)
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) ––
Caution Do not use different soldering methods together (except for partial heating).
Recommended
Condition Symbol
60
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(2)µPD780031AYGK-×××-8A8: 64-pin plastic LQFP (12 × 12 mm)
µ
PD780032AYGK-×××-8A8: 64-pin plastic LQFP (12 × 12 mm)
µ
PD780033AYGK-×××-8A8: 64-pin plastic LQFP (12 × 12 mm)
µ
PD780034AYGK-×××-8A8: 64-pin plastic LQFP (12 × 12 mm)
Soldering Method Soldering Conditions
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. IR35-107-2
(at 210°C or higher), Count: two times or less, prebake at 125°C for 10 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. VP15-107-2
(at 200°C or higher), Count: two times or less, prebake at 125°C for 10 hours)
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., WS60-107-1
Count: once, Preheating temperature: 120°C max. (package surface temperature), Exposure limit: 7 days at 125
°C for 10 hours
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) ––
Exposure limit: 7 days
Exposure limit: 7 days
)
Note
(after that,
Note
(after that,
Note
(after that, prebake
Recommended
Condition Symbol
Note After opening the dry pack, store it at 25°C or less and 65%RH or less for the allowable storage
period.
Caution Do not use different soldering methods together (except for partial heating).
Table 14-2. Insertion Type Soldering Conditions
µ
PD780031AYCW-×××: 64-pin plastic shrink DIP (750mils)
µ
PD780032AYCW-×××: 64-pin plastic shrink DIP (750mils)
µ
PD780033AYCW-×××: 64-pin plastic shrink DIP (750mils)
µ
PD780034AYCW-×××: 64-pin plastic shrink DIP (750mils)
Soldering Method Soldering Conditions
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max. (only for pins)
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
Data Sheet U14045EJ1V0DS00
61
µ
PD780031AY, 780032AY, 780033AY, 780034AY
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for system development using the µPD780034AY Subseries. Also refer to (5) Cautions on Using Development Tools.
(1) Language Processing Software
RA78K/0 Assembler package common to 78K/0 Series CC78K/0 C compiler package common to 78K/0 Series DF780034 Device file common to µPD780034A Subseries CC78K/0-L C compiler library source file common to 78K/0 Series
(2) Flash Memory Writing Tools
Flashpro II (FL-PR2) Flash programmer dedicated to microcontrollers with on-chip flash memory Flashpro III (FL-PR3, PG-FP3)
FA-64CW Adapter for flash memory writing FA-64GC FA-64GK
(3) Debugging Tools
• When using in-circuit emulator IE-78K0-NS
IE-78K0-NS In-circuit emulator common to 78K/0 Series IE-70000-MC-PS-B Power supply unit for IE-78K0-NS IE-78K0-NS-PA IE-70000-98-IF-C IE-70000-CD-IF-A IE-70000-PC-IF-C Interface adapter when using IBM PC/ATTM or compatible as host machine (ISA bus supported) IE-70000-PCI-IF Adapter required when using PC in which PCI bus is embedded as host machine IE-780034-NS-EM1 Emulation board to emulate µPD780034AY Subseries NP-64CW Emulation probe for 64-pin plastic shrink DIP (CW type) NP-64GC Emulation probe for 64-pin plastic QFP (GC-AB8 type)
NP-64GC-TQ NP-64GK Emulation probe for 64-pin plastic LQFP (GK-8A8 type) TGK-064SBW Conversion adapter to connect NP-64GK and target system board on which a 64-pin plastic LQFP
EV-9200GC-64 Socket to be mounted on target system board made for 64-pin plastic QFP (GC-AB8 type) ID78K0-NS Integrated debugger for IE-78K0-NS SM78K0 System simulator common to 78K/0 Series DF780034 Device file common to µPD780034A Subseries
Note
Performance board to enhance and expand the functions of IE-78K0-NS Interface adapter when using PC-9800 series as host machine (excluding notebook PCs) (C bus supported) PC card and interface cable when using notebook PC as host machine (PCMCIA socket supported)
(GK-8A8 type) can be mounted.
Note Under development
62
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
• When using in-circuit emulator IE-78001-R-A
IE-78001-R-A In-circuit emulator common to 78K/0 Series IE-70000-98-IF-C IE-70000-PC-IF-C Interface adapter when using IBM PC/AT or compatible as host machine (ISA bus supported) IE-70000-PCI-IF Adapter required when using PC in which PCI bus is embedded as host machine IE-78000-R-SV3 Interface adapter and cable when using EWS as host machine IE-780034-NS-EM1 Emulation board to emulate µPD780034AY Subseries IE-78K0-R-EX1 Emulation probe conversion board necessary when using IE-780034-NS-EM1 on IE-78001-R-A EP-78240CW-R Emulation probe for 64-pin plastic shrink DIP (CW type) EP-78240GC-R Emulation probe for 64-pin plastic QFP (GC-AB8 type) EP-78012GK-R Emulation probe for 64-pin plastic LQFP (GK-8A8 type) TGK-064SBW
EV-9200GC-64 ID78K0 Integrated debugger for IE-78001-R-A SM78K0 System simulator common to 78K/0 Series DF780034 Device file common to µPD780034A Subseries
Interface adapter when using PC-9800 series as host machine (excluding notebook PCs) (C bus supported)
Conversion adapter to connect LQFP (GK-8A8 type) can be mounted.
Socket to be mounted on target system board made for 64-pin plastic QFP (GC-AB8 type)
EP-78012GK-R a
nd target system board on which a 64-pin plastic
(4) Real-time OS
RX78K/0 Real-time OS for 78K/0 Series MX78K0 OS for 78K/0 Series
Data Sheet U14045EJ1V0DS00
63
µ
PD780031AY, 780032AY, 780033AY, 780034AY
(5) Cautions on Using Development Tools
• The ID78K0-NS, ID78K0, and SM78K0 are used in combination with the DF780034.
• The CC78K/0 and RX78K/0 are used in combination with the RA78K/0 and the DF780034.
• FL-PR2, FL-PR3, FA-64CW, FA-64GC, FA-64GK, NP-64CW, NP-64GC, NP-64GC-TQ, and NP-64GK are products made by Naito Densei Machida Mfg. Co., Ltd. (+81-44-822-3813).
Contact an NEC distributor regarding the purchase of these products.
• The TGK-064SBW is a product made by TOKYO ELETECH CORPORATION. Refer to: Daimaru Kogyo, Ltd.
Tokyo Electronic Division (+81-3-3820-7112) Osaka Electronic Division (+81-6-6244-6672)
• For third-party development tools, see the 78K/0 Series Selection Guide (U11126E).
• The host machines and OSs supporting each software are as follows.
Host Machine PC EWS
[OS] PC-9800 series [WindowsTM] HP9000 series 700TM [HP-UXTM]
IBM PC/AT and compatibles SPARCstationTM [SunOSTM, SolarisTM]
Software [Japanese/English Windows] NEWSTM (RISC) [NEWS-OSTM]
Note
RA78K/0 CC78K/0 ID78K0-NS ID78K0 SM78K0 RX78K/0 MX78K0
Note
√ √√ √
Note
Note
√ √
√ √
Note DOS-based software
64
Data Sheet U14045EJ1V0DS00
µ
PD780031AY, 780032AY, 780033AY, 780034AY
APPENDIX B. RELATED DOCUMENTS
Documents Related to Devices
Document Name Document No. Document No.
(English) (Japanese)
µ
PD780024A, 780034A, 780024AY, 780034AY Subseries User’s Manual U14046E U14046J
µ
PD780031AY, 780032AY, 780033AY, 780034AY Data Sheet This document U14045J
µ
PD78F0034AY Data Sheet U14041E U14041J 78K/0 Series User’s Manual Instructions U12326E U12326J 78K/0 Series Instruction Table U10903J 78K/0 Series Instruction Set U10904J
Documents Related to Development Tools (User’s Manuals)
Document Name Document No. Document No.
(English) (Japanese)
RA78K0 Assembler Package Operation U11802E U11802J
Assembly Language U11801E U11801J
Structured Assembly Language U11789E U11789J RA78K Series Structured Assembler Preprocessor EEU-1402 U12323J CC78K0 C Compiler Operation U11517E U11517J
Language U11518E U11518J CC78K0 C Compiler Application Note Programming Know-how U13034E U13034J IE-78K0-NS To be prepared To be prepared IE-78001-R-A To be prepared To be prepared IE-780034-NS-EM1 To be prepared To be prepared EP-78240 U10332E EEU-986 EP-78012GK-R EEU-1538 EEU-5012 SM78K0 System Simulator Windows based Reference U10181E U10181J SM78K Series System Simulator External Part User Open U10092E U10092J
Interface Specifications ID78K0-NS Integrated Debugger Windows based ID78K0 Integrated Debugger EWS based Reference U11151J ID78K0 Integrated Debugger PC based Reference U11539E U11539J ID78K0 Integrated Debugger Windows based Guide U11649E U11649J
Reference U12900E U12900J
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document for designing.
Data Sheet U14045EJ1V0DS00
65
µ
PD780031AY, 780032AY, 780033AY, 780034AY
Documents Related to Embedded Software (User’s Manuals)
Document Name Document No. Document No.
(English) (Japanese)
78K/0 Series Real-time OS Basics U11537E U11537J
Installation U11536E U11536J
78K/0 Series OS MX78K0 Basics U12257E U12257J
Other Related Documents
Document Name Document No. Document No.
(English) (Japanese) SEMICONDUCTORS SELECTION GUIDE Products & Packages (CD-ROM) X13769X Semiconductor Device Mounting Technology Manual C10535E C10535J Quality Grades on NEC Semiconductor Devices C11531E C11531J NEC Semiconductor Device Reliability/Quality Control System C10983E C10983J Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD) Guide to Microcomputer-Related Products by Third Party U11416J
C11892E C11892J
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document for designing.
66
Data Sheet U14045EJ1V0DS00
[MEMO]
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PD780031AY, 780032AY, 780033AY, 780034AY
Data Sheet U14045EJ1V0DS00
67
µ
PD780031AY, 780032AY, 780033AY, 780034AY
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
DD or GND with a resistor, if it is considered to have a possibility of
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Caution Purchase of NEC I2C components conveys a license under the Philips I2C Patent Rights to use
2
these components in an I Specification as defined by Philips.
C system, provided that the system conforms to the I2C Standard
68
Data Sheet U14045EJ1V0DS00
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PD780031AY, 780032AY, 780033AY, 780034AY
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290
NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99
NEC Electronics (France) S.A.
Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829
J99.1
Data Sheet U14045EJ1V0DS00
69
µ
PD780031AY, 780032AY, 780033AY, 780034AY
FIP and IEBus are trademarks of NEC Corporation. Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/ or other countries. PC/AT is a trademark of International Business Machines Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. NEWS and NEWS-OS are trademarks of Sony Corporation.
The related documents indicated in this publication may include preliminary versions. However, preliminary versions are not marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited without governmental license, the need for which must be judged by the customer. The export or re-export of this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8
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