NEC PD70732 DATA SHEET

Document No. U10691EJ3V0DS00 (3rd edition)
Date Published September 1996 P
Printed in Japan
The information in this document is subject to change without notice.
The mark shows major revised points.
µ
PD70732
MOS Integrated Circuit
TM
32-BIT MICROPROCESSOR
The µPD70732 (a.k.a. V810) microprocessor is NEC’s first microprocessor of the V810 family
TM
for embedded
control applications.
The V810 employs a RISC architecture for embedded control applications. This product has high-speed real
time response, high-speed integer operation instruction, bit string instruction, floating-point operation instruction,
and significantly high cost performance is realized for applications such as facsimile, digital PPC, word processor,
image processor, real time control device, etc.
The functions are described in detail in the following User’s Manuals, which should be read before
starting design work.
• V805
TM
, V810 User’s Manual Hardware : U10661E
• V810 Family User’s Manual Architecture : U10082E

Features

High-performance 32-bit architecture for embedded control application
32-bit separate address/data bus
1-Kbyte cache memory
Pipeline structure of 1 clock pitch
16-bit fixed instructions (with some exceptions)
32-bit general-purpose registers: 32
4-Gbyte linear address space
Register/flag hazard interlocked by hardware
Dynamic bus sizing function (16 bits)
16-bit bus fixing function
16-bit bus system can be configured.
Instructions ideal for various application fields
Floating-point operation instructions (based upon IEEE754 data format)
Bit string instructions
16 levels of high-speed interrupt responses
Clock can be stopped by internal static operation
Maximum operating frequency: 16/20/25 MHz
Low voltage: VDD = 2.7 to 3.6 V (Max. 16 MHz)
V
DD = 2.2 to 3.6 V (Max. 10 MHz)
Small package versions available (14 x 14 mm fine-pitch TQFP)
©
1993
DATA SHEET
2
µPD70732

Ordering Information

Part Number Package Max. operating freq. (MHz)
µ
PD70732GD-16-LBB 120-pin plastic QFP (28 x 28 mm) 16
µ
PD70732GD-20-LBB 120-pin plastic QFP (28 x 28 mm) 20
µ
PD70732GD-25-LBB 120-pin plastic QFP (28 x 28 mm) 25
µ
PD70732GC-25-9EV 120-pin plastic TQFP (Fine pitch) (14 x 14 mm) 25
µ
PD70732R-25 176-pin ceramic PGA (Seam weld) 25

Pin Outline

V810
A31 to A1
D31 to D0
BE3 to BE0
ST1, ST0
DA
MRQ
R/W
BCYST
BLOCK
CLK
RESET
INT
INTV3 to INTV0
NMI
HLDRQ
HLDAK
READY
SZRQ
SIZ16B
ICHEEN
ADRSERR
3
µPD70732

Pin Configuration

120-pin plastic QFP (28 x 28 mm) (Top View)
µ
PD70732GD-xx-LBB
Cautions 1. Leave the IC1 pin open.
2. Connect the IC2 pin to GND.
Remark IC: Internally Connected
1V
DD
2IC1
3IC1
4IC1
5RESET
6D0
7D1
8D2
10D3
11D4
13D5
14D6
15D7
18D8
19D9
20D10
21D11
22D12
24D13
25D14
26D15
27D16
28D17
29D18
9GND
12GND
16V
DD
17V
DD
23GND
30GND
31V
DD
32D19
33D20
34D21
35GND
36D22
37D23
38D24
40D26
41D27
43D29
44D30
45V
DD
48D31
49A31
50A30
51A29
52A28
54A26
55A25
56A24
57A23
58GND
59
A22
39D25
42D28
46GND
47V
DD
53A27
60V
DD
90
V
DD
89
ST0
88
HLDRQ
78
GND
76
V
DD
75
V
DD
74
GND
61
GND
87
SZRQ
86
READY
85
A2
84
A3
83
A4
82
A5
81
A6
80
A7
79
A8
77
A9
73
A10
72
A11
71
A12
70
A13
69
A14
68
A15
67
A16
66
A17
65
A18
64
A19
63
A20
62
A21
120
IC1
119
IC2
118
IC2
108
V
DD
106
GND
105
SIZ16B
104 DA
91
GND
117
ICHEEN
116
NMI
115
INT
114
INTV0
113
INTV1
112
INTV2
111
INTV3
110
BLOCK
109
GND
107
CLK
103
V
DD
102
BCYST
101
HLDAK
100
ADRSERR
99
BE0
98
BE1
97
A1
96
BE2
95
BE3
94
R/W
93
MRQ
92
ST1
4
µPD70732
120-pin plastic TQFP (Fine pitch) (14 x 14 mm) (Top View)
µ
PD70732GC-25-9EV
Cautions 1. VDD is power supply pin. All VDD pins should be connected to a +5V power supply (the
same power supply).
2. GND is ground pin. All GND pins should be connected to the same GND.
3. Leave the IC1 pin open.
4. Connect the IC2 pin to GND.
Remark IC: Internally Connected
1
2
3
4
5
6
7
8
10
11
13
14
15
18
19
20
21
22
24
25
26
27
28
29
9
12
16
17
23
30
GND
D18
D17
D16
D15
D14
D13
GND
D11
D10
D8
V
DD
V
DD
D5
GND
D4
D3
GND
D1
D0
RESET
IC1
IC1
IC1
D12
D9
D7
D6
D2
V
DD
31
V
DD
32
D19
33
D20
34
D21
35
GND
36
D22
37
D23
38
D24
40
D26
41
D27
43
D29
44
D30
45
V
DD
48
D31
49
A31
50
A30
51
A29
52
A28
54
A26
55
A25
56
A24
57
A23
58
GND
59
A22
39
D25
42
D28
46
GND
47
V
DD
53
A27
60
V
DD
90
GND
89
A21
88
A20
78
A10
76
V
DD
75
V
DD
74
A9
61
V
DD
87
A19
86
A18
85
A17
84
A16
83
A15
82
A14
81
A13
80
A12
79
A11
77
GND
73
GND
72
A8
71
A7
70
A6
69
A5
68
A4
67
A3
66
A2
65
READY
64
SZRQ
63
HLDRQ
62
ST0
120
IC1
119
IC2
118
IC2
108
V
DD
106
GND
105
SIZ16B
104
DA
91
GND
117
ICHEEN
116
NMI
115
INT
114
INTV0
113
INTV1
112
INTV2
111
INTV3
110
BLOCK
109
GND
107
CLK
103
V
DD
102
BCYST
101
HLDAK
100
ADRSERR
99
BE0
98
BE1
97
A1
96
BE2
95
BE3
94
R/W
93
MRQ
92
ST1
5
µPD70732
176-pin ceramic PGA (Seam weld)
µ
PD70732R-25
Remark The insertion guide pin is not included in the number of pins.
No. Signal No. Signal No. Signal No. Signal
A1 IC2 B3 GND C5 VDD D7 VDD
A2 D12 B4 D11 C6 D8 D8 VDD
A3 D13 B5 GND C7 VDD D9 GND
A4 D10 B6 D7 C8 D4 D10 IC3
A5 GND B7 VDD C9 D2 D11 IC2
A6 D6 B8 D3 C10 IC3 D12 GND
A7 IC2 B9 GND C11 VDD D13 INT
A8 D5 B10 D0 C12 IC1 D14 INTV1
A9 IC2 B11 GND C13 IC2 D15 GND
A10 D1 B12 IC1 C14 VDD E1 D27
A11 VDD B13 GND C15 NMI E2 D25
A12 RESET B14 IC1 D1 D23 E3 D21
A13 IC1 B15 ICHEEN D2 D22 E4 D19
A14 IC1 C1 VDD D3 D20 E12 IC3
A15 IC2 C2 VDD D4 GND E13 INTV0
B1 D17 C3 D16 D5 D15 E14 IC3
B2 D18 C4 D14 D6 D9 E15 IC1
Bottom View Top View
Insertion
guide pin
No. 1 pin index
QPNML KJHGFEDCB A
A
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BCDEFGHJKLMNPQ
6
µPD70732
No. Signal No. Signal No. Signal No. Signal
F1 VDD J4 VDD M7 VDD P4 A12
F2 D26 J12 IC2 M8 A5 P5 GND
F3 D24 J13 IC2 M9 VDD P6 A8
F4 GND J14 IC1 M10 ST1 P7 GND
F12 INTV2 J15 IC1 M11 A1 P8 A6
F13 INTV3 K1 IC2 M12 GND P9 GND
F14 VDD K2 A27 M13 BCYST P10 SZRQ
F15 GND K3 A25 M14 DA P11 GND
G1 D29 K4 A24 M15 SIZ16B P12 MRQ
G2 D28 K12 GND N1 VDD P13 GND
G3 IC2 K13 BLOCK N2 VDD P14 ADRSERR
G4 IC2 K14 VDD N3 A17 P15 BE0
G12 VDD K15 VDD N4 A15 Q1 IC2
G13 IC2 L1 A28 N5 VDD Q2 A13
G14 IC1 L2 A26 N6 A9 Q3 A14
G15 IC1 L3 A22 N7 VDD Q4 A11
H1 A31 L4 A20 N8 VDD Q5 GND
H2 D30 L12 HLDAK N9 A3 Q6 A7
H3 GND L13 VDD N10 HLDRQ Q7 IC2
H4 D31 L14 IC1 N11 VDD Q8 A4
H12 GND L15 IC1 N12 BE2 Q9 IC2
H13 CLK M1 GND N13 BE1 Q10 A2
H14 IC1 M2 A23 N14 VDD Q11 READY
H15 IC2 M3 A21 N15 IC1 Q12 ST0
J1 A30 M4 GND P1 A18 Q13 BE3
J2 A29 M5 A16 P2 A19 Q14 R/W
J3 IC2 M6 A10 P3 GND Q15 IC2
Cautions 1. Leave the IC1 pin open.
2. Connect the IC2 pin to GND.
3. Connect the IC3 pin to power supply.
Remark IC: Internally Connected
7
µPD70732
CONTENTS
1. PIN FUNCTIONS.............................................................................................................................. 8
1.1 Pin Function List................................................................................................................... 8
1.2 Pin I/O Circuits and Recommended Connection of Unused Pins................................. 10
2. REGISTER SET ............................................................................................................................... 12
2.1 Program Register Set ........................................................................................................... 13
2.2 System Register Set ............................................................................................................. 14
3. DATA TYPES ................................................................................................................................... 15
3.1 Data Types ............................................................................................................................. 15
3.1.1 Data type and addressing ......................................................................................................... 15
3.1.2 Integer ........................................................................................................................................ 16
3.1.3 Unsigned integer ....................................................................................................................... 16
3.1.4 Bit string ..................................................................................................................................... 16
3.1.5 Single-precision floating-point data .......................................................................................... 17
3.2 Data Alignment ...................................................................................................................... 17
4. ADDRESS SPACE........................................................................................................................... 18
5. BUS INTERFACE FUNCTION ......................................................................................................... 21
6. INTERRUPT AND EXCEPTION.......................................................................................................22
7. CACHE ............................................................................................................................................. 23
8. RESET .............................................................................................................................................. 24
9. INSTRUCTION SET ......................................................................................................................... 25
9.1 Instruction Format ................................................................................................................ 25
9.2 Instruction Mnemonic (in alphabetical order)................................................................... 27
10. ELECTRICAL SPECIFICATIONS ....................................................................................................37
10.1 Specifications When VDD = +5 V ± 10%.............................................................................. 38
10.2 Specifications When VDD = 2.7 to 3.6 V ............................................................................. 47
10.3 Specifications When VDD = 2.2 to 3.6 V ............................................................................. 51
11. PACKAGE DRAWINGS ................................................................................................................... 59
12. RECOMMENDED SOLDERING CONDITIONS ............................................................................... 62
8
µPD70732

1. PIN FUNCTIONS

1.1 Pin Function List

Bus hold
status
during
operation
A31 to A1 3-state Address bus Hi-Z Hi-Z H
Note
(Address Bus) output
D31 to D0 3-state Bidirectional data bus Hi-Z Hi-Z Hi-Z
(Data Bus) I/O
BE3 to BE0 3-state Indicates valid data bus when data is accessed Hi-Z Hi-Z H
(Byte Enable) output
ST1, ST0 3-state Indicates type of bus cycle Hi-Z Hi-Z H
(Status) output
DA 3-state Strobe signal for bus cycle Hi-Z Hi-Z H
(Data Access) output
MRQ 3-state Indicates memory access Hi-Z Hi-Z H
(Memory Request) output
R/W 3-state Distinguishes between read access and write access Hi-Z Hi-Z H
(Read/Write) output
BCYST 3-state Indicates start of bus cycle Hi-Z Hi-Z H
(Bus Cycle Start) output
READY Input Extends bus cycle
(Ready)
HLDRQ Input Requests bus mastership
(Hold Request)
HLDAK Output Acknowledges HLDRQ L L H
(Hold Acknowledge)
SZRQ Input Requests bus sizing
(Bus Sizing Request)
SIZ16B Input Fixes external data bus width to 16 bits
(Bus Size 16 Bit)
BLOCK Output Requests to inhibit use of bus L L L
(Bus Lock)
ICHEEN Input Operates instruction cache
(Instruction Cache Enable)
INT Input Interrupt request
(Maskable Interrupt)
INTV3 to INTV0 Input Interrupt level
(Interrupt Level)
Note A1 pin is “H” in the 16-bit bus fixed mode; otherwise, it is “L”.
Bus hold Bus idle
Name I/O Function status status
at reset at reset
9
µPD70732
Bus hold
status
during
operation
NMI Input Non-maskable interrupt request
(Non-Maskable Interrupt)
CLK Input CPU clock input
RESET Input Resets internal status
(Reset)
ADRSERR Output Indicates that data alignment is illegal Not H H
(Address Error) affected
V
DD Positive power supply
(Power Supply)
GND Ground potential (0 V)
(Ground)
IC1 Internally connected (Leave this pin open.)
(Internally Connected 1)
IC2 Internally connected (Ground this pin.)
(Internally Connected 2)
IC3 Internally connected (Connect this pin to power supply.)
(Internally Connected 3)
Bus hold Bus idle
Name I/O Function status status
at reset at reset
10
µPD70732

1.2 Pin I/O Circuits and Recommended Connection of Unused Pins

The I/O circuit type of each pin and recommended connection of unused pins are shown in Table 1-1. Figure
1-1 shows the I/O circuit of each type.
Table 1-1. Pin I/O Circuit Types and Recommended Connection Method of Unused Pins
Pin I/O Circuit Type Recommended Connection Method
D31 to D0 5 Open
A31 to A1 4
BE3 to BE0
ST1, ST0
DA
MRQ
R/W
BCYST
READY 1 Connect to GND via resistor
HLDRQ Connect to VDD via resistor
HLDAK 4 Open
SZRQ 1 Connect to VDD via resistor
SIZ16B Connect to GND via resistor
BLOCK 4 Open
ICHEEN 1 Connect to VDD via resistor
INT Connect to GND via resistor
INTV3 to INTV0 Connect to VDD via resistor
NMI
CLK
RESET
ADRSERR 4 Open
IC1
IC2 Connect to GND
IC3 Connect to VDD
11
µPD70732
Type 1
Type 4
P-ch
N-ch
IN
V
DD
Type 5
P-ch
N-ch
V
DD
IN/OUT
data
output
disable
input
enable
P-ch
N-ch
V
DD
OUT
data
output
disable
Push-pull output that can be output high impedance
(both P-ch and N-ch are off).
Figure 1-1. Pin I/O Circuit
12
µPD70732

2. REGISTER SET

The registers of the V810 can be classified into two types: general-purpose program register set and dedicated
system register set. All registers are 32 bits wide.
Program register sets System register sets
31 0 31 0
r0 Zero Register EIPC Exception/Interrupt PC
r1 Reserved for Address Generation EIPSW Exception/Interrupt PSW
r2 Handler Stack Pointer (hp)
r3 Stack Pointer (sp) 31 0
r4 Global Pointer (gp) FEPC Fatal Error PC
r5 Text Pointer (tp) FEPSW Fatal Error PSW
r6
r7 31 0
r8 ECR Exception Cause Register
r9
r10 31 0
r11 PSW Program Status Word
r12
r13 31 0
r14 PIR Processor ID Register
r15
r16 31 0
r17 TKCW Task Control Word
r18
r19 31 0
r20 CHCW Cache Control Word
r21
r22 31 0
r23 ADTRE Address Trap Register
r24
r25
r26 String Destination Bit Offset
r27 String Source Bit Offset
r28 String Length
r29 String Destination
r30 String Source
r31 Link Pointer (lp)
31 0
PC Program Counter
13
µPD70732

2.1 Program Register Set

The program register set is composed of general-purpose registers and a program counter.
(1) General-purpose registers
Thirty-two general-purpose registers, r0 to r31, are available. All these registers can be used as data
registers or address registers.
Of these registers, r0 and r26 through r30 are implicitly used by some instructions, and r1 through r5 and
r31 are implicitly used by the assembler and C compiler. Therefore, when using these registers, it is
necessary to take special care such as saving these registers’ contents to different areas before using
these registers and restoring the contents after using them.
Table 2-1. Program Registers
Register Application Operation
r0 Zero register Always holds zeros.
r1 Register reserved for assembler Used as a working register to generate a 32-bit immediate data.
r2 Handler stack pointer Used as the stack pointer for the handler.
r3 Stack pointer Used to generate a stack frame at a function call.
r4 Global pointer Used to access a global variable in the data area.
r5 Text pointer Points the start address of the text area.
r6 to r25 Stores address or data variables.
r26 String destination bit offset Used in a bit-string instruction execution.
r27 String source bit offset
r28 String length register
r29 String destination address register
r30 String address register
r31 Link pointer Stores the return address at execution of a JAL instruction.
(2) Program Counter
The program counter (PC) indicates the address of the instruction currently executed by the program.
Bit 0 of the PC is fixed to 0, and execution cannot branch to an odd address. The contents of the PC
are initialized to FFFFFFF0H at reset.
14
µPD70732

2.2 System Register Set

The system register set is composed of the following registers that perform operations such as CPU-status
control and interrupt information holding.
Table 2-2. System Register Number
Number Register Name Application Operation
0 EIPC Status saving registers The EIPC and EIPSW registers save the PC and PSW,
for exception/interrupt respectively, when an exception or interrupt occurs. Because in
the V810 the registers incorporated for this purpose are
1 EIPSW these registers only, save the contents of these registers by means
of programming if your application set can cause multiple interrupt
requests to be issued in the V810.
2 FEPC Status saving registers for The FEPC and FEPSW registers save the PC and PSW,
3 FEPSW
NMI/duplexed exception respectively, when an NMI or duplexed exception occurs.
4 ECR Exception cause register This register, when an exception, maskable interrupt, or NMI
occurs, holds its cause. This register consists of 32 bits. Its higher
16 bits, called FECC, hold the exception code for an NMI or
duplexed exception, while the lower 16 bits, called EICC, hold the
exception code for an exception or maskable interrupt.
5 PSW Program status word This register, also called the program status word, is a set of flags
indicating the statuses of the CPU and program (instruction execution
results).
6 PIR Processor ID register This register identifies the CPU type number.
7 TKCW Task control word This register controls floating-point operations.
8 to 23 Reserved
24 CHCW Cache control word This register controls the on-chip instruction cache.
25 ADTRE Address trap register This register holds an address and is used for address trapping.
When the address in this register matches the PC value, the
execution jumps to a predefined address.
26 to 31 Reserved
To read or write one of the registers shown above, specify a system register number with the system register
load (LDSR) or system register store (STSR) instruction.
15
µPD70732

3. DATA TYPES

3.1 Data Types

The data types supported by the V810 are as follows:
• Integer (8, 16, 32 bits)
• Unsigned integer (8, 16, 32 bits)
• Bit string
• Single-precision floating-point data (32 bits)

3.1.1 Data type and addressing

The V810 uses the little-endian data addressing. In this addressing, if a fixed-length data is located in a memory
area, the data must be either of the data types shown below.
(1) Byte
A byte is a consecutive 8-bit data whose first-bit address is aligned to a byte boundary. Each bit in a
byte is numbered from 0 to 7: LSB (the least significant bit) is bit 0 and MSB (the most significant bit)
is bit 7. To access a byte, specify address A. (See diagram below.)
(2) Halfword
A halfword is a consecutive 16-bit (= 2 bytes) data whose first-bit address is aligned to a halfword
boundary. Each bit in a halfword is numbered from 0 to 15: LSB (the least significant bit) is bit 0 and
MSB (the most significant bit) is bit 15. To access a halfword, specify the address A only (lowest bit must
be 0).
(3) Word/short real
A word, also called short real, is a consecutive 32-bit (= 4 bytes) data whose first-bit address is aligned
to a word boundary. Each bit in a word is numbered from 0 to 31: LSB (the least significant bit) is bit
0 and MSB (the most significant bit) is bit 31. To access a word or short real, specify the address A only
(lower two bits must be 0).
70
A
15 8 7
A + 1
0
A
31 24 23
A + 3
16 15
A + 2
87
A + 1
0
A
16
µPD70732

3.1.2 Integer

In the V810, all integers are expressed in the two’s-complement binary notation, and are composed of either
8 bits, 16 bits, or 32 bits. Regardless of the data length, bit 0 is the least significant bit, and higher-numbered
bits express higher digits of the integer with the highest bit expressing its sign.
Data Length Range
Byte 8 bits –128 to +127
Halfword 16 bits –32768 to +32767
Word 32 bits –2147483648 to +2147483647

3.1.3 Unsigned integer

An unsigned integer is either zero or a positive integer unlike the integer explained in section 3.1.2 which can
be negative as well as zero and positive. Unsigned integers are expressed in the binary notation in the same way
as integers, and are either 8 bits, 16 bits, or 32 bits long. Regardless of the data length, the bit assignments are
the same as in the case of integers except that unsigned integers do not include a sign bit; the highest bit is also
a part of the integer.
Data Length Range
Byte 8 bits 0 to 255
Halfword 16 bits 0 to 65535
Word 32 bits 0 to 4294967295

3.1.4 Bit string

A bit string is a type of data whose bit length is variable from 0 to 2
32
– 1. To specify a bit-string data, define
the following three attributes.
• A : address of the string data’s first word (lower two bits must be 0.)
• B : in-word bit offset in the string data (0 to 31)
• M: bit length of the string data (0 to 2
32
– 1)
The above three attributes may vary depending on the bit-string data manipulation direction: upward or
downward, as shown below. The former is the direction from lower addresses to higher addresses while the latter
is the direction from higher to lower addresses.
Attribute Upward Downward
First-word address (0s in bits 1 and 0) A A + 4
In-word bit offset (0 to 31) B D
Bit length (0 to 2
32
– 1) M M
D
A + 8
M– 1 0
A + 4 A (Word boundary)
M
B
17
µPD70732

3.1.5 Single-precision floating-point data

This data type is 32 bits long and its bit allocation complies with the IEEE single format. A single-precision
floating-point data consists of 1-bit mantissa sign bit, 8-bit exponent, and 23-bit mantissa. The exponent is offset-
expressed from the bias value – 127, and the mantissa is binary-expressed with the integer part omitted.

3.2 Data Alignment

In the V810, a word data must be aligned to a word boundary (with the lowest two bits of the address fixed
to 0s), and a halfword data to a halfword boundary (with the lowest bit of the address fixed to 0). If a data is not
aligned as specified, the lowest one bit (in the case of word) or two bits (in the case of halfword) of its address
will forcibly be masked with 0s when the data is accessed.
31 2330
s exp (8) mantissa (23)
22 0
18
µPD70732

4. ADDRESS SPACE

The V810 supports 4 Gbytes of linear memory space and I/O space. The CPU outputs 32-bit addresses to
the memory and I/Os; therefore, the addresses are from 0 to 2
32
– 1.
Bit number 0 of each byte data is defined as the LSB (Least Significant Bit), and bit number 7 is the MSB (Most
Significant Bit). Unless otherwise specified, the byte data at the lower address side of data consisting of two or
more bytes is the LSB, and the byte data at the higher address side is the MSB (little endian).
Data consisting of 2 bytes is called a halfword, and data consisting of 4 bytes is called a word. The lower address
of memory or I/O data of two or more bytes, here, is shown on the right, and the higher address is shown on the
left, as follows:
Byte of address A
Halfword of address A
Word/short real of address A
70
A (address)
7015 8
A (address)A + 1
7015 823 1631 24
AA + 1A + 2A + 3
19
µPD70732
Figure 4-1 shows the memory map of the V810, and Figure 4-2 shows the I/O map.
Figure 4-1. Memory Map
Note For the details, refer to Table 6-1 Exception Codes.
FFFFFFFFH
FFFFFE00H
FFFFFDFFH
Interrupt handler table
Note
General use
00000000H
20
µPD70732
Figure 4-2. I/O Map
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General use
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