NEC PD168110 DATA SHEET

查询UPD168110供应商

DESCRIPTION

The µPD168110 is a monolithic 2-channel H bridge driver that consists of a CMOS controller and a MOS output

stage. It can reduce the current consumption and the voltage loss at the output stage compared with a conventional

driver using bipolar transistors, thanks to employment of a MOS process. This product employs a P-channel

MOSFET on the high side of the output stage, eliminating a charge pump. As a result, the circuit current consumption

can be substantially reduced during operation.

This product is ideal for driving the motor of a digital still camera as it can switch over between two-phase excitation

driving and microstep driving, using a stepper motor.

FEATURES

O Two H bridge circuits employing power MOSFET

O Current feedback 64-step microstep driving and two-phase excitation driving selectable
O Low on-resistance: 2 Ω MAX.
O 3 V power supply

Minimum operating power supply voltage V

O Under voltage lockout circuit

Shuts down internal circuitry at V

O 24-pin TSSOP

ORDERING INFORMATION

Part Number Package

MICROSTEP DRIVER FOR DRIVING CAMERA LENS

µ

PD168110MA-6A5 24-pin plastic TSSOP (5.72 mm (225))

DATA SHEET

DD = 2.7 V

DD = 1.7 V TYP.

MOS INTEGRATED CIRCUIT

µ

PD168110

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.

Document No. S15840EJ2V0DS00 (2nd edition)
Date Published June 2005 NS CP(K)
Printed in Japan

The mark shows major revised points.

2003

µ

PD168110

PIN FUNCTIONS

Package: 24-pin TSSOP

MODE

CLK

LGND

C

OSC

MOB

PGND2

OUT2B

V

OUT2A

FB2

PS

OE

1

2

3

4

5

6

7

M2

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

RESETB

CW

DD

V

FIL2

FIL1

FB1

OUT1B

M1

V

OUT1A

PGND1

MOBSEL

STOP

Pin No. Pin Name Pin Function

1 MODE Microstep/2-phase excitation switch pin

2 CLK Pulse input pin

3 LGND Control block GND pin

4 COSC Pin connecting capacitor for output oscillator

5 MOB Phase detection output pin

6 PGND2 Output block GND pin

7 OUT2B Channel 2 output B

8 VM2 Motor power pin

9 OUT2A Channel 2 output A

10 FB2 Channel 2 current detection resistor connecting pin

11 PS Power save mode pin

12 OE Output enable pin

13 STOP Stop mode pin

14 MOBSEL MOB output select pin

15 PGND1 Output block GND pin

16 OUT1A Channel 1 output A

17 VM1 Motor power pin

18 OUT1B Channel 1 output B

19 FB1 Channel 1 current detection resistor connecting pin

20 FIL1 Channel 1 filter capacitor connecting pin

21 FIL2 Channel 2 filter capacitor connecting pin

22 VDD Control block power pin

23 CW Revolution direction setting pin

24 RESETB Reset input pin

2

Data Sheet S15840EJ2V0DS

µ

PD168110

BLOCK DIAGRAM

V

DD

V

M1

V

M2

MODE MOBSEL

RESET CLK

DECODER

PULSE

GENERATER

CW PS STOP

C

OSC

LGND

FB1

Current
Sense1

PGND

EVR1

OSC

++

+

–

V

M

H BRIDGE

ch1

OUT1A OUT1B

CURRENT SET

FILTER FILTER

Internal Block

FIL1 OE FIL2

EVR2

+

–

M

V

H BRIDGE

ch2

OUT2A OUT2B

Current
Sense2

PGND

Truth Table

RESET CLK CW OE PS STOP MODE MOBSEL Operation Mode

H

H

H

H

H

H

H X X L X X X X Output Hi-Z

H X X H L H H X

H X X H H H H X

H X X H H L H X Setting prohibited

L X X X X X X X Reset mode

L H L L H L

H H L L H L

L H L L H H

H H L L H H

L H L L L X 2-phase CW mode

H H L L L X 2-phase CCW mode

Microstep CW mode
MOB: 1 pulse/cycle

Microstep CCW mode
MOB: 1 pulse/cycle

Microstep CW mode
MOB: 4 pulses/cycle

Microstep CCW mode
MOB: 4 pulses/cycle

STOP mode after MOB = L
(CLK must be input until MOB = L)

PS mode after MOB = L
(CLK must be input until MOB = L)

MOB

FB2

H: High level, L: Low level, X: High level or low level

Data Sheet S15840EJ2V0DS

3

µ

PD168110

Command Input Timing Chart

In microstep mode

RESET

CLK

CW

OE

PS

STOP

PULSE

OUT

(internal)

Chopping pulse

MOB

Reset status

1

2 3 4 5 6 7 8 9 1011 12 13 14 1516

12 345678910111213 1314 1415 1516 17 18 17 16

Output when MOBSEL = H

CW mode

17 1819 20 21 22 23 24 25 26272829 30

Power save mode

STOP mode

stopped

CCW mode Reset status

Output Hi-Z

4

Data Sheet S15840EJ2V0DS

µ

PD168110

Standard Connection Diagram

Microstep/2-phase excitation driving

CPU

DD

5.0 V

330 pF

V

V

V

C

LGND

FB1

2 kΩ

M1

M2

OSC

Current
Sense1

PGND

3.3 V

Only 2-phase excitation driving

DECODER

PULSE

EVR2

1000 pF

from CPU

M

CPU

CW PS STOP

–

H BRIDGE

ch2

OUT2A OUT2B

M

V

Current
Sense2

PGND

MODE MOBSEL

OSC

++

++–

V

M

H BRIDGE

ch1

OUT1A OUT1B

RESET CLK

GENERATER

EVR1

CURRENT SET

FILTER FILTER

Internal Block

FIL1 OE FIL2

1000 pF

MOB

FB2

2 kΩ

V

10 kΩ

DD

1000 pF1000 pF

3.3 V

5.0 V

V

MODE MOBSEL

V

DD

V

M1

V

M2

C

OSC

LGND

DD

Current

FB1

Sense1

PGND

OSC

++–

V

M

H BRIDGE

ch1

OUT1A OUT1B

RESET CLK

DECODER

PULSE

GENERATER

EVR1

CURRENT SET

FILTER FILTER

Internal Block

FIL1 OE

EVR2

From CPU

M

CW PS STOP

++

–

H BRIDGE

ch2

FIL2

OUT2A OUT2B

DD

V

10 kΩ

MOB

V

DD

M

V

Current
Sense2

PGND

FB2

Data Sheet S15840EJ2V0DS

5

µ

PD168110

Output Timing Chart

• Microstep output mode

100

99.5

98.1

95.7

92.4

88.2

83.1

77.3

70.7

63.4

55.6

47.1

38.3

29.0

19.5

9.8

0

–9.8

–19.5

–29.0

–38.3

–47.1

–55.6

–63.4
–70.7
–77.3

–83.1
–88.2

–92.4

–95.7

–98.1

–99.5

–100

0510

position

Ch 1 current

15 20 25 30 35 40 45 50 55 60 65

100

Ch 2 current

99.5

98.1

95.7

92.4

88.2

83.1

77.3

70.7

63.4

55.6

47.1

38.3

29.0

19.5

9.8

0

—

9.8

—

19.5

—

29.0

—

38.3

—

47.1

—

55.6

—

63.4

—

70.7

—

77.3

—

83.1

—

88.2

—

92.4
—

95.7

—

98.1
—

99.5

—

100

0 5 10 15 20 25 30 35 40 45 50 55 60 65

0 5 10 15 20 25 30 35 40 45 50 55 60 65

0

5 101520253035404550556065

MOB output (when MOBSEL = “L”)

MOB output (when MOBSEL = “H”)

CLK input

0 5 10 15 20 25 30 35 40 45 50 55 60 65

The horizontal axis indicates the number of steps. This figure shows an example in the CW mode. The pulse

advances in synchronization with the rising edge of CLK. The current flows into ch 1 and ch 2 in the positive direction

when it flows from OUT1A to OUT1B, and in the negative direction when it flows from OUT1B to OUT1A (the values

shown above are ideal values and do not indicate the actual values).

6

Data Sheet S15840EJ2V0DS

µ

Output Timing Chart

• 2-phase excitation output mode

Ch 1 current

100

–100

012345678

Ch 2 current

100

PD168110

–100

012345678

MOB output

012345678

CLK input

012345678

The horizontal axis indicates the number of steps. This figure shows an example in the CW mode. The current

flows into ch 1 and ch 2 in the positive direction when it flows from OUT1A to OUT1B, and in the negative direction

when it flows from OUT1B to OUT1A.

Data Sheet S15840EJ2V0DS

7

µ

PD168110

Relationship Between Revolution Angle, Phase Current, and Vector Amount (64 microsteps)

Step

θ

0 0

θ

1 5.625 2.5 9.8 17.0 94.5 100 104.5 100.48

θ

2 11.250 12.4 19.5 26.5 93.2 98.1 103.0 100

θ

3 16.875 22.1 29.0 36.1 90.7 95.7 100.7 100.02

θ

4 22.500 31.3 38.3 45.3 87.4 92.4 97.4 100.02

θ

5 28.125 40.1 47.1 54.1 83.2 88.2 93.2 99.99

θ

6 33.750 48.6 55.6 62.6 78.1 83.1 88.1 99.98

θ

7 39.375 58.4 63.4 68.4 72.3 77.3 82.3 99.97

θ

8 45 65.7 70.7 75.7 65.7 70.7 75.7 99.98

θ

9 50.625 72.3 77.3 82.3 58.4 63.4 68.4 99.97

θ

10 56.250 78.1 83.1 88.1 48.6 55.6 62.6 99.98

θ

11 61.875 83.2 88.2 93.4 40.1 47.1 54.1 99.99

θ

12 67.500 87.4 92.4 97.4 31.3 38.3 45.3 100.02

θ

13 73.125 90.7 95.7 100.7 22.1 29.0 36.1 100.02

θ

14 78.750 93.2 98.1 103.0 12.4 19.5 26.5 100

θ

15 84.375 94.5 100 104.5 2.5 9.8 17.0 100.48

θ

16 90

Revolution

Angle

Phase A – Phase Current Phase B – Phase Current Vector Amount

Min. Typ. Max. Min. Typ. Max. Typ.

−

−

0 3.8

100

− −

−

100

0 3.8 100

−

100

The above values are ideal values and are not guaranteed values.

8

Data Sheet S15840EJ2V0DS

µ

PD168110

FUNCTION DESCRIPTION

2-phase excitation driving mode

By allowing a current of ±100% to flow into output ch1 and ch2 at the same time, a motor can be driven with the

larger torque.

The two-phase excitation driving mode and microstep driving mode are switched by the MODE pin. In the two-

phase excitation driving mode, the chopping pulse circuit does not operate.

Microstep driving of stepper motor

To position a stepper motor with high accuracy, the

through the H bridge by a vector value and to stop one cycle in 64 steps. To realize the microstep driving mode, the

driver internally realizes the following functions.

• Detecting the current flowing into each channel as a voltage value by a sense resistor

• Synthesizing the dummy sine wave of the half-wave generated by the internal D/A and PWM oscillation wave for

chopping operation

• The driver stage performs PWM driving based on the result of comparing the detected voltage value and

synthesized waves.

The internal dummy sine wave is of 64 steps per cycle, so that the stepper motor can be driven in 64 steps. The

microstep driving mode and two-phase excitation driving mode are switched by an external pin.

µ

PD168110 has a function to hold constant the current flowing

+

M

A

Concept of microstep driving operation

MOB output

The MOB output pin outputs “L” if the current of ch1 or ch2 reaches ±100% in the microstep output mode, or if the

current of ch 1 reaches +100%. In the two-phase excitation output mode, the MOB pin outputs “L” when the current of

ch1 and ch2 reaches +100%. The excitation position of the stepper motor can be checked by monitoring the MOB

output. The MOB output also indicates the stop position information in the stop mode to be explained below.

The MOB output goes into a Hi-Z state (output H level if pulled up) when OE = “L”.

Stop mode

If the stop mode is set by the STOP pin, the pulse is automatically output until MOB = “L” when CLK is input. If

MOB = “L” in the stop mode, the pulse is not output even when CLK is input, and the output holds the excitation

status.

To advance the pulse, release the stop mode and restore the normal mode.

Data Sheet S15840EJ2V0DS

9

µ

PD168110

Reset function

When RESET = “L”, initialization is executed and the output goes into a Hi-Z state. When RESET = “H”, excitation

is started with the current of ch1 at +100% and the current of ch2 at 0% (one-phase excitation position). To perform

two-phase excitation driving, excitation is started with the currents of ch1 and ch2 at +100% after the mode has been

set. Be sure to execute a reset operation after power application. MOB outputs “L” until the pulse is output when

RESET goes “L”.

Output enable (OE) pin

The pulse output can be forcibly stopped from an external source by using the OE pin. When OE = “L”, the output

is forcibly made to go into a Hi-Z state.

Standby function

The

µ

PD168110 can enter the standby mode when the pulse is not output and when PS = “H” and

STOP = “H”. In the standby mode, as many internal circuits as possible are stopped so that the self current

consumption can be reduced. In the standby mode, the current consumption is 1

stopped. While CLK is being input, the current consumption is reduced to 300

µ

A MAX. when external CLK input is

µ

A MAX. by the current flowing into the

input buffer. The standby mode is released when PS = “L” and STOP = “L”.

Under voltage lockout circuit (UVLO)

This function is used to forcibly stop the operation of the IC to prevent malfunction of the circuits if V

drops during operation. Note that if the V

DD voltage abruptly drops in the order of

µ

s, this function may not operate.

DD of the IC

V

M pin current shutdown circuit

A circuit that prevents a current from flowing into the VM pin when V

flowing into the VM pin is cut off when V

A current of up to 3

µ

A flows into the VM pin when VDD is applied so that the voltages on the VDD and VM pins can

DD = 0 V.

DD = 0 V is provided. Therefore, the current

be monitored.

10

Data Sheet S15840EJ2V0DS

µ

PD168110

OPERATION DESCRIPTION

• Setting output current

The peak value of the output current (when current of ch 1 or ch 2 is 100%) is determined by the resistor R

is connected to FB1 and FB2. This IC has an internal reference power supply V

current, and drives the stepper motor with the current value calculated by R

REF (500 mV TYP.) for comparing

FB and VREF as the peak output

current value.

Peak output current value I

MAX (A) ≅ VREF (V) ÷ RFB (Ω) x Output detection ratio

• Pulse output

The motor is driven by inputting a pulse to the CLK pin. The motor advances by one pulse at the rising edge of

the CLK signal. When MODE = “H”, the motor is driven in the 64-microstep driving mode, and the driving current

of each step is determined based on the internal motor excitation position information and revolution direction.

When MODE = “L”, the two-phase excitation mode is selected, and the current direction (100% drive) of ch 1 and

ch 2 are switched each time a pulse has been input.

• Setting motor revolution direction
The revolution direction of the motor is set by CW. In the CW mode (CW = “L”), the current of ch2 is output, 90°
degrees in phase behind the current of ch1. In the CCW mode (CW = “H”), the current of ch2 is output, 90°

degrees in phase ahead of the current of ch1.

CW Pin Operation Mode

FB that

L CW mode (forward revolution)

H CCW mode (reverse revolution)

• Setting stop mode (valid only in microstep driving mode)

When STOP = “H”, the motor advances to the position of MOB output = “L”, and the output status is held.

The excitation status is not changed even when a pulse is input to CLK while MOB = “L” when STOP = “H”. The

pulse can be advanced when STOP = “L”.

STOP Operation Mode

L Normal mode

H Stop mode

Caution If STOP = “L” before the stop mode is set (until MOB = “L”), the operation is performed in the

same manner as in the normal mode.

Data Sheet S15840EJ2V0DS

11

µ

PD168110

• Power save mode (valid only in microstep driving mode)

When PS = “H” and STOP = “H”, the motor advances to the position of MOB output = “L” and then the output

goes to a Hi-Z state.

The internal circuitry is stopped as much as possible and the standby mode is set. The power save mode is

released when PS = “L” and STOP = “L”.

STOP Operation Mode

L Normal mode

H Power save mode (only when STOP = “H”)

Caution Inputting PS = “H” and STOP = “L” is prohibited.

• Setting output enable

When OE = “H”, the motor is driven (output excitation status). Be sure to set OE to “H” to drive the motor.

STOP Operation Mode

L Output Hi-Z

H Enable mode

• Selecting two-phase excitation/microstep driving mode

The MODE pin can be used to select the two-phase excitation or microstep driving mode. When MODE = “H”,

the microstep driving mode is selected. When MODE = “L”, the two-phase excitation mode (both ch 1 and ch 2

are driven at +100% or –100%) is selected. The

µ

PD168110 is initialized immediately after a RESET operation,

so excitation is started from the position at which the output current of ch 1 is 100% and the output current of ch

2 is 0% in the microstep driving mode, and from the position at which the output currents of both ch 1 and ch 2

are +100% in the two-phase excitation driving mode.

If the mode is changed from the microstep to the two-phase, the position of the microstep mode is retained until

CLK is input. When the first CLK is input, pulse output is started, the operation skips to the two-phase position of

the next quadrant, and driving is started.

MODE Operation Mode

L 2-phase excitation

H Microstep driving

Microstep stop

position

(example 2)

(3)

Microstep stop position

(example 1)

2-phase

excitation stop

(1)

position

Skips to next quadrant

(2)

Concept of switching operation mode

from microstep to 2-phase excitation

12

Data Sheet S15840EJ2V0DS

µ

PD168110

• Selecting MOB output (in microstep driving mode only)

The output function of MOB can be selected by MOBSEL. When MOBSEL = “L”, MOB is output at the position

where the current of ch1 is +100% and the current of ch2 is 0%. When MOBSEL = “H”, MOB is output at the
position where the current of ch1 or ch2 is ±100%.

MOBSEL MOB Output

L Current of ch1 is +100% and current of ch2 is 0% (1 pulse/cycle).

H Current of ch1 or ch2 is ±100% (4 pulses/cycle).

RESET position

100

99.5

98.1

95.7

92.4

88.2

83.1

77.3

70.7

63.4

55.6

47.1

38.3

29.0

19.5

9.8

0

—

9.8

—

19.5

—

29.0

—

38.3

—

47.1

—

55.6

—

63.4

—

70.7

—

77.3

—

83.1

—

88.2

—

92.4
—

95.7

—

98.1
—

99.5

—

100

0 5 10 15 20 25 30 35 40 45 50 55 60 65

100

99.5

98.1

95.7

92.4

88.2

83.1

77.3

70.7

63.4

55.6

47.1

38.3

29.0

19.5

9.8

0

—

9.8

—

19.5

—

29.0

—

38.3

—

47.1

—

55.6

—

63.4

—

70.7

—

77.3

—

83.1

—

88.2

—

92.4
—

95.7

—

98.1
—

99.5

—

100

0 5 10 15 20 25 30 35 40 45 50 55 60 65

Ch 1 current

Ch 2 current

MOB output MOBSEL = “L”

0 5 10 15 20 25 30 35 40 45 50 55 60 65

MOB output MOBSEL = “H”

0 5 10 15 20 25 30 35 40 45 50 55 60 65

Data Sheet S15840EJ2V0DS

13

µ

PD168110

ABSOLUTE MAXIMUM RATINGS
(T

A = 25°C: GLASS EPOXY BOARD OF 100 mm × 100 mm × 1 mm WITH C OPPER FOIL OF 15%)

Parameter Symbol Conditions Rating Unit

VDD Control block −0.5 to +6.0 Power supply voltage

V

M Motor block −0.5 to +6.0

Input voltage VIN −0.5 to VDD +0.5 V

Output pin voltage VOUT 6.2 V

DC output current ID(DC) DC ±0.4 A/ch

Instantaneous output current ID(pulse) PW < 10 ms, Duty 20% ±0.7 A/ch

Power consumption PT 0.7 W
Peak junction temperature TCH(MAX) 150 °C
Storage temperature Tstg −55 to +150 °C

V

RECOMMENDED OPERATING CONDITIONS
(T

A = 25°C: GLASS EPOXY BOARD OF 100 mm × 100 mm × 1 mm WITH COPPER FOIL OF 15%)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

VDD Control block 2.7 3.6 V Power supply voltage

V

M Motor block 2.7 5.5 V

Input voltage VIN 0 VDD V
DC output current ID(DC) DC −0.35 +0.35 A/ch
Instantaneous output current ID(pulse) PW < 10 ms, Duty ≤ 20% −0.6 +0.6 A/ch

MOB pin output sink current IMOB Open-drain output 5 mA
Operating temperature range TA −10 75 °C

14

Data Sheet S15840EJ2V0DS

µ

PD168110

ELECTRICAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED, VDD = VM = 3 V, TA = 25°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

VDD pin current after reset IDD(STB) External CLK stopped 1.0

IDD(STB2) External CLK stopped 30

I

DD(STB3) External CLK is input 300

VDD pin current during operation IDD(ACT) 3.0 mA

VM pin current

High-level input current IIH VIN = VDD 1.0
Low-level input current IIL VIN = 0 V −1.0 µA
High-level input voltage VIH 2.7 V ≤ VDD ≤ 3.6 V 0.7 x VDD V
Low-level input voltage VIL 2.7 V ≤ VDD ≤ 3.6 V 0.3 x VDD V

Input hysteresis voltage Vhys 0.3 V

H bridge on-resistance

Output turn-on time tON 0.02 0.5

Output turn-off time tOFF

Internal reference voltage VREF 450 500 550 mV

Output detection ratio

I

M(OFF)

R

ON

M

= 5.5 V per VM pin, after reset

V
and in standby mode

M = 0.35 A, sum of upper and

I
lower stages,
FB1 = FB2 = 0 V

M

= 20 Ω

R
OE pin ↑ → output SW time

IM = 0.1 A, with 5 kΩ sense
resistor connected

3.0

2.0

0.02 0.5

950 1050 1150

µ

A

µ

A VDD pin current in standby mode

µ

A

µ

A

µ

A

Ω

µ

s

µ

s

Cautions 1. The undervoltage lockout detection circuit (UVLO) operates at 1.7 V TYP. whereupon the

output goes into a Hi-Z state. Internal data such as the excitation position information is

reset. The UVLO circuit does not operate after reset.

2. A shutdown circuit that prevents a current from flowing into the V

M pin when VDD = 0 V is

provided.

Data Sheet S15840EJ2V0DS

15

µ

PD168110

PACKAGE DRAWING

24-PIN PLASTIC TSSOP (5.72 mm (225))

24

13

detail of lead end

F

G

R

P

L

S

1

A

A'

12

E

H

I

J

S

C

K

SN

DM

NOTE

Each lead centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.

M

B

ITEM MILLIMETERS

A

6.65±0.10

6.5±0.1

A'

0.575

B

0.5 (T.P.)

C

0.22±0.05

D

0.1±0.05

E

F

1.2 MAX.

1.0±0.05

G

6.4±0.1

H

I

4.4±0.1

1.0±0.1

J

0.17±0.025

K

L

0.5

0.10

M

0.08

N

P3°

R
S 0.6±0.15

+5°

−3°

0.25

P24MA-50-6A5

16

Data Sheet S15840EJ2V0DS

µ

PD168110

RECOMMENDED SOLDERING CONDITIONS

The µPD168110 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Recommended Soldering Conditions for Surface Mounting Type

µ

PD168110MA-6A5 24pin TSSOP

Soldering Method Soldering Conditions Recommended

Condition Symbol

Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or

higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with

low chlorine (0.2 Wt% or below) recommended

Caution Do not use different soldering methods together (except for partial heating).

IR60-00-3

Data Sheet S15840EJ2V0DS

17

µ

PD168110

•

The information in this document is current as of June, 2005. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.

No part of this document may be copied or reproduced in any form or by any means without the prior

•

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative

•

purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer­designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.

"Standard":

"Special":

"Specific":

Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.

(Note)
(1)

"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.

(2)

"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).

M8E 02. 11-1