NEC NNCD3.3B, NNCD4.7B, NNCD5.1B, NNCD7.5B, NNCD8.2B Datasheet

...
DATA SHEET
E.S.D NOISE CLIPPING DIODES
NNCD3.3B to NNCD12B
ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES
(500 mW TYPE)
This product series is a diode developed for E.S.D (Electrostatic Discharge) noise protection. Based on the IEC1000-4-2 test on electromagnetic interference (EMI), the diode assures an endur­ance of no less than 30 kV.
Type NNCD2.0B to NNCD12B Series is into DO-35 Package with DHD (Double Heatsink Diode) construction having allowable power dissipation of 500 mW.
PACKAGE DIMENSIONS
(in millimeters)
0.5
φ
FEATURES
• Based on the electrostatic discharge immunity test (IEC1000-4-
2), the product assures the minimum endurance of 30 kV.
• Based on the reference supply of the set, the product achieves
a series over a wide range (15 product name lined up).
• DHD (Double Heatsink Diode) construction.
APPLICATIONS
• Circuit E.S.D protection.
• Circuits for Waveform clipper, Surge absorber.
MAXIMUM RATINGS (TA = 25 °C)
Power Dissipation P 500 mW
Surge Reverse Power P
Junction Temperature Tj 175 °C
Storage Temperature Tstg –65 °C to +175 °C
RSM 100 W (tT = 10
µ
s 1 pulse) Fig. 7
Cathode indication
φ
2.0 MAX.
25 MIN. 25 MIN.4.2 MAX.
Document No. D11770EJ2V0DS00 (2nd edition) Date Published December 1996 N Printed in Japan
©
1996
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)
NNCD3.3B to NNCD12B
Breakdown Voltage
VBR (V)
Type Number
MIN. MAX. IT (mA) MAX. IT (mA) MAX. VR (V) TYP.
NNCD3.3B 3.16 3.53 20 70 20 20 1.0 240 30 NNCD3.6B 3.47 3.83 20 60 20 10 1.0 230 30 NNCD3.9B 3.77 4.14 20 50 20 5 1.0 220 30 NNCD4.3B 4.05 4.53 20 40 20 5 1.0 210 30 NNCD4.7B 4.47 4.91 20 25 20 5 1.0 190 30 NNCD5.1B 4.85 5.35 20 20 20 5 1.5 160 30 NNCD5.6B 5.29 5.88 20 13 20 5 2.5 140 NNCD6.2B 5.81 6.40 20 10 20 5 3.0 120 NNCD6.8B 6.32 6.97 20 8 20 2 3.5 110 30 NNCD7.5B 6.88 7.64 20 8 20 0.5 4.0 90 30 NNCD8.2B 7.56 8.41 20 8 20 0.5 5.0 90 30 NNCD9.1B 8.33 9.29 20 8 20 0.5 6.0 90 30 NNCD10B 9.19 10.3 20 8 20 0.2 7.0 80 30 NNCD11B 10.18 11.26 10 10 10 0.2 8.0 70 30 NNCD12B 11.13 12.30 10 10 10 0.2 9.0 70 30
Note 1
Dynamic Impedance
Zz ()
Reverse Leakage Capacitance E.S.D Voltage
Note 2
IR (µA) Ct (pF) (kV)
TEST CONDITION CONDITION
VR = 0 V f = 1 MHz
MIN.
30 30
TEST
C = 150 pF
R = 330 (IEC1000
-4-2)
Notes 1. Tested with pulse (40 ms)
2. Zz is measured at IT give a small A.C. signal.
2
TYPICAL CHARACTERISTICS (TA = 25 °C)
10 mm
= 5 mm
= 10 mm
0 40 80 120 160 20020 60 100 140 180
600
500
400
300
200
100
0
P.C Board 3 mm t = 0.035 mm
φ
P.C Board 7 mm t = 0.035 mm
P - Power Dissipation - mW
TA - Ambient Temperature - °C
= 10 mm
= 5 mm
0 20406080100
600
500
400
300
200
100
0
S - Size of P.C Board - mm
2
Junction to anbient
S
Fig. 1 POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Fig. 2 THERMAL RESISTANCE vs.
SIZE OF P.C BOARD
R
th
- Thermal Resistance - °C/W
NNCD3.3B to NNCD12B
Fig. 3 IT - VBR CHARACTERISTICS Fig. 4 IT - VBR CHARACTERISTICS
NNCD5.1B
100 m
NNCD3.3B NNCD3.6B
10 m
NNCD3.9B
NNCD4.3B
NNCD4.7B
1 m
100
µ
10
µ
IT - On State Current - A
1
µ
100 n
10 n
1 n
0246813579
V
BR - Breakdown Voltage - V
NNCD5.6B
TA = 25 °C TYP.
NNCD6.2B
NNCD6.8B
NNCD7.5B
NNCD8.2B
NNCD9.1B
100 m
10 m
1 m
100
µ
10
µ
IT - On State Current - A
1
µ
100 n
10 n
1 n
0 8 10 12 147 9 11 13 15
TA = 25 °C TYP.
NNCD11B
NNCD10B
BR - Breakdown Voltage - V
V
NNCD12B
3
Fig. 5 Zz - IT CHARACTERISTICS
NNCD3.3B to NNCD12B
5 000
1 000
100
1 000
TA = 25 °C TYP.
NNCD3.3B
100
NNCD3.9B
10
- Dynamic Impedance -
Z
Z
1
0.01 0.1 1 10 100 I
T
- On State Current - mA
NNCD7.5B
NNCD5.6B
NNCD10B
Fig. 6 TRANSIENT THERMAL IMPEDANCE
NNCD [ ] B
NNCD4.7B
300 °C/W
- Transient Thermal Impedance - °C/W
10
th
Z
5
1 m 10 m 100 m 1 10 100
t - Time - s
Fig. 7 SURGE REVERSE POWER RATING
1 000
100
NNCD [ ] B
10
- Surge Reverse Power - W
RSM
P
1
110
µµ
100
µ
t
T
- Pulse Width - s
1 m 10 m
A
= 25 °C
T Non-repetitive
RSM
P
t
T
100 m
4
NNCD3.3B to NNCD12B
REFERENCE
Document Name Document No. NEC semiconductor device reliability/quality control system C11745E NEC semiconductor device reliability/quality control system MEI-1201 Quality grade on NEC semiconductor device C11531E Semiconductor device mounting technology manual C10535E Guide to quality assurance for semiconductor device MEI-1202
5
[MEMO]
NNCD3.3B to NNCD12B
6
[MEMO]
NNCD3.3B to NNCD12B
7
NNCD3.3B to NNCD12B
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96.5
8
Loading...