The 2SK3663 is a switching device which can be driven directly
by a 2.5 V power source.
The 2SK3663 features a low on-state resistance and excellent
switching characteristics, and is suitable for applications such as
power switch of portable machine and so on.
FEATURES
• 2.5 V drive available
• Low on-state resistance
= 0.57 Ω MAX. (VGS = 4.5 V, ID = 0.30 A)
DS(on)1
R
R
= 0.60 Ω MAX. (VGS = 4.0 V, ID = 0.30 A)
DS(on)2
R
= 0.88 Ω MAX. (VGS = 2.5 V, ID = 0.15 A)
DS(on)3
ORDERING INFORMATION
PART NUMBERPACKAGE
2SK3663SC-70 (SSP)
Remark Marking : G26
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)V
Gate to Source Voltage (VDS
= 0 V)V
DSS
GSS
Drain Current (DC)ID (DC)
Drain Current (pulse)
Total Power Dissipation
Note1
Note2
I
D (pulse)
P
T
Channel TemperatureTch
Storage TemperatureTstg−55 to +150°C
s, Duty Cycle ≤ 1%
Notes 1. PW ≤ 10
2. Mounted on FR-4 board of 2500 mm
µ
2
x 1.1 mm
20V
±12V
±0.5A
±2.0A
0.2W
150°C
PACKAGE DRAWING (Unit: mm)
EQUIVALENT CIRCUIT
Drain
Body
Gate
Gate
Protection
Diode
Source
Diode
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When
this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated
voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No.D16529EJ1V0DS00 (1st edition)
Date Published January 2003 NS CP(K)
Printed in Japan
2003
Page 2
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICSSYMBOLTEST CONDITIONSMIN.TYP. MAX. UNIT
2SK3663
Zero Gate Voltage Drain CurrentI
Gate Leakage CurrentI
Gate Cut-off Voltage
Forward Transfer Admittance
Drain to Source On-state Resistance
Note
Note
Note
Input CapacitanceC
Output CapacitanceC
Reverse Transfer CapacitanceC
Turn-on Delay Timet
Rise Timet
Turn-off Delay Timet
Fall Timet
Body Diode Forward VoltageV
Pulsed : PW≤350 µs, Duty Cycle≤2%
Note
TEST CIRCUIT SWITCHING TIME
DSS
VDS = 20 V, VGS = 0 V1.0
GSS
VGS = ±12 V, VDS = 0 V±10
GS(off)VDS
V
= 10 V, ID = 1.0 mA0.51.01.5V
| yfs |VDS = 10 V, ID = 0.30 A0.250.75S
DS(on)1VGS
R
DS(on)2VGS
R
DS(on)3VGS
R
iss
oss
rss
d(on)
r
d off)
f
F(S-D)IF
= 4.5 V, ID = 0.30 A0.380.57Ω
= 4.0 V, ID = 0.30 A0.410.60Ω
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
120
100
80
60
40
20
0
0255075100125150175
TA - Ambient Temperature - °C
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
2
Pulsed
VGS = 4.5 V
1.6
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
0.24
0.2
0.16
0.12
0.08
- Total Power Dissipation - W
T
P
Mounted on FR-4 board o
2500 mm2 x 1.1 mm
0.04
0
0255075100125150175
TA - Ambient Temperature - °C
FORWARD TRANSFER CHARACTERISTI CS
10
VDS = 10 V
Pulsed
1
- Drain Current - A
D
I
-Gate Cut-off Voltage - V
GS(off)
V
4.0 V
1.2
0.8
0.4
0
00.40.81.21.6
2.5 V
VDS - Drain to Source Voltage - V
GATE CUT-OFF VOLTAGE vs.
CHANNEL TEMPERATURE
1.4
VDS = 10 V
I
= 1.0 mA
D
1.2
1
0.8
0.6
0.4
-50050100150
Tch - Channel Temperature - °C
- Drain Current - A
D
I
| - Forward Transfer Admittance - S
fs
| y
0.1
0.01
0.001
0.0001
00.511.522.53
TA = 125°C
75°C
25°C
−25°C
VGS - Gate to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
10
V
= 10 V
DS
Pulsed
TA = −25°C
1
0.1
0.01
0.0010.010.1110
25°C
75°C
125°C
ID - Drain Current - A
Data Sheet D16529EJ1V0DS
3
Page 4
2SK3663
DRAIN TO SOURCE ON-STATE RESISTA NCE vs.
CHANNEL TEMPERATURE
1.2
Pulsed
1
0.8
0.6
0.4
0.2
- Drain to Source On-state Resistance - Ω
0
DS(on)
R
-50050100150
VGS = 2.5 V, ID = 0.15 A
VGS = 4.0 V, ID = 0.30 A
VGS = 4.5 V, ID = 0.30 A
Tch - Channel Temperature - °C
DRAIN TO SOURCE ON-STATE RESISTA NCE vs.
DRAIN CURRENT
1.2
VGS = 4.5 V
Pulsed
1
0.8
0.6
TA = 125°C
75°C
DRAIN TO SOURCE ON-STATE RESISTA NCE vs.
GATE TO SOURCE VOLTAGE
1.2
ID = 0.30 A
Pulsed
1
0.8
0.6
0.4
0.2
- Drain to Source On-state Resistance - Ω
0
DS(on)
R
024681012
VGS - Gate to Source Voltage - V
DRAIN TO SOURCE ON-STATE RESISTA NCE vs.
DRAIN CURRENT
1.2
VGS = 4.0 V
Pulsed
1
0.8
0.6
TA = 125°C
75°C
0.4
0.2
- Drain to Source On-state Resistance - Ω
0
0.010.1110
DS(on)
R
25°C
−
25°C
ID - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTA NCE vs.
DRAIN CURRENT
1.2
VGS = 2.5 V
Pulsed
1
TA = 125°C
75°
0.8
0.6
0.4
0.2
−
25°C
25°C
- Drain to Source On-state Resistance - Ω
0
DS(on)
R
0.010.1110
ID - Drain Current - A
0.4
0.2
- Drain to Source On-state Resistance - Ω
0
0.010.1110
DS(on)
R
25°C
−25°C
ID - Drain Current - A
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
100
VGS = 0 V
f = 1.0 MHz
10
- Capacitance - pF
rss
, C
oss
, C
iss
C
1
0.1110100
VDS - Drain to Source Voltage - V
iss
C
oss
C
rss
C
4
Data Sheet D16529EJ1V0DS
Page 5
2SK3663
SWITCHING CHARACTERISTICSSOURCE TO DRAIN DIODE FORWARD VOLTAGE
1000
VDD = 10 V
VGS = 4.0 V
Ω
G
R
= 10
d(off)
t
100
- Switching Time - ns
f
, t
d(off)
, t
r
, t
d(on)
t
10
0.010.1110
t
t
f
d(on)
r
t
ID - Drain Current - A
10
VGS = 0 V
Pulsed
1
0.1
0.01
– Diode Forward Current - A
F
I
0.001
0.40.60.811.21.4
F (S-D)
V
- Source to Drain Voltage - V
Data Sheet D16529EJ1V0DS
5
Page 6
2SK3663
•
The information in this document is current as of January, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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•
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•
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M8E 02. 11-1
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