NEC 2SK3296 Technical data

DATA SHEET
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MOS FIELD EFFECT TRANSISTOR
SWITCHING
N-CHANNEL POWER MOS FET
INDUSTRIAL USE
2SK3296
DESCRIPTION
The 2SK3296 is N-Channel MOS FET device that features a low on-state resistance and excellent switching characteristics, designed for low voltage high current applications such as DC/DC converter with synchronous rectifier.
FEATURES
4.5 V drive available
Low on-state resistance
DS(on)1
= 12 mMAX. (VGS = 10 V, ID = 18 A)
R
Low gate charge
QG = 30 nC TYP. (ID = 35 A, VDD = 16 V, VGS = 10 V)
Built-in gate protection diode
Surface mount device available
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V) V
DS
Gate to Source Voltage (V
Drain Current (DC) (T
Drain Current (Pulse)
= 0 V) V
C
= 25°C) I
Note
DSS
GSS
D(DC)
D(pulse)
I
20 V
±20 V
±35 A
±140 A
ORDERING INFORMATION
PART NUMBER PACKAGE
2SK3296 TO-220AB
2SK3296-S TO-262
2SK3296-ZK TO-263(MP-25ZK)
2SK3296-ZJ TO-263(MP-25ZJ)
A
Total Power Dissipation (T
= 25°C) P
Total Power Dissipation (TC = 25°C) P
Channel Temperature T
Storage Temperature T
Note
PW 10 µs, Duty Cycle 1%
T1
T2
ch
stg
The mark
1.5 W
40 W
150 °C
55 to +150 °C

shows major revised points.
©
1999, 2000
ELECTRICAL CHARACTERISTICS(TA = 25°C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Drain Leakage Current I
Gate Leakage Current I
DSS
GSS
2SK3296
VDS = 20 V, VGS = 0 V 10
VGS = ±20 V, VDS = 0 V
±
10
A
µ
A
µ
R
d(on)
r
d(off)
f
rr
GS(off)
DS(on)1
DS(on)2
iss
oss
rss
G
GS
GD
F(S-D)
rr
VDS = 10 V, ID = 1 mA 1.0 2.5 V
DS
= 10 V, ID = 18 A 9.0 S
VGS = 10 V, ID = 18 A 8.5 12
VGS = 4.5 V, ID = 18 A 12 19
VDS = 10 V 1300 pF
VGS = 0 V 570 pF
f = 1 MHz 300 pF
VDD = 10 V , ID = 18 A 70 ns
GS(on)
V
= 10 V 1220 ns
RG = 10
VDD = 16 V 30 nC
VGS = 10 V 4.5 nC
ID = 35 A 8.0 nC
IF = 35 A, VGS = 0 V 1.0 V
IF = 35 A, VGS = 0 V 35 ns
di/dt = 100 A/µs
Gate Cut-off Voltage V
Forward Transfer Admittance | yfs |V
Drain to Source On-state Resistance R
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Turn-on Delay Time t
Rise Time t
Turn-off Delay Time t
Fall Time t
Total Gate Charge Q
Gate to Source Charge Q
Gate to Drain Charge Q
Diode Forward Voltage V
Reverse Recovery Time t
Reverse Recovery Charge Q
m
m
100 ns
180 ns
23 nC
TEST CIRCUIT 1 SWITCHING TIME
D.U.T.
L
R
G
PG.
V
GS
0
τ = 1 s Duty Cycle 1%
R
V
DD
τ
µ
GS
V
Wave Form
I
D
Wave Form
TEST CIRCUIT 2 GATE CHARGE
D.U.T.
V
GS
10%
0
I
D
90%
10%
0
t
d(on)
r
t
on
t
90%
V
GS
(on)
PG.
90%
I
D
t
d(off)
10%
t
f
t
off
IG = 2 mA
50
R
L
V
DD
2
Data Sheet D14063EJ2V0DS
TYPICAL CHARACTERISTICS (TA = 25°C)
2SK3296
DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE
160 140
V
GS
120
=10 V
7.0 V
100
80 60
- Drain Current - A
D
40
I
20
0
0
GATE TO SOURCE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE
1
V
DS
- Drain to Source Voltage - V
2
3.0
2.5
2.0
1.5
4.5 V
Pulsed
VDS = 10 V ID = 1 mA
FORWARD TRANSFER CHARACTERISTICS
1000
100
T
ch
= 50˚C
10
0.1
- Drain Current - A
D
I
25˚C 25˚C 75˚C
125˚C
1
150˚C
0.01 V
DS
= 10 V
0.001
3
012 3
V
GS
- Gate to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT
Pulsed
4
56
100
T
ch
= 50˚C
−25˚C 25˚C
75˚C
10
150˚C
1.0
0.5
- Gate to Source Cut-off Voltage - V
0
GS(off)
50
V
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE
50
40
0 50 100 150
T
ch
- Channel Temperature - ˚C
Pulsed
ID = 28 A 18 A
30
7 A
20
10
- Drain to Source On-state Resistance - m
DS(on)
R
0
0
V
GS
- Gate to Source Voltage - V
1051520
1
| - Forward Transfer Admittance - S
fs
0.1
| y
0.1
50
Pulsed
1 10 100
D
- Drain Current - A
I
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT
40
30
20
V
GS
= 4.5 V
7.0 V 10 V
10
- Drain to Source On-state Resistance - m
DS(on)
R
0
101
I
D
- Drain Current - A
DS
= 10 V
V
Pulsed
1000100
Data Sheet D14063EJ2V0DS
3
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