The 2SK1584 is a switching device which can be driven directly
by a 5-V power source.
The 2SK1584 features a low on-state resistance and excellent
switching characteristics, and is suitable for applications such as
actuator driver.
FEATURES
• Can be driven by a 5-V power source.
• Low On-state resistance :
DS(on)1
R
R
= 2.0 Ω MAX. (VGS = 4 V, ID = 0.3 A)
DS(on)2
= 1.5 Ω MAX. (VGS = 10 V, ID = 0.3 A)
ABSOLUTE MAXIMUM RATI NGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)V
Gate to Source Voltage (V
Drain Current (DC) (T
Drain Current (pulse)
Total Power Dissipation (T
DS
= 0 V)V
C
= 25°C)I
Note1
A
= 25°C)
Note2
Channel TemperatureT
Storage TemperatureT
Notes1.
2.
PW ≤ 10 ms, Duty Cycle ≤ 50%
Mounted on ceramic board of 16 cm2 × 0.7 mm
DSS
GSS
D(DC)
D(pulse)
I
P
ch
stg
±20V
±500mA
±1.0A
T
2.0W
150°C
−55 to +150 °C
30V
PACKAGE DRAWING (Unit : mm)
4.5±0.1
.
0.42
±0.06
0.8MIN
1.6±0.2
2
1
1.5
3.0
0.47
±0.06
3
0.42
2.5±0.1
±0.06
1.5±0.1
4.0±0.25
+0.03
0.41
-0.05
Marking : NH
EQUIVALENT CIRCUIT
Drain
Internal
Gate
Gate
Protection
Diode
Source
Diode
Electrode
Connection
1.Source
2.Drain
3.Gate
Remark
The diode connected between the gate and source of the transistor serves as a protector against ESD.
When this device is actually used, an additional protection circuit is externally required if a voltage exceeding
the rated voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. D15283EJ2V0DS00 (2nd edition)
Date Published February 2001 NS CP (K)
Printed in Japan
Zero Gate Voltage Drain CurrentI
Gate Leakage CurrentI
Gate Cut-off VoltageV
DSS
VDS = 30 V, VGS = 0 V1.0
GSS
VGS = ±20 V, VDS = 0 V±10
GS(off) VDS
= 10 V, ID = 0.1 mA1.31.852.5V
Forward Transfer Admittance| yfs | VDS = 5 V, ID = 0.5 A350440mS
DS(on)1 VGS
Drain to Source On-state Resistance
R
R
Input CapacitanceC
Output CapacitanceC
Reverse Transfer CapacitanceC
Turn-on Delay Timet
Rise Timet
Turn-off Delay Timet
Fall Timet
DS(on)2 VGS
iss
oss
rss
d(on)
r
d(off)
f
= 4 V, ID = 0.3 A1.22.0
= 10 V, ID = 0.3 A0.651.5
VDS = 10 V
VGS = 0 V
f = 1 MHz
VDD = 10 V, ID = 0.3 A
GS(on)
= 4 V
V
G
R
= 10
Ω
L
= 33
R
Ω
60pF
50pF
9pF
80ns
270ns
100ns
110ns
TEST CIRCUIT SWITCHING TIME
D.U.T.
V
GS
L
R
V
GS
R
PG.
GS
V
G
0
Wave Form
V
DD
I
D
Wave Form
τ
10%
0
I
D
90%
10%
0
t
t
d(on)
r
90%
V
GS
(on)
90%
I
D
t
d(off)
10%
t
f
A
µ
A
µ
Ω
Ω
τ = 1 s
µ
Duty Cycle ≤ 1%
2
t
t
on
Data Sheet D15283EJ2V0DS
off
Page 3
★
TYPICAL CHARACTERISTICS (TA = 25°C)
2SK1584
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
120
100
80
60
40
dT - Derating Factor - %
20
0
020406080 100 120 140 160
TC - Case Temperature -
˚C
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERA TURE
2.5
2.0
Mounted on ceramic
board of
2
× 0.7 mm
16 cm
1.5
1.0
- Total Power Dissipation - W
0.5
T
P
0
3001501206018090
TA - Ambient Temperature -
˚C
FORWARD BIAS SAFE OPERATING AREA
10
3
I
D(pulse)
PW
=
1
0.3
0.1
- Drain Current - A
D
I
0.03
0.01
Limited (V
DS(on)
R
TA = 25˚C
Single Pulse
V
DS
DRAIN CURRENT
4 V)
=
GS
13100.30.1
- Drain to Source Voltage - V
I
D(DC)
VS.
1 ms
DC
10
100 ms
ms
30100
DRAIN TO SOURCE VOLTAGE
1.2
1.0
V
GS
= 4.0 V
0.8
0.6
0.4
- Drain Current - A
D
I
3.5 V
3.0 V
0.2
2.5 V
0
01234567
VDS - Drain to Source Voltage - V
V
DSS
Pulsed
TRANSFER CHARACTERISTICS
500
VDS = 10 V
Pulsed
100
10
- Drain Current - mA
D
I
1
TA = 150˚C
0.1
0123
VGS - Gate to Source Voltage - V
75˚C
25˚C
–25˚C
- Gate Cut-off Voltage - V
GS(off)
V
54
Data Sheet D15283EJ2V0DS
GATE CUT-OFF VOLTAGE vs.
3
CHANNEL TEMPERA TURE
V
I
DS =
D =
10 V
0.1 mA
2
1
0
300–301501206090
Tch - Channel Temperature -
˚C
3
Page 4
2SK1584
FORWARD TRANSFER ADMMITTANCE vs.
DRAIN CURRENT
10000
VDS = 5 V
Pulsed
3000
1000
TA = −25
˚C
25
300
100
30
| - Forward Transfer Admittance - mS
fs
| y
10
150
˚C
75
˚C
˚C
ID - Drain Current - mA
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. DRAIN CURRENT
VGS = 4 V
Pulsed
2
1
- Drain to Source On-state Resistance - Ω
0
DS(on)
R
30300
100101000
D
- Drain Current - mA
I
100301031300
T
A
= 150
−25
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. GATE TO SOURCE VOLTAGE
3
D
= 0.3 A
I
Pulsed
2
1
- Drain to Source On-state Resistance - Ω
0
DS(on)
R
1000
0 4 8 1216202428
VGS - Gate to Source Voltage -
V
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. CHANNEL TEMPERATURE
3
˚C
75
˚C
25
˚C
˚C
2
VGS = 4 V
1
VGS = 10 V
I
D =
0.3 A
Pulsed
- Drain to Source On-state Resistance - Ω
0
DS(on)
R
300–301501206090
Tch - Channel Temperature -
˚C
1000
300
100
- Capacitance - pF
rss
,C
oss
,C
iss
C
4
30
10
3
1
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
VGS = 0 V
f = 1 MH
Z
13100.30.1
V
DS
- Drain to Source Voltage - V
C
iss
C
oss
C
rss
30100
Data Sheet D15283EJ2V0DS
10000
SWITCHING CHARACTERISTICS
300
100
td(off)
30
td(on),tr,td(off),tf - Switchig Time - ns
10
101001000
30300
D - Drain Current - mA
I
tf
V
V
R
td(on)
DD =
GS(on) =
G =
10 Ω
tr
10 V
4 V
Page 5
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
1000
V
GS
=
0 V
Pulsed
300
100
30
10
- Source to Drain Current - mA
3
SD
I
1
0.50.60.70.80.91.01.1
VSD - Source to Drain Voltage - V
2SK1584
Data Sheet D15283EJ2V0DS
5
Page 6
[MEMO]
2SK1584
6
Data Sheet D15283EJ2V0DS
Page 7
[MEMO]
2SK1584
Data Sheet D15283EJ2V0DS
7
Page 8
2SK1584
•
The information in this document is current as of February, 2001. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.