The 2SK1485, N-channel vertical type MOS FET is a switching device
which can be driven directly by the output of ICs having a 5 V power source.
As the MOS FET has low on-state resistance and excellent switching
characteristics, it is suitable for driving actuators such as motors, relays,
and solenoids.
FEATURES
• Directly driven by ICs having a 5 V power source.
• Low on-state resistance
DS(on)1
= 1.2 Ω MAX. (VGS = 4.0 V, ID = 0.5 A)
R
DS(on)2
= 0.8 Ω MAX. (VGS = 10 V, ID = 0.5 A)
R
• Complementary to 2SJ199.
2SK1485
PACKAGE DRAWING (Unit : mm)
4.5 ± 0.1
1
0.42
±0.06
0.8 MIN.
MARK : NC
1.6 ± 0.2
2
0.47
1.5
±0.06
3.0
1.Source
2.Drain
3.Gate
3
0.42
±0.06
2.5 ± 0.1
4.0 ± 0.25
1.5 ± 0.1
+0.03
0.41
–0.05
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)V
DS
Gate to Source Voltage (V
★
Drain Current (DC) (T
Drain Current (pulse)
Total Power Dissipation (TA = 25°C)
Channel TemperatureT
Storage TemperatureT
Notes1.
2.
Remark
PW ≤ 10 ms, Duty Cycle ≤ 50%
Mounted on ceramic board of 16 cm
The diode connected between the gate and source of the transistor serves as a protector against ESD. When
this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated
voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
= 0 V)V
C
= 25°C)I
Note1
Note2
DSS
GSS
D(DC)
D(pulse)
I
T
P
ch
stg
2
× 0.7 mm
100V
±20V
±1.0A
±2.0A
2.0W
150°C
−55 to +150°C
EQUIVALENT CIRCUIT
Drain
Body
Gate
Gate
Protection
Diode
Source
Diode
Document No.D15680EJ3V0DS00 (3rd edition)
(Previous No. TC-2349)
Date Published July 2001 NS CP(K)
Printed in Japan
Zero Gate Voltage Drain CurrentI
Gate Leakage CurrentI
Gate Cut-off VoltageV
Forward Transfer Admittance| yfs |VDS = 10 V, ID = 0.5 A0.4S
Drain to Source On-state ResistanceR
Input CapacitanceC
Output CapacitanceC
Reverse Transfer CapacitanceC
Turn-on Delay Timet
Rise Timet
Turn-off Delay Timet
Fall Timet
A
µ
A
µ
Ω
Ω
SWITCHING TIME
D.U.T.
R
PG.
V
GS
0
τ = 1 s
µ
Duty Cycle ≤ 1%
G
τ
R
VDD
L
V
GS
Wave Form
ID
Wave Form
VGS
0
ID
0
10%
10%
t
d(on)
90%
t
on
90%
VGS
90%
ID
10%
t
r
t
d(off)
t
f
toff
2
Data Sheet D15680EJ3V0DS
Page 3
TYPICAL CHARACTERISTICS (TA = 25°C)
2SK1485
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
100
80
60
40
dT - Derating Factor - %
20
0
020406080 100 120 140 160
TC - Case Temperature -
°C
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERA TURE
2.4
mounted on ceramic
board of 16 cm × 0.7 mm
2
2.0
1.6
FORWARD BIAS SAFE OPERATING AREA
4
I
D(pulse)
I
D(DC)
1
0.3
0.1
- Drain Current - A
D
I
0.03
TA = 25°C
Single Pulse
0.01
3101
V
DRAIN CURRENT
DRAIN TO SOURCE VOLTAGE
600
Pulsed
500
400
PW
= 1 m
10
s
ms
100
m
s
DC
V
DSS
301003001000
DS
- Drain to Source Voltage - V
VS.
3.0 V
2.5 V
1.2
0.8
- Total Power Dissipation - W
T
0.4
P
0
0306090120150180
TA - Ambient Temperature -
TRANSFER CHARACTERISTICS
3
VDS = 10 V
Pulsed
1
0.1
- Drain Current - A
D
I
0.01
0.001
01.02.03.0
GS
- Gate to Source Voltage - V
V
°C
300
200
- Drain Current - mA
D
I
100
0
00.40.81.20.20.61.01.4
VDS - Drain to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
8.0
V
DS
= 10 V
f = 1MH
3.0
Z
1.0
0.3
0.1
| - Forward Transfer Admittance - S
fs
0.03
| y
0.310.030.10.004 0.012
I
D
- Drain Current - A
V
GS
= 2.0 V
Data Sheet D15680EJ3V0DS
3
Page 4
2SK1485
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. GATE TO SOURCE VOLTAGE
1.1
D
I
Pulsed
0.9
0.7
0.5
0.3
- Drain to Source On-state Resistance - Ω
0.1
DS(on)
R
048121620
VGS - Gate to Source Voltage -
CAPACITANCE vs.
600
DRAIN TO SOURCE VOLTAGE
300
100
50
30
- Capacitance - pF
rss
,C
10
oss
,C
iss
5
C
3
13100.2
V
DS
- Drain to Source Voltage - V
30100 200
= 0.5 A
V
VGS = 0 V
f = 1 MH
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. DRAIN CURRENT
0.9
Pulsed
0.7
VGS = 4 V
0.5
VGS = 10 V
0.3
- Drain to Source On-state Resistance - Ω
DS(on)
0.1
R
0.33
D
- Drain Current - A
I
10.1
SWITCHING CHARACTERISTICS
800
Z
C
iss
300
100
C
oss
50
20
10
C
rss
5
td(on),tr,td(off),tf - Switchig Time - ns
3
0.030.3310
td(off)
tf
td(on)
tr
0.11
I
D - Drain Current - A
V
DD =
25 V
V
GS =
10 V
R
G =
10 Ω
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
V
GS
=
Pulsed
0 V
1.4
1.2
1.0
0.8
0.6
0.4
- Source to Drain Current - A
SD
0.2
I
0
00.20.40.60.81.01.21.4
SD
- Source to Drain Voltage - V
V
4
Data Sheet D15680EJ3V0DS
Page 5
[MEMO]
2SK1485
Data Sheet D15680EJ3V0DS
5
Page 6
[MEMO]
2SK1485
6
Data Sheet D15680EJ3V0DS
Page 7
[MEMO]
2SK1485
Data Sheet D15680EJ3V0DS
7
Page 8
2SK1485
•
The information in this document is current as of July, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
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third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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