NEC 2SK1109 Technical data

DATA SHEET
12
3
5.5 ± 0.4
1.8 MIN.
1.8 MIN. 1.5
1.1
0.8
2.9 ± 0.2
1. Source
2. Drain
3. Gate
JUNCTION FIELD EFFECT TRANSI STO R
N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR
FOR IMPEDANCE CONVERTER OF ECM
DESCRIPTION
The 2SK1109 is suitable for converter of ECM.
FEATURES
Compact package
High forward transfer admittance
S TYP. (I
1000
µ
1600 µS TYP. (I
= 100 µA)
DSS
= 200 µA)
DSS
Includes diode and high resistance at G - S
ORDERING INFORMATION
PART NUMBER PACKAGE
2SK1109 SC-59 (MM)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage Gate to Drain Voltage V Drain Current I Gate Current I Total Power Dissipation P Junction Temperature T Storage Temperature T
Note
V
DSX
GDO
D
G
T
j
stg
20 V
–20 V
10 mA 10 mA 80 mW
125 °C
–55 to +125 °C
PACKAGE DRAWING (Unit: mm)
EQUIVALENT CIRCUIT
Drain
Gate
Source
= –1.0 V
Note V
GS
Remark Please take care of ESD (Electro Static Discharge) when you handle the device in this document.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. D15940EJ1V0DS00 (1st edition) Date Published January 2002 NS CP(K) Printed in Japan
©
2002
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
2SK1109
Zero Gate Voltage Drain Cut-off Current I Gate Cut-off Voltage V Forward Transfer Admittance | y Forward Transfer Admittance | y Input Capacitance C
DSS
VDS = 5.0 V, VGS = 0 V 40 600
GS(off)VDS
fs1
|VDS = 5.0 V, ID = 30 µA, f = 1.0 kHz 350
fs2
|VDS = 5.0 V, VGS = 0 V, f = 1.0 kHz 350
iss
= 5.0 V, ID = 1.0 µA 0.1 1.0 V
VDS = 5.0 V, VGS = 0 V, f = 1.0 MHz 7.0 8.0 pF
Noise Voltage NV See Test Circuit 1.8 3.0
I
RANK
DSS
MARKING J32 J33 J34 J35 J36 J37
DSS
I
(µA)
40 to 70 60 to 110 90 to 180 150 to 300 200 to 450 300 to 600
NOISE VOLTAGE TEST CIRCUIT
+4.5 V
R = 1 k
JIS A
NV (r.m.s)
A
µ
S
µ
S
µ
V
µ
C = 10 pF
2
Data Sheet D15940EJ1V0DS
TYPICAL CHARACTERISTICS (TA = 25°C)
20 40 60 80 100 120 140 160
0
40
20
80
60
100
DERATING FACTOR OF POWER DISSIPATION
T
A - Ambient Temperature - ˚C
dT - Derating Factor - %
VGS - Gate to Source Voltage - V
IG - Gate Current - A
GATE TO SOURCE CURRENT vs. GATE TO SOURCE VOLTAGE
µ
0
10
20
30
30
40
20
10
40
0.2−0.4−0.6−0.8−1.0
1.00.80.60.40.2
DRAIN CURRENT vs. GATE TO SOURCE VOLTAGE
V
GS
- Gate to Source Voltage - V
I
D
- Drain Current - mA
0.6 0.4 0.2 0 +0.2
0.2
0.6
0.4
0.8
1.0
VDS = 5 V
I
D
S
S
=
3
0
0
A
I
D
S
S
=
2
0
0
A
I
D
S
S
=
1
0
0
A
µ
µ
µ
INPUT CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
10 20 50 100
V
DS
- Drain to Source Voltage - V
C
iSS
- Input Capacitance - pF
10
20
50
100
1
2
5
152
VDS = 0 V f = 1.0 MHz
GATE TO SOURCE CUT-OFF VOLTAGE AND FORWARD TRANSFER ADMITTANCE vs. ZERO-GATE VOLTAGE
DRAIN CURRENT CO-RELATION
Zero-Gate Voltage Drain Current - A
V
GS (off)
- Gate to Source Cut-off Voltage - V |y
fs
| - Forward Transfer Admittance - S
V
DS
= 5 V
1.0
0.5
0.2
0.1
0.05
0.02
10.0
20 50 100 200 500 1000
0.01
5.0
2.0
10
µ
V
GS (off)
|yfs|
µ
2SK1109
Data Sheet D15940EJ1V0DS
3
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