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MOS FIELD EFFECT TRANSISTOR
P-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR SWITCHING
2SJ621
DESCRIPTION
The 2SJ621 is a switching device which can be driven directly
by a 1.8 V power source.
This device features a low on-state resistance and excellent
switching characteristics, and is suitable for applications such
as power switch of portable machine and so on.
FEATURES
• 1.8 V drive available
• Low on-state resistance
= 44 mΩ MAX. (VGS = –4.5 V, ID = –2.0 A)
DS(on)1
R
= 56 mΩ MAX. (VGS = –3.0 V, ID = –2.0 A)
RDS(on)2
= 62 mΩ MAX. (VGS = –2.5 V, ID = –2.0 A)
RDS(on)3
= 105 mΩ MAX. (VGS = –1.8 V, ID = –1.5 A)
RDS(on)4
ORDERING INFORMATION
PART NUMBERPACKAGE
2SJ621SC-96 (Mini Mold Thin Type)
Marking: XG
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)V
Gate to Source Voltage (VDS = 0 V)V
Drain Current (DC) (TA
Drain Current (pulse)
Total Power Dissipation (TA
Total Power Dissipation (TA = 25°C)
= 25°C)I
Note1
= 25°C)P
Note2
I
D(pulse)
Channel TemperatureT
Storage TemperatureT
DSS
GSS
D(DC)
T1
P
T2
ch
stg
–12V
m8.0
m3.5
m12
0.2W
1.25W
150°C
–55 to +150°C
PACKAGE DRAWING (Unit: mm)
+0.1
0.4
–0.05
+0.1
–0.15
0.65
1.5
2.8 ±0.2
1
0.95
3
0.95
1.9
2.9 ±0.2
2
1
: Gate
2 : Source
3 : Drain
EQUIVALENT CIRCUIT
V
A
A
Gate
Gate
Protection
Diode
0.9 to 1.1
Drain
Source
0.65
Body
Diode
+0.1
0.16
–0.06
0 to 0.1
s, Duty Cycle ≤ 1%
Notes 1. PW ≤ 10
2. Mounted on FR-4 board, t ≤ 5
µ
sec.
RemarkThe diode connected between the gate and source of the transistor serves as a protector against ESD. When
this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated
voltage may be applied to this device.
Document No.D15634EJ1V0DS00 (1st edition)
Date Published May 2002 NS CP(K)
Printed in Japan
CHARACTERISTICSSYMBOLTEST CONDITIONSMIN.TYP. MAX. UNIT
2SJ621
Zero Gate Voltage Drain CurrentI
Gate Leakage CurrentI
Gate Cut-off VoltageV
VDS = –12 V, VGS = 0 V–10
DSS
VGS = m8.0 V, VDS = 0 V
GSS
GS(off)VDS
10
m
= –10 V, ID = –1.0 mA0.451.5V
Forward Transfer Admittance| yfs |VDS = –10 V, ID = –3.5 A4.0S
Drain to Source On-state Resi stanceR
R
R
R
Input CapacitanceC
Output CapacitanceC
Reverse Transfer CapacitanceC
Turn-on Delay Timet
Rise Timet
Turn-off Delay Timet
Fall Timet
Total Gate ChargeQ
Gate to Source ChargeQ
Gate to Drain ChargeQ
Body Diode Forward VoltageV
DS(on)1VGS
DS(on)2VGS
DS(on)3VGS
DS(on)4VGS
iss
oss
rss
d(on)
r
d(off)
f
G
GS
GDID
F(S-D)IF
= –4.5 V, ID = –2.0 A3544mΩ
= –3.0 V, ID = –2.0 A4256mΩ
= –2.5 V, ID = –2.0 A4662mΩ
Single Pulse
Mounted on FR-4 board of
50 x 50 x 1.6 mm
−0.1−1−10−100
VDS - Drain to Source Voltage - V
10 ms
100 ms
5 s
1.5
1.25
ation - W
0.75
0.5
0.25
- Total Power Dissi
T
P
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
1
0
0 20406080100120140160
- Ambient Temperature - °C
A
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
Single Pulse
100
10
1
Without board
Mounted on FR-4 board of
50 × 50 × 1.6 mm
- Transient Thermal Resistance - °C/W
0.1
th(ch-A)
r
1 m10 m100 m1101001000
PW - Pulse Width - s
Data Sheet D15634EJ1V0DS
3
Page 4
2SJ621
DRAIN CURRENT vs.
−12
−10
−8
−6
−4
- Drain Current - A
D
I
−2
0
0−0.2−0.4−0.6−0.8
DRAIN TO SOURCE VOLTAGE
Pulsed
−
3.0 V
4.5 V
−
1.8 V
−
VDS - Drain to Source Voltage - VVGS - Gate to Source Voltage - V
GATE CUT-OFF VOLTAGE vs.
CHANNEL TEMPERATURE
−1.2
VSD = −10 V
ID = −1 mA
−0.7
2.5 V
−
FORWARD TRA NSFER CHARACTERISTI CS
−100
VDS = −10 V
Pulsed
−10
−1
−0.1
−0.01
- Drain Current - A
D
I
−0.001
−0.0001
0−0.4−0.8−1.2−1.6−2
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
100
VDS = −10 V
Pulsed
TA = −25°C
10
25°C
75°C
125°C
TA = −25°C
25°C
75°C
125°C
- Gate Cut-off Voltage - V
GS(off)
V
−0.2
-50050100150
Tch - Channel Temperature - °CI
DRAIN TO SOURCE ON-STATE
RESISTANCE vs . CHANNEL TEMPERATURE
100
- Drain to Source On-state Resistance - mΩ
DS(on)
R
Pulsed
VGS = −1.8 V
80
60
40
20
0
-50050100150
Tch - Channel Temperature - °C
−
2.5 V
−
4.5 V
−
3.0 V
1
| - Forward Transfer Admittance - S
0.1
fs
−0.01−0.1−1−10
| y
- Drain Current - A
D
DRAIN TO SOURCE ON-STA T E RESISTANCE vs.
GATE TO SOURCE VOLTAGE
100
80
60
40
20
- Drain to Source On-state Resistance - mΩ
0
DS(on)
R
0−2−4−6−8
VGS - Gate to Source Voltage - V
ID = −2.0 A
Pulsed
4
Data Sheet D15634EJ1V0DS
Page 5
2SJ621
DRAIN TO SOURCE ON-STAT E
RESISTANCE vs . DRAIN CURRENT
120
VGS = −1.8 V
Pulsed
100
80
60
40
- Drain to Source On-state Resistance - mΩ
DS(on)
R
−0.01−0.1−1−10−100
TA = 125°C
75°C
25°C
−25°
C
ID - Drain Current - A
- Drain to Source On-state Resistance - mΩ
DS(on)
R
DRAIN TO SOURCE ON-STAT E
RESISTANCE vs . DRAIN CURRENT
80
VGS = −3.0 V
Pulsed
70
60
50
40
30
TA = 125°C
75°C
25°C
−25°
C
DRAIN TO SOURCE ON-STAT E
RESISTANCE vs . DRAIN CURRENT
80
VGS = −2.5 V
Pulsed
70
TA = 125°C
60
50
40
30
20
75°C
25°C
−25°
C
−0.01−0.1−1−10−100
ID - Drain Current - A
DRAIN TO SOURCE ON-STAT E
RESISTANCE vs . DRAIN CURRENT
60
VGS = −4.5 V
Pulsed
50
40
30
TA = 125°C
75°C
25°C
−25°
C
- Drain to Source On-state Resistance - mΩ
DS(on)
R
- Capacitance - pF
rss
, C
oss
, C
iss
C
20
−0.01−0.1−1−10−100
ID - Drain Current - A
CAPACITANCE vs .
DRAIN TO SOURCE VOLTAGE
10000
1000
100
VGS = 0 V
f = 1 M Hz
iss
C
oss
C
rss
C
10
−0.1−1−10−100
VDS - Drain to Source Voltage - V
20
- Drain to Source On-state Resistance - mΩ
−0.01−0.1−1−10−100
DS(on)
R
ID - Drain Current - A
SWITCHI NG CHA RACTERISTICS
1000
100
- Switching Time - ns
f
, t
d(off)
, t
r
, t
d(on)
t
10
−0.1−1−10
ID - Drain Current - A
VDD = −6.0 V
GS
= −4.0 V
V
G
=
d(off)
t
f
t
r
t
d(on)
t
Data Sheet D15634EJ1V0DS
5
Page 6
2SJ621
- Diode Forward Current - A
SD
I
SOURCE TO DRAIN DIODE F ORWARD
VOLTAGE
100
Pulsed
10
1
0.1
0.01
0.40.60.811.2
VGS = 0 V
VSD - Source to Drain Voltage - VQG - Gate Charge - nC
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
−5
ID = −3.5 A
- Gate to Source Voltage - V
GS
V
−4
−3
−2
−1
0
01234567
VDD = −10 V
−
6.0 V
6
Data Sheet D15634EJ1V0DS
Page 7
[MEMO]
2SJ621
Data Sheet D15634EJ1V0DS
7
Page 8
2SJ621
•
The information in this document is current as of May, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
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written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
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third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
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purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
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"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
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recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
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and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
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(Note)
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(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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