NEC 2sj621 Datasets

Page 1
DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
MOS FIELD EFFECT TRANSISTOR
P-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR SWITCHING
2SJ621
DESCRIPTION
The 2SJ621 is a switching device which can be driven directly by a 1.8 V power source. This device features a low on-state resistance and excellent switching characteristics, and is suitable for applications such as power switch of portable machine and so on.
FEATURES
• 1.8 V drive available
• Low on-state resistance
= 44 mΩ MAX. (VGS = –4.5 V, ID = –2.0 A)
DS(on)1
R
= 56 mΩ MAX. (VGS = –3.0 V, ID = –2.0 A)
RDS(on)2
= 62 mΩ MAX. (VGS = –2.5 V, ID = –2.0 A)
RDS(on)3
= 105 mΩ MAX. (VGS = –1.8 V, ID = –1.5 A)
RDS(on)4
ORDERING INFORMATION
PART NUMBER PACKAGE
2SJ621 SC-96 (Mini Mold Thin Type)
Marking: XG
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V) V Gate to Source Voltage (VDS = 0 V) V Drain Current (DC) (TA Drain Current (pulse) Total Power Dissipation (TA Total Power Dissipation (TA = 25°C)
= 25°C) I
Note1
= 25°C) P
Note2
I
D(pulse)
Channel Temperature T Storage Temperature T
DSS GSS
D(DC)
T1
P
T2 ch
stg
–12 V
m8.0 m3.5
m12
0.2 W
1.25 W 150 °C
–55 to +150 °C
PACKAGE DRAWING (Unit: mm)
+0.1
0.4
–0.05
+0.1
–0.15
0.65
1.5
2.8 ±0.2
1
0.95
3
0.95
1.9
2.9 ±0.2
2
1
: Gate 2 : Source 3 : Drain
EQUIVALENT CIRCUIT
V A A
Gate
Gate Protection Diode
0.9 to 1.1
Drain
Source
0.65
Body Diode
+0.1
0.16
–0.06
0 to 0.1
s, Duty Cycle ≤ 1%
Notes 1. PW ≤ 10
2. Mounted on FR-4 board, t ≤ 5
µ
sec.
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When
this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.
©
2001
Page 2
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
2SJ621
Zero Gate Voltage Drain Current I Gate Leakage Current I Gate Cut-off Voltage V
VDS = –12 V, VGS = 0 V –10
DSS
VGS = m8.0 V, VDS = 0 V
GSS
GS(off)VDS
10
m
= –10 V, ID = –1.0 mA 0.45 1.5 V Forward Transfer Admittance | yfs |VDS = –10 V, ID = –3.5 A 4.0 S Drain to Source On-state Resi stance R
R R
R Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Turn-on Delay Time t Rise Time t Turn-off Delay Time t Fall Time t Total Gate Charge Q Gate to Source Charge Q Gate to Drain Charge Q Body Diode Forward Voltage V
DS(on)1VGS
DS(on)2VGS
DS(on)3VGS
DS(on)4VGS
iss
oss
rss
d(on)
r
d(off)
f
G
GS
GDID
F(S-D)IF
= –4.5 V, ID = –2.0 A 35 44 mΩ = –3.0 V, ID = –2.0 A 42 56 mΩ = –2.5 V, ID = –2.0 A 46 62 mΩ
= –1.8 V, ID = –1.5 A 63 105 mΩ VDS = –10 V 630 pF VGS = 0 V 170 pF f = 1.0 MHz 100 pF VDD = –6.0 V, ID = –2.0 A 20 ns VGS = –4.0 V 70 ns RG = 10 Ω 320 ns
200 ns
V
= –10 V 6.2 nC
DD
VGS = –4.0 V 1.0 nC
= –3.5 A 2.0 nC = 3.5 A, VGS = 0 V 0.84 V
A
µ
A
µ
TEST CIRCUIT 1 SWITCHING TIME
D.U.T.
L
R
R
PG.
V
GS (−)
0
τ = 1 s
µ
Duty Cycle ≤ 1%
G
VDD
τ
VGS
Wave Form
VDS
Wave Form
VGS(−)
0
10%
VGS
VDS(−)
90%
VDS
0
10% 10%
td(on) trtd(off) tf
ton toff
90%
90%
TEST CIRCUIT 2 GATE CHARGE
D.U.T.
IG = −2 mA
PG.
50 Ω
RL
VDD
2
Data Sheet D15634EJ1V0DS
Page 3
TYPICAL CHARACTERISTICS (TA = 25°C)
p
)
(
)
2SJ621
DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA
120
100
80
60
40
20
dT - Percentage of Rated Power - %
0
0 2 0 40 60 80 100 120 140 160
TA - Ambient Temperature - °CT
FORWARD BIAS SAFE OPERATING AREA
- Drain Current - A
D
I
−100
−0.01
DS(on)
R
Limite d
VGS = −4.5 V
−10
D(DC
I
D(pulse)
I
PW = 1 ms
−1
−0.1
Single Pulse Mounted on FR-4 board of 50 x 50 x 1.6 mm
−0.1 −1 −10 −100
VDS - Drain to Source Voltage - V
10 ms 100 ms
5 s
1.5
1.25
ation - W
0.75
0.5
0.25
- Total Power Dissi
T
P
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
1
0
0 20406080100120140160
- Ambient Temperature - °C
A
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
Single Pulse
100
10
1
Without board
Mounted on FR-4 board of 50 × 50 × 1.6 mm
- Transient Thermal Resistance - °C/W
0.1
th(ch-A)
r
1 m 10 m 100 m 1 10 100 1000
PW - Pulse Width - s
Data Sheet D15634EJ1V0DS
3
Page 4
2SJ621
DRAIN CURRENT vs.
−12
−10
−8
−6
−4
- Drain Current - A
D
I
−2
0
0 −0.2 −0.4 −0.6 −0.8
DRAIN TO SOURCE VOLTAGE
Pulsed
−
3.0 V
4.5 V
−
1.8 V
−
VDS - Drain to Source Voltage - V VGS - Gate to Source Voltage - V
GATE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE
−1.2
VSD = −10 V ID = −1 mA
−0.7
2.5 V
−
FORWARD TRA NSFER CHARACTERISTI CS
−100
VDS = −10 V Pulsed
−10
−1
−0.1
−0.01
- Drain Current - A
D
I
−0.001
−0.0001
0 −0.4 −0.8 −1.2 −1.6 −2
FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT
100
VDS = −10 V Pulsed
TA = −25°C
10
25°C 75°C
125°C
TA = −25°C
25°C 75°C
125°C
- Gate Cut-off Voltage - V
GS(off)
V
−0.2
-50 0 50 100 150
Tch - Channel Temperature - °CI
DRAIN TO SOURCE ON-STATE RESISTANCE vs . CHANNEL TEMPERATURE
100
- Drain to Source On-state Resistance - mΩ
DS(on)
R
Pulsed
VGS = −1.8 V
80
60
40
20
0
-50 0 50 100 150
Tch - Channel Temperature - °C
−
2.5 V
−
4.5 V
−
3.0 V
1
| - Forward Transfer Admittance - S
0.1
fs
−0.01 −0.1 −1 −10
| y
- Drain Current - A
D
DRAIN TO SOURCE ON-STA T E RESISTANCE vs. GATE TO SOURCE VOLTAGE
100
80
60
40
20
- Drain to Source On-state Resistance - mΩ
0
DS(on)
R
0 −2 −4 −6 −8
VGS - Gate to Source Voltage - V
ID = −2.0 A
Pulsed
4
Data Sheet D15634EJ1V0DS
Page 5
2SJ621
DRAIN TO SOURCE ON-STAT E RESISTANCE vs . DRAIN CURRENT
120
VGS = −1.8 V Pulsed
100
80
60
40
- Drain to Source On-state Resistance - mΩ
DS(on)
R
−0.01 −0.1 −1 −10 −100
TA = 125°C
75°C 25°C
−25°
C
ID - Drain Current - A
- Drain to Source On-state Resistance - mΩ
DS(on)
R
DRAIN TO SOURCE ON-STAT E RESISTANCE vs . DRAIN CURRENT
80
VGS = −3.0 V Pulsed
70
60
50
40
30
TA = 125°C
75°C
25°C
−25°
C
DRAIN TO SOURCE ON-STAT E RESISTANCE vs . DRAIN CURRENT
80
VGS = −2.5 V Pulsed
70
TA = 125°C
60
50
40
30
20
75°C
25°C
−25°
C
−0.01 −0.1 −1 −10 −100
ID - Drain Current - A
DRAIN TO SOURCE ON-STAT E RESISTANCE vs . DRAIN CURRENT
60
VGS = −4.5 V Pulsed
50
40
30
TA = 125°C
75°C
25°C
−25°
C
- Drain to Source On-state Resistance - mΩ
DS(on)
R
- Capacitance - pF
rss
, C
oss
, C
iss
C
20
−0.01 −0.1 −1 −10 −100
ID - Drain Current - A
CAPACITANCE vs . DRAIN TO SOURCE VOLTAGE
10000
1000
100
VGS = 0 V f = 1 M Hz
iss
C
oss
C
rss
C
10
−0.1 −1 −10 −100
VDS - Drain to Source Voltage - V
20
- Drain to Source On-state Resistance - mΩ
−0.01 −0.1 −1 −10 −100
DS(on)
R
ID - Drain Current - A
SWITCHI NG CHA RACTERISTICS
1000
100
- Switching Time - ns
f
, t
d(off)
, t
r
, t
d(on)
t
10
−0.1 −1 −10
ID - Drain Current - A
VDD = −6.0 V
GS
= −4.0 V
V
G
=
d(off)
t
f
t
r
t
d(on)
t
Data Sheet D15634EJ1V0DS
5
Page 6
2SJ621
- Diode Forward Current - A
SD
I
SOURCE TO DRAIN DIODE F ORWARD VOLTAGE
100
Pulsed
10
1
0.1
0.01
0.4 0.6 0.8 1 1.2
VGS = 0 V
VSD - Source to Drain Voltage - V QG - Gate Charge - nC
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
−5
ID = −3.5 A
- Gate to Source Voltage - V
GS
V
−4
−3
−2
−1
0
01234567
VDD = −10 V
−
6.0 V
6
Data Sheet D15634EJ1V0DS
Page 7
[MEMO]
2SJ621
Data Sheet D15634EJ1V0DS
7
Page 8
2SJ621
•
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M8E 00. 4
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