The 2SJ559 is a switching device which can be driven directly by a
V power source.
2.5
The 2SJ559 has excellent switching characteristics, and is suitable
for use as a high-speed switching device in digital circuits.
FEATURES
• Can be driven by a 2.5V power source.
• Low gate cut-off voltage.
ORDERING INFORMATION
PART NUMBER PACKAGE
2SJ559 SC-75 (USM)
Marking: C1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage VDSS
Gate to Source Voltage V
Drain Current (DC) I
Drain Current (pulse)
Total Power Dissipation
Note1
Note2
Channel Temperature T
Storage Temperature T
µ
Notes 1. PW ≤ 10
s, Duty Cycle ≤ 1%
2. Mounted on ceramic substrate of 3.0 cm
GSSm20 V
D(DC)m0.1 A
D(pulse)m0.4 A
I
T 200 mW
P
ch 150 °C
stg
2
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.
When this device actually used, an additional protection circuit is externally required if a voltage exceeding
the rated voltage may be applied to this device.
−30
−55 to +150
x 0.64 mm
V
°C
PACKAGE DRAWING (Unit: mm)
0.5
1
0.75 ± 0.05
1: Source
2: Gate
3: Drain
0.8 ± 0.1
1.6 ± 0.1
2
0.2
0.5
1.6 ± 0.1
0.3
+0.1
–0
1.0
+0.1
–0
3
EQUIVALENT CIRCUIT
Gate
Gate
Protection
Diode
0.6
Drain
Source
0.15
0 to 0.1
Body
Diode
+0.1
–0.05
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. D13801EJ2V0DS00 (2nd edition)
Date Published November 2004 NS CP(K)
Printed in Japan
The mark shows major revised points.
1999
Page 2
2SJ559
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS SYMBOLTEST CONDITIONS MIN. TYP. MAX. UNIT
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
60
GS
= –2.5 V
V
Pulsed
50
40
TA = 125˚C
TA = 75˚C
30
20
TA = 25˚C
10
- Drain to Source On-State Resistance - Ω
0
DS(on)
–0.1 –1 –10 –100 –1000
R
I
D
TA = –25˚C
- Drain Current - mA
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
1000
V
DS
= –3 V
Pulsed
100
TA = –25˚C
TA = 25˚C
10
TA = 75˚C
TA = 125˚C
I - Forward Transfer Admittance - mS
fs
Iy
1
–0.1 –1 –10 –100 –1000
I
D
- Drain Current - mA
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
60
GS
= –4 V
V
Pulsed
50
40
30
TA = 125˚C
20
TA = 75˚C
10
- Drain to Source On-State Resistance - Ω
0
DS(on)
–0.1 –1 –10 –100 –1000
R
I
D
- Drain Current - mA
TA = 25˚C
TA = –25˚C
Data Sheet D13801EJ2V0DS
3
Page 4
2SJ559
60
50
40
30
20
10
- Drain to Source On-Stage Resistance - Ω
DS(on)
R
100
10
- Capacitance - pF
rss
, C
oss
, C
iss
C
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
GS
=
–10 V
V
Pulesd
T
A
=
T
A
=
25˚C
T
A
=
–25˚C
0
–0.1 –1 –10 –100 –1000
I
D
- Drain Current - mA
75˚C
T
A
=
125˚C
CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
V
GS
= 0 V
f = 1 MHz
C
oss
C
iss
C
rss
1
–1 –10 –100
V
DS
- Drain to Source Voltage - V
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
60
50
I
D
=
40
30
I
D
I
D
–1 mA
=
–10 mA
=
–100 mA
20
10
- Drain to Source On-State Resistance - Ω
0
DS(on)
R
0 –2 –4 –6 –8 –10
V
GS
- Gate to Source Voltage - V
SWITCHING CHARACTERISTICS
1000
t
r
t
f
t
d(on)
100
- Switching Time - ns
f
, t
d(off)
, t
r
, t
V
DD
= –3 V
V
GS
= –
RG = 10 Ω
4 V
I
D
- Drain Current - mA
d(on)
t
10
–10 –100 –1000
t
d(off)
Pulsed
–1000
V
GS
= 0 V
Pulsed
–100
–10
–1
- Reverse Drain Current - mA
D
I
–0.1
–0.2 –0.4 –0.6 –0.8 –1.0 –1.2
4
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
V
SD
- Source to Drain Voltage - V
Data Sheet D13801EJ2V0DS
Page 5
2SJ559
•
The information in this document is current as of November, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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•
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•
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•
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M8E 02. 11-1
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