100nA2SD1615AVCB = 120 V, IE = 0
Emitter Cutoff CurrentIEBO100nAVEB = 6.0 V, IC = 0
DC Current GainhFE1
DC Current GainhFE2
Collector Saturation Voltage
Base Saturation VoltageVBE(sat)
Base to Emitter VoltageVBE
Gain Bandwidth ProductfT80160MHzVCE = 2.0 V, IE = –100 mA
Output CapacitanceCob19pFVCB = 10 V, IE = 0, f = 1.0 MHz
∗∗∗
Pulsed: PW ≤ 350 µs, Duty Cycle ≤ 2 %
∗∗∗
∗∗∗
VCE(sat)
∗∗∗
1352906002SC1615VCE = 2.0 V, IC = 100 mA
1354002SD1615A
81270VCE = 2.0 V, IC = 1.0 A
∗∗∗
∗∗∗
0.150.3VIC = 1.0 A, IB = 50 mA
0.91.2VIC = 1.0 A, IB = 50 mA
600700mVVCE = 2.0 V, IC = 50 mA
2.5 ± 0.1
0.42 ± 0.06
1.5 ± 0.1
4.0 ± 0.25
0.41
+ 0.03
– 0.05
hFE Classification
MARKING2SD1615GMGLGK
2SD1615AGQGP
hFE135 to 270200 to 400300 to 600
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Document No. D10198EJ4V0DS00 (4th edition)
Date Published December 2000 N CP(K)
Printed in Japan
SAFE OPERATING AREA
(TRANSIENT THERMAL RESISTANCE
METHOD)
5
2
PW=1 ms
10 ms
1
200 ms
0.5
0.2
DC
0.1
– Collector Current – A
C
I
0.05
0.02
0.01
125102050100
CE
– Collector to Emitter Voltage – V
V
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLT AGE
1.0
0.8
5.0 mA
4.5 mA
4.0 mA
3.5 mA
3.0 mA
2.5 mA
2.0 mA
0.6
1.5 mA
1 pulse
2SD1615
2SD1615A
40
µ
100 A
– Collector Current – mA
C
20
I
= 50 A
B
I
µ
0246810
CE
– Collector to Emitter Voltage – V
V
DC CURRENT GAIN vs.
COLLECTOR CURRENT
1000
V
CE =
2.0 V
500
200
100
50
20
– DC Current Gain
EF
10
h
5
0.020.05 0.1 0.20.512510
0.01
IC – Collector Current – A
0.4
– Collector Current – A
C
0.2
I
1.0 mA
= 0.5 mA
B
I
00.20.40.60.81.0
CE(sat)
– Collector Saturation Voltage – V
V
COLLECTOR AND BASE SATURATION
VOLTAGE vs. COLLECTOR CURRENT
2
1
V
BE(sat)
0.5
0.2
0.1
CE(sat)
V
– Collector Saturation Voltage – V
CE(sat)
V
0.05
– Base Saturation Voltage – V
0.02
BE(sat)
V
0.020.05 0.1 0.20.512510
0.01
IC – Collector Current – A
IC = 20·I
B
2
Data Sheet D10198EJ4V0DS00
Page 3
2SD1615, 2SD1615A
GAIN BANDWIDTH PRODUCT vs.
EMITTER CURRENT
1000
500
Z
200
100
50
20
10
5
– Gain Bandwidth Product – MH
T
f
2
1
0.01 0.02 0.05
0.1 0.20.5125 10
IC – Collector Current – A
SWITCHING TIME vs.
COLLECTOR CURRENT
2
1
µ
0.5
V
V
CC
= 10 V
C
= 10.I
BI
BE(off)
= –2 to 3 V
.
.
= –10.I
µ
I
V
PW = 2 s
Duty Cycle ≤ 2 %
t
stg
EC =
2.0 V
B2
OUTPUT CAPCITANCE vs.
COLLECTOR TO BASE VOLTAGE
100
50
IE = 0
f
=
1.0 MH
20
10
5
– Output Capacitance – pF
ob
C
2
125102050100
VCB – Collector to Base Voltage – V
Z
0.2
0.1
t – Switching Time – s
0.05
0.01 0.020.05 0.10.20.51
I
C
– Collector Current – A
t
f
t
on
Data Sheet D10198EJ4V0DS00
3
Page 4
2SD1615, 2SD1615A
[MEMO]
•
The information in this document is current as of October, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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