Datasheet LP3872, LP3875 Datasheet (National Semiconductor)

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LP3872/LP3875
1.5A Fast Ultra Low Dropout Linear Regulators
LP3872/LP3875 1.5A Fast Ultra Low Dropout Linear Regulators
July 2005
General Description
The LP3872/LP3875 series of fast ultra low-dropout linear regulators operate from a +2.5V to +7.0V input supply. Wide range of preset output voltage options are available. These ultra low dropout linear regulators respond very quickly to step changes in load, which makes them suitable for low voltage microprocessor applications. The LP3872/LP3875 are developed on a CMOS process which allows low quies­cent current operation independent of output load current. This CMOS process also allows the LP3872/LP3875 to op­erate under extremely low dropout conditions.
Dropout Voltage: Ultra low dropout voltage; typically 38mV at 150mA load current and 380mV at 1.5A load current.
Ground Pin Current: Typically 6mA at 1.5A load current. Shutdown Mode: Typically 10nA quiescent current when
the shutdown pin is pulled low. Error Flag: Error flag goes low when the output voltage
drops 10% below nominal value.
SENSE: Sense pin improves regulation at remote loads. Precision Output Voltage: Multiple output voltage options
are available ranging from 1.8V to 5.0V with a guaranteed accuracy of conditions (varying line, load, and temperature).
±
1.5% at room temperature, and±3.0% over all
Typical Application Circuits
Features
n Ultra low dropout voltage n Low ground pin current n Load regulation of 0.06% n 10nA quiescent current in shutdown mode n Guaranteed output current of 1.5A DC n Available in TO-263, TO-220 and SOT-223 packages n Output voltage accuracy n Error flag indicates output status n Sense option improves load regulation n Minimum output capacitor requirements n Overtemperature/overcurrent protection n −40˚C to +125˚C junction temperature range
±
1.5%
Applications
n Microprocessor power supplies n GTL, GTL+, BTL, and SSTL bus terminators n Power supplies for DSPs n SCSI terminator n Post regulators n High efficiency linear regulators n Battery chargers n Other battery powered applications
*SD and ERROR pins must be pulled high through a 10kpull-up resistor. Connect the ERROR pin to ground if this function is not used. See application hints for more information.
© 2005 National Semiconductor Corporation DS200633 www.national.com
20063301
Typical Application Circuits (Continued)
LP3872/LP3875
*SD must be pulled high through a 10kpull-up resistor. See application hints for more information.
Connection Diagrams
20063305
Top View
TO220-5 Package
Bent, Staggered Leads
20063345
20063306
Top View
TO263-5 Package
Top View
20063386
SOT223-5 Package
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Pin Description for TO220-5 and TO263-5 Packages
#
Pin
Name Function Name Function
1SD
2V
IN
3 GND Ground GND Ground
4V
OUT
5 ERROR
LP3872 LP3875
Shutdown SD Shutdown
Input Supply V
Output Voltage V
IN
OUT
ERROR Flag SENSE Remote Sense Pin
Pin Description for SOT223-5 Package
#
Pin
Name Function Name Function
1SD
2V
3V
IN
OUT
4 ERROR
5 GND Ground GND Ground
LP3872 LP3875
Shutdown SD Shutdown
Input Supply V
Output Voltage V
IN
OUT
ERROR Flag SENSE Remote Sense Pin
LP3872/LP3875
Input Supply
Output Voltage
Input Supply
Output Voltage
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Ordering Information
LP3872/LP3875
Package Type Designator is "T" for TO220 package, "S" for TO263 package, and "MP" for SOT223-5 package.
TABLE 1. Package Marking and Ordering Information
Output
Voltage
5.0 LP3872EMP-5.0 1.5A, Error Flag
5.0 LP3872EMPX-5.0 1.5A, Error Flag SOT223-5 LHDB 2000 Units on Tape and
5.0 LP3872ES-5.0 1.5A, Error Flag
5.0 LP3872ESX-5.0 1.5A, Error Flag
3.3 LP3872EMP-3.3 1.5A, Error Flag
3.3 LP3872EMPX-3.3 1.5A, Error Flag SOT223-5 LHCB 2000 Units on Tape and
3.3 LP3872ES-3.3 1.5A, Error Flag
3.3 LP3872ESX-3.3 1.5A, Error Flag
2.5 LP3872EMP-2.5 1.5A, Error Flag
2.5 LP3872EMPX-2.5 1.5A, Error Flag SOT223-5 LHBB 2000 Units on Tape and
2.5 LP3872ES-2.5 1.5A, Error Flag
2.5 LP3872ESX-2.5 1.5A, Error Flag
1.8 LP3872ES-1.8 1.5A, Error Flag
1.8 LP3872ESX-1.8 1.5A, Error Flag
1.8 LP3872EMP-1.8 1.5A, Error Flag
1.8 LP3872EMPX-1.8 1.5A, Error Flag
5.0 LP3875EMP-5.0 1.5A, SENSE SOT223-5 LHRB 1000 Units on Tape and
5.0 LP3875EMPX-5.0 1.5A, SENSE SOT223-5 LHRB 2000 Units on Tape and
5.0 LP3875ES-5.0 1.5A, SENSE TO263-5 LP3875ES-5.0 Rail
5.0 LP3875ESX-5.0 1.5A, SENSE TO263-5 LP3875ES-5.0 Tape and Reel
3.3 LP3875EMP-3.3 1.5A, SENSE SOT223-5 LHPB 1000 Units on Tape and
Order Number
Description
(Current, Option)
Package Type Package Marking Supplied As:
SOT223-5 LHDB 1000 Units on Tape and
TO263-5 LP3872ES-5.0 Rail
TO263-5 LP3872ES-5.0 Tape and Reel
SOT223-5 LHCB 1000 Units on Tape and
TO263-5 LP3872ES-3.3 Rail
TO263-5 LP3872ES-3.3 Tape and Reel
SOT223-5 LHBB 1000 Units on Tape and
TO263-5 LP3872ES-2.5 Rail
TO263-5 LP3872ES-2.5 Tape and Reel
TO263-5 LP3872ES-1.8 Rail
TO263-5 LP3872ES-1.8 Tape and Reel
SOT223-5 LHAB 1000 Units on Tape and
SOT223-5 LHAB 2000 Units on Tape and
20063331
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
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Ordering Information (Continued)
TABLE 1. Package Marking and Ordering Information (Continued)
Output
Voltage
3.3 LP3875EMPX-3.3 1.5A, SENSE SOT223-5 LHPB 2000 Units on Tape and
3.3 LP3875ES-3.3 1.5A, SENSE TO263-5 LP3875ES-3.3 Rail
3.3 LP3875ESX-3.3 1.5A, SENSE TO263-5 LP3875ES-3.3 Tape and Reel
2.5 LP3875EMP-2.5 1.5A, SENSE SOT223-5 LHNB 1000 Units on Tape and
2.5 LP3875EMPX-2.5 1.5A, SENSE SOT223-5 LHNB 2000 Units on Tape and
2.5 LP3875ES-2.5 1.5A, SENSE TO263-5 LP3875ES-2.5 Rail
2.5 LP3875ESX-2.5 1.5A, SENSE TO263-5 LP3875ES-2.5 Tape and Reel
1.8 LP3875EMP-1.8 1.5A, SENSE SOT223-5 LHLB 1000 Units on Tape and
1.8 LP3875EMPX-1.8 1.5A, SENSE SOT223-5 LHLB
1.8 LP3875ES-1.8 1.5A, SENSE TO263-5 LP3875ES-1.8 Rail
1.8 LP3875ESX-1.8 1.5A, SENSE TO263-5 LP3875ES-1.8 Tape and Reel
5.0 LP3872ET-5.0 1.5A, Error Flag
3.3 LP3872ET-3.3 1.5A, Error Flag
2.5 LP3872ET-2.5 1.5A, Error Flag
1.8 LP3872ET-1.8 1.5A, Error Flag
5.0 LP3875ET-5.0 1.5A, SENSE TO220-5 LP3875ET-5.0 Rail
3.3 LP3875ET-3.3 1.5A, SENSE TO220-5 LP3875ET-3.3 Rail
2.5 LP3875ET-2.5 1.5A, SENSE TO220-5 LP3875ET-2.5 Rail
1.8 LP3875ET-1.8 1.5A, SENSE TO220-5 LP3875ET-1.8 Rail
Order Number
Description
(Current, Option)
Package Type Package Marking Supplied As:
Ree
Reel
Ree
Reel
TO220-5 LP3872ET-5.0 Rail
TO220-5 LP3872ET-3.3 Rail
TO220-5 LP3872ET-2.5 Rail
TO220-5 LP3872ET-1.8 Rail
LP3872/LP3875
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Block Diagrams
LP3872/LP3875
LP3872
20063303
LP3875
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20063329
LP3872/LP3875
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
I
(Survival) Short Circuit Protected
OUT
Maximum Voltage for ERROR Pin V
Maximum Voltage for SENSE Pin V
Storage Temperature Range −65˚C to +150˚C
Lead Temperature
Operating Ratings
(Soldering, 5 sec.) 260˚C
ESD Rating (Note 3) 2 kV
Power Dissipation (Note 2) Internally Limited
Input Supply Voltage (Survival) −0.3V to +7.5V
Shutdown Input Voltage
Input Supply Voltage (Note 11) 2.5V to 7.0V
Shutdown Input Voltage −0.3V to 7.0V
Maximum Operating Current (DC) 1.5A
Junction Temperature −40˚C to +125˚C
(Survival) −0.3V to +7.5V
Output Voltage (Survival), (Note
6), (Note 7) −0.3V to +6.0V
Electrical Characteristics LP3872/LP3875
Limits in standard typeface are for TJ= 25˚C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: V
IN=VO(NOM)
+ 1V, IL= 10 mA, C
Symbol Parameter Conditions Typ
Output Voltage
V
O
Tolerance
+1V VIN≤ 7.0V
V
OUT
10 mA I
1.5A 0
L
(Note 8)
V
OL
Output Voltage Line
V
+1V≤ VIN≤ 7.0V 0.02
OUT
Regulation (Note 8)
VO/ I
OUT
Output Voltage Load
10 mA I
1.5A 0.06
L
Regulation (Note 8)
= 150 mA 38 50
V
IN-VOUT
I
L
Dropout Voltage
I
I
I
O(PK)
GND
GND
(Note 10)
Ground Pin Current In Normal Operation Mode
Ground Pin Current In Shutdown Mode
Peak Output Current VO≥ V
IL= 1.5A 380 450
= 150 mA 5 9
I
L
= 1.5A 6 14
I
L
VSD≤ 0.3V 0.01 10 µA
-40˚C T
85˚C 50
J
- 4% 1.8 A
O(NOM)
Short Circuit Protection
I
SC
Short Circuit Current 3.2 A
= 10µF, VSD= 2V.
OUT
(Note 4)
0.06
0.12
LP3872/5 (Note 5) Units
Min Max
-1.5
-3.0
+1.5
+3.0
60
550
10
15
IN
OUT
%
%
%
mV
mA
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Electrical Characteristics LP3872/LP3875
Limits in standard typeface are for TJ= 25˚C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: V
LP3872/LP3875
Symbol Parameter Conditions Typ
Shutdown Input
V
SDT
T
dOFF
T
dON
I
SD
Error Flag
V
T
V
TH
V
EF(Sat)
Td Flag Reset Delay 1 µs
I
lk
I
max
AC Parameters
PSRR Ripple Rejection
ρ
n(l/f)
e
n
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions, see Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: At elevated temperatures, devices must be derated based on package thermal resistance. The devices in TO220 package must be derated at θ (with 0.5in
0.5in
Note 3: The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin.
Note 4: Typical numbers are at 25˚C and represent the most likely parametric norm.
Note 5: Limits are guaranteed by testing, design, or statistical correlation.
Note 6: If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.
Note 7: The output PMOS structure contains a diode between the V
if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically withstand 200mA of DC current and 1Amp of peak current.
Note 8: Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the input line voltage. Output voltage load regulation is defined as the change in output voltage from the nominal value due to change in load current. The line and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the output voltage tolerance specification.
Note 9: Error Flag threshold and hysteresis are specified as percentage of regulated output voltage. See Application Hints.
Note 10: Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value. Dropout voltage
specification applies only to output voltages of 2.5V and above. For output voltages below 2.5V, the drop-out voltage is nothing but the input to output differential, since the minimum input voltage is 2.5V.
Note 11: The minimum operating value for V
2
2
, 1oz. copper area), junction-to-ambient. The SOT-223 package must be derated at θjA= 90˚C/W (with 0.5in2, 1oz. copper area), junction-to-ambient.
Shutdown Threshold
Turn-off delay IL= 1.5A 20 µs
Turn-on delay IL= 1.5A 25 µs
SD Input Current VSD=V
Threshold (Note 9) 10 516%
Threshold Hysteresis (Note 9) 5 28%
Error Flag Saturation I
Error Flag Pin Leakage Current
Error Flag Pin Sink Current
Output Noise Density f = 120Hz 0.8 µV
Output Noise Voltage
, 1oz. copper area), junction-to-ambient (with no heat sink). The devices in the TO263 surface-mount package must be derated at θjA= 60˚C/W (with
(Continued)
IN=VO(NOM)
IN
+ 1V, IL= 10 mA, C
Output = High V
Output = Low 0 0.3
= 100µA 0.02 0.1 V
sink
V
Error
V
IN=VOUT
C
OUT
V
OUT
V
IN=VOUT
C
OUT
V
OUT
BW = 10Hz – 100kHz V
OUT
BW = 300Hz – 300kHz V
OUT
is equal to either [V
= 10µF, VSD= 2V.
OUT
LP3872/5 (Note 5) Units
(Note 4)
IN
IN
1nA
Min Max
2
1nA
= 0.5V 1mA
+1V
73 = 10uF = 3.3V, f = 120Hz
+ 0.5V
57 = 10uF = 3.3V, f = 120Hz
150
= 2.5V
100
= 2.5V
and V
IN
OUT(NOM)+VDROPOUT
terminals. This diode is normally reverse biased. This diode will get forward biased
OUT
] or 2.5V, whichever is greater.
V
dB
µV (rms)
= 50˚C/W
jA
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LP3872/LP3875
Typical Performance Characteristics Unless otherwise specified: T
= 10µF, S/D pin is tied to VIN,V
C
IN
Dropout Voltage vs Output Load Current
Shutdown IQvs Junction Temperature Errorflag Threshold vs Junction Temperature
= 2.5V, VIN=V
OUT
20063360
O(NOM)
+ 1V, IL= 10mA
Ground Current vs Output Voltage
= 25˚C, C
J
= 1.5A
I
L
OUT
= 10µF,
20063354
20063355
DC Load Reg. vs Junction Temperature DC Line Regulation vs Temperature
20063358 20063359
20063357
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Typical Performance Characteristics Unless otherwise specified: T
= 10µF, S/D pin is tied to VIN,V
C
IN
LP3872/LP3875
Noise vs Frequency
Load Transient Response
C
IN=COUT
= 100µF, OSCON
= 2.5V, VIN=V
OUT
20063361
+ 1V, IL= 10mA (Continued)
O(NOM)
= 25˚C, C
J
OUT
Load Transient Response
C
IN=COUT
= 10µF, OSCON
Load Transient Response
CIN=C
= 100µF, POSCAP
OUT
= 10µF,
20063381
20063382
Load Transient Response
C
IN=COUT
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= 10µF, TANTALUM
20063384
Load Transient Response
CIN=C
= 100µF, TANTALUM
OUT
20063383
20063385
Application Hints
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are re­quired to assure stability. These capacitors must be correctly selected for proper performance.
INPUT CAPACITOR: An input capacitor of at least 10µF is required. Ceramic Ceramic, Tantalum, or Electrolytic capaci­tors may be used, and capacitance may be increased with­out limit
OUTPUT CAPACITOR: An output capacitor is required for loop stability. It must be located less than 1 cm from the device and connected directly to the output and ground pins using traces which have no other currents flowing through them (see PCB Layout section).
The minimum value of output capacitance that can be used for stable full-load operation is 10µF, but it may be increased without limit. The output capacitor must have an ESR value as shown in the stable region of the curve below. Tantalum capacitors are recommended for the output capacitor.
ESR Curve
20063370
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and varia­tion with temperature must be taken into consideration when selecting a capacitor so that the minimum required amount of capacitance is provided over the full operating tempera­ture range. In general, a good Tantalum capacitor will show very little capacitance variation with temperature, but a ce­ramic may not be as good (depending on dielectric type). Aluminum electrolytics also typically have large temperature variation of capacitance value.
Equally important to consider is a capacitor’s ESR change with temperature: this is not an issue with ceramics, as their ESR is extremely low. However, it is very important in Tan­talum and aluminum electrolytic capacitors. Both show in­creasing ESR at colder temperatures, but the increase in aluminum electrolytic capacitors is so severe they may not be feasible for some applications (see Capacitor Character­istics Section).
CAPACITOR CHARACTERISTICS CERAMIC: For values of capacitance in the 10 to 100 µF
range, ceramics are usually larger and more costly than tantalums but give superior AC performance for bypassing high frequency noise because of very low ESR (typically less
than 10 m). However, some dielectric types do not have good capacitance characteristics as a function of voltage and temperature.
Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V also exhibit a severe temperature effect, losing more than 50% of nomi­nal capacitance at high and low limits of the temperature range.
X7R and X5R dielectric ceramic capacitors are strongly rec­ommended if ceramics are used, as they typically maintain a
±
capacitance range within
20% of nominal over full operat­ing ratings of temperature and voltage. Of course, they are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
TANTALUM: Solid Tantalum capacitors are recommended for use on the output because their typical ESR is very close to the ideal value required for loop compensation. They also work well as input capacitors if selected to meet the ESR requirements previously listed.
Tantalums also have good temperature stability: a good quality Tantalum will typically show a capacitance value that varies less than 10-15% across the full temperature range of 125˚C to −40˚C. ESR will vary only about 2X going from the high to low temperature limits.
The increasing ESR at lower temperatures can cause oscil­lations when marginal quality capacitors are used (if the ESR of the capacitor is near the upper limit of the stability range at room temperature).
ALUMINUM: This capacitor type offers the most capaci­tance for the money. The disadvantages are that they are larger in physical size, not widely available in surface mount, and have poor AC performance (especially at higher fre­quencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is higher than either Tantalum or ceramic, and it also varies greatly with temperature. A typical aluminum electrolytic can exhibit an ESR increase of as much as 50X when going from 25˚C down to −40˚C.
It should also be noted that many aluminum electrolytics only specify impedance at a frequency of 120 Hz, which indicates they have poor high frequency performance. Only aluminum electrolytics that have an impedance specified at a higher frequency (between 20 kHz and 100 kHz) should be used for the LP387X. Derating must be applied to the manufacturer’s ESR specification, since it is typically only valid at room temperature.
Any applications using aluminum electrolytics should be thoroughly tested at the lowest ambient operating tempera­ture where ESR is maximum.
PCB LAYOUT
Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops. The input and output capacitors must be directly connected to the input, output, and ground pins of the regulator using traces which do not have other currents flowing in them (Kelvin connect).
The best way to do this is to lay out C device with short traces to the V
IN,VOUT
and C
IN
, and ground pins.
OUT
near the
LP3872/LP3875
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Application Hints (Continued)
The regulator ground pin should be connected to the exter­nal circuit ground so that the regulator and its capacitors have a "single point ground".
It should be noted that stability problems have been seen in
LP3872/LP3875
applications where "vias" to an internal ground plane were used at the ground points of the IC and the input and output capacitors. This was caused by varying ground potentials at these nodes resulting from current flowing through the ground plane. Using a single point ground technique for the regulator and it’s capacitors fixed the problem.
Since high current flows through the traces going into V and coming from V these pins so there is no voltage drop in series with the input and output capacitors.
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic interference) can degrade any integrated circuit’s perfor­mance because of the small dimensions of the geometries inside the device. In applications where circuit sources are present which generate signals with significant high fre­quency energy content ( ensure that this does not affect the IC regulator.
If RFI/EMI noise is present on the input side of the regulator (such as applications where the input source comes from the output of a switching regulator), good ceramic bypass ca­pacitors must be used at the input pin of the IC.
If a load is connected to the IC output which switches at high speed (such as a clock), the high-frequency current pulses required by the load must be supplied by the capacitors on the IC output. Since the bandwidth of the regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above that frequency. This means the effective output impedance of the IC at frequencies above 100 kHz is determined only by the output capacitor(s).
In applications where the load is switching at high speed, the output of the IC may need RF isolation from the load. It is recommended that some inductance be placed between the output capacitor and the load, and good RF bypass capaci­tors be placed directly across the load.
PCB layout is also critical in high noise environments, since RFI/EMI is easily radiated directly into PC traces. Noisy circuitry should be isolated from "clean" circuits where pos­sible, and grounded through a separate path. At MHz fre­quencies, ground planes begin to look inductive and RFI/ EMI can cause ground bounce across the ground plane.
In multi-layer PCB applications, care should be taken in layout so that noisy power and ground planes do not radiate directly into adjacent layers which carry analog power and ground.
OUTPUT NOISE
Noise is specified in two ways­Spot Noise or Output noise density is the RMS sum of all
noise sources, measured at the regulator output, at a spe-
, Kelvin connect the capacitor leads to
OUT
>
1 MHz), care must be taken to
cific frequency (measured with a 1Hz bandwidth). This type of noise is usually plotted on a curve as a function of fre­quency.
Total output Noise or Broad-band noise is the RMS sum of spot noise over a specified bandwidth, usually several decades of frequencies.
Attention should be paid to the units of measurement. Spot noise is measured in units µV/ noise is measured in µV(rms).
The primary source of noise in low-dropout regulators is the internal reference. In CMOS regulators, noise has a low
IN
frequency component and a high frequency component, which depend strongly on the silicon area and quiescent current. Noise can be reduced in two ways: by increasing the transistor area or by increasing the current drawn by the internal reference. Increasing the area will decrease the chance of fitting the die into a smaller package. Increasing the current drawn by the internal reference increases the total supply current (ground pin current). Using an optimized trade-off of ground pin current and die size, LP3872/LP3875 achieves low noise performance and low quiescent current operation.
The total output noise specification for LP3872/LP3875 is presented in the Electrical Characteristics table. The Output noise density at different frequencies is represented by a curve under typical performance characteristics.
SHORT-CIRCUIT PROTECTION
The LP3872 and LP3875 are short circuit protected and in the event of a peak over-current condition, the short-circuit control loop will rapidly drive the output PMOS pass element off. Once the power pass element shuts down, the control loop will rapidly cycle the output on and off until the average power dissipation causes the thermal shutdown circuit to respond to servo the on/off cycling to a lower frequency. Please refer to the section on thermal information for power dissipation calculations.
ERROR FLAG OPERATION
The LP3872/LP3875 produces a logic low signal at the Error Flag pin when the output drops out of regulation due to low input voltage, current limiting, or thermal limiting. This flag has a built in hysteresis. The timing diagram in Figure 1 shows the relationship between the ERROR flag and the output voltage. In this example, the input voltage is changed to demonstrate the functionality of the Error Flag.
The internal Error flag comparator has an open drain output stage. Hence, the ERROR pin should be pulled high through a pull up resistor. Although the ERROR flag pin can sink current of 1mA, this current is energy drain from the input supply. Hence, the value of the pull up resistor should be in the range of 10kto 1M. The ERROR pin must be connected to ground if this function is not used. It should also be noted that when the shutdown pin is pulled low, the ERROR pin is forced to be invalid for reasons of saving power in shutdown mode.
Hz or nV/√Hz and total output
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Application Hints (Continued)
LP3872/LP3875
20063307
FIGURE 1. Error Flag Operation
SENSE PIN
In applications where the regulator output is not very close to the load, LP3875 can provide better remote load regulation using the SENSE pin. Figure 2 depicts the advantage of the SENSE option. LP3872 regulates the voltage at the output pin. Hence, the voltage at the remote load will be the regu­lator output voltage minus the drop across the trace resis-
tance. For example, in the case of a 3.3V output, if the trace resistance is 100m, the voltage at the remote load will be
3.15V with 1.5A of load current, I
. The LP3875 regulates
LOAD
the voltage at the sense pin. Connecting the sense pin to the remote load will provide regulation at the remote load, as shown in Figure 2. If the sense option pin is not required, the sense pin must be connected to the V
OUT
20063308
pin.
FIGURE 2. Improving remote load regulation using LP3875
SHUTDOWN OPERATION
A CMOS Logic level signal at the shutdown ( SD) pin will turn-off the regulator. Pin SD must be actively terminated through a 10kpull-up resistor for a proper operation. If this
pin is driven from a source that actively pulls high and low (such as a CMOS rail to rail comparator), the pull-up resistor is not required. This pin must be tied to Vin if not used.
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Application Hints (Continued)
DROPOUT VOLTAGE
The dropout voltage of a regulator is defined as the minimum input-to-output differential required to stay within 2% of the nominal output voltage. For CMOS LDOs, the dropout volt-
LP3872/LP3875
age is the product of the load current and the Rds(on) of the internal MOSFET.
REVERSE CURRENT PATH
The internal MOSFET in LP3872 and LP3875 has an inher­ent parasitic diode. During normal operation, the input volt­age is higher than the output voltage and the parasitic diode is reverse biased. However, if the output is pulled above the input in an application, then current flows from the output to the input as the parasitic diode gets forward biased. The output can be pulled above the input as long as the current in the parasitic diode is limited to 200mA continuous and 1A peak.
POWER DISSIPATION/HEATSINKING
LP3872 and LP3875 can deliver a continuous current of
1.5A over the full operating temperature range. A heatsink may be required depending on the maximum power dissipa­tion and maximum ambient temperature of the application. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The total power dissipation of the device is given by:
=(VIN−V
P
D
where I
OUT)IOUT
is the operating ground current of the device
GND
(specified under Electrical Characteristics). The maximum allowable temperature rise (T
on the maximum ambient temperature (T cation, and the maximum allowable junction temperature
):
(T
Jmax
T
Rmax=TJmax−TAmax
The maximum allowable value for junction to ambient Ther­mal Resistance, θ
θ
JA=TRmax/PD
LP3872 and LP3875 are available in TO-220 and TO-263 packages. The thermal resistance depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of θ TO-220 package and 60 ˚C/W for TO-263 package no heatsink is needed since the package can dissipate enough heat to satisfy these requirements. If the value for allowable
falls below these limits, a heat sink is required.
θ
JA
HEATSINKING TO-220 PACKAGE
The thermal resistance of a TO220 package can be reduced by attaching it to a heat sink or a copper plane on a PC board. If a copper plane is to be used, the values of θ be same as shown in next section for TO263 package.
The heatsink to be used in the application should have a heatsink to ambient thermal resistance,
θ
HA≤θJA
θCH− θJC.
In this equation, θ to the surface of the heat sink and θ tance from the junction to the surface of the case. θ about 3˚C/W for a TO220 package. The value for θ pends on method of attachment, insulator, etc. θ between 1.5˚C/W to 2.5˚C/W. If the exact value is unknown, 2˚C/W can be assumed.
+(VIN)I
GND
Rmax
Amax
, can be calculated using the formula:
JA
calculated above is 60 ˚C/W for
JA
is the thermal resistance from the case
CH
is the thermal resis-
JC
) depends
) of the appli-
will
JA
JC
de-
CH
varies
CH
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as a heatsink. The tab of these packages are soldered to the copper plane for heat sinking. Figure 3 shows a curve for the
θ
of TO-263 package for different copper area sizes, using
JA
a typical PCB with 1 ounce copper and no solder mask over the copper area for heat sinking.
20063332
FIGURE 3. θJAvs Copper (1 Ounce) Area for TO-263
package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θ
for the TO-263 package mounted to a PCB is
JA
32˚C/W. Figure 4 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures, assuming θ
is 35˚C/W and the maximum junction tempera-
JA
ture is 125˚C.
20063333
FIGURE 4. Maximum power dissipation vs ambient
temperature for TO-263 package
HEATSINKING SOT223-5 PACKAGE
Figure 5 shows a curve for the θ
of SOT-223 package for
JA
different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat sinking.
is
www.national.com 14
Application Hints (Continued)
20063387
FIGURE 5. θJAvs Copper(1 Ounce) Area for SOT-223
package
The following figures show different layout scenarios for SOT-223 package.
LP3872/LP3875
20063388
FIGURE 6. SCENARIO A, θJA= 148˚C/W
20063389
FIGURE 7. SCENARIO B, θJA= 125˚C/W
www.national.com15
Physical Dimensions inches (millimeters) unless otherwise noted
LP3872/LP3875
TO220 5-lead, Molded, Stagger Bend Package (TO220-5)
NS Package Number T05D
For Order Numbers, refer to the “Ordering Information” section of this document.
www.national.com 16
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LP3872/LP3875
TO263 5-Lead, Molded, Surface Mount Package (TO263-5)
NS Package Number TS5B
For Order Numbers, refer to the “Ordering Information” section of this document.
www.national.com17
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
SOT223, 5-Lead, Molded, Surface Mount Package (SOT223-5)
NS Package Number MP05A
For Order Numbers, refer to the “Ordering Information” section of this document.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
LP3872/LP3875 1.5A Fast Ultra Low Dropout Linear Regulators
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to result in a significant injury to the user.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
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Email: new.feedback@nsc.com Tel: 1-800-272-9959
www.national.com
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