National Semiconductor LMX2430 Technical data

查询LMX2430供应商

LMX2430/LMX2433/LMX2434

May 2003

LMX2430/LMX2433/LMX2434 PLLatinum Dual High Frequency Synthesizer for RF Personal

Communications

PLLatinum

™

Dual High Frequency Synthesizer for RF Personal Communications LMX2430 3.0 GHz/0.8 GHz LMX2433 3.6 GHz/1.7 GHz LMX2434 5.0 GHz/2.5 GHz

General Description

The LMX243x devices are high performance frequency synthesizers with integrated dual modulus prescalers. The LMX243x devices are designed for use as RF and IF local oscillators for dual conversion radio transceivers.

A 32/33 or a 16/17 prescale ratio can be selected for the 5.0 GHz LMX2434 RF synthesizer. An 8/9 or a 16/17 prescale ratio can be selected for both the LMX2430 and LMX2433 RF synthesizers. The IF circuitry contains an 8/9 or a 16/17 prescaler. Using a proprietary digital phase locked loop technique, the LMX243x devices generate very stable, low noise control signals for RF and IF voltage controlled oscillators. Both the RF and IF synthesizers include a two-level programmable charge pump. Both the RF and IF synthesizers have dedicated Fastlock circuitry with integrated timeout counters. Furthermore, only a single word write is required to power up and tune the synthesizers to a new frequency.

Serial data is transferred to the devices via a three-wire interface (DATA, LE, CLK). A low voltage logic interface allows direct connection to 1.8V devices. Supply voltages from 2.25V to 2.75V are supported . The LMX243x family features low current consumption:

LMX2430 (3.0 GHz/ 0.8 GHz) — 2.8 mA/ 1.4 mA, LMX2433 (3.6 GHz/ 1.7 GHz) —3.2 mA/ 2.0 mA, LMX2434 (5.0 GHz/

2.5 GHz) — 4.6 mA/ 2.4 mA at 2.50V. The LMX243x devices are available in 20-Pin TSSOP and

20-Pin UTCSP surface mount plastic packages.

Features

n Low Current Consumption n 2.25V to 2.75V Operation n Selectable Synchronous or Asynchronous Powerdown

Mode

n Selectable Dual Modulus Prescaler:

LMX2430 RF: 8/9 or 16/17 LMX2433 RF: 8/9 or 16/17 LMX2434 RF: 16/17 or 32/33 LMX243x IF: 8/9 or 16/17

n Programmable Charge Pump Current Levels

RF and IF: 1 or 4 mA

n Fastlock n Digital Filtered Lock Detect Output n Analog Lock Detect Output (supports both Push-Pull

and Open Drain configurations)

n 1.8V MICROWIRE Logic Interface n Available in 20-Pin TSSOP and 20-Pin UTCSP

™

Technology with Integrated Timeout Counters

Applications

n Mobile Handsets

(GSM, GPRS, W-CDMA, CDMA, PCS, AMPS, PDC, DCS)

n Cordless Handsets

(DECT, DCT)

n Wireless Data n Cable TV Tuners

Thin Shrink Small Outline Package (MTC20) Ultra Thin Chip Scale Package (SLE20A)

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PLLatinum™is a trademark of National Semiconductor Corporation.

Functional Block Diagram

LMX2430/LMX2433/LMX2434

Note:

1 (2) refers to Pin

1 of the 20-Pin UTCSP and Pin#2 of the 20-Pin TSSOP

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Connection Diagrams

LMX2430/LMX2433/LMX2434

Ultra Thin Chip Scale Package (SLE)

(Top View)

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Thin Shrink Small Outline Package (TM)

(Top View)

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Pin Descriptions

Pin No. UTCSP

Pin No. TSSOP

1 2 GND — Ground for the IF PLL analog and digital circuits, MICROWIRETM, Ftest/LD and

2 3 FinIF I IF PLL prescaler input. Small signal input from the VCO.

3 4 EN I Chip Enable input. High Impedance CMOS input. When this pin is set HIGH,

4 5 CPoutIF O IF PLL charge pump output. The output is connected to the external loop filter,

5 6 ENosc I Oscillator Enable input. High impedance CMOS input. When this pin is set

6 7 OSCout/

7 8 OSCin I Reference oscillator input. The input has an approximate Vcc/2 threshold and is

8 9 Vcc — Power supply bias for the RF PLL digital circuits and oscillator circuits. Vcc may

9 10 Ftest/LD O Programmable multiplexed output. Functions as a general purpose CMOS

Pin Name I/O Description

oscillator circuits.

the RF and IF PLLs are powered up. Powerdown is then controlled through the MICROWIRE. When this pin is set LOW, the device is asynchronously powered down and the charge pump output is forced to a high impedance state (TRI-STATE).

which drives the input of the IF VCO.

HIGH, the oscillator buffer is always powered up, independent of the state of the EN pin. When this pin is set LOW, the OSCout/ FLoutIF pin functions as an IF Fastlock output, which connects a resistor in parallel to R2 of the external loop filter.

O Oscillator output/ IF PLL Fastlock output. The output configuration is dependent

FLoutIF

on the state of the ENosc pin. When ENosc is set LOW, the pin functions as an IF Fastlock output, which connects a resistor in parallel to R2 of the external loop filter. This configuration also functions as a general purpose CMOS TRI-STATE output. When ENosc is set HIGH, the pin functions as an oscillator output so that an external crystal can be used.

driven by an external AC coupled source.

range from 2.25V to 2.75V. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane.

TRI-STATE output, N and R divider output, RF/ IF PLL push-pull analog lock detect output, RF/ IF PLL open-drain analog lock detect output, or RF/ IF PLL digital filtered lock detect output.

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Pin Descriptions (Continued)

Pin No. UTCSP

10 11 FLoutRF O RF PLL Fastlock output. This pin connects a resistor in parallel to R2 of the

11 12 GND — Ground for the RF PLL digital circuits.

12 13 CPoutRF O RF PLL charge pump output. The output is connected to the external loop filter,

LMX2430/LMX2433/LMX2434

13 14 GND — Ground for the RF PLL analog circuits.

14 15 FinRF I RF PLL prescaler input. Small signal input from the VCO.

15 16 FinRF

16 17 Vcc — Power supply bias for the RF PLL analog circuits. Vcc may range from 2.25V to

17 18 LE I MICROWIRE Latch Enable input. High impedance CMOS input. When LE

18 19 CLK I MICROWIRE Clock input. High impedance CMOS input. DATA is clocked into

19 20 DATA I MICROWIRE Data input. High impedance CMOS input. Binary serial data. The

20 1 Vcc — Power supply bias for the IF PLL analog and digital circuits, MICROWIRE, and

Pin No. TSSOP

Pin Name I/O Description

external loop filter. This pin can also function as a general purpose CMOS TRI-STATE output.

which drives the input of the RF VCO.

I RF PLL prescaler complementary input. For single ended operation, this pin

should be AC grounded through a 100 pF capacitor. The LMX243x can be driven differentially when the AC coupled capacitor is omitted.

2.75V. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane.

transitions HIGH, DATA stored in the shift register is loaded into one of 6 internal control registers.

the 24-bit shift register on the rising edge of CLK.

MSB of DATA is shifted in first. The two last bits are the control bits.

Ftest/LD circuits. Vcc may range from 2.25V to 2.75V. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane

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Ordering Information

Model Temperature Range Package Description Packing NS Package Number

LMX2430TM -40˚C to +85˚C Thin Shrink Small

LMX2430TMX -40˚C to +85˚C Thin Shrink Small

LMX2430SLEX -40˚C to +85˚C Ultra Thin Chip Scale

LMX2433TM -40˚C to +85˚C Thin Shrink Small

LMX2433TMX -40˚C to +85˚C Thin Shrink Small

LMX2433SLEX -40˚C to +85˚C Ultra Thin Chip Scale

LMX2434TM -40˚C to +85˚C Thin Shrink Small

LMX2434TMX -40˚C to +85˚C Thin Shrink Small

LMX2434SLEX -40˚C to +85˚C Ultra Thin Chip Scale

LMX2430/LMX2433/LMX2434

73 Units Per Rail MTC20

Outline Package

(TSSOP)

2500 Units Per Reel MTC20

Outline Package

(TSSOP)

Tape and Reel

2500 Units Per Reel SLE20A

Package (UTCSP)

Tape and Reel

73 Units Per Rail MTC20

Outline Package

(TSSOP)

2500 Units Per Reel MTC20

Outline Package

(TSSOP)

Tape and Reel

2500 Units Per Reel SLE20A

Package (UTCSP)

Tape and Reel

73 Units Per Rail MTC20

Outline Package

(TSSOP)

2500 Units Per Reel MTC20

Outline Package

(TSSOP)

Tape and Reel

2500 Units Per Reel SLE20A

Package (UTCSP)

Tape and Reel

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Absolute Maximum Ratings (Notes 1,

2, 3)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

Power Supply Voltage

Vcc to GND −0.3V to +3.25V

Voltage on any pin to GND (V

must be<+3.25V −0.3V to Vcc+0.3V

LMX2430/LMX2433/LMX2434

Storage Temperature Range (T

Lead Temperature (solder 4 s) (T

)

) −65˚C to +150˚C

) +260˚C

Electrical Characteristics

Vcc = EN = 2.5V, −40˚C ≤ TA≤ +85˚C, unless otherwise specified

Symbol Parameter Conditions

PARAMETERS

Icc

RF SYNTHESIZER PARAMETERS

FinRF

COMPRF

FinRF

Power Supply Current, RF Synthesizer

Power Supply Current, IF Synthesizer

LMX2430 CLK, DATA and LE = 0V

OSCin = GND

LMX2433 3.2 4.4 mA

LMX2434 4.6 6.2 mA

RF_PD Bit = 0 IF_PD Bit = 1 RF_P Bit = 0

LMX2430 CLK, DATA and LE = 0V

OSCin = GND

LMX2433 2.0 2.8 mA

LMX2434 2.4 3.5 mA

RF_PD Bit = 1 IF_PD Bit = 0 IF_P Bit = 0

Powerdown Current EN, ENosc, CLK, DATA

and LE = 0V

RF Operating Frequency

LMX2430 RF_P Bit = 0 250 2500 MHz

RF_P Bit = 1 250 3000 MHz

LMX2433 RF_P Bit = 0 500 3000 MHz

RF_P Bit = 1 500 3600 MHz

LMX2434 RF_P Bit = 0 or 1 1000 5000 MHz

N Divider Range P = 8/9

(Note 4)

P = 16/17 (Note 4)

P = 32/33 (Note 4)

RF R Divider Range 3 32767

RF Phase Detector Frequency 10 MHz

RF Input Sensitivity LMX2430/33

2.25V ≤ Vcc ≤ 2.75V (Note 5)

LMX2434

2.35V ≤ Vcc ≤ 2.75V (Note 5)

Recommended Operating Conditions

Power Supply Voltage

Vcc to GND +2.25V to +2.75V

Operating Temperature (T

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, refer to the Electrical Characteristics section. The guaranteed specifications apply only for the conditions listed.

Note 2: This device is a high performance RF integrated circuit with an ESD

rating

2 kV and is ESD sensitive. Handling and assembly of this device

should only be done at ESD protected work stations.

Note 3: GND=0V

(Note 1)

) −40˚C to +85˚C

Value

Min Typ Max

2.8 3.6 mA

1.4 2.0 mA

24 262151

48 524287

96 524287

−15 0 dBm

−12 0 dBm

Units

10 µA

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Electrical Characteristics (Continued)

Vcc = EN = 2.5V, −40˚C ≤ TA≤ +85˚C, unless otherwise specified

Symbol Parameter Conditions

RF SYNTHESIZER PARAMETERS

CPoutRF

Source

CPoutRF

Sink

CPoutRF

TRI

CPoutRF

%MIS

CPoutRF

IF SYNTHESIZER PARAMETERS

FinIF

COMPIF

FinIF

CPoutIF

Source

CPoutIF

Sink

RF Charge Pump Output Source Current

CPoutRF

= Vcc/2 RF_CPG Bit = 0 (Note 6)

CPoutRF

= Vcc/2

V RF_CPG Bit = 1 (Note 6)

RF Charge Pump Output Sink Current V

CPoutRF

= Vcc/2 RF_CPG Bit = 0 (Note 6)

CPoutRF

= Vcc/2

V RF_CPG Bit = 1 (Note 6)

RF Charge Pump Output TRI-STATE Current

RF Charge Pump Output Sink Current Vs Charge Pump Output Source

0.5V ≤ V (Note 6)

CPoutRF

(Note 7)

CPoutRF

= Vcc/2

≤ Vcc - 0.5V

Current Mismatch

RF Charge Pump Output Current Magnitude Variation Vs Charge Pump

0.5V ≤ V (Note 7)

CPoutRF

≤ Vcc - 0.5V

Output Voltage

RF Charge Pump Output Current Magnitude Variation Vs Temperature

IF Operating Frequency

LMX2430 IF_P Bit = 0 or 1 100 800 MHz

LMX2433 IF_P Bit = 0 or 1 250 1700 MHz

CPoutRF

(Note 7)

= Vcc/2

LMX2434 IF_P Bit = 0 or 1 500 2500 MHz

IF N Divider Range P = 8/9

(Note 4)

P = 16/17 (Note 4)

IF R Divider Range 3 32767

IF Phase Detector Frequency 10 MHz

IF Input Sensitivity 2.25V ≤ Vcc ≤ 2.75V

(Note 5)

IF Charge Pump Output Source Current

CPoutIF

= Vcc/2 IF_CPG Bit = 0 (Note 6)

CPoutIF

= Vcc/2

V IF_CPG Bit = 1 (Note 6)

IF Charge Pump Output Sink Current V

CPoutIF

= Vcc/2 IF_CPG Bit = 0 (Note 6)

CPoutIF

= Vcc/2

V IF_CPG Bit = 1 (Note 6)

Value

Min Typ Max

Units

-1.0 mA

-4.0 mA

1.0 mA

4.0 mA

-2.5 2.5 nA

310%

515%

24 131079

48 262143

-15 0 dBm

-1.0 mA

-4.0 mA

1.0 mA

4.0 mA

LMX2430/LMX2433/LMX2434

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Electrical Characteristics (Continued)

Vcc = EN = 2.5V, −40˚C ≤ TA≤ +85˚C, unless otherwise specified

Symbol Parameter Conditions

IF SYNTHESIZER PARAMETERS

CPoutIF

TRI

CPoutIF

%MIS

LMX2430/LMX2433/LMX2434

CPoutIF

OSCILLATOR PARAMETERS

OSCin

DIGITAL INTERFACE (DATA, CLK, LE, EN, ENosc, Ftest/LD, FLoutRF, OSCout/ FLoutIF)

MICROWIRE INTERFACE

CWH

CWL

IF Charge Pump Output TRI-STATE Current

IF Charge Pump Output Sink Current Vs Charge Pump Output Source

0.5V ≤ V (Note 6)

CPoutIF

(Note 7)

CPoutIF

= Vcc/2

≤ Vcc - 0.5V

Current Mismatch

IF Charge Pump Output Current Magnitude Variation Vs Charge Pump

0.5V ≤ V (Note 7)

CPoutIF

≤ Vcc - 0.5V

Output Voltage

IF Charge Pump Output Current Magnitude Variation Vs Temperature

CPoutIF

(Note 7)

= Vcc/2

Oscillator Operating Frequency 1 256 MHz

Oscillator Sensitivity (Note 8) 0.5 Vcc V

Oscillator Input Current V

= Vcc 100 µA

OSCin

= 0V -100 µA

OSCin

High-Level Input Voltage 1.6 V

Low-Level Input Voltage 0.4 V

High-Level Input Current VIH= Vcc 1.0 µA

Low-Level Input Current VIL= 0V −1.0 µA

High-Level Output Voltage IOH= −500 µA VCC−

Low-Level Output Voltage IOL= 500 µA 0.4 V

DATA to CLK Set Up Time (Note 9) 50 ns

DATA to CLK Hold Time (Note 9) 10 ns

CLK Pulse Width HIGH (Note 9) 50 ns

CLK Pulse Width LOW (Note 9) 50 ns

CLK to LE Set Up Time (Note 9) 50 ns

LE Pulse Width (Note 9) 50 ns

Value

Min Typ Max

Units

-2.5 2.5 nA

310%

515%

0.4

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Electrical Characteristics (Continued)

Vcc = EN = 2.5V, −40˚C ≤ TA≤ +85˚C, unless otherwise specified

Symbol Parameter Conditions

PHASE NOISE CHARACTERISTICS

(f) RF Synthesizer Normalized Phase

NRF

Noise Contribution (Note 10)

(f) IF Synthesizer Normalized Phase

NIF

Noise Contribution (Note 10)

(f) RF Synthesizer Single

Side Band Phase Noise Measured

LMX2430 f

LMX2433 f

LMX2434 f

TCXO Reference Source RF_CPG Bit = 1 IF_PD Bit = 1

TCXO Reference Source IF_CPG Bit = 1 RF_PD Bit = 1

= 2750 MHz

FinRF

f = 10 kHz offset f

COMPRF

= 1 MHz

Loop Bandwidth = 100 kHz

= 2750

=10MHz

OSCin

=1V

OSCin

RF_CPG Bit = 1 IF_PD Bit = 1

= +25oC

(Note 11)

= 3200 MHz

FinRF

f = 10 kHz offset f

COMPRF

= 1 MHz

Loop Bandwidth = 100 kHz

= 3200

=10MHz

OSCin

=1V

OSCin

RF_CPG Bit = 1 IF_PD Bit = 1

= +25oC

(Note 11)

= 4700 MHz

FinRF

f = 10 kHz offset f

COMPRF

= 1 MHz

Loop Bandwidth = 100 kHz

= 4700

=10MHz

OSCin

=1V

OSCin

RF_CPG Bit = 1 IF_PD Bit = 1

= +25oC

(Note 11)

Value

Min Typ Max

-219.0 dBc/

-214.0 dBc/

-90.30 dBc/

-88.90 dBc/

-85.60 dBc/

LMX2430/LMX2433/LMX2434

Units

Note 4: Some of the values in this range are illegal divide ratios (B<A). To obtain continuous legal division, the Minimum Divide Ratio must be calculated. Use N

≥ P

(P−1), where P is the value of the prescaler selected.

Note 5: Refer to the LMX243x FinRF Sensitivity Test Setup section

Note 6: Refer to the LMX243x Charge Pump Test Setup section

Note 7: Refer to the Charge Pump Current Specification Definitions for details on how these measurements are made.

Note 8: Refer to the LMX243x OSCin Sensitivity Test Setup section

Note 9: Refer to the LMX243x Serial Data Input Timing section

Note 10: Normalized Phase Noise Contribution is defined as : L

measured at an offset frequency, f, ina1Hzbandwidth. The offset frequency, f, must be chosen sufficiently smaller than the PLL’s loop bandwidth, yet large enough to avoid substantial phase noise contribution from the reference source. N is the value selected for the feedback divider and f detector comparison frequency.

Note 11: The synthesizer phase noise is measured with the LMX2430TM/LMX2430SLE Evaluation boards and the HP8566B Spectrum Analyzer.

(f) = L(f) − 20 log (N) − 10 log (f

), where L(f) is defined as the single side band phase noise

COMP

is the RF/IF phase/ frequency

COMP

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Charge Pump Current Specification Definitions

LMX2430/LMX2433/LMX2434

I1 = Charge Pump Sink Current at V

I2 = Charge Pump Sink Current at V

I3 = Charge Pump Sink Current at V

I4 = Charge Pump Source Current at V

I5 = Charge Pump Source Current at V

I6 = Charge Pump Source Current at V

CPout

= Vcc − ∆V

= Vcc//2

= ∆V

= Vcc − ∆V

= Vcc/2

= ∆V

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∆V = Voltage offset from the positive and negative rails. Dependent on the VCO tuning range relative to Vcc and GND. Typical values are between 0.5V and

1.0V.

CPout

refers to either I

CPout

refers to either V

CPoutRF

or I

or V

CPoutIF

Charge Pump Output Current Magnitude Variation Vs Charge Pump Output Voltage

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Charge Pump Output Sink Current Vs Charge Pump Output Source Current Mismatch

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Charge Pump Output Current Magnitude Variation Vs Temperature

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Typical Performance Characteristics Sensitivity

LMX2430 FinRF Input Power Vs Frequency

Vcc = EN = 2.25V

LMX2430/LMX2433/LMX2434

LMX2430 FinRF Input Power Vs Frequency

Vcc = EN = 2.75V

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Typical Performance Characteristics Sensitivity

LMX2430/LMX2433/LMX2434

(Continued)

LMX2433 FinRF Input Power Vs Frequency

Vcc = EN = 2.25V

LMX2433 FinRF Input Power Vs Frequency

Vcc = EN = 2.75V

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Typical Performance Characteristics Sensitivity

(Continued)

LMX2434 FinRF Input Power Vs Frequency

Vcc = EN = 2.35V

LMX2430/LMX2433/LMX2434

LMX2434 FinRF Input Power Vs Frequency

Vcc = EN = 2.75V

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Typical Performance Characteristics Sensitivity

LMX2430/LMX2433/LMX2434

(Continued)

LMX2430 FinIF Input Power Vs Frequency

Vcc = EN = 2.25V

LMX2430 FinIF Input Power Vs Frequency

Vcc = EN = 2.75V

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Typical Performance Characteristics Sensitivity

(Continued)

LMX2433 FinIF Input Power Vs Frequency

Vcc = EN = 2.25V

LMX2430/LMX2433/LMX2434

LMX2433 FinIF Input Power Vs Frequency

Vcc = EN = 2.75V

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