LMV1012 Analog Series:
Pre-Amplified IC’s for High Gain 2-Wire Microphones
LMV1012 Analog Series Pre-Amplified IC’s for High Gain 2-Wire Microphones
August 2004
General Description
The LMV1012 is an audio amplifier series for small form
factor electret microphones. This 2-wire portfolio is designed
to replace the JFET amplifier currently being used. The
LMV1012 series is ideally suited for applications requiring
high signal integrity in the presence of ambient or RF noise,
such as in cellular communications. The LMV1012 audio
amplifiers are guaranteed to operate over a 2.2V to 5.0V
supply voltage range with fixed gains of 7.8 dB, 15.6 dB,
20.9 dB, and 23.8 dB. The devices offer excellent THD, gain
accuracy and temperature stability as compared to a JFET
microphone.
The LMV1012 series enables a two-pin electret microphone
solution, which provides direct pin-to-pin compatibility with
the existing JFET market.
The devices are offered in extremely thin space saving
4-bump micro SMD packages. The LMV1012XP is designed
for 1.0 mm canisters and thicker ECM canisters. These
extremely miniature packages are designed for electret condenser microphones (ECM) form factor.
n Supply voltage2V - 5V
n Supply current
n Signal to noise ratio (A-weighted)60 dB
n Output voltage noise (A-weighted)−89 dBV
n Total harmonic distortion0.09%
n Voltage gain
— LMV1012-077.8 dB
— LMV1012-1515.6 dB
— LMV1012-2020.9 dB
— LMV1012-2523.8 dB
n Temperature range−40˚C to 85˚C
n Offered in 4-bump micro SMD packages
<
180 µA
Applications
n Cellular phones
n Headsets
n Mobile communications
n Automotive accessories
n PDAs
n Accessory microphone products
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range−65˚C to 150˚C
Junction Temperature (Note 6)150˚C max
Mounting Temperature
Infrared or Convection (20 sec.)235˚C
ESD Tolerance (Note 2)
Human Body Model2500V
Operating Ratings (Note 1)
Machine Model250V
LMV1012 Analog Series
Supply Voltage
- GND5.5V
V
DD
Supply Voltage2V to 5V
Temperature Range−40˚C to 85˚C
2.2V Electrical Characteristics (Note 3)
Unless otherwise specified, all limits guaranteed for TJ= 25˚C, VDD= 2.2V, VIN= 18 mV, RL= 2.2 kΩ and C = 2.2 µF.
Boldface limits apply at the temperature extremes.
Unless otherwise specified, all limits guaranteed for TJ= 25˚C, VDD= 5V, VIN= 18 mV, RL= 2.2 kΩ and C = 2.2 µF.
Boldface limits apply at the temperature extremes.
Min
SymbolParameterConditions
C
IN
Z
IN
A
V
LMV1012 Analog Series
Input Capacitance2pF
Input Impedance
Gainf = 1 kHz,
R
SOURCE
=50Ω
LMV1012-076.4
(Note 4)
5.5
LMV1012-1514.0
13.1
LMV1012-2019.2
17.0
LMV1012-2522.5
21.2
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model (HBM) is 1.5 kΩ in series with 100 pF.
Note 3: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
Note 4: All limits are guaranteed by design or statistical analysis.
Note 5: Typical values represent the most likely parametric norm.
Note 6: The maximum power dissipation is a function of T
P
=(T
D
J(MAX)-TA
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
J=TA
, θJAand TA. The maximum allowable power dissipation at any ambient temperature is
)/θJA. All numbers apply for packages soldered directly into a PC board.
J(MAX)
Typ
(Note 5)
>
1000GΩ
Max
(Note 4)Units
8.19.5
10.7
15.616.9
17.5
21.122.3
23.5
23.925.0
25.8
dB
>
TA.
J
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Connection Diagram
LMV1012 Analog Series
4-Bump micro SMD
Top View
Note: - Pin numbers are referenced to package marking text orientation.
- The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably.
Package marking does not correlate to device type in any way.