National Semiconductor LMH6502 Technical data

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LMH6502 Wideband, Low Power, Linear-in-dB Variable Gain Amplifier
LMH6502 Wideband, Low Power, Linear-in-dB Variable Gain Amplifier
June 2004
General Description
The LMH™6502 is a wideband DC coupled differential input voltage controlled gain stage followed by a high-speed cur­rent feedback Op Amp which can directly drive a low imped­ance load. Gain adjustment range is more than 70dB for up to 10MHz.
Maximum gain is set by external components and the gain can be reduced all the way to cut-off. Power consumption is 300mW with a speed of 130MHz. Output referred DC offset voltage is less than 350mV over the entire gain control voltage range. Device-to-device Gain matching is within
±
0.6dB at maximum gain. Furthermore, gain at any VGis tested and the tolerance is guaranteed. The output current feedback Op Amp allows high frequency large signals (Slew Rate = 1800V/µs) and can also drive heavy load current (75mA). Differential inputs allow common mode rejection in low level amplification or in applications where signals are carried over relatively long wires. For single ended opera­tion, the unused input can easily be tied to ground (or to a virtual half-supply in single supply application). Inverting or non-inverting gains could be obtained by choosing one input polarity or the other.
To provide ease of use when working with a single supply,
range is set to be from 0V to +2V relative to pin 11
V
G
potential (ground pin). In single supply operation, this ground pin is tied to a "virtual" half supply.
LMH6502 gain control is linear in dB for a large portion of the total gain control range. This makes the device suitable for AGC circuits among other applications. For linear gain con­trol applications, see the LMH6503 datasheet. The LMH6502 is available in the SOIC-14 and TSSOP-14 pack­age.
Features
VS=±5V, TA= 25˚C, RF=1kΩ,RG= 174,RL= 100,A =A
n -3dB BW 130MHz n Gain control BW 100MHz n Adjustment range (typical over temp) 70dB n Gain matching (limit) n Slew rate 1800V/µs n Supply current (no load) 27mA n Linear output current n Output voltage (R n Input voltage noise 7.7nV/ n Input current noise 2.4pA/ n THD (20MHz, RL= 100,VO=2VPP) −53dBc n Replacement for CLC520
= 10 Typical values unless specified.
V(MAX)
= 100)
L
±
0.6dB
±
75mA
±
3.2V
Applications
n Variable attenuator n AGC n Voltage controller filter n Video imaging processing
V
Gain vs. VGfor Various Temperature
20067706
LMH™is a trademark of National Semiconductor Corporation.
© 2004 National Semiconductor Corporation DS200677 www.national.com
Typical Application
A
= 10V/V
VMAX
20067737
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/
LMH6502
Distributors for availability and specifications.
Junction Temperature +150˚C
Soldering Information:
Infrared or Convection (20 sec) 235˚C
Wave Soldering (10 sec) 260˚C
ESD Tolerance (Note 4):
Human Body 2KV
Machine Model 200V
±
Input Current
V
Differential
IN
10mA
±
(V+-V−)
Output Current 120mA (Note 3)
Supply Voltages (V
Voltage at Input/ Output pins V
+-V−
) 12.6V
+
+0.8V,V−- 0.8V
Operating Ratings (Note 1)
Supply Voltages (V
Temperature Range −40˚C to +85˚C
Thermal Resistance: (θ
14-Pin SOIC 45˚C/W 138˚C/W
14-Pin TSSOP 51˚C/W 160˚C/W
+-V−
) 5Vto12V
)(θJA)
JC
Storage Temperature Range −65˚C to +150˚C
Electrical Characteristics(Note 2)
Unless otherwise specified, all limits guaranteed for TJ= 25˚C, VS=±5V, A V
=±0.1V, RL= 100,VG= +2V. Boldface limits apply at the temperature extremes.
IN_DIFF
Symbol Parameter Conditions
Frequency Domain Response
BW -3dB Bandwidth V
GF Gain Flatness V
<
0.5
OUT
V
OUT
OUT
<
0.5PP,A
<
0.5V
PP
= 100 50
V(MAX)
PP
0.6V VG≤ 2V,±0.3dB
Att Range Flat Band (Relative to Max Gain)
Attenuation Range (Note 14)
BW
Gain control Bandwidth V
±
0.2dB, f<30MHz 16
±
0.1dB, f<30MHz 7.5
= 1V (Note 13) 100 MHz
G
Control
PL Linear Phase Deviation DC to 60MHz 1.5 deg
G Delay Group Delay DC to 130MHz 2.5 ns
CT (dB) Feed-through V
= 0V, 30MHz (Output
G
Referred)
GR Gain Adjustment Range f<10MHz 72
<
f
30MHz 67
Time Domain Response
t
r,tf
Rise and Fall Time 0.5V Step 2.2 ns
OS % Overshoot 0.5V Step 10 %
SR Slew Rate 4V Step 1800 V/µs
G Rate Gain Change Rate V
= 0.3V, 10%-90% of Final
IN
Output
Distortion & Noise Performance
HD2 2
HD3 3
THD Total Harmonic Distortion 2V
nd
Harmonic Distortion 2VPP, 20MHz −55 dBc
rd
Harmonic Distortion 2VPP, 20MHz −57 dBc
, 20MHz −53 dBc
PP
En tot Total Equivalent Input Noise 1MHz to 150MHz 7.7 nV/
I
N
Input Noise Current 1MHz to 150MHz 2.4 pA/
DG Differential Gain f = 4.43MHz, RL= 150,
Neg. Sync
DP Differential Phase f = 4.43MHz, R
= 150,
L
Neg. Sync
= 10, VCM= 0V, RF=1kΩ,RG= 174,
V(MAX)
Min
(Note 6)
Typ
(Note 6)
(Note 6) Units
130
30 MHz
−47 dB
4.8 dB/ns
0.34 %
0.10 deg
Max
MHz
dB
dB
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Electrical Characteristics(Note 2) (Continued)
Unless otherwise specified, all limits guaranteed for TJ= 25˚C, VS=±5V, A V
Symbol Parameter Conditions
DC & Miscellaneous Performance
GACCU Gain Accuracy (See Application
G Match Gain Matching (See Application
K Gain Multiplier
V
CM
V
IN_DIFF
I
RG_MAX
I
BIAS
TC I
I
OFF
TC I
R
IN
C
IN
I
VG
TC I
R
VG
C
VG
V
OUT
R
OUT
I
OUT
V
O
OFFSET
+PSRR +Power Supply Rejection Ratio
−PSRR −Power Supply Rejection Ratio
CMRR Common Mode Rejection Ratio
I
S
=±0.1V, RL= 100,VG= +2V. Boldface limits apply at the temperature extremes.
IN_DIFF
V
= 2.0V 0.0 +0.6
G
Note)
Note)
<
1V
V
1
G
<
V
2V +0.6/−0.3 +3.1/−3.6
G
= 2.0V
<
<
V
2V +2.8/−3.9
G
(See Application Notes)
Input Voltage Range Pin3&6Common Mode,
>
|CMRR|
55dB (Note 9)
Differential Input Voltage Between pins3&6
RGCurrent Pins4&5
Bias Current Pins 3 & 6(Note 7) 9 18
Pins3&6(Note 7),
=±2.5V
V
S
Bias Current Drift Pin 3 & 6(Note 8) 100 nA/˚C
BIAS
Offset Current Pin3&6 0.01 2.0
Offset Current Drift (Note 8) 5 nA/˚C
OFF
Input Resistance Pin3&6 750 k
Input Capacitance Pin3&6 5 pF
VGBias Current Pin 2, VG= 0V(Note 7) −300 µA
VGBias Drift Pin 2(Note 8) 20 nA/˚C
VG
VGInput Resistance Pin 2 10 k
VGInput Capacitance Pin 2 1.3 pF
Output Voltage Range RL= 100
= Open
R
L
Output Impedance DC 0.1
Output Current V
Output Offset Voltage 0V<V
=±4V from Rails
OUT
<
2V
G
Input Referred, 1V change,
(Note 10)
V
= 2.2V
G
Input Referred, 1V change,
(Note 10)
(Note 9)
= 2.2V
V
G
Input Referred,V
<
<
−1.8V
V
CM
=2V
G
1.8V
Supply Current No Load 27 38
=±2.5V, RL= Open 9.3 16
V
S
= 10, VCM= 0V, RF=1kΩ,RG= 174,
V(MAX)
Min
(Note 6)
1.61
Typ
(Note 6)
(Note 6) Units
1.72 1.84
1.58
±
±
±
±
±
1.70
±
0.12
1.70
1.56
2.0
0.3
±
2.2 V
±
0.39
±
2.22 mA
2.5 5
±
±
±
±
3.00
2.95
3.95
3.82
±
80
±
75
±
3.20
±
4.00
±
90 mA
±
80
−69 −47
−58 −41
−72 dB
Max
±
0.6
1.91
20
6
3.6
±
300
±
380
−45
−40
41
19
LMH6502
dB
dB
V/V
V
µA
µA
V
mV
dB
dB
mA
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Electrical Characteristics(Note 2) (Continued)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
LMH6502
Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
Note 3: The maximum output current (I
Note 4: Human body model: 1.5kin series with 100pF. Machine model: 0in series with 200pF.
Note 5: Slew Rate is the average of the rising and falling rates.
Note 6: Typical values represent the most likely parametric norm. Bold numbers refer to over temperature limits.
Note 7: Positive current corresponds to current flowing in the device.
Note 8: Drift determined by dividing the change in parameter distribution average at temperature extremes by the total temperature change.
Note 9: CMRR definition: [|V
Note 10: +PSRR definition: [|V
Note 11: Gain/Phase normalized to low frequency value at 25˚C.
Note 12: Gain/Phase normalized to low frequency value at each A
Note 13: Gain Control Frequency Response Schematic:
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
J=TA
OUT
OUT
) is determined by device power dissipation limitations or value specified, whichever is lower.
OUT
/VCM|/AV] with 0.1V differential input voltage.
/V+|/AV], −PSRR definition: [|V
/V−|/AV] with 0.1V differential input voltage.
OUT
.
V
>
TA.
J
20067738
Note 14: Flat Band Attenuation (Relative to Max Gain) Range Definition: Specified as the attenuation range from maximum which allows gain flatness specified
±
(either
0.2dB or±0.1dB) relative to A
±
0.2dB 20dB down to 4dB = 16dB range
±
0.1dB 20dB down to 12.5 dB = 7.5dB range
gain. For example, for f<30MHz, here are the Flat Band Attenuation ranges:
VMAX
Connection Diagram
14-Pin SOIC/TSSOP
Top View
20067736
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
14-pin SOIC LMH6502MA LMH6502MA 55 Units/Rail M14A
LMH6502MAX 2.5k Units Tape and Reel
14-Pin TSSOP
LMH6502MT
LMH6502MTX 2.5k Units Tape and Reel
LMH6502MT
94 Units/Rail
MTC14
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LMH6502
Typical Performance Characteristics Unless otherwise specified: V
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output.
V
CM
Small Signal Frequency for Various V
G
20067731
Frequency Response Over Temperature (AV= 10) Frequency Response for Various VG(A
Large Signal Frequency for Various V
=±5V, 25˚C, VG=V
S
VMAX
GMAX
G
20067732
= 10)
,
Frequency Response for Various VG(A
±
2.5V) Small Signal Frequency Response for Various A
(
20067707 20067708
= 10)
VMAX
20067714
VMAX
20067723
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Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
LMH6502
GMAX,VCM
Large Signal Frequency Response for Various A
20067724
Frequency Response for Various VG(A
VMAX
= 100)
(Large Signal) I
VMAX
Frequency Response for Various VG(A
(Small Signal)
vs. V
S
S
VMAX
= 100)
20067729
20067730
ISvs. V
S
20067751
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Input Bias Current vs. V
20067750
S
20067752
LMH6502
Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
A
VMAX
vs. V
CM
20067767
A
VMAX
vs. V
CM
PSRR±5V PSRR±2.5V
GMAX,VCM
20067766
20067703
CMRR±5V CMRR±2.5V
20067701 20067702
20067704
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Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
LMH6502
A
vs. Supply Voltage Supply Current vs. V
VMAX
GMAX,VCM
CM
Supply Current vs. V
CM
20067768
Output Offset Voltage vs. VCM(Typical Unit#1)
20067757
20067756
20067758
Output Offset Voltage vs. VCM(Typical Unit#2) Output Offset Voltage vs. VCM(Typical Unit#3)
20067759 20067760
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LMH6502
Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
Feed through Isolation Gain Flatness and Linear Phase Deviation vs. V
20067721
Gain Flatness Frequency vs. Gain (Note 14) Group Delay vs. Frequency
GMAX,VCM
G
20067709
K Factor vs. R
20067711
G
20067739
Gain vs. VGIncluding Limits
20067712
20067705
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Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
LMH6502
GMAX,VCM
BW vs. R
F
20067740
Gain vs. VG(±5V)
20067706
Gain vs. VG(±2.5V) Output Offset Voltage vs. VG(Typical Unit#1)
20067713
Output Offset Voltage vs. VG(Typical Unit#2) Output Offset Voltage vs. VG(Typical Unit#3)
20067754
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20067753
20067755
LMH6502
Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
Output Offset Voltage vs.
±
VSfor various V
(Typical Unit#1)
20067761
Output Offset Voltage vs.±VSfor various V
(Typical Unit#3) Noise vs. Frequency (A
G
Output Offset Voltage vs.
(Typical Unit#2)
G
±
VSfor various V
=2)
VMAX
GMAX,VCM
G
20067762
Noise vs. Frequency (A
20067763
= 10) Noise vs. Frequency (A
VMAX
20067710
VMAX
20067725
= 100)
20067717
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Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
LMH6502
−1dB Compression Output Voltage vs. Output Current
GMAX,VCM
HD2 & HD3 vs. P
THD vs. P
OUT
OUT
20067722
20067733
THD vs. P
OUT
HD2 & HD3 vs. V
20067726
20067718
G
20067719
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20067728
LMH6502
Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
THD vs. V
G
VGBias Current vs. V
20067720
G
THD vs. V
G
Step Response Plot
GMAX,VCM
20067715
20067727
Step Response Plot Gain vs. VGStep
20067735
20067734
20067764
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Typical Performance Characteristics Unless otherwise specified: V
=±5V, 25˚C, VG=V
S
= 0V, RF=1kΩ,RG= 174, both inputs terminated in 50,RL= 100, Typical values, results referred to device output. (Continued)
LMH6502
GMAX,VCM
Feedthrough from V
Application Information
THEORY OF OPERATION
A simplified schematic is shown in Figure 1.+V are buffered with closed loop voltage followers inducing a signal current in Rg proportional to (+V
) - (−VIN), the dif-
IN
ferential input voltage. This current controls a current source which supplies two well-matched transistor, Q1 and Q2.
The current flowing through Q2 is converted to the final output voltage using R
and the output amplifier, U1. By
F
changing the fraction of the signal current "I" which flows through Q2, the gain is changed. This is done by changing the voltage applied differentially to the bases of Q1 and Q2. For example, with V off. With none of "I" flowing through R
= 0V, Q1 conducts heavily and Q2 is
G
, the LMH6502’s input
F
to output gain is strongly attenuated. With V and the entire signal current flows through Q2 to R ing maximum gain. With V
set to 1V, the bases of Q1 and
G
Q2 are set to approximately the same voltage, Q1 and Q2 have the same collector currents - equal to one half of the signal current "I", thus the gain is approximately one half the maximum gain.
FIGURE 1. LMH6502 Block Diagram
and −V
IN
=+2V,Q1isoff
G
produc-
F
20067741
G
20067765
CHOOSING R
F&RG
Maximum input amplitude and maximum gain are the two key specifications that determine component values in a
IN
LMH6502 application. The output stage op amp is a current-feedback type amplifier
optimized for R
=1kΩ.RGcan then be computed as:
F
(1)
To determine whether the maximum input amplitude will overdrive the LMH6502, compute:
=(RG+ 3.0) x 1.70mA (2)
V
DMAX
the maximum differential input voltage for linear operation. If the maximum input amplitude exceeds the above V
DMAX
limit, then LMH6502 should either be moved to a location in the signal chain where input amplitudes are reduced, or the LMH6502 gain A
and RFshould be increased. The overall system perfor-
R
G
should be reduced or the values for
VMAX
mance impact is different based on the choice made. If the input amplitude is reduced, re-compute the impact on signal­to-noise ratio. If A
is reduced, post LMH6502 amplifier
VMAX
gain, should be increased, or another gain stage added to make up for reduced system gain. To increase R compute the lowest acceptable value for R
>
590xV
R
Operating with R
G
larger than this value insures linear op-
G
DMAX
G
-3 (3)
and RF,
G
:
eration of the input buffers.
may be computed from selected RGand A
R
F
should be>=1kΩ for overall best performance, however R
<
1kcan be implemented if necessary using a loop gain
VMAX:RF
F
reducing resistor to ground on the inverting summing node of the output amplifier (see application note QA-13 for details).
ADJUSTING OFFSET
Offset can be broken into two parts; an input-referred term and an output-referred term. The input-referred offset shows up as a variation in output voltage as V
is changed. This
G
can be trimmed using the circuit in Figure 2 by placing a low frequency square wave (V
LOW
=0V,V
= 2V into VGwith
HIGH
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Application Information (Continued)
V
= 0V, the input referred VOSterm shows up as a small
IN
square wave riding a DC value. Adjust R square wave term to zero. After adjusting the input-referred offset, adjust R Finally, for inverting applications V
(with VIN=0,VG= 0) until V
14
may be applied to pin 6
IN
and the offset adjustment to pin 3. These steps will minimize the output offset voltage. However, since the offset term itself varies with the gain setting, the correction is not perfect and some residual output offset will remain at in-between V Also, this offset trim does not improve output offset tempera­ture coefficient.
to null the V
10
OUT
OS
is zero.
’s.
G
NOISE
Figure 3 describes the LMH6502’s output-referred spot noise density as a function of frequency with A
VMAX
= 10V/V. The plot includes all the noise contributing terms. However, with both inputs terminated in 50, the input noise contribu­tion is minimal. At A input-referred spot noise density (e
= 10V/V, the LMH6502 has a typical
VMAX
) of 7.7nV/ flat-
in
band. For applications extending well into the flat-band re­gion, the input RMS voltage noise can be determined from the following single-pole model:
(5)
LMH6502
20067743
FIGURE 2. Nulling the output offset voltage
GAIN ACCURACY
Defined as the actual gain compared against the theoretical gain at a certain V
(results expressed in dB).
G
Theoretical gain is given by:
(4)
Where K = 1.72 (nominal) & V
= 90mV@room tempera-
C
ture. ForaV
range, the value specified in the tables represents
G
the worst case accuracy over the entire range. The "Typical" value would be the worst case difference between the "Typi­cal Gain" and the "Theoretical gain". The "Max" value would be the worst case difference between the max/min gain limit and the "Theoretical gain".
GAIN MATCHING
Defined as the limit on gain variation at a certain V
(ex-
G
pressed in dB). Specified as "Max" only (no "Typical"). For a
range, the value specified represents the worst case
V
G
20067710
FIGURE 3. Output Referred Voltage Noise vs.
Frequency
CIRCUIT LAYOUT CONSIDERATIONS & EVALUATION BOARD
A good high frequency PCB layout including ground plane construction and power supply bypassing close to the pack­age are critical to achieving full performance. The amplifier is sensitive to stray capacitance to ground at the I
input (pin
12); keep node trace area small. Shunt capacitance across the feedback resistor should not be used to compensate for this effect. For best performance at low maximum gains
<
(A
10) +RGand -RGconnections should be treated in
VMAX
a similar fashion. Capacitance to ground should be mini­mized by removing the ground plane from under the body of
. Parasitic or load capacitance directly on the output (pin
R
G.
10) degrades phase margin leading to frequency response peaking.
The LMH6502 is fully stable when driving a 100load. With reduced load (e.g. 1k) there is a possibility of instability at very high frequencies beyond 400MHz especially with a capacitive load. When the LMH6502 is connected to a light load as such, it is recommended to add a snubber network to the output (e.g. 100and 39pF in series tied between the LMH6502 output and ground). C
can also be isolated from
L
the output by placing a small resistor in series with the output (pin 10).
Component parasitics also influence high frequency results. Therefore it is recommended to use metal film resistors such as RN55D or leadless components such as surface mount devices. High profile sockets are not recommended.
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Application Information (Continued)
National Semiconductor suggests the following evaluation
LMH6502
boards as a guide for high frequency layout and as an aid in device testing and characterization:
Device Package Evaluation Board
Part Number
LMH6502MA SOIC-14 CLC730033
LMH6502MT TSSOP-14 CLC730146
The evaluation board is shipped when a device sample request is placed with National Semiconductor
SINGLE SUPPLY OPERATION
It is possible to operate the LMH6502 with a single supply. To do so, tie pin 11 (GND) to a potential about mid point between V Figure 5.
+
and V−. Two examples are shown in Figure 4 &
FIGURE 4. AC Coupled Single Supply VGA
20067746
OPERATING AT LOWER SUPPLY VOLTAGES
The LMH6502 is rated for operation down to 5V supplies (V
-V−). There are some specifications shown for operation at
±
2.5V within the data sheet (i.e. Frequency Response,
CMRR, PSRR, Gain vs. V
, etc.). Compared to±5V opera-
G
tion, at lower supplies: a) V
range shifts lower.
G
Here are the approximate expressions for various V voltages as a function of V+:
+
+
0.2xV++1
V
G
V
G_MIN
V
G_MID
V
G_MAX
b) V
G_LIMIT
TABLE 1. V
Definition Based on V
G
Definition Expression (V)
Gain Cut-off 0.2 x V+−1
A
/2 0.2 x V
VMAX
A
VMAX
(maximum permissible voltage on VG)isre­duced. This is due to limitations within the device arising from transistor headroom. Beyond this limit, device per­formance will be affected (non-destructive). This could reveal itself as premature high frequency response roll-
±
off. With V
G
2.5V supplies, V
= 1.5V is needed to get maximum gain. This means
is below 1.1V whereas
G_LIMIT
that operating under these conditions has reduced the maximum permissible voltage on V what is needed to get Max gain. If supply voltages are asymmetrical with V
range could result; for example, with V+= 2V, and V
V
G
= −3V, V
G_LIMIT
+
being lower, further "pinching" of
= 0.40V which results in maximum gain
to a level below
G
being 2.5dB less than what would be expected when V is higher.
c) "Max_gain" reduces. There is an intrinsic reduction in
max gain when the total supply voltage is reduced (see Typical Performance Characteristics plots for Gain vs. V (VS=±2.5V). In addition, there is the more drastic mechanism described in "b" above. Beyond V
G_LIMIT
high frequency response is also effected.
Application Circuits
+
G
S
G
,
20067747
FIGURE 5. Transformer Coupled Single Supply VGA
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AGC LOOP
Figure 6 shows a typical AGC circuit. The LMH6502 is followed up with a LMH6714 for higher overall gain. The output of the LMH6714 is rectified and fed to an inverting integrator using a LMH6657 (wideband voltage feedback op amp). When the output voltage, V
, is too large the inte-
OUT
grator output voltage ramps down reducing the net gain of the LMH6502 and V
. If the output voltage is too small,
OUT
the integrator ramps up increasing the net gain and the output voltage. Actual output level is set with R
. To prevent
1
shifts in DC output voltage with DC changes in input signal level, trim pot R
is provided. AGC circuits are always limited
2
in the range of input signals over which constant output level can be maintained. In this circuit, we would expect that reasonable AGC action could be maintained for at least 40dB. In practice, rectifier dynamic range limits reduce this slightly.
Application Circuits (Continued)
LMH6502
20067748
FIGURE 6. Automatic Gain Control (AGC) Loop
FREQUENCY SHAPING
Frequency Shaping Frequency shaping and bandwidth extension of the LMH6502 can be accomplished using parallel networks connected across the R
ports. The network shown in the Figure 7 schematic will effectively extend the LMH6502’s bandwidth.
G
20067749
FIGURE 7. Frequency Shaping
www.national.com17
Physical Dimensions inches (millimeters) unless otherwise noted
LMH6502
14-Pin SOIC
NS Package Number M14A
14-Pin TSSOP
NS Package Number MTC14
www.national.com 18
Notes
LMH6502 Wideband, Low Power, Linear-in-dB Variable Gain Amplifier
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