The LMC6024 is a CMOS quad operational amplifier which
can operate from either a single supply or dual supplies. Its
performance features include an input common-mode range
that reaches V
100 kΩ and5kΩloads) that is equal to or better than widely
accepted bipolar equivalents, while the power supply requirement is less than 1 mW.
This chip is built with National’s advanced Double-Poly
Silicon-Gate CMOS process.
See the LMC6022 datasheet for a CMOS dual operational
amplifier with these same features.
Features
n Specified for 100 kΩ and5kΩloads
n High voltage gain 120 dB
n Low offset voltage drift 2.5 µV/˚C
−
, low input bias current and voltage gain (into
n Ultra low input bias current 40 fA
n Input common-mode range includes V
n Operating range from +5V to +15V supply
n Low distortion 0.01%at 1 kHz
n Slew rate 0.11 V/µs
n Micropower operation 1 mW
−
Applications
n High-impedance buffer or preamplifier
n Current-to-voltage converter
n Long-term integrator
n Sample-and-hold circuit
n Peak detector
n Medical instrumentation
n Industrial controls
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Differential Input Voltage
Supply Voltage (V
+−V−
)16V
Lead Temperature
(Soldering, 10 sec.)260˚C
Storage Temperature Range−65˚C to +150˚C
Voltage at Output/Input Pin(V
Current at Input Pin
Current at Output Pin
Current at Power Supply Pin35 mA
Output Short Circuit to V
Temperature Range−40˚C ≤ TJ≤ +85˚C
Supply Voltage Range4.75V to 15.5V
Power Dissipation(Note 10)
Thermal Resistance (θ
14-Pin DIP85˚C/W
14-Pin SO115˚C/W
), (Note 11)
JA
DC Electrical Characteristics
The following specifications apply for V
face limits apply at the temperature extremes; all other limits T
+
=
5V, V
−
=
0V, V
=
1.5V, V
CM
J
=
25˚C.
=
2.5V, and R
O
=
1M unless otherwise noted. Bold-
L
TypicalLMC6024I
SymbolParameterConditions(Note 5)LimitUnits
(Note 6)
V
OS
Input Offset Voltage19mV
11Max
∆V
/∆TInput Offset Voltage2.5µV/˚C
OS
Average Drift
I
B
Input Bias Current0.04pA
200Max
I
OS
Input Offset Current0.01pA
100Max
R
IN
Input Resistance
CMRRCommon Mode0V ≤ V
+
Rejection RatioV
=
+PSRRPositive Power Supply5V ≤ V
≤ 12V8363dB
CM
15V61Min
+
≤ 15V8363dB
>
1TeraΩ
Rejection Ratio61Min
−PSRRNegative Power Supply0V ≤ V
−
≤ −10V9474dB
Rejection Ratio73Min
+
V
CM
Input Common-ModeV
=
5V and 15V−0.4−0.1V
Voltage RangeFor CMRR ≥ 50 DB0Max
+
V
− 1.9V+− 2.3V
A
V
Large Signal Voltage GainR
=
100 kΩ (Note 7)1000200V/mV
L
+
V
− 2.5Min
Sourcing100Min
Sinking50090V/mV
40Min
=
R
5kΩ(Note 7)1000100V/mV
L
Sourcing75Min
Sinking25050V/mV
20Min
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DC Electrical Characteristics (Continued)
The following specifications apply for V
face limits apply at the temperature extremes; all other limits T
+
SymbolParameterConditions(Note 5)LimitUnits
V
O
I
O
I
S
Output Voltage SwingV
Output CurrentV
Supply CurrentAll Four Amplifiers160240µA
=
−
5V, V
=
0V, V
=
1.5V, V
CM
J
=
25˚C.
=
2.5V, and R
O
=
1M unless otherwise noted. Bold-
L
TypicalLMC6024I
(Note 6)
+
=
5V4.9874.40V
=
R
100 kΩ to 2.5V4.43Min
L
0.0040.06V
0.09Max
+
=
V
5V4.9404.20V
=
R
5kΩto 2.5V4.00Min
L
0.0400.25V
0.35Max
+
=
V
15V14.97014.00V
=
R
100 kΩ to 7.5V13.90Min
L
0.0070.06V
0.09Max
+
=
V
15V14.84013.70V
=
R
5kΩto 7.5V13.50Min
L
0.1100.32V
0.40Max
+
=
5V2213mA
Sourcing, V
Sinking V
=
0V9Min
O
=
5V2113mA
O
(Note 2)9Min
+
=
V
15V4023mA
Sourcing, V
Sinking, V
=
0V15Min
O
=
13V3923mA
O
(Note 12)15Min
=
V
1.5V280Max
O
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AC Electrical Characteristics
The following specifications apply for V
face limits apply at the temperature extremes; all other limits T
+
=
5V, V
−
=
0V, V
=
1.5V, V
CM
J
=
25˚C.
=
2.5V, and R
O
=
1M unless otherwise noted. Bold-
L
TypicalLMC6024I
SymbolParameterConditions(Note 5)LimitUnits
(Note 6)
SRSlew Rate(Note 8)0.110.05V/µs
0.03Min
GBWGain-Bandwidth Product0.35MHz
θ
M
G
M
Phase Margin50Deg
Gain Margin17dB
Amp-to-Amp Isolation(Note 9)130dB
e
n
Input-Referred Voltage NoiseF=1 kHz42
i
n
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
The guaranteed specifications apply only for the test conditions listed.
Note 2: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature and/or multiple Op Amp shorts
can result in exceeding the maximum allowed junction temperature of 150˚C. Output currents in excess of
Note 3: The maximum power dissipation isafunction of T
−TA)/θJA.
Note 4: Human body model, 100 pF discharge through a 1.5 kΩ resistor.
Note 5: Typical values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or correlation.
Note 7: V
Note 8: V
Note 9: Input referred, V
Note 10: For operating at elevated temperatures the device must be derated based on the thermal resistance θ
Note 11: All numbers apply for packages soldered directly into a PC board.
Note 12: Do not connect output to V
Input-Referred Current NoiseF=1 kHz0.0002
±
, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is P
J(max)
+
=
+
=
=
15V, V
15V. Connected as Voltage Follower with 10V step input. Number specified is the slower of the positive and negative slew rates.
CM
7.5V, and R
+
=
connected to 7.5V. For Sourcing tests, 7.5V ≤ VO≤ 11.5V. For Sinking tests, 2.5V ≤ VO≤ 7.5V.
L
15V and R
=
100 kΩ connected to 7.5V. Each amp excited in turn with 1 kHz to produce V
L
+
when V+is greater than 13V or reliability may be adversely affected.
30 mA over long term may adversly affect reliability.
=
13 V
O
PP
=
with P
JA
(T
D
J−TA
.
)/θJA.
=
(T
D
J(max)
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Typical Performance Characteristics V
Supply Current
vs Supply Voltage
Input Bias Current
vs Temperature
=
±
S
7.5V, T
=
25˚C unless otherwise specified
A
Common-Mode Voltage
Range vs Temperature
Output Characteristics
Current Sinking
Crosstalk Rejection
vs Frequency
DS011235-27
DS011235-30
DS011235-33
Output Characteristics
Current Sourcing
CMRR vs Frequency
DS011235-28
DS011235-31
DS011235-34
DS011235-29
Input Voltage Noise
vs Frequency
DS011235-32
CMRR vs Temperature
DS011235-35
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Typical Performance Characteristics V
=
±
S
7.5V, T
=
25˚C unless otherwise specified (Continued)
A
Power Supply Rejection
Ratio vs Frequency
Gain and Phase Responses
vs Load Capacitance
Non-Inverting Slew Rate
vs Temperature
DS011235-36
DS011235-39
Open-Loop Voltage
Gain vs Temperature
Gain and Phase
Responses vs Temperature
Inverting Slew Rate
vs Temperature
DS011235-37
DS011235-40
Open-Loop
Frequency Response
Gain Error
(V
vs V
OUT
)
OS
Large-Signal Pulse
Non-Inverting Response
=
(A
+1)
V
DS011235-38
DS011235-41
DS011235-42
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DS011235-43
DS011235-44
Typical Performance Characteristics V
=
±
S
7.5V, T
=
25˚C unless otherwise specified (Continued)
A
Non-Inverting Small
Signal Pulse Response
=
(A
+1)
V
Stability vs Capacitive Load
DS011235-45
Inverting Large-Signal
Pulse Response
Stability vs Capacitive Load
DS011235-46
Inverting Small-Signal
Pulse Response
DS011235-47
Note 13: Avoid resistive loads of less than 500Ω, as they may cause instability.
DS011235-4
Application Hints
AMPLIFIER TOPOLOGY
The topology chosen for the LMC6024 is unconventional
(compared to general-purpose op amps) in that the traditional unity-gain buffer output stage is not used; instead, the
output is taken directly from the output of the integrator,to allow rail-to-rail output swing. Since the buffer traditionally delivers the power to the load, while maintaining high op amp
gain and stability, and must withstand shorts to either rail,
these tasks now fall to the integrator.
As a result of these demands, the integrator is a compound
affair with an embedded gain stage that is doubly fed forward
(via C
and Cff) by a dedicated unity-gain compensation
f
driver. In addition, the output portion of the integrator is a
push-pull configuration for delivering heavy loads. While
sinking current the whole amplifier path consists of three
gain stages with one stage fed forward, whereas while
sourcing the path contains four gain stages with two fed
forward.
The large signal voltage gain while sourcing is comparable
to traditional bipolar op amps, for load resistance of at least
5kΩ. The gain while sinking is higher than most CMOS op
amps, due to the additional gain stage; however, when driv-
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Application Hints (Continued)
ing load resistance of 5 kΩ or less, the gain will be reduced
as indicated in the Electrical Characterisitics. The op amp
can drive load resistance as low as 500Ω without instability.
COMPENSATING INPUT CAPACITANCE
Refer to the LMC660 or LMC662 datasheets to determine
whether or not a feedback capacitor will be necessary for
compensation and what the value of that capacitor would be.
CAPACITIVE LOAD TOLERANCE
Like many other op amps, the LMC6024 may oscillate when
its applied load appears capacitive. The threshold of oscillation varies both with load and circuit gain. The configuration
most sensitive to oscillation is a unity-gain follower. See the
Typical Performance Characteristics.
The load capacitance interacts with the op amp’s output resistance to create an additional pole. If this pole frequency is
sufficiently low, it will degrade the op amp’s phase margin so
that the amplifier is no longer stable at low gains. The addition of a small resistor (50Ω to 100Ω) in series with the op
amp’s output, and a capacitor (5 pF to 10 pF) from inverting
input to output pins, returns the phase margin to a safe value
without interfering with lower-frequency circuit operation.
Thus, larger values of capacitance can be tolerated without
oscillation. Note that in all cases, the output will ring heavily
when the load capcitance is near the threshold for
oscillation.
Capacitive load driving capability is enhanced by using a pull
up resistor to V
ducting 50 µA or more will significantly improve capacitive
load responses. The value of the pull up resistor must be determined based on the current sinking capability of the ampli-
+
Figure 3
. Typically a pull up resistor con-
fier with respect to the desired output swing. Open loop gain
of the amplifier can also be affected by the pull up resistor
(see Electrical Characteristics).
DS011235-26
FIGURE 3. Compensating for Large
Capacitive Loads with a Pull Up Resistor
PRINTED-CIRCUIT-BOARD LAYOUT
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with less than 1000 pA of leakage current requires special
layout of the PC board. When one wishes to take advantage
of the ultra-low bias current of the LMC6024, typically less
than 0.04 pA, it is essential to have an excellent layout. Fortunately, the techniques for obtaining low leakages are quite
simple. First, the user must not ignore the surface leakage of
the PC board, even though it may sometimes appear acceptably low, because under conditions of high humidity or dust
or contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6024’s inputs and the
terminals of capacitors, diodes, conductors, resistors, relay
terminals, etc. connected to the op-amp’s inputs. See
4
. To have a significant effect, guard rings should be placed
Figure
on both the top and bottom of the PC board. This PC foil
must then be connected to a voltage which is at the same
voltage as the amplifier inputs, since no leakage current can
flow between two points at the same potential. For example,
a PC board trace-to-pad resistance of 10
12
ohms, which is
normally considered a very large resistance, could leak 5 pA
if the trace were a 5V bus adjacent to the pad of an input.
This would cause a 100 times degradation from the
LMC6024’s actual performance. However, if a guard ring is
held within 5 mV of the inputs, then even a resistance of 10
ohms would cause only 0.05 pA of leakage current, or perhaps a minor (2:1) degradation of the amplifier’s performance. See
Figure 5a,Figure 5b,Figure 5c
for typical connections of guard rings for standard op-amp configurations.
If both inputs are active and at high impedance, the guard
can be tied to ground and still provide some protection; see
Figure 5d
.
11
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Application Hints (Continued)
FIGURE 4. Example of Guard Ring in P.C. Board Layout (Using the LMC6024)
DS011235-8
DS011235-9
(a) Inverting Amplifier
DS011235-11
(c) Follower
FIGURE 5. Guard Ring Connections
The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board con-
DS011235-10
(b) Non-Inverting Amplifier
DS011235-12
(d) Howland Current Pump
struction, but the advantages are sometimes well worth the
effort of using point-to-point up-in-the-air wiring. See
6
.
Figure
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Application Hints (Continued)
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board.)
DS011235-13
FIGURE 6. Air Wiring
BIAS CURRENT TESTING
Figure 7
The test method of
is appropriate for bench-testing
bias current with reasonable accuracy. Tounderstand its operation, first close switch S2 momentarily. When S2 is
opened, then
Typical Single-Supply Applications (V
Photodiode Current-to-Voltage Converter
DS011235-14
FIGURE 7. Simple Input Bias Current Test Circuit
A suitable capacitor for C2 would bea5pFor10pFsilver
mica, NPO ceramic, or air-dielectric. When determining the
magnitude of I
−
, the leakage of the capacitor and socket
must be taken into account. Switch S2 should be left shorted
most of the time, or else the dielectric absorption of the capacitor C2 could cause errors.
Similarly, if S1 is shorted momentarily (while leaving S2
shorted)
where Cxis the stray capacitance at the +input.
+
=
5.0 V
)
DC
Micropower Current Source
Note 14: A 5V bias on the photodiode can cut its capacitance by a factor of
2 or 3, leading to improved response and lower noise. However, this bias on
the photodiode will cause photodiode leakage (also known as its dark current).
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DS011235-15
(Upper limit of output range dictated by input common-mode range; lower
limit dictated by minimum current requirement of LM385.)
DS011235-16
Typical Single-Supply Applications (V
Low-Leakage Sample-and-Hold
Instrumentation Amplifier
+
=
5.0 V
) (Continued)
DC
DS011235-17
If R1=R5, R3=R6, and R4=R7;
Then
∴
AV≈ 100 for circuit shown.
For good CMRR over temperature, low drift resistors should be used. Matching of R3 to R6 and R4 to R7 affects CMRR. Gain may be adjusted through R2.
CMRR may be adjusted through R7.
=
f
10 Hz
O
Q=2.1
Gain=−8.8
10 Hz Bandpass Filter
DS011235-19
=
f
c
d=0.895
Gain=1
10 Hz High-Pass Filter (2 dB Dip)
10 Hz
DS011235-18
DS011235-20
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Typical Single-Supply Applications (V
+
=
5.0 V
) (Continued)
DC
1 Hz Low-Pass Filter (Maximally Flat, Dual Supply
Only)
DS011235-21
High Gain Amplifier with Offset Voltage Reduction
Gain=−46.8
Output offset voltage reduced to the
level of the input offset voltage of
the bottom amplifier (typically 1 mV),
referred to V
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group