The LMC6008 octal buffer is designed specifically to buffer
the multi-level voltages going to the inputs of the integrated
circuits. The LMC6008 AC characteristics, including settling
time, are specified for a capacitive load of 0.1 mF for this
reason.
The LMC6008 contains 4 high-speed buffers and 4 lowpower buffers. The high-speed buffers can provide an output current of at least 250 mA (minimum), and the low-power buffers can provide at least 150 mA (minimum). By including the 2 types of buffers, the LMC6008 is able to provide
this function while consuming a supply current of only 6.5
mA (maximum). The buffers are a rail-to-rail design, which
typically swing to within 30 mV of either supply.
The LMC6008 also contains a standby function which puts
the buffer into a high-impedance mode. The supply current
in the standby mode is a low 500 mA max. Also, a thermal
limit circuit is included to protect the device from overload
conditions.
Connection Diagram
24-Pin SO
Features
Y
High Output Current:
High Speed Buffers250 mA min
Low Power Buffers150 mA min
Y
Slew Rate:
High Speed Buffers1.7 V/ms
Low Power Buffers0.85V/ms
Y
Settling Time, C
Y
Wide Input/Output Range0.1V to V
Y
Supply Voltage Range5V to 16V
Y
Supply Current6.5 mA max
Y
Standby Mode Current500 mA
e
0.1 mF16ms max
L
CC
b
0.1V min
Applications
Y
AMLCD voltage buffering
Y
Multi-voltage buffering
Ordering Information
Package
24-PinLMC6008IMM24BRail
Surface Mount
Temperature Range NSCTransport
b
40§Ctoa85§C DrawingMedia
LMC6008IMXM24B Tape & Reel
Note: Buffers 1, 3, 5 and 7 are High Speed and
Buffers 2, 4, 6 and 8 are Low Speed.
C
1996 National Semiconductor CorporationRRD-B30M56/Printed in U. S. A.
Top View
TL/H/12321
TL/H/12321– 1
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
ESD Tolerance (Note 2)2000V
Voltage at Input PinV
Voltage at Output PinV
a
Supply Voltage (V
b
Vb)16V
Lead Temperature
(soldering, 10 sec.)260
Storage Temperature Range
Junction Temperature (Note 4)150§C
Power Dissipation (Note 4)Internally Limited
a
a
0.4V, V
a
a
0.4V, V
b
55§Ctoa150§C
b
b
0.4V
b
b
0.4V
Operating Ratings (Note 1)
a
s
s
V
C/W
§
16V
Supply Voltage4.5V
Temperature Range
b
20§Ctoa100§C
Thermal Resistance (iJA)
M Package, 24-Pin Surface Mount50
C
§
DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
J
e
25§C, V
SymbolParameterConditions
V
OS
A
V
I
B
I
LP
I
LP
V
ERR
V
IH
V
IL
I
IH
I
IL
I
O (STD-BY)
I
CC
I
STD-BY
Input Offset VoltageR
e
V
10 V
O
PP
Input Bias Current300nA max
Peak Load CurrentHi Speed Buffers
Peak Load CurrentLo Speed Buffers
Output Voltage Difference
(Note 9)
Standby Logic
HIgh Voltage
I
Low Voltage
STANDBY
Logic
Standby High Input Current1.0mA max
Standby Low Input Current1.0mA max
Output Leakage CurrentV
Supply CurrentV
Standby CurrentV
PSRRPower Supply Rejection Ratio5VkV
V
O
Voltage Output Swing0.1V min
e
10 kX25mV max
S
e
V
13 V
O
PP
e
V
13 V
O
PP
e
STD-BY
e
Low, V
IL
e
STD-BY
k
CC
CC
e
14.5V and R
e
0.
L
Typ
(Note 5)
LMC6008
Limit
(Note 6)
Units
0.985V/V
b
250mA max
a
250mA min
b
150mA max
a
150mA min
35mV max
3.30V min
1.80V max
High5mA max
e
7.25V6.5mA max
IN
High500mA max
14.5V55dB min
b
V
0.1V max
CC
http://www.national.com2
AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
SymbolParameterConditions
J
e
25§C, V
CC
e
14.5V and R
e
0X.
L
Typ
(Note 5)
LMC6008
Limit
(Note 6)
Units
SRSlew RateBuffers 1, 3, 5, 7 (Note 3)1.70V/ms min
Buffers 2, 4, 6, 8 (Note 3)0.85V/ms min
t
S
t
ON
t
OFF
PBWPower BandwidthV
C
L
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5 kX in series with 100 pF.
Note 3: The Load is a series connection of a 0.1 mF capacitor and a 1X resistor.
Note 4: The maximum power dissipation is a function of T
e
(T
P
D
limit circuit will limit the die temperature to approximately 160
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: The settling time is measured from the input transition to a point 50 mV of the final value, for both rising and falling transitions. The input swing is 0.5V to
13.5V for buffers 1, 3, 5, 7 and 3.75V to 10.25V for buffers 2, 4, 6, 8. Input rise time should be less than 1 ms.
Note 8: High-Speed Buffers are 1, 3, 5, 7 and Low-Speed Buffers are 2, 4, 6, 8.
Note 9: Output Voltage Difference is the difference between the highest and lowest buffer output voltage when all buffer inputs are at identical voltages.
Settling Time(Notes 3, 7)16ms max
Standby Response Time ON10ms max
Standby Response Time OFF10ms max
e
10 VPPfor Hi-Speed
O
e
V
5VPPfor Lo-SpeedKHz min
O
(Note 3)
45
Load Capacitance0.1mF max
, iJA, and TA. The maximum allowable power dissipation at any ambient temperature is
b
TA)/iJA, where the junction-to-ambient thermal resistance i
J(max)
J(max)
C. All numbers apply for packages soldered directly into a PC board.
§
e
50§C/W. If the maximum allowable power dissipation is exceeded, the thermal
24-Lead (3.00×Wide) Small Outline Molded Package (M)
Order Number LMC6008IM or LMC6008IMX
NS Package Number M24B
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