LM4879
1.1 Watt Audio Power Amplifier
LM4879 1.1 Watt Audio Power Amplifier
October 2004
General Description
The LM4879 is an audio power amplifier primarily designed
for demanding applications in mobile phones and other portable communication device applications. It is capable of
delivering 1.1 watt of continuous average power to an 8Ω
BTL load with less than 1% distortion (THD+N) from a 5V
power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4879 does not require output
coupling capacitors or bootstrap capacitors, and therefore is
ideally suited for lower-power portable applications where
minimal space and power consumption are primary requirements.
The LM4879 features a low-power consumption global shutdown mode, which is achieved by driving the shutdown pin
with logic low. Additionally, the LM4879 features an internal
thermal shutdown protection mechanism.
The LM4879 contains advanced pop & click circuitry which
eliminates noises which would otherwise occur during
turn-on and turn-off transitions.
The LM4879 is unity-gain stable and can be configured by
external gain-setting resistors.
DC
Key Specifications
j
PSRR: 5V, 3V@217Hz 62dB (typ)
j
Power Output at 5V & 1% THD+N 1.1W (typ)
j
Power Output at 3V & 1% THD+N 350mW (typ)
j
Shutdown Current 0.1µA (typ)
Features
n No output coupling capacitors, snubber networks or
bootstrap capacitors required
n Unity gain stable
n Ultra low current shutdown mode
n Fast turn on: 80ms (typ), 110ms (max) with 1.0µF
capacitor
n BTL output can drive capacitive loads up to 100pF
n Advanced pop & click circuitry eliminates noises during
turn-on and turn-off transitions
n 2.2V - 5.0V operation
n Available in space-saving µSMD, LLP, and MSOP
packages
Applications
n Mobile Phones
n PDAs
n Portable electronic devices
Typical Application
20024301
FIGURE 1. Typical Audio Amplifier Application Circuit
Boomer®is a registered trademark of National Semiconductor Corporation.
© 2004 National Semiconductor Corporation DS200243 www.national.com
Connection Diagrams
LM4879
8 Bump micro SMD 8 Bump micro SMD Marking
Top View
X - Date Code
T - Die Traceability
Top View
20024382
G - Boomer Family
N- LM4879IBP
Order Number LM4879IBP, LM4879IBPX
See NS Package Number BPA08DDB
Mini Small Outline (MSOP) Package MSOP Marking
Top View
G - Boomer Family
20024384
79-LM4879MM
Top View
NC = No Connect
Order Number LM4879MM
See NS Package Number MUB10A
9 Bump micro SMD 9 Bump micro SMD Marking
20024383
20024385
Top View
20024386
Order Number LM4879IBL, LM4879IBLX
See NS package Number BLA09AAB
www.national.com 2
Top View
20024387
X - Date Code
T - Die Traceability
G - Boomer Family
79 - LM4879IBL
Connection Diagrams (Continued)
9 Bump micro SMD 9 Bump micro SMD Marking
LM4879
Top View
X - Date Code
T - Die Traceability
G - Boomer Family
B3 - LM4879ITL
Top View
20024386
Order Number LM4879ITL, LM4879ITLX
See NS package Number TLA09AAA
Leadless Leadframe Package (LLP) LLP Marking
Top View
Top View
20024302
Order Number LM4879SD
See NS Package Number SDC08A
N - NS Logo
U - Fab Code
Z - Assembly Plant Code
XY - Date Code
TT - Die Traceability
L4879SD - LM4879SD
200243B3
200243B6
www.national.com3
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
LM4879
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 9) 6.0V
Storage Temperature −65˚C to +150˚C
Input Voltage −0.3V to V
Power Dissipation (Note 3) Internally Limited
DD
+0.3V
θ
(BPA08DDB) 220˚C/W (Note 10)
JA
θ
(SDC08A) 64˚C/W (Note 12)
JA
θ
(TLA09AAA) 180˚C/W (Note 10)
JA
θ
(BLA09AAB) 180˚C/W (Note 10)
JA
θ
(MUB10A) 56˚C/W
JC
θ
(MUB10A) 190˚C/W
JA
Operating Ratings
ESD Susceptibility (Note 4) 2000V
ESD Susceptibility (Note 5) 200V
Junction Temperature 150˚C
Thermal Resistance
Temperature Range
T
≤ TA≤ T
MIN
MAX
Supply Voltage 2.2V ≤ V
Electrical Characteristics VDD=5V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for T
−40˚C ≤ TA≤ 85˚C
≤ 5.5V
DD
= 25˚C.
A
LM4879
Symbol Parameter Conditions
Typical Limit
(Note 6) (Notes 7, 8)
I
DD
I
SD
V
OS
P
o
THD+N Total Harmonic Distortion+Noise P
PSRR Power Supply Rejection Ratio
Quiescent Power Supply Current VIN= 0V, 8Ω BTL 5 10 mA (max)
Shutdown Current V
shutdown
= GND 0.1 2.0 µA (max)
Output Offset Voltage 5 40 mV (max)
Output Power THD+N = 1% (max); f = 1kHz 1.1 0.9 W (min)
= 0.4Wrms; f = 1kHz 0.1 %
o
V
= 200mVsine p-p, CB=
ripple
1.0µF
Input terminated with 10Ω to
68 (f = 1kHz)
62 (f =
217Hz)
55 dB (min)
ground
V
SDIH
V
SDIL
T
WU
Shutdown High Input Voltage 1.4 V (min)
Shutdown Low Input Voltage 0.4 V (max)
Wake-up Time CB= 1.0µF 80 110 ms (max)
A-Weighted; Measured across 8Ω
N
OUT
Output Noise
BTL
Input terminated with 10Ω to
26 µV
ground
Electrical Characteristics VDD= 3.0V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for T
LM4879
Symbol Parameter Conditions
I
DD
I
SD
V
OS
P
o
THD+N Total Harmonic Distortion+Noise P
PSRR Power Supply Rejection Ratio
Quiescent Power Supply Current VIN= 0V, 8Ω BTL 4.5 9 mA (max)
Shutdown Current V
shutdown
= GND 0.1 2.0 µA (max)
Output Offset Voltage 5 40 mV (max)
Output Power THD+N = 1% (max); f = 1kHz 350 320 mW
= 0.15Wrms; f = 1kHz 0.1 %
o
V
= 200mVsine p-p, CB=
ripple
1.0µF
Input terminated with 10Ω to
ground
V
SDIH
V
SDIL
T
WU
Shutdown High Input Voltage 1.4 V (min)
Shutdown Low Input Voltage 0.4 V (max)
Wake-up Time CB= 1.0µF 80 110 ms (max)
Typical Limit
(Note 6) (Notes 7, 8)
68 (f = 1kHz)
62 (f =
217Hz)
55 dB (min)
= 25˚C.
A
Units
(Limits)
RMS
Units
(Limits)
www.national.com 4
Electrical Characteristics VDD= 3.0V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for T
25˚C. (Continued)
LM4879
=
A
LM4879
Symbol Parameter Conditions
Typical Limit
(Note 6) (Notes 7, 8)
A-Weighted; Measured across 8Ω
N
OUT
Output Noise
BTL
Input terminated with 10Ω to
26 µV
ground
Electrical Characteristics VDD= 2.6V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for T
LM4879
Symbol Parameter Conditions
I
DD
I
SD
V
OS
Quiescent Power Supply Current VIN= 0V, 8Ω BTL 3.5 mA
Shutdown Current V
shutdown
= GND 0.1 µA
Output Offset Voltage 5 mV
THD+N = 1% (max); f = 1kHz
P
o
Output Power
THD+N Total Harmonic Distortion+Noise P
PSRR Power Supply Rejection Ratio
RL=8Ω 250
R
=4Ω 350
L
= 0.1Wrms; f = 1kHz 0.1 %
o
V
= 200mVsine p-p, CB=
ripple
1.0µF
Input terminated with 10Ω to
ground
Typical Limit
(Note 6) (Notes 7, 8)
55 (f = 1kHz)
55 (f =
217Hz)
= 25˚C.
A
Units
(Limits)
RMS
Units
(Limits)
mW
dB
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC andAC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
allowable power dissipation is P
curves for additional information.
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF–240pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase I
Note 9: If the product is in shutdown mode, and V
If the source impedance limits the current to a max of 10ma, then the part will be protected. If the part is enabled when V
be curtailed or the part may be permanently damaged.
Note 10: All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance.
Note 11: Maximum power dissipation (P
Equation 1 shown in the Application section. It may also be obtained from the power dissipation graphs.
Note 12: The stated θ
is achieved when the LLP package’s DAP is soldered to a 4in2copper heatsink plain.
JA
DMAX
=(T
)/θJAor the number given inAbsolute Maximum Ratings, whichever is lower. For the LM4879, see power derating
JMAX–TA
exceeds 6V (to a max of 8V VDD), then most of the excess current will flow through the ESD protection circuits.
DD
) in the device occurs at an output power level significantly below full output power. P
DMAX
, θJA, and the ambient temperature TA. The maximum
JMAX
by a maximum of 2µA.
SD
is above 6V, circuit performance will
DD
can be calculated using
DMAX
www.national.com5
External Components Description
(Figure 1)
LM4879
Components Functional Description
1. R
2. C
3. R
4. C
5. C
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a
i
high pass filter with C
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a
i
highpass filter with R
at fC= 1/(2π RiCi).
i
at fc= 1/(2π RiCi). Refer to the section, Proper Selection of External Components,
i
for an explanation of how to determine the value of C
Feedback resistance which sets the closed-loop gain in conjunction with Ri.
f
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
S
section for information concerning proper placement and selection of the supply bypass capacitor.
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
B
Components, for information concerning proper placement and selection of C
.
i
.
B
www.national.com 6
Typical Performance Characteristics
LM4879
THD+N vs Frequency
= 5V, RL=8Ω, PWR = 250mW
V
DD
THD+N vs Frequency
= 2.6V, RL=8Ω, PWR = 100mW
V
DD
THD+N vs Frequency
VDD= 3V, RL=8Ω, PWR = 150mW
20024337 20024338
THD+N vs Frequency
VDD= 2.6V, RL=4Ω, PWR = 100mW
THD+N vs Power Out
= 5V, RL=8Ω, f = 1kHz
V
DD
20024339 20024340
THD+N vs Power Out
VDD= 3V, RL=8Ω, f = 1kHz
20024341 20024342
www.national.com7
Typical Performance Characteristics (Continued)
LM4879
THD+N vs Power Out
V
= 2.6V, RL=8Ω, f = 1kHz
DD
Power Supply Rejection Ratio
=5V
V
DD
THD+N vs Power Out
VDD= 2.6V, RL=4Ω, f = 1kHz
20024343 20024344
Power Supply Rejection Ratio
VDD=3V
20024345 20024373
Power Supply Rejection Ratio
= 2.6V
V
DD
20024347
www.national.com 8
Power Dissipation vs Output Power
VDD=5V
20024346
Typical Performance Characteristics (Continued)
LM4879
Power Dissipation
vs Output Power
=3V
V
DD
Power Dissipation
vs Output Power (LLP Package)
=5V
V
DD
20024349
Power Dissipation
vs Output Power
VDD= 2.6V
Power Derating - MSOP
P
= 670mW
DMAX
= 5V, RL=8Ω
V
DD
20024348
20024313
Power Derating - 8 Bump µSMD
= 670mW
P
DMAX
= 5V, RL=8Ω
V
DD
20024380 20024381
20024379
Power Derating - 9 Bump µSMD
P
= 670mW
DMAX
= 5V, RL=8Ω
V
DD
www.national.com9
Typical Performance Characteristics (Continued)
LM4879
Power Derating - LLP
P
= 670mV
DMAX
= 5V, RL=8
V
DD
Output Power
vs Supply Voltage
200243B4
Output Power
vs Supply Voltage
20024351
Output Power
vs Load Resistance
Clipping (Dropout) Voltage
vs Supply Voltage
20024350
20024352
20024374
Supply Current
Shutdown Voltage
20024375
www.national.com 10
Typical Performance Characteristics (Continued)
LM4879
Shutdown Hysterisis Voltage
V
=5V
DD
Shutdown Hysterisis Voltage
= 2.6V
V
DD
20024376
Shutdown Hysterisis Voltage
VDD=3V
20024377
Open Loop
Frequency Response
Frequency Response
vs Input Capacitor Size
20024378
20024356
20024354
www.national.com11
Application Information
LM4879
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4879 has two operational
amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier’s gain is externally configurable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of R
the second amplifier’s gain is fixed by the two internal 20 kΩ
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase by 180˚. Consequently, the differential gain for the
IC is
= 2 *(Rf/Ri)
A
VD
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configuration where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing excessive clipping, please refer to the Audio Power Amplifier
Design section.
A bridge configuration, such as the one used in LM4879,
also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased
at half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configuration. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal
IC power dissipation and also possible loudspeaker damage.
to Riwhile
f
duced supply voltage, higher load impedance, or reduced
ambient temperature. Internal power dissipation is a function
of output power. Refer to the Typical Performance Charac-
teristics curves for power dissipation information for different output powers and output loading.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic bypass capacitor which aid
in supply stability. This does not eliminate the need for
bypassing the supply nodes of the LM4879. The selection of
a bypass capacitor, especially C
, is dependent upon PSRR
B
requirements, click and pop performance (as explained in
the section, Proper Selection of External Components),
system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4879 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when a logic low is placed on the shutdown pin.
By switching the shutdown pin to ground, the LM4879 supply
current draw will be minimized in idle mode. While the device
will be disabled with shutdown pin voltages less than
, the idle current may be greater than the typical
0.4V
DC
value of 0.1µA. (Idle current is measured with the shutdown
pin tied to ground).
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry to provide a
quick, smooth transition into shutdown. Another solution is to
use a single-pole, single-throw switch in conjunction with an
external pull-up resistor. When the switch is closed, the
shutdown pin is connected to ground which disables the
amplifier. If the switch is open, then the external pull-up
resistor to V
will enable the LM4879. This scheme guar-
DD
antees that the shutdown pin will not float thus preventing
unwanted state changes.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4879 has two operational amplifiers in one package, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
The maximum power dissipation for a given application can
be derived from the power dissipation graphs or from Equation 1.
= 4*(VDD)2/(2π2RL) (1)
P
DMAX
It is critical that the maximum junction temperature (T
of 150˚C is not exceeded. T
power derating curves by using P
can be determined from the
JMAX
and the PC board foil
DMAX
JMAX
)
area. By adding additional copper foil, the thermal resistance
of the application can be reduced from a free air value of
150˚C/W, resulting in higher P
. Additional copper foil
DMAX
can be added to any of the leads connected to the LM4879.
It is especially effective when connected to V
, GND, and
DD
the output pins. Refer to the application information on the
LM4879 reference design board for an example of good heat
sinking. If T
still exceeds 150˚C, then additional
JMAX
changes must be made. These changes can include re-
www.national.com 12
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize device
and system performance. While the LM4879 is tolerant of
external component combinations, consideration to component values must be used to maximize overall system quality.
The LM4879 is unity-gain stable which gives the designer
maximum system flexibility. The LM4879 should be used in
low gain configurations to minimize THD+N values, and
maximize the signal to noise ratio. Low gain configurations
require large input signals to obtain a given output power.
Input signals equal to or greater than 1 Vrms are available
from sources such as audio codecs. Please refer to the
section, Audio Power Amplifier Design, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closedloop bandwidth of the amplifier. To a large extent, the bandwidth is dictated by the choice of external components
shown in Figure 1. The input coupling capacitor, C
, forms a
i
first order high pass filter which limits low frequency response. This value should be chosen based on needed
frequency response for a few distinct reasons.
Application Information (Continued)
Selection Of Input Capacitor Size
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 100 Hz to 150 Hz. Thus, using a
large input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor,
A larger input coupling capacitor requires more charge to
C
i.
reach its quiescent DC voltage (nominally 1/2 V
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value. Bypass
capacitor, C
, is the most critical component to minimize
B
turn-on pops since it determines how fast the LM4879 turns
on. The slower the LM4879’s outputs ramp to their quiescent
DC voltage (nominally 1/2 V
Choosing C
equal to 1.0 µF along with a small value of C
B
), the smaller the turn-on pop.
DD
(in the range of 0.1 µF to 0.39 µF), should produce a virtually
clickless and popless shutdown function. While the device
will function properly, (no oscillations or motorboating), with
equal to 0.1 µF, the device will be much more susceptible
C
B
to turn-on clicks and pops. Thus, a value of C
1.0 µF is recommended in all but the most cost sensitive
designs.
AUDIO POWER AMPLIFIER DESIGN
A 1W/8Ω Audio Amplifier
Given:
Power Output 1 Wrms
Load Impedance 8Ω
Input Level 1 Vrms
Input Impedance 20 kΩ
Bandwidth 100 Hz– 20 kHz
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-
DD
B
±
0.25 dB
). This
equal to
formance Characteristics section, the supply rail can be
easily found. A second way to determine the minimum supply rail is to calculate the required V
opeak
and add the output voltage. Using this method, the minimum
supply voltage would be (V
and V
V
OD
BOT
age vs Supply Voltage curve in the Typical Performance
are extrapolated from the Dropout Volt-
OD
TOP
opeak
+(V
OD
TOP
Characteristics section.
5V is a standard voltage, in most applications, chosen for the
supply rail. Extra supply voltage creates headroom that allows the LM4879 to reproduce peaks in excess of 1W without producing audible distortion. At this time, the designer
must make sure that the power supply choice along with the
output impedance does not violate the conditions explained
in the Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equation 3.
=(Rf/Ri)2
A
i
From Equation 3, the minimum A
VD
is 2.83; use AVD=3.
VD
Since the desired input impedance was 20 kΩ, and with a
of 3, a ratio of 1.5:1 of Rfto Riresults in an allocation of
A
VD
=20kΩ and Rf=30kΩ. The final design step is to
R
i
address the bandwidth requirements which must be stated
as a pair of −3 dB frequency points. Five times away from a
−3 dB point is 0.17 dB down from passband response which
±
is better than the required
= 100 Hz/5 = 20 Hz
f
L
=20kHz*5=100kHz
f
H
0.25 dB specified.
As stated in the External Components section, R
junction with C
≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
C
i
create a highpass filter.
i
The high frequency pole is determined by the product of the
desired frequency pole, f
With a A
= 3 and fH= 100 kHz, the resulting GBWP =
VD
, and the differential gain, AVD.
H
300 kHz which is much smaller than the LM4879 GBWP of
10 MHz. This figure displays that if a designer has a need to
design an amplifier with a higher differential gain, the
LM4879 can still be used without running into bandwidth
limitations.
using Equation 2
+V
OD
)), where
BOT
i
in con-
LM4879
(2)
(3)
www.national.com13
Application Information (Continued)
LM4879
20024388
FIGURE 2. HIGHER GAIN AUDIO AMPLIFIER
The LM4879 is unity-gain stable and requires no external
components besides gain-setting resistors, an input coupling
capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential gain of greater
than 10 is required, a feedback capacitor (C4) may be
needed as shown in Figure 2 to bandwidth limit the amplifier.
This feedback capacitor creates a low pass filter that elimi-
nates possible high frequency oscillations. Care should be
taken when calculating the -3dB frequency in that an incorrect combination of R
and C4will cause rolloff before
3
20kHz. A typical combination of feedback resistor and capacitor that will not produce audio band high frequency rolloff
= 20kΩ and C4= 25pf. These components result in a
is R
3
-3dB point of approximately 320 kHz.
www.national.com 14
Application Information (Continued)
LM4879
FIGURE 3. DIFFERENTIAL AMPLIFIER CONFIGURATION FOR LM4879
20024389
FIGURE 4. REFERENCE DESIGN BOARD and LAYOUT - micro SMD
20024390
www.national.com15
Application Information (Continued)
LM4879
20024368
FIGURE 5. REFERENCE DESIGN BOARD and PCB LAYOUT GUIDELINES - MSOP & SO Boards
www.national.com 16
Application Information (Continued)
LM4879 micro SMD BOARD ARTWORK
Silk Screen Top Layer
20024357
Bottom Layer Inner Layer Ground
LM4879
20024358
Inner Layer V
20024359
DD
20024361
20024360
www.national.com17
Application Information (Continued)
LM4879 MSOP DEMO BOARD ARTWORK
LM4879
Silk Screen Top Layer
20024365
20024366
Bottom Layer
20024367
TABLE 1. Mono LM4879 Reference Design Boards Bill of Material for all 3 Demo Boards
Item Part Number Part Description Qty Ref Designator
1 551011208-001 LM4879 Mono Reference Design Board 1
10 482911183-001 LM4879 Audio AMP 1 U1
20 151911207-001 Tant Cap 1uF 16V 10 1 C1
21 151911207-002 Cer Cap 0.39uF 50V Z5U 20% 1210 1 C2
25 152911207-001 Tant Cap 1.0uF 16V 10 1 C3
30 472911207-001 Res 20K Ohm 1/10W 5 3 R1, R2, R3
35 210007039-002 Jumper Header Vertical Mount 2X1 0.100 2 J1, J2
www.national.com 18
Application Information (Continued)
LM4879 LLP DEMO BOARD ARTWORK
Silk Screen Top Layer
200243C2 200243C0
Bottom Layer
LM4879
200243C1
www.national.com19
Application Information (Continued)
PCB LAYOUT GUIDELINES
LM4879
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout Recommendation
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a
major impact on low level signal performance. Star trace
routing refers to using individual traces to feed power and
ground to each circuit or even device. This technique will
take require a greater amount of design time but will not
increase the final price of the board. The only extra parts
required may be some jumpers.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing high frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital and analog ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signals traces
should be located as far away as possible from analog
components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces
parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
www.national.com 20
Physical Dimensions inches (millimeters) unless otherwise noted
LM4879
Note: Unless otherwise specified.
1. Epoxy coating.
2. 63Sn/37Pb eutectic bump.
3. Recommend non-solder mask defined landing pad.
4. Pin 1 is established by lower left corner with respect to text orientation pins are numbered counterclockwise.
5. Reference JEDEC registration MO-211, variation BC.
8-Bump micro SMD
Order Number LM4879IBP, LM4879IBPX
NS Package Number BPA08DDB
±
X1 = 1.361
0.03 X2 = 1.361±0.03 X3 = 0.850±0.10
www.national.com21
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LM4879
Note: Unless otherwise specified.
1. Epoxy coating.
2. 63Sn/37Pb eutectic bump.
3. Recommend non-solder mask defined landing pad.
4. Pin 1 is established by lower left corner with respect to text orientation pins are numbered counterclockwise.
5. Reference JEDEC registration MO-211, variation BC.
9-Bump micro SMD
Order Number LM4879IBL, LM4879IBLX
NS Package Number BLA09AAB
±
X1 = 1.514
0.03 X2 = 1.514±0.03 X3 = 0.945±0.10
www.national.com 22
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LM4879
LLP
Order Number LM4879SD
NS Package Number SDC08A
www.national.com23
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LM4879
9-Bump micro SMD
Order Number LM4879ITL LM4879ITLX
NS Package Number TLA09AAA
±
X1 = 1.514
0.03 X2 = 1.514±0.03 X3 = 0.60±0.075
MSOP
Order Number LM4879MM
NS Package Number MUB10A
www.national.com 24
Notes
LM4879 1.1 Watt Audio Power Amplifier
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned
Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
www.national.com
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
Loading...