LM3500
Synchronous Step-up DC/DC Converter for White LED
Applications
Synchronous Step-up DC/DC Converter for White LED Applications
General Description
The LM3500 is a fixed frequency synchronous step-up
DC/DC converter in a small 8-bump thin micro SMD package. The LM3500 is ideal for white LED applications for
cellular phone back-lighting requiring low current and high
efficiency. Its fixed 1MHz operating frequency allows the use
of small, low ESR capacitors as well as a more predictable
frequency spectrum, which is important in cellular phone
applications. The LM3500 can drive 2 to 4 white LEDs in
series from a single Li-Ion battery or 3 cell NiMH with no
external rectification diode. For white LED applications, a
single external resistor is used to set the maximum LED
current. The white LED current can easily be adjusted using
a pulse width modulated (PWM) signal on the shutdown pin.
The LM3500 uses special protection circuitry on the output
to prevent an overvoltage event if the primary white LED
network should be disconnected eliminating the need of an
extra protection Zener diode. In shutdown, the LM3500 disconnects the input and output creating a true isolation preventing any LED light from emitting over the full input operating voltage range and temperature.
Typical Application Circuit
Features
n Synchronous rectification, high efficiency and no
external schottky diode required
n Uses small surface mount components
n Can drive up to 3 (or 4 low V
n 2.7V to 7V input range
n True shutdown isolation
n Input undervoltage lockout
n Output overvoltage protection, no external zener diode
required
n Requires only a small 16V ceramic capacitor at the
output
n Thermal Shutdown
n 0.1µA shutdown current
n Small 8-bump thin micro SMD package
) white LEDs in series
F
Applications
n LCD Bias Supplies
n White LED Back-Lighting
n Handheld Devices
n Digital Cameras
n Portable Applications
Order NumberPackage TypeNSC Package DrawingTop MarkSupplied As
LM3500TL-16micro SMDTL08SSAC18250 Units, Tape and Reel
LM3500TLX-16micro SMDTL08SSAC183000 Units, Tape and Reel
Pin Description/Functions
PinNameFunction
A1AGNDAnalog ground.
B1V
C1V
C2V
IN
OUT
SW
C3GNDPower Ground.
B3FBOutput voltage feedback connection.
A3NCNo internal connection made to this pin.
A2SHDN
AGND(pin A1): Analog ground pin. The analog ground pin
should tie directly to the GND pin.
V
(pin B1): Analog and Power supply pin. Bypass this pin
IN
with a capacitor, as close to the device as possible, connected between the V
(pin C1): Source connection of internal PMOS power
V
OUT
and GND pins.
IN
device. Connect the output capacitor between the V
GND pins as close as possible to the device.
(pin C2): Drain connection of internal NMOS and PMOS
V
SW
switch devices. Keep the inductor connection close to this
pin to minimize EMI radiation.
GND(pin C3): Power ground pin. Tie directly to ground
plane.
Analog and Power supply input.
PMOS source connection for synchronous rectification.
Switch pin. Drain connections of both NMOS and PMOS power devices.
Shutdown control pin.
FB(pin B3): Output voltage feedback connection. Set the
primary White LED network current with a resistor from the
FB pin to GND. Keep the current setting resistor close to the
device and connected between the FB and GND pins.
NC(pin A3): No internal connection is made to this pin. The
maximum allowable voltage that can be applied to this pin is
OUT
and
7.5V.
SHDN(pin A2): Shutdown control pin. Disable the device
with a voltage less than 0.3V and enable the device with a
voltage greater than 1.1V. The white LED current can be
controlled using a PWM signal at this pin. There is an
internal pull down on the SHDN pin, the device is in a
normally off state.
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LM3500
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN
V
(Note 2)−0.3V to 16V
OUT
V
(Note 2)−0.3V to V
SW
FB Voltage−0.3V to 7.5V
SHDN Voltage
−0.3V to 7.5V
+0.3V
OUT
−0.3V to 7.5V
ESD Ratings (Note 4)
Human Body Model2kV
Machine Model200V
Operating Conditions
Junction Temperature
(Note 3)−40˚C to +125˚C
Supply Voltage2.7V to 7V
NC−0.3V to 7.5V
Maximum Junction Temperature150˚C
Lead Temperature
(Soldering 10 sec.)300˚C
Vapor Phase
Thermal Properties
Junction to Ambient Thermal
Resistance (θ
SMD package (Note 3)
), 8-pin micro
JA
220˚C/W
(60 sec.)215˚C
Infrared
(15 sec.)220˚C
Electrical Characteristics
Specifications in standard type face are for TA= 25˚C and those in boldface type apply over the Operating Temperature
Range of T
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to
be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: This condition applies if V
Note 3: The maximum allowable power dissipation is a function of the maximum operating junction temperature, T
resistance, θ
temperature is calculated using: P
Note 4: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production
tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical
Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 6: Typical numbers are at 25˚C and represent the most likely norm.
Note 7: Feedback current flows out of the pin.
Note 8: Current flows into the pin.
= −10˚C to +85˚C. Unless otherwise specified VIN=2.7V.
A
SHDN low
SHDN High
= −40˚C to +125˚C). Unless otherwise specified VIN=2.7V.
J
Quiescent Current, Device
FB>0.54V
Not Switching
Quiescent Current, Device
FB=0V
Switching
ShutdownSHDN = 0V
Min
(Note 5)
1.10.65
Min
(Note 5)
Typ
(Note 6)
Max
(Note 5)
0.650.3
Typ
(Note 6)
Max
(Note 5)
0.951.2
1.82.5
0.12µA
FeedbackVoltageVIN= 2.7V to 7V0.470.50.53V
FeedbackVoltage Line
Regulation
Switch Current LimitVIN= 3.0V, Duty Cycle =
VIN= 2.7V to 7V
70%
0.10.4%/V
400mA
FB Pin Bias CurrentFB = 0.5V (Note 7)45200nA
Input Voltage Range2.77.0V
NMOS Switch R
PMOS Switch R
DSON
DSON
VIN= 2.7V, ISW= 300mA0.43
V
= 6V, ISW= 300mA1.12.3
OUT
Duty Cycle LimitFB = 0V87%
Switching Frequency0.81.01.2MHz
SHDN Pin Current (Note 8)SHDN = 5.5V1830
916
SHDN = GND
0.1
Switch Leakage CurrentVSW= 15V0.010.5µA
OFF Threshold2.32.42.5
ON Threshold1515.516
Protection
V
Bias CurrentV
OUT
PMOS Switch Leakage
Current
SHDN low
SHDN High
<
V
IN
OUT
, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power dissipation at any ambient
JA
(MAX) = (T
D
OFF Threshold1414.615
= 15V, SHDN = V
OUT
V
= 15V, VSW=0V
OUT
IN
260400µA
0.013µA
0.650.3
1.10.65
>
.IfV
V
IN
J(MAX)−TA
, a voltage greater than VIN+ 0.3V should not be applied to the V
OUT
)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature.
or VSWpins.
OUT
, the junction-to-ambient thermal
J(MAX)
Units
V
Units
mA
Ω
µASHDN = 2.7V
V
V
V
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Typical Performance Characteristics
LM3500
Switching Quiescent Current vs V
2006575520065756
2 LED Efficiency vs LED Current
L = Coilcraft DT1608C-223,
Efficiency = 100*(P
IN
/(2V
LED*ILED
IN
Non-Switching Quiescent Current vs V
IN
2 LED Efficiency vs LED Current
L = TDK VLP4612T-220MR34,
))
Efficiency = 100*(PIN/(2V
LED*ILED
))
3 LED Efficiency vs LED Current
L = Coilcraft DT1608C-223,
Efficiency = 100*(P
IN
/(3V
LED*ILED
20065757
))
20065758
3 LED Efficiency vs LED Current
L = TDK VLP4612T-220MR34,
Efficiency = 100*(PIN/(3V
LED*ILED
20065779
))
20065780
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