National Semiconductor LM3500 Technical data

December 2003
LM3500 Synchronous Step-up DC/DC Converter for White LED Applications
Synchronous Step-up DC/DC Converter for White LED Applications

General Description

The LM3500 is a fixed frequency synchronous step-up DC/DC converter in a small 8-bump thin micro SMD pack­age. The LM3500 is ideal for white LED applications for cellular phone back-lighting requiring low current and high efficiency. Its fixed 1MHz operating frequency allows the use of small, low ESR capacitors as well as a more predictable frequency spectrum, which is important in cellular phone applications. The LM3500 can drive 2 to 4 white LEDs in series from a single Li-Ion battery or 3 cell NiMH with no external rectification diode. For white LED applications, a single external resistor is used to set the maximum LED current. The white LED current can easily be adjusted using a pulse width modulated (PWM) signal on the shutdown pin. The LM3500 uses special protection circuitry on the output to prevent an overvoltage event if the primary white LED network should be disconnected eliminating the need of an extra protection Zener diode. In shutdown, the LM3500 dis­connects the input and output creating a true isolation pre­venting any LED light from emitting over the full input oper­ating voltage range and temperature.

Typical Application Circuit

Features

n Synchronous rectification, high efficiency and no
external schottky diode required
n Uses small surface mount components n Can drive up to 3 (or 4 low V n 2.7V to 7V input range n True shutdown isolation n Input undervoltage lockout n Output overvoltage protection, no external zener diode
required
n Requires only a small 16V ceramic capacitor at the
output
n Thermal Shutdown n 0.1µA shutdown current n Small 8-bump thin micro SMD package
) white LEDs in series
F

Applications

n LCD Bias Supplies n White LED Back-Lighting n Handheld Devices n Digital Cameras n Portable Applications
20065701

FIGURE 1. Typical 3 LED Application

© 2003 National Semiconductor Corporation DS200657 www.national.com

Connection Diagram

LM3500
Top View
8-bump micro SMD
20065702
T
= 125˚C, θJA= 220˚C/W (Note 3)
J(MAX)

Ordering Information

Order Number Package Type NSC Package Drawing Top Mark Supplied As
LM3500TL-16 micro SMD TL08SSA C18 250 Units, Tape and Reel
LM3500TLX-16 micro SMD TL08SSA C18 3000 Units, Tape and Reel

Pin Description/Functions

Pin Name Function
A1 AGND Analog ground.
B1 V
C1 V
C2 V
IN
OUT
SW
C3 GND Power Ground.
B3 FB Output voltage feedback connection.
A3 NC No internal connection made to this pin.
A2 SHDN
AGND(pin A1): Analog ground pin. The analog ground pin should tie directly to the GND pin.
V
(pin B1): Analog and Power supply pin. Bypass this pin
IN
with a capacitor, as close to the device as possible, con­nected between the V
(pin C1): Source connection of internal PMOS power
V
OUT
and GND pins.
IN
device. Connect the output capacitor between the V GND pins as close as possible to the device.
(pin C2): Drain connection of internal NMOS and PMOS
V
SW
switch devices. Keep the inductor connection close to this pin to minimize EMI radiation.
GND(pin C3): Power ground pin. Tie directly to ground plane.
Analog and Power supply input.
PMOS source connection for synchronous rectification.
Switch pin. Drain connections of both NMOS and PMOS power devices.
Shutdown control pin.
FB(pin B3): Output voltage feedback connection. Set the primary White LED network current with a resistor from the FB pin to GND. Keep the current setting resistor close to the device and connected between the FB and GND pins.
NC(pin A3): No internal connection is made to this pin. The maximum allowable voltage that can be applied to this pin is
OUT
and
7.5V. SHDN(pin A2): Shutdown control pin. Disable the device
with a voltage less than 0.3V and enable the device with a voltage greater than 1.1V. The white LED current can be controlled using a PWM signal at this pin. There is an internal pull down on the SHDN pin, the device is in a normally off state.
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LM3500

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
V
IN
V
(Note 2) −0.3V to 16V
OUT
V
(Note 2) −0.3V to V
SW
FB Voltage −0.3V to 7.5V
SHDN Voltage
−0.3V to 7.5V
+0.3V
OUT
−0.3V to 7.5V
ESD Ratings (Note 4)
Human Body Model 2kV
Machine Model 200V

Operating Conditions

Junction Temperature (Note 3) −40˚C to +125˚C
Supply Voltage 2.7V to 7V
NC −0.3V to 7.5V
Maximum Junction Temperature 150˚C
Lead Temperature (Soldering 10 sec.) 300˚C
Vapor Phase

Thermal Properties

Junction to Ambient Thermal Resistance (θ SMD package (Note 3)
), 8-pin micro
JA
220˚C/W
(60 sec.) 215˚C
Infrared (15 sec.) 220˚C

Electrical Characteristics

Specifications in standard type face are for TA= 25˚C and those in boldface type apply over the Operating Temperature Range of T
Symbol Parameter Conditions
I
Q
V
FB
V
FB
I
CL
I
B
V
IN
R
DSON
D
Limit
F
SW
I
SD
I
L
UVP Input Undervoltage Lockout ON Threshold 2.4 2.5 2.6
OVP Output Overvoltage
I
Vout
I
VL
= −10˚C to +85˚C. Unless otherwise specified VIN=2.7V.
A
Quiescent Current, Device
FB>0.54V
Not Switching
Quiescent Current, Device
FB=0V
Switching
Shutdown SHDN = 0V
Min
(Note 5)
Typ
(Note 6)
Max
(Note 5)
0.95 1.2
1.8 2.5
0.1 2 µA
FeedbackVoltage VIN= 2.7V to 7V 0.47 0.5 0.53 V
FeedbackVoltage Line Regulation
Switch Current Limit VIN= 2.7V, Duty Cycle =
VIN= 2.7V to 7V
80%
= 3.0V, Duty Cycle =
V
IN
70%
0.1 0.4 %/V
275 400 480
255 400 530
FB Pin Bias Current FB = 0.5V (Note 7) 45 200 nA
Input Voltage Range 2.7 7.0 V
NMOS Switch R
PMOS Switch R
DSON
DSON
VIN= 2.7V, ISW= 300mA 0.43
V
= 6V, ISW= 300mA 1.1 2.3
OUT
Duty Cycle Limit FB = 0V 80 87 %
Switching Frequency 0.85 1.0 1.15 MHz
SHDN Pin Current (Note 8) SHDN = 5.5V 18 30
9 16
SHDN = GND
0.1
Switch Leakage Current VSW= 15V 0.01 0.5 µA
OFF Threshold 2.3 2.4 2.5
ON Threshold 15 15.5 16
Protection
V
Bias Current V
OUT
PMOS Switch Leakage Current
OFF Threshold 14 14.6 15
= 15V, SHDN = V
OUT
V
= 15V, VSW=0V
OUT
IN
260 400 µA
0.01 3 µA
Units
mA
mA
µASHDN = 2.7V
V
V
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Electrical Characteristics (Continued)
Specifications in standard type face are for TA= 25˚C and those in boldface type apply over the Operating Temperature
LM3500
Range of T
Symbol Parameter Conditions
SHDN Threshold
Specifications in standard type face are for TJ= 25˚C and those in boldface type apply over the full Operating Temperature
Range (T
Symbol Parameter Conditions
I
Q
V
FB
V
FB
I
CL
I
B
V
IN
R
DSON
D
Limit
F
SW
I
SD
I
L
UVP Input Undervoltage Lockout ON Threshold 2.4 2.5 2.6
OVP Output Overvoltage
I
Vout
I
VL
SHDN Threshold
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: This condition applies if V
Note 3: The maximum allowable power dissipation is a function of the maximum operating junction temperature, T
resistance, θ temperature is calculated using: P
Note 4: The human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin.
Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 6: Typical numbers are at 25˚C and represent the most likely norm.
Note 7: Feedback current flows out of the pin.
Note 8: Current flows into the pin.
= −10˚C to +85˚C. Unless otherwise specified VIN=2.7V.
A
SHDN low
SHDN High
= −40˚C to +125˚C). Unless otherwise specified VIN=2.7V.
J
Quiescent Current, Device
FB>0.54V
Not Switching
Quiescent Current, Device
FB=0V
Switching
Shutdown SHDN = 0V
Min
(Note 5)
1.1 0.65
Min
(Note 5)
Typ
(Note 6)
Max
(Note 5)
0.65 0.3
Typ
(Note 6)
Max
(Note 5)
0.95 1.2
1.8 2.5
0.1 2 µA
FeedbackVoltage VIN= 2.7V to 7V 0.47 0.5 0.53 V
FeedbackVoltage Line Regulation
Switch Current Limit VIN= 3.0V, Duty Cycle =
VIN= 2.7V to 7V
70%
0.1 0.4 %/V
400 mA
FB Pin Bias Current FB = 0.5V (Note 7) 45 200 nA
Input Voltage Range 2.7 7.0 V
NMOS Switch R
PMOS Switch R
DSON
DSON
VIN= 2.7V, ISW= 300mA 0.43
V
= 6V, ISW= 300mA 1.1 2.3
OUT
Duty Cycle Limit FB = 0V 87 %
Switching Frequency 0.8 1.0 1.2 MHz
SHDN Pin Current (Note 8) SHDN = 5.5V 18 30
9 16
SHDN = GND
0.1
Switch Leakage Current VSW= 15V 0.01 0.5 µA
OFF Threshold 2.3 2.4 2.5
ON Threshold 15 15.5 16
Protection
V
Bias Current V
OUT
PMOS Switch Leakage Current
SHDN low
SHDN High
<
V
IN
OUT
, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power dissipation at any ambient
JA
(MAX) = (T
D
OFF Threshold 14 14.6 15
= 15V, SHDN = V
OUT
V
= 15V, VSW=0V
OUT
IN
260 400 µA
0.01 3 µA
0.65 0.3
1.1 0.65
>
.IfV
V
IN
J(MAX)−TA
, a voltage greater than VIN+ 0.3V should not be applied to the V
OUT
)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature.
or VSWpins.
OUT
, the junction-to-ambient thermal
J(MAX)
Units
V
Units
mA
µASHDN = 2.7V
V
V
V
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Typical Performance Characteristics

LM3500
Switching Quiescent Current vs V
20065755 20065756
2 LED Efficiency vs LED Current
L = Coilcraft DT1608C-223,
Efficiency = 100*(P
IN
/(2V
LED*ILED
IN
Non-Switching Quiescent Current vs V
IN
2 LED Efficiency vs LED Current
L = TDK VLP4612T-220MR34,
))
Efficiency = 100*(PIN/(2V
LED*ILED
))
3 LED Efficiency vs LED Current
L = Coilcraft DT1608C-223,
Efficiency = 100*(P
IN
/(3V
LED*ILED
20065757
))
20065758
3 LED Efficiency vs LED Current
L = TDK VLP4612T-220MR34,
Efficiency = 100*(PIN/(3V
LED*ILED
20065779
))
20065780
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