Datasheet LM2937 Datasheet (National Semiconductor)

LM2937 500 mA Low Dropout Regulator
LM2937 500 mA Low Dropout Regulator
March 2000
General Description
The LM2937 is a positive voltage regulator capable of sup­plying up to 500 mAofloadcurrent.TheuseofaPNPpower transistor provides a low dropout voltage characteristic. With a load current of 500 mAthe minimum input to output voltage differential required for the output to remain in regulation is typically 0.5V (1V guaranteed maximum over the full operat­ing temperature range). Special circuitry has been incorpo­rated to minimize the quiescent current to typically only 10 mA with a full 500 mA load current when the input to out­put voltage differential is greater than 3V.
The LM2937 requires an output bypass capacitor for stabil­ity.As with most low dropout regulators, the ESR of this ca­pacitor remains a critical design parameter, but the LM2937 includes special compensation circuitry that relaxes ESR re­quirements. The LM2937 is stable for all ESR below 3. This allows the use of low ESR chip capacitors.
Ideally suited for automotive applications, the LM2937 will protect itself and any load circuitry from reverse battery con-
nections, two-battery jumps and up to +60V/−50V load dump transients. Familiar regulator features such as short circuit and thermal shutdown protection are also built in.
Features
n Fully specified for operation over −40˚C to +125˚C n Output current in excess of 500 mA n Output trimmed for 5% tolerance under all operating
conditions
n Typical dropout voltage of 0.5V at full rated load current n Wide output capacitor ESR range, up to 3 n Internal short circuit and thermal overload protection n Reverse battery protection n 60V input transient protection n Mirror image insertion protection
Connection Diagram and Ordering Information
TO-220 Plastic Package
SOT-223 Plastic Package
DS011280-2
Front View Order Number LM2937ET-5.0, LM2937ET-8.0, LM2937ET-10, LM2937ET-12 or LM2937ET-15
See NS Package Number T03B
TO-263 Surface-Mount Package
DS011280-5
Top View
Order Number LM2937ES-5.0, LM2937ES-8.0, LM2937ES-10, LM2937ES-12 or LM2937ES-15
See NS Package Number TS3B
DS011280-26
Front View
Order Number LM2937IMP-5.0,
LM2937IMP-8.0, LM2937IMP-10,
LM2937IMP-12 or LM2937IMP-15
See NS Package Number MP04A
DS011280-6
Side View
© 2000 National Semiconductor Corporation DS011280 www.national.com
Connection Diagram and Ordering Information (Continued)
LM2937
Temperature
Range
−40˚C T
−40˚C T
SOT-223 Package Markings
The small physical size of the SOT-223 package does not allow sufficient space to provide the complete device part number. The actual devices will be labeled with the package markings shown.
125˚C LM2937ES-5.0 LM2937ES-8.0 LM2937ES-10 LM2937ES-12 LM2937ES-15 TS3B TO-263
J
85˚C LM2937IMP-5.0 LM2937IMP-8.0 LM2937IMP-10 LM2937IMP-12 LM2937IMP-15 MP04A SOT-223
J
5.0 8.0 10 12 15 Package
LM2937ET-5.0 LM2937ET-8.0 LM2937ET-10 LM2937ET-12 LM2937ET-15 T03B TO-220
LM2937IMPX-5.0 LM2937IMPX-8.0 LM2937IMPX-10 LM2937IMPX-12 LM2937IMPX-15 MP04A SOT-223
L71B L72B L73B L74B L75B
Output Voltage NSC Package
Drawing
in Tape
and Reel
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LM2937
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
TO-263 (10 seconds) 230˚C SOT-223 (Vapor Phase, 60 seconds) 215˚C SOT-223 (Infared, 15 seconds) 220˚C ESD Susceptibility (Note 3) 2 kV
Input Voltage
Continuous 26V
Transient (t 100 ms) 60V Internal Power Dissipation (Note 2) Internally Limited Maximum Junction Temperature 150˚C Storage Temperature Range −65˚C to +150˚C
Operating Conditions (Note 1)
Temperature Range (Note 2)
LM2937ET, LM2937ES −40˚C T LM2937IMP −40˚C T
Maximum Input Voltage 26V
125˚C
J
85˚C
J
TO-220 (10 seconds) 260˚C
Electrical Characteristics
VIN=V age, C indicated device., all other specifications are for T
Output Voltage 5 mA I
Line Regulation (V
Load Regulation 5 mA I Quiescent Current (V
Output Noise 10 Hz–100 kHz 150 240 300 µVrms Voltage I Long Term Stability 1000 Hrs. 20 32 40 mV Dropout Voltage I
Short-Circuit Current 1.0 0.6 1.0 0.6 1.0 0.6 A(Min) Peak Line Transient t Voltage Maximum Operational 26 26 26 V(Min) Input Voltage Reverse DC V Input Voltage Reverse Transient t Input Voltage
+ 5V, (Note 4) I
NOM
= 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
OUT
Output Voltage (V
= 500 mA for the TO-220 and TO-263 packages, I
OUTmax
= 25˚C.
A=TJ
) 5V 8V 10V Units
OUT
=400mA for the SOT-223 pack-
OUTmax
Parameter Conditions Typ Limit Typ Limit Typ Limit
OUT
I
OUTmax
4.85 7.76 9.70 V(Min)
5.00 4.75 8.00 7.60 10.00 9.50 V(Min)
5.15 8.24 10.30 V(Max)
5.25 8.40 10.50 V(Max)
+ 2V) VIN≤ 26V, 15 50 24 80 30 100 mV(Max)
OUT
I
=5mA
OUT
I
OUT
OUTmax
+ 2V) VIN≤ 26V, 2 10 2 10 2 10 mA(Max)
OUT
I
=5mA
OUT
V
=(V
IN
I
OUT=IOUTmax
OUT
OUT=IOUTmax
I
OUT
<
100 ms, RL= 100 75 60 75 60 75 60 V(Min)
f
OUT
<
1 ms, RL= 100 −75 −50 −75 −50 −75 −50 V(Min)
r
+ 5V), 10 20 10 20 10 20 mA(Max)
OUT
=5mA
= 50 mA 110 250 110 250 110 250 mV(Max)
−0.6V, RL= 100 −30 −15 −30 −15 −30 −15 V(Min)
5 50 8 80 10 100 mV(Max)
0.5 1.0 0.5 1.0 0.5 1.0 V(Max)
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Electrical Characteristics
VIN=V
LM2937
age, C indicted device., all other specifications are for T
Output Voltage 5 mA I
Line Regulation (V
Load Regulation 5 mA I Quiescent Current (V
Output Noise 10 Hz–100 kHz, 360 450 µVrms Voltage I Long Term Stability 1000 Hrs. 44 56 mV Dropout Voltage I
Short-Circuit Current 1.0 0.6 1.0 0.6 A(Min) Peak Line Transient t Voltage Maximum Operational 26 26 V(Min) Input Voltage Reverse DC V Input Voltage Reverse Transient t Input Voltage
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions.
Note 2: The maximum allowable power dissipation at any ambient temperature is P eration, T and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θ with a heatsink, θ or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C.boardcopper area thermally connected to the package (see Application Hints for more information on heatsinking).
Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 k. Note 4: Typicals are at T
+ 5V, (Note 4) I
NOM
= 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
OUT
Output Voltage (V
= 500 mA for the TO-220 and TO-263 packages, I
OUTmax
= 25˚C.
A=TJ
) 12V 15V Units
OUT
=400mA for the SOT-223 pack-
OUTmax
Parameter Conditions Typ Limit Typ Limit
OUT
I
OUTmax
11.64 14.55 V (Min)
12.00 11.40 15.00 14.25 V(Min)
12.36 15.45 V(Max)
12.60 15.75 V(Max)
+ 2V) VIN≤ 26V, 36 120 45 150 mV(Max)
OUT
I
=5mA
OUT
I
OUT
OUTmax
+ 2V) VIN≤ 26V, 2 10 2 10 mA(Max)
OUT
I
=5mA
OUT
V
=(V
IN
I
OUT=IOUTmax
OUT
OUT=IOUTmax
I
OUT
<
100 ms, RL= 100 75 60 75 60 V(Min)
f
OUT
<
1 ms, RL= 100 −75 −50 −75 −50 V(Min)
r
is the ambient temperature, and θJAis the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C
A
is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used
is the sum of the LM2937 junction-to-case thermal resistance θJCof 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263
JA
= 25˚C and represent the most likely parametric norm.
J
JA
+ 5V), 10 20 10 20 mA(Max)
OUT
=5mA
= 50 mA 110 250 110 250 mV(Max)
−0.6V, RL= 100 −30 −15 −30 −15 V(Min)
12 120 15 150 mV(Max)
0.5 1.0 0.5 1.0 V(Max)
= (125 − TA)/θJA, where 125 is the maximum junction temperature for op-
MAX
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Typical Performance Characteristics
LM2937
Dropout Voltage vs Output Current
Quiescent Current vs Temperature
DS011280-7
Dropout Voltage vs Temperature
Quiescent Current vs Input Voltage
DS011280-8
Output Voltage vs Temperature
DS011280-9
Quiescent Current vs Output Current
Line Transient Response
Output Impedance
DS011280-10
DS011280-13
Load Transient Response
Maximum Power Dissipation (TO-220)
DS011280-11
DS011280-14
DS011280-12
Ripple Rejection
DS011280-15
Maximum Power Dissipation (TO-263) (Note 2)
DS011280-16
DS011280-17
DS011280-18
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Typical Performance Characteristics (Continued)
LM2937
Low Voltage Behavior
Low Voltage Behavior
Low Voltage Behavior
Output at Voltage Extremes
Peak Output Current
DS011280-19
DS011280-22
Output at Voltage Extremes
DS011280-20
DS011280-23
DS011280-21
Output Capacitor ESR
DS011280-24
DS011280-25
Typical Application
* Required if the regulator is located more than 3 inches from the power supply filter capacitors.
*
Required for stability. C
* equivalent series resistance, ESR, of this capacitor may be as high as 3.
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must be at least 10 µF (over the full expected operating temperature range) and located as close as possible to the regulator. The
out
DS011280-1
Application Hints
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stabil­ity, and must meet the required conditions for both ESR (Equivalent Series Resistance) and minimum amount of ca­pacitance.
MINIMUM CAPACITANCE: The minimum output capacitance required to maintain stabil-
ity is 10 µF (this value may be increased without limit). Larger values of output capacitance will give improved tran­sient response.
ESR LIMITS: The ESR of the output capacitor will cause loop instability if
it is too high or too low.The acceptable range of ESR plotted versus load current is shown in the graph below.
tial that the output capacitor meet these requirements, or oscillations can result.
Output Capacitor ESR
DS011280-24
FIGURE 1. ESR Limits
It is important to note that for most capacitors, ESR is speci­fied only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design.
Solid tantalum capacitors have a more stable ESR over tem­perature, but are more expensive than aluminum electrolyt­ics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid Tantalum, with the total capacitance split about 75/25% with theAluminum being the larger value.
If two capacitors are paralleled, the effective ESR is the par­allel of the two individual values.The “flatter” ESR of the Tan­talum will keep the effective ESR from rising as quickly at low temperatures.
HEATSINKING
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junc­tion temperature must be within the range specified under Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated by the regulator, P
, must be calculated.
D
It is essen-
The figure below shows the voltages and currents which are present in the circuit, as well as the formula for calculating the power dissipated in the regulator:
DS011280-27
IIN=IL÷I PD=(VIN−V
G
OUT)IL
+(VIN)I
G
FIGURE 2. Power Dissipation Diagram
The next parameter which must be calculated is the maxi­mum allowable temperature rise, T
(max). This is calcu-
R
lated by using the formula:
T
(max) = TJ(max) − TA(max)
R
where: T
(max) is the maximum allowable junction tem-
J
perature, which is 125˚C for commercial grade parts.
T
(max) is the maximum ambient temperature
A
which will be encountered in the applica­tion.
Using the calculated values for T
(max) and PD, the maxi-
R
mum allowable value for the junction-to-ambient thermal re­sistance, θ
IMPORTANT: If the maximum allowable value for θ
, can now be found:
(J−A)
θ
(J−A)=TR
(max)/P
D
(J−A)
found to be 53˚C/W for the TO-220 package, 80˚C/W for the TO-263 package, or 174˚C/W for the SOT-223 pack­age, no heatsink is needed since the package alone will dis­sipate enough heat to satisfy these requirements.
If the calculated value for θ
falls below these limits, a
(J−A)
heatsink is required.
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or se­cured to a copper plane on a PC board. If a copper plane is to be used, the values of θ
will be the same as shown in
(J−A)
the next section for the TO-263. If a manufactured heatsink is to be selected, the value of
heatsink-to-ambient thermal resistance, θ
, must first be
(H−A)
calculated:
θ
Where: θ
= θ
(H−A)
is defined as the thermal resistance from
(J−C)
(J−A)
θ
(C−H)
θ
(J−C)
the junction to the surface of the case. A value of 3˚C/W can be assumed for θ
(J−C)
for this calculation.
θ
(C−H)
is defined as the thermal resistance be­tween the case and the surface of the heat­sink. The value of θ
will vary from
(C−H)
about 1.5˚C/W to about 2.5˚C/W (depend­ing on method of attachment, insulator, etc.). If the exact value is unknown, 2˚C/W should be assumed for θ
When a value for θ
is found using the equation shown,
(H−A)
(C−H)
.
a heatsink must be selected that has a value that is less than or equal to this number.
LM2937
is
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Application Hints (Continued)
θ
LM2937
is specified numerically by the heatsink manufacturer
(H−A)
in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
Figure 3
shows for the TO-263 the measured values of θ for different copper area sizes using a typical PCB with 1 ounce copper
and no solder mask over the copper area used
for heatsinking.
(J−A)
FIGURE 5. θ
DS011280-30
vs Copper (2 ounce) Area for the
(J−A)
SOT-223 Package
DS011280-28
FIGURE 3. θ
vs Copper (1 ounce) Area for the
(J−A)
TO-263 Package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ
for the TO-263
(J−A)
package mounted to a PCB is 32˚C/W. As a design aid,
Figure 4
shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device (assuming θ
is 35˚C/W and the maxi-
(J−A)
mum junction temperature is 125˚C).
DS011280-29
FIGURE 4. Maximum Power Dissipation vs T
AMB
for
the TO-263 Package
Figure 5
package.
and
Figure 6
Figure 6
show the information for the SOT-223
assumes a θ
of 74˚C/W for 1 ounce
(J−A)
copper and 51˚C/W for 2 ounce copper and a maximum junction temperature of 125˚C.
DS011280-31
FIGURE 6. Maximum Power Dissipation vs T
AMB
for
the SOT-223 Package
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave solder­ing to attach the small SOT-223 package to a printed circuit board. The excessive temperatures involved may cause package cracking.
Either vapor phase or infrared reflow techniques are pre­ferred soldering attachment methods for the SOT-223 pack­age.
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Physical Dimensions inches (millimeters) unless otherwise noted
Plastic Package
Order Number LM2937ET-5.0,
LM2937ET-8.0, LM2937ET-10, LM2937ET-12,
or LM2937ET-15
NS Package Number T03B
LM2937
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LM2937
TO-263 3-Lead Plastic Surface Mount Package
Order Number LM2937ES-5.0, LM2937ES-8.0, LM2937ES-10, LM2937ES-12 or LM2937ES-15
NS Package Number TS3B
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LM2937 500 mA Low Dropout Regulator
SOT-223 3-Lead Plastic Surface Mount Package
Order Number LM2937IMP-5.0, LM2937IMP-8.0, LM2937IMP-10, LM2937IMP-12 or LM2937IMP-15
NS Package Number MP04A
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labeling, can be reasonably expected to result in a significant injury to the user.
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