The LM2937 is a positive voltage regulator capable of supplying up to 500 mAofloadcurrent.TheuseofaPNPpower
transistor provides a low dropout voltage characteristic. With
a load current of 500 mAthe minimum input to output voltage
differential required for the output to remain in regulation is
typically 0.5V (1V guaranteed maximum over the full operating temperature range). Special circuitry has been incorporated to minimize the quiescent current to typically only
10 mA with a full 500 mA load current when the input to output voltage differential is greater than 3V.
The LM2937 requires an output bypass capacitor for stability.As with most low dropout regulators, the ESR of this capacitor remains a critical design parameter, but the LM2937
includes special compensation circuitry that relaxes ESR requirements. The LM2937 is stable for all ESR below 3Ω. This
allows the use of low ESR chip capacitors.
Ideally suited for automotive applications, the LM2937 will
protect itself and any load circuitry from reverse battery con-
nections, two-battery jumps and up to +60V/−50V load dump
transients. Familiar regulator features such as short circuit
and thermal shutdown protection are also built in.
Features
n Fully specified for operation over −40˚C to +125˚C
n Output current in excess of 500 mA
n Output trimmed for 5% tolerance under all operating
conditions
n Typical dropout voltage of 0.5V at full rated load current
n Wide output capacitor ESR range, up to 3Ω
n Internal short circuit and thermal overload protection
n Reverse battery protection
n 60V input transient protection
n Mirror image insertion protection
Connection Diagram and Ordering Information
TO-220 Plastic Package
SOT-223 Plastic Package
DS011280-2
Front View
Order Number LM2937ET-5.0, LM2937ET-8.0,
LM2937ET-10, LM2937ET-12 or LM2937ET-15
See NS Package Number T03B
TO-263 Surface-Mount Package
DS011280-5
Top View
Order Number LM2937ES-5.0, LM2937ES-8.0,
LM2937ES-10, LM2937ES-12 or LM2937ES-15
Connection Diagram and Ordering Information (Continued)
LM2937
Temperature
Range
−40˚C ≤ T
−40˚C ≤ T
SOT-223 Package
Markings
The small physical size of the SOT-223 package does not allow sufficient space to provide the complete device part number. The actual devices will be labeled with
the package markings shown.
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Transient (t ≤ 100 ms)60V
Internal Power Dissipation (Note 2)Internally Limited
Maximum Junction Temperature150˚C
Storage Temperature Range−65˚C to +150˚C
Operating Conditions (Note 1)
Temperature Range (Note 2)
LM2937ET,LM2937ES−40˚C ≤ T
LM2937IMP−40˚C ≤ T
Maximum Input Voltage26V
≤125˚C
J
≤85˚C
J
TO-220 (10 seconds)260˚C
Electrical Characteristics
VIN=V
age, C
indicated device., all other specifications are for T
Output Voltage5 mA ≤ I
Line Regulation(V
Load Regulation5 mA ≤ I
Quiescent Current(V
Output Noise10 Hz–100 kHz150240300µVrms
VoltageI
Long Term Stability1000 Hrs.203240mV
Dropout VoltageI
Short-Circuit Current1.00.61.00.61.00.6A(Min)
Peak Line Transientt
Voltage
Maximum Operational262626V(Min)
Input Voltage
Reverse DCV
Input Voltage
Reverse Transientt
Input Voltage
+ 5V, (Note 4) I
NOM
= 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
OUT
Output Voltage (V
= 500 mA for the TO-220 and TO-263 packages, I
OUTmax
= 25˚C.
A=TJ
)5V8V10VUnits
OUT
=400mA for the SOT-223 pack-
OUTmax
ParameterConditionsTypLimitTypLimitTypLimit
OUT
≤ I
OUTmax
4.857.769.70V(Min)
5.004.758.007.6010.009.50V(Min)
5.158.2410.30V(Max)
5.258.4010.50V(Max)
+ 2V) ≤ VIN≤ 26V,1550248030100mV(Max)
OUT
I
=5mA
OUT
≤ I
OUT
OUTmax
+ 2V) ≤ VIN≤ 26V,210210210mA(Max)
OUT
I
=5mA
OUT
V
=(V
IN
I
OUT=IOUTmax
OUT
OUT=IOUTmax
I
OUT
<
100 ms, RL= 100Ω756075607560V(Min)
f
OUT
<
1 ms, RL= 100Ω−75−50−75−50−75−50V(Min)
r
+ 5V),102010201020mA(Max)
OUT
=5mA
= 50 mA110250110250110250mV(Max)
≥ −0.6V, RL= 100Ω−30−15−30−15−30−15V(Min)
55088010100mV(Max)
0.51.00.51.00.51.0V(Max)
www.national.com3
Electrical Characteristics
VIN=V
LM2937
age, C
indicted device., all other specifications are for T
Output Voltage5 mA ≤ I
Line Regulation(V
Load Regulation5 mA ≤ I
Quiescent Current(V
Output Noise10 Hz–100 kHz,360450µVrms
VoltageI
Long Term Stability1000 Hrs.4456mV
Dropout VoltageI
Short-Circuit Current1.00.61.00.6A(Min)
Peak Line Transientt
Voltage
Maximum Operational2626V(Min)
Input Voltage
Reverse DCV
Input Voltage
Reverse Transientt
Input Voltage
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
outside of its rated Operating Conditions.
Note 2: The maximum allowable power dissipation at any ambient temperature is P
eration, T
and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the
junction-to-ambient thermal resistance θ
with a heatsink, θ
or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C.boardcopper area thermally connected to the package (see Application
Hints for more information on heatsinking).
Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Note 4: Typicals are at T
+ 5V, (Note 4) I
NOM
= 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
OUT
Output Voltage (V
= 500 mA for the TO-220 and TO-263 packages, I
OUTmax
= 25˚C.
A=TJ
)12V15VUnits
OUT
=400mA for the SOT-223 pack-
OUTmax
ParameterConditionsTypLimitTypLimit
OUT
≤ I
OUTmax
11.6414.55V (Min)
12.0011.4015.0014.25V(Min)
12.3615.45V(Max)
12.6015.75V(Max)
+ 2V) ≤ VIN≤ 26V,3612045150mV(Max)
OUT
I
=5mA
OUT
≤ I
OUT
OUTmax
+ 2V) ≤ VIN≤ 26V,210210mA(Max)
OUT
I
=5mA
OUT
V
=(V
IN
I
OUT=IOUTmax
OUT
OUT=IOUTmax
I
OUT
<
100 ms, RL= 100Ω75607560V(Min)
f
OUT
<
1 ms, RL= 100Ω−75−50−75−50V(Min)
r
is the ambient temperature, and θJAis the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C
A
is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used
is the sum of the LM2937 junction-to-case thermal resistance θJCof 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263
JA
= 25˚C and represent the most likely parametric norm.
J
JA
+ 5V),10201020mA(Max)
OUT
=5mA
= 50 mA110250110250mV(Max)
≥ −0.6V, RL= 100Ω−30−15−30−15V(Min)
1212015150mV(Max)
0.51.00.51.0V(Max)
= (125 − TA)/θJA, where 125 is the maximum junction temperature for op-
MAX
www.national.com4
Typical Performance Characteristics
LM2937
Dropout Voltage vs
Output Current
Quiescent Current vs
Temperature
DS011280-7
Dropout Voltage vs
Temperature
Quiescent Current vs
Input Voltage
DS011280-8
Output Voltage vs
Temperature
DS011280-9
Quiescent Current vs
Output Current
Line Transient Response
Output Impedance
DS011280-10
DS011280-13
Load Transient Response
Maximum Power
Dissipation (TO-220)
DS011280-11
DS011280-14
DS011280-12
Ripple Rejection
DS011280-15
Maximum Power Dissipation
(TO-263) (Note 2)
DS011280-16
DS011280-17
DS011280-18
www.national.com5
Typical Performance Characteristics (Continued)
LM2937
Low Voltage Behavior
Low Voltage Behavior
Low Voltage Behavior
Output at Voltage
Extremes
Peak Output Current
DS011280-19
DS011280-22
Output at Voltage
Extremes
DS011280-20
DS011280-23
DS011280-21
Output Capacitor ESR
DS011280-24
DS011280-25
Typical Application
* Required if the regulator is located more than 3 inches from the power supply filter capacitors.
*
Required for stability. C
*
equivalent series resistance, ESR, of this capacitor may be as high as 3Ω.
www.national.com6
must be at least 10 µF (over the full expected operating temperature range) and located as close as possible to the regulator. The
out
DS011280-1
Application Hints
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both ESR
(Equivalent Series Resistance) and minimum amount of capacitance.
MINIMUM CAPACITANCE:
The minimum output capacitance required to maintain stabil-
ity is 10 µF (this value may be increased without limit).
Larger values of output capacitance will give improved transient response.
ESR LIMITS:
The ESR of the output capacitor will cause loop instability if
it is too high or too low.The acceptable range of ESR plotted
versus load current is shown in the graph below.
tial that the output capacitor meet these requirements,
or oscillations can result.
Output Capacitor ESR
DS011280-24
FIGURE 1. ESR Limits
It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must
ensure that the ESR will stay inside the limits shown over the
entire operating temperature range for the design.
For aluminum electrolytic capacitors, ESR will increase by
about 30X as the temperature is reduced from 25˚C to
−40˚C. This type of capacitor is not well-suited for low temperature operation.
Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum electrolytics. A cost-effective approach sometimes used is to parallel
an aluminum electrolytic with a solid Tantalum, with the total
capacitance split about 75/25% with theAluminum being the
larger value.
If two capacitors are paralleled, the effective ESR is the parallel of the two individual values.The “flatter” ESR of the Tantalum will keep the effective ESR from rising as quickly at low
temperatures.
HEATSINKING
A heatsink may be required depending on the maximum
power dissipation and maximum ambient temperature of the
application. Under all possible operating conditions, the junction temperature must be within the range specified under
Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated
by the regulator, P
, must be calculated.
D
It is essen-
The figure below shows the voltages and currents which are
present in the circuit, as well as the formula for calculating
the power dissipated in the regulator:
DS011280-27
IIN=IL÷I
PD=(VIN−V
G
OUT)IL
+(VIN)I
G
FIGURE 2. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, T
(max). This is calcu-
R
lated by using the formula:
T
(max) = TJ(max) − TA(max)
R
where: T
(max) is the maximum allowable junction tem-
J
perature, which is 125˚C for commercial
grade parts.
T
(max) is the maximum ambient temperature
A
which will be encountered in the application.
Using the calculated values for T
(max) and PD, the maxi-
R
mum allowable value for the junction-to-ambient thermal resistance, θ
IMPORTANT: If the maximum allowable value for θ
, can now be found:
(J−A)
θ
(J−A)=TR
(max)/P
D
(J−A)
found to be ≥ 53˚C/W for the TO-220 package, ≥ 80˚C/W for
the TO-263 package, or ≥174˚C/W for the SOT-223 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements.
If the calculated value for θ
falls below these limits, a
(J−A)
heatsink is required.
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane is
to be used, the values of θ
will be the same as shown in
(J−A)
the next section for the TO-263.
If a manufactured heatsink is to be selected, the value of
heatsink-to-ambient thermal resistance, θ
, must first be
(H−A)
calculated:
θ
Where: θ
= θ
(H−A)
is defined as the thermal resistance from
(J−C)
(J−A)
− θ
(C−H)
− θ
(J−C)
the junction to the surface of the case. A
value of 3˚C/W can be assumed for θ
(J−C)
for this calculation.
θ
(C−H)
is defined as the thermal resistance between the case and the surface of the heatsink. The value of θ
will vary from
(C−H)
about 1.5˚C/W to about 2.5˚C/W (depending on method of attachment, insulator,
etc.). If the exact value is unknown, 2˚C/W
should be assumed for θ
When a value for θ
is found using the equation shown,
(H−A)
(C−H)
.
a heatsink must be selected that has a value that is less than
or equal to this number.
LM2937
is
www.national.com7
Application Hints (Continued)
θ
LM2937
is specified numerically by the heatsink manufacturer
(H−A)
in the catalog, or shown in a curve that plots temperature rise
vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the package to the plane.
Figure 3
shows for the TO-263 the measured values of θ
for different copper area sizes using a typical PCB with 1
ounce copper
and no solder mask over the copper area used
for heatsinking.
(J−A)
FIGURE 5. θ
DS011280-30
vs Copper (2 ounce) Area for the
(J−A)
SOT-223 Package
DS011280-28
FIGURE 3. θ
vs Copper (1 ounce) Area for the
(J−A)
TO-263 Package
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
for the TO-263
(J−A)
package mounted to a PCB is 32˚C/W.
As a design aid,
Figure 4
shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming θ
is 35˚C/W and the maxi-
(J−A)
mum junction temperature is 125˚C).
DS011280-29
FIGURE 4. Maximum Power Dissipation vs T
AMB
for
the TO-263 Package
Figure 5
package.
and
Figure 6
Figure 6
show the information for the SOT-223
assumes a θ
of 74˚C/W for 1 ounce
(J−A)
copper and 51˚C/W for 2 ounce copper and a maximum
junction temperature of 125˚C.
DS011280-31
FIGURE 6. Maximum Power Dissipation vs T
AMB
for
the SOT-223 Package
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed circuit
board. The excessive temperatures involved may cause
package cracking.
Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223 package.
Order Number LM2937IMP-5.0, LM2937IMP-8.0, LM2937IMP-10, LM2937IMP-12 or LM2937IMP-15
NS Package Number MP04A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
labeling, can be reasonably expected to result in a
significant injury to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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