The LM26 is a precision, single digital-output, low-power thermostat comprised of an internal reference, DAC, temperature
sensor and comparator. Utilizing factory programming, it can
be manufactured with different trip points as well as different
digital output functionality. The trip point (TOS) can be preset
at the factory to any temperature in the range of −55°C to
+110°C in 1°C increments. The LM26 has one digital output
/US/US), one digital input (HYST) and one analog
(OS/OS
output (V
ther open-drain or push-pull. In addition, it can be factory
programmed to be active HIGH or LOW. The digital output
can be factory programmed to indicate an over temperature
shutdown event (OS or OS) or an under temperature shutdown event (US or US). When preset as an overtemperature
shutdown (OS) it will go LOW to indicate that the die temperature is over the internally preset TOS and go HIGH when the
temperature goes below (TOS–T
programmed as an undertemperature shutdown (US) it will
go HIGH to indicate that the temperature is below TUS and go
LOW when the temperature is above (TUS+T
hysteresis, T
by the state of the HYST pin. A V
a voltage that is proportional to temperature and has a
−10.82mV/°C output slope.
Available parts are detailed in the ordering information. For
other part options, contact a National Semiconductor Distributor or Sales Representative for information on minimum
order qualification. The LM26 is currently available in a 5-lead
SOT-23 package.
). The digital output stage can be preset as ei-
TEMP
). Similarly, when pre-
HYST
). The typical
, can be set to 2°C or 10°C and is controlled
HYST
TEMP
HYST
analog output provides
Applications
Microprocessor Thermal Management
■
Appliances
■
Portable Battery Powered Systems
■
■
Industrial Process Control
■
HVAC Systems
■
Remote Temperature Sensing
■
Electronic System Protection
■
Features
Internal comparator with pin programmable 2°C or 10°C
■
hysteresis
No external components required
■
Open Drain or push-pull digital output; supports CMOS
■
logic levels
Internal temperature sensor with V
■
V
■
■
■
■
■
output allows after-assembly system testing
TEMP
Internal voltage reference and DAC for trip-point setting
Currently available in 5-pin SOT-23 plastic package
Excellent power supply noise rejection
UL Recognized Component
For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteristics
Section. Contact National Semiconductor for other set points and output options.
Order Number
Bulk Rail3000 Units in Tape &
Reel
LM26CIM5-DPBLM26CIM5X-DPBTDPBMA05B−25°COpen Drain US
LM26CIM5-HHDLM26CIM5X-HHDTHHDMA05B0°CPush Pull US
LM26CIM5-NPALM26CIM5X-NPATNPAMA05B45°COpen Drain OS
LM26CIM5-PHALM26CIM5X-PHATPHAMA05B50°COpen Drain OS
LM26CIM5-RPALM26CIM5X-RPATRPAMA05B65°COpen Drain OS
LM26CIM5-SHALM26CIM5X-SHATSHAMA05B70°COpen Drain OS
LM26CIM5-SPALM26CIM5X-SPATSPAMA05B75°COpen Drain OS
LM26CIM5-TPALM26CIM5X-TPATTPAMA05B85°COpen Drain OS
LM26CIM5-VHALM26CIM5X-VHATVHAMA05B90°COpen Drain OS
LM26CIM5-VPALM26CIM5X-VPATVPAMA05B95°COpen Drain OS
LM26CIM5-XHALM26CIM5X-XHATXHAMA05B100°COpen Drain OS
LM26CIM5-XPALM26CIM5X-XPATXPAMA05B105°COpen Drain OS
LM26CIM5-YHALM26CIM5X-YHATYHAMA05B110°COpen Drain OS
LM26CIM5-YPALM26CIM5X-YPATYPAMA05B115°COpen Drain OS
LM26CIM5-ZHALM26CIM5X-ZHATZHAMA05B120°COpen Drain OS
Top Mark
NS Package
Number
Trip Point SettingOutput Function
Connection Diagram
10132302
Pin Descriptions
Pin
Number
1HYSTHysteresis control, digital inputGND for 10°C or V+ for 2°C
2GNDGround, connected to the back side of the die
3V
4V
5OSOvertemperature Shutdown open-drain active
Note: pin 5 functionality and trip point setting are programmed during LM26 manufacture.
Pin
Name
through lead frame.
Analog output voltage proportional to
TEMP
temperature
+
Supply input2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR
low thermostat digital output
OSOvertemperature Shutdown push-pull active
high thermostat digital output
USUndertemperature Shutdown open-drain active
low thermostat digital output
USUndertemperature Shutdown push-pull active
high thermostat digital output
FunctionConnection
System GND
Leave floating or connect to a high impedance node.
information see Section Titled NOISE CONSIDERATIONS.
Controller interrupt, system or power supply shutdown; pull-up
resistor ≥ 10kΩ
Controller interrupt, system or power supply shutdown
System or power supply shutdown; pull-up resistor ≥ 10kΩ
System or power supply shutdown
www.national.com2
LM26
Absolute Maximum Ratings (Note 1)
Input Voltage6.0V
Input Current at any pin (Note 2)5mA
Storage Temperature−65°C to + 150°C
ESD Susceptibility (Note 4)
Human Body Model
Machine Model
Package Input Current(Note 2)20mA
Package Dissipation at TA = 25°C
The following specifications apply for V+ = 2.7VDC to 5.5VDC, and V
limits apply for TA = TJ = T
MIN
to T
; all other limits TA = TJ = 25°C unless otherwise specified.
MAX
TypicalLM26CIMUnits
SymbolParameterConditions
Temperature Sensor
Trip Point Accuracy (Includes V
Comparator Offset, and Temperature
REF
, DAC,
-55°C ≤ TA ≤ +110°C
+120°C±4°C (max)
Sensitivity errors)
Trip Point HysteresisHYST = GND11°C
HYST = V
V
V
Output Temperature Sensitivity
TEMP
Temperature Sensitivity Error to
TEMP
Equation:
VO = (−3.479×10−6×(T−30)2)
+ (−1.082×10−2×(T−30)) + 1.8015V
−30°C ≤ TA ≤ 120°C,
2.7V ≤ V+ ≤ 5.5V
−55°C ≤ TA ≤ 120°C,
4.5V ≤ V+ ≤ 5.5V
TA = 30°C±2.5°C (max)
V
Load Regulation
TEMP
Source ≤ 1 μA
Sink ≤ 40 μA
V
Line Regulation
TEMP
+2.7V ≤ V+ ≤ +5.5V,
−30°C ≤ TA ≤ +120°C
I
S
Supply Current1620
Digital Output and Input
I
OUT(“1”)
Logical “1” Output Leakage Current
V+ = +5.0V0.0011µA (max)
(Note 9)
V
OUT(“0”)
V
OUT(“1”)
Logical “0” Output VoltageI
Logical “1” Push-Pull Output Voltage
= +1.2mA and
OUT
+
V
≥2.7V; I
+
and V
≥4.5V; (Note 8)
I
= 500µA, V+ ≥
SOURCE
2.7V
I
= 800µA, V
SOURCE
+
≥4.5V
V
IH
HYST Input Logical ”1“ Threshold
0.8 × V
Voltage
V
IL
HYST Input Logical ”0“ Threshold
0.2 × V
Voltage
load current = 0µA unless otherwise specified. Boldface
TEMP
(Note 6)
Limits
(Note 7)
±3°C (max)
+
2
−10.82
°C
±3°C (max)
±3°C (max)
0.070mV
0.7mV (max)
−0.2mV/V
40
0.4V (max)
= +3.2mA
OUT
0.8 × V
+
V+ − 1.5V (min)
+
+
(Limits)
mV/°C
µA (max)
µA (max)
V (min)
V (min)
V (max)
2500V
250V
MAX
+5.5V
3www.national.com
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
LM26
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal
operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (T
given in the Absolute Maximum Ratings, whichever is lower. For this device, T
package types when board mounted follow:
= 150°C. For this device the typical thermal resistance (θJA) of the different
Jmax
(maximum junction temperature), θJA (junction to
Jmax
)/θJA or the number
Jmax–TA
Package Type
θ
JA
SOT23-5, MA05B250°C/W
Note 4: The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 5: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices.
Note 6: Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 8: Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would
increase by 1.28mW when I
temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification.
Note 9: The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every
15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.
=3.2mA and V
OUT
=0.4V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die
OUT
Part Number Template
The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of the output as
follows:
The place holders xy describe the set point temperature as shown in the following table.
x (10x)y (1x)Temperature (°C)
A-−5
B-−4
C-−3
D-−2
E-−1
F-−0
HH0
JJ1
KK2
LL3
The value of z describes the assignment/function of the output as shown in the following table:
Active-Low/High
Open-Drain/ Push-
Pull
OS/USValue of zDigital Output Function
000AActive-Low, Open-Drain, OS output
001BActive-Low, Open-Drain, US output
110CActive-High, Push-Pull, OS output
111DActive-High, Push-Pull, US output
x (10x)y (1x)Temperature (°C)
NN4
PP5
RR6
SS7
TT8
VV9
X-10
Y-11
Z-12
For example:
•
the part number LM26CIM5-TPA has TOS = 85°C, and programmed as an active-low open-drain overtemperature shutdown
output.
•
the part number LM26CIM5-FPD has TUS = −5°C, and programmed as an active-high, push-pull undertemperature shutdown
output.
Active-high open-drain and active-low push-pull options are available, please contact National Semiconductor for more information.
www.national.com4
Functional Description
LM26 OPTIONS
LM26
LM26-_ _A
LM26-_ _C
10132312
10132314
FIGURE 1. Output Pin Options Block Diagrams
The LM26 can be factory programmed to have a trip point
anywhere in the range of −55°C to +110°C.
Applications Hints
AFTER-ASSEMBLY PCB TESTING
The LM26's V
by following a simple test procedure. Simply measuring the
V
output voltage will verify that the LM26 has been as-
TEMP
sembled properly and that its temperature sensing circuitry is
functional. The V
that can be overdriven by 1.5mA. Therefore, one can simply
force the V
state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test procedure that can be used to test the LM26CIM5-TPA which has
an 85°C trip point.
1.
Turn on V+ and measure V
temperature reading of the LM26 using the equation:
VO = (−3.479×10−6×(T−30)2) + (−1.082×10−2×(T
or
2.
Verify that the temperature measured in step one is
within (±3°C + error of reference temperature sensor) of
the ambient/board temperature. The ambient/board
temperature (reference temperature) should be
measured using an extremely accurate calibrated
temperature sensor.
output allows after-assembly PCB testing
TEMP
output has very weak drive capability
TEMP
voltage to cause the digital output to change
TEMP
. Then calculate the
TEMP
−30)) + 1.8015V(1)
(2)
LM26-_ _B
LM26-_ _D
10132313
10132315
3.
A.
Observe that OS
B.
Drive V
C.
D.
E.
TEMP
Observe that OS is now low.
Release the V
Observe that OS is now high.
is high.
to ground.
pin.
TEMP
4.
A.
Observe that OS is high.
B.
Drive V
C.
When OS goes low, note the V
D.
V
TEMP
E.
Calculate Ttrig using Equation 2.
voltage down gradually.
TEMP
Trig = V
at OS trigger (HIGH->LOW)
TEMP
TEMP
voltage.
5.
A.
Gradually raise V
V
.
TEMP
B.
Calculate T
V
LOADING
TEMP
The V
40 µA sink). So care should be taken when attaching circuitry
output has very weak drive capability (1 µA source,
TEMP
HYST
to this pin. Capacitive loading may cause the V
oscillate. Simply adding a resistor in series as shown in Figure
TEMP
until OS
goes HIGH. Note
using Equation 2.
TEMP
output to
2 will prevent oscillations from occurring. To determine the
value of the resistor follow the guidelines given in Table 1. The
same value resistor will work for either placement of the resistor. If an additional capacitive load is placed directly on the
LM26 output, rather than across C
a factor of 10 smaller than C
LOAD
, it should be at least
LOAD
.
5www.national.com
TABLE 1. Resistive compensation for capacitive loading
LM26
C
LOAD
of V
TEMP
R (Ω)
≤100pF
1nF8200
10nF3000
100nF1000
≥1µF
a) R in series with capacitor
b) R in series with signal path
FIGURE 2. Resistor placement for capacitive loading
NOISE CONSIDERATIONS
The LM26 has excellent power supply noise rejection. Listed
below is a variety of signals used to test the LM26 power supply rejection. False triggering of the output was not observed
when these signals where coupled into the V+ pin of the
LM26.
•
square wave 400kHz, 1Vp-p
•
square wave 2kHz, 200mVp-p
•
sine wave 100Hz to 1MHz, 200mVp-p
Testing was done while maintaining the temperature of the
LM26 one degree centigrade way from the trip point with the
output not activated.
compensation of V
430
TEMP
0
10132317
10132318
mented to a surface. The temperature that the LM26 is sensing will be within about +0.06°C of the surface temperature to
which the LM26's leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the actual
temperature measured would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity, the backside of the
LM26 die is directly attached to the GND pin (pin 2). The temperatures of the lands and traces to the other leads of the
LM26 will also affect the temperature that is being sensed.
Alternatively, the LM26 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM26 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to ensure
that moisture cannot corrode the LM26 or its connections.
The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction temperature due to its power dissipation. For the LM26 the equation
used to calculate the rise in the die junction temperature is as
follows:
(3)
where TA is the ambient temperature, V+ is the power supply
voltage, IQ is the quiescent current, I
on the V
and IDO is the load current on the digital output. Since the
output, VDO is the voltage on the digital output,
TEMP
is the load current
L_TEMP
LM26's junction temperature is the actual temperature being
measured, care should be taken to minimize the load current
that the LM26 is required to drive.
The tables shown in Figure 3 summarize the thermal resistance for different conditions and the rise in die temperature
of the LM26 without any loading on V
resistor on an open-drain digital output with a 5.5V power
and a 10k pull-up
TEMP
supply.
SOT23-5
no heat sink
θ
JA
(°C/W)
TJ−T
(°C)
A
SOT23-5
small heat sink
θ
JA
(°C/W)
TJ−T
(°C)
A
Still Air2500.11TBDTBD
Moving AirTBDTBDTBDTBD
FIGURE 3. Thermal resistance (θJA) and temperature rise
due to self heating (TJ−TA)
MOUNTING CONSIDERATIONS
The LM26 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or ce-
www.national.com6
Typical Applications
LM26
Note: The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM26 goes low, the fan will speed up.
10132303
FIGURE 4. Two Speed Fan Speed Control
10132320
FIGURE 5. Fan High Side Drive
FIGURE 6. Fan Low Side Drive
7www.national.com
10132321
LM26
10132322
FIGURE 7. Audio Power Amplifier Thermal Protection
Power Managementwww.national.com/powerFeedbackwww.national.com/feedback
Switching Regulatorswww.national.com/switchers
LDOswww.national.com/ldo
LED Lightingwww.national.com/led
PowerWisewww.national.com/powerwise
Serial Digital Interface (SDI)www.national.com/sdi
Temperature Sensorswww.national.com/tempsensors
Wireless (PLL/VCO)www.national.com/wireless
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