National Semiconductor DS90CF384A, DS90CF364A Technical data

October 1998

DS90CF384A/DS90CF364A
+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD)
Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel
Display (FPD) Link—65 MHz

DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit-Color Flat Panel Display (FPD)

Link— 65 MHz, +3.3V LVDS Receiver 18-Bit-Color Flat Panel Display (FPD) Link—65 MHz

General Description

The DS90CF384A receiver converts the four LVDS data
streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec
bandwidth) back into parallel 28 bits of CMOS/TTL data (24
bits of RGB and 4 bits of Hsync,Vsync, DE and CNTL).Also
available is the DS90CF364A that converts the three LVDS
data streams (Up to 1.3 Gbps throughput or 170 Megabytes/
sec bandwidth) back into parallel 21 bits of CMOS/TTL data
(18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both
Receivers’ outputs are Falling edge strobe. A Rising edge or
Falling edge strobe transmitter (DS90C383A/DS90C363A)
will interoperate with a Falling edge strobe Receiver without
any translation logic.

This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.

Block Diagrams

DS90CF384A

Features

n 20 to 65 MHz shift clock support
n 50%duty cycle on receiver output clock
n Best–in–Class Set & Hold Times on RxOUTPUTs
n Rx power consumption

Grayscale

n Rx Power-down mode
n ESD rating
n Supports VGA, SVGA, XGA and Dual Pixel SXGA.
n PLL requires no external components
n Compatible with TIA/EIA-644 LVDS standard
n Low profile 56-lead or 48-lead TSSOP package

>

7 kV (HBM),>700V (EIAJ)

<

250 mW (typ)@65MHz

<

200µW (max)

DS90CF364A

DS100870-27

Order Number DS90CF384AMTD
See NS Package Number MTD56

TRI-STATE®is a registered trademark of National Semiconductor Corporation.

© 1998 National Semiconductor Corporation DS100870 www.national.com

Order Number DS90CF364AMTD
See NS Package Number MTD48

DS100870-28

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Supply Voltage (V
CMOS/TTL Output Voltage −0.3V to (V
LVDS Receiver Input Voltage −0.3V to (V
Junction Temperature +150˚C
Storage Temperature −65˚C to +150˚C
Lead Temperature

(Soldering, 4 sec) +260˚C

Maximum Package Power Dissipation Capacity

MTD56 (TSSOP) Package:

DS90CF384A 1.61 W

MTD48 (TSSOP) Package:

DS90CF364A 1.89 W

) −0.3V to +4V

CC

CC
CC

@

25˚C

+ 0.3V)
+ 0.3V)

Package Derating:

DS90CF384A 12.4 mW/˚C above +25˚C
DS90CF364A 15 mW/˚C above +25˚C

ESD Rating

(HBM, 1.5 kΩ, 100 pF)

(EIAJ, 0Ω, 200 pF)

>

>

Recommended Operating
Conditions

Supply Voltage (V

) 3.0 3.3 3.6 V

CC

Operating Free Air

Temperature (T

) −10 +25 +70 ˚C

A

Receiver Input Range 0 2.4 V
Supply Noise Voltage (V

Min Nom Max Units

) 100 mV

CC

7kV

700V

Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units

CMOS/TTL DC SPECIFICATIONS

V

OH

V

OL

I

OS

LVDS RECEIVER DC SPECIFICATIONS

V

TH

V

TL

I

IN

RECEIVER SUPPLY CURRENT

ICCRW Receiver Supply Current C

ICCRW Receiver Supply Current C

ICCRG Receiver Supply Current, C

ICCRZ Receiver Supply Current Power Down = Low

Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.

Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise speci-

fied (except V

High Level Output Voltage IOH= −0.4 mA 2.7 3.3 V
Low Level Output Voltage IOL= 2 mA 0.06 0.3 V
Output Short Circuit Current V

= 0V −60 −120 mA

OUT

Differential Input High Threshold VCM= +1.2V +100 mV
Differential Input Low Threshold −100 mV
Input Current VIN= +2.4V, VCC= 3.6V

V

= 0V, VCC= 3.6V

IN

= 8 pF, f = 32.5 MHz 49 65 mA

L

±

10 µA

±

10 µA

Worst Case Worst Case Pattern, f = 37.5 MHz 53 70 mA

DS90CF384A

(Figures

f = 65 MHz 81 105 mA

1,4)

= 8 pF, f = 32.5 MHz 49 55 mA

L

Worst Case Worst Case Pattern, f = 37.5 MHz 53 60 mA

DS90CF364A

(Figures

f = 65 MHz 78 90 mA

1,4)

= 8 pF, f = 32.5 MHz 28 45 mA

L

16 Grayscale 16 Grayscale Pattern, f = 37.5 MHz 30 47 mA

(Figures 2, 3, 4 )

f = 65 MHz 43 60 mA

10 55 µA

Power Down Receiver Outputs Stay Low during

Power Down Mode

= 3.3V and TA= +25C.

CC

and ∆VOD).

OD

PP

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Receiver Switching Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified

Symbol Parameter Min Typ Max Units

CLHT CMOS/TTL Low-to-High Transition Time
CHLT CMOS/TTL High-to-Low Transition Time
RSPos0 Receiver Input Strobe Position for Bit 0

,

Figure 12 )

11

(Figure 4 )
(Figure 4 )

(Figure

f = 65 MHz 0.7 1.1 1.4 ns

25ns

1.8 5 ns

RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns
RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns
RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns
RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns
RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns
RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns
RSKM RxIN Skew Margin (Note 4)
RCOP RxCLK OUT Period
RCOH RxCLK OUT High Time
RCOL RxCLK OUT Low Time
RSRC RxOUT Setup to RxCLK OUT
RHRC RxOUT Hold to RxCLK OUT
RCCD RxCLK IN to RxCLK OUT Delay 25˚C, V
RPLLS Receiver Phase Lock Loop Set
RPDD Receiver Power Down Delay

Note 4: ReceiverSkew Margin is defined as the validdatasampling region at the receiver inputs. Thismargintakes into account the transmitter pulse positions(min
and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol inter­ference (both dependent on type/length of cable), and clock jitter (less than 250 ps).

(Figure 5)

(Figure 5 )

(Figure 5)

(Figure 13 )

(Figure 5 )

(Figure 5 )

(Figure 7 )

(Figure 10 )

CC

= 3.3V

f = 65 MHz 400 ps

15 T 50 ns

f = 65 MHz 5.0 7.6 9.0 ns

5.0 6.3 9.0 ns

4.5 7.3 ns

4.0 6.3 ns

(Figure 6 )

3.5 5.0 7.5 ns
10 ms

1µs

AC Timing Diagrams

FIGURE 1. “Worst Case” Test Pattern

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AC Timing Diagrams (Continued)

FIGURE 2. “16 Grayscale” Test Pattern (DS90CF384A)(Notes 5, 6, 7, 8)

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AC Timing Diagrams (Continued)

DS100870-3

FIGURE 3. “16 Grayscale” Test Pattern (DS90CF364A)(Notes 5, 6, 7, 8)

Note 5: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 6: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed

to produce groups of 16 vertical stripes across the display.

Note 7:

Figures 1, 3

Note 8: Recommended pin to signal mapping. Customer may choose to define differently.

show a falling edge data strobe (TxCLK IN/RxCLK OUT).

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FIGURE 4. DS90CF384A/DS90CF364A (Receiver) CMOS/TTL Output Load and Transition Times

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FIGURE 5. DS90CF384A/DS90CF364A (Receiver) Setup/Hold and High/Low Times

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