The DS90C383A/DS90CF383A transmitter converts 28 bits
of CMOS/TTL data into four LVDS (Low Voltage Differential
Signaling) data streams. A phase-locked transmit clock is
transmitted in parallel with the data streams over a fifth
LVDS link. Every cycle of the transmit clock 28 bits of input
data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD
timing and control data (FPLINE, FPFRAME, DRDY) are
transmitted at a rate of 455 Mbps per LVDS data channel.
Using a 65 MHz clock, the data throughput is 227 Mbytes/
sec. The DS90C383A transmitter can be programmed for
Rising edge strobe or Falling edge strobe through a dedicated pin. The DS90CF383A is fixed as a Falling edge
strobe transmitter. A Rising edge or Falling edge strobe
transmitter will interoperate with a Falling edge strobe Receiver (DS90CF384) without any translation logic.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
3.0 Block Diagrams
DS90C383A/DS90CF383A
2.0 Features
n 20 to 65 MHz shift clock support
n Rejects
n Best–in–Class Set & Hold Times on TxINPUTs
n Tx power consumption
n
n Tx Power-down mode
n ESD rating
n Supports VGA, SVGA, XGA and Dual Pixel SXGA.
n Narrow bus reduces cable size and cost
n Up to 1.8 Gbps throughput
n Up to 227 Megabytes/sec bandwidth
n 345 mV (typ) swing LVDS devices for low EMI
n PLL requires no external components
n Compatible with TIA/EIA-644 LVDS standard
n Low profile 56-lead TSSOP package
n Improved replacement for:
>
±
3ns Jitter from VGA chip with less than
225ps output Jitter
Grayscale
>
50%Less Power Dissipation than BiCMOS
Alternatives
SN75LVDS83 — DS90C383A
SN75LVDS81 — DS90CF383A
@
65MHz (TJCC)
<
130 mW (typ)@65MHz
<
>
7 kV (HBM),>500V (EIAJ)
200µW (max)
DS100100-1
Order Number DS90C383AMTD or DS90CF383AMTD
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CMOS/TTL Input Voltage−0.3V to (V
LVDS Driver Output Voltage−0.3V to (V
LVDS Output Short Circuit
DurationContinuous
Junction Temperature+150˚C
Storage Temperature−65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec)+260˚C
Maximum Package Power Dissipation Capacity
MTD56 (TSSOP) Package:
DS90C383A/DS90CF383A1.63 W
)−0.3V to +4V
CC
CC
CC
@
25˚C
+ 0.3V)
+ 0.3V)
Package Derating:
DS90C383A/DS90CF383A12.5 mW/˚C above +25˚C
ESD Rating
>
(HBM, 1.5 kΩ, 100 pF)
(EIAJ, 0Ω, 200 pF)
>
7kV
500V
5.0 Recommended Operating
Conditions
Supply Voltage (V
)3.03.33.6V
CC
Operating Free Air
Temperature (T
)−10+25+70˚C
A
Receiver Input Range02.4V
Supply Noise Voltage (V
TxCLKIN frequency1868MHz
Min Nom MaxUnits
)100mV
CC
PP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
CMOS/TTL DC SPECIFICATIONS
V
IH
V
IL
V
CL
I
IN
LVDS DC SPECIFICATIONS
V
OD
∆V
V
OS
∆V
I
OS
I
OZ
TRANSMITTER SUPPLY CURRENT
ICCTWTransmitter Supply Current
ICCTGTransmitter Supply Current
ICCTZTransmitter Supply Current
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise speci-
fied (except V
Note 4: V
High Level Input Voltage2.0V
Low Level Input VoltageGND0.8V
Input Clamp VoltageICL= −18 mA−0.79−1.5V
Input CurrentVIN= 0.4V, 2.5V or V
V
= GND−100µA
IN
CC
+1.8+10µA
Differential Output VoltageRL= 100Ω250345450mV
Change in VODbetween
OD
complimentary output states
Offset Voltage (Note 4)1.1251.251.375V
Change in VOSbetween
OS
complimentary output states
Output Short Circuit CurrentV
Output TRI-STATE®CurrentPower Down = 0V,
Worst Case
16 Grayscale
Power Down
= 0V, RL= 100Ω−3.5−5mA
OUT
V
=0VorV
OUT
R
= 100Ω,
L
= 5 pF,
C
L
Worst Case Pattern
CC
(Figures 1, 4)
R
= 100Ω,
L
= 5 pF,
C
L
16 Grayscale Pattern
(Figures 2, 4)
Power Down = Low
f = 32.5 MHz3143mA
f = 37.5 MHz3345mA
f = 65 MHz3952mA
f = 32.5 MHz2335mA
f = 37.5 MHz2840mA
f = 65 MHz3345mA
±
1
1055µA
Driver Outputs in TRI-STATE under
Power Down Mode
= 3.3V and TA= +25C.
CC
and ∆VOD).
OD
previously referred as VCM.
OS
CC
35mV
35mV
±
10µA
V
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Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
SymbolParameterMinTypMaxUnits
TCITTxCLK IN Transition Time
TCIPTxCLK IN Period
TCIHTxCLK IN High Time
TCILTxCLK IN Low Time
(Figure 6 )
(Figure 6 )
(Figure 6)
(Figure 5 )
14.7T55.6ns
0.35T0.5T 0.65Tns
0.35T0.5T 0.65Tns
5ns
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
SymbolParameterMinTypMaxUnits
LLHTLVDS Low-to-High Transition Time
LHLTLVDS High-to-Low Transition Time
TPPos0Transmitter Output Pulse Position for Bit 0
TPPos1Transmitter Output Pulse Position for Bit 11.902.202.40ns
TPPos2Transmitter Output Pulse Position for Bit 24.104.404.60ns
TPPos3Transmitter Output Pulse Position for Bit 36.306.606.80ns
TPPos4Transmitter Output Pulse Position for Bit 48.508.809.00ns
TPPos5Transmitter Output Pulse Position for Bit 510.70 11.00 11.20ns
TPPos6Transmitter Output Pulse Position for Bit 612.90 13.20 13.40ns
TPPos0Transmitter Output Pulse Position for Bit 0
TPPos1Transmitter Output Pulse Position for Bit 13.223.573.92ns
TPPos2Transmitter Output Pulse Position for Bit 26.797.147.49ns
TPPos3Transmitter Output Pulse Position for Bit 310.36 10.71 11.06ns
TPPos4Transmitter Output Pulse Position for Bit 413.93 14.28 14.63ns
TPPos5Transmitter Output Pulse Position for Bit 517.51 17.86 18.21ns
TPPos6Transmitter Output Pulse Position for Bit 621.08 21.43 21.78ns
TPPos0Transmitter Output Pulse Position for Bit 0
TPPos1Transmitter Output Pulse Position for Bit 14.004.404.80ns
TPPos2Transmitter Output Pulse Position for Bit 28.408.809.20ns
TPPos3Transmitter Output Pulse Position for Bit 312.80 13.20 13.60ns
TPPos4Transmitter Output Pulse Position for Bit 417.20 17.60 18.00ns
TPPos5Transmitter Output Pulse Position for Bit 521.60 22.00 22.40ns
TPPos6Transmitter Output Pulse Position for Bit 626.00 26.40 26.80ns
TSTCTxIN Setup to TxCLK IN
THTCTxIN Hold to TxCLK IN
TCCDTxCLK IN to TxCLK OUT Delay
TxCLK IN to TxCLK OUT Delay
TJCCTransmitter Jitter Cycle-to-Cycle
TPLLSTransmitter Phase Lock Loop Set
TPDDTransmitter Power Down Delay
Note 5: The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature ranges. This parameter is functionality tested only on Automatic Test Equipment (ATE).
Note 6: The Limits are based onstatistical analysis of the device performance over process, voltage, and temperature ranges.Output jitter is measured with a cycleto-cycle jitter of 3ns applied to the input clock signal. A jitter event of 3ns, represents worse case jump in the clock edge from most Graphics controller VGA chips
currently available. This parameter is used when calculating system margin (RSKM). See Figures 12, 13 and AN-1059.
Note 7: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 8: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 9:
Figures 1, 2
Note 10: Recommended pin to signal mapping. Customer may choose to define differently.
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show a falling edge data strobe (TxCLK IN/RxCLK OUT).
FIGURE 4. DS90C383A/DS90CF383A (Transmitter) LVDS Transition Times
FIGURE 5. DS90C383A/DS90CF383A (Transmitter) Input Clock Transition Time
DS100100-30
DS100100-6
DS100100-8
DS100100-10
FIGURE 6. DS90C383A/DS90CF383A (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
DS100100-12
FIGURE 7. DS90C383A/DS90CF383A (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)
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6.0 AC Timing Diagrams (Continued)
FIGURE 8. DS90C383A/DS90CF383A (Transmitter) Phase Lock Loop Set Time
DS100100-14
FIGURE 9. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs
FIGURE 10. Transmitter Power Down Delay
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DS100100-17
DS100100-18
6.0 AC Timing Diagrams (Continued)
FIGURE 11. Transmitter LVDS Output Pulse Position Measurement
DS100100-26
FIGURE 12. TJCC Test Setup
DS100100-27
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6.0 AC Timing Diagrams (Continued)
DS100100-28
FIGURE 13. Timing Diagram of the Input cycle-to-cycle clock jitter
7.0 DS90C383A Pin Description—FPD Link Transmitter
Pin NameI/ONo.Description
TxINI28TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines —FPLINE,
TxOUT+O4Positive LVDS differentiaI data output.
TxOUT−O4Negative LVDS differential data output.
FPSHIFT INI1TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
R_FBI1Programmable strobe select (See Table 1).
TxCLK OUT+O1Positive LVDS differential clock output.
TxCLK OUT−O1Negative LVDS differential clock output.
PWR DOWN
V
CC
I1TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at
I3Power supply pins for TTL inputs.
GNDI4Ground pins for TTL inputs.
PLL V
CC
I1Power supply pin for PLL.
PLL GNDI2Ground pins for PLL.
LVDS V
CC
I1Power supply pin for LVDS outputs.
LVDS GNDI3Ground pins for LVDS outputs.
FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable).
power down.
8.0 DS90CF383A Pin Description—FPD Link Transmitter
Pin NameI/ONo.Description
TxINI28TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines —FPLINE,
TxOUT+O4Positive LVDS differential data output.
TxOUT−O4Negative LVDS differential data output.
FPSHIFT INI1TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+O1Positive LVDS differential clock output.
TxCLK OUT−O1Negative LVDS differential clock output.
PWR DOWN
V
CC
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I1TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at
I4Power supply pins for TTL inputs.
FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable).
power down.
8.0 DS90CF383A Pin Description—FPD Link Transmitter (Continued)
Pin NameI/ONo.Description
GNDI4Ground pins for TTL inputs.
PLL V
CC
PLL GNDI2Ground pins for PLL.
LVDS V
CC
LVDS GNDI3Ground pins for LVDS outputs.
I1Power supply pin for PLL.
I1Power supply pin for LVDS outputs.
9.0 Applications Information
The DS90C383A/DS90CF383A are backward compatible
with the DS90C383/DS90CF383 and are a pin-for-pin replacement. The device (DS90C383A/DS90CF383A) utilizes
a different PLL architecture employing an internal 7X clock
for enhanced pulse position control.
This device (DS90C383A/DS90CF383A) also features reduced variation of the TCCD parameter which is important
for dual pixel applications. (See AN-1084) TCCD variation
has been measured to be less than 250ps at 65MHz under
normal operating conditions.
This device may also be used as a replacement for the
DS90CF583 (5V, 65MHz) and DS90CF581 (5V, 40MHz)
FPD-Link Transmitters withcertain considerations/
modifications:
1. Change 5V power supply to 3.3V. Provide this supply to
the V
, LVDS VCCand PLL VCCof the transmitter.
2. The DS90C383Atransmitter input and control inputs ac-
3. To implement a falling edge device for the DS90C383A,
CC
cept 3.3V TTL/CMOS levels. They are not 5V tolerant.
the R_FB pin (pin 17) may be tied to ground OR left unconnected (an internal pull-down resistor biases this pin
low). Biasing this pin to Vcc implements a rising edge
device.
10.0 Transmitter Clock Jitter Cycle-to-Cycle
Figures 12 and 13 illustrate the timing of the input clock relative to the input data. The input clock (TxCLKin) is intentionally shifted to the left −3ns and +3ns to the right when data
(Txin0-27) is high. This 3ns of cycle-to-cycle clock jitter is re-
peated at a period of 2µs, which is the period of the input
data (1µs high, 1µs low). At different operating frequencies
the N Cycle is changed to maintain the desired 3ns cycle-tocycle jitter at 2µs period.
56-Lead Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90C383AMTD, DS90CF383AMTD
NS Package Number MTD56
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
labeling, can be reasonably expected to result in a
significant injury to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.