DS90C2501
Transmitter with built-in scaler for LVDS Display
Interface (LDI)
DS90C2501 Transmitter with built-in scaler for LVDS Display Interface (LDI)
October 2003
General Description
The DS90C2501 is a highly integrated scaling IC with LVDS
transmitter with a scaled resolution up to SXGA+ for single
pixel input. The DS90C2501 is a video controller hub designed to be compatible with Graphic Memory Controller
Hub (GMCH). The input interface can be single or dual DVO
port (12 pin per port). The high quality cubic zoom engine
scales the input graphics into the desired/optimal output
resolution up to 1400x1050 resolution. Advanced video digital signal processing provides gamma correction, and dithering for the display output. A two-wire serial interface is
used to communicate with the host system. The dual high
speed LVDS channels supports single pixel in-single pixel
out, single pixel in-dual pixel out, and dual pixel in-dual pixel
out transmission modes. The DS90C2501 complies to Open
LDI standard, and can be paired up with DS90CF388 receiver or FPD8531x/FPD8731x series integrated timing controller or FPDLink LVDS receivers such as DS90CF364/
DS90CF384A/DS90CF384/DS90CF384A. The LVDS output
is similar to DS90C387 and DS90C387R. Thus, this transmitter can be paired up with DS90CF388, receiver of
112MHz LDI chipset or FPD-Link Receivers in non-DC Balance mode operation which provides GUI/LCD panel/mother
board vendors a wide choice of inter-operation with LVDS
based TFT panels.
This chip is an ideal solution to solve EMI and cable size
problems for high-resolution flat panel applications. It provides a reliable industry standard interface based on LVDS
technology that delivers the bandwidth needed for highresolution panels while maximizing bit times, and keeping
clock rates low to reduce EMI and shielding requirements.
For more details, please refer to the “Applications Information” section of this datasheet.
Features
n Complies with Open LDI and GMCH DVO specification
for digital display interfaces
n 25 to 65 MHz clock in single pixel in to single pixel out
operation.
n 50 to 130 MHz clock in single pixel in to dual pixel out
operation.
n Support 24bit/48bit color TFT LCD with Conventional
and Non-Conventional Color Mappings.
n Support 16bit/32bit color TFT LCD.
n Single pixel transmitter inputs support single pixel GUI
interface.
n Up scaling/panel fitting supports VGA to SXGA+ output
in single pixel input mode at 640x480
800x600
1400x1050
n Independent horizontal and vertical scaling.
n Support dithering (available for 6-bit color only),
programmable smoothing and anti-aliasing filter.
n Programmable digital sharpness, edge enhancement
and contrast control via gamma correction.
n Allow 2% at 200KHz spread spectrum clocking, rejects
cycle-to-cycle jitter (+/− 20% of input data bit time).
n Programmable LCD panel power sequencing.
n Support low voltage swing signal level (1V to 1.8V),
2.5V and 3.3V LVTTL level on CLKINP, CLKINM, D0 to
D23, DE, HSYNC and VSYNC pins
n Support 2.5V/3.3V LVTTL level on configuration pins
n Support 3.3V LVTTL level on GPIO pins
n Available in 10mm x 10mm x 1mm 128pin thermally
enhanced CSP package.
n Two-wire serial communication interface is active during
normal as well as power down mode and support data
rates up to 400KHz.
n TIA/EIA-644, Open LDI, DVO compliance.
@
60Hz, 1024x768@60Hz, 1280x1024@60Hz,
@
60Hz.
@
60Hz,
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DVO is a registered trademark of Intel Corporation.
AGP or 4x AGP is a registered trademark of Intel Corporation.
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
Supply Voltage (V
CMOS/TTL Input Voltage−0.3V to V
CMOS/TTL Output
Voltage−0.3V to (V
LVDS Driver Output
)−0.3V to +2.8V
CC
)−0.3V to +3.6V
CC3V
+ 0.3V)
CC
CC3V
Typical Package Power Dissipation Capacity
and Max V
CC
128 CSP Package:
DS90C25011.8W
Maximum Operating Case Temperature: 97˚C
(measured at top center of package)
ESD Rating:
DS90C2501
(HBM, 1.5kΩ, 100pF)
(EIAJ, 0Ω, 200pF)
@
>
>
70˚C
2kV
250 V
Voltage−0.3V to (VCC+ 0.3V)
LVDS Output Short
CircuitDurationContinuous
Junction Temperature+150˚C
Storage Temperature−65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec.)+260˚C
Recommended Operating
Conditions
Min Nom Max Units
All Supply Voltage except
)
(V
CC3V
V
Supply Voltage3.03.33.6V
CC3V
2.250 2.5 2.750V
Operating Free Air
Temperature (TA)0+25+70˚C
Supply Noise Voltage (V
)
CC
100 mV
P-P
up to 33Mhz
DC Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
LVCMOS/LVTTL DC SPECIFICATIONS (All input pins when operate in LVTTL level except DUAL pin. Note: On ID0, ID1
pins have typical 30K ohm internal pull-down, and ID2 and ID3 pins have typical 3K ohm internal pull-down.)
V
IH
V
IL
V
CL
I
IN
LVCMOS/LVTTL DC SPECIFICATIONS for DUAL pin, pin35
V
DUAL High Level Input Voltage (for
IH
DUAL High Level Input Voltage (for
V
IM
DUAL High Level Input Voltage (for
V
IL
V
CL
I
IN
LVCMOS/LVTTL DC SPECIFICATIONS for MSEN, pin 98
V
OL
LVCMOS/LVTTL DC SPECIFICATIONS (Pin 62 to pin 69 when operate in 3.3V LVTTL level)
V
OH
V
OL
I
OS
High Level Input VoltageV
Low Level Input VoltageV
REF=VCC3V
REF=VCC3V
2.0V
CC3V
-0.30.8V
Input Clamp VoltageICL= 18 mA-0.9-1.5V
Input CurrentVIN= 0.4V, or V
V
= GND−150µA
IN
PD=V
CC3V
CC
2.0V
+1.8+15µA
CC
dual pixel in to dual pixel
out).
PD=V
CC3V
1
⁄2VCC−0.1
1
⁄2V
1
CC
⁄2VCC+0.1V
single pixel in to dual pixel
out).
PD=V
CC3V
00.4V
single pixel in to single pixel
out).
Input Clamp VoltageICL= 18 mA-0.9-1.5V
Input CurrentVIN= 0.4V, V
V
= Gnd-150µA
IN
Low level Open Drain Output
IOL= 2 mA0.10.3V
CC
1.815µA
Voltage
High Level Input VoltageIOL= 2 mA2.22.95V
Low Level Input Voltage0.0550.4V
Output Short Circuit CurrentV
= 0V-50−120mA
OUT
V
V
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DC Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
DS90C2501
Low Voltage Level DC SPECIFICATIONS (pins D0 to D23, CLKINP, CLKINM, DE, HSYNC,VSYNC)
V
DDQ
V
ILSH
V
ILSL
V
REF
LVDS DRIVER DC SPECIFICATIONS (Output pins AnP, AnM, CLKnP and CLKnM)
V
OD
∆V
OD
V
OS
∆V
OS
I
OS
I
OZ
SUPPLY CURRENT
I
1Transmitter Supply Current
CC
2Transmitter Supply Current
I
CC
3Transmitter Supply Current
I
CC
4Transmitter Supply Current
I
CC
ICCTZTransmitter Supply Current
Low Swing Voltagefrom GMCH1+1.8V
Low Swing High Level Input
Voltage
Low Swing Low Level Input
Voltage
Differential Input Reference
V
REF
+
V
DDQ
100mV
0V
REF
100mV
0.475
1
⁄2V
DDQ
0.945V
Voltage
Differential Output VoltageRL= 100Ω250345450mV
Change in VODbetween
335mV
Complimentary Output
States
Offset Voltage1.1251.321.475V
Change in VOSbetween
1.535mV
Complimentary Output
States
Output Short Circuit CurrentV
Output TRI-STATE CurrentPD = 0V, V
when data input and clock
input are at Low Swing level.
when data input and clock
input are at Low Swing level.
when data input and clock
input are at Low Swing level.
= 0V0−8.5-15mA
OUT
OUT
= 100Ω,CL=
R
L
5 pF, DUAL pin
= GND, BAL =
GND, one 12bit
input, Pattern
Figure 1
= 100Ω,CL=
R
L
5 pF, DUAL pin
1
⁄2VCC, BAL =
=
GND, one 12bit
input, Pattern
Figure 1
= 100Ω,CL=
R
L
5 pF, DUAL pin
= GND, BAL =
=0VorV
CC
f = 65MHz,
scaler off, 2.75V
supply
f = 65 MHz,
scaler off, 3.6V
supply
f = 108MHz,
scaler off, 2.75V
supply
f = 108 MHz,
scaler off, 3.6V
supply.
f = 65 MHz,
scaler on, 2.75V
supply
±
0.1
70120mA
3890mA
85130mA
75130mA
330415mA
±
10µA
GND, one 12bit
input
when data input and clock
input are at Low Swing level.
Two-Wire Serial Communication Interface Switching Characteristics
Unless otherwise noted, below specifications apply for VCC3V pin = +3.3V, load capacitance on output lines = 80 pF. Load capacitance on output lines can be up to 400pF provided that external pull-up is on board. The following parameters are the timing relationship between SCL and SDA signals related to the DS90C2501.
SymbolParameterMinTypMaxUnits
t
1
t
2
t
3
t
4
t
5
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except V
Note 4: The limits are based on bench characterization of the device’s jitter response over the power supply voltage range. Output clock jitter is measured with a
cycle-to-cycle jitter of
calculating system margin as described in AN-1059.
Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account transmitter output pulse positions
(min and max) and the receiver input setup and hold time (internal data sampling window - RSPOS). This margin allows for LVDS interconnect skew, inter-symbol
interference (both dependent on type/length of cable) and clock jitter.
SDA Low Set-Up Time to SCL Low (Start Condition)100ns
SDA High Hold Time after SCL High (Stop Condition)100ns
= 2.5V and V
CC
and ∆VOD).
OD
±
20% data input bit time applied to the input clock signal while data inputs are switching (see figures 11 and 12). This parameter is used when
= 0V of CLK1P when EDGE pin = Gnd, DUAL pin = Gnd or VCCor1⁄2VCC, BAL pin= Gnd.
DIFF
= 3.3V at TA= +25˚C.
CC3V
2000
(Note 7)
µs
DS90C2501
AC Timing Diagrams
FIGURE 1. “Alternate High/Low” Test Pattern in 12-bit Input Mode (Note 8)
20004532
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AC Timing Diagrams (Continued)
DS90C2501
20004551
FIGURE 2. “16 Grayscale” Test Pattern in 12-bit Input Mode(Note 9)
Note 8: The “Alternate High/Low” test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 9: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
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AC Timing Diagrams (Continued)
FIGURE 3. DS90C2501 (Transmitter) LVDS Output Load and Transition Times
FIGURE 4. DS90C2501 (Transmitter) Input Clock Transition Time
DS90C2501
20004512
20004514
FIGURE 5. DS90C2501 (Transmitter) Input Clock High/Low Times
FIGURE 6. Setup/Hold Times, V
20004554
= 0.900V, EDGE = Gnd, DUAL = VCC, BAL = Gnd
REF
20004555
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AC Timing Diagrams (Continued)
DS90C2501
FIGURE 7. DS90C2501 (Transmitter) Phase Lock Loop Set Time
20004519
FIGURE 8. Transmitter Power Down Delay
FIGURE 9. Transmitter Input to Output Lantency
20004521
20004553
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AC Timing Diagrams (Continued)
DS90C2501
C —Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos —Transmitter output pulse position (min and max)
61I-LVTTL 2.5Active low RESET signal. Asserting RESETN will reset all internal logic and
S2CCLK72I-LVTTL3VThis is the clock line for the two-wire serial communication interface. Normally
S2CDAT71I/O-LVTTL3VThis is the data line for two-wire serial communication interface. A Pull-up
MSEN98O-LVTTL 2.5Interrupt signal. This is an open drain output, a pull-up resistor is required.
PD
99I-LVTTL 2.5Power Down Signal. A logic “0” will place the device in power down mode per
CLOCK
REFCLK118I-LVTTL3VReference clock, — A 3V, 14.318 MHz clock is required for internal control
DVO Port RGB input data
When DUAL pin = GND inputs D0–D11 correspond to LVDS ports A0–A3.
1
When DUAL pin =
⁄2VCC, 1st pixel from D0– D11 corresponds to LVDS ports
A0–A3, 2nd pixel from D0– D11 corresponds to LVDS ports A4–A7.
When DUAL pin = V
, 1st pixel from D0– D11 corresponds to LVDS ports
CC
A0–A3, 2nd pixel from D12– D23 corresponds to LVDS ports A4–A7.
Note: Ports refer to the corresponding differential LVDS pin pairs. The port A nomenclature should not
be confused with the serial interface slave address pins AO-A2.
Display Data Enable. When High, input pixel data is valid to DS90C2501
when R_FDE bit = High (default). See RFDE register field for more
information .
Display Horizontal Sync input control signal.
Display Vertical Sync input control signal.
“Positive” differential pixel clock input. A differential clock is recommended for
applications 65 MHz or higher.
“Minus” differential pixel clock input. A differential clock is recommended for
applications 65 MHz or higher.
clear the Host Interface registers.
a pull-up resistor is required in the system.
resistor is normally required in the system.
Please refer to MDI, RSEN, TSEL and MSEL register fields in Register Field
Definitions for more information. This signal requires support from host
software.
Table 1 below.
When maximum power savings is desired, the PD pin or soft power down bit
(Reg 08h bit 0) should be used to power down the DS90C2501.
LVDS outputs of the device will be in TRI-STATE.
Scaling engine will be powered down, and retain all register values.
PLL will be powered down.
All data input pads will be powered down. V
circuit is powered down. The
REF
two-wire serial communication interface remains active and all register
contents will be retained.
All GPIO pins will be disabled (tri-state if programmed as an output).
ENAVDD, ENABKL, PWM, VSTALL and HIRQ pins remain active and can be
accessed through the two-wire serial communication interface.
and timing. This clock must be stable when the DS90C2501 is powered-up.
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DS90C2501 Pin Description (Continued)
Pin NamePin No.I/O TypeDescription
OPTION SELECTION
BAL97I-LVTTL 2.5Tie this pin to GND.
DUAL35I-LVTTL 2.5LVTTL level input.
Input = GND for single pixel in-to-single pixel out mode. LVDS output
channels A0 to A3 are enabled, A4 to A7 are CLK2 are disable.
Input = V
to A7, CLK1 and CLK2 are enable. Use a 10K typ. pull-up resistor.
Input =
A0 to A7, CLK1 and CLK2 are enabled. See register CFG1 (08h) BPASS field
for more information.
See Figure 11 for example interface circuit.
COLOR34I-LVTTL 2.5LVTTL level input to select RGB to LVDS color mapping.
Tie to GND for 18-bit/36-bit LCD.
Tie to GND to select conventional color mapping for 24-bit/48-bit LCD.
Tie to Logic “1” to select non-conventional color mapping for 24-bit/48-bit
LCD.
A0, A1, A2115, 116,
117
I-LVTTL 2.5These are input pins to select the 2-wire Serial Communication Slave Device
Address Lower Bits.
EDGE36I-LVTTL 2.5Selects primary clock edge E1.
Tie to Logic “1” to select Rising edge for E1.
Tie to ground to select Falling edge for E1.
PANEL INTERFACE
A0P, A1P,
A2P, A3P
55, 53,
51, 47
O-LVDSPositive LVDS differential data output.
When DUAL pin = GND, input to D0–D11 will be coming out of A0P to A3P.
For 6-bit color application, no connect for channel A3P.
When DUAL pin =
of A0P to A3P, and the second pixel going in D0–D11 will come out of A4P to
A7P. For 6-bit color application, no connect for channels A3P and A7P.
When DUAL pin = V
A0P to A3P, the second pixel going in D12–D23 will be coming out of A4P to
A7P. For 6-bit color application, no connect for channels A3P and A7P.
A0M, A1M,
A2M, A3M
56, 54,
52, 48
O-LVDSNegative LVDS differential data output.
When DUAL pin = GND, input to D0–D11 will be coming out of A0M to A3M.
For 6-bit color application, no connect for channel A3M.
When DUAL pin =
of A0M to A3M, and the second pixel going in D0–D11 will come out of A4M
to A7M. For 6-bit color application, no connect for channels A3M and A7M.
When DUAL pin = V
A0M to A3M, the second pixel going in D12–D23 will be coming out of A4M
to A7M. For 6-bit color application, no connect for channels A3M and A7M.
A4P, A5P,
A6P, A7P
45, 43,
41, 39
O-LVDSPositive LVDS differential data output for second pixel.
When DUAL pin = GND, input to D0–D11 will be coming out of A0P to A3P.
For 6-bit color application, no connect for channel A3P.
When DUAL pin =
of A0P to A3P, and the second pixel going in D0–D11 will come out of A4P to
A7P. For 6-bit color application, no connect for channels A3P and A7P.
When DUAL pin = V
A0P to A3P, the second pixel going in D12–D23 will be coming out of A4P to
A7P. For 6-bit color application, no connect for channels A3P and A7P.
for dual pixel in-to-dual pixel out mode. LVDS output channel A0
CC
1
⁄2VCCfor single pixel in-to-dual pixel out mode. LVDS output channel
1
⁄2VCC, the first pixel going in D0–D11 will be coming out
, the first pixel going in D0–D11 will be coming out of
CC
1
⁄2VCC, the first pixel going in D0–D11 will be coming out
, the first pixel going in D0–D11 will be coming out of
CC
1
⁄2VCC, the first pixel going in D0–D11 will be coming out
, the first pixel going in D0–D11 will be coming out of
CLK2P37O-LVDSAdditional positive LVDS differential clock output pin. Identical to CLK1P. No
CLK2M38O-LVDSAdditional negative LVDS differential clock output pin. Identical to CLK1M. No
ID0, ID1, ID2,
ID3
ENAVDD69O-LVTTL 2.5Output to control LCD panel power under software control. Typically, this
ENABKL68O-LVTTL 2.5Output to control LCD panel back light power under software control.
MISCELLANEOUS/TEST
GPIO1,
GPIO2,
GPIO3
CLK_INV114I-LVTTL 2.5This pin is used to invert the polarity of the incoming pixel CLK
RES270I-LVTTL 2.5This pin is used in production testing and should be tied to GND in normal
RES3113I-LVTTL 2.5This pin is used in production testing and should be tied to GND in normal
RES4100I-LVTTL 2.5This pin is used in production testing and should be tied to GND in normal
PWM67O-LVTTL 3VThis signal was provided for legacy support and is no longer required. This
VSTALL66O-LVTTL 3VThis signal was provided for legacy support and is no longer required. This
HIRQ65O-LVTTL 3VThis signal was provided for legacy support and is no longer required. This
46, 44,
42, 40
O-LVDSNegative LVDS differential data output for second pixel.
When DUAL pin = GND, input to D0–D11 will be coming out of A0M to A3M.
For 6-bit color application, no connect for channel A3M.
1
When DUAL pin =
⁄2VCC, the first pixel going in D0–D11 will be coming out
of A0M to A3M, and the second pixel going in D0–D11 will come out of A4M
to A7M. For 6-bit color application, no connect for channels A3M and A7M.
When DUAL pin = V
, the first pixel going in D0–D11 will be coming out of
CC
A0M to A3M, the second pixel going in D12–D23 will be coming out of A4M
to A7M. For 6-bit color application, no connect for channels A3M and A7M.
connect if not used.
connect if not used.
57, 58,
59, 60
I-LVTTL 2.5These four pins are used to select one out of 16 pre-determined LCD display
timing information. The values are from 0 to 15. This function requires support
from VBIOS or display driver. Tie these pins to GND when not in use. Tie
these four pins [ID3, ID2, ID1, ID0] to High or Low for selecting LCD panel.
ID0 is the LSB, and ID3 is the MSB. For example: 1000 will select the 9th
LCD panel.
A 4-bit register field [3:0] will be used to store the selected value for the host
to read. See PANEL field for more information.
output is used with a power switch such as a FET circuit to control LCD panel
(Note 11).
V
CC
Typically, this output is used to control the enable on a backlight inverter
(Note 11).
64, 63, 62I/O-LVTTL 3VGeneral purpose inputs or outputs referenced to GND.
When the device is powered up, this pin defaults to an input.
When the scaler is in the power down state these signals are tri-state if
programmed as outputs (Note 11).
(CLKINP/CLKINM). A logic 0 = Normal, Logic 1 = Invert.
operation.
operation.
operation.
pin should be left open in normal operation.
pin should be left open in normal operation.
pin should be left open in normal operation.
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DS90C2501 Pin Description (Continued)
Pin NamePin No.I/O TypeDescription
OPTION SELECTION
V
REF
TST1, TST2,
TST3
POWER (See Application Information for power supply decoupling requirements)
V
/DV
CC
CC
GND/DGND33, 73,
3V121, 127PWRThe VCC3V is required for internal logic and certain 3V I/O.
V
CC
GND3V120, 126,
SPLLV
CC
SPLLGND86, 88, 90PWRGround returns for scaler PLL circuitry.
PLLV
CC
PLLGND91, 93, 95PWRGround returns for Tx PLL circuitry.
LVDSV
CC
LVDSGND104, 108PWRGround return pins for LVDS output drivers.
LVDSV
3V101, 103,
CC
LVDSGND3V102, 106,
Note 11: When device power is applied, it is possible for these outputs to switch to a logic “1” momentarily as the 3.3V is rising and before 2.5V reaches at least
0.8V. During this brief period, the pad control logic could be non-deterministic, RESETN will have no effect. It is recommended these outputs are gated externally
if the system design requires them to remain in the inactive logic “0” state during power-on.
83I-ANALOGThis pin is never to be left floating and never tie to GND.
For LVTTL level data input, tie V
to VCC3V. When V
REF
>
1.8V, input data
REF
is set to LVTTL level.
For low voltage swing level data input, tie V
host interface) V
is from the host. When V
DDQ
REF
to1⁄2V
DDQ(VDDQ
<
=1.0V, indicates input
REF
provided by
data is in low voltage swing mode.
Input data = logic High = V
Input data = logic Low = V
+100 mV in low voltage swing level.
REF
−100 mV in low voltage swing level.
REF
19, 20, 85I-LVTTL 2.5These pins are used in production testing and should be tied to GND in
normal operation.
81, 82,
75, 77,
PWRPower supply pins (pin 75, 77, 81, 82, 96, 119, 123, and 125) for 2.5V LVTTL
inputs and digital circuitry.
96, 119,
123, 125
PWRGND or DGND reference for 2.5V TTL inputs and digital circuitry.
74, 76,
78, 79,
80, 84,
118, 122,
124
During power up stage, voltage readings on these pins must be higher than
2.5V pins.
PWRGround return pins for V
3V powered logic.
CC
128
87, 89PWR2.5V power supply pins for scaler PLL circuitry. It is not recommended to
share this power with PLLV
.
CC
92, 94PWR2.5V power supply pins for Tx PLL circuitry. It is not recommended to share
this power with SPLLV
.
CC
105, 109PWRPower supply pins for LVDS output drivers.
PWR3V power supply pins for LVDS output drivers.
107, 111
During power up stage, voltage readings on these pins must be higher than
2.5V pins.
PWRGround return pins for 3V LVDS outputs.
110, 112
DS90C2501
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