National Semiconductor DS10BR254 Technical data
DS10BR254
1.5 Gbps 1:4 LVDS Repeater
DS10BR254 1.5 Gbps 1:4 LVDS Repeater
December 14, 2007
General Description
The DS10BR254 is a 1.5 Gbps 1:4 LVDS repeater optimized
for high-speed signal routing and distribution over FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and
noise immunity.
The device has two different LVDS input channels and a select pin determines which input is active. A loss-of-signal
) circuit monitors both input channels and a unique
(LOS
LOS pin is asserted when no signal is detected at that input.
Wide input common mode range allows the switch to accept
signals with LVDS, CML and LVPECL levels; the output levels
are LVDS. A very small package footprint requires a minimal
space on the board while the flow-through pinout allows easy
board layout. Each differential input and output is internally
terminated with a 100Ω resistor to lower device return losses,
reduce component count and further minimize board space.
Typical Application
Features
DC - 1.5 Gbps low jitter, low skew, low power operation
■
Wide Input Common Mode Voltage Range allows for DC-
■
coupled interface to LVDS, CML and LVPECL drivers
Redundant inputs
■
circuitry detects open inputs fault condition
LOS
■
Integrated 100Ω input and output terminations
■
8 kV ESD on LVDS I/O pins protects adjoining
■
components
Small 6 mm x 6 mm LLP-40 space saving package
■
Applications
Clock distribution
■
Clock and data buffering and muxing
■
OC-12 / STM-4
■
SD/HD SDI Routers
■
30007803
© 2007 National Semiconductor Corporation 300078 www.national.com
Ordering Code
NSID Function
DS10BR254TSQ 1:4 Repeater
DS10BR254
Block Diagram
Connection Diagram
DS10BR254 Pin Diagram
30007801
30007802
www.national.com 2
Pin Descriptions
DS10BR254
Pin Name Pin
Number
IN1+, IN1-,
IN2+, IN2-,
OUT0+, OUT0-,
OUT1+, OUT1-,
OUT2+, OUT2-,
OUT3+, OUT3-
SEL_in 14 I, LVCMOS This pin selects which LVDS input is active.
LOS1,
LOS2
PWDN0,
PWDN1,
PWDN2,
PWDN3
PWDN 38 I, LVCMOS Device power down pin. When the PWDN is set to L, the device
VDD 3, 8,
GND 16, DAP Power Ground pin and a pad (DAP - die attach pad).
NC 1, 2
4, 5,
6, 7,
29, 28,
27, 26,
24, 23,
22, 21
37,
36
35,
34
33,
32
15,25, 30
9, 10,
11, 12,
13, 17,
18, 19,
20, 31,
39, 40
I/O, Type Pin Description
I, LVDS Inverting and non-inverting high speed LVDS input pins.
O, LVDS Inverting and non-inverting high speed LVDS output pins.
O, LVCMOS Loss Of Signal output pins, LOSn report when an open input fault
condition is detected at the input, INn. These are open drain
outputs. External pull up resistors are required.
I, LVCMOS Channel output power down pin. When the PWDNn is set to L, the
channel output OUTn is in the power down mode.
is in the power down mode.
Power Power supply pins.
NC NO CONNECT pins. May be left floating.
3 www.national.com
Absolute Maximum Ratings (Note 4)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
DS10BR254
Supply Voltage −0.3V to +4V
LVCMOS Input Voltage −0.3V to (VCC + 0.3V)
LVCMOS Output Voltage −0.3V to (VCC + 0.3V)
LVDS Input Voltage −0.3V to +4V
LVDS Differential Input Voltage 0.0V to +1V
LVDS Output Voltage −0.3V to (VCC + 0.3V)
LVDS Differential Output Voltage 0.0V to +1V
LVDS Output Short Circuit Current
Duration
Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range
Soldering (4 sec.) +260°C
Maximum Package Power Dissipation at 25°C
SQA Package 4.65W
Derate SQA Package 37.2 mW/°C above +25°C
5 ms
Package Thermal Resistance
θ
θ
JA
JC
+26.9°C/W
+3.8°C/W
ESD Susceptibility
HBM (Note 1)
MM (Note 2)
CDM (Note 3)
Note 1: Human Body Model, applicable std. JESD22-A114C
Note 2: Machine Model, applicable std. JESD22-A115-A
Note 3: Field Induced Charge Device Model, applicable std.
JESD22-C101-C
Recommended Operating Conditions
Min Typ Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Receiver Differential Input
Voltage (VID)
Operating Free Air
Temperature (TA)
0 1 V
−40 +25 +85 °C
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (Notes 5, 6, 7)
Symbol Parameter Conditions Min Typ Max Units
LVCMOS DC SPECIFICATIONS
V
IH
V
IL
I
IH
I
IL
V
CL
V
OL
LVDS INPUT DC SPECIFICATIONS
V
ID
V
TH
V
TL
V
CMR
I
IN
C
IN
R
IN
High Level Input Voltage 2.0 V
DD
Low Level Input Voltage GND 0.8 V
High Level Input Current VIN = 3.6V
0 ±10
VCC = 3.6V
Low Level Input Current VIN = GND
0 ±10
VCC = 3.6V
Input Clamp Voltage ICL = −18 mA, VCC = 0V −0.9 −1.5 V
Low Level Output Voltage IOL= 4 mA 0.26 0.4 V
Input Differential Voltage 0 1 V
Differential Input High Threshold
Differential Input Low Threshold
VCM = +0.05V or VCC-0.05V
0 +100 mV
−100 0 mV
Common Mode Voltage Range VID = 100 mV 0.05 VCC -
0.05
Input Current
VIN = +3.6V or 0V
VCC = 3.6V or 0V
Input Capacitance Any LVDS Input Pin to GND
Input Termination Resistor Between IN+ and IN-
±1 ±10
1.7 pF
100
≥8 kV
≥250V
≥1250V
V
μA
μA
V
μA
Ω
www.national.com 4
Symbol Parameter Conditions Min Typ Max Units
LVDS OUTPUT DC SPECIFICATIONS
V
ΔV
V
ΔV
I
OS
C
R
OD
OS
OUT
OUT
Differential Output Voltage
Change in Magnitude of VOD for Complimentary
OD
Output States
Offset Voltage
Change in Magnitude of VOS for Complimentary
OS
Output States
RL = 100Ω
RL = 100Ω
250 350 450 mV
-35 35 mV
1.05 1.2 1.375 V
-35 35 mV
Output Short Circuit Current (Note 8) OUT to GND -35 -55 mA
OUT to V
CC
Output Capacitance Any LVDS Output Pin to GND
Output Termination Resistor Between OUT+ and OUT-
7 55 mA
1.2 pF
100
Ω
SUPPLY CURRENT
I
I
CC
CCZ
Supply Current PWDN = H 113 135 mA
Power Down Supply Current PWDN = L 50 60 mA
Note 4: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 5: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 6: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and
ΔVOD.
Note 7: Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of
product characterization and are not guaranteed.
Note 8: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
DS10BR254
5 www.national.com
Loading...