The COP404C ROMless Microcontroller is a member of the
TM
COPS
family, fabricated using double-poly, silicon gate
CMOS (microCMOS) technology. The COP404C contains
CPU, RAM, I/O and is identical to a COP444C device except the ROM has been removed and pins have been added to output the ROM address and to input the ROM data.
The COP404C can be configured, by means of external
pins, to function as a COP444C, a COP424C, or a
COP410C. Pins have been added to allow the user to select
the various functional options that are available on the family of mask-programmed CMOS parts. The COP404C is primarily intended for use in the development and debug of a
COP program for the COP444C/445C, COP424C/425C,
and COP410C/411C devices prior to masking the final part.
The COP404C is also appropriate in low volume applications or when the program might be changing.
MICROBUSTMand MICROWIRETMare trademarks of National Semiconductor Corporation.
TRI-STATE
is a registered trademark of National Semiconductor Corporation.
É
Block Diagram
Features
Y
Accurate emulation of the COP444C, COP424C and
COP410C
Y
Lowest Power Dissipation (50 mW typical)
Y
Fully static (can turn off the clock)
Y
Power saving IDLE state and HALT mode
Y
4 ms instruction time, plus software selectable clocks
Y
128c4 RAM, addresses 2kc8 ROM
Y
True vectored interrupt, plus restart
Y
Three-level subroutine stack
Y
Single supply operation (2.4V to 5.5V)
Y
Programmable read/write 8-bit timer/event counter
Y
Internal binary counter register with MICROWIRE
serial I/O capability
Y
General purpose and TRI-STATEÉoutputs
Y
LSTTL/CMOS compatible
Y
MICROBUSTMcompatible
Y
Software/hardware compatible with other members of
the COP400 family
TM
TL/DD/5530– 1
FIGURE 1. Block Diagram
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/DD/5530
Absolute Maximum Ratings
Supply Voltage6V
Voltage at any pin
Total Allowable Source Current25 mA
Total Allowable Sink Current25 mA
b
0.3V to V
CC
a
0.3V
Operating temperature range0§toa70§C
Storage temperature range
b
65§Ctoa150§C
Lead temperature (soldering, 10 sec.)300§C
DC Electrical Characteristics 0
s
CsT
70§C unless otherwise specified
§
a
ParameterConditionsMinMaxUnits
Operating Voltage2.45.5V
Power Supply Ripplepeak to peak0.1 V
(Notes 4, 5)
Supply CurrentV
(Note 1)V
HALT Mode CurrentV
(Note 2)V
e
CC
e
CC
e
V
CC
(T
is instruction cycle time)
c
e
CC
e
CC
2.4V, t
5.0V, t
5.0V, t
5.0V, F
2.4V, F
e
64 ms120mA
c
e
16 ms700mA
c
e
4 ms3000mA
c
e
IN
e
IN
0 kHz, T
0 kHz, T
e
25§C20mA
A
e
25§C6mA
A
CC
V
Input Voltage Levels
RESET
, D0 (clock input)
CKI
Logic High0.9 V
Logic Low0.1 V
CC
All other inputs (Note 7)
Logic High0.7 V
Logic Low0.2 V
CC
CC
CC
V
V
V
V
Input Pull-up
currentV
Hi-Z input leakage
CC
e
4.5V, V
e
030330mA
IN
b
1
a
1mA
Input capacitance7pF
(Note 4)
Output Voltage LevelsStandard outputs
LSTTL OperationV
Logic HighI
Logic LowI
CMOS Operation
Logic HighI
Logic LowI
e
5.0Vg10%
CC
eb
100 mA2.7V
OH
e
400 mA0.4V
OL
eb
10 mAV
OH
e
10 mA0.2V
OL
b
0.2V
CC
Output current levels
Sink (Note 6)V
Source (Standard option)V
Source (Low current option)V
e
4.5V, V
CC
e
V
2.4V, V
CC
e
4.5V, V
CC
e
V
2.4V, V
CC
e
4.5V, V
CC
e
V
2.4V, V
CC
e
V
OUT
CC
e
V
OUT
CC
e
0V0.5mA
OUT
e
0V0.1mA
OUT
e
0V30330mA
OUT
e
0V680mA
OUT
1.2mA
0.2mA
Allowable Sink/Source current per pin5mA
(Note 6)
Allowable Loading on CKOH100pF
Current needed to over-ride HALT
(Note 3)
To continueV
To haltV
CC
CC
e
e
TRI-STATE leakage current
Note: Absolute maximum ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications are not ensured when
operating the device at absolute maximum ratings.
4.5V, V
4.5V, V
e
2V
IN
CC
e
7V
IN
CC
b
2.5
.7mA
1.6mA
a
2.5mA
2
COP404C
s
AC Electrical Characteristics
0§CsT
ParameterConditionsMinMaxUnits
Instruction CycleV
)4.5VlV
Time (t
c
Operating CKIV
Frequency4.5V
Duty Cycle (Note 4)f
Rise Time (Note 4)f
Fall Time (Note 4)40ns
Instruction CycleRe30k, V
Time using D0 as aC
RC Oscillator DualClock Input (Note 4)
INPUTS: (See
t
SETUP
t
HOLD
OUTPUT
PROPAGATION DELAYV
IP7±IP0, A10 ±A8, SKIP
t
PD1,tPD0
AD/DATA
t
PD1,tPD0
ALL OTHER OUTPUTS
t
PD1
MICROBUS TIMINGC
Read Operation (
Chip select stable before RDbt
Chip select hold time for RDbt
RD pulse widthbt
Data delay from RDbt
Fig. 3
)
,t
PD0
Fig. 4
)
CSR
RCS
RR
RD
CC
CC
e
1
e
1
e
G InputsTc/4a.7ms
SI Input
IP Input1.0ms
All Others
V
CC
4.5V
OUT
V
CC
4.5VlV
V
CC
4.5V
V
CC
4.5V
e
L
RD to data floatingbtDF(Note 4)250ns
Write Operation (
Chip select stable before WRbt
Chip select hold time for WRbt
WR pulse widthbt
Data set-up time for WRbt
Data hold time for WRbt
INTR transition time from WRbt
Note 1: Supply current is measured after running for 2000 cycle times with a square-wave clock on CKI and all other pins pulled up to VCCwith 20k resistors. See
current drain equation on page 16.
Note 2: Test conditions: All inputs tied to V
Note 3: When forcing HALT, current is only needed for a short time (approx. 200 ns) to flip the HALT flip-flop.
Note 4: This parameter is only sampled and not 100% tested. Variation due to the device included.
Note 5: Voltage change must be less than 0.1 V
Note 6: SO output sink current must be limited to keep V
Note 7: MB
Fig. 5
)
CSW
WCS
WW
DW
WD
WI
; L lines in TRI-STATE mode and tied to Ground; all outputs tied to Ground.
CC
ina1msperiod.
CC
less than 0.2 VCCto prevent entering test mode.
, TIN, DUAL, SEL10, SEL20, input levels at VCCor VSS.
OL
70§C unless otherwise specified
A
t
4.5V4DCms
t
2.4V16DCms
CC
t
4.5VDC1.0MHz
t
l
V
2.4VDC250kHz
CC
4 MHz4060%
4 MHz external clock60ns
e
5V
CC
82 pF816m s
t
V
4.5V
CC
*1.7m s
t
4.5V0.25ms
t
l
V
2.4V1.0m s
CC
e
t
4.5V1.94ms
t
4.5V375ns
l
l
4.5V1.0ms
l
50 pF, V
e
1.5V, C
CC
V
CC
V
CC
100 pF, R
L
t
2.4V7.75ms
t
2.4V1.5ms
t
2.4V4.0ms
e
5Vg5%
CC
e
5K
L
0.3ms
65ns
20ns
400ns
375ns
65ns
20ns
400ns
320ns
100ns
700ns
3
Connection Diagram
Dual-In-Line Package
Order Number COP404CN
See NS Package Number N48A
TL/DD/5530– 2
Pin Descriptions
PinDescription
V
CC
V
SS
CKIClock input
RS
CKOIGeneral purpose input
L0±L78 TRI-STATE I/O
G0±G34 general purpose I/O
D1±D33 general purpose outputs
D0Either general purpose output
IN0±IN34 general purpose inputs
SOSerial data output
SISerial data input
SKSerial data clock output
IP0±IP7I/O for ROM address and data
A8, A9, A103 address outputs
SKIPSkip status output
AD/DATA
MB
CKOHHalt I/O pin
DUAL
TIN
SEL10
SEL20
UNUSEDGround
FIGURE 2
Most positive voltage
Ground
Reset input
or Dual-Clock RC input
Clock output
MICROBUS select input
Dual-Clock select input
Timer input select pin (should be
connected to GND)
COP410C emulation select input
COP424C emulation select input
Figure 1
The internal architecture is shown in
are illustrated in simplified form to depict how the various
logic elements communicate with each other in implementing the instruction set of the device. Positive logic is used.
When a bit is set, it is a logic ‘‘1’’, when a bit is reset, it is a
logic ‘‘0’’.
PROGRAM MEMORY
Program Memory consists of a 2048-byte external memory
(typically PROM). Words of this memory may be program
instructions, constants or ROM addressing data.
ROM addressing is accomplished by a 11-bit PC register
which selects one of the 8-bit words contained in ROM. A
new address is loaded into the PC register during each instruction cycle. Unless the instruction is a transfer of control
instruction, the PC register is loaded with the next sequential 11-bit binary count value.
Three levels of subroutine nesting are implemented by a
three level deep stack. Each subroutine call or interrupt
. Data paths
pushes the next PC address into the stack. Each return
pops the stack back into the PC register.
DATA MEMORY
Data memory consists of a 512-bit RAM, organized as 8
data registers of 16
mented by a 7-bit B register whose upper 3 bits (B
of 8 data registers and lower 4 bits (B
digits in the selected data register. While the 4-bit contents
of the selected RAM digit (M) are usually loaded into or
from, or exchanged with, the A register (accumulator), it
may also be loaded into or from the Q latches or T counter
or loaded from the L ports. RAM addressing may also be
performed directly by the LDD and XAD instructions based
upon the immediate operand field of these instructions. The
B
register also serves as a source register for 4-bit data
d
sent directly to the D outputs.
4
c
4-bit digits. RAM addressing is imple-
) select 1 of 16 4-bit
d
) select 1
r
Timing Diagrams
FIGURE 3. Input/Output Timing
FIGURE 4. MICROBUS Read Operation Timing
TL/DD/5530– 3
TL/DD/5530– 4
FIGURE 5. MICROBUS Write Operation Timing
5
TL/DD/5530– 5
Functional Description
INTERNAL LOGIC
The processor contains its own 4-bit A register (accumulator) which is the source and destination register for most
I/O, arithmetic, logic, and data memory access operations.
It can also be used to load the B
register, to load and input 4 bits of the 8-bit Q latch or T
counter, L I/O ports data, to input 4-bit G, or IN ports, and to
perform data exchanges with the SIO register.
A 4-bit adder performs the arithmetic and logic functions,
storing the results in A. It also outputs a carry bit to the 1-bit
C register, most often employed to indicate arithmetic overflow. The C register in conjunction with the XAS instruction
and the EN register, also serves to control the SK output.
The 8-bit T counter is a binary up counter which can be
loaded to and from M and A using CAMT and CTMA instructions. This counter is operated as a time-base counter.
When the T counter overflows, an overflow flag will be set
(see SKT and IT instructions below). The T counter is
cleared on reset. A functional block diagram of the timer/
counter is illustrated in
Figure 10a
Four general-purpose inputs, IN3 –IN0, are provided. IN1,
IN2 and IN3 may be selected (by pulling MB
Read Strobe, Chip Select, and Write Strobe inputs, respectively, for use in MICROBUS application.
The D register provides 4 general-purpose outputs and is
used as the destination register for the 4-bit contents of B
In the dual clock mode, D0 latch controls the clock selection
(see dual oscillator below).
The G register contents are outputs to a 4-bit general-purpose bidirectional I/O port. G0 may be selected as an output for MICROBUS applications.
The Q register is an internal, latched, 8-bit register, used to
hold data loaded to or from M and A, as well as 8-bit data
from ROM. Its contents are outputted to the L I/O ports
when the L drivers are enabled under program control. With
the MICROBUS option selected, Q can also be loaded with
the 8-bit contents of the L I/O ports upon the occurrence of
a write strobe from the host CPU.
The 8 L drivers, when enabled, output the contents of
latched Q data to the L I/O port. Also, the contents of L may
be read directly into A and M. As explained above, the MICROBUS option allows L I/O port data to be latched into
the Q register.
The SIO register functions as a 4-bit serial-in/serial-out shift
register for MICROWIRE
as a binary counter (depending on the contents of the EN
register). Its contents can be exchanged with A.
The XAS instruction copies C into the SKL latch. In the
counter mode, SK is the output SKL; in the shift register
mode, SK outputs SKL ANDed with the clock.
and Bdportions of the B
r
.
pin low) as
TM
I/O and COPS peripherals, or
EN is an internal 4-bit register loaded by the LEI instruction.
The state of each bit of this register selects or deselects the
particular feature associated with each bit of the EN register:
0. The least significant bit of the enable register, EN0, selects the SIO register as either a 4-bit shift register or a 4bit binary counter. With EN0 set, SIO is an asynchronous
binary counter, decrementing its value by one upon each
low-going pulse (‘‘1’’ to ‘‘0’’) occurring on the SI input.
Each pulse must be at least two instruction cycles wide.
SK outputs the value of SKL. The SO output equals the
value of EN3. With EN0 reset, SIO is a serial shift register
left shifting 1 bit each instruction cycle time. The data
present at SI goes into the least significant bit of SIO. SO
can be enabled to output the most significant bit of SIO
each cycle time. The SK outputs SKL ANDed with the
instruction cycle clock.
1. With EN1 set, interrupt is enabled. Immediately following
an interrupt, EN1 is reset to disable further interrupts.
2. With EN2 set, the L drivers are enabled to output the data
in Q to the L I/O port. Resetting EN2 disables the L drivers, placing the L I/O port in a high-impedance input
state.
3. EN3, in conjunction with EN0, affects the SO output. With
EN0 set (binary counter option selected) SO will output
.
d
the value loaded into EN3. With EN0 reset (serial shift
register option selected), setting EN3 enables SO as the
output of the SIO shift register, outputting serial shifted
data each instruction time. Resetting EN3 with the serial
shift register option selected disables SO as the shift register output; data continues to be shifted through SIO and
can be exchanged with A via an XAS instruction but SO
remains set to ‘‘0’’.
INTERRUPT
The following features are associated with interrupt procedure and protocol and must be considered by the programmer when utilizing interrupts.
a. The interrupt, once recognized as explained below,
pushes the next sequential program counter address
a
(PC
1) onto the stack. Any previous contents at the bottom of the stack are lost. The program counter is set to
hex address 0FF (the last word of page 3) and EN1 is
reset.
b. An interrupt will be recognized only on the following con-
ditions:
1. EN1 has been set.
2. A low-going pulse (‘‘1’’ to ‘‘0’’) at least two instruction
cycles wide has occurred on the IN1 input.
3. A currently executing instruction has been completed.
TABLE I. ENABLE REGISTER MODES Ð BITS EN0 AND EN3
EN0EN3SIOSISOSK
00Shift RegisterInput to Shift0If SKLe1, SKeclock
e
01Shift RegisterInput to ShiftSerialIf SKL
RegisterIf SKL
RegisteroutIf SKL
10Binary CounterInput to Counter0SK
11Binary CounterInput to Counter1SK
0, SKe0
e
1, SKeclock
e
0, SKe0
e
SKL
e
SKL
6
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