ADC0819 8-Bit Serial I/O A/D Converter
with 19-Channel Multiplexer
General Description
The ADC0819 is an 8-Bit successive approximation A/D
converter with simultaneous serial I/O. The serial input controls an analog multiplexer which selects from 19 input
channels or an internal half scale test voltage.
An input sample-and-hold is implemented by a capacitive
reference ladder and sampled data comparator. This allows
the input signal to vary during the conversion cycle.
Separate serial I/O and conversion clock inputs are provided to facilitate the interface to various microprocessors.
Features
Y
Separate asynchronous converter clock and serial data
I/O clock.
Y
19-Channel multiplexer with 5-Bit serial address logic.
Y
Built-in sample and hold function.
December 1994
Y
Ratiometric or absolute voltage referencing.
Y
No zero or full-scale adjust required.
Y
Internally addressable test voltage.
Y
0V to 5V input range with single 5V power supply.
Y
TTL/MOS input/output compatible.
Y
28-pin molded chip carrier or 28-pin molded DIP
Key Specifications
Y
Resolution8-Bits
Y
Total unadjusted error
Y
Single supply5V
Y
Low Power15 mW
Y
Conversion Time16 ms
g
(/2LSB andg1LSB
ADC0819 8-Bit Serial I/O A/D Converter with 19-Channel Multiplexer
DC
Connection Diagrams
Molded Chip Carrier (PCC) Package
TL/H/9287– 1
Top View
Order Number ADC0819BCV, CCV
See NS Package Number V28A
Dual-In-Line Package
TL/H/9287– 20
Top View
Order Number ADC0819BCN, CIN
See NS Package Number N28B
Functional Diagram
TL/H/9287– 2
C
1995 National Semiconductor CorporationRRD-B30M115/Printed in U. S. A.
TL/H/9287
Absolute Maximum Ratings (Notes1&2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
Voltage
Inputs and Outputs
Input Current Per Pin (Note 3)
Total Package Input Current (Note 3)
Storage Temperature
Package Dissipation at T
)6.5V
CC
b
0.3V to V
CC
b
e
25§C875 mW
A
65§Ctoa150§C
a
g
g
0.3V
5mA
20mA
Lead Temperature (Soldering, 10 sec.)
Dual-In-Line Package (Plastic)260
Surface Mount Package
TC, Conversion Process TimeMIN Not Including MUX2626w2cycles
Addressing and
Analog Input
MAX
Sampling Times
t
, Access Time Delay From CSMIN1w2cycles
ACC
3232
Falling Edge to DO Data ValidMAX3
t
, Minimum Set-up Time of CS Falling
SET-UP
Edge to S
t
,CSHold Time After the Falling
HCS
Edge of S
CLK
Rising Edge
CLK
tCS, Total CS Low TimeMINt
MAXtCS(min)a26/w
t
, Minimum DI Hold Time from
HDI
t
HDO
t
SDI
t
DDO
t
TRI
Rising Edge
S
CLK
, Minimum DO Hold Time from S
Falling EdgeC
, Minimum DI Set-up Time to S
Rising Edge
, Maximum Delay From S
Falling Edge to DO Data ValidC
CLK
CLK
CLK
, Maximum DO Hold Time,R
Rising edge to DO TRI-STATE)C
(CS
e
R
30k,
L
e
100 pF
L
e
R
30k,
L
e
100 pF
L
e
3k,
L
e
100 pF
L
00ns
200400ns
180200250ns
90150150ns
4/w
set-up
2CLK
1
a
2S
CLK
sec
0ns
a
8/S
CLK
2CLK
sec
sec
10ns
3
Electrical Characteristics The following specifications apply for V
otherwise specified. Boldface limits apply from T
ParameterConditions
MIN
to T
MAX
; all other limits T
Typical
(Note 6)
5V, t
CC
e
A
r
e
T
25§C.
J
TestedDesign
LimitLimitUnits
(Note 7)(Note 8)
e
t
f
20 ns, V
REF
e
5V, unless
e
e
AC CHARACTERISTICS (Continued)
tCA, AnalogAfter Address Is Latched
e
Sampling TimeCS
t
, Maximum DOR
RDO
Rise TimeC
t
, Maximum DOR
FDO
Fall TimeC
Low
e
30 kX,‘‘TRI-STATE’’ to ‘‘HIGH’’ State75150150
L
e
100 pf‘‘LOW’’ to ‘‘HIGH’’ State150300300
L
e
30 kX,‘‘TRI-STATE’’ to ‘‘LOW’’ State75150150
L
e
100 pf‘‘HIGH’’ to ‘‘LOW’’ State150300300
L
CIN, Maximum InputAnalog Inputs, ANO–AN10 and V
REF
1155
3/S
CLK
a
1 mssec
CapacitanceAll Others515
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its specified operating conditions.
Note 2: All voltages are measured with respect to ground.
Note 3: Under over voltage conditions (V
a
.3V the total package current must be limited to 20 mA. For example the maximum number of pins that can be over driven at the maximum current level of
V
CC
g
5 mA is four.
Note 4: Total unadjusted error includes offset, full-scale, linearity, multiplexer, and hold step errors.
Note 5: Two on-chip diodes are tied to each analog input, which will forward-conduct for analog input voltages one diode drop below ground or one diode drop
greater than V
elevated temperatures, and cause errors for analog inputs near full-scale. The spec allows 50 mV forward bias of either diode. This means that as long as the
analog V
therefore require a minimum supply voltage of 4.950 V
Note 6: Typicals are at 25
Note 7: Tested Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Design Limits are guaranteed, but not 100% production tested. These limits are not used to calculate outgoing quality levels.
Note 9: Channel leakage current is measured after the channel selection.
Note 10: 1 count
Note 11: Human body model; 100 pF discharged through a 1.5 kX resistor.
supply. Be careful during testing at low VCClevels (4.5V), as high level analog inputs (5V) can cause this input diode to conduct, especially at
CC
does not exceed the supply voltage by more than 50 mV, the output code will be correct. To achieve an absolute 0 VDCto5VDCinput voltage range will
IN
C and represent most likely parametric norm.
§
e
V
/256.
REF
k
IN
0V and V
l
VCC) the maximum input current at any one pin isg5 mA. If the voltage at more than one pin exceeds
IN
over temperature variations, initial tolerance and loading.
DC
ns
ns
pF
Test Circuits
Leakage Current
t
‘‘TRI-STATE’’
TRI
D0 Except ‘‘TRI-STATE’’
TL/H/9287– 4
TL/H/9287– 3
Timing Diagrams
D0 ‘‘TRI-STATE’’ Rise & Fall Times
TL/H/9287– 6
TL/H/9287– 5
4
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