Nanotron Technologies NANOPAN5375V1 UserMan
FCC Required Exhibit 12
nanoPAN 5375 RF Module
User Manual (UserMan)
Version 1.0
NA-09-0256-0008-1.0
FCC ID: SIFNANOPAN5375V1
Document Information
nanoPAN 5375 RF Module User Manual (UserMan)
Document Information
Document Title: nanoPAN 5375 RF Module User Manual (UserMan)
Document Version: 1.0
Published (yyyy-mm-dd): 2009-03-18
Current Printing: 2009-3-18, 11:52 am
Document ID: NA-09-0256-0008-1.0
Document Status: Released
Disclaimer
Nanotron Technologies GmbH believes the information contained herein is correct and accurate at the time of release. Nanotron
Technologies GmbH reserves the right to make changes without further notice to the product to improve reliability, function or
design. Nanotron Technologies GmbH does not assume any liability or responsibility arising out of this product, as well as any
application or circuits described herein, neither does it convey any license under its patent rights.
As far as possible, significant changes to product specifications and functionality will be provided in product specific Errata
sheets, or in new versions of this document. Customers are encouraged to check the Nanotron website for the most recent
updates on products.
Trademarks
©
nanoNET
names are the sole property of their respective owners.
This document and the information contained herein is the subject of copyright and intellectual property rights under international
convention. All rights reserv ed. No part of this documen t may be reproduced, stored in a retrieval system, or transmitted in any
form by any means, electronic, mechanical or optical, in whole or in part, without the prior written permission of Nanotron
Technologies GmbH.
Copyright © 2009 Nanotron Technologies GmbH.
is a registered trademark of Nanotron Technologies GmbH. All other trademarks, registered trademarks, and product
Life Support Policy
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury.
Nanotron Technologies GmbH customers using or selling
these products for use in such applications do so at their own
risk and agree to fully indemnify Nanotron Technologies
GmbH for any damages resulting from such improper use or
sale.
Electromagnetic Interference / Compatibility
Nearly every electronic device is susceptible to electromagnetic interference (EMI) if inadequately shielded, designed, or
otherwise configured for electromagnetic compatibility.
To avoid electromagnetic interference and/or compatibility
conflicts, do not use this device in any facility where posted
FCC User Information
Statement according to FCC part 15.19:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must
accept any interference received, including interference that
may cause undesired operation.
Statement according to FCC part 15.21:
Modifications not expressly approved by this company could
void the user's authority to operate the equipment.
RF exposure mobil:
The internal / external antennas used for this mobile transmitter must provide a separation distance of at least 20 cm from
all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.”
Statement according to FCC part 15.105:
This equipment has been tested and found to comply with the
limits for a Class A and Class B digit al devi ce, pursuan t to Part
15 of the FCC Rules. These limits are designed to provide
notices instruct you to do so. In aircraft, use of any radio frequency devices must be in accordance with applicable regulations. Hospitals or health care facilities may be using
equipment that is sensitive to external RF energy.
With medical devices, maintain a minimum separation of 15
cm (6 inches) between pacemakers and wireless devices and
some wireless radios may interfere with some hearing aids. If
other personal medical devices are being used in the vicinity
of wireless devices, ensure that the device has been adequately shielded from RF energy. In a domestic environment
this product may cause radio interference in which case the
user may be required to take adequate measures.
CAUTION! Electrostatic Sensitive Device. Precaution should be used when handling the
device in order to prevent permanent damage.
reasonable protection against harmful interference in a residential installation and against harmful interference when the
equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions as provided in the user manual, may
cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his
or her own expense.
If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and
receiver.
• Connect the equipment into an outlet on a circuit different
from that to connected.
• Consult the dealer or an experienced technician for help.
Page ii NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.
Table of Contents
nanoPAN 5375 RF Module User Manual (UserMan)
Table of Contents
1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Key Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 General / DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2 RF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3 Offset Clock Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3.1 Nominal Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.4 Digital Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 Overview – I
4.2 Power Down Pad / Power Down Full . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3 P
4.4 I
4.5 I
as a Function of Tx Register (Typical). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
out
as a Function of P
cc
as a Function of Tx Register (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
cc
5 Module Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 Pin Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1 Recommended Temperature Profile for Lead Free Reflow Soldering . . . . . . . . . . . . . . . . . . . . . 11
6.2 Footprint and Recommended Landing Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 nanoPAN 5375 RF Test Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.2 PCB Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
cc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
(Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
out
© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1
List of Tables
nanoPAN 5375 RF Module User Manual (UserMan)
Intentionally Left Blank
Page 2 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.
1 Overview
The nanoPAN 5375 Module integrates all the required components for a complete RF module
based on Nanotron’s innovative nanoLOC TRX Transceiver. At only 29 mm by 15 mm and less
than 4 mm thick, this RF module includes a balun, a band pass filter, a set of clock crystals, a 20
dBm power amplifier, as well as the nanoLOC chip and required circuitry . Figure 1 below shows the
nanoPAN 5375 RF Module with a shielding cap and label.
Scale 3:1
nanoPAN 5375 RF Module User Manual (UserMan)
Figure 1: nanoPAN 5375 RF Module – top showing shielding cap
Overview
1
Figure 2 below shows the pad side of the nanoPAN 5375 RF Module with pins 1 and 32 indicated,
as well as dimensions.
Scale 3:1
15.0 mm
1.1 Key Components
Figure 3 below shows the key components of the nanoPAN 5375 RF Module.
Scale 3:1
29.0 mm
Figure 2: nanoPAN 5375 RF Module – pad side
32 kHz crystal
Balun
RF Switch
Pin 32
Pin 1
32 MHz crystal
nanoLOC chip
Figure 3: nanoPAN 5375 RF Module – key components
© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 1
Power amplifier
Band pass filter
Overview
1
nanoPAN 5375 RF Module User Manual (UserMan)
Component Description
The nanoLOC chip supports a freely adjustable center frequency with two sets of 3
non-overlapping frequency channels, as well as 14 overlapping frequency channels,
all within the 2.4 GHz ISM band. These channels provide support for multiple physically independent networks and improved coexistence performance with existing 2.4
GHz wireless technologies. Data rates are selectable from 2 Mbps to 250 kbps.
Due to the chip’s unique chirp pulse, adjustment of the antenna is not critical. This significantly simplifies the system’s installation and maintenance (“pick and place”).
A sophisticated MAC controller with CSMA/CA and TDMA support is included, as is
nanoLOC TRX
Transceiver
Matching circuits
(Balun)
ISM band pass
filter
32.768 kHz and
32 MHz quartz
crystals
RF switch
Power amplifier
Forward Error Correction (FEC) and 128 bit hardware encryption. To minimize software and microcontroller requirements, the nanoLOC chip also provides scrambling,
automatic address matching, and packet retransmission.
Integrated into the nanoLOC chip is a Digital Dispersive Delay Line (DDDL). This is
responsible for distinguishing between two possible incoming signals generated by
another nanoLOC chip. These are either an Upchirp or a Downchirp, both of which
have the same center frequency and the same bandwidth. The difference between an
Upchirp and a Downchirp occurs only in the phase information of the complex spectrum. This phase information is enough for the DDDL to compress a pulse at one output port and expand it at the other (that is, to extend the incoming signal to the doubled
duration). In this way the DDDL acts like a matched filter for one of the possible transmitted pulses.
At the RF interface of the nanoLOC chip, a differential impedance of 200 Ω exists
which is matched to the asymmetrical 50 Ω impedance of the antenna port by a
200 Ω to 50 Ω RF balun. Additional external components at the RF interface have a
power and noise matching function that allows a sharing of the antenna without an
external TX/RX – RF switch.
For an improved robustness against out-of-band inferences, an ISM band pass filter is
connected at the antenna port.
The 32.768 kHz quartz is used for the Real Time Clock oscillator. The 32 MHz quartz
works with the internal oscillator circuitry of the nanoLOC chip.
This switch is actually two devices that are used to switch the RX / TX paths between
receive and transmit mode.
This amplifier gives the module high efficiency, high gain, and a high output power of
20 dBm.
T able 1: Key components
Page 2 NA-09-0256-0008-1.0 © 2009 Nanotron Technologies GmbH.
2 Absolute Maximum Ratings
Parameter Value Unit
Min. operating temperature -40.0 °C
Max. operating temperature +85.0 °C
Max. supply voltage (Vcc)
Max. DC current per I/O pin 2.0 mA
Note: It is critical that the ratings provided in Absolute Maximum Ratings be carefully observed.
Stress exceeding one or more of these limiting values may cause permanent damage to the
nanoPAN 5375 RF Module.
3 Electrical Characteristics
3.1 General / DC Parameters
Absolute Maximum Ratings
nanoPAN 5375 RF Module User Manual (UserMan)
Table 2: Absolute maximum rating
2.7 V
Table 3: General / DC-Parameters
2
Note Symbol Parameter Condition Min. Typ. Max. Units
–
–
2
2
2
1
1
2
2
2
1
1
T
op
V
cc
I
cc
I
cc
I
cc
I
cc
I
cc
I
cc
I
cc
I
cc
I
cc
Icc
Note 1: Tested in production @ 2.5 V, Temp= 25°C ± 5°C.
Note 2: Not tested in production. Only by characterization.
Note 3: RX off, TX off, Baseband Clock on.
Note 4: RX off, TX off, Baseband Clock off.
Operating
temperature
Supply voltage – 2.3 – 2.7 V
Supply current TX
Supply current TX
Supply current TX
Supply current RX Unsync (80/1/1) 51.0 mA
Supply current RX Sync (80/1/1) 46.0 mA
Supply current Ready (3) 4.0 mA
Supply current StandBy (4) 2.5 mA
Supply current Power Up 750.0 uA
Supply current PD Pad 550.0 625.0 900.0 µA
Supply current PD FULL 3.0 3.8 5.0 uA
– -40.0 – +85.0 °C
Low power TX
Reg 0x00
Mid power TX
Reg 0x1F
Full power TX
Reg 0xx3F
– 210.0 – mA
75.0 mA
80.0 mA
© 2009 Nanotron Technologies GmbH. NA-09-0256-0008-1.0 Page 3
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