8051 core, 12MHz operating frequency.
512-byte RAM; 32K-byte program Flash-ROM support In System
Maximum 14 channels of 5V open-drain PWM DAC.
Watchdog timer with pro
VESA DDC interface, 3-channel A/D converter and a 32K-byte internal program Flash-ROM.
WR
WR
MTV212M32
TECHNOLOGY
(Rev 1.1)
8051 Embedded Monitor Controller
Flash Type with ISP
FEATURES
•
•
•
•Maximum 32 bi-directional I/O pins.
•SYNC processor for composite separation/insertion, H/V polarity/frequency check, polarity adjustment
and programmable clamp pulse output.
•Built-in self-test pattern generator with four free-running timings.
•Built-in low power reset circuit.
•Compliant with VESA DDC1/2B/2Bi/2B+ standard.
•Dual slave IIC addresses.
•Single master IIC interface for internal device communication.
•4-channel 6-bit ADC.
•
•40-pin DIP, 42-pin SDIP or 44-pin PLCC package.
grammable interval.
GENERAL DESCRIPTIONS
Programming(ISP).
The MTV212M32 micro-controller is an 8051 CPU core embedded device specially tailored to Monitor
applications. It includes an 8051 CPU core, 512-byte SRAM, SYNC processor, 14 built-in PWM DACs,
This datasheet contains new product information. Myson Technology reserves the rights to modify the product specification without
notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
Revision 1.1 - 1 - 2000/07/04
MYSON
MTV212M32
TECHNOLOGY
(Rev 1.1)
DEVICE SUMMARY
The MTV212M32 is one of the MTV212 family device. For other family devices information, please see the
table below:
Note: As long as the pin sequence is not changed, the 42 pin SDIP’s pin-out is negotiable according to
customer’s demand.
401
VSYNC
39
HSYNC
38
DA3/P5.3
37
DA4/P5.4
36
DA5/P5.5
35
DA8/HALFH
34
DA9/HALFV
33
HBLANK/P4.1
32
VBLANK/P4.0
31
DA7/HCLAMP
30
DA6/P5.6
29
P2.7/DA13
28
P2.6/DA12
27
P2.5/DA11
26
P2.4/DA10
25
HSCL/P3.0/Rxd
24
HSDA/P3.1/Txd
23
P2.0/AD0
22
P2.1/AD1
21
P1.7
RST
VDD
X2
X1
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
2
3
4
5
6
7
8
MTV212M32
9
40 Pin
10
11
12
13
14
15
16
17
18
19
20
PDIP
NC
NC
NC
RST
VDD
X2
X1
P1.0
P1.1
P1.2
P1.3
P1.4
1
2
3
4
5
6
7
8
MTV212M32
9
42 Pin
10
11
12
13
14
15
16
17
18
19
20
SDIP
VSYNC
42
HSYNC
41
40
DA3/P5.3
39
DA4/P5.4
38
DA5/P5.5
37
DA8/HALFH
36
DA9/HALFV
35
HBLANK/P4.1
34
VBLANK/P4.0
33
DA7/HCLAMP
32
DA6/P5.6
31
P2.6/DA12
30
P2.5/DA11
29
P2.4/DA10
28
HSCL/P3.0/Rxd
27
HSDA/P3.1/Txd
26
P2.0/AD0
25
P2.1/AD1
24
P1.7
23
P1.6
2221
P1.5
RST
VDD
X2
X1
P1.0
7
8
9
10
11
12
13
14
15
16
17
MTV212M32
44 Pin
PLCC
39
DA8/HALFH
38
DA9/HALFV
37
HBLANK/P4.1
36
VBLANK/P4.0
35
DA7/HCLAMP
34
DA6/P5.6
33
P2.7/DA13
32
P2.6/DA12
31
P2.5/DA11
30
P2.4/DA10
29
HSCL/P3.0/Rxd
Revision 1.1 - 3 - 2000/07/04
MYSON
PWM DAC output (5V open drain) / General purpose I/O (5V open drain).
PWM DAC output (5V open drain) / General purpose I/O (5V open drain).
PWM DAC output (5V open drain) / General purpose I/O (5V open drain).
PWM DAC output (CMOS) /
PWM DAC output (5V open drain) /
PWM DAC output (5V open drain) /
General purpose I/O (CMOS output or 8051 standard) / ADC Input.
I/O
Ground.
-
Oscillator output.
O
Oscillator input.
I
Master IIC data (5V open drain) / General purpose I/O (8051 standard) / T0
I/O
Master IIC clock (5V open drain) / General purpose I/O (8051 standard) / T1
I/O
Self-test video output (CMOS) / General purpose Output (CMOS).
O
General purpose I/O (CMOS output or 8051 standard) / ADC Input.
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose Input / INT0.
I
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard).
I/O
General purpose I/O (CMOS output or 8051 standard) / ADC Input.
I/O
General purpose I/O (CMOS output or 8051 standard) / ADC Input.
I/O
Slave IIC data (5V open drain) / General purpose I/O (8051 standard) / Txd
I/O
Slave IIC clock (5V open drain) / General purpose I/O (8051 standard) / Rxd
I/O
General purpose I/O (CMOS output or 8051 standard) / PWM DAC output (CMOS).
I/O
General purpose I/O (CMOS output or 8051 standard) / PWM DAC output (CMOS).
I/O
General purpose I/O (CMOS output or 8051 standard) / PWM DAC output (CMOS).
I/O
General purpose I/O (CMOS output or 8051 standard) / PWM DAC output (CMOS).
I/O
PWM DAC output (CMOS) / General purpose I/O (CMOS output or open drain I/O).
I/O
O
Vertical blank (CMOS) / General purpose Output (CMOS).
O
Horizontal blank (CMOS) / General purpose Output (CMOS).
O
O
O
PWM DAC output (CMOS) / General purpose I/O (CMOS output or open drain I/O).
I/O
PWM DAC output (CMOS) / General purpose I/O (CMOS output or open drain I/O).
I/O
PWM DAC output (CMOS) / General purpose I/O (CMOS output or open drain I/O).
I/O
Horizontal SYNC or Composite SYNC Input.
I
Vertical SYNC input.
I
Hsync clamp pulse output (CMOS).
(Rev 1.1)
vsync half freq. output (5V open drain).
hsync half freq. output (5V open drain).
Revision 1.1 - 4 - 2000/07/04
MYSON
MTV212M32
TECHNOLOGY
(Rev 1.1)
PIN CONFIGURATION
A “CMOS output pin” means it can sink and drive at least 4mA current. It’s not recommended to use such pin
as input fuction.
A “5V open drain pin” means it can sink at least 4mA current but only drive 10~20uA to VDD. It can be used
as input or output function and need an external pull up resistor.
A “8051 standard pin” is a pseudo open drain pin. It can sink at least 4mA current when output low level, and
drive at least 4mA current for 160nS when output transit from low to high, then keep drive 1 00uA to maintain
the pin at high level. It can be used as input or output function. It need an external pull up resistor when drive
heavy load device.
Output
Data
2 OSC
period
delay
4mA10uA
4mA
Input
Data
120uA
8051 Stand ard Pin
Pin
Input
Data
Output
Data
Output
Data
4mA
CMOS Outp u t Pin
Pin
4mA
No Current
5V Open Drain Pin
Pin
4mA
Revision 1.1 - 5 - 2000/07/04
MYSON
FUNCTIONAL DESCRIPTIONS
2. Memory Allo catio n
2.4 Auxiliary RAM (AUXRAM)
divided into two banks, selected by XBANK register. Program can initialize
MTV212M32
TECHNOLOGY
1. 8051 CPU Core
(Rev 1.1)
MTV212M32 includes all 8051 functions with the following exceptions:
1.1 The external RAM access is restricted to XFRs/AUXRAM within the MTV212M32.
1.2 Port0, port3.3, port3.6 and port3.7 are not general-purpose I/O ports. They are dedicated to monitor
special application.
1.3 INT1 input pin is not provided, it is connected to special interrupt sources.
1.4 Port2 are shared with special function pins.
In addition, there are 2 timers, 5 interrupt sources and serial interface compatible with the standard 8051.
Note: All registers listed in this document reside in external RAM area (XFR). For internal RAM memory map
please refer to 8051 spec.
2.1 Internal Special Function Registers (SFR)
The SFR is a group of registers that are the same as standard 8051.
2.2 Internal RAM
There are total 256 bytes internal RAM in MTV212M32, same as standard 8052.
2.3 External Special Function Registers (XFR)
The XFR is a group of registers allocated in the 8051 external RAM area 00h - 7Fh. Most of the registers are
used for monitor control or PWM DAC. Program can initialize Ri value and use "MOVX" instruction to access
these registers.
There are total 256 bytes auxiliary RAM allocated in the 8051 external RAM area 80h - FFh. The AUXRAM is
instruction to access the AUXRAM.
FFh
Internal RAM
addressing only
80h
7Fh
Internal RAM
Accessible by
indirect
(Using
MOV A,@Ri
instruction)
SFR
Accessible by
direct addressing
FFh
80h
7Fh
Ri value and use "MOVX"
AUXRAM
Accessible by
indirect external
RAM addressing
(XBANK=0)(Using
MOVX A,@Ri
instruction)
Accessible by
indirect external
RAM addressing
(XBANK=1)(Using
MOVX A,@Ri
XFR
AUXRAM
instruction)
Accessible by
direct and indirect
addressing
00h
Accessible by
indirect external
RAM addressing
(Using
MOVX A,@Ri
instruction
00h
Revision 1.1 - 6 - 2000/07/04
MYSON
PWMF
MTV212M32
TECHNOLOGY
3. Chip Configu ratio n
The Chip Configuration registers define the chip pins function, as well as the functional blocks' connection,
configuration and frequency.
Reg nameaddrbit7bit6bit5bit4bit3bit2bit1bit0
PADMOD
PADMOD
PADMOD
PADMOD
PADMOD
PADMOD
OPTION
OPTION
XBANK
PADMOD (w) : Pad mode control registers. (All are "0" in Chip Reset)
DA13E = 1→ pin “P2.7/DA13” is DA13.
DA12E = 1→ pin “P2.6/DA12” is DA12.
DA11E = 1→ pin “P2.5/DA11” is DA11.
DA10E = 1→ pin “P2.4/DA10” is DA10.
AD3E = 1→ pin “P2.3/AD3” is AD3.
AD2E = 1→ pin “P2.2/AD2” is AD2.
AD1E = 1→ pin “P2.1/AD1” is AD1.
AD0E = 1→ pin “P2.0/AD0” is AD0.
P56E= 1→ pin “DA6/P5.6” is P5.6.
P55E= 1→ pin “DA5/P5.5” is P5.5.
P54E= 1→ pin “DA4/P5.4” is P5.4.
P53E= 1→ pin “DA3/P5.3” is P5.3.
P52E= 1→ pin “DA2/P5.2” is P5.2.
P51E= 1→ pin “DA1/P5.1” is P5.1.
P50E= 1→ pin “DA0/P5.0” is P5.0.
HIICE = 1→pin “HSCL/P3.0/Rxd” is HSCL; pin “HSDA/P3.1/Txd” is HSDA.
IIICE= 1→ pin “ISDA/P3.4/T0” is ISDA; pin “ISCL/P3.5/T1” is ISCL.
HLFVE = 1→ pin “DA9/HALFV” is VSYNC half frequency output.