MXIC MX27L2000MI-20, MX27L2000MI-25, MX27L2000PC-12, MX27L2000PC-15, MX27L2000PC-20 Datasheet

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FEATURES

MX27L2000

2M-BIT [256Kx8] CMOS EPROM

• 256Kx 8 organization

• Wide power supply range, 2.7V DC to 3.6V DC

• +12.5V programming voltage

• Fast access time: 120/150/200/250 ns

• Totally static operation

• Completely TTL compatible

• Operating current:20mA @ 3.6V, 5MHz

GENERAL DESCRIPTION

The MX27L2000 is a 3V only, 2M-bit, One Time Programmable Read Only Memory. It is organized as 256K words by 8 bits per word, operates from a single + 3 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM

PIN CONFIGURATIONS

32 PDIP/SOP 32 PLCC

VPP

A16

A15

A12

10 11 12 13 14 15 16

MX27L2000

A1 A0 Q0 Q1 Q2

GND

32 TSOP(I) (8x20mm,8x14mm,8x13.4mm)

VCC

PGM

A17

A14

A13

A11

A10

A12

A15

A7 A6 A5 A4

A3 A2 A1 A0 Q0

MX27L2000

14 17 20

A16

GND

VPP

VCCNCA17

Q3Q4Q5

• Standby current: 20uA

• Package type:

- 32 pin plastic DIP

- 32 pin SOP

- 32 pin PLCC

- 8x20mm 32-lead TSOP(I)

- 8x14mm 32-lead TSOP(I)

- 8x13.4mm 32-lead TSOP(I)

programmers may be used. The MX27L2000 supports a intelligent fast programming algorithm which can result in programming time of less than one minute.

This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead SOP and 32 lead PLCC and 32 lead TSOP(I) packages.

BLOCK DIAGRAM

PGM

A14 A13 A8 A9 A11 OE A10 CE Q7

A0~A17

ADDRESS

INPUTS

VCC VSS

PIN DESCRIPTION

. . . . . . . .

CONTROL

LOGIC

Y-DECODER

X-DECODER

OUTPUT

BUFFERS

Y-SELECT

. . .

2M BIT

. . . .

CELL

MAXTRIX

Q0~Q7

A11

A13 A14 A17

PGM

VCC VPP

A16 A15 A12

1 2

4 5 6 7 8 9 10 11 12 13

MX27L2000

A10

GND

SYMBOL PIN NAME

A0~A17 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input PGM Programmable Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin

REV. 2.9, JAN. 22, 2002P/N: PM0372

MX27L2000

FUNCTIONAL DESCRIPTION

THE PROGRAMMING OF THE MX27L2000

When the MX27L2000 is delivered, or it is erased, the chip has all 2M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27L2000 through the procedure of programming.

For programming, the data to be programmed is applied with 8 bits in parallel to the data pins.

Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device.

FAST PROGRAMMING

The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%.

PROGRAM INHIBIT MODE

Programming of multiple MX27L2000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27L2000 may be common. A TTL low-level program pulse applied to an MX27L2000 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27L2000. A high-level CE input inhibits the other MX27L2000s from being programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE, at VIL, PGM at VIH, and VPP at its programming voltage.

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27L2000.

To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode.

Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27L2000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit.

READ MODE

The MX27L2000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE.

STANDBY MODE

The MX27L2000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27L2000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.

P/N: PM0372

REV. 2.9, JAN. 22, 2002

MX27L2000

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a twoline control function is provided to allow for:

SYSTEM CONSIDERATIONS

During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude

1. Low memory power dissipation,

2. Assurance that output bus contention will not occur.

of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent

inductance) should be used on each device between It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular

Vcc and GND to minimize transient effects. In addition,

to overcome the voltage drop caused by the inductive

effects of the printed circuit board traces on EPROM

arrays, a 4.7 uF bulk electrolytic capacitor should be

used between VCC and GND for each eight devices.

The location of the capacitor should be close to where

the power supply is connected to the array. memory device.

MODE SELECT TABLE

PINS

MODE CE OE PGM A0 A9 VPP OUTPUTS

Read VIL VIL X X X VCC DOUT Output Disable VIL VIH X X X VCC High Z Standby (TTL) VIH X X X X VCC High Z Standby (CMOS) VCC±0.3V X X X X VCC High Z Program VIL VIH VIL X X VPP DIN Program Verify VIL VIL VIH X X VPP DOUT Program Inhibit VIH X X X X VPP High Z Manufacturer Code(3) VIL VIL X VIL VH VCC C2H Device Code(3) VIL VIL X VIH VH VCC 20H

NOTES:

1. VH = 12.0 V ± 0.5 V

2. X = Either VIH or VIL

3. A1 - A8 = A10 - A17 = VIL(For auto select)

4. See DC Programming Characteristics for VPP voltage during programming.

P/N: PM0372

REV. 2.9, JAN. 22, 2002

FIGURE 1. FAST PROGRAMMING FLOW CHART

MX27L2000

START

ADDRESS = FIRST LOCATION

VCC = 6.25V VPP = 12.75V

X = 0

PROGRAM ONE 100us PULSE

INTERACTIVE SECTION

VERIFY SECTION

INCREMENT ADDRESS

FAIL

INCREMENT X

X = 25?

VERIFY BYTE

PASS

LAST ADDRESS

YES

VCC = VPP = 5.25V

VERIFY ALL BYTES

PASS

DEVICE PASSED

YES

FAIL

DEVICE FAILED

P/N: PM0372

REV. 2.9, JAN. 22, 2002

SWITCHING TEST CIRCUITS

MX27L2000

DEVICE UNDER

TEST

CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns)

SWITCHING TEST WAVEFORMS

AC driving levels

AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade.

6.2K ohm

2.0V TEST POINTS

0.8V

INPUT

Input pulse rise and fall times are < 10ns.

1.8K ohm +5V

DIODES = IN3064 OR EQUIVALENT

2.0V

0.8V OUTPUT

P/N: PM0372

AC driving levels

1.5V

INPUT

AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade.

Input pulse rise and fall times are < 10ns. (2) For MX27L2000-12/15.

TEST POINTS

OUTPUT

1.5V

REV. 2.9, JAN. 22, 2002

MX27L2000

ABSOLUTE MAXIMUM RATINGS

RATING VALUE

Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V

NOTICE:

Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability.

Applied Output Voltage -0.5V to VCC+0.5V VCC to Ground Potential -0.5V to 7.0V V9 & VPP -0.5V to 13.5V

NOTICE:

Specifications contained within the following tables are subject to change.

DC/AC Operating Conditions for Read Operation

MX27L2000

-12- 15 -20 -25

Operating Temperature Commercial 0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C

Industrial - - -40°C to 85°C -40°C to 85°C

Vcc Power Supply 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V

DC CHARACTERISTICS

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS

VOH Output High Voltage 2.4 V IOH = -0.4mA, VCC=3.0V VOL Output Low Voltage 0.4 V IOL = 2.1mA, VCC=3.0V VIH Input High Voltage 2.0 VCC + 0.5 V VIL Input Low Voltage -0.3 0.8 V 2.7V < VCC < 3.6V ILI Input Leakage Current -10 10 uA VIN = 0 to 3.6V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 20 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 0.25 mA CE = VIH ICC1 VCC Active Current 20 mA CE = VIL, f=5MHz, Iout = 0mA,

VCC=3.6V

IPP VPP Supply Current Read 10 u A CE = OE = VIL, VPP = VCC

CAPACITANCE TA = 25

SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS

CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V

C, f = 1.0 MHz (Sampled only)

P/N: PM0372

REV. 2.9, JAN. 22, 2002

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