MXIC MX27C512 Technical data

FEATURES
CONTROL
LOGIC
OUTPUT
BUFFERS
Q0~Q7
CE
OE/VPP
A0~A15
ADDRESS
INPUTS
Y-DECODER
X-DECODER
Y-SELECT
512K BIT
CELL
MAXTRIX
VCC GND
. . . . . . . .
. . . . . . . .
MX27C512
512K-BIT [64Kx8] CMOS EPROM
64K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 45/55/70/90/100/120/150ns
Totally static operation
Completely TTL compatible
GENERAL DESCRIPTION
The MX27C512 is a 5V only, 512K-bit, ultraviolet Eras­able Programmable Read Only Memory. It is organized as 64K words by 8 bits per word, operates from a single +5volt supply, has a static standby mode, and features fast single address location programming. All program­ming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM
PIN CONFIGURATIONS
A15 A12
A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2
GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20
MX27C512
19 18 17 16 15
VCC A14 A13 A8 A9 A11 OE/VPP A10 CE Q7 Q6 Q5 Q4 Q3
PLCC
A7
A12
4
5
A6 A5 A4 A3
9
A2 A1
A0 NC Q0
MX27C512
13
14 17 20
A15NCVCC
1
32
A14
A13
30
29
25
21
Operating current: 30mA
Standby current: 100uA
Package type:
- 28 pin plastic DIP
- 32 pin PLCC
- 28 pin 8 x 13.4 mm TSOP(I)
programmers may be used. The MX27C512 supports intelligent fast programming algorithm which can result in programming time of less than fifteen seconds.
This EPROM is packaged in industry standard 28 pin dual-in-line packages 32 lead PLCC, and 28 lead TSOP(I) packages.
BLOCK DIAGRAM
A8 A9 A11 NC OE/VPP A10 CE Q7 Q6
8 x 13.4mm 28TSOP(I)
A11
A9
A8 A13 A14
A15 A12
A7
A6
A5
A4
A3
22 23 24 25 26 27 28 1 2 3 4 5 6 7
OE/VPP
VCC
P/N: PM0235
MX27C512
Q1
Q2
GND
Q3Q4Q5
NC
PIN DESCRIPTION
21
A10
20
CE
19
Q7
18
Q6
17
Q5
16
Q4
15
Q3
14
GND
13
Q2
12
Q1
11
Q0
10
A0
9
A1
8
A2
SYMBOL PIN NAME
A0~A15 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE/VPP Output Enable Input/Program Supply
Voltage NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin
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MX27C512
FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27C512
When the MX27C512 is delivered, or it is erased, the chip has all 512K bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C512 through the procedure of programming.
For programming, the data to be programmed is applied with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when the programming voltage OE/VPP = 12.75V is applied, with VCC = 6.25 V, (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = 5V ± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27C512s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C512 may be common. A TTL low-level program pulse applied to an MX27C512 CE input with OE/VPP = 12.5 ± 0.5V will program that MX27C512. A high-level CE input inhibits the other MX27C512s from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE/VPP and CE, at VIL. Data should be verified tDV after the falling edge of CE.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C512.
To activate this mode, the programming equipment must force 12.0 ± 0.5(VH) on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C512, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit.
READ MODE
The MX27C512 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE.
STANDBY MODE
The MX27C512 has a CMOS standby mode which reduces the maximum VCC current to 100uA . It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C512 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.
P/N:PM0235
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MX27C512
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two­line control function is provided to allow for:
SYSTEM CONSIDERATIONS
During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude
1. Low memory power dissipation,
2. Assurance that output bus contention will not occur.
of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between
It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular
VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.
memory device.
MODE SELECT TABLE
PINS
MODE CE OE/VPP A0 A9 OUTPUTS
Read VIL VIL X X DOUT Output Disable VIL VIH X X High Z Standby (TTL) VIH X X X High Z Standby (CMOS) VCC±0.3V X X X High Z Program VIL VPP X X DIN Program Verify VIL VIL X X DOUT Program Inhibit VIH VPP X X High Z Manufacturer Code(3) VIL VIL VIL VH C2H Device Code(3) VIL VIL V IH VH 91H
NOTES: 1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
P/N:PM0235
3. A1 - A8 = A10 - A15 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
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REV. 4.5, NOV. 09, 2001
Figure1. FAST PROGRAMMING FLOW CHART
ADDRESS = FIRST LOCATION
OE/VPP = 12.75V
PROGRAM ONE 100us PULSE
MX27C512
START
VCC = 6.25V
INCREMENT ADDRESS
INCREMENT ADDRESS
NO
LAST
ADDRESS ?
YES
PASS
NO
ADDRESS = FIRST LOCATION
PROGRAM ONE 100us PULSE
LAST
ADDRESS ?
X = 0
VERIFY BYTE
VCC = 5.25V
OE/VPP = VIL
COMPARE
ALL BYTES
TO ORIGINAL
DATA
DEVICE PASSED
YES
PASS
FAIL
NO
FAIL
INCREMENT X
X = 25 ?
YES
DEVICE FAILED
P/N:PM0235
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REV. 4.5, NOV. 09, 2001
SWITCHING TEST CIRCUITS
MX27C512
DEVICE UNDER
TEST
CL = 100 pF including jig capacitance (30pF for 45/55/70 ns parts)
SWITCHING TEST WAVEFORMS
AC driving levels
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.
Input pulse rise and fall times are < 10ns.
INPUT
CL
2.0V
0.8V
6.2K ohm
TEST POINTS
1.8K ohm +5V
DIODES = IN3064 OR EQUIVALENT
2.0V
0.8V OUTPUT
P/N:PM0235
AC driving levels
1.5V
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70.
TEST POINTS
OUTPUT
5
1.5V
REV. 4.5, NOV. 09, 2001
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