The MX27C4111 is a 4M-bit, One Time Programmable
Read Only Memory with page mode. It is organized as
512K x 8 or 256K x 16, operates from a single + 5 volt
supply, has a static standby mode, and features fast
single address location programming. All programming
signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27C4111 supports
a intelligent fast programming algorithm which can result
in programming time of less than two minutes.
• Completely TTL compatible
• Operating current: 60mA
• Standby current: 100uA
• Package type:
- 40 pin plastic DIP
- 40 pin SOP
MX27C4111 provides Page Read Access Mode which
can greatly reduce the read access time. Normal read
access time and Page Mode read access time is as fast
as 90/50ns. It is designed to be compatible with all
microprocessors and similar applications in which high
perofmrance, large bit storage and simple interfacing
are important design considerations.
This EPROM is packaged in industry standard 40 pin
dual-in-line packages and 40 pin SOP packages.
When the MX27C4111 is delivered, or it is erased, the
chip has all 4M bits in the "ONE" or HIGH state. "ZEROs"
are loaded into the MX27C4111 through the procedure
of programming.
For programming, the data to be programmed is applied
with 16 bits in parallel to the data pins.
VCC must be applied simultaneously or before VPP,
and removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across VPP and ground to suppress spurious
voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and OE = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27C4111's in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C4111 may be common. A
TTL low-level program pulse applied to an MX27C4111
CE input with VPP = 12.5 ± 0.5 V will program the
MX27C4111. A high-level CE input inhibits the other
MX27C4111s from being programmed.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27C4111.
To activate this mode, the programming equipment
must force 12.0 ± 0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27C4111, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB
(Q15) defined as the parity bit.
READ MODE
The MX27C4111 provides page mode with 8 words/16
bytes per page. In order to get the benefit of fast page
read, the user should keep chip enable(CE) low and
toggle address A0~A2 in word mode or A-1~A2 in byte
mode. Page Read access time(tPA) is equal to the
delay from address stable to data output. It is twice as
fast as normal tACC and is highly recommended.
WORD-WIDE MODE
With BYTE/VPP at VCC ± 0.2V outputs Q0-7 present
data Q0-7 and outputs Q8-15 present data Q8-15, after
CE and OE are appropriately enabled.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE at VIL, CE
at VIH, and VPP at its programming voltage.
P/N: PM0239
BYTE-WIDE MODE
With BYTE/VPP at GND ± 0.2V, outputs Q8-15 are tristated. If Q15/A-1 = VIH, outputs Q0-7 present data bits
Q8-15. If Q15/A-1 = VIL, outputs Q0-7 present data bits
Q0-7.
3
REV. 2.6, AUG. 20, 2001
MX27C4111
STANDBY MODE
The MX27C4111 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C4111 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a twoline control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control
bus. This assures that all deselected memory devices
are in their low-power standby mode and that the output
pins are only active when data is desired from a
particular memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
Vcc and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
MODE SELECT TABLE
BYTE/
MODECEOEA9A0Q15/A-1VPP(5)Q8-14Q0-7
Read (Word)VILVILXXQ15 OutVCCQ8-14 OutQ0-7 Out
Read (Upper Byte)VILVILXXVIHGNDHigh ZQ8-15 Out
Read (Lower Byte)VILVILXXVILGNDHigh ZQ0-7 Out
Output DisableVILVIHXXHigh ZXHigh ZHigh Z
StandbyVIHXXXHigh ZXHigh ZHigh Z
ProgramVILVIHXXQ15 InVPPQ8-14 InQ0-7 In
Program VerifyVIHVILXXQ5 OutVPPQ8-14 OutQ0-7 Out
Program InhibitVIHVIHXXHigh ZVPPHigh ZHigh Z
Manufacturer Code(3)VILVILVHVIL0BVCC00HC2H
Device Code(3)VILVILVHVIH1BVCC38H00H
NOTES:
1.VH = 12.0V ± 0.5V
2.X = Either VIH or VIL
3.A1 - A8, A10 - A17 = VIL (For auto select)
4.See DC Programming Characteristics for VPP
voltages.
5.BYTE/VPP is intended for operation under DC
Voltage conditions only.
6.Manufacture code = 00C2H
Device code = B800H
P/N: PM0239
4
REV. 2.6, AUG. 20, 2001
FIGURE 1. FAST PROGRAMMING FLOW CHART
MX27C4111
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X = 0
PROGRAM ONE 50us PULSE
INTERACTIVE
SECTION
VERIFY SECTION
INCREMENT ADDRESS
FAIL
NO
INCREMENT X
X = 25?
NO
VERIFY BYTE
?
PASS
LAST ADDRESS
YES
VCC = VPP = 5.25V
VERIFY ALL BYTES
?
PASS
DEVICE PASSED
YES
FAIL
FAIL
DEVICE FAILED
P/N: PM0239
5
REV. 2.6, AUG. 20, 2001
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