The MX27C4000A is a 5V only, 4M-bit, One Time
Programmable Read Only Memory. It is organized as
512K words by 8 bits per word, operates from a single
+5 volt supply, has a static standby mode, and features
fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
PIN CONFIGURATIONS
32 PDIP/SOP
VPP
A16
A15
A12
GND
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX27C4000A
VCC
32
A18
31
A17
30
A14
29
A13
28
A8
27
A9
26
A11
25
OE
24
A10
23
CE
22
Q7
21
Q6
20
Q5
19
Q4
18
Q3
17
• Operating current: 40mA
• Standby current: 100uA
• Package type:
- 32 pin PDIP
- 32 pin PLCC
- 32 pin SOP
- 32 pin TSOP
programmers may be used. The MX27C4000A
supports a intelligent fast programming algorithm which
can result in programming time of less than two minutes.
This One Time Programmable Read Only Memory is
packaged in industry standard 32 pin dual-in-line plastic,
32 lead PLCC, 32 lead SOP, 32 lead TSOP packages.
When the MX27C4000A is delivered, or it is erased,
the chip has all 4M bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C4000A through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC OTP ROM, a 01uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and OE = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 10us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27C4000As in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C4000A may be common. A
TTL low-level program pulse applied to an
MX27C4000A CE input with VPP = 12.5 ± 0.5 V and CE
LOW will program that MX27C4000A. A high-level CE
input inhibits the other MX27C4000As from being
programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE and CE at
VIL, and VPP at its programming voltage.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an OTP ROM that will identify its
manufacturer and device type. This mode is intended for
use by programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27C4000A.
To activate this mode, the programming equipment
must force 12.0 ± 0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27C4000A, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
READ MODE
The MX27C4000A has two control functions, both of
which must be logically satisfied in order to obtain data
P/N: PM00694
2
REV. 1.6, JUL. 19, 2001
MX27C4000A
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE's, assuming that CE has been LOW and
addresses have been stable for at least tACC - tOE.
STANDBY MODE
The MX27C4000A has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C4000A also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a twoline control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
MODE SELECT TABLE
PINS
MODECEOEA0A9VPPOUTPUTS
ReadVILVILXXVCCDOUT
Output DisableVILVIHXXVCCHigh Z
Standby (TTL)VIHXXXVCCHigh Z
Standby (CMOS)VCC±0.3V XXXVCCHigh Z
ProgramVILVIHXXVPPDIN
Program VerifyVIHVILXXVPPDOUT
Program InhibitVIHVIHXXVPPHigh Z
Manufacturer Code(3)VILVILVILVHVCCC2H
Device Code(3)VILVILVIHVHVCCC0H
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A18 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
P/N: PM00694
3
REV. 1.6, JUL. 19, 2001
FIGURE 1. FAST PROGRAMMING FLOWCHART
MX27C4000A
ST AR T
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X = 0
PROGRAM ONE 10us PULSE
INTERACTIVE
SECTION
VERIFY SECTION
INCREMENT ADDRESS
FAIL
NO
VCC = VPP = 5.25V
VERIFY ALL BYTES
INCREMENT X
X = 25?
NO
VERIFY BYTE
?
PASS
LAST ADDRESS
YES
?
PASS
DEVICE PASSED
YES
FAIL
FAIL
DEVICE FAILED
P/N: PM00694
4
REV. 1.6, JUL. 19, 2001
SWITCHING TEST CIRCUITS
MX27C4000A
DEVICE
UNDER
TEST
CL = 100 pF including jig capacitance
SWITCHING TEST WAVEFORMS
AC driving levels
AC TESTING: (1) AC driving levels are 2.4V/0.4V.
CL
6.2K ohm
2.0V
TEST POINTS
0.8V
INPUT
(2) Input pulse rise and fall times are < 10ns.
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
2.0V
0.8V
OUTPUT
P/N: PM00694
5
REV. 1.6, JUL. 19, 2001
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