Ball Descriptions Epoch MultiLayer Switch Chipset
Rev. 2.7 Draft
7
CRI RCP.
Glue free Con-
nection to the
MUSIC MUAC
RCP.
(continued)
RCPDSC Data Segment Control
Output
Output
TTL
AF3
RCPDQ[31:0] RCP Data Bus Bidir
TTL
3.3V
Only
b0:AC5, b1:AF 6, b2:AE6, b3:AD6,
b4:AC6, b5:AF 7, b6:AE7, b7:AD7,
b8:AC7, b9:AF 8, b10:AE8,
b11:AD8, b12:AC8, b13:AF9,
b14:AE9, b15:AD9, b16:AC9,
b17:AF10, b18:AE10, b19:AD10,
b20:AC10, b21:AF11, b22:AE11,
b23, AD11, b24:AC11, b25:AF12,
b26:AE12, b27:AD12, b28:AC12,
b29:AF13, b30:AE13, b31:AD13
RCPEb RCP Chip Enable Output
TTL
AD1
RCPOEb RCP Output Enable Output
TTL
AD2
RCPRESETb RCP Reset Output
TTL
AD4
RCPVBb RCP Validity Bit Bidir
TTL
3.3V
Only
AE3
RCPWb RCP Write Enable Output
TTL
AF2
RCPADDR[14:0] CRI Shared RCP and Associated Data SRAM
Address Bus. Connect to AA12:0 on RCPs and to
Address pins of CRI SRAM.
Bidir
TTL
3.3V
Only
b0:W3, b1:W4, b2:Y1, b3:Y2,
b4:Y3, b5:Y4, b6:AA1, b7:AA2,
b8:AA3, b9:AA4, b10:AB1,
b11:AB2, b12:AB3, b13:AB4,
b14:AC1
Interface to the
CRI Associated
Data SRAM
SRAMADDR [16:15] CRI High SRAM Address Bits
SRAM Address [16:15]
Output
TTL
b15:AC2, b16:AC3
SRAMDQ[15:0] CRI SRAM
Data Bus
Bidir
TTL
3.3V
Only
b0:R3, b1:R4, b2:T1, b3:T2,
b4:T3, b5:T4, b6:U1, b7:U2,
b8:U3, b9:U4, b10:V1, b11:V2,
b12:V3, b13:V4, b14:W1,
b15:W2
SRAMOEb CRI SRAM
Output Enable
Output
TTL
R2
SRAMWEb CRI SRAM
Write Enable
Output
TTL
R1
Processor
Interface
PDATA[31:0] Processor Data Bus Bidir
TTL
5V Tol.
b0:C1, b1:D1, b2:D2, b3:D3,
b4:E1, b5:E2, b6:E3, b7:E4,
b8:F1, b9:F2, b10:F3, b11:F4
b12:G2, b13:G3, b14:G4,
b15:H1, b16:H2, b17:H3,
b18:H4, b19:J1, b20:J2, b21:J3,
b22:J4, b23:K1, b24:K2,
b25:K3, b26:K4, b27:L1, b28:L2,
b29:L3, b30:L4, b31:M1
Table 1: Ball Descriptions (continued)
Functional
Group
Ball Name(s)
(Appended b
indicates
active low signal)
Function Type PBGA Ball(s)