LXDC3EP TypeF series
Micro DC-DC converter
1
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b
TOP VIEW
BOTTOM VIEW
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BOTTOM VIEW
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BOTTOM VIEW
1. Features
Low EMI noise and small footprint (11mm
High efficiency using synchronous rectifier technology at 4MHz operation.
Power-Save mode / Forced PWM automatic mode switching function
2% DC output voltage accuracy (PWM mode).
1A maximum load capability
Wide input voltage range : 2.5 - 5.5V
Fixed output voltage : 1.0V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Internal soft start, over current protection, thermal shutdown protection
2
)using inductor-imbedded ferrite substrate
2. Description
The LXDC3EP series is a 1A output step-down DCDC converter, which is suitable for a space-limited or a
noise-sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate
eliminates radiated EMI noise and conduction noise efficiently.
By just putting this device, it can be used as a LDO replacement. Its low noise feature and easy to assembly
feature assures reliable power supply quality.
The LXDC3EP series has a mode pin that allows the user to select Forced PWM mode or Power-Save mode that
changes modes between pulse-skip operation and forced PWM operation automatically depending on the load.
In Power-Save mode, LXDC3EP series offers superior efficiency under light load condition, and it extends the
battery life. When Forced PWM mode is selected, it works at fixed frequency (4MHz) over all load range. The
advantages of this mode are easy filtering of switching frequency and better load transient response.
The integrated over current protection and the thermal shutdown protection features offer a reliable power supply
operation.
3. Typical Application Circuit
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
2
Symbol
Dimension
Symbol
Dimension
L
3.5+/- 0.2
a
0.2+/- 0.2
W
3.2+/- 0.2
b
0.8+/- 0.1
T
1.3MAX
c
0.4+/- 0.1
d
0.7+/- 0.1
e
0.6+/- 0.1
4. Mechanical details
4-1 Out line
unit (mm)
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
3
Pin
Symbol
I/O
Function
1
EN
Input
This is the ON/OFF control pin of the device. The device is in shutdown
when the voltage to this pin is below 0.4V. Pulling this pin above 1.2V
enables the device with soft start. This pin should not be left floating.
EN=H: Device ON, EN=L: Device OFF
2,3,5,6,9
GND
－
Ground pin
4
Vout
Output
Regulated voltage output pin.
Apply output load between this pin and GND.
7
MODE
Input
This is the operation mode select pin. This pin must not be left floating and
must be terminated.
Mode=H: Forced PWM mode
Mode=L: Power-Save mode
8
Vin
Input
Vin pin supplies current to the LXDC3EP internal regulator.
Gate
Driver
EA
Switching
Controller
Soft Start
Clock
UVLO
Thermal
Shutdown
GND
Cout
Cin
Embedded
L
EN
Mode
Vin
Vout
Control IC
LXDC3EP
Current
Sense
OCP
4-2 Pin function
4-3 Functional Block Diagram
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
4
Part number
Output Voltage
Device Specific Feature
MOQ
LXDC3EP10F-208
1.0V
Output current derating improvement type
T/R,1000pcs/R
LXDC3EP12F-151
1.2V
Output current derating improvement type
T/R,1000pcs/R
LXDC3EP15F-263
1.5V
Output current derating improvement type
T/R,1000pcs/R
LXDC3EP18F-264
1.8V
Output current derating improvement type
T/R,1000pcs/R
LXDC3EP25F-265
2.5V
Output current derating improvement type
T/R,1000pcs/R
LXDC3EP33F-204
3.3V
Output current derating improvement type
T/R,1000pcs/R
Parameter
symbol
rating
Unit
Maximum pin voltage
Vin, EN, MODE
6.0
V
Operating ambient temperature
Ta
-30 to +85
o
C
Operating IC temperature
TIC
-30 to +125
oC
Storage temperature
T
STO
-30 to +85
o
C
5. Ordering Information
6. Electrical Specification
6-1 Absolute maximum ratings
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
5
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input voltage
Vin
LXDC3EP10F-208
2.5
3.7
5.5
V
LXDC3EP12F-151
LXDC3EP15F-263
LXDC3EP18F-264
LXDC3EP25F-265
3.0
3.7
5.5
LXDC3EP33F-204
4.0
5.0
5.5
UVLO Voltage
UVLO
2.2 V
Output voltage
accuracy
Vout
PWM Mode
Vin-Vout>0.7V
LXDC3EP10F-208
0.976
1.0
1.024
V
LXDC3EP12F-151
1.176
1.2
1.224
LXDC3EP15F-263
1.47
1.5
1.53
LXDC3EP18F-264
1.764
1.8
1.836
LXDC3EP25F-265
2.45
2.5
2.55
LXDC3EP33F-204
3.234
3.3
3.366
Load current
range
Iout
0 -
1000
mA
Ripple Voltage
Vrpl
Vin=3.7V
Io=1000mA
BW=100MHz
LXDC3EP10F-208
-
15
-
mV(p-p)
LXDC3EP12F-151
LXDC3EP15F-263
LXDC3EP18F-264
Vin=3.7V
Io=1000mA
BW=100MHz
LXDC3EP25F-265
-
20
-
Vin=5.0V
Io=1000mA
BW=100MHz
LXDC3EP33F-204
-
20
-
Efficiency
EFF
Vin=3.7V
Io=300mA
LXDC3EP10F-208
86
-
%
LXDC3EP12F-151
88
LXDC3EP15F-263
90
-
LXDC3EP18F-264
92
-
LXDC3EP25F-265
94
-
Vin=5.0V
Io=300mA
LXDC3EP33F-204
94
-
Enable Voltage
ENon
ON; Enable
1.2 - - V ENoff
OFF; Disable
- - 0.4
MODE Voltage
MODE-H
High; Forced PWM mode
1.2 - -
V
MODE-L
Low; Power-Save mode
- - 0.4
6-2 Electrical Characteristics (Ta=25 oC)
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
6
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
SW Frequency
Freq
- 4 - MHz
Over Current
Protection
OCP
1000
1200
1700
mA
Start -up Time
Ton
- 170
-
usec
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0 200 400 600 800 1000 1200
Power Dissipation[mW]
Iout[mA]
LOSS-ΔT Characteristics(Vin=5.5V,Vo=1.2V)
0
5
10
15
20
25
30
0 0.05 0. 1 0.15 0.2 0.25 0 .3 0.3 5
IΔT[℃ ]
Power Dissipation[mW]
LOSS-ΔT Characteristics(Vin=5.5V,Vo=1.2V)
(*1)The above characteristics are tested using the application circuit on section 8
6-3 Thermal and Current De-rating Information
The following figure shows the power dissipation and temperature rise characteristics example. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
especially be taken in applications where the device temperature exceeds 85oC.
The case temperature of the device must be kept lower than the maximum rating of 125 oC. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress.
Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be
described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance).
The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out
mechanisms in MLCC capacitor is not reversible but cumulative over time.
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
7
Capacitor B1 Life(Thousand Hours)
Capacitor Case temperature(℃)
The following steps should be taken before the design fix of user’s set for a reliable operation.
1. The ambient temperature of the device should be kept below 85 oC
2. The case temperature should be measured on the worst condition of each application. The temperature must
be kept below 125 oC. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be considered as same as the case temperature. Considering the above
figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
8
Power-Save mode at light load PWM mode at heavy load
Nominal output voltage
7. Detailed Description
Power-Save Mode / Forced PWM Mode
The MODE pin allows selecting the operating mode. If the MODE pin is pulled to logic low voltage (MODE-L), the
converter operates automatic pulse-skip and PWM mode. In this mode, the converter operates pulse-skip mode
at light load current, and when the load current increases, the operating mode will changes to PWM mode
automatically. In this mode, the converter can work in high efficiency over wide load current range. The transition
current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark threshold is about
50-200mA
If the MODE pin is pulled to logic high voltage (MODE-H), the device operates in Forced PWM mode. In this mode,
the converter operates in PWM mode even at light load current. The advantage of this mode is that the converter
operates with a fixed frequency that allows simple filtering of switching frequency. In this mode, the efficiency is
lower compared to the PFM mode at light load current.
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (2.2Vtyp) before the device begins the start up
sequence even when EN pin is kept high. UVLO function keeps away of an unstable operation at low Vin range
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 170usec.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin
must be terminated to logic high and must not be left floating. Pulling the EN pin to logic low forces the device
shutdown.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the
output voltage. When the current goes below the threshold, the converter returns to normal operation
automatically.
Thermal Shutdown
The device has a thermal overload protection function. When the internal IC’s junction temperature exceeds
around 150oC, the device goes into thermal shutdown. The device returns to its normal operation when the
Internal IC’s junction temperature falls below 130
kept below 125 oC. Prolonged thermal overload condition may damage the device
o
C (typ). For reliable operation, the IC temperature should be
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
9
Vin
Cin
Cout
RL
GND
Vout
Vin
EN
V-EN
LXDC-SAMPLE-B67
MODE
V-MODE
(C)
RL
Vin
GND
Vout
Vin
EN
V-EN
MODE
V-MODE
LXDC3EP
(Cout)
8. Test Circuit
*Optional：Cout: 4.7uF/6.3V (LXDC3EP33F-204)
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
10
Enable SW
VIN
VIN_S
GND
VOUT_S
A
VOUT
GND_S
V
GND_S
Load
V
GND
A
Mode SW
9. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0457B)
Measurement setup
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stop operation and keep shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external
voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable
switch should not to be set to the middle position.
The mode switch has three states (PWM, PFM/PWM and Open).
1. When it is shorted to “PWM” side, the device operates PWM forced mode.
2. When it is shorted to “PFM/PWM” side, the device operates PFM/PWM automatic mode.
3. When it is set to open, the mode pin becomes floated and can be applied an external voltage through the
Mode terminal pin on the EVB. If you don’t apply external voltage to Mode pin, the mode switch should not to
be set to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
11
30
40
50
60
70
80
90
100
1 10 100 1,000
EFF [%]
Iout [mA]
30
40
50
60
70
80
90
100
1 10 100 1 ,000
EFF [%]
Iout [mA]
30
40
50
60
70
80
90
100
1 10 100 1,000
EFF [%]
Iout [mA]
30
40
50
60
70
80
90
100
1 10 100 1,000
EFF [%]
Iout [mA]
30
40
50
60
70
80
90
100
1 10 100 1,00 0
EFF [%]
Iout [mA]
30
40
50
60
70
80
90
100
1 10 100 1,000
EFF [%]
Iout [mA]
Typical Measurement Data (reference purpose only) (Ta=25℃)
Efficiency
Vin=3.7V, Vout=1.0V Vin=3.7V, Vout=1.2V
Vin=3.7V, Vout=1.5V Vin=3.7V, Vout=1.8V
Vin=3.7V, Vout=2.5V Vin=5.0V, Vout=3.3V
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
12
0.98
0.99
1
1.01
1.02
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
1.176
1.188
1.2
1.212
1.224
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
1.47
1.485
1.5
1.515
1.53
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
1.764
1.782
1.8
1.818
1.836
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
2.45
2.475
2.5
2.525
2.55
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
3.234
3.267
3.3
3.333
3.366
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Requlation
Vin=3.7V, Vout=1.0V Vin=3.7V, Vout=1.2V
Vin=3.7V, Vout=1.5V Vin=3.7V, Vout=1.8V
Vin=3.7V, Vout=2.5V Vin=5.0V, Vout=3.3V
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
13
0
10
20
30
40
50
60
0 200 400 600 800 1000
Vrpl [mVpp]
Iout [mA]
0
10
20
30
40
50
60
0 200 400 600 800 1000
Vrpl [mVpp]
Iout [mA]
0
10
20
30
40
50
60
0 200 400 600 800 1000
Vrpl [mVpp]
Iout [mA]
0
10
20
30
40
50
60
0 200 400 600 800 1000
Vrpl [mVpp]
Iout [mA]
0
10
20
30
40
50
60
0 200 400 600 800 1000
Vrpl [mVpp]
Iout [mA]
0
10
20
30
40
50
60
0 200 400 600 800 1000
Vrpl [mVpp]
Iout [mA]
Output Ripple-Noise
Vin=3.7V, Vout=1.0V Vin=3.7V, Vout=1.2V
Vin=3.7V, Vout=1.5V Vin=3.7V, Vout=1.8V
Vin=3.7V, Vout=2.5V Vin=5.0V, Vout=3.3V
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
14
Typical Measurement Data (reference purpose only)
Load Transient Response
・Vin=2.3V,Vout=1.2V
Vin=3.7V,Vout=1.2V
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
15
Vin=5.5V,Vout=1.2V
Vin=5.0V,Vout=3.3V
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
16
Vin=5.5V,Vout=3.3V
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
17
No.
Items
Specifications
Test Methods
QTY
Result
(NG)
1 Vibration
Resistance
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period : 2 h on each direction
Total 6 h.
18
G
(0)
2
Deflection
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
18
G
(0)
3
Soldering strength
(Push Strength)
9.8 N Minimum
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
4
Solderability of
Termination
75% of the
terminations is to be
soldered evenly and
continuously.
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat : 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
18
G
(0)
5
Resistance to
Soldering Heat
(Reflow)
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Preheat Temperature : 150-180 °C
Preheat Period : 90+/-30 sec.
High Temperature : 220 °C
High Temp. Period : 20sec.
Peak Temperature : 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
18
G
(0)
Pushing Direction
Jig
Specimen
10.Reliability Tests
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
18
No.
Items
Specifications
Test Methods
QTY
Result
(NG)
6
High Temp.
Exposure
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Temperature：85±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
7
Temperature
Cycle
Condition：100 cycles in the following
table
Step
Temp(°C)
Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
18
G
(0)
8
Humidity
(Steady State)
Temperature：85±2 ℃
Humidity：80～90%RH
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
9
Low Temp.
Exposure
Temperature：-40±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
10
ESD(Machine
Model)
C：200pF、R：0Ω
TEST Voltage ：+/-100V
Number of electric discharges：1
5
G
(0)
11
ESD(Human
Body Model)
C：100pF、R：1500Ω
TEST Voltage ：+/-1000V
Number of electric discharges：1
5
G
(0)
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
19
Symbol
Dimensions
a
0.8 b 0.4 c 0.7 d 0.6
Fig.1
Land Pattern
Unit:mm
・Reference purpose only.
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
20
45
45
チップ
■： Land pattern is same as figure1
Glass-fluorine board t＝1.6mm
Copper thickness over 35 m
deflection
R230
50
20
100
40
Fig.2
Testing board
Mounted situation
Test method
Unit：mm
Unit：mm
Unit：mm
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
21
15.4±1.0
2±0.5
(13.0)
φ13±0.2
φ60
φ180
12.0±0.2
1.75±0.1
(5.5)
4.0±0.1
8.0±0.1
2.0±0.05
Φ1.5+0.1
0
(3.8)
(0.30)
(1.35)
Feeding direction
(3.5)
11. Tape and Reel Packing
1）Dimensions of Tape (Plastic tape) Unit: mm
2） Dimensions of Reel
Unit: mm
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
22
Feeding Hole
Feeding Direction
Chip
[2]
[3]
[4]
[3]
[1]
[3]
[1]
[3]
[2]
[4]
3）Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 50um in thickness
[4] Base tape : As specified in (1)
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
23
Symbol
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
165 to 180 °
0.7 N max.
ベーステープ
カバーテープ
部品収納部
B
C
A
0.1~1.3N
Cover Tape
Base Tape
Components
4）Leader and Tail tape
5）The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
6）Packaging unit: 1,000 pcs./ reel
7） Material： Base Tape … Plastic
Reel … Plastic
Antistatic coating for both base tape and reel
8）Peeling of force
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
24
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this period
is exceeded
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern
should be provided between the IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
25
Reflow soldering standard conditions (example)
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating ：△ T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
26
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the
similar conditions to the above-mentioned. However, if products are used under the following
circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NO
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the
x
etc.).
time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range .
February 2016
LXDC3EP TypeF series
Micro DC-DC converter
27
!
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option
and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
February 2016
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