LXDC2HL series
Micro DC-DC converter
1
4.7uF
10uF
LXDC2HL
GND
Vin Vout
EN
Enable
VBAT
Vout
1.8V/600mA
1. Features
Low EMI noise and small footprint (5mm
High efficiency using synchronous rectifier technology at 3MHz operation
PFM/PWM automatic mode switching function
Smooth mode transition between PFM mode and PWM mode
2
) using inductor-embedded ferrite substrate
with low-ripple-voltage PFM mode
2% DC voltage accuracy over full load current range
Wide input voltage range : 2.3~5.5V
Maximum Load Current: 600mA (depends on output voltage)
Fixed output voltage: 0.8V – 4V (factory setting, 50mV step)
Internal soft start, overcurrent protection
2. Description
The LXDC2HL series is a low power step-down DC-DC converter suitable for space-limited or noise-sensitive
applications. The device utilizes an inductor-embedded ferrite substrate that reduces radiated EMI noise and
conduction noise.
By adding input/output capacitors, it can be used as an LDO replacement. Its low noise and easy-to-assemble
features assure reliable power supply quality.
The device works in PFM mode at light load for extended battery life. At heavy load, it changes to PMW mode
automatically and maintains high efficiency using synchronous rectifying technology.
The device provides good output voltage accuracy even in PFM mode. It maintains 2% DC voltage accuracy over
the full current range (0-600mA), and shows very smooth mode transition between PFM mode and PWM mode.
3. Typical Application Circuit
July 2015
LXDC2HL series
Micro DC-DC converter
2
a
1 2
3
4
b
c
c
あ２
L
W
X
X X
T
IC
Capacitor
Substrate
1 pin MarkDevice&Trace
Code
Mark
Dimension
L
2.5 +/- 0.2
W
2.0 +/- 0.2
T
1.1 MAX
a
0.85 +/- 0.1
b
0.60 +/- 0.1
c
0.15 +/- 0.15
Pin
Symbol
I/O
Description
1
Vin
Input
Vin pin supplies current to the LXDC2HL internal regulator.
2
EN
Input
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
If this pin is left open, the device may be off around 100mA output.
EN=H: Device ON, EN=L: Device OFF
3
Vout
Output
Regulated voltage output pin.
Apply output load between this pin and GND.
4
GND
-
Ground pin
Top View
Side View
Bottom View
4. Mechanical details
4-1 Outline
Unit: mm
4-2. Pin Function
July 2015
LXDC2HL series
Micro DC-DC converter
3
Part number
Output Voltage
Device Specific Feature
MOQ
LXDC2HL10A-080
1.0V
Standard Type
T/R, 3000pcs/R
LXDC2HL11A-314
1.1V
Standard Type
T/R, 3000pcs/R
LXDC2HL12A-050
1.2V
Standard Type
T/R, 3000pcs/R
LXDC2HL1CA-322
1.25V
Standard Type
T/R, 3000pcs/R
LXDC2HL13A-082
1.3V
Standard Type
T/R, 3000pcs/R
LXDC2HL1DA-087
1.35V
Standard Type
T/R, 3000pcs/R
LXDC2HL15A-051
1.5V
Standard Type
T/R, 3000pcs/R
LXDC2HL18A-052
1.8V
Standard Type
T/R, 3000pcs/R
LXDC2HL23A-323
2.3V
Standard Type
T/R, 3000pcs/R
LXDC2HL25A-053
2.5V
Standard Type
T/R, 3000pcs/R
LXDC2HL28A-243
2.8V
Standard Type
T/R, 3000pcs/R
LXDC2HL30A-054
3.0V
Standard Type
T/R, 3000pcs/R
LXDC2HL33A-055
3.3V
Standard Type
T/R, 3000pcs/R
Switching
Controler
EA
Soft Start
UVLO
Clock
Gate
Driver
Control IC
Embedded L
On-board
Cin
LXDC2HL
GND
Vout
VinEN
4-3. Functional Block Diagram
5. Ordering Information
# Output voltage can be set 50mV step from 0.8V to 4.0V. Please ask Murata representative.
July 2015
LXDC2HL series
Micro DC-DC converter
4
Parameter
Symbol
rating
Unit
Input voltage
Vin, EN
6.3
V
Operating ambient temperature
Ta
-40 to +85
o
C
Operating IC temperature
TIC
-40 to +125
o
C
Storage temperature
T
STO
-40 to +85
o
C
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input voltage
Vin
2.3
3.6
5.5
V
UVLO voltage
UVLO
1.0
1.4
1.8
V
Input leak current
lin-off
Vin=3.6V,
EN=0V
LXDC2HL10A-080
0 2
uA
LXDC2HL11A-314
LXDC2HL12A-050
LXDC2HL1CA-322
LXDC2HL13A-082
LXDC2HL1DA-087
LXDC2HL15A-051
LXDC2HL18A-052
LXDC2HL23A-323
LXDC2HL25A-053
Vin=5.0V,
EN=0V
LXDC2HL28A-243
LXDC2HL30A-054
LXDC2HL33A-055
Output voltage
accuracy
Vout
Vin-Vout>1V
LXDC2HL10A-080
0.976
1.0
1.024
V
LXDC2HL11A-314
1.076
1.1
1.124
LXDC2HL12A-050
1.176
1.20
1.224
LXDC2HL1CA-322
1.225
1.25
1.275
LXDC2HL13A-082
1.274
1.30
1.326
LXDC2HL1DA-087
1.323
1.35
1.377
LXDC2HL15A-051
1.47
1.50
1.53
LXDC2HL18A-052
1.764
1.80
1.836
LXDC2HL23A-323
2.254
2.30
2.346
LXDC2HL25A-053
2.45
2.50
2.55
Vin-Vout>0.7V
LXDC2HL28A-243
2.744
2.80
2.856
LXDC2HL30A-054
2.94
3.00
3.06
Vin-Vout>0.5V
LXDC2HL33A-055
3.234
3.30
3.366
6. Electrical Specification
6-1 Absolute maximum ratings
6-2 Electrical characteristics (Ta=25℃)
July 2015
LXDC2HL series
Micro DC-DC converter
5
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Load current range
Iout
LXDC2HL10A-080
0 600
mA
LXDC2HL11A-314
LXDC2HL12A-050
LXDC2HL1CA-322
LXDC2HL13A-082
LXDC2HL1DA-087
LXDC2HL15A-051
LXDC2HL18A-052
LXDC2HL23A-323
0 500
LXDC2HL25A-053
LXDC2HL28A-243
0 450
LXDC2HL30A-054
0 400
LXDC2HL33A-055
0 300
Ripple voltage
Vrpl
Vin=3.6V,
Iout=300mA,
BW=100MHz
LXDC2HL10A-080
15
mV
LXDC2HL11A-314
LXDC2HL12A-050
LXDC2HL1CA-322
LXDC2HL13A-082
LXDC2HL1DA-087
LXDC2HL15A-051
LXDC2HL18A-052
LXDC2HL23A-323
LXDC2HL25A-053
Vin=5V,
Iout=300mA,
BW=100MHz
LXDC2HL28A-243
LXDC2HL30A-054
LXDC2HL33A-055
July 2015
LXDC2HL series
Micro DC-DC converter
6
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Efficiency
EFF
Vin=3.6V,
Iout=150mA
LXDC2HL10A-080
78
%
LXDC2HL11A-314
79
LXDC2HL12A-050
80
LXDC2HL1CA-322
81
LXDC2HL13A-082
81
LXDC2HL1DA-087
82
LXDC2HL15A-051
83
LXDC2HL18A-052
85
LXDC2HL23A-323
87
LXDC2HL25A-053
88
Vin=5V,
Iout=150mA
LXDC2HL28A-243
86
LXDC2HL30A-054
87
LXDC2HL33A-055
88
EN control voltage
VENH
ON ; Enable
1.4 Vin
V
VENL
OFF ; Disable
0 0.25
V
SW Frequency
Fosc
2.5
3.0
3.5
MHz
Over current
protection
OCP
LXDC2HL10A-080
600
900
1200
mA
LXDC2HL11A-314
LXDC2HL12A-050
LXDC2HL1CA-322
LXDC2HL13A-082
LXDC2HL1DA-087
LXDC2HL15A-051
LXDC2HL18A-052
LXDC2HL23A-323
500
900
1200
LXDC2HL25A-053
LXDC2HL28A-243
500
900
1200
LXDC2HL30A-054
400
700
1200
LXDC2HL33A-055
300
700
1200
If the over current event continues less than Tlatch, auto-recovery.
If the over current event continues more than Tlatch, latch-up.
Restart by toggling EN voltage or Vin voltage
Tlatch
Latch-up mask time
@Vout=0.8×Vnom
20
usec
Start-up time
Ton
0.9
msec
(*1) External capacitors (Cin: 4.7uF, Cout: 10uF) should be placed near the module for proper operation.
(*2) The above characteristics are tested using the test circuit in section 8.
July 2015
LXDC2HL series
Micro DC-DC converter
7
0
50
100
150
200
250
300
350
400
0 100 200 300 400 500 600
Power Dissipation (mW)
Io (mA)
Io - Loss Characteristics (Vin=3.6V, Vo=1.8V)
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400
ΔT (
o
C）
Power Dissipation (mW)
Loss - ΔT Characteristics (Vin=3.6V, Vo=1.8V)
6-3 Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
especially be taken in applications where the device temperature exceeds 85oC.
The IC temperature of the device must be kept lower than the maximum rating of 125 oC. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress.
Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be
described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance).
The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out
mechanisms in MLCC capacitor is not reversible but cumulative over time.
July 2015
LXDC2HL series
Micro DC-DC converter
8
0.1
1
10
100
1000
10000
100000
20 40 60 80 100 120
Capacitor B1 Life (Tousand Hours)
Capacitor Case Temprature (oC )
Capacitor B1 Life vs Capacitor Case temperature
Vin=5V
Vin=3.6V
Vin=3.3V
Vin=2.5V
Capacitor Case temperature(℃)
Capacitor B1 Life(Thousand Hours)
The following steps should be taken before the design fix of user’s set for reliable operation.
1. The ambient temperature of the device should be kept below 85 oC
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
kept below 125 oC. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
July 2015
LXDC2HL series
Micro DC-DC converter
9
PFM mode at light load PWM mode at heavy load
Nominal output voltage
7. Detailed Description
PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates
in discontinuous current mode with a sporadic switching pulse to keep high efficiency at light load.
The device uses constant on-time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing the output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is dependent on Vin, Vout and other factors, but the approximate
threshold is about 100-200mA.
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up
sequence even when the EN pin is kept high. The UVLO function protects against unstable operation at low Vin
levels .
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of this function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 0.9msec. If you prefer a faster soft-start time, please contact a Murata representative.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin
must be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light
load but will not work at heavy load.
Pulling the EN pin to logic low forces the device into shutdown. The device does not have a discharge function
when it turns off. If you prefer a discharge function, please contact a Murata representative.
100% Duty Cycle Operation
The device can operate in 100% duty cycle mode, in which the high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout become close and the duty cycle approaches 100%, the switching pulse will skip the
nominal switching period and the output voltage ripple may be larger than other conditions. It should be noted that
this condition does not mean a failure of the device.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decreases the
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown.
After it is shut down, it can be restarted by toggling the Vin or EN voltage.
July 2015
LXDC2HL series
Micro DC-DC converter
10
Vin
Cin
Cout
RL
GND
Vout
Vin
EN
V-EN
LXDC2HL
8. Test Circuit
Cin : 4.7uF/6.3V (GRM188B30J475K)
Cout : 10uF/6.3V (GRM188B30J106M)
July 2015
LXDC2HL series
Micro DC-DC converter
11
9. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0244)
Measurement setup
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stops operation and remains in shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin floats and an external voltage can be applied to the
EN terminal pin on the EVB. If you don’t apply an external voltage to EN pin, the enable switch should not to
be set to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
July 2015
LXDC2HL series
Micro DC-DC converter
12
60
65
70
75
80
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
65
70
75
80
85
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
65
70
75
80
85
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
65
70
75
80
85
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
70
75
80
85
90
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
65
70
75
80
85
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
Typical Measurement Data (reference purpose only) (Ta=25℃)
Efficiency
・Vin=3.6V, Vout=1.0V ・Vin=3.6V, Vout=1.2V
・Vin=3.6V, Vout=1. 3V ・Vin=3.6V, Vout=1.35V
・Vin=3.6V, Vout=1.5V ・Vin=3.6V, Vout=1.8V
July 2015
LXDC2HL series
Micro DC-DC converter
13
75
80
85
90
95
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
75
80
85
90
95
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
75
80
85
90
95
1 10 100 1000
EFF [%]
Iout [mA]
Efficiency
・Vin=5.0V, Vout=2.5V ・Vin=5.0V, Vout=3.0V
・Vin=5.0V, Vout=3.3V
July 2015
LXDC2HL series
Micro DC-DC converter
14
0.988
1.000
1.012
1.024
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
1.188
1.200
1.212
1.224
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
1.323
1.337
1.350
1.364
1.377
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
1.470
1.485
1.500
1.515
1.530
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
1.764
1.782
1.800
1.818
1.836
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
1.274
1.287
1.300
1.313
1.326
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
Typical Measurement Data (reference purpose only) (Ta=25℃)
Load Regulation
・Vin=3.6V, Vout=1.0V ・Vin=3.6V, Vout=1.2V
・Vin=3.6V, Vout=1.3V ・Vin=3.6V, Vout=1.35V
・Vin=3.6V, Vout=1.5V ・Vin=3.6V, Vout=1.8V
July 2015
LXDC2HL series
Micro DC-DC converter
15
2.450
2.475
2.500
2.525
2.550
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
2.940
2.970
3.000
3.030
3.060
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
3.234
3.267
3.300
3.333
3.366
0 100 200 300 400 500 600
Vout [V]
Iout [mA]
Load Regulation
・Vin=5.0V, Vout=2.5V ・Vin=5.0V, Vout=3.0V
・Vin=5.0V, Vout=3.3V
July 2015
LXDC2HL series
Micro DC-DC converter
16
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
Typical Measurement Data (reference purpose only)
Output Ripple-Noise
・Vin=3.6V, Vout=1.0V, BW : 150MHz ・Vin=3.6V, Vout=1.2V, BW: 150MHz
・Vin=3.6V, Vout=1. 3V, BW: 150MHz ・Vin=3.6V, Vout=1.35V, BW: 150MHz
・Vin=3.6V, Vout=1.5V, BW: 150MHz ・Vin=3.6V, Vout=1.8V, BW: 150MHz
July 2015
LXDC2HL series
Micro DC-DC converter
17
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500 600
Vrpl [mV]
Iout [mA]
Output Ripple Noise
・Vin=5.0V, Vout=2.5V, BW: 150MHz ・Vin=5.0V, Vout=3. 0V, BW: 150MHz
・Vin=5.0V, Vout=3.3V, BW: 150MHz
July 2015
LXDC2HL series
Micro DC-DC converter
18
100mV/div
58mV
-80mV
ΔIo=600mA
ΔIo=600mA
-88mV
100mV/div
58mV
Typical Measurement Data (reference purpose only) (Ta=25℃)
Load Transient Response
・Vin=3.6V, Vout=1.0V
・Vin=3.6V, Vout=1.2V
July 2015
LXDC2HL series
Micro DC-DC converter
19
ΔIo=600mA
66mV
-86mV
100mV/div
ΔIo=600mA
66mV
-86mV
100mV/div
・Vin=3.6V, Vout=1.35V
・Vin=3.6V, Vout=1.5V
July 2015
LXDC2HL series
Micro DC-DC converter
20
100mV/div
-140mV
114mV
ΔIo=500mA
ΔIo=600mA
-108mV
76mV
100mV/div
・Vin=3.6V, Vout=1.8V
・Vin=3.6V, Vout=2.5V
July 2015
LXDC2HL series
Micro DC-DC converter
21
ΔIo=300mA
-112mV
106mV
100mV/div
-128mV
100mV/div
106mV
ΔIo=400mA
・Vin=5.0V, Vout=3.0V
Vin=5.0V, Vout=3.3V
July 2015
LXDC2HL series
Micro DC-DC converter
22
No.
Items
Specifications
Test Methods
QTY
Result
(NG)
1 Vibration
Resistance
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period : 2 h on each direction
Total 6 h.
18
G
(0)
2
Deflection
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
18
G
(0)
3
Soldering strength
(Push Strength)
9.8 N Minimum
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
4
Solderability of
Termination
75% of the
terminations is to be
soldered evenly and
continuously.
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat : 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
18
G
(0)
5
Resistance to
Soldering Heat
(Reflow)
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Preheat Temperature : 150-180 °C
Preheat Period : 90+/-30 sec.
High Temperature : 220 °C
High Temp. Period : 20sec.
Peak Temperature : 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
18
G
(0)
Pushing Direction
Jig
Specimen
10.Reliability Tests
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Micro DC-DC converter
23
No.
Items
Specifications
Test Methods
QTY
Result
(NG)
6
High Temp.
Exposure
Appearance
Electrical
specifications
No severe damages
Satisfy
specifications listed
in paragraph 6-2.
Temperature：85±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
7
Temperature
Cycle
Condition：100 cycles in the following
table
Step
Temp(°C)
Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
18
G
(0)
8
Humidity
(Steady State)
Temperature：85±2 ℃
Humidity：80～90%RH
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
9
Low Temp.
Exposure
Temperature：-40±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
18
G
(0)
10
ESD(Machine
Model)
C：200pF、R：0Ω
TEST Voltage ：+/-100V
Number of electric discharges：1
5
G
(0)
11
ESD(Human
Body Model)
C：100pF、R：1500Ω
TEST Voltage ：+/-1000V
Number of electric discharges：1
5
G
(0)
July 2015
LXDC2HL series
Micro DC-DC converter
24
Symbol
Dimensions
a
0.85
b
0.60 c 0.5 d 0.2
Fig.1
Land Pattern
Unit：mm
・Reference purpose only.
July 2015
LXDC2HL series
Micro DC-DC converter
25
45
45
チップ
■： Land pattern is same as figure1
Glass-fluorine board t＝1.6mm
Copper thickness over 35 m
deflection
R230
50
20
Fig.2
Testing board
Mounted situation
Test method
Unit：mm
Unit：mm
Unit：mm
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LXDC2HL series
Micro DC-DC converter
26
13.0±1.4
(9.0)
Φ13±0.2
Φ60
2±0.5
Feeding direction
Φ180
1.75±0.1
(3.5)
2.0±0.05
(2.3)
1.5+0.1
0
(2.8)
(0.25)
(1.25)
4.0±0.1
4.0±0.1
8.0±0.2
11. Tape and Reel Packing
1）Dimensions of Tape (Plastic tape) Unit: mm
2） Dimensions of Reel Unit: mm
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Micro DC-DC converter
27
Feeding Hole
Chip
Feeding Direction
[1]
[2]
[3]
[3]
[4]
3）Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 50um in thickness
[4] Base tape : As specified in (1)
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LXDC2HL series
Micro DC-DC converter
28
Symbol
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
165 to 180 °
0.7 N max.
ベーステープ
カバーテープ
部品収納部
B
C
A
0.1~1.0N
Cover Tape
Base Tape
Components
4）Leader and Tail tape
5）The tape for chips are wound clockwise and the feeding holes are to the right side as the tape is pulled
toward the user.
6）Packaging unit: 3,000 pcs./ reel
7） Material： Base Tape … Plastic
Reel … Plastic
Antistatic coating for both base tape and reel
8）Peeling of force
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Micro DC-DC converter
29
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this period
is exceeded
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
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LXDC2HL series
Micro DC-DC converter
30
Reflow soldering standard conditions (example)
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating ：△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
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Micro DC-DC converter
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5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NO
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
x
etc.).
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the
time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range .
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LXDC2HL series
Micro DC-DC converter
32
!
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option
and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
July 2015
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